DE4290875T1 - Wärmetauscher für elektronische Festkörper-Vorrichtungen - Google Patents

Wärmetauscher für elektronische Festkörper-Vorrichtungen

Info

Publication number
DE4290875T1
DE4290875T1 DE4290875T DE4290875T DE4290875T1 DE 4290875 T1 DE4290875 T1 DE 4290875T1 DE 4290875 T DE4290875 T DE 4290875T DE 4290875 T DE4290875 T DE 4290875T DE 4290875 T1 DE4290875 T1 DE 4290875T1
Authority
DE
Germany
Prior art keywords
electronic devices
solid state
heat exchangers
state electronic
exchangers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4290875T
Other languages
English (en)
Inventor
James A Matthews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microunity Systems Engineering Inc
Original Assignee
Microunity Systems Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microunity Systems Engineering Inc filed Critical Microunity Systems Engineering Inc
Publication of DE4290875T1 publication Critical patent/DE4290875T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y10T29/49368—Sheet joined to sheet with inserted tubes
DE4290875T 1991-04-02 1992-03-31 Wärmetauscher für elektronische Festkörper-Vorrichtungen Withdrawn DE4290875T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/679,529 US5125451A (en) 1991-04-02 1991-04-02 Heat exchanger for solid-state electronic devices

Publications (1)

Publication Number Publication Date
DE4290875T1 true DE4290875T1 (de) 1994-01-13

Family

ID=24727288

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4290875T Withdrawn DE4290875T1 (de) 1991-04-02 1992-03-31 Wärmetauscher für elektronische Festkörper-Vorrichtungen

Country Status (6)

Country Link
US (2) US5125451A (de)
JP (1) JPH06508911A (de)
AU (1) AU1756692A (de)
DE (1) DE4290875T1 (de)
GB (1) GB2275575B (de)
WO (1) WO1992017745A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4401607A1 (de) * 1994-01-20 1995-07-27 Siemens Ag Kühleinheit für Leistungshalbleiter
DE19710783A1 (de) * 1997-03-17 1998-09-24 Curamik Electronics Gmbh Kühler für elektrische Bauelemente oder Schaltkreise sowie elektrischer Schaltkreis mit einer solchen Wärmesenke

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225964A (en) * 1991-10-31 1993-07-06 Rockwell International Corporation Integrated lightweight card rack
FR2701554B1 (fr) * 1993-02-12 1995-05-12 Transcal Echangeur de chaleur pour composants électroniques et appareillages électro-techniques.
US5427174A (en) * 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5383517A (en) * 1993-06-04 1995-01-24 Dierbeck; Robert F. Adhesively assembled and sealed modular heat exchanger
US5751327A (en) * 1993-06-18 1998-05-12 Xeikon N.V. Printer including temperature controlled LED recording heads
EP0629508B1 (de) * 1993-06-18 1996-10-09 Xeikon Nv Temperaturgesteuerter LED-Aufzeichnungskopf
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
EP0667640A3 (de) * 1994-01-14 1997-05-14 Brush Wellman Mehrlagen-Laminatprodukt und seine Herstellung.
US6129973A (en) * 1994-07-29 2000-10-10 Battelle Memorial Institute Microchannel laminated mass exchanger and method of making
US6022426A (en) * 1995-05-31 2000-02-08 Brush Wellman Inc. Multilayer laminate process
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US5920457A (en) * 1996-09-25 1999-07-06 International Business Machines Corporation Apparatus for cooling electronic devices using a flexible coolant conduit
US6003591A (en) * 1997-12-22 1999-12-21 Saddleback Aerospace Formed laminate heat pipe
JP3681581B2 (ja) * 1999-07-30 2005-08-10 ファナック株式会社 冷却装置とそれを備えた面発光装置
US6668570B2 (en) 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US7134486B2 (en) * 2001-09-28 2006-11-14 The Board Of Trustees Of The Leeland Stanford Junior University Control of electrolysis gases in electroosmotic pump systems
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6819561B2 (en) * 2002-02-22 2004-11-16 Satcon Technology Corporation Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
US6988534B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US7086839B2 (en) * 2002-09-23 2006-08-08 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US6994151B2 (en) * 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US20050211427A1 (en) * 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
JP2006522463A (ja) * 2002-11-01 2006-09-28 クーリギー インコーポレイテッド 流体により冷却される超小型熱交換のための最適なスプレッダシステム、装置及び方法
US7104312B2 (en) * 2002-11-01 2006-09-12 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US20050211417A1 (en) * 2002-11-01 2005-09-29 Cooligy,Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US6986382B2 (en) 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7156159B2 (en) * 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
US8464781B2 (en) * 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7090001B2 (en) * 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US20090044928A1 (en) * 2003-01-31 2009-02-19 Girish Upadhya Method and apparatus for preventing cracking in a liquid cooling system
US7293423B2 (en) 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7017654B2 (en) * 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US20040182551A1 (en) * 2003-03-17 2004-09-23 Cooligy, Inc. Boiling temperature design in pumped microchannel cooling loops
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7021369B2 (en) 2003-07-23 2006-04-04 Cooligy, Inc. Hermetic closed loop fluid system
US6842342B1 (en) * 2003-09-12 2005-01-11 Leohab Enterprise Co., Ltd. Heat sink
JP4014549B2 (ja) * 2003-09-18 2007-11-28 富士電機システムズ株式会社 ヒートシンク及びその製造方法
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
JP2005166855A (ja) * 2003-12-02 2005-06-23 Hitachi Ltd 電子機器
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US6992382B2 (en) * 2003-12-29 2006-01-31 Intel Corporation Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
TWI287700B (en) * 2004-03-31 2007-10-01 Delta Electronics Inc Heat dissipation module
US7616444B2 (en) 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7188662B2 (en) * 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US20060042785A1 (en) * 2004-08-27 2006-03-02 Cooligy, Inc. Pumped fluid cooling system and method
CN100389371C (zh) * 2004-09-16 2008-05-21 中芯国际集成电路制造(上海)有限公司 具有低待机电流的调压器用器件和方法
JP4551261B2 (ja) * 2005-04-01 2010-09-22 株式会社日立製作所 冷却ジャケット
JP2007127398A (ja) * 2005-10-05 2007-05-24 Seiko Epson Corp 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
JP4449894B2 (ja) * 2005-12-16 2010-04-14 セイコーエプソン株式会社 熱交換器、光源装置、プロジェクタおよび電子機器
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US7539020B2 (en) * 2006-02-16 2009-05-26 Cooligy Inc. Liquid cooling loops for server applications
US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
TW200810676A (en) 2006-03-30 2008-02-16 Cooligy Inc Multi device cooling
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US20070256825A1 (en) * 2006-05-04 2007-11-08 Conway Bruce R Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
US20080006396A1 (en) * 2006-06-30 2008-01-10 Girish Upadhya Multi-stage staggered radiator for high performance liquid cooling applications
US7762314B2 (en) * 2007-04-24 2010-07-27 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
TW200912621A (en) * 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
US8081462B2 (en) 2007-09-13 2011-12-20 Rockwell Automation Technologies, Inc. Modular liquid cooling system
US7764494B2 (en) * 2007-11-20 2010-07-27 Basic Electronics, Inc. Liquid cooled module
US9157687B2 (en) * 2007-12-28 2015-10-13 Qcip Holdings, Llc Heat pipes incorporating microchannel heat exchangers
US20100230081A1 (en) * 2008-01-09 2010-09-16 International Mezzo Technologies, Inc. Corrugated Micro Tube Heat Exchanger
KR100950198B1 (ko) * 2008-02-05 2010-03-29 주식회사 이노윌 열전달용 박판구조 및 그 열전달장치
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US20090225514A1 (en) * 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
WO2010017321A1 (en) 2008-08-05 2010-02-11 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
US20100078155A1 (en) * 2008-09-30 2010-04-01 Third Millennium Engineering Thin Cavity Fluidic Heat Exchanger
US8177932B2 (en) * 2009-02-27 2012-05-15 International Mezzo Technologies, Inc. Method for manufacturing a micro tube heat exchanger
US8844609B2 (en) * 2009-03-11 2014-09-30 Alcatel Lucent Cooling manifold
US20110073292A1 (en) * 2009-09-30 2011-03-31 Madhav Datta Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems
US8368208B2 (en) 2010-10-01 2013-02-05 Raytheon Company Semiconductor cooling apparatus
US9417016B2 (en) 2011-01-05 2016-08-16 Hs Marston Aerospace Ltd. Laminated heat exchanger
US20130058043A1 (en) * 2011-09-03 2013-03-07 Weiss-Aug Co. Inc Heat sink with a stack of metal layers having channels therein
US9275931B2 (en) * 2012-01-12 2016-03-01 Huang-Han Chen Heat dissipating module
US9279626B2 (en) * 2012-01-23 2016-03-08 Honeywell International Inc. Plate-fin heat exchanger with a porous blocker bar
US9472487B2 (en) 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
US9553038B2 (en) 2012-04-02 2017-01-24 Raytheon Company Semiconductor cooling apparatus
US9313921B2 (en) 2012-08-30 2016-04-12 International Business Machines Corporation Chip stack structures that implement two-phase cooling with radial flow
JP2014146663A (ja) * 2013-01-28 2014-08-14 Fujitsu Ltd 冷却装置の製造方法、冷却装置及びこれを備えた電子部品パッケージ
EP3352216B1 (de) * 2015-09-18 2021-11-10 T.RAD Co., Ltd. Laminierte wärmesenke
US9961808B2 (en) 2016-03-09 2018-05-01 Ford Global Technologies, Llc Power electronics system
US9950628B2 (en) 2016-03-09 2018-04-24 Ford Global Technologies, Llc Power-module assembly with dummy module
US10017073B2 (en) 2016-03-09 2018-07-10 Ford Global Technologies, Llc Coolant channels for power module assemblies
CN107809878B (zh) * 2016-09-08 2020-08-04 奇鋐科技股份有限公司 水冷散热排结构
US10219408B2 (en) * 2016-09-26 2019-02-26 Asia Vital Components Co., Ltd. Water-cooling radiator structure
US10251306B2 (en) * 2016-09-26 2019-04-02 Asia Vital Components Co., Ltd. Water cooling heat dissipation structure
US10170392B2 (en) * 2017-04-05 2019-01-01 International Business Machines Corporation Wafer level integration for embedded cooling
SG10201904782SA (en) 2019-05-27 2020-12-30 Aem Singapore Pte Ltd Cold plate and a method of manufacture thereof
RU2727617C1 (ru) * 2019-11-01 2020-07-22 Акционерное общество "Научно-производственное предприятие "Пульсар" Радиатор

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2129300A (en) * 1936-04-10 1938-09-06 Dow Chemical Co Spiral heat interchanger
FR1396469A (fr) * 1964-03-11 1965-04-23 échangeur de chaleur entre deux fluides
US3347422A (en) * 1965-07-20 1967-10-17 Eversharp Inc Heat exchange device
US3361195A (en) * 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3454082A (en) * 1967-08-04 1969-07-08 Otto Harke Valve-controlled mixing with upstream heat exchanger
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
JPS5355544A (en) * 1976-10-29 1978-05-20 Sharp Corp Heat exchanger
US4151458A (en) * 1977-07-29 1979-04-24 Harco Corporation Closely spaced pipe-to-soil electrical survey method and apparatus
US4749032A (en) * 1979-10-01 1988-06-07 Rockwell International Corporation Internally manifolded unibody plate for a plate/fin-type heat exchanger
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
JPS58212824A (ja) * 1982-06-02 1983-12-10 Hitachi Ltd 沸騰伝熱面の製造方法
DE3415554A1 (de) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Kuehlkoerper fuer leistungselektronische bauelemente
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
US4893673A (en) * 1984-10-31 1990-01-16 Rockwell International Corporation Entry port inserts for internally manifolded stacked, finned-plate heat exchanger
FR2596144B1 (fr) * 1986-03-24 1988-05-27 Jouet Etienne Echangeur de chaleur spirale et son procede de fabrication
SU1397129A1 (ru) * 1986-07-03 1988-05-23 Одесский Технологический Институт Холодильной Промышленности Способ изготовлени матричных теплообменников
US4975803A (en) * 1988-12-07 1990-12-04 Sundstrand Corporation Cold plane system for cooling electronic circuit components
US4993487A (en) * 1989-03-29 1991-02-19 Sundstrand Corporation Spiral heat exchanger

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4401607A1 (de) * 1994-01-20 1995-07-27 Siemens Ag Kühleinheit für Leistungshalbleiter
DE19710783A1 (de) * 1997-03-17 1998-09-24 Curamik Electronics Gmbh Kühler für elektrische Bauelemente oder Schaltkreise sowie elektrischer Schaltkreis mit einer solchen Wärmesenke
DE19710783C2 (de) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise

Also Published As

Publication number Publication date
WO1992017745A1 (en) 1992-10-15
GB9320323D0 (en) 1994-05-04
GB2275575B (en) 1995-11-22
US5274920A (en) 1994-01-04
GB2275575A (en) 1994-08-31
JPH06508911A (ja) 1994-10-06
US5125451A (en) 1992-06-30
AU1756692A (en) 1992-11-02

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Legal Events

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8139 Disposal/non-payment of the annual fee