DE3163825D1 - Photosensitive polyamide resin composition - Google Patents

Photosensitive polyamide resin composition

Info

Publication number
DE3163825D1
DE3163825D1 DE8181301040T DE3163825T DE3163825D1 DE 3163825 D1 DE3163825 D1 DE 3163825D1 DE 8181301040 T DE8181301040 T DE 8181301040T DE 3163825 T DE3163825 T DE 3163825T DE 3163825 D1 DE3163825 D1 DE 3163825D1
Authority
DE
Germany
Prior art keywords
resin composition
polyamide resin
photosensitive polyamide
photosensitive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181301040T
Other languages
English (en)
Inventor
Junichi Fujikawa
Masaharu Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=12347859&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3163825(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Application granted granted Critical
Publication of DE3163825D1 publication Critical patent/DE3163825D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/48—Polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
DE8181301040T 1980-03-13 1981-03-12 Photosensitive polyamide resin composition Expired DE3163825D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3204480A JPS56129212A (en) 1980-03-13 1980-03-13 Photosensitive polyamide resin composition

Publications (1)

Publication Number Publication Date
DE3163825D1 true DE3163825D1 (en) 1984-07-05

Family

ID=12347859

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181301040T Expired DE3163825D1 (en) 1980-03-13 1981-03-12 Photosensitive polyamide resin composition

Country Status (4)

Country Link
US (1) US4481280A (de)
EP (1) EP0036301B1 (de)
JP (1) JPS56129212A (de)
DE (1) DE3163825D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0081964B2 (de) * 1981-12-10 1993-08-04 Toray Industries, Inc. Photoempfindliche Polymerzusammensetzung
JPS58117537A (ja) * 1982-01-06 1983-07-13 Toray Ind Inc 感光性樹脂組成物
DE3513779A1 (de) * 1985-04-17 1986-10-23 Merck Patent Gmbh, 6100 Darmstadt Stabilisierte loesungen strahlungsvernetzbarer polymervorstufen hochwaermebestaendiger polymere
DE3767690D1 (de) * 1986-12-26 1991-02-28 Toray Industries Lichtempfindliche photopolymerzusammensetzung und druckplatte.
DE3808952A1 (de) * 1988-03-17 1989-10-05 Basf Ag Lichtempfindliche, photopolymerisierbare druckplatte
DE3808951A1 (de) * 1988-03-17 1989-10-05 Basf Ag Photopolymerisierbare, zur herstellung von druckformen geeignete druckplatte
US4975498A (en) * 1988-12-14 1990-12-04 Union Camp Corporation Thermally-curable aminoamide acrylate polymer
US4987160A (en) * 1989-01-31 1991-01-22 Union Camp Corporation Radiation-curable aminoamide acrylate polymer
DE4015298A1 (de) * 1990-05-12 1991-11-14 Bayer Ag Mischungen aus polyamiden und speziellen phenolgruppenhaltigen polymerisaten
US5756260A (en) * 1993-02-16 1998-05-26 Sumitomo Bakelite Company Limited Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same
JP3389820B2 (ja) * 1996-06-17 2003-03-24 東レ株式会社 水なし平版印刷版原版
US6238449B1 (en) 1998-12-22 2001-05-29 3M Innovative Properties Company Abrasive article having an abrasive coating containing a siloxane polymer
WO2000037569A1 (en) * 1998-12-22 2000-06-29 3M Innovative Properties Company Acrylated oligomer/thermoplastic polyamide presize coatings for abrasive article backings
US6312484B1 (en) 1998-12-22 2001-11-06 3M Innovative Properties Company Nonwoven abrasive articles and method of preparing same
US6239049B1 (en) 1998-12-22 2001-05-29 3M Innovative Properties Company Aminoplast resin/thermoplastic polyamide presize coatings for abrasive article backings
US6743273B2 (en) * 2000-09-05 2004-06-01 Donaldson Company, Inc. Polymer, polymer microfiber, polymer nanofiber and applications including filter structures
WO2005105443A1 (ja) * 2004-04-28 2005-11-10 Mitsubishi Heavy Industries Ltd. 製版装置及び再生式刷版の管理方法並びに中間スリーブ
US20100175555A1 (en) * 2008-09-12 2010-07-15 Ismael Ferrer Polyamide Fine Fibers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7003304A (de) * 1969-03-11 1970-09-15
GB1241622A (en) * 1969-03-20 1971-08-04 Ppg Industries Inc Highly radiation-sensitive amides
DD109884A1 (de) * 1973-07-10 1974-11-20
DE2361041C3 (de) * 1973-12-07 1980-08-14 Hoechst Ag, 6000 Frankfurt Photopolymerisierbares Gemisch
JPS5823616B2 (ja) * 1976-11-08 1983-05-16 東レ株式会社 感光性ポリマ組成物
JPS53141026A (en) * 1977-05-14 1978-12-08 Toyo Boseki Sensitive resin composite forming relief
JPS5820420B2 (ja) * 1978-12-15 1983-04-22 富士通株式会社 パタ−ン形成方法
US4230790A (en) * 1979-01-31 1980-10-28 E. I. Du Pont De Nemours And Company Photopolymerizable compositions useful in dry film photoresist

Also Published As

Publication number Publication date
JPS6337369B2 (de) 1988-07-25
JPS56129212A (en) 1981-10-09
EP0036301B1 (de) 1984-05-30
US4481280A (en) 1984-11-06
EP0036301A1 (de) 1981-09-23

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Legal Events

Date Code Title Description
8365 Fully valid after opposition proceedings