DE50308988D1 - Nichtflüchtiges speicherelement sowie zugehörige herstellungsverfahren und speicherelementanordnungen - Google Patents
Nichtflüchtiges speicherelement sowie zugehörige herstellungsverfahren und speicherelementanordnungenInfo
- Publication number
- DE50308988D1 DE50308988D1 DE50308988T DE50308988T DE50308988D1 DE 50308988 D1 DE50308988 D1 DE 50308988D1 DE 50308988 T DE50308988 T DE 50308988T DE 50308988 T DE50308988 T DE 50308988T DE 50308988 D1 DE50308988 D1 DE 50308988D1
- Authority
- DE
- Germany
- Prior art keywords
- memory element
- associated manufacturing
- volatile memory
- element assembly
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0011—RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of the switching material, e.g. layer deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8418—Electrodes adapted for focusing electric field or current, e.g. tip-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Other compounds of groups 13-15, e.g. elemental or compound semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Other compounds of groups 13-15, e.g. elemental or compound semiconductors
- H10N70/8845—Carbon or carbides
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
- G11C2013/009—Write using potential difference applied between cell electrodes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/10—Resistive cells; Technology aspects
- G11C2213/15—Current-voltage curve
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/33—Material including silicon
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10234660 | 2002-07-26 | ||
PCT/DE2003/002434 WO2004017436A2 (de) | 2002-07-26 | 2003-07-19 | Nichtflüchtiges speicherelement sowie zugehörige herstellungsverfahren und speicherelementanordnungen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE50308988D1 true DE50308988D1 (de) | 2008-02-21 |
Family
ID=31724054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE50308988T Expired - Lifetime DE50308988D1 (de) | 2002-07-26 | 2003-07-19 | Nichtflüchtiges speicherelement sowie zugehörige herstellungsverfahren und speicherelementanordnungen |
Country Status (8)
Country | Link |
---|---|
US (4) | US7361924B2 (de) |
EP (1) | EP1543569B1 (de) |
JP (1) | JP2005534195A (de) |
KR (1) | KR100757532B1 (de) |
CN (1) | CN100454600C (de) |
DE (1) | DE50308988D1 (de) |
TW (1) | TWI233204B (de) |
WO (1) | WO2004017436A2 (de) |
Families Citing this family (122)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100481866B1 (ko) * | 2002-11-01 | 2005-04-11 | 삼성전자주식회사 | 상변환 기억소자 및 그 제조방법 |
US7236394B2 (en) * | 2003-06-18 | 2007-06-26 | Macronix International Co., Ltd. | Transistor-free random access memory |
DE10356285A1 (de) * | 2003-11-28 | 2005-06-30 | Infineon Technologies Ag | Integrierter Halbleiterspeicher und Verfahren zum Herstellen eines integrierten Halbleiterspeichers |
EP1675183A1 (de) * | 2004-12-21 | 2006-06-28 | STMicroelectronics S.r.l. | Phasenübergangsspeicherzelle mit Diodenübergangsauswahl und Methode zu ihrer Herstellung |
JP2006237593A (ja) * | 2005-01-31 | 2006-09-07 | Semiconductor Energy Lab Co Ltd | 記憶装置および半導体装置 |
WO2006080550A1 (en) | 2005-01-31 | 2006-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
US8604547B2 (en) * | 2005-02-10 | 2013-12-10 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device |
KR100675279B1 (ko) * | 2005-04-20 | 2007-01-26 | 삼성전자주식회사 | 셀 다이오드들을 채택하는 상변이 기억소자들 및 그제조방법들 |
US7749922B2 (en) * | 2005-05-05 | 2010-07-06 | The Board Of Trustees Of The University Of Illinois | Nanowire structures and electrical devices |
US7521705B2 (en) | 2005-08-15 | 2009-04-21 | Micron Technology, Inc. | Reproducible resistance variable insulating memory devices having a shaped bottom electrode |
US8766224B2 (en) * | 2006-10-03 | 2014-07-01 | Hewlett-Packard Development Company, L.P. | Electrically actuated switch |
US20080090324A1 (en) * | 2006-10-12 | 2008-04-17 | Lee Jong-Won S | Forming sublithographic heaters for phase change memories |
KR100858083B1 (ko) * | 2006-10-18 | 2008-09-10 | 삼성전자주식회사 | 하부전극 콘택층과 상변화층 사이에 넓은 접촉면적을 갖는상변화 메모리 소자 및 그 제조 방법 |
US7906368B2 (en) * | 2007-06-29 | 2011-03-15 | International Business Machines Corporation | Phase change memory with tapered heater |
JP2009164458A (ja) * | 2008-01-09 | 2009-07-23 | Renesas Technology Corp | 相変化メモリ |
US7768812B2 (en) | 2008-01-15 | 2010-08-03 | Micron Technology, Inc. | Memory cells, memory cell programming methods, memory cell reading methods, memory cell operating methods, and memory devices |
JP5305711B2 (ja) * | 2008-03-31 | 2013-10-02 | 株式会社東芝 | 不揮発性記憶装置及びその製造方法 |
US8034655B2 (en) | 2008-04-08 | 2011-10-11 | Micron Technology, Inc. | Non-volatile resistive oxide memory cells, non-volatile resistive oxide memory arrays, and methods of forming non-volatile resistive oxide memory cells and memory arrays |
US8211743B2 (en) | 2008-05-02 | 2012-07-03 | Micron Technology, Inc. | Methods of forming non-volatile memory cells having multi-resistive state material between conductive electrodes |
US8134137B2 (en) | 2008-06-18 | 2012-03-13 | Micron Technology, Inc. | Memory device constructions, memory cell forming methods, and semiconductor construction forming methods |
US9343665B2 (en) | 2008-07-02 | 2016-05-17 | Micron Technology, Inc. | Methods of forming a non-volatile resistive oxide memory cell and methods of forming a non-volatile resistive oxide memory array |
US20100034010A1 (en) * | 2008-08-06 | 2010-02-11 | Seagate Technology Llc | Memory devices with concentrated electrical fields |
US8072793B2 (en) * | 2008-09-04 | 2011-12-06 | Macronix International Co., Ltd. | High density resistance based semiconductor device |
WO2010077247A1 (en) * | 2008-12-31 | 2010-07-08 | Hewlett-Packard Development Company, L.P. | Electrically and/or thermally actuated device |
WO2010082922A1 (en) * | 2009-01-13 | 2010-07-22 | Hewlett-Packard Development Company, L.P. | Memristor having a triangular shaped electrode |
JP5477687B2 (ja) * | 2009-04-01 | 2014-04-23 | 日本電気株式会社 | スイッチング素子、スイッチング素子の動作方法、スイッチング素子の製造方法、書き換え可能な論理集積回路およびメモリ素子 |
JP5446393B2 (ja) * | 2009-04-02 | 2014-03-19 | ソニー株式会社 | 記憶素子とその製造方法および半導体記憶装置 |
US8207593B2 (en) * | 2009-07-28 | 2012-06-26 | Hewlett-Packard Development Company, L.P. | Memristor having a nanostructure in the switching material |
US8283649B2 (en) * | 2009-07-28 | 2012-10-09 | Hewlett-Packard Development Company, L.P. | Memristor with a non-planar substrate |
KR101070291B1 (ko) * | 2009-12-18 | 2011-10-06 | 주식회사 하이닉스반도체 | 저항성 메모리 소자 및 그 제조 방법 |
US8427859B2 (en) | 2010-04-22 | 2013-04-23 | Micron Technology, Inc. | Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of reading a data value stored by an array of vertically stacked tiers of non-volatile cross point memory cells |
US8411477B2 (en) | 2010-04-22 | 2013-04-02 | Micron Technology, Inc. | Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of reading a data value stored by an array of vertically stacked tiers of non-volatile cross point memory cells |
US8289763B2 (en) | 2010-06-07 | 2012-10-16 | Micron Technology, Inc. | Memory arrays |
US8946046B1 (en) | 2012-05-02 | 2015-02-03 | Crossbar, Inc. | Guided path for forming a conductive filament in RRAM |
US9601692B1 (en) | 2010-07-13 | 2017-03-21 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
US9012307B2 (en) | 2010-07-13 | 2015-04-21 | Crossbar, Inc. | Two terminal resistive switching device structure and method of fabricating |
US9570678B1 (en) | 2010-06-08 | 2017-02-14 | Crossbar, Inc. | Resistive RAM with preferental filament formation region and methods |
CN103081093B (zh) | 2010-06-11 | 2015-06-03 | 科洛斯巴股份有限公司 | 存储器件的柱结构以及方法 |
US8441835B2 (en) | 2010-06-11 | 2013-05-14 | Crossbar, Inc. | Interface control for improved switching in RRAM |
US8374018B2 (en) | 2010-07-09 | 2013-02-12 | Crossbar, Inc. | Resistive memory using SiGe material |
US8884261B2 (en) | 2010-08-23 | 2014-11-11 | Crossbar, Inc. | Device switching using layered device structure |
US8168506B2 (en) | 2010-07-13 | 2012-05-01 | Crossbar, Inc. | On/off ratio for non-volatile memory device and method |
US8467227B1 (en) | 2010-11-04 | 2013-06-18 | Crossbar, Inc. | Hetero resistive switching material layer in RRAM device and method |
US8947908B2 (en) | 2010-11-04 | 2015-02-03 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
US8569172B1 (en) | 2012-08-14 | 2013-10-29 | Crossbar, Inc. | Noble metal/non-noble metal electrode for RRAM applications |
US9401475B1 (en) | 2010-08-23 | 2016-07-26 | Crossbar, Inc. | Method for silver deposition for a non-volatile memory device |
US8404553B2 (en) | 2010-08-23 | 2013-03-26 | Crossbar, Inc. | Disturb-resistant non-volatile memory device and method |
US8889521B1 (en) | 2012-09-14 | 2014-11-18 | Crossbar, Inc. | Method for silver deposition for a non-volatile memory device |
US8492195B2 (en) | 2010-08-23 | 2013-07-23 | Crossbar, Inc. | Method for forming stackable non-volatile resistive switching memory devices |
EP2622664A4 (de) | 2010-09-27 | 2013-08-07 | Hewlett Packard Development Co | Gerätestruktur für memristoren mit langer lebensdauer |
US8391049B2 (en) | 2010-09-29 | 2013-03-05 | Crossbar, Inc. | Resistor structure for a non-volatile memory device and method |
US8351242B2 (en) | 2010-09-29 | 2013-01-08 | Micron Technology, Inc. | Electronic devices, memory devices and memory arrays |
US8558212B2 (en) | 2010-09-29 | 2013-10-15 | Crossbar, Inc. | Conductive path in switching material in a resistive random access memory device and control |
US8759809B2 (en) | 2010-10-21 | 2014-06-24 | Micron Technology, Inc. | Integrated circuitry comprising nonvolatile memory cells having platelike electrode and ion conductive material layer |
US8526213B2 (en) | 2010-11-01 | 2013-09-03 | Micron Technology, Inc. | Memory cells, methods of programming memory cells, and methods of forming memory cells |
US8796661B2 (en) * | 2010-11-01 | 2014-08-05 | Micron Technology, Inc. | Nonvolatile memory cells and methods of forming nonvolatile memory cell |
USRE46335E1 (en) | 2010-11-04 | 2017-03-07 | Crossbar, Inc. | Switching device having a non-linear element |
US8502185B2 (en) | 2011-05-31 | 2013-08-06 | Crossbar, Inc. | Switching device having a non-linear element |
US8088688B1 (en) | 2010-11-05 | 2012-01-03 | Crossbar, Inc. | p+ polysilicon material on aluminum for non-volatile memory device and method |
US9454997B2 (en) | 2010-12-02 | 2016-09-27 | Micron Technology, Inc. | Array of nonvolatile memory cells having at least five memory cells per unit cell, having a plurality of the unit cells which individually comprise three elevational regions of programmable material, and/or having a continuous volume having a combination of a plurality of vertically oriented memory cells and a plurality of horizontally oriented memory cells; array of vertically stacked tiers of nonvolatile memory cells |
US8431458B2 (en) | 2010-12-27 | 2013-04-30 | Micron Technology, Inc. | Methods of forming a nonvolatile memory cell and methods of forming an array of nonvolatile memory cells |
US8930174B2 (en) | 2010-12-28 | 2015-01-06 | Crossbar, Inc. | Modeling technique for resistive random access memory (RRAM) cells |
US8791010B1 (en) | 2010-12-31 | 2014-07-29 | Crossbar, Inc. | Silver interconnects for stacked non-volatile memory device and method |
US8815696B1 (en) | 2010-12-31 | 2014-08-26 | Crossbar, Inc. | Disturb-resistant non-volatile memory device using via-fill and etchback technique |
US9153623B1 (en) | 2010-12-31 | 2015-10-06 | Crossbar, Inc. | Thin film transistor steering element for a non-volatile memory device |
US8791447B2 (en) | 2011-01-20 | 2014-07-29 | Micron Technology, Inc. | Arrays of nonvolatile memory cells and methods of forming arrays of nonvolatile memory cells |
US8488365B2 (en) | 2011-02-24 | 2013-07-16 | Micron Technology, Inc. | Memory cells |
US8537592B2 (en) | 2011-04-15 | 2013-09-17 | Micron Technology, Inc. | Arrays of nonvolatile memory cells and methods of forming arrays of nonvolatile memory cells |
US8450710B2 (en) | 2011-05-27 | 2013-05-28 | Crossbar, Inc. | Low temperature p+ silicon junction material for a non-volatile memory device |
US8394670B2 (en) | 2011-05-31 | 2013-03-12 | Crossbar, Inc. | Vertical diodes for non-volatile memory device |
US9620206B2 (en) | 2011-05-31 | 2017-04-11 | Crossbar, Inc. | Memory array architecture with two-terminal memory cells |
US8619459B1 (en) | 2011-06-23 | 2013-12-31 | Crossbar, Inc. | High operating speed resistive random access memory |
US9564587B1 (en) | 2011-06-30 | 2017-02-07 | Crossbar, Inc. | Three-dimensional two-terminal memory with enhanced electric field and segmented interconnects |
US9166163B2 (en) | 2011-06-30 | 2015-10-20 | Crossbar, Inc. | Sub-oxide interface layer for two-terminal memory |
US9627443B2 (en) | 2011-06-30 | 2017-04-18 | Crossbar, Inc. | Three-dimensional oblique two-terminal memory with enhanced electric field |
US8946669B1 (en) | 2012-04-05 | 2015-02-03 | Crossbar, Inc. | Resistive memory device and fabrication methods |
US8659929B2 (en) | 2011-06-30 | 2014-02-25 | Crossbar, Inc. | Amorphous silicon RRAM with non-linear device and operation |
US9252191B2 (en) | 2011-07-22 | 2016-02-02 | Crossbar, Inc. | Seed layer for a p+ silicon germanium material for a non-volatile memory device and method |
US8674724B2 (en) | 2011-07-29 | 2014-03-18 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
US9729155B2 (en) | 2011-07-29 | 2017-08-08 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
US10056907B1 (en) | 2011-07-29 | 2018-08-21 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
CN103094471A (zh) * | 2011-10-28 | 2013-05-08 | 中国科学院物理研究所 | 一种缩小存储节点的非易失性存储装置及其制造方法 |
US8716098B1 (en) | 2012-03-09 | 2014-05-06 | Crossbar, Inc. | Selective removal method and structure of silver in resistive switching device for a non-volatile memory device |
US9087576B1 (en) | 2012-03-29 | 2015-07-21 | Crossbar, Inc. | Low temperature fabrication method for a three-dimensional memory device and structure |
US9685608B2 (en) | 2012-04-13 | 2017-06-20 | Crossbar, Inc. | Reduced diffusion in metal electrode for two-terminal memory |
US8658476B1 (en) | 2012-04-20 | 2014-02-25 | Crossbar, Inc. | Low temperature P+ polycrystalline silicon material for non-volatile memory device |
US8796658B1 (en) | 2012-05-07 | 2014-08-05 | Crossbar, Inc. | Filamentary based non-volatile resistive memory device and method |
US8765566B2 (en) | 2012-05-10 | 2014-07-01 | Crossbar, Inc. | Line and space architecture for a non-volatile memory device |
CN102810634B (zh) * | 2012-07-25 | 2015-10-14 | 中国科学院宁波材料技术与工程研究所 | 一种高稳定性的电阻式随机存储器及其制备方法 |
US9583701B1 (en) | 2012-08-14 | 2017-02-28 | Crossbar, Inc. | Methods for fabricating resistive memory device switching material using ion implantation |
US10096653B2 (en) | 2012-08-14 | 2018-10-09 | Crossbar, Inc. | Monolithically integrated resistive memory using integrated-circuit foundry compatible processes |
US8946673B1 (en) | 2012-08-24 | 2015-02-03 | Crossbar, Inc. | Resistive switching device structure with improved data retention for non-volatile memory device and method |
US9312483B2 (en) | 2012-09-24 | 2016-04-12 | Crossbar, Inc. | Electrode structure for a non-volatile memory device and method |
US9576616B2 (en) | 2012-10-10 | 2017-02-21 | Crossbar, Inc. | Non-volatile memory with overwrite capability and low write amplification |
US11068620B2 (en) | 2012-11-09 | 2021-07-20 | Crossbar, Inc. | Secure circuit integrated with memory layer |
US8982647B2 (en) | 2012-11-14 | 2015-03-17 | Crossbar, Inc. | Resistive random access memory equalization and sensing |
US9412790B1 (en) | 2012-12-04 | 2016-08-09 | Crossbar, Inc. | Scalable RRAM device architecture for a non-volatile memory device and method |
US9406379B2 (en) | 2013-01-03 | 2016-08-02 | Crossbar, Inc. | Resistive random access memory with non-linear current-voltage relationship |
US9324942B1 (en) | 2013-01-31 | 2016-04-26 | Crossbar, Inc. | Resistive memory cell with solid state diode |
US9112145B1 (en) | 2013-01-31 | 2015-08-18 | Crossbar, Inc. | Rectified switching of two-terminal memory via real time filament formation |
US8934280B1 (en) | 2013-02-06 | 2015-01-13 | Crossbar, Inc. | Capacitive discharge programming for two-terminal memory cells |
US9231205B2 (en) * | 2013-03-13 | 2016-01-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Low form voltage resistive random access memory (RRAM) |
US9349950B2 (en) | 2013-03-13 | 2016-05-24 | Microchip Technology Incorporated | Resistive memory cell with trench-shaped bottom electrode |
US9444040B2 (en) | 2013-03-13 | 2016-09-13 | Microchip Technology Incorporated | Sidewall type memory cell |
US9608204B2 (en) * | 2013-09-09 | 2017-03-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Resistive random access memory and manufacturing method thereof |
US10290801B2 (en) | 2014-02-07 | 2019-05-14 | Crossbar, Inc. | Scalable silicon based resistive memory device |
US9318702B2 (en) | 2014-02-19 | 2016-04-19 | Microchip Technology Incorporated | Resistive memory cell having a reduced conductive path area |
US9385313B2 (en) | 2014-02-19 | 2016-07-05 | Microchip Technology Incorporated | Resistive memory cell having a reduced conductive path area |
US9865813B2 (en) | 2014-02-19 | 2018-01-09 | Microchip Technology Incorporated | Method for forming resistive memory cell having a spacer region under an electrolyte region and a top electrode |
US9269606B2 (en) | 2014-02-19 | 2016-02-23 | Microchip Technology Incorporated | Spacer enabled active isolation for an integrated circuit device |
US10003021B2 (en) * | 2014-02-19 | 2018-06-19 | Microchip Technology Incorporated | Resistive memory cell with sloped bottom electrode |
US9412942B2 (en) * | 2014-02-19 | 2016-08-09 | Microchip Technology Incorporated | Resistive memory cell with bottom electrode having a sloped side wall |
US9425237B2 (en) | 2014-03-11 | 2016-08-23 | Crossbar, Inc. | Selector device for two-terminal memory |
US9768234B2 (en) | 2014-05-20 | 2017-09-19 | Crossbar, Inc. | Resistive memory architecture and devices |
US9633724B2 (en) | 2014-07-07 | 2017-04-25 | Crossbar, Inc. | Sensing a non-volatile memory device utilizing selector device holding characteristics |
US10211397B1 (en) * | 2014-07-07 | 2019-02-19 | Crossbar, Inc. | Threshold voltage tuning for a volatile selection device |
US9685483B2 (en) | 2014-07-09 | 2017-06-20 | Crossbar, Inc. | Selector-based non-volatile cell fabrication utilizing IC-foundry compatible process |
US10115819B2 (en) | 2015-05-29 | 2018-10-30 | Crossbar, Inc. | Recessed high voltage metal oxide semiconductor transistor for RRAM cell |
US9698201B2 (en) | 2014-07-09 | 2017-07-04 | Crossbar, Inc. | High density selector-based non volatile memory cell and fabrication |
US9460788B2 (en) | 2014-07-09 | 2016-10-04 | Crossbar, Inc. | Non-volatile memory cell utilizing volatile switching two terminal device and a MOS transistor |
US10096362B1 (en) | 2017-03-24 | 2018-10-09 | Crossbar, Inc. | Switching block configuration bit comprising a non-volatile memory cell |
US10490745B2 (en) * | 2018-03-14 | 2019-11-26 | Globalfoundries Singapore Pte. Ltd. | Vertical and planar RRAM with tip electrodes and methods for producing the same |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1464880B2 (de) * | 1964-05-05 | 1970-11-12 | Danfoss A/S, Nordborg (Dänemark) | Elektronische Schaltanordnung unter Verwendung von sperrschichtfreien Halbleiter-Schaltelementen |
DE1465450B1 (de) * | 1964-12-22 | 1970-07-23 | As Danfoss | Elektronisches Festk¦rperbauelement zum Schalten |
DE2904171A1 (de) * | 1979-02-05 | 1980-08-14 | Siemens Ag | Verfahren zum herstellen von aus amorphem silizium bestehenden halbleiterkoerpern durch glimmentladung |
IL61678A (en) * | 1979-12-13 | 1984-04-30 | Energy Conversion Devices Inc | Programmable cell and programmable electronic arrays comprising such cells |
GB8816632D0 (en) * | 1988-07-13 | 1988-08-17 | Raychem Ltd | Electrical device |
GB8910854D0 (en) * | 1989-05-11 | 1989-06-28 | British Petroleum Co Plc | Semiconductor device |
US5166758A (en) * | 1991-01-18 | 1992-11-24 | Energy Conversion Devices, Inc. | Electrically erasable phase change memory |
WO1996019837A2 (en) * | 1994-12-22 | 1996-06-27 | Philips Electronics N.V. | Semiconductor memory devices and methods of producing such |
JP3679519B2 (ja) * | 1995-09-14 | 2005-08-03 | キヤノン株式会社 | トンネル電流または微小力または磁気力検出用の微小ティップの製造方法、並びにその微小ティップを有するプローブの製造方法とそのプローブ、該プローブを有するプローブユニットと走査型プローブ顕微鏡及び情報記録再生装置 |
US5687112A (en) * | 1996-04-19 | 1997-11-11 | Energy Conversion Devices, Inc. | Multibit single cell memory element having tapered contact |
US5814527A (en) * | 1996-07-22 | 1998-09-29 | Micron Technology, Inc. | Method of making small pores defined by a disposable internal spacer for use in chalcogenide memories |
US5789277A (en) * | 1996-07-22 | 1998-08-04 | Micron Technology, Inc. | Method of making chalogenide memory device |
US6337266B1 (en) * | 1996-07-22 | 2002-01-08 | Micron Technology, Inc. | Small electrode for chalcogenide memories |
US6147395A (en) * | 1996-10-02 | 2000-11-14 | Micron Technology, Inc. | Method for fabricating a small area of contact between electrodes |
US6087674A (en) * | 1996-10-28 | 2000-07-11 | Energy Conversion Devices, Inc. | Memory element with memory material comprising phase-change material and dielectric material |
US6015977A (en) * | 1997-01-28 | 2000-01-18 | Micron Technology, Inc. | Integrated circuit memory cell having a small active area and method of forming same |
US5952671A (en) * | 1997-05-09 | 1999-09-14 | Micron Technology, Inc. | Small electrode for a chalcogenide switching device and method for fabricating same |
US6545902B2 (en) * | 1998-08-28 | 2003-04-08 | Hitachi, Ltd. | Ferroelectric memory device |
US7173317B1 (en) * | 1998-11-09 | 2007-02-06 | Micron Technology, Inc. | Electrical and thermal contact for use in semiconductor devices |
US6696355B2 (en) * | 2000-12-14 | 2004-02-24 | Ovonyx, Inc. | Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory |
US6348365B1 (en) * | 2001-03-02 | 2002-02-19 | Micron Technology, Inc. | PCRAM cell manufacturing |
US7102150B2 (en) * | 2001-05-11 | 2006-09-05 | Harshfield Steven T | PCRAM memory cell and method of making same |
US6646902B2 (en) * | 2001-08-30 | 2003-11-11 | Micron Technology, Inc. | Method of retaining memory state in a programmable conductor RAM |
US6545903B1 (en) * | 2001-12-17 | 2003-04-08 | Texas Instruments Incorporated | Self-aligned resistive plugs for forming memory cell with phase change material |
US20030143782A1 (en) * | 2002-01-31 | 2003-07-31 | Gilton Terry L. | Methods of forming germanium selenide comprising devices and methods of forming silver selenide comprising structures |
US6670628B2 (en) * | 2002-04-04 | 2003-12-30 | Hewlett-Packard Company, L.P. | Low heat loss and small contact area composite electrode for a phase change media memory device |
US6717234B2 (en) * | 2002-05-01 | 2004-04-06 | Hewlett-Packard Development Company, L.P. | Resistive memory for data storage devices |
US6870751B2 (en) * | 2002-11-07 | 2005-03-22 | Hewlett-Packard Development Company, L.P. | Low-energy writing in cross-point array memory devices |
-
2003
- 2003-07-14 TW TW092119191A patent/TWI233204B/zh not_active IP Right Cessation
- 2003-07-19 JP JP2004528394A patent/JP2005534195A/ja active Pending
- 2003-07-19 EP EP03787689A patent/EP1543569B1/de not_active Expired - Fee Related
- 2003-07-19 US US10/522,386 patent/US7361924B2/en not_active Expired - Lifetime
- 2003-07-19 KR KR1020057001387A patent/KR100757532B1/ko not_active IP Right Cessation
- 2003-07-19 DE DE50308988T patent/DE50308988D1/de not_active Expired - Lifetime
- 2003-07-19 CN CNB038179229A patent/CN100454600C/zh not_active Expired - Fee Related
- 2003-07-19 WO PCT/DE2003/002434 patent/WO2004017436A2/de active IP Right Grant
-
2008
- 2008-02-29 US US12/040,489 patent/US7923342B2/en not_active Expired - Fee Related
-
2011
- 2011-03-08 US US13/043,129 patent/US8377791B2/en not_active Expired - Fee Related
-
2013
- 2013-01-17 US US13/743,369 patent/US8629034B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20050075919A (ko) | 2005-07-25 |
US7923342B2 (en) | 2011-04-12 |
US20060097238A1 (en) | 2006-05-11 |
CN100454600C (zh) | 2009-01-21 |
US20130130470A1 (en) | 2013-05-23 |
TW200408119A (en) | 2004-05-16 |
US20110159661A1 (en) | 2011-06-30 |
JP2005534195A (ja) | 2005-11-10 |
US20080206931A1 (en) | 2008-08-28 |
US8377791B2 (en) | 2013-02-19 |
KR100757532B1 (ko) | 2007-09-11 |
WO2004017436A2 (de) | 2004-02-26 |
CN1813360A (zh) | 2006-08-02 |
US8629034B2 (en) | 2014-01-14 |
US7361924B2 (en) | 2008-04-22 |
TWI233204B (en) | 2005-05-21 |
EP1543569A2 (de) | 2005-06-22 |
EP1543569B1 (de) | 2008-01-09 |
WO2004017436A3 (de) | 2004-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE50308988D1 (de) | Nichtflüchtiges speicherelement sowie zugehörige herstellungsverfahren und speicherelementanordnungen | |
AU2003221003A1 (en) | Non-volatile memory and manufacturing method thereof | |
DE60336567D1 (de) | Piezoelektrischer d nnfilmoszillator, piezoelektrisches d nnfilmbauelement und herstellungsverfahren daf r | |
AU2003241844A1 (en) | Nonvolatile memory and its manufacturing method | |
DE60314068D1 (de) | Nichtflüchtiger Halbleiterspeicher | |
DE60310339D1 (de) | Querträger und Herstellungsverfahren | |
DE60318659D1 (de) | Nichtflüchtiger Speicher und Auffrischungsverfahren | |
DE60311063D1 (de) | Ausziehleiter und zugehörige herstellungsverfahren | |
DE60037057D1 (de) | Halbleiterelement und Herstellungsverfahren dafür | |
DE60219719D1 (de) | Speichermatrix und Herstellungsverfahren | |
DE69929500D1 (de) | Ferroelektrischer nichtflüchtiger Transistor und dessen Herstellungsverfahren | |
DE60311223D1 (de) | Aktuator und dessen Herstellungsverfahren | |
DE602005018561D1 (de) | Halbleiterspeicherbauelement und dessen Herstellungsverfahren | |
DE60222891D1 (de) | Nichtflüchtige Speicheranordnung und Selbstreparatur-Verfahren | |
DE60231538D1 (de) | Sputtertarget und herstellungsverfahren dafür | |
DE60326822D1 (de) | Mehrschichtiges piezoelektrisches element und herstellungsverfahren dafür | |
DE60312603D1 (de) | Mikrokapsel sowie das Herstellungsverfahren | |
DE60329610D1 (de) | Polyesterharz und herstellungsverfahren dafür | |
DE50213262D1 (de) | Nichtflüchtige zweitransistor-halbleiterspeicherzelle sowie zugehöriges herstellungsverfahren | |
DE50312533D1 (de) | Nichtflüchtiges halbleiterspeicherelement sowie zugehöriges herstellungs- und ansteuerverfahren | |
DE60334276D1 (de) | Programmierbarer Speichertransistor | |
DE60302019D1 (de) | Stiftsteckerelement und Herstellungsverfahren davon | |
GB2436234B (en) | Nonvolatile memory device and its manufacturing method | |
DE60306074D1 (de) | Mikrokapsel sowie Herstellungsverfahren | |
DE60328482D1 (de) | Strahlungsfilterelement und herstellungsprozess dafür |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |