DE3686386T2 - Verfahren und vorrichtung zur mustermaskierung. - Google Patents

Verfahren und vorrichtung zur mustermaskierung.

Info

Publication number
DE3686386T2
DE3686386T2 DE8686113698T DE3686386T DE3686386T2 DE 3686386 T2 DE3686386 T2 DE 3686386T2 DE 8686113698 T DE8686113698 T DE 8686113698T DE 3686386 T DE3686386 T DE 3686386T DE 3686386 T2 DE3686386 T2 DE 3686386T2
Authority
DE
Germany
Prior art keywords
pattern masking
masking
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686113698T
Other languages
English (en)
Other versions
DE3686386D1 (de
Inventor
Ltd Hoki
Ltd Sano
Ltd Kitakado
Ltd Sezaki
Ltd Hotta
Ltd Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60222454A external-priority patent/JPH0750504B2/ja
Priority claimed from JP15845886A external-priority patent/JPH0623998B2/ja
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of DE3686386D1 publication Critical patent/DE3686386D1/de
Application granted granted Critical
Publication of DE3686386T2 publication Critical patent/DE3686386T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
DE8686113698T 1985-10-04 1986-10-03 Verfahren und vorrichtung zur mustermaskierung. Expired - Fee Related DE3686386T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60222454A JPH0750504B2 (ja) 1985-10-04 1985-10-04 パタ−ン認識装置
JP15845886A JPH0623998B2 (ja) 1986-07-05 1986-07-05 パタ−ンマスキング方法およびその装置

Publications (2)

Publication Number Publication Date
DE3686386D1 DE3686386D1 (de) 1992-09-17
DE3686386T2 true DE3686386T2 (de) 1993-04-01

Family

ID=26485567

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686113698T Expired - Fee Related DE3686386T2 (de) 1985-10-04 1986-10-03 Verfahren und vorrichtung zur mustermaskierung.

Country Status (4)

Country Link
US (1) US4797939A (de)
EP (1) EP0217414B1 (de)
KR (1) KR900007548B1 (de)
DE (1) DE3686386T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4969200A (en) * 1988-03-25 1990-11-06 Texas Instruments Incorporated Target autoalignment for pattern inspector or writer
US5173949A (en) * 1988-08-29 1992-12-22 Raytheon Company Confirmed boundary pattern matching
US5168529A (en) * 1988-08-29 1992-12-01 Rayethon Company Confirmed boundary pattern matching
US5027422A (en) * 1988-08-29 1991-06-25 Raytheon Company Confirmed boundary pattern matching
US5168530A (en) * 1988-08-29 1992-12-01 Raytheon Company Confirmed boundary pattern matching
US5052045A (en) * 1988-08-29 1991-09-24 Raytheon Company Confirmed boundary pattern matching
US5027417A (en) * 1989-03-31 1991-06-25 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
US5150422A (en) * 1989-03-31 1992-09-22 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
US5144681A (en) * 1989-03-31 1992-09-01 Dainnippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
JPH0469777A (ja) * 1990-07-10 1992-03-04 Dainippon Screen Mfg Co Ltd プリント基板のパターン検査装置
JPH0786466B2 (ja) * 1990-07-18 1995-09-20 大日本スクリーン製造株式会社 プリント基板のパターン検査装置
JP2747105B2 (ja) * 1990-11-05 1998-05-06 富士通株式会社 画像データ検証方法及び装置
JPH04237383A (ja) * 1991-01-22 1992-08-25 Matsushita Electric Ind Co Ltd 二次元画像処理における円弧近似方法
JP3332546B2 (ja) * 1994-01-31 2002-10-07 キヤノン株式会社 画像形成装置及び画像形成方法
US5727300A (en) * 1995-02-07 1998-03-17 The Boeing Company Fastener verification system
JP4071866B2 (ja) * 1998-07-31 2008-04-02 イビデン株式会社 配線パターン検査装置
US6642150B1 (en) 1999-12-28 2003-11-04 Taiwan Semiconductor Manufacturing Company Method for testing for blind hole formed in wafer layer
US6459448B1 (en) 2000-04-19 2002-10-01 K-G Devices Corporation System and method for automatically inspecting arrays of geometric targets
JP2002358509A (ja) * 2001-06-01 2002-12-13 Dainippon Screen Mfg Co Ltd 穴検査装置
US20090021545A1 (en) * 2007-07-19 2009-01-22 Samsung Electronics Co. Ltd. Image forming apparatus and method of generating output signal thereof
JP2015025758A (ja) * 2013-07-26 2015-02-05 Hoya株式会社 基板検査方法、基板製造方法および基板検査装置
JP6732518B2 (ja) * 2016-04-27 2020-07-29 キヤノン株式会社 画像処理装置および画像処理方法
JP7220128B2 (ja) * 2019-06-21 2023-02-09 東洋ガラス株式会社 ガラスびんの検査方法及びガラスびんの製造方法
US20240087135A1 (en) * 2022-09-09 2024-03-14 Applied Materials, Inc. Clog detection via image analytics

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3882463A (en) * 1971-06-14 1975-05-06 Philips Corp Character recognition apparatus
JPS5517988B2 (de) * 1974-06-05 1980-05-15
JPS55142254A (en) * 1979-04-25 1980-11-06 Hitachi Ltd Inspecting method for pattern of printed wiring board
US4379308A (en) * 1980-02-25 1983-04-05 Cooper Industries, Inc. Apparatus for determining the parameters of figures on a surface
DE3070721D1 (en) * 1980-12-18 1985-07-04 Ibm Process for inspecting and automatically classifying objects presenting configurations with dimensional tolerances and variable rejecting criteria depending on placement, apparatus and circuits therefor
JPS57137979A (en) * 1981-02-20 1982-08-25 Nec Corp Printing character recognizing device
JPS5863838A (ja) * 1981-10-14 1983-04-15 Fuji Electric Co Ltd 欠陥検出回路
US4545070A (en) * 1982-04-30 1985-10-01 Fuji Electric Company, Ltd. Pattern discriminator
JPS592069A (ja) 1982-06-28 1984-01-07 Tsutomu Sato 画像の消去法
US4560273A (en) * 1982-11-30 1985-12-24 Fujitsu Limited Method and apparatus for inspecting plated through holes in printed circuit boards
US4555798A (en) * 1983-06-20 1985-11-26 Kla Instruments Corporation Automatic system and method for inspecting hole quality
JPS6061604A (ja) 1983-09-16 1985-04-09 Hitachi Ltd パタ−ン検査装置
US4692690A (en) * 1983-12-26 1987-09-08 Hitachi, Ltd. Pattern detecting apparatus
DE3587220T2 (de) * 1984-01-13 1993-07-08 Komatsu Mfg Co Ltd Identifizierungsverfahren von konturlinien.
US4596037A (en) * 1984-03-09 1986-06-17 International Business Machines Corporation Video measuring system for defining location orthogonally

Also Published As

Publication number Publication date
KR900007548B1 (ko) 1990-10-15
DE3686386D1 (de) 1992-09-17
US4797939A (en) 1989-01-10
EP0217414B1 (de) 1992-08-12
EP0217414A2 (de) 1987-04-08
KR870004290A (ko) 1987-05-08
EP0217414A3 (en) 1989-11-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee