DE3876215D1 - Zusammensetzung und verfahren zum konditionieren der oberflaeche von polycarbonat-harzen vor der metallplattierung. - Google Patents
Zusammensetzung und verfahren zum konditionieren der oberflaeche von polycarbonat-harzen vor der metallplattierung.Info
- Publication number
- DE3876215D1 DE3876215D1 DE8888308753T DE3876215T DE3876215D1 DE 3876215 D1 DE3876215 D1 DE 3876215D1 DE 8888308753 T DE8888308753 T DE 8888308753T DE 3876215 T DE3876215 T DE 3876215T DE 3876215 D1 DE3876215 D1 DE 3876215D1
- Authority
- DE
- Germany
- Prior art keywords
- composition
- metal plating
- conditioning
- polycarbonate resins
- before metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/118,811 US4775557A (en) | 1987-11-09 | 1987-11-09 | Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3876215D1 true DE3876215D1 (de) | 1993-01-07 |
DE3876215T2 DE3876215T2 (de) | 1993-04-15 |
Family
ID=22380887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8888308753T Expired - Fee Related DE3876215T2 (de) | 1987-11-09 | 1988-09-21 | Zusammensetzung und verfahren zum konditionieren der oberflaeche von polycarbonat-harzen vor der metallplattierung. |
Country Status (13)
Country | Link |
---|---|
US (1) | US4775557A (de) |
EP (1) | EP0316061B1 (de) |
JP (1) | JPH01142085A (de) |
KR (1) | KR960003735B1 (de) |
AT (1) | ATE82776T1 (de) |
AU (1) | AU609506B2 (de) |
BR (1) | BR8804411A (de) |
CA (1) | CA1306409C (de) |
DE (1) | DE3876215T2 (de) |
DK (1) | DK443488A (de) |
ES (1) | ES2008638A6 (de) |
IL (1) | IL87392A (de) |
MX (1) | MX166697B (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3740369A1 (de) * | 1987-11-25 | 1989-06-08 | Schering Ag | Verfahren zur vorbehandlung von kunststoffen |
US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
US4921736A (en) * | 1988-10-12 | 1990-05-01 | Occidental Chemical Corporation | Low friction, wear resistant plastic parts |
US5049230A (en) * | 1988-11-07 | 1991-09-17 | Jp Laboratories, Inc. | Single step pre-swelling and etching of plastics for plating |
US5015329A (en) * | 1988-11-07 | 1991-05-14 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
US4941940A (en) * | 1988-11-07 | 1990-07-17 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
DE3922477A1 (de) * | 1989-07-06 | 1991-01-17 | Schering Ag | Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung |
US4978569A (en) * | 1989-08-14 | 1990-12-18 | Eastman Kodak Company | Process for preparing selectively metallized articles |
US5075039A (en) * | 1990-05-31 | 1991-12-24 | Shipley Company Inc. | Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
US5120578A (en) * | 1990-05-31 | 1992-06-09 | Shipley Company Inc. | Coating composition |
US5288313A (en) * | 1990-05-31 | 1994-02-22 | Shipley Company Inc. | Electroless plating catalyst |
US5180639A (en) * | 1990-10-26 | 1993-01-19 | General Electric Company | Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
US5132191A (en) * | 1990-10-26 | 1992-07-21 | General Electric Company | Polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
US5198096A (en) * | 1990-11-28 | 1993-03-30 | General Electric Company | Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
JP2768390B2 (ja) * | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
DE4108461C1 (de) * | 1991-03-13 | 1992-06-25 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
US5498440A (en) * | 1992-01-21 | 1996-03-12 | General Electric Company | Adhesion of electroless coating to resinous articles |
US5229169A (en) * | 1992-01-21 | 1993-07-20 | General Electric Company | Adhesion of electroless coatings to resinous articles by treatment with permanganate |
DE4221948C1 (de) * | 1992-07-02 | 1993-10-21 | Schering Ag | Verfahren zur Metallisierung von Kunststoffen und Verwendung |
DE4326079A1 (de) * | 1993-07-30 | 1995-02-02 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung |
US5332465A (en) * | 1993-09-08 | 1994-07-26 | Macdermid, Incorporated | Process for preparing plastic surfaces to be plated |
US5336370A (en) * | 1993-12-09 | 1994-08-09 | Chipalkatti Makarand H | Pre-treatment for plating technique |
US5985040A (en) * | 1998-09-21 | 1999-11-16 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
KR100336297B1 (ko) * | 1999-05-17 | 2002-05-13 | 남상진 | 페수처리시스템 |
US6454868B1 (en) | 2000-04-17 | 2002-09-24 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
US7354870B2 (en) | 2005-11-14 | 2008-04-08 | National Research Council Of Canada | Process for chemical etching of parts fabricated by stereolithography |
JP5482343B2 (ja) * | 2010-03-18 | 2014-05-07 | コニカミノルタ株式会社 | 難燃性ポリエステル樹脂組成物 |
KR101628806B1 (ko) * | 2014-05-16 | 2016-06-09 | 주식회사 아모센스 | 발광소자 패키지의 제조방법 |
TWI713737B (zh) | 2016-05-04 | 2020-12-21 | 德商德國艾托特克公司 | 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE747271A (fr) * | 1969-03-13 | 1970-08-17 | Ampex | Traitement de surface pour rendre hydrophiles des matetiaux polymeres, notamment en vue de leur placage par les |
US3770528A (en) * | 1971-09-29 | 1973-11-06 | Martin Processing Co Inc | Method for the surface treatment of polyimide materials |
FR2223438A1 (fr) * | 1973-03-28 | 1974-10-25 | Air Ind | Compositions de denaturation des peintures, notamment pour le nettoyage des cabines de peinture |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
AT367081B (de) * | 1977-09-19 | 1982-05-25 | Semperit Ag | Elastomerkoerper |
US4131698A (en) * | 1977-12-16 | 1978-12-26 | Rca Corporation | Pretreatment of polyvinyl chloride plastics for electroless deposition |
JPS575855A (en) * | 1980-06-12 | 1982-01-12 | Kakihara Kogyo Kk | Formation of metal film onto electric unconductive resin |
FR2565699A1 (fr) * | 1984-06-11 | 1985-12-13 | Suwa Seikosha Kk | Procede de modification de la surface d'une matiere de base comprenant des motifs carbonate et ester d'allyle, pour former ensuite un revetement superficiel dur, dans le cas de lentilles pour verres ophtalmiques |
DE3582234D1 (de) * | 1985-01-08 | 1991-04-25 | Toray Industries | Metallplattierter formgegenstand. |
JPS61252691A (ja) * | 1985-05-02 | 1986-11-10 | キヤノン株式会社 | プリント配線板の製造方法 |
EP0309243B1 (de) * | 1987-09-25 | 1993-08-18 | Engelhard Technologies Limited | Vorätzbehandlung eines Plastiksubstrats |
-
1987
- 1987-11-09 US US07/118,811 patent/US4775557A/en not_active Expired - Lifetime
-
1988
- 1988-08-08 DK DK443488A patent/DK443488A/da not_active Application Discontinuation
- 1988-08-09 IL IL87392A patent/IL87392A/xx not_active IP Right Cessation
- 1988-08-10 CA CA000574350A patent/CA1306409C/en not_active Expired - Fee Related
- 1988-08-11 AU AU20666/88A patent/AU609506B2/en not_active Ceased
- 1988-08-23 MX MX012788A patent/MX166697B/es unknown
- 1988-08-23 KR KR1019880010685A patent/KR960003735B1/ko not_active IP Right Cessation
- 1988-08-29 BR BR8804411A patent/BR8804411A/pt not_active IP Right Cessation
- 1988-09-21 DE DE8888308753T patent/DE3876215T2/de not_active Expired - Fee Related
- 1988-09-21 AT AT88308753T patent/ATE82776T1/de active
- 1988-09-21 EP EP88308753A patent/EP0316061B1/de not_active Expired - Lifetime
- 1988-09-26 JP JP63239105A patent/JPH01142085A/ja active Pending
- 1988-10-07 ES ES8803054A patent/ES2008638A6/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DK443488D0 (da) | 1988-08-08 |
ES2008638A6 (es) | 1989-07-16 |
MX166697B (es) | 1993-01-28 |
BR8804411A (pt) | 1989-05-23 |
US4775557A (en) | 1988-10-04 |
AU609506B2 (en) | 1991-05-02 |
DK443488A (da) | 1989-05-10 |
EP0316061B1 (de) | 1992-11-25 |
EP0316061A1 (de) | 1989-05-17 |
DE3876215T2 (de) | 1993-04-15 |
ATE82776T1 (de) | 1992-12-15 |
KR960003735B1 (ko) | 1996-03-21 |
IL87392A0 (en) | 1989-01-31 |
CA1306409C (en) | 1992-08-18 |
AU2066688A (en) | 1989-05-11 |
IL87392A (en) | 1991-11-21 |
JPH01142085A (ja) | 1989-06-02 |
KR890008345A (ko) | 1989-07-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |