DE59310292D1 - Entfernung von Verunreinigungen und Verbesserung der Minoritätsladungsträger-Lebensdauer bei Silicium - Google Patents
Entfernung von Verunreinigungen und Verbesserung der Minoritätsladungsträger-Lebensdauer bei SiliciumInfo
- Publication number
- DE59310292D1 DE59310292D1 DE59310292T DE59310292T DE59310292D1 DE 59310292 D1 DE59310292 D1 DE 59310292D1 DE 59310292 T DE59310292 T DE 59310292T DE 59310292 T DE59310292 T DE 59310292T DE 59310292 D1 DE59310292 D1 DE 59310292D1
- Authority
- DE
- Germany
- Prior art keywords
- minority carrier
- silicon
- contaminants
- removal
- improvement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052710 silicon Inorganic materials 0.000 title abstract 4
- 239000010703 silicon Substances 0.000 title abstract 4
- 239000000356 contaminant Substances 0.000 title 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 238000005215 recombination Methods 0.000 abstract 2
- 230000006798 recombination Effects 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052723 transition metal Inorganic materials 0.000 abstract 1
- 150000003624 transition metals Chemical class 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/024—Defect control-gettering and annealing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT92RM687 IT1258487B (it) | 1992-09-23 | 1992-09-23 | Procedimento per migliorare il tempo di vita dei portatori di minoranza in fette di silicio o in dispositivi a semiconduttore con esse prodotti |
US07/971,056 US5272119A (en) | 1992-09-23 | 1992-11-03 | Process for contamination removal and minority carrier lifetime improvement in silicon |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59310292D1 true DE59310292D1 (de) | 2002-08-14 |
Family
ID=26332021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE59310292T Expired - Fee Related DE59310292D1 (de) | 1992-09-23 | 1993-09-23 | Entfernung von Verunreinigungen und Verbesserung der Minoritätsladungsträger-Lebensdauer bei Silicium |
Country Status (9)
Country | Link |
---|---|
US (1) | US5272119A (de) |
EP (1) | EP0590508B1 (de) |
JP (1) | JP2735772B2 (de) |
KR (1) | KR100298529B1 (de) |
CN (1) | CN1034893C (de) |
AT (1) | ATE220477T1 (de) |
DE (1) | DE59310292D1 (de) |
FI (1) | FI934149A (de) |
MY (1) | MY110011A (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6997985B1 (en) | 1993-02-15 | 2006-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor, semiconductor device, and method for fabricating the same |
JP3562588B2 (ja) * | 1993-02-15 | 2004-09-08 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
JP3193803B2 (ja) * | 1993-03-12 | 2001-07-30 | 株式会社半導体エネルギー研究所 | 半導体素子の作製方法 |
US5418172A (en) * | 1993-06-29 | 1995-05-23 | Memc Electronic Materials S.P.A. | Method for detecting sources of contamination in silicon using a contamination monitor wafer |
KR100240023B1 (ko) * | 1996-11-29 | 2000-01-15 | 윤종용 | 반도체 웨이퍼 열처리방법 및 이에 따라 형성된 반도체 웨이퍼 |
US5913103A (en) * | 1997-05-13 | 1999-06-15 | Integrated Device Technology, Inc. | Method of detecting metal contaminants in a wet chemical using enhanced semiconductor growth phenomena |
US6482269B1 (en) | 1997-05-29 | 2002-11-19 | Memc Electronic Materials, Inc. | Process for the removal of copper and other metallic impurities from silicon |
US6100167A (en) * | 1997-05-29 | 2000-08-08 | Memc Electronic Materials, Inc. | Process for the removal of copper from polished boron doped silicon wafers |
US20030104680A1 (en) * | 2001-11-13 | 2003-06-05 | Memc Electronic Materials, Inc. | Process for the removal of copper from polished boron-doped silicon wafers |
US6838321B2 (en) * | 2002-09-26 | 2005-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor substrate with defects reduced or removed and method of manufacturing the same, and semiconductor device capable of bidirectionally retaining breakdown voltage and method of manufacturing the same |
US20040063302A1 (en) * | 2002-09-26 | 2004-04-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor substrate with defects reduced or removed and method of manufacturing the same, and semiconductor device capable of bidirectionally retaining breakdown voltage and method of manufacturing the same |
JP4781616B2 (ja) * | 2002-09-26 | 2011-09-28 | 三菱電機株式会社 | 半導体基板の製造方法及び半導体装置の製造方法 |
JP5042445B2 (ja) * | 2004-04-14 | 2012-10-03 | 株式会社Sumco | シリコンウェーハのゲッタリング効率を評価する方法 |
JP4743010B2 (ja) * | 2005-08-26 | 2011-08-10 | 株式会社Sumco | シリコンウェーハの表面欠陥評価方法 |
US7657390B2 (en) * | 2005-11-02 | 2010-02-02 | Applied Materials, Inc. | Reclaiming substrates having defects and contaminants |
US8133800B2 (en) * | 2008-08-29 | 2012-03-13 | Silicon Genesis Corporation | Free-standing thickness of single crystal material and method having carrier lifetimes |
CN102709181B (zh) * | 2012-05-08 | 2014-12-31 | 常州天合光能有限公司 | 提高硅晶体电池片转换效率的方法 |
CN106505004B (zh) * | 2015-09-07 | 2019-05-03 | 中芯国际集成电路制造(上海)有限公司 | 检测晶圆中铁含量异常的装置及其方法 |
CN111398774B (zh) * | 2020-03-18 | 2022-02-15 | 西安奕斯伟材料科技有限公司 | 硅片少子寿命的测试方法及装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3929529A (en) * | 1974-12-09 | 1975-12-30 | Ibm | Method for gettering contaminants in monocrystalline silicon |
US4053335A (en) * | 1976-04-02 | 1977-10-11 | International Business Machines Corporation | Method of gettering using backside polycrystalline silicon |
JPS583375B2 (ja) * | 1979-01-19 | 1983-01-21 | 超エル・エス・アイ技術研究組合 | シリコン単結晶ウエハ−の製造方法 |
US4231809A (en) * | 1979-05-25 | 1980-11-04 | Bell Telephone Laboratories, Incorporated | Method of removing impurity metals from semiconductor devices |
US4410395A (en) * | 1982-05-10 | 1983-10-18 | Fairchild Camera & Instrument Corporation | Method of removing bulk impurities from semiconductor wafers |
DE3473971D1 (en) * | 1984-06-20 | 1988-10-13 | Ibm | Method of standardization and stabilization of semiconductor wafers |
US4732874A (en) * | 1986-10-15 | 1988-03-22 | Delco Electronics Corporation | Removing metal precipitates from semiconductor devices |
JPS63136531A (ja) * | 1986-11-27 | 1988-06-08 | Toshiba Corp | 半導体装置 |
JPH0290531A (ja) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | 半導体装置の製造方法およびウエハ |
US4929564A (en) * | 1988-10-21 | 1990-05-29 | Nippon Mining Co., Ltd. | Method for producing compound semiconductor single crystals and method for producing compound semiconductor devices |
JP2671494B2 (ja) * | 1989-05-16 | 1997-10-29 | 富士通株式会社 | ゲッタリング方法 |
-
1992
- 1992-11-03 US US07/971,056 patent/US5272119A/en not_active Expired - Fee Related
-
1993
- 1993-09-22 FI FI934149A patent/FI934149A/fi not_active Application Discontinuation
- 1993-09-23 KR KR1019930019495A patent/KR100298529B1/ko not_active IP Right Cessation
- 1993-09-23 AT AT93115307T patent/ATE220477T1/de not_active IP Right Cessation
- 1993-09-23 MY MYPI93001930A patent/MY110011A/en unknown
- 1993-09-23 CN CN93117900A patent/CN1034893C/zh not_active Expired - Fee Related
- 1993-09-23 DE DE59310292T patent/DE59310292D1/de not_active Expired - Fee Related
- 1993-09-23 EP EP93115307A patent/EP0590508B1/de not_active Expired - Lifetime
- 1993-09-24 JP JP5237794A patent/JP2735772B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100298529B1 (ko) | 2001-11-30 |
JPH06196488A (ja) | 1994-07-15 |
CN1034893C (zh) | 1997-05-14 |
EP0590508A3 (en) | 1997-10-08 |
US5272119A (en) | 1993-12-21 |
ATE220477T1 (de) | 2002-07-15 |
FI934149A0 (fi) | 1993-09-22 |
MY110011A (en) | 1997-11-29 |
FI934149A (fi) | 1994-03-24 |
CN1087208A (zh) | 1994-05-25 |
EP0590508A2 (de) | 1994-04-06 |
JP2735772B2 (ja) | 1998-04-02 |
KR940008018A (ko) | 1994-04-28 |
EP0590508B1 (de) | 2002-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |