DE2708945A1 - Circuit board conducting paths embedded in insulating board - is manufactured by specified sequence of coating and etching processes - Google Patents

Circuit board conducting paths embedded in insulating board - is manufactured by specified sequence of coating and etching processes

Info

Publication number
DE2708945A1
DE2708945A1 DE19772708945 DE2708945A DE2708945A1 DE 2708945 A1 DE2708945 A1 DE 2708945A1 DE 19772708945 DE19772708945 DE 19772708945 DE 2708945 A DE2708945 A DE 2708945A DE 2708945 A1 DE2708945 A1 DE 2708945A1
Authority
DE
Germany
Prior art keywords
holes
board
insulating
conductor tracks
electroplated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19772708945
Other languages
German (de)
Inventor
Gerhard Geiger
Werner Plappert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bach and Co GmbH
Original Assignee
Bach and Co GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bach and Co GmbH filed Critical Bach and Co GmbH
Priority to DE19772708945 priority Critical patent/DE2708945A1/en
Publication of DE2708945A1 publication Critical patent/DE2708945A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Abstract

The circuit board has its conducting paths embedded in its insulating board and is made in the following stages: The circuit layout is formed on the pre-printed board by etching away its metal coating and applying a protective metal layer that resists etching to the conductors. The conductors are then pressed into the board. holes are bored and plated and a conducting layer applied by chemical deposition to the whole of the board surface and the walls of the holes. The surface is then printed with a resistive lacquer and the walls of the holes are strengthened by electrodeposition. The lacquer is then washed off and the conducting layer is etched.

Description

Leitervlatte und Verfahren zw deren Herstellung Conductor sheet and process for making it

Die Erfindung bezieht sich auf ein Verfahren zur Herstellung von Gedruckten Schaltungen, bei denen auf einer Isolierstoffträger metallische Leiter aufgebracht sind, wobei die Leiterbahnen in den Isolierstoffträger eingebettet und die Vorder- und Rückseiten mittels durchsetallisierter Löcher elektrisch leitend verbunden sind.The invention relates to a method for producing printed matter Circuits in which metallic conductors are applied to an insulating material are, with the conductor tracks embedded in the insulating substrate and the front and rear sides are connected in an electrically conductive manner by means of penetrated holes.

Durch die zunehmende Miniaturisierung nimmt der Bedarf an zweiseitigen, durchkontaktierten Gedruckten Schaltungen immer mehr zu.Due to the increasing miniaturization, the need for two-sided, plated-through printed circuits are increasing.

Häufig befinden sich jedoch auf solchen Gedruckten Schaltungen Kontaktflächen für Kontaktschieber oder Drehschalter. Bei erhabenen Leiterzügen tritt ein starker Verschleiß an den Kontaktelementen auf, oder es kommt zu Störungen durch Hängenbleiben der Kontaktelemente.Frequently, however, there are contact areas on such printed circuits for contact slide or rotary switch. With raised ladder lines a strong one occurs Wear on the contact elements, or it comes to disturbances by getting stuck of the contact elements.

Diese Fehler können auf ein Minium reduziert werden, wenn die Leiterbahnen und die Kontaktflächen tiefgelegt, d.h. bis zum Isolierstoffträger eingeebnet sind, sodaß keine Höhenunterschiede mehr bestehen.These errors can be reduced to a minimum if the conductor tracks and the contact surfaces are lowered, i.e. leveled up to the insulating material carrier, so that there are no more height differences.

Es gehört bereits zum Stand der Technik, Kontaktflächen und Leiterbahnen durch verschiedene Verfahren in den Isolierstoffträger einzubetten. So gibt es ein Verfahren, bei dem das Harz des Isolierstoffträgers nur halb ausgehärtet ist und nach dem Ätzen der Leiterbahnen nochmals einer Wärme- und Druckbehandlung unterzogen wird. Bei dieser Behandlung werden die Leiterzüge in die Isoliermasse eingedrückt und das Harz härtet gleichzeitig aus.It is already part of the state of the art, contact areas and conductor tracks embedded in the insulating material carrier using various methods. So there is a Process in which the resin of the insulating material carrier is only half cured and after the conductor tracks have been etched, subjected to a further heat and pressure treatment will. During this treatment, the conductor tracks are pressed into the insulating compound and the resin hardens at the same time.

Bei einem weiteren Verfahren werden die Leiterbahnen in ausgehärtetes Basismaterial eingepreßt. Dazu sind allerdings hohe Drücke und Temperaturen notwendig, damit der Federeffekt des Schichtpreßstoffes überwunden wird.In another process, the conductor tracks are cured in Base material pressed in. However, this requires high pressures and temperatures, so that the spring effect of the laminate is overcome.

Bei diesen bekannten Verfahren werden zunächst die Löcher in die metallkaschierte Isolierstoffplatte gebohrt. Nach dem Katalysieren der Oberfläche und der Lochwandungen werden diese meta'lisiert. Das Leiterbild wird durch einen Negativdruck mit galvanifester Farbe hergestellt und die Leiter und die Lochwandungen galvanisch verstärkt und mit einem Atzschutzmetall versehen. Nun wird die galvanikfeste Farbe abgewaschen und das Leiterbild herausgeätzt.In these known methods, the holes are first made in the metal-clad Drilled insulating material plate. After catalyzing the surface and the hole walls these are metallicized. The conductive pattern is made more resistant by negative printing with galvanic Color made and the conductors and the perforated walls galvanically reinforced and provided with a protective metal. Now the galvanic-proof paint is washed off and etched out the conductor pattern.

Nach diesen bislang bekannten Verfahren ist es aber nicht möglich, Leiterplatten mit eingeebneten Leiterzügen und durchmetallisierten Bohrungen und Durchbrüchen herzustellen, da bei Anwendung von Druck die in den Bohrungen und Durchbrüchen aufgebrachte metallische, hülsenartige Durchverbindung zusammengedrückt wird und dabei springt, so daß es zu Unterbrechungen in der Strom führung kommt.However, according to these previously known methods, it is not possible Printed circuit boards with leveled conductor tracks and plated through holes and Produce breakthroughs, since when pressure is applied, those in the bores and breakthroughs applied metallic, sleeve-like through connection is compressed and it jumps, so that there is an interruption in the current management.

Aufgabe der erfindung ist es, ein Verfahren zu finden, das es ermöglicht, eingeebhete Leiterplatten mit durchkontaktierten Bohrungen herzustellen, und das die oben aufgeführten Nachteile nicht aufweist.The task of the invention is to find a method that makes it possible to to produce embedded printed circuit boards with plated-through holes, and that does not have the disadvantages listed above.

Diese Aufgabe wird bei dem erfindungsgemäßen Verfahren durch folgende, teilweise einzeln für sich bekannte Verfahrensschritte, gelöst: 1. Subtraktive Herstellung des Leiterbildes durch Abätzen der Metallkaschierung positiv bedruckter Isolierstoffträger und Aufbringen eines Xtzschutzmetalles auf die Leiterbahnen.This object is achieved in the method according to the invention by the following, Process steps, some of which are known individually, solved: 1. Subtractive production of the conductor pattern by etching away the metal lamination of positively printed insulating material and applying an Xtz protection metal to the conductor tracks.

2. Sinpressen der Leiterbahnen in die Isolierstoffplatte.2. Pressing the conductor tracks into the insulating plate.

3. Bohren der Löcher, die plattiert werden sollen, und Aufbringen einer Leitschicht durch chemische Metallisierung der gesamten Plattenoberfläche und der Lochwandungen.3. Drill the holes to be plated and apply a conductive layer through chemical metallization of the entire plate surface and the hole walls.

4. Bedrucken der Plattenoberfläche mit galvanofestem Lack, galvanische Verstärkung der Lochwandungen und gegebenenfalls der Lötaugen und Aufbringen eines Utzschutzmetalles.4. Printing of the plate surface with electroplated varnish, electroplated Reinforcement of the hole walls and possibly the soldering eyes and application of one Utzschutzmetalles.

5. Abwaschen des Salvanofesten Lackes und Abätzen der Leitschicht.5. Wash off the galvanic-resistant paint and etch off the conductive layer.

Durch die besondere und für das Verfahren kennzeichnende Verfahrensfolge wird erreicht, daß die hülsenartige metallische Leitschicht der durchplattierten Bohrungen keiner mechanischen Beanspruchung ausgesetzt wird, sodaß die hohe Kontaktsicherheit auch bei Leiterplatten mit eingepreßten Leiterzügen erhalten bleibt.Due to the special procedural sequence that is characteristic of the procedure it is achieved that the sleeve-like metallic conductive layer of the plated through Bores is not exposed to mechanical stress, so that the high contact security is retained even in the case of printed circuit boards with pressed-in conductor tracks.

Claims (5)

Patentanspruch Verfahren zur Herstellung von Gedruckten Schaltungen, bei denen auf einem Isolierstoffträger metallische Leiter aufgebracht sind, wobei die Leiterbahnen in den Isolierstoffträger eingebettet und die Vorder- und Rückseiten mittels durohietallisierter Löcher elektrisch leitend verbunden sind, durch folgende, teilweise einzeln für sich bekannte Verfahrens-Schritte gekennzeichnet: 1. Subtraktive Herltellung des Leiterbildes durch Abätzen der Metallkaschierung positiv bedruckter Isolierstoffträger und Aufringen eines Ätzschutzmetalles auf die Leiterbahnen. Claim method for the production of printed circuits, in which metallic conductors are applied to an insulating carrier, with the conductor tracks embedded in the insulating material carrier and the front and back sides are electrically conductively connected by means of durohietallized holes, through the following, partially individually known process steps: 1. Subtractive Production of the conductor pattern by etching off the metal lamination with positive printing Insulating material carrier and application of an anti-etching metal to the conductor tracks. 2. Einpressen der Leiterbahnen in die Isolierstoffplatte 2. Pressing the conductor tracks into the insulating plate 3. Bohren der Löcher, die plattiert werden sollen, und Aufbringen einer Leitschicht durch cheiische Metallisierung der gesamten Plattenoberfläche und der Lochwandungen.3. Drilling of the holes to be plated and applying a conductive layer through Mechanical metallization of the entire plate surface and the hole walls. 4. Bedrucken der Plattenoberfläche mit galvanofestem Lack, galvanische Verstärkung der Lochwandungen und gegebenenfalls der Lötaugen und Aufbringen eines Ätzschutzmetalles.4. Printing of the plate surface with electroplated varnish, electroplated Reinforcement of the hole walls and possibly the soldering eyes and application of one Anti-corrosive metal. 5. Abwaschen des galvanofesten Lackes und Abätzen der Leitschicht.5. Wash off the electroplated paint and etch off the conductive layer.
DE19772708945 1977-03-02 1977-03-02 Circuit board conducting paths embedded in insulating board - is manufactured by specified sequence of coating and etching processes Withdrawn DE2708945A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772708945 DE2708945A1 (en) 1977-03-02 1977-03-02 Circuit board conducting paths embedded in insulating board - is manufactured by specified sequence of coating and etching processes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772708945 DE2708945A1 (en) 1977-03-02 1977-03-02 Circuit board conducting paths embedded in insulating board - is manufactured by specified sequence of coating and etching processes

Publications (1)

Publication Number Publication Date
DE2708945A1 true DE2708945A1 (en) 1978-09-07

Family

ID=6002531

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772708945 Withdrawn DE2708945A1 (en) 1977-03-02 1977-03-02 Circuit board conducting paths embedded in insulating board - is manufactured by specified sequence of coating and etching processes

Country Status (1)

Country Link
DE (1) DE2708945A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0062300A2 (en) * 1981-04-06 1982-10-13 FRITZ WITTIG Herstellung gedruckter Schaltungen Process for making a circuit board
EP0127689A1 (en) * 1983-05-19 1984-12-12 Ibm Deutschland Gmbh Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
DE19904928A1 (en) * 1999-02-06 2000-08-31 Cubit Electronics Gmbh Transponder manufacturing method involves flattening by exerting pressure on transponder surfaces and/or protruding structures in direction normal to surface at temp. below softening point
US7947207B2 (en) 2005-04-12 2011-05-24 Abbott Cardiovascular Systems Inc. Method for retaining a vascular stent on a catheter

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0062300A2 (en) * 1981-04-06 1982-10-13 FRITZ WITTIG Herstellung gedruckter Schaltungen Process for making a circuit board
EP0062300A3 (en) * 1981-04-06 1984-04-11 FRITZ WITTIG Herstellung gedruckter Schaltungen Process for making a circuit board
EP0127689A1 (en) * 1983-05-19 1984-12-12 Ibm Deutschland Gmbh Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
DE19904928A1 (en) * 1999-02-06 2000-08-31 Cubit Electronics Gmbh Transponder manufacturing method involves flattening by exerting pressure on transponder surfaces and/or protruding structures in direction normal to surface at temp. below softening point
DE19904928B4 (en) * 1999-02-06 2006-10-26 Sokymat Gmbh Method for producing transponders of small thickness
US7947207B2 (en) 2005-04-12 2011-05-24 Abbott Cardiovascular Systems Inc. Method for retaining a vascular stent on a catheter
US8221112B2 (en) 2005-04-12 2012-07-17 Abbott Cardiovascular Systems, Inc. Method for retaining a vascular stent on a catheter

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