DE3684557D1 - Waferintegrierte halbleiteranordnung. - Google Patents

Waferintegrierte halbleiteranordnung.

Info

Publication number
DE3684557D1
DE3684557D1 DE8686113735T DE3684557T DE3684557D1 DE 3684557 D1 DE3684557 D1 DE 3684557D1 DE 8686113735 T DE8686113735 T DE 8686113735T DE 3684557 T DE3684557 T DE 3684557T DE 3684557 D1 DE3684557 D1 DE 3684557D1
Authority
DE
Germany
Prior art keywords
wafer
integrated semiconductor
semiconductor arrangement
arrangement
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686113735T
Other languages
English (en)
Inventor
Toshitaka Fujitsu Lt Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3684557D1 publication Critical patent/DE3684557D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
DE8686113735T 1985-10-05 1986-10-03 Waferintegrierte halbleiteranordnung. Expired - Fee Related DE3684557D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60222593A JPS6281745A (ja) 1985-10-05 1985-10-05 ウエハ−規模のｌｓｉ半導体装置とその製造方法

Publications (1)

Publication Number Publication Date
DE3684557D1 true DE3684557D1 (de) 1992-04-30

Family

ID=16784898

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686113735T Expired - Fee Related DE3684557D1 (de) 1985-10-05 1986-10-03 Waferintegrierte halbleiteranordnung.

Country Status (5)

Country Link
US (1) US4907062A (de)
EP (1) EP0222144B1 (de)
JP (1) JPS6281745A (de)
KR (1) KR900008018B1 (de)
DE (1) DE3684557D1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR890005869A (ko) * 1987-09-11 1989-05-17 페어차일드 세미컨덕터 코포레이션 회로기판의 공동에 붙박힌 액티브 디바이스를 갖는 반도체 모듈
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JPS6281745A (ja) 1987-04-15
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EP0222144A1 (de) 1987-05-20
US4907062A (en) 1990-03-06

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