DE19983939T1 - Laserstrahlmaschine - Google Patents

Laserstrahlmaschine

Info

Publication number
DE19983939T1
DE19983939T1 DE19983939T DE19983939T DE19983939T1 DE 19983939 T1 DE19983939 T1 DE 19983939T1 DE 19983939 T DE19983939 T DE 19983939T DE 19983939 T DE19983939 T DE 19983939T DE 19983939 T1 DE19983939 T1 DE 19983939T1
Authority
DE
Germany
Prior art keywords
laser beam
beam machine
machine
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19983939T
Other languages
English (en)
Other versions
DE19983939B4 (de
Inventor
Tatsuki Okawa
Yasuhiko Iwai
Miki Kurosawa
Masanori Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE19983939T1 publication Critical patent/DE19983939T1/de
Application granted granted Critical
Publication of DE19983939B4 publication Critical patent/DE19983939B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE19983939T 1999-03-05 1999-03-05 Laserstrahlmaschine Expired - Fee Related DE19983939B4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/001089 WO2000053365A1 (fr) 1999-03-05 1999-03-05 Appareil d'usinage au laser

Publications (2)

Publication Number Publication Date
DE19983939T1 true DE19983939T1 (de) 2002-04-11
DE19983939B4 DE19983939B4 (de) 2005-02-17

Family

ID=14235119

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983939T Expired - Fee Related DE19983939B4 (de) 1999-03-05 1999-03-05 Laserstrahlmaschine

Country Status (5)

Country Link
US (1) US6635849B1 (de)
JP (1) JP4218209B2 (de)
DE (1) DE19983939B4 (de)
TW (1) TW436358B (de)
WO (1) WO2000053365A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1441874A1 (de) 2001-10-09 2004-08-04 Chromalloy Gas Turbine Corporation Verfahren zur entfernung von überzugsmaterial aus einem kühlloch eines turbomotorbauteils

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI223581B (en) 1999-04-02 2004-11-01 Murata Manufacturing Co Method for machining ceramic green sheet and apparatus for machining the same
TW552645B (en) 2001-08-03 2003-09-11 Semiconductor Energy Lab Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device
JP4397571B2 (ja) 2001-09-25 2010-01-13 株式会社半導体エネルギー研究所 レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法
TW555612B (en) 2001-11-15 2003-10-01 Mitsubishi Electric Corp Laser machining apparatus
JP3925169B2 (ja) * 2001-11-26 2007-06-06 株式会社デンソー レーザー光による材料の同時一括溶融方法及び装置
DE10296639B4 (de) * 2002-03-28 2007-06-21 Mitsubishi Denki K.K. Laserbearbeitungsgerät
JP3775410B2 (ja) * 2003-02-03 2006-05-17 セイコーエプソン株式会社 レーザー加工方法、レーザー溶接方法並びにレーザー加工装置
JP4662411B2 (ja) 2003-03-14 2011-03-30 日立ビアメカニクス株式会社 レーザ加工装置
TWI275439B (en) * 2003-05-19 2007-03-11 Mitsubishi Electric Corp Laser processing apparatus
US6947454B2 (en) * 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
JP2005144487A (ja) * 2003-11-13 2005-06-09 Seiko Epson Corp レーザ加工装置及びレーザ加工方法
EP1550528A1 (de) * 2003-12-30 2005-07-06 Advanced Laser Separation International (ALSI) B.V. Verfahren, Vorrichtung und Beugungsgitter zum Trennen eines auf einem Substrat hergestellten Halbleiterelementes durch Veränderung dieses Beugungsgitters
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
KR100514996B1 (ko) 2004-04-19 2005-09-15 주식회사 이오테크닉스 레이저 가공 장치
JP2005342748A (ja) * 2004-06-01 2005-12-15 Hitachi Via Mechanics Ltd レーザ加工機
US7244907B2 (en) * 2004-06-30 2007-07-17 Matsushita Electric Industrial Co., Ltd. Method of optimizing optical power use in a parallel processing laser system
US20060086898A1 (en) * 2004-10-26 2006-04-27 Matsushita Electric Industrial Co., Ltd. Method and apparatus of making highly repetitive micro-pattern using laser writer
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
CN100523976C (zh) * 2005-06-17 2009-08-05 同济大学 一种全固态电致变色器件及其制备方法
JP4664852B2 (ja) * 2006-03-31 2011-04-06 三菱電機株式会社 レーザ加工装置
JP4667329B2 (ja) * 2006-08-30 2011-04-13 三菱電機株式会社 レーザ加工装置
JP4667400B2 (ja) * 2007-01-16 2011-04-13 三菱電機株式会社 Ｄｏｅ調整方法およびレーザ加工装置
WO2009066370A1 (ja) * 2007-11-20 2009-05-28 Mitsubishi Electric Corporation レーザ発振器内出射ミラーの劣化状態測定方法およびレーザ加工装置
DE102008032751B3 (de) * 2008-07-11 2009-12-10 Innolas Systems Gmbh Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren mit Doppel- oder Mehrfachspot mittels eines Galvanoscanners
US8388609B2 (en) * 2008-12-01 2013-03-05 Amo Development, Llc. System and method for multibeam scanning
AU2015201408B2 (en) * 2008-12-01 2017-04-13 Amo Development, Llc System and method for laser photoaltering a material using multi-beam scanning
WO2010070940A1 (ja) 2008-12-17 2010-06-24 三菱電機株式会社 レーザ加工装置、レーザ加工方法、および光起電力装置の製造方法
JP5300544B2 (ja) * 2009-03-17 2013-09-25 株式会社ディスコ 光学系及びレーザ加工装置
JP5667347B2 (ja) * 2009-06-30 2015-02-12 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板加工装置
WO2011116968A2 (en) * 2010-03-24 2011-09-29 Laser Zentrum Hannover E.V. System and method for laser-beam based processing
DE202010013161U1 (de) * 2010-07-08 2011-03-31 Oerlikon Solar Ag, Trübbach Laserbearbeitung mit mehreren Strahlen und dafür geeigneter Laseroptikkopf
JP5511644B2 (ja) * 2010-12-07 2014-06-04 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP6035096B2 (ja) * 2012-09-27 2016-11-30 三星ダイヤモンド工業株式会社 レーザ加工装置
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
TWI561327B (en) * 2013-10-16 2016-12-11 Asm Tech Singapore Pte Ltd Laser scribing apparatus comprising adjustable spatial filter and method for etching semiconductor substrate
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
CN106687419A (zh) 2014-07-08 2017-05-17 康宁股份有限公司 用于激光处理材料的方法和设备
EP3536440A1 (de) 2014-07-14 2019-09-11 Corning Incorporated Glasartikel mit einem defektweg
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
EP3169477B1 (de) * 2014-07-14 2020-01-29 Corning Incorporated System und verfahren zur verarbeitung transparenter materialien mithilfe von in länge und durchmesser anpassbaren laserstrahlbrennlinien
KR101527482B1 (ko) * 2014-11-25 2015-06-10 유수영 레이저를 이용한 미세 부품 가공 장치
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
KR102546692B1 (ko) 2015-03-24 2023-06-22 코닝 인코포레이티드 디스플레이 유리 조성물의 레이저 절단 및 가공
JP2018516215A (ja) 2015-03-27 2018-06-21 コーニング インコーポレイテッド 気体透過性窓、および、その製造方法
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
CN109311725B (zh) 2016-05-06 2022-04-26 康宁股份有限公司 从透明基材激光切割及移除轮廓形状
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR101653524B1 (ko) * 2016-07-01 2016-09-01 이석준 레이저 3차원 가공 시스템
US11179802B2 (en) * 2016-07-14 2021-11-23 Mitsubishi Electric Corporation Laser machining head and laser machining apparatus
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
EP3848333A1 (de) 2016-10-24 2021-07-14 Corning Incorporated Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
JP6595558B2 (ja) * 2017-10-30 2019-10-23 ファナック株式会社 レーザ加工システム
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7073986B2 (ja) * 2018-08-29 2022-05-24 日本電信電話株式会社 レーザー加工装置
JP7295728B2 (ja) * 2019-07-11 2023-06-21 日本電信電話株式会社 レーザー光走査装置及びレーザー光走査方法
JP7303053B2 (ja) * 2019-07-17 2023-07-04 ファナック株式会社 調整補助具及びレーザ溶接装置
JP7412925B2 (ja) * 2019-08-26 2024-01-15 キヤノン株式会社 光学装置、および、物品の製造方法
US11305377B2 (en) * 2019-12-23 2022-04-19 Precitec Gmbh & Co. Kg Add-on module for interposing between a control device and a laser machining head of a laser machining system
US20210283719A1 (en) * 2020-03-12 2021-09-16 Rohr, Inc. Substrate perforation system & method using beamlets
US20220117209A1 (en) * 2020-10-16 2022-04-21 Verdant Robotics, Inc. Precision fluid delivery system
DE102020131405A1 (de) 2020-11-26 2022-06-02 LANG LASER - System GmbH Vorrichtung zur Materialbearbeitung mit Mehrfachapplikation

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770834B2 (ja) 1990-05-17 1995-07-31 富士機工電子株式会社 内層パターン部が露出したプリント基板、およびその製造方法
JPH0422190U (de) * 1990-06-07 1992-02-24
US5322999A (en) * 1992-10-13 1994-06-21 Merryman Jerry D Method and apparatus for precision control of galvanometer patterning system
US5521628A (en) * 1993-08-30 1996-05-28 Lumonics Corporation Laser system for simultaneously marking multiple parts
JPH07124778A (ja) 1993-10-29 1995-05-16 Japan Energy Corp レーザ加工装置
JP2682475B2 (ja) * 1994-11-17 1997-11-26 日本電気株式会社 ビームスキャン式レーザマーキング方法および装置
DE19511393B4 (de) * 1995-03-28 2005-08-25 Carl Baasel Lasertechnik Gmbh Gerät zur Substratbehandlung, insbesondere zum Perforieren von Papier
JPH091363A (ja) 1995-06-14 1997-01-07 Hitachi Ltd レーザマーカ
JP3738790B2 (ja) 1996-07-26 2006-01-25 セイコーエプソン株式会社 インクジェット記録ヘッドの構成部材の開口穿孔方法
JP3199653B2 (ja) * 1996-12-27 2001-08-20 イビデン株式会社 多層プリント配線板の製造装置及び製造方法
EP0884128B1 (de) 1996-11-20 2007-08-08 Ibiden Co., Ltd. Laserbearbeitungsvorrichtung, verfahren und vorrichtung zur herstellung einer mehrschichtigen, gedruckten leiterplatte
GB9811557D0 (en) * 1998-05-29 1998-07-29 Exitech Ltd The use of beam shaping for improving the performance of machines used to laser drill microvia holes in printed circuit (wiring) and other packages
JP3346374B2 (ja) * 1999-06-23 2002-11-18 住友電気工業株式会社 レーザ穴開け加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1441874A1 (de) 2001-10-09 2004-08-04 Chromalloy Gas Turbine Corporation Verfahren zur entfernung von überzugsmaterial aus einem kühlloch eines turbomotorbauteils

Also Published As

Publication number Publication date
JP4218209B2 (ja) 2009-02-04
DE19983939B4 (de) 2005-02-17
TW436358B (en) 2001-05-28
US6635849B1 (en) 2003-10-21
WO2000053365A1 (fr) 2000-09-14

Similar Documents

Publication Publication Date Title
DE19983939T1 (de) Laserstrahlmaschine
DE50007382D1 (de) Abschirmung gegen laserstrahlen
DE69908745D1 (de) Laserbearbeitungskopf
DE19782307T1 (de) Laserbearbeitungsgerät
DE69817099D1 (de) Laserdrucker
DE60029865D1 (de) Einmodiger Halbleiterlaser
DE60336956D1 (de) Laserstrahlmaschine
DE60020069D1 (de) Verstimmbare Laserquelle
DE69800626D1 (de) Laserstrahlbearbeitungsvorrichtung
DE60009615D1 (de) Laservorrichtung
DE60019257D1 (de) Oberflächenemittierender halbleiterlaser
DE50009759D1 (de) Durchstrahl-Laser-Schweisseinrichtung
DE50002091D1 (de) Festkörperlaser
FI980860A (fi) Aallonpituudeltaan säädettävä laserjärjestely
ATA150099A (de) Laserskalpell
DE60041742D1 (de) Halbleiterlaser
DE60017076D1 (de) Lasersystem
DE69924544D1 (de) Faserlaser
DE29801562U1 (de) Regaltraverse
NO20005271D0 (no) Optisk aktive tetrahydrobenzindol-derivater
DE60040636D1 (de) Lasermustergenerator
DE69928801D1 (de) Stabilisierte Laserquelle
DE50003181D1 (de) Verbundlenkerachse
DE69901967D1 (de) Laser-Nivelliersystem
DE60013934D1 (de) Laservorrichtung

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee