DE3672301D1 - Piezoresistiver druckwandler. - Google Patents

Piezoresistiver druckwandler.

Info

Publication number
DE3672301D1
DE3672301D1 DE8686303078T DE3672301T DE3672301D1 DE 3672301 D1 DE3672301 D1 DE 3672301D1 DE 8686303078 T DE8686303078 T DE 8686303078T DE 3672301 T DE3672301 T DE 3672301T DE 3672301 D1 DE3672301 D1 DE 3672301D1
Authority
DE
Germany
Prior art keywords
pressure converter
piezoresistive pressure
piezoresistive
converter
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686303078T
Other languages
English (en)
Inventor
Mark E Rosenberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell Inc
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Application granted granted Critical
Publication of DE3672301D1 publication Critical patent/DE3672301D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G01L19/146—Housings with stress relieving means using flexible element between the transducer and the support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49103—Strain gauge making
DE8686303078T 1985-04-24 1986-04-23 Piezoresistiver druckwandler. Expired - Fee Related DE3672301D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/726,743 US4656454A (en) 1985-04-24 1985-04-24 Piezoresistive pressure transducer with elastomeric seals

Publications (1)

Publication Number Publication Date
DE3672301D1 true DE3672301D1 (de) 1990-08-02

Family

ID=24919826

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686303078T Expired - Fee Related DE3672301D1 (de) 1985-04-24 1986-04-23 Piezoresistiver druckwandler.

Country Status (4)

Country Link
US (1) US4656454A (de)
EP (1) EP0202786B1 (de)
JP (1) JPS61247933A (de)
DE (1) DE3672301D1 (de)

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US4774843A (en) * 1987-08-14 1988-10-04 Gulton Industries, Inc. Strain gage
US4756193A (en) * 1987-09-11 1988-07-12 Delco Electronics Corporation Pressure sensor
DE3777188D1 (de) * 1987-11-27 1992-04-09 Kristal Instr Ag Messzelle, insbesondere fuer relativ- und differenzdruckmessungen.
US4879903A (en) * 1988-09-02 1989-11-14 Nova Sensor Three part low cost sensor housing
US5048181A (en) * 1988-09-19 1991-09-17 Ford Motor Company Method for making thick film circuit housing assembly design
US4923444A (en) * 1988-12-19 1990-05-08 Ivac Corporation Negative pressure measurement system
US4942383A (en) * 1989-03-06 1990-07-17 Honeywell Inc. Low cost wet-to-wet pressure sensor package
DE3937522A1 (de) * 1989-11-10 1991-05-16 Texas Instruments Deutschland Mit einem traegerelement verbundener halbleiter-drucksensor
US5121627A (en) * 1990-05-21 1992-06-16 Aoust Brian G D Integrated miniaturized sensor for measuring total dissolved gas and liquid vapor
US5184107A (en) * 1991-01-28 1993-02-02 Honeywell, Inc. Piezoresistive pressure transducer with a conductive elastomeric seal
CA2058916C (en) * 1991-01-28 2000-03-21 Dean Joseph Maurer Piezoresistive pressure transducer with a conductive elastomeric seal
FR2678066B1 (fr) * 1991-06-18 1993-10-15 Jaeger Dispositif support d'une capsule de capteur electrique.
US5187985A (en) * 1991-09-19 1993-02-23 Honeywell Inc. Amplified pressure transducer
US5333505A (en) * 1992-01-13 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same
US5351550A (en) * 1992-10-16 1994-10-04 Honeywell Inc. Pressure sensor adapted for use with a component carrier
US5327785A (en) * 1993-03-09 1994-07-12 Honeywell Inc. Pressure sensor with improved heat dissipation characteristics
US5410916A (en) * 1994-06-24 1995-05-02 Honeywell Inc. Flowthrough pressure sensor
US5644285A (en) * 1995-02-01 1997-07-01 Honeywell Inc. Pressure transducer with media isolation
US5483994A (en) * 1995-02-01 1996-01-16 Honeywell, Inc. Pressure transducer with media isolation and negative pressure measuring capability
DE19626084C2 (de) * 1996-06-28 2003-04-17 Infineon Technologies Ag Drucksensorvorrichtung für eine Montage auf der Bestückungsoberfläche einer Leiterplatte
DE19626081A1 (de) * 1996-06-28 1998-01-02 Siemens Ag Halbleiter-Bauelement
US5763787A (en) * 1996-09-05 1998-06-09 Rosemont Inc. Carrier assembly for fluid sensor
DE19707503B4 (de) * 1997-02-25 2007-01-04 Infineon Technologies Ag Drucksensor-Bauelement und Verfahren zur Herstellung
US6076409A (en) * 1997-12-22 2000-06-20 Rosemount Aerospace, Inc. Media compatible packages for pressure sensing devices
US6311561B1 (en) 1997-12-22 2001-11-06 Rosemount Aerospace Inc. Media compatible pressure sensor
US20020003274A1 (en) * 1998-08-27 2002-01-10 Janusz Bryzek Piezoresistive sensor with epi-pocket isolation
US6006607A (en) * 1998-08-31 1999-12-28 Maxim Integrated Products, Inc. Piezoresistive pressure sensor with sculpted diaphragm
US6351996B1 (en) 1998-11-12 2002-03-05 Maxim Integrated Products, Inc. Hermetic packaging for semiconductor pressure sensors
US6346742B1 (en) 1998-11-12 2002-02-12 Maxim Integrated Products, Inc. Chip-scale packaged pressure sensor
US6229190B1 (en) 1998-12-18 2001-05-08 Maxim Integrated Products, Inc. Compensated semiconductor pressure sensor
US6255728B1 (en) 1999-01-15 2001-07-03 Maxim Integrated Products, Inc. Rigid encapsulation package for semiconductor devices
DE19909069C2 (de) * 1999-03-02 2001-08-30 Hahn Schickard Ges Mikroventilanordnung
CA2310149C (en) 2000-05-30 2004-12-07 International Road Dynamics Inc. In road vehicle axle sensor
US6612175B1 (en) 2000-07-20 2003-09-02 Nt International, Inc. Sensor usable in ultra pure and highly corrosive environments
US7152478B2 (en) * 2000-07-20 2006-12-26 Entegris, Inc. Sensor usable in ultra pure and highly corrosive environments
US6883874B2 (en) 2000-09-14 2005-04-26 New York Air Brake Corporation Pressure sensor module
US6889568B2 (en) * 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
US7757574B2 (en) * 2002-01-24 2010-07-20 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
JP2004004069A (ja) * 2002-04-12 2004-01-08 Hokuriku Electric Ind Co Ltd 半導体力センサ
JP3479064B1 (ja) * 2002-04-12 2003-12-15 北陸電気工業株式会社 半導体力センサ
US7203334B2 (en) * 2002-11-22 2007-04-10 Knowles Electronics, Llc. Apparatus for creating acoustic energy in a balanced receiver assembly and manufacturing method thereof
DE10343498A1 (de) * 2003-02-07 2005-05-04 Univ Leipzig Verfahren zur Feststellung wenigstens eines Zustandsparameters eines Dichtungssystems sowie Dichtungssystem
US20040209699A1 (en) * 2003-04-18 2004-10-21 Olson Roger Allred Electronic putting target apparatus
US7204010B2 (en) * 2004-04-28 2007-04-17 Measurement Specialties, Inc. Method of making a load sensor plate
US8604361B2 (en) * 2005-12-13 2013-12-10 Kla-Tencor Corporation Component package for maintaining safe operating temperature of components
JP4939110B2 (ja) * 2006-05-16 2012-05-23 株式会社ミツトヨ プローブ、および、表面性状測定装置
US7930944B2 (en) * 2008-05-14 2011-04-26 Honeywell International Inc. ASIC compensated pressure sensor with soldered sense die attach
US8164007B2 (en) * 2008-07-16 2012-04-24 Honeywell International Conductive elastomeric seal and method of fabricating the same
US7900521B2 (en) * 2009-02-10 2011-03-08 Freescale Semiconductor, Inc. Exposed pad backside pressure sensor package
US8371176B2 (en) 2011-01-06 2013-02-12 Honeywell International Inc. Media isolated pressure sensor
US8681493B2 (en) 2011-05-10 2014-03-25 Kla-Tencor Corporation Heat shield module for substrate-like metrology device
US8516897B1 (en) 2012-02-21 2013-08-27 Honeywell International Inc. Pressure sensor
US9003897B2 (en) * 2012-05-10 2015-04-14 Honeywell International Inc. Temperature compensated force sensor
WO2014150156A1 (en) 2013-03-14 2014-09-25 Trl Enterprises Llc Fully swept pressure sensor
US9470593B2 (en) * 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
US9983074B2 (en) * 2014-06-27 2018-05-29 Hokuriku Electric Industry Co., Ltd. Force detector
KR102637239B1 (ko) * 2017-02-27 2024-02-19 현대모비스 주식회사 차량용 압력감지장치
KR102413739B1 (ko) * 2017-09-15 2022-06-29 현대모비스 주식회사 에어백용 압력감지장치
US11292101B2 (en) * 2017-11-22 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US10942079B2 (en) 2018-03-29 2021-03-09 Veoneer Us Inc. Rectangular snap fit pressure sensor unit

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751530A (en) * 1954-01-04 1956-06-19 Honeywell Regulator Co Differential pressure sensing unit
US2830698A (en) * 1955-04-25 1958-04-15 Erie Resistor Corp Condenser
US3315201A (en) * 1965-03-31 1967-04-18 Bailey Meter Co Strain transducer
US3455165A (en) * 1965-12-22 1969-07-15 Pierre Huet Pressure sensitive devices
US3417361A (en) * 1966-03-07 1968-12-17 Conrac Corp Semiconductive pressure transducer
US3466513A (en) * 1968-01-24 1969-09-09 William R Belko Jr Electrical capacitor
US3739315A (en) * 1972-05-18 1973-06-12 Kulite Semiconductors Prod Inc Semiconductor transducers having h shaped cross-sectional configurations
NL7415668A (nl) * 1974-12-02 1976-06-04 Philips Nv Drukopnemer.
US4125820A (en) * 1975-10-06 1978-11-14 Honeywell Inc. Stress sensor apparatus
US4128006A (en) * 1976-12-13 1978-12-05 Bunker Ramo Corporation Packaging of pressure sensor cells
US4173900A (en) * 1977-03-07 1979-11-13 Hitachi, Ltd. Semiconductor pressure transducer
JPS54131892A (en) * 1978-04-05 1979-10-13 Hitachi Ltd Semiconductor pressure converter
ATE7737T1 (de) * 1980-02-06 1984-06-15 Hans W. Dipl.-Phys. Keller Piezoresistive zylinderdosenartige druckmesszelle.
DE3200448C2 (de) * 1982-01-09 1986-03-06 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur Herstellung einer Halbleiter-Druckwandleranordnung
US4528855A (en) * 1984-07-02 1985-07-16 Itt Corporation Integral differential and static pressure transducer
US4600912A (en) * 1985-01-25 1986-07-15 Bourns Instruments, Inc. Diaphragm pressure sensor with improved tensile loading characteristics

Also Published As

Publication number Publication date
JPS61247933A (ja) 1986-11-05
US4656454A (en) 1987-04-07
EP0202786B1 (de) 1990-06-27
EP0202786A2 (de) 1986-11-26
EP0202786A3 (en) 1987-09-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee