DE3378169D1 - Apparatus for effecting alignment and spacing control of a mask and wafer for use in x-ray lithography - Google Patents
Apparatus for effecting alignment and spacing control of a mask and wafer for use in x-ray lithographyInfo
- Publication number
- DE3378169D1 DE3378169D1 DE8383107404T DE3378169T DE3378169D1 DE 3378169 D1 DE3378169 D1 DE 3378169D1 DE 8383107404 T DE8383107404 T DE 8383107404T DE 3378169 T DE3378169 T DE 3378169T DE 3378169 D1 DE3378169 D1 DE 3378169D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- mask
- ray lithography
- spacing control
- effecting alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/405,207 US4472824A (en) | 1982-08-04 | 1982-08-04 | Apparatus for effecting alignment and spacing control of a mask and wafer for use in X-ray lithography |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3378169D1 true DE3378169D1 (en) | 1988-11-10 |
Family
ID=23602735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383107404T Expired DE3378169D1 (en) | 1982-08-04 | 1983-07-27 | Apparatus for effecting alignment and spacing control of a mask and wafer for use in x-ray lithography |
Country Status (4)
Country | Link |
---|---|
US (1) | US4472824A (de) |
EP (1) | EP0100526B1 (de) |
JP (1) | JPS5933828A (de) |
DE (1) | DE3378169D1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60201626A (ja) * | 1984-03-27 | 1985-10-12 | Canon Inc | 位置合わせ装置 |
US4964146A (en) * | 1985-07-31 | 1990-10-16 | Hitachi, Ltd. | Pattern transistor mask and method of using the same |
DE3623891A1 (de) * | 1986-07-15 | 1988-01-28 | Siemens Ag | Anordnung zur genauen gegenseitigen ausrichtung einer maske und einer halbleiterscheibe in einem lithographiegeraet und verfahren zu ihrem betrieb |
US5561696A (en) * | 1987-10-30 | 1996-10-01 | Hewlett-Packard Company | Method and apparatus for inspecting electrical connections |
US5621811A (en) * | 1987-10-30 | 1997-04-15 | Hewlett-Packard Co. | Learning method and apparatus for detecting and controlling solder defects |
US5081656A (en) * | 1987-10-30 | 1992-01-14 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
US5097492A (en) * | 1987-10-30 | 1992-03-17 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
US4926452A (en) * | 1987-10-30 | 1990-05-15 | Four Pi Systems Corporation | Automated laminography system for inspection of electronics |
US4870668A (en) * | 1987-12-30 | 1989-09-26 | Hampshire Instruments, Inc. | Gap sensing/adjustment apparatus and method for a lithography machine |
US5319444A (en) * | 1988-02-16 | 1994-06-07 | Canon Kabushiki Kaisha | Position detecting method and apparatus |
US5294980A (en) * | 1988-03-24 | 1994-03-15 | Canon Kabushiki Kaisha | Positioning detecting method and apparatus |
JP2676933B2 (ja) * | 1988-09-05 | 1997-11-17 | キヤノン株式会社 | 位置検出装置 |
US5259012A (en) * | 1990-08-30 | 1993-11-02 | Four Pi Systems Corporation | Laminography system and method with electromagnetically directed multipath radiation source |
JPH05206017A (ja) * | 1991-08-09 | 1993-08-13 | Internatl Business Mach Corp <Ibm> | リソグラフイ露光システム及びその方法 |
US5548625A (en) * | 1995-03-02 | 1996-08-20 | Motorola, Inc. | Method for parallel multiple field processing in X-ray lithography |
US5583904A (en) * | 1995-04-11 | 1996-12-10 | Hewlett-Packard Co. | Continuous linear scan laminography system and method |
US5687209A (en) * | 1995-04-11 | 1997-11-11 | Hewlett-Packard Co. | Automatic warp compensation for laminographic circuit board inspection |
US6089525A (en) * | 1997-10-07 | 2000-07-18 | Ultratech Stepper, Inc. | Six axis active vibration isolation and payload reaction force compensation system |
US6307619B1 (en) | 2000-03-23 | 2001-10-23 | Silicon Valley Group, Inc. | Scanning framing blade apparatus |
DE10355681A1 (de) * | 2003-11-28 | 2005-07-07 | Süss Microtec Lithography Gmbh | Direkte Justierung in Maskalignern |
US7437911B2 (en) * | 2004-12-15 | 2008-10-21 | Asml Holding N.V. | Method and system for operating an air gauge at programmable or constant standoff |
DE102005033036B4 (de) * | 2005-07-15 | 2008-05-15 | Vistec Semiconductor Systems Gmbh | Vorrichtung und Verfahren zur Inspektion eines Wafers |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1312825A (en) * | 1969-04-19 | 1973-04-11 | Licentia Gmbh | Method and apparatus for bringing a mask and a semiconductor body into register with one another |
JPS5243692B2 (de) * | 1973-03-26 | 1977-11-01 | ||
JPS5252579A (en) * | 1975-10-27 | 1977-04-27 | Canon Inc | Clearance adjusng method |
JPS5255579A (en) * | 1975-10-31 | 1977-05-07 | Asahi Glass Co Ltd | Moisture sensor |
US4093378A (en) * | 1976-11-01 | 1978-06-06 | International Business Machines Corporation | Alignment apparatus |
DE2723902C2 (de) * | 1977-05-26 | 1983-12-08 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Parallelausrichtung und Justierung der Lage einer Halbleiterscheibe relativ zu einer Bestrahlungsmaske bei der Röntgenstrahl-Fotolithografie |
JPS55113330A (en) * | 1979-02-23 | 1980-09-01 | Chiyou Lsi Gijutsu Kenkyu Kumiai | X-ray exposure system and device |
US4335313A (en) * | 1980-05-12 | 1982-06-15 | The Perkin-Elmer Corporation | Method and apparatus for aligning an opaque mask with an integrated circuit wafer |
JPS5730291A (en) * | 1980-07-31 | 1982-02-18 | Fujitsu Ltd | El display unit |
-
1982
- 1982-08-04 US US06/405,207 patent/US4472824A/en not_active Expired - Fee Related
-
1983
- 1983-07-06 JP JP58121706A patent/JPS5933828A/ja active Granted
- 1983-07-27 DE DE8383107404T patent/DE3378169D1/de not_active Expired
- 1983-07-27 EP EP83107404A patent/EP0100526B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0100526A3 (en) | 1986-03-19 |
EP0100526A2 (de) | 1984-02-15 |
US4472824A (en) | 1984-09-18 |
JPS5933828A (ja) | 1984-02-23 |
JPH0562450B2 (de) | 1993-09-08 |
EP0100526B1 (de) | 1988-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SVG LITHOGRAPHY SYSTEMS, INC., WILTON, CONN., US |
|
8328 | Change in the person/name/address of the agent |
Free format text: GRUENECKER, A., DIPL.-ING. KINKELDEY, H., DIPL.-ING. DR.-ING. STOCKMAIR, W., DIPL.-ING. DR.-ING. AE.E. CAL TECH SCHUMANN, K., DIPL.-PHYS. DR.RER.NAT. JAKOB, P., DIPL.-ING. BEZOLD, G., DIPL.-CHEM. DR.RER.NAT. MEISTER, W., DIPL.-ING. HILGERS, H., DIPL.-ING. MEYER-PLATH, H., DIPL.-ING. DR.-ING. EHNOLD, A., DIPL.-ING. SCHUSTER, T., DIPL.-PHYS. GOLDBACH, K., DIPL.-ING.DR.-ING. AUFENANGER, M., DIPL.-ING. KLITZSCH, G., DIPL.-ING., PAT.-ANWAELTE, 8000 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |