DE2653833C2 - - Google Patents

Info

Publication number: DE2653833C2
Authority: DE; Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

DE2653833A

Other versions

DE2653833A1 (de

Inventor

Masayoshi Tokio Jp Yoshimura

Keizo Higashiyamato Jp Otsuki

Senji Tokorozawa Jp Shoji

Tomio Shimizu Ichio Jp Yamada

Arai Yuji Kokubunji Jp Kodaira

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hitachi Ltd

Original Assignee

Hitachi Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-11-29

Filing date

1976-11-26

Publication date

1982-10-21

1976-11-26 Application filed by Hitachi Ltd filed Critical Hitachi Ltd

1977-06-08 Publication of DE2653833A1 publication Critical patent/DE2653833A1/de

1982-10-21 Application granted granted Critical

1982-10-21 Publication of DE2653833C2 publication Critical patent/DE2653833C2/de

Status Granted legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

DE19762653833 1975-11-29 1976-11-26 Halbleitervorrichtung Granted DE2653833A1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP50142794A JPS5266376A (en)	1975-11-29	1975-11-29	Device and manufacture of resin body type semiconductor

Publications (2)

Publication Number	Publication Date
DE2653833A1 DE2653833A1 (de)	1977-06-08
DE2653833C2 true DE2653833C2 (de)	1982-10-21

Family

ID=15323757

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE19762653833 Granted DE2653833A1 (de)	1975-11-29	1976-11-26	Halbleitervorrichtung

Country Status (3)

Country	Link
US (1)	US4095253A (de)
JP (1)	JPS5266376A (de)
DE (1)	DE2653833A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
IT7821073V0 (it) *	1978-03-09	1978-03-09	Ates Componenti Elettron	Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.
US4370615A (en) *	1980-10-14	1983-01-25	The Perkin-Elmer Corporation	High speed temperature controlled electrometer
GB2088128B (en) *	1980-11-25	1984-11-28	Staver Thermal Products Uk Ltd	Heatsink for integrated circuit device
JPS58209147A (ja) *	1982-05-31	1983-12-06	Toshiba Corp	樹脂封止型半導体装置
US4654472A (en) *	1984-12-17	1987-03-31	Samuel Goldfarb	Electronic component package with multiconductive base forms for multichannel mounting
US4720771A (en) *	1985-07-05	1988-01-19	Chrysler Motors Corporation	Heat sink assembly for a circuit board mounted integrated circuit
US4730666A (en) *	1986-04-30	1988-03-15	International Business Machines Corporation	Flexible finned heat exchanger
US4961107A (en) *	1989-04-03	1990-10-02	Motorola Inc.	Electrically isolated heatsink for single-in-line package
IT1235830B (it) *	1989-07-11	1992-11-03	Sgs Thomson Microelectronics	Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore
IT1239644B (it) *	1990-02-22	1993-11-11	Sgs Thomson Microelectronics	Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
USRE37707E1 (en)	1990-02-22	2002-05-21	Stmicroelectronics S.R.L.	Leadframe with heat dissipator connected to S-shaped fingers
JPH0846104A (ja) *	1994-05-31	1996-02-16	Motorola Inc	表面実装電子素子およびその製造方法
KR0155843B1 (ko) *	1995-07-07	1998-12-01	이대원	반도체장치
US5771966A (en) *	1995-12-15	1998-06-30	Jacoby; John	Folded conducting member heatsinks and method of making same
US6048744A (en) *	1997-09-15	2000-04-11	Micron Technology, Inc.	Integrated circuit package alignment feature
US6398573B1 (en)	1998-03-31	2002-06-04	Micron Technology, Inc.	Locking assembly for securing semiconductor device to carrier substrate
US6071139A (en)	1998-03-31	2000-06-06	Micron Technology, Inc.	Locking assembly for securing semiconductor device to carrier substrate
US6751860B2 (en)	2000-02-22	2004-06-22	The Furukawa Electric Co., Ltd.	Method of making of electronic parts mounting board
US6991960B2 (en) *	2001-08-30	2006-01-31	Micron Technology, Inc.	Method of semiconductor device package alignment and method of testing
US20070126445A1 (en) *	2005-11-30	2007-06-07	Micron Technology, Inc.	Integrated circuit package testing devices and methods of making and using same
US8933555B2 (en) *	2009-05-15	2015-01-13	Infineon Technologies Ag	Semiconductor chip package
CN102299127B (zh) *	2011-07-13	2013-12-11	台达电子企业管理（上海）有限公司	用于封装元件的双向散热器及其组装方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2955242A (en) *	1956-11-27	1960-10-04	Raytheon Co	Hermetically sealed power transistors
JPS4827761B1 (de) *	1964-12-07	1973-08-25
FR1484389A (fr) *	1965-06-28	1967-06-09	Texas Instruments Inc	Monture pour élément électronique, notamment pour semi-conducteur
GB1186890A (en) *	1966-07-13	1970-04-08	Motorola Inc	Semiconductor Device
US3606673A (en) *	1968-08-15	1971-09-21	Texas Instruments Inc	Plastic encapsulated semiconductor devices
US3548927A (en) *	1968-11-29	1970-12-22	Intern Electronic Research Co	Heat dissipating retainer for electronic component
US3694703A (en) *	1970-09-02	1972-09-26	Staver Co Inc The	Heat dissipator for encased semiconductor device having heat tab extending therefrom
JPS4720455U (de) *	1971-01-26	1972-11-08
GB1334173A (en) *	1971-06-02	1973-10-17	Redpoint Ltd	Twisted vane heat sink
DE2165649A1 (de) *	1971-12-30	1973-07-12	Staver Co	Kuehlkoerper
JPS4911794A (de) *	1972-04-28	1974-02-01
JPS529654B2 (de) *	1972-06-02	1977-03-17
US3786317A (en) *	1972-11-09	1974-01-15	Bell Telephone Labor Inc	Microelectronic circuit package
JPS49128679A (de) *	1973-04-09	1974-12-10
US3893161A (en) *	1974-02-04	1975-07-01	Jr Albert Pesak	Frictionally engageable heat sink for solid state devices

1975
- 1975-11-29 JP JP50142794A patent/JPS5266376A/ja active Pending
1976
- 1976-11-23 US US05/744,397 patent/US4095253A/en not_active Expired - Lifetime
- 1976-11-26 DE DE19762653833 patent/DE2653833A1/de active Granted

Also Published As

Publication number	Publication date
JPS5266376A (en)	1977-06-01
US4095253A (en)	1978-06-13
DE2653833A1 (de)	1977-06-08

Legal Events

Date	Code	Title	Description
1982-10-21	D2	Grant after examination
1983-02-10	8328	Change in the person/name/address of the agent	Free format text: VON FUENER, A., DIPL.-CHEM. DR.RER.NAT. EBBINGHAUS, D., DIPL.-ING., PAT.-ANW., 8000 MUENCHEN
1988-11-17	8339	Ceased/non-payment of the annual fee

Publication	Publication Date	Title
DE2653833C2 (de)	1982-10-21
FI762258A (de)	1977-02-16
JPS5180938A (de)	1976-07-15
JPS5431202Y2 (de)	1979-09-29
JPS5233162U (de)	1977-03-08
JPS51163240U (de)	1976-12-25
JPS5530897Y2 (de)	1980-07-23
JPS5514575Y2 (de)	1980-04-03
JPS5332736B2 (de)	1978-09-09
JPS525407U (de)	1977-01-14
JPS5194451U (de)	1976-07-29
JPS51163267U (de)	1976-12-25
JPS5218578U (de)	1977-02-09
CH602181A5 (de)	1978-07-31
CH599878A5 (de)	1978-05-31
CH607966A5 (de)	1978-12-15
CH607814A5 (de)	1978-11-15
CH607797A5 (de)	1978-10-31
CH605930A5 (de)	1978-10-13
CH605290A5 (de)	1978-09-29
CH604367A5 (de)	1978-09-15
CH603888B5 (de)	1978-08-31
CH602537A5 (de)	1978-07-31
CH602398A5 (de)	1978-07-31
CH597193A5 (de)	1978-03-31