DE60005671D1 - Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg - Google Patents
Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petgInfo
- Publication number
- DE60005671D1 DE60005671D1 DE60005671T DE60005671T DE60005671D1 DE 60005671 D1 DE60005671 D1 DE 60005671D1 DE 60005671 T DE60005671 T DE 60005671T DE 60005671 T DE60005671 T DE 60005671T DE 60005671 D1 DE60005671 D1 DE 60005671D1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- petg
- interlayer
- producing
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011229 interlayer Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 title 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 239000002650 laminated plastic Substances 0.000 abstract 1
- -1 polyethylene terephthalate Polymers 0.000 abstract 1
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 1
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9908506A FR2795846B1 (fr) | 1999-07-01 | 1999-07-01 | PROCEDE DE FABRICATION DE CARTES LAMINEES MUNIES D'UNE COUCHE INTERMEDIAIRES DE petg |
FR9908506 | 1999-07-01 | ||
PCT/FR2000/001896 WO2001003061A1 (fr) | 1999-07-01 | 2000-07-03 | Procede de fabrication de cartes laminees munies d'une couche intermediaire de petg |
Publications (3)
Publication Number | Publication Date |
---|---|
DE60005671D1 true DE60005671D1 (de) | 2003-11-06 |
DE60005671T2 DE60005671T2 (de) | 2004-07-29 |
DE60005671T9 DE60005671T9 (de) | 2005-07-07 |
Family
ID=9547611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60005671T Expired - Fee Related DE60005671T9 (de) | 1999-07-01 | 2000-07-03 | Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg |
Country Status (6)
Country | Link |
---|---|
US (1) | US6803114B1 (de) |
EP (1) | EP1192594B1 (de) |
AT (1) | ATE251325T1 (de) |
DE (1) | DE60005671T9 (de) |
FR (1) | FR2795846B1 (de) |
WO (1) | WO2001003061A1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
US7063264B2 (en) | 2001-12-24 | 2006-06-20 | Digimarc Corporation | Covert variable information on identification documents and methods of making same |
ATE509326T1 (de) | 2001-12-18 | 2011-05-15 | L 1 Secure Credentialing Inc | Mehrfachbildsicherheitsmerkmale zur identifikation von dokumenten und verfahren zu ihrer herstellung |
US7793846B2 (en) | 2001-12-24 | 2010-09-14 | L-1 Secure Credentialing, Inc. | Systems, compositions, and methods for full color laser engraving of ID documents |
US7728048B2 (en) | 2002-12-20 | 2010-06-01 | L-1 Secure Credentialing, Inc. | Increasing thermal conductivity of host polymer used with laser engraving methods and compositions |
CA2652104C (en) * | 2001-12-24 | 2012-02-14 | Digimarc Id Systems, Llc | Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same |
US7694887B2 (en) | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
WO2003055638A1 (en) | 2001-12-24 | 2003-07-10 | Digimarc Id Systems, Llc | Laser etched security features for identification documents and methods of making same |
AU2003221894A1 (en) | 2002-04-09 | 2003-10-27 | Digimarc Id Systems, Llc | Image processing techniques for printing identification cards and documents |
US7824029B2 (en) | 2002-05-10 | 2010-11-02 | L-1 Secure Credentialing, Inc. | Identification card printer-assembler for over the counter card issuing |
FR2844621A1 (fr) * | 2002-09-13 | 2004-03-19 | A S K | Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee |
US7804982B2 (en) | 2002-11-26 | 2010-09-28 | L-1 Secure Credentialing, Inc. | Systems and methods for managing and detecting fraud in image databases used with identification documents |
EP1614064B1 (de) | 2003-04-16 | 2010-12-08 | L-1 Secure Credentialing, Inc. | Dreidimensionale datenspeicherung |
US7422794B2 (en) * | 2003-10-21 | 2008-09-09 | Digimarc Corporation | Document laminate formed from different polyester materials |
US7744002B2 (en) | 2004-03-11 | 2010-06-29 | L-1 Secure Credentialing, Inc. | Tamper evident adhesive and identification document including same |
FR2867882B1 (fr) * | 2004-03-19 | 2007-03-30 | Richard Edme Henri Bado | Support pour cartes a puce |
US20050231922A1 (en) * | 2004-04-16 | 2005-10-20 | Jung-Chien Chang | Functional printed circuit board module with an embedded chip |
US7383999B2 (en) | 2004-12-28 | 2008-06-10 | Digimarc Corporation | ID document structure with pattern coating providing variable security features |
WO2007031609A1 (fr) * | 2005-09-09 | 2007-03-22 | Richard Bado | Support pour carte d'aide a la communication |
US20100201115A1 (en) * | 2007-09-20 | 2010-08-12 | Agfa-Gevaert Nv | Security laminates with interlaminated transparent embossed polymer hologram |
EP2042576A1 (de) * | 2007-09-20 | 2009-04-01 | Agfa-Gevaert | Sicherheitslaminat mit eingeprägtem transparentem Zwischenschicht-Polymerhologramm |
US20100316841A1 (en) * | 2008-04-01 | 2010-12-16 | Agfa-Gevaert | Lamination process for producing security laminates |
EP2282895A2 (de) * | 2008-04-01 | 2011-02-16 | Agfa-Gevaert N.V. | Sicherheitsbeschichtung mit sicherheitsfunktion |
CN101990497A (zh) * | 2008-04-01 | 2011-03-23 | 爱克发-格法特公司 | 具有可通过触摸察觉的安全性特征的安全性层压板 |
EP2181858A1 (de) * | 2008-11-04 | 2010-05-05 | Agfa-Gevaert N.V. | Sicherheitsdokument und Herstellungsverfahren |
EP2199100A1 (de) * | 2008-12-22 | 2010-06-23 | Agfa-Gevaert N.V. | Sicherheitslaminate für Sicherheitsdokumente |
EP2332738B1 (de) | 2009-12-10 | 2012-07-04 | Agfa-Gevaert | Sicherheitsdokument mit Sicherheitsmerkmal auf Rand |
EP2335937B1 (de) | 2009-12-18 | 2013-02-20 | Agfa-Gevaert | Lasermarkierbarer Sicherheitsfilm |
PL2335938T3 (pl) | 2009-12-18 | 2013-07-31 | Agfa Gevaert | Znakowalna laserowo folia zabezpieczająca |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US9533473B2 (en) * | 2014-04-03 | 2017-01-03 | Infineon Technologies Ag | Chip card substrate and method of forming a chip card substrate |
DE102016106698A1 (de) * | 2016-04-12 | 2017-10-12 | Infineon Technologies Ag | Chipkarte und Verfahren zum Herstellen einer Chipkarte |
DE102016109654A1 (de) | 2016-05-25 | 2017-11-30 | Ovd Kinegram Ag | Bogen für ein Sicherheitsdokument, Verfahren zur Herstellung des Bogens und daraus hergestelltes Sicherheitsdokument |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
US5534372A (en) * | 1993-07-28 | 1996-07-09 | Konica Corporation | IC card having image information |
NL9301457A (nl) * | 1993-08-23 | 1995-03-16 | Nedap Nv | Contactloze identificatiekaart of smart card. |
DE19507144A1 (de) * | 1994-10-18 | 1996-04-25 | Giesecke & Devrient Gmbh | Mehrschichtiger Datenträger mit Deckschichten aus modifiziertem PET |
DE59502482D1 (de) * | 1994-11-03 | 1998-07-16 | Fela Holding Ag | Basis Folie für Chip Karte |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
JPH09156267A (ja) * | 1995-12-06 | 1997-06-17 | Watada Insatsu Kk | プラスチックカード |
US5846900A (en) * | 1996-07-31 | 1998-12-08 | Eastman Kodak Company | Composite thermal dye transfer ID card stock |
US6301119B1 (en) * | 1996-08-02 | 2001-10-09 | Schlumberger Systemes | Integrated circuit card with two connection modes |
DE19710144C2 (de) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
US6208019B1 (en) * | 1998-03-13 | 2001-03-27 | Kabushiki Kaisha Toshiba | Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein |
JP2000094874A (ja) * | 1998-09-22 | 2000-04-04 | Canon Inc | 電子部品内蔵カードとその製造方法 |
-
1999
- 1999-07-01 FR FR9908506A patent/FR2795846B1/fr not_active Expired - Fee Related
-
2000
- 2000-07-03 US US10/030,205 patent/US6803114B1/en not_active Expired - Fee Related
- 2000-07-03 WO PCT/FR2000/001896 patent/WO2001003061A1/fr active IP Right Grant
- 2000-07-03 DE DE60005671T patent/DE60005671T9/de not_active Expired - Fee Related
- 2000-07-03 AT AT00949618T patent/ATE251325T1/de not_active IP Right Cessation
- 2000-07-03 EP EP00949618A patent/EP1192594B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2001003061A1 (fr) | 2001-01-11 |
FR2795846A1 (fr) | 2001-01-05 |
FR2795846B1 (fr) | 2001-08-31 |
EP1192594A1 (de) | 2002-04-03 |
DE60005671T9 (de) | 2005-07-07 |
DE60005671T2 (de) | 2004-07-29 |
EP1192594B1 (de) | 2003-10-01 |
US6803114B1 (en) | 2004-10-12 |
ATE251325T1 (de) | 2003-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: AXALTO S.A., MONTROUGE, FR |
|
8339 | Ceased/non-payment of the annual fee |