DE20008346U1 - Electrical arrangement with several electrical components - Google Patents

Electrical arrangement with several electrical components

Info

Publication number
DE20008346U1
DE20008346U1 DE20008346U DE20008346U DE20008346U1 DE 20008346 U1 DE20008346 U1 DE 20008346U1 DE 20008346 U DE20008346 U DE 20008346U DE 20008346 U DE20008346 U DE 20008346U DE 20008346 U1 DE20008346 U1 DE 20008346U1
Authority
DE
Germany
Prior art keywords
electrical
arrangement according
carrier
electrical arrangement
contact plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20008346U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidler GmbH and Co
Original Assignee
Sidler GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sidler GmbH and Co filed Critical Sidler GmbH and Co
Priority to DE20008346U priority Critical patent/DE20008346U1/en
Publication of DE20008346U1 publication Critical patent/DE20008346U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (11)

1. Elektrische Anordnung (1) mit mindestens zwei vonein­ ander beabstandet gehaltenen Kontaktplatten (3, 5) und mit mehreren mit den Kontaktplatten (3, 5) elektrisch leitend verbundenen elektrischen Bauteilen, insbeson­ dere LEDs, dadurch gekennzeichnet, daß die Kontaktplatten (3, 5) durch einen elektrisch isolierenden Träger (6) voneinander beabstandet gehal­ ten sind.1. Electrical arrangement ( 1 ) with at least two mutually spaced contact plates ( 3 , 5 ) and with several with the contact plates ( 3 , 5 ) electrically conductively connected electrical components, in particular LEDs, characterized in that the contact plates ( 3 , 5 ) are held at a distance from one another by an electrically insulating carrier ( 6 ). 2. Elektrische Anordnung nach Anspruch 1, dadurch gekenn­ zeichnet, daß der Träger (6) auf der Ober- und/oder auf der Unterseite der Kontaktplatten (3, 5) vorgese­ hen ist.2. Electrical arrangement according to claim 1, characterized in that the carrier ( 6 ) on the top and / or on the underside of the contact plates ( 3 , 5 ) is vorgese hen. 3. Elektrische Anordnung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Träger (6) durch Umspritzen der Kontaktplatten (3, 5) mit Kunststoff hergestellt ist.3. Electrical arrangement according to claim 1 or 2, characterized in that the carrier ( 6 ) by injection molding the contact plates ( 3 , 5 ) is made with plastic. 4. Elektrische Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der Träger (6) einen Gehäuseteil der elektrischen Anordnung (1) und/ oder ein Gehäuse für Anschlußkontakte der Kontaktplat­ ten (3, 5) bildet.4. Electrical arrangement according to one of the preceding claims, characterized in that the carrier ( 6 ) forms a housing part of the electrical arrangement ( 1 ) and / or a housing for connecting contacts of the Kontaktplat th ( 3 , 5 ). 5. Elektrische Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die elektri­ schen Bauteile jeweils nur an einer der Kontaktplatten (3) befestigt sind. 5. Electrical arrangement according to one of the preceding claims, characterized in that the electrical rule's components are each attached to only one of the contact plates ( 3 ). 6. Elektrische Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die elektri­ schen Bauteile von dem Träger (6) zumindest teilweise abgedeckt sind.6. Electrical arrangement according to one of the preceding claims, characterized in that the electrical components of the carrier ( 6 ) are at least partially covered. 7. Elektrische Anordnung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß auf den Kontaktplatten (3, 5) jeweils trägerfreie Aufnahmebereiche (8) für die elektrischen Bauteile vorgesehen sind.7. Electrical arrangement according to one of claims 1 to 5, characterized in that on the contact plates ( 3 , 5 ) each carrier-free receiving areas ( 8 ) are provided for the electrical components. 8. Elektrische Anordnung nach Anspruch 7, dadurch gekenn­ zeichnet, daß jedes elektrische Bauteil elektrisch leitend an der einen Kontaktplatte (3) befestigt und mittels eines Drahts (4) mit der anderen Kontaktplatte (5) elektrisch leitend verbunden ist.8. Electrical arrangement according to claim 7, characterized in that each electrical component is electrically conductively attached to one contact plate ( 3 ) and by means of a wire ( 4 ) with the other contact plate ( 5 ) is electrically conductively connected. 9. Elektrische Anordnung nach Anspruch 7 oder 8, dadurch gekennzeichnet, daß die elektrischen Bauteile jeweils ein LED-Chip (2) sind.9. Electrical arrangement according to claim 7 or 8, characterized in that the electrical components are each an LED chip ( 2 ). 10. Elektrische Anordnung nach einem der Ansprüche 7 bis 9, dadurch gekennzeichnet, daß der Träger (6) um jeden trägerfreien Aufnahmebereich (8) jeweils einen Reflek­ torabschnitt (10) für die als Lichtquelle ausgebilde­ ten elektrischen Bauteile bildet.10. Electrical arrangement according to one of claims 7 to 9, characterized in that the carrier ( 6 ) around each carrier-free receiving area ( 8 ) forms a reflector gate section ( 10 ) for the trained as a light source th electrical components. 11. Elektrische Anordnung nach einem der Ansprüche 7 bis 10, dadurch gekennzeichnet, daß die elektrischen Bau­ teile in dem trägerfreien Aufnahmebereich (8) jeweils von einer separaten Schutzschicht (11) abgedeckt sind.11. Electrical arrangement according to one of claims 7 to 10, characterized in that the electrical construction parts in the carrier-free receiving area ( 8 ) are each covered by a separate protective layer ( 11 ).
DE20008346U 2000-05-09 2000-05-09 Electrical arrangement with several electrical components Expired - Lifetime DE20008346U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20008346U DE20008346U1 (en) 2000-05-09 2000-05-09 Electrical arrangement with several electrical components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20008346U DE20008346U1 (en) 2000-05-09 2000-05-09 Electrical arrangement with several electrical components

Publications (1)

Publication Number Publication Date
DE20008346U1 true DE20008346U1 (en) 2001-09-20

Family

ID=7941270

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20008346U Expired - Lifetime DE20008346U1 (en) 2000-05-09 2000-05-09 Electrical arrangement with several electrical components

Country Status (1)

Country Link
DE (1) DE20008346U1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004006629A2 (en) * 2002-07-04 2004-01-15 Tridonic Optoelectronics Gmbh Power supply unit for light-emitting diodes
DE102004053089A1 (en) * 2004-11-03 2006-05-04 Sidler Gmbh & Co. Kg Motor vehicle light
EP1945012A1 (en) 2007-01-10 2008-07-16 TridonicAtco Optoelectronics GMBH LED module with gold bonding
EP1881743A3 (en) * 2006-07-10 2010-04-28 Toshiba Lighting & Technology Corporation Lighting apparatus
US7708447B2 (en) 2002-07-04 2010-05-04 Tridonic Optoelectronics Gmbh Current supply for luminescent diodes
DE102019009034A1 (en) * 2019-12-31 2021-07-01 Marquardt Gmbh Light band
WO2022199876A1 (en) 2021-03-24 2022-09-29 Marquardt Gmbh Optimized lead frame assembly

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8063575B2 (en) 2002-07-04 2011-11-22 Tridonic Jennersdorf Gmbh Current supply for luminescent diodes
WO2004006629A3 (en) * 2002-07-04 2004-03-25 Tridonic Optoelectronics Gmbh Power supply unit for light-emitting diodes
US8698415B2 (en) 2002-07-04 2014-04-15 Tridonic Jennersdorf Gmbh Current supply for luminescent diodes
US8207689B2 (en) 2002-07-04 2012-06-26 Tridonic Ag Current supply for luminescent diodes
EP2001269A1 (en) * 2002-07-04 2008-12-10 Ledon Lighting Jennersdorf GmbH Electricity supply for luminescence diodes
WO2004006629A2 (en) * 2002-07-04 2004-01-15 Tridonic Optoelectronics Gmbh Power supply unit for light-emitting diodes
US7708447B2 (en) 2002-07-04 2010-05-04 Tridonic Optoelectronics Gmbh Current supply for luminescent diodes
DE102004053089A1 (en) * 2004-11-03 2006-05-04 Sidler Gmbh & Co. Kg Motor vehicle light
EP1881743A3 (en) * 2006-07-10 2010-04-28 Toshiba Lighting & Technology Corporation Lighting apparatus
WO2008083794A1 (en) * 2007-01-10 2008-07-17 Ledon Lighting Jennersdorf Gmbh Led module with gold bonding
EP1945012A1 (en) 2007-01-10 2008-07-16 TridonicAtco Optoelectronics GMBH LED module with gold bonding
DE102019009034A1 (en) * 2019-12-31 2021-07-01 Marquardt Gmbh Light band
WO2022199876A1 (en) 2021-03-24 2022-09-29 Marquardt Gmbh Optimized lead frame assembly
DE102021107369A1 (en) 2021-03-24 2022-09-29 Marquardt Gmbh Optimized punched grid arrangement

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20011025

R150 Term of protection extended to 6 years

Effective date: 20030702

R151 Term of protection extended to 8 years

Effective date: 20060621

R158 Lapse of ip right after 8 years

Effective date: 20081202