DE502004012290D1 - Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor - Google Patents

Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor

Info

Publication number
DE502004012290D1
DE502004012290D1 DE502004012290T DE502004012290T DE502004012290D1 DE 502004012290 D1 DE502004012290 D1 DE 502004012290D1 DE 502004012290 T DE502004012290 T DE 502004012290T DE 502004012290 T DE502004012290 T DE 502004012290T DE 502004012290 D1 DE502004012290 D1 DE 502004012290D1
Authority
DE
Germany
Prior art keywords
electronic component
heat sink
cooled
cooling device
microprocessor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502004012290T
Other languages
English (en)
Inventor
Harald Fonfara
Herbert Goestl
Thorsten Miltkau
Markus Eberl
Ralf Mollik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vertiv Corp
Original Assignee
Liebert Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liebert Corp filed Critical Liebert Corp
Publication of DE502004012290D1 publication Critical patent/DE502004012290D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE502004012290T 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor Active DE502004012290D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10335197A DE10335197B4 (de) 2003-07-30 2003-07-30 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
PCT/DE2004/001361 WO2005015970A2 (de) 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor

Publications (1)

Publication Number Publication Date
DE502004012290D1 true DE502004012290D1 (de) 2011-04-21

Family

ID=34089012

Family Applications (3)

Application Number Title Priority Date Filing Date
DE10335197A Expired - Lifetime DE10335197B4 (de) 2003-07-30 2003-07-30 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
DE502004012290T Active DE502004012290D1 (de) 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor
DE112004001872T Withdrawn - After Issue DE112004001872D2 (de) 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10335197A Expired - Lifetime DE10335197B4 (de) 2003-07-30 2003-07-30 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112004001872T Withdrawn - After Issue DE112004001872D2 (de) 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor

Country Status (5)

Country Link
US (1) US7508669B2 (de)
EP (1) EP1649736B1 (de)
AT (1) ATE501524T1 (de)
DE (3) DE10335197B4 (de)
WO (1) WO2005015970A2 (de)

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SE533224C2 (sv) * 2008-09-16 2010-07-27 Sapa Profiler Ab Kylkropp för kretskortkomponenter
CN101742875B (zh) * 2008-11-20 2011-10-05 英业达股份有限公司 散热组件
DE102009006924B3 (de) * 2009-02-02 2010-08-05 Knürr AG Betriebsverfahren und Anordnung zum Kühlen von elektrischen und elektronischen Bauelementen und Moduleinheiten in Geräteschränken
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US8422229B2 (en) * 2009-06-25 2013-04-16 Oracle America, Inc. Molded heat sink and method of making same
JP4802272B2 (ja) * 2009-09-30 2011-10-26 株式会社東芝 電子機器
EP2494298A1 (de) * 2009-10-30 2012-09-05 Hewlett-Packard Development Company, L.P. Thermische sammelschiene für ein bladegehäuse
US20120279683A1 (en) * 2011-05-05 2012-11-08 Alcatel-Lucent Usa Inc. Cooling apparatus for communications platforms
US20130250522A1 (en) * 2012-03-22 2013-09-26 Varian Medical Systems, Inc. Heat sink profile for interface to thermally conductive material
US8937810B2 (en) 2012-09-14 2015-01-20 International Business Machines Corporation Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
US9066460B2 (en) 2013-01-17 2015-06-23 International Business Machines Corporation Disassemblable electronic assembly with leak-inhibiting coolant capillaries
EP3185663A1 (de) * 2014-08-18 2017-06-28 Murakumo Corporation System, informationsverarbeitungsvorrichtung und gestell
EP3227624B1 (de) * 2014-12-03 2021-01-27 GE Intelligent Platforms, Inc. Verfahren zur bereitstellung einer kombinierten energiedissipationsanordnung
WO2017141215A1 (en) * 2016-02-18 2017-08-24 Eric Matte High efficiency heat dissipation methods and systems for electronic circuits and systems
DE102016109280A1 (de) * 2016-05-20 2017-11-23 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung zur Kühlung von elektronischen Komponenten
US20230320034A1 (en) * 2022-03-22 2023-10-05 Baidu Usa Llc Thermal management device for high density processing unit
US20230345669A1 (en) * 2022-04-20 2023-10-26 Quanta Computer Inc. Heat-Absorbing Chassis For Fan-Less Electronic Component

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Also Published As

Publication number Publication date
US20070274044A1 (en) 2007-11-29
EP1649736A2 (de) 2006-04-26
DE112004001872D2 (de) 2006-06-14
US7508669B2 (en) 2009-03-24
EP1649736B1 (de) 2011-03-09
WO2005015970A2 (de) 2005-02-17
DE10335197A1 (de) 2005-02-24
WO2005015970A3 (de) 2007-07-05
DE10335197B4 (de) 2005-10-27
ATE501524T1 (de) 2011-03-15

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