DE3784211T2 - Produkt aus kunstharz mit einer oberflaeche, die mit einer anordnung von einer durch mikrodendriten gebundenen metallschicht beschichtbar ist und kunstharz metallaminat daraus. - Google Patents

Produkt aus kunstharz mit einer oberflaeche, die mit einer anordnung von einer durch mikrodendriten gebundenen metallschicht beschichtbar ist und kunstharz metallaminat daraus.

Info

Publication number
DE3784211T2
DE3784211T2 DE8787309067T DE3784211T DE3784211T2 DE 3784211 T2 DE3784211 T2 DE 3784211T2 DE 8787309067 T DE8787309067 T DE 8787309067T DE 3784211 T DE3784211 T DE 3784211T DE 3784211 T2 DE3784211 T2 DE 3784211T2
Authority
DE
Germany
Prior art keywords
synthetic resin
microdendrite
coated
arrangement
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787309067T
Other languages
English (en)
Other versions
DE3784211D1 (de
Inventor
Edward Dr Adler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE3784211D1 publication Critical patent/DE3784211D1/de
Application granted granted Critical
Publication of DE3784211T2 publication Critical patent/DE3784211T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24529—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface and conforming component on an opposite nonplanar surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24595—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness and varying density
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
DE8787309067T 1986-10-14 1987-10-14 Produkt aus kunstharz mit einer oberflaeche, die mit einer anordnung von einer durch mikrodendriten gebundenen metallschicht beschichtbar ist und kunstharz metallaminat daraus. Expired - Fee Related DE3784211T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61242174A JPS63103075A (ja) 1986-10-14 1986-10-14 マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品

Publications (2)

Publication Number Publication Date
DE3784211D1 DE3784211D1 (de) 1993-03-25
DE3784211T2 true DE3784211T2 (de) 1993-06-03

Family

ID=17085415

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787309067T Expired - Fee Related DE3784211T2 (de) 1986-10-14 1987-10-14 Produkt aus kunstharz mit einer oberflaeche, die mit einer anordnung von einer durch mikrodendriten gebundenen metallschicht beschichtbar ist und kunstharz metallaminat daraus.

Country Status (4)

Country Link
US (1) US4774122A (de)
EP (1) EP0265161B1 (de)
JP (1) JPS63103075A (de)
DE (1) DE3784211T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4867839A (en) * 1987-09-04 1989-09-19 Shinko Electric Industries Co., Ltd. Process for forming a circuit substrate
JPH0634448B2 (ja) * 1988-07-25 1994-05-02 株式会社日立製作所 多層プリント配線板及びその製造方法
JPH0628941B2 (ja) * 1988-09-20 1994-04-20 株式会社日立製作所 回路基板及びその製造方法
US4997516A (en) * 1989-07-10 1991-03-05 Edward Adler Method for improving adherence of copper foil to resinous substrates
US4997722A (en) * 1989-07-10 1991-03-05 Edward Adler Composition and method for improving adherence of copper foil to resinous substrates
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
US5238729A (en) * 1991-04-05 1993-08-24 Minnesota Mining And Manufacturing Company Sensors based on nanosstructured composite films
US5336558A (en) * 1991-06-24 1994-08-09 Minnesota Mining And Manufacturing Company Composite article comprising oriented microstructures
US5517758A (en) * 1992-05-29 1996-05-21 Matsushita Electric Industrial Co., Ltd. Plating method and method for producing a multi-layered printed wiring board using the same
SE470277B (sv) * 1992-11-06 1993-12-20 Metfoils Ab Förfarande vid mönsterkortstillverkning samt användning därvid
US5376232A (en) * 1993-08-23 1994-12-27 Parlex Corporation Method of manufacturing a printed circuit board
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
KR20000069523A (ko) * 1997-01-16 2000-11-25 보텀필드 레인, 에프. 기상 증착 요소 및 기상 증착 방법
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
KR100248054B1 (ko) * 1997-08-14 2000-03-15 윤종용 솔더링을 이용한 광섬유어레이 모듈 및 그 제작방법
EP0899053A3 (de) 1997-08-29 2000-04-05 Sintokogio Ltd. Plattiertes Produkt und Verfahren und Vorrichtung zu dessen Herstellung
US20090126974A1 (en) * 2005-09-30 2009-05-21 Maroshi Yuasa Manufacturing Process for a Prepreg with a Carrier, Prepreg with a Carrier, Manufacturing Process for a Thin Double-Sided Plate, Thin Double-Sided Plate and Manufacturing Process for a Multilayer-Printed Circuit Board
FR2996491A1 (fr) * 2012-10-08 2014-04-11 Europ Aeronautic Defence Ans Space Company Eads France Procede de realisation de pieces composites thermodurcissables par drapage de materiau preimpregne

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US29820A (en) * 1860-08-28 Of richmond
US1963834A (en) * 1933-01-14 1934-06-19 Moto Mcter Gauge & Equipment C Method of ornamentation
BE529729A (de) * 1953-06-19 1900-01-01
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same
JPS49348B1 (de) * 1970-12-25 1974-01-07
BE789715A (fr) * 1971-10-08 1973-02-01 Yates Industries Traitement de feuilles de cuivre en plusieurs couches
US3864147A (en) * 1972-09-25 1975-02-04 Macdermid Inc Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof
JPS5123266B2 (de) * 1972-04-21 1976-07-15
US3956041A (en) * 1972-07-11 1976-05-11 Kollmorgen Corporation Transfer coating process for manufacture of printing circuits
FR2193363A5 (en) * 1972-07-17 1974-02-15 Dodge Ind Inc Sheet bonding - using stepped cross-section in metal sheeting for heat/pre-assure roller bonding
US4087300A (en) * 1974-01-07 1978-05-02 Edward Adler Process for producing metal-plastic laminate
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards
US4448804A (en) * 1983-10-11 1984-05-15 International Business Machines Corporation Method for selective electroless plating of copper onto a non-conductive substrate surface
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
JPS6142993A (ja) * 1984-08-07 1986-03-01 三菱電機株式会社 樹脂への導体層形成方法

Also Published As

Publication number Publication date
DE3784211D1 (de) 1993-03-25
EP0265161B1 (de) 1993-02-17
US4774122A (en) 1988-09-27
EP0265161A2 (de) 1988-04-27
EP0265161A3 (en) 1988-09-21
JPS63103075A (ja) 1988-05-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee