DE19838532B4 - Method and device for placing and remelting solder material fittings - Google Patents

Abstract

A method for placing a plurality of Lotmaterialformstücken on a plurality of pads having pad arrangement of a substrate and then remelting the Lotmaterialformstücke on the pads; marked by
the process steps:
- Arrangement of a template device (21, 40, 51, 56, 65, 75) having a plurality of template openings (27, 48, 61, 70) for receiving Lotmaterialformstücken (20) against a provided with a pad arrangement (29) substrate (23 , 49, 64), such that the solder material fittings are assigned to the individual connection surfaces (28, 50, 63),
Scanning the template openings (27, 48, 61, 70) with an optical scanning device (32) for detecting solder material fittings (20),
- And subsequent loading of the in the template openings (27, 48, 61, 70) received Lotmaterialformstücke (20) with a rearward to the template means (21, 40, 51, 56, 65, 75) arranged laser device (39), such that the Lotmaterialformstücke be applied through the template device through with laser energy.

Description

The The present invention relates to a method for placing a Plurality of solder material fittings on a plurality of pads having pad arrangement of a Substrate and to the subsequent Remelting the Lotmaterialformstücke on the pads. Furthermore relates to the present invention for carrying out this Method suitable device.

method of the type mentioned are, for example, the so-called "wafer Bumping ", at the Production of so-called "chip-size packages" or even in the Production of "Ball Grid Arrays "used. in principle it is in the aforementioned method to a variety of uniformly formed pad or contact metallizations in predetermined Establish distribution order on a substrate surface. To do this hitherto used methods in which either the placement or arrangement of solder material deposits on the pads in a single placement process and subsequent remelting by a separate loading of the solder material depots or Lotmaterialformstücke with Thermal energy, For example, laser energy takes place, or in which, for example in a mask application process, solder material deposits as a pasty material be applied and the subsequent remelting in one Oven for all soldering material deposits are carried out simultaneously.

A particular advantage of the former method, which, for example, in the DE 195 41 996 A1 is described, that by the occasional loading of the solder material depots or Lotmaterialformstücke with heat energy, in particular in the case of the use of laser energy, the lowest possible thermal stress for the substrate allows. On the other hand, this method also proves to be correspondingly lengthy in the implementation. With the second-mentioned method, large throughputs with correspondingly high quantities in production are possible, in particular due to the fast-running remelting process. However, with the implementation of such a method, in particular due to the high expenditure on equipment, high production costs associated. In addition, depending on the nature of the substrates thus treated, problems arise due to the high temperature load.

Another method for the arrangement of soldering material deposits on the pads is in the US 48 71 110 described. In this case, solder balls are recorded by means of a negative pressure by a hole template fixing and then placed on a pad assembly. The solder material deposits can then be remelted simultaneously in an oven as described above.

In the DE 195 11 392 A1 a method for the formation of solder bumps on surface areas of a substrate is described in which solder material is applied in paste form on a glass substrate, the glass substrate is then placed over the substrate and then melted the solder material in a certain area by means of laser radiation applied backward, so that forms a solder bump on the substrate.

From the DE 44 43 822 A1 a method for laser soldering of workpieces is known in which isolated Lotmaterialformstücke be positioned in template openings and then acted upon for connection to the workpieces with laser energy. The laser soldering device provided for laser application is equipped with an infrared detector.

Of the The present invention is based on the object, a method of the type mentioned above or one for carrying out such a method Propose suitable device, the or the placement and the subsequent remelting of a plurality of Lotmaterialformstücken on pads of a Substrate as possible economical and yet with one possible low thermal substrate stress allows.

These The object is achieved by a method having the features of the claim 1 or a device with the features of claim 9 or 14 solved.

at the method according to the invention takes place first the arrangement of a template device with a plurality of stencil apertures for receiving Lotmaterialformstücken over a provided with a pad arrangement Substrate, such that the Lotmaterialformstücke assigned to the individual pads then a scan of the template openings with an optical Scanning device for detecting Lotmaterialformstücken takes place and subsequently an impingement on the template openings recorded Lotmaterialformstücke with a backward to Template device arranged laser device, such that the Lotmaterialformstücke by the stencil device is supplied with laser energy become.

The inventive method combi accordingly defines a template method suitable for carrying out a particularly time-saving placement operation with a laser remelting method which is particularly gentle on the substrate with regard to thermal stress.

In addition is it is possible, Defects very early, So even before any remelting subsequent Quality inspection too detect. On the other hand, the laser device depending be triggered by the presence of the Lotmaterialformstücks on the relevant pad so that one thermal damage of the substrate due to an immediate laser exposure of the Connection surface excluded can be.

at a particularly preferred variant of the method is the for the application of the individual pieces of solder material necessary separation in the stencil device itself from a lot of in the stencil device recorded Lotmaterialformstücken through a filling arranged in a perforated disc of the template device Stencil apertures. In this process variant, the template device itself serves as Reservoir for the solder material fittings, so that one separate loading device for feeding the template device with solder material fittings is not necessary.

at a likewise very advantageous variant of the method takes place a separation of the Lotmaterialformstücke by the template device Removal of Lotmaterialformstücken from an outside the stencil device arranged amount of Lotmaterialformstücken, such that in the Removal of the stencil openings arranged in a perforated disk the template device filled become.

in this connection serves the template device itself as a removal device, so that one separate device for the removal and feeding of Lotmaterialformstücken for Template device is not necessary.

When It is also particularly advantageous if the admission the solder material fittings with laser energy over the optical scanning takes place, which also already for detection of solder material fittings is used.

at execution the method variant, in which, as mentioned above, the Stencil device itself serves as a reservoir for the Lotmaterialformstücke, it proves to be advantageous when filling the in a perforated disc the template device arranged template openings by means of an over the perforated disc movable away and the perforated disc open filling chamber he follows.

A further advantageous possibility when performing the variant of the method according to the invention, in which the template device itself serves as a reservoir for the solder material fittings, is the filling the stencil openings arranged in a perforated disk of the stencil device by means of a movable parallel to the surface of the perforated disc, to perform about their axis of motion rotating Flügelradeinrichtung.

at execution the above-described variant of the method according to the invention, in which the Template device itself as a removal device for removal the Lotmaterialformstücke a reservoir for Lotmaterialformstücke serves, it proves to be advantageous if the filling of in a perforated disc of the template device arranged stencil openings by means of negative pressure.

Independent of the above-described variants for carrying out the method according to the invention In any case, a contact pressure exerted on the solder material fittings accommodated in the template openings can take place to create a touch contact with the pads by means of a formed in the template device overpressure be generated. It is also possible the touch contact over a generate mechanical contact pressure of the template device itself.

at the one to carry the method according to the invention Particularly suitable device according to the invention is a template device with a receptacle provided for receiving a lot of solder material fittings, wherein the receptacle designed as a perforated disc container wall for transfer of solder material fittings on the pad assembly has, and the perforated disc with a singulator provided, such that from the amount of Lotmaterialformstücken isolated and individual pads of the pad assembly assigned in template openings the perforated disc recorded Lotmaterialformstücke be exposed their presence by means of a detection device individually detectable and which can be acted upon by laser energy by means of a laser device are.

According to an advantageous embodiment, the separating device is designed to be movable over the perforated disk. In this case, the singling device can be moved as a movable over the perforated disc and towards the perforated disc be formed open filling chamber. A further advantageous possibility consists in designing the singling device as a vane wheel device movable over the perforated disk and with radially open transport chamber sections delimited by vanes of an impeller wheel of the impeller device.

If the separating device regardless of their training in a closed space formed by the stencil device is received, the perforated disc opposite arranged rear wall transparent accomplished is, is it possible the application of the isolated Lotmaterialformstücke the pads of the Pad arrangement of the substrate or the remelting with an overpressure to overlay. It proves particularly advantageous in this context if for generating the overpressure a protective gas atmosphere is used.

at an alternative embodiment the device according to the invention is the template device itself as a singulator formed and has a housing with a perforated disc, which with a plurality of template openings for Inclusion of solder material fittings is provided, and opposite the perforated disc has a transparent rear wall, and with a detection device for detecting the individual pieces of solder material and a laser device for backward loading the solder material fittings is provided.

A such trained stencil device can with negative pressure acts as a separation and / or withdrawal facility for the removal of Lotmaterialformstücken from a reservoir of solder material serve, in which case due to the removal of the Lotmaterialformstücke the reservoir was made possible by the negative pressure, automatic filling the template openings results.

If the stencil openings formed in the perforated disc smaller in diameter are as the smallest diameter of the Lotmaterialformstücke is it is possible with a negative pressure against the Lotmaterialformstücke against the opening cross sections the template openings to suck, so that simultaneously with the separation also an exposed arrangement the solder material fittings that makes it possible the Lotmaterialformstücke on the Template device mechanically against the pads of the Pad arrangement to press.

If the template openings formed in the perforated disc are larger in diameter than the largest diameter the solder material fittings and a clearance formed between the perforated disc and the rear wall is smaller than the smallest diameter of the Lotmaterialformstücke is it is possible the solder material fittings while maintaining the isolated arrangement inside the Template device to order the subsequent remelting to perform as far as possible within the template direction can.

When it proves particularly advantageous if the perforated disc and / or side walls the over the perforated disc movable away Füllkammer a transverse to the surface extent the perforated disc have flexible wall construction. This is it possible, even with any uneven formation of the substrate surface a largely conforming to the substrate surface training to reach the perforated disc.

For this The wall construction can be at least three layers with one between two wear-resistant surface layers arranged and yieldingly formed compression layer. It proves to be particularly advantageous if the compression layer made of a plastic and the surface layers of metal are.

following are preferred variants of the method according to the invention and thereby to Use coming preferred embodiments of Device according to the invention closer to the drawings explained. Show it:

1 a schematic diagram of a variant of the method according to the invention;

2 a variant of the method according to the invention using a provided with a filling chamber template device prior to placement on a substrate surface and performing the remelting process;

3 in the 2 illustrated stencil device after arrangement on the substrate surface;

4 a plan view of the in the 2 and 3 illustrated template device;

5 a further variant of the method according to the invention using a stencil device provided with a Flügelradeinrichtung before placing on a substrate surface and performing the remelting process;

6 in the 5 illustrated templates device after placement on the substrate surface;

7 in the 5 and 6 illustrated template device in plan view;

8th a further embodiment of a template device after receiving Lotmaterialformstücken;

9 in the 8th illustrated template device after receiving Lotmaterialformstücken;

10 a further embodiment of the template device prior to the arrangement of a substrate surface;

11 in the 10 illustrated stencil device after placement on a substrate surface;

12 a partial view of the in the 10 and 11 illustrated template device with representation of template openings;

13 an enlarged sectional view of a template opening according to section line XIII-XIII in 12 ;

14 an embodiment of a template device in plan view with a plurality of template segments;

15 a sectional view of an in 14 illustrated filling chamber;

16 a sectional view through a in 14 shown stencil segment according to section line XVI-XVI in 14 ;

17 a partial enlargement of the in 16 illustrated sectional view;

18 a variant of the in the 5 . 6 and 7 illustrated Flügelradeinrichtung.

1 shows in a schematic representation of a possibility for carrying out a method for the placement of Lotmaterialformstücken 20 for a subsequent remelting process. This is a template device 21 provided a housing 22 from one opposite a substrate 23 arranged perforated disc 24 , one of the perforated disc 24 opposite arranged transparent rear wall 25 and one the back wall 25 with the perforated disc 24 connecting side wall frame 26 having.

The perforated disc 24 has template openings 27 on, in which the Lotmaterialformstücke 20 are arranged so that they are each in touching contact with associated pads 28 a pad arrangement 29 of the substrate 23 are located.

How out 1 can be seen, is the template device 21 with a pressure connection 30 provided that an admission of an interior 31 the template device 21 with a gas pressure allows. In the in 1 The configuration shown are the Lotmaterialformstücke 20 through one in the interior 31 trained pressure applied, so that a touch contact between the Lotmaterialformstücken 20 and the associated pads 28 of the substrate 23 established. In this configuration, a re-melting process explained below can be initiated.

To perform the remelting process, as in 1 exemplified, above the transparent rear wall 25 the template device 21 an optical scanner 32 arranged, which has a swivel mirror 33 which is in a scanning beam path 34 is arranged. In the present case is in the scanning beam 34 a trained as a prism beam deflection 35 arranged, which is a decoupling of a detector beam path 36 from the scanning beam 34 allows. The detector beam path 36 provides depending on the rotational position of the pivoting mirror 33 the optical connection between the individual pieces of solder material 20 or the associated pads 28 of the substrate 23 ago. At the end of the detector beam path 36 In the present case, there is an infrared detector 37 and a formed for example as a CCD camera solder material detector 38 , At the end of the scanning beam path 34 there is a laser device 39 depending on the rotational position of the pivoting mirror 33 an admission of the individual Lotmaterialformstücke 20 enabled with laser energy.

Although for the sake of simplified illustration in 1 not shown, has the pivoting mirror 33 not only via a pivot axis extending transversely to the plane of the drawing, but also via a pivot axis extending in the plane of the drawing, so that a total planar scanning of the template device 21 or the Lotmaterialformstücke recorded therein 20 is possible.

To perform the remelting process, triggered by the soldering material detector 38 , a stop of the biaxial pivoting movement of the pivoting mirror 33 and also triggered by the soldering material detector 38 an activation of the laser device 39 for loading the respective detected Lotmaterialformstücks 20 with Laserener strategy. During operation of the laser device 39 allows the infrared detector 37 a temperature monitoring with optionally carried out as a function of changes in the setting values of the laser device 39 ,

2 shows a template device 40 , analogous to the in 1 illustrated stencil device 21 with a perforated disc 41 , a transparent back wall 42 , a sidewall frame 43 and a pressure port 44 is provided. In an interior 45 There is one here from four side walls 46 formed filling chamber 47 in the present case, up and down through the back wall 42 or the perforated disc 41 is limited. In the filling chamber 47 is a variety of Lotmaterialformstücken 20 arranged for filling stencil openings 48 in the perforated disc 41 serve.

Below the in 2 illustrated stencil device 40 there is a substrate 49 , which in the present case has a surface curvature with a deflection d.

As 3 shows nestles in arrangement of the template device 40 on the surface of the substrate 49 the perforated disc 41 to the surface of the substrate 49 at. Upon reaching this snug state, the filling chamber 47 translationally over the perforated disc 41 moved away, taking out of the in the filling chamber 47 arranged amount of Lotmaterialformstücken 20 Lotmaterialformstücke 20 into the template openings 48 the perforated disc 41 to be isolated.

This process is in 4 in a plan view of the template device 40 shown, with the transparent rear wall 42 the view into the interior 45 the template device 40 releases.

In the 4 shown top view clearly shows that due to the translational movement of the filling chamber 47 a filling of the template openings 48 in the perforated disc 41 established. After complete filling of the perforated disc 41 and return movement of the filling chamber 47 in the in 2 Starting position shown can now be an admission of the individual Lotmaterialformstücke 20 with laser energy, as referring to 1 described, done. It can over the in the sidewall frame 43 provided pressure connection 44 The interior 45 be acted upon with an inert gas, in addition to an oxidation-free remelting and the desired contact pressure of the Lotmaterialformstücke 20 against connection surfaces 50 of the substrate 49 allows ( 3 ).

5 shows a template device 51 which, in accordance with the in the 2 to 4 illustrated stencil device 40 a perforated disc 41 , a back wall 42 , a sidewall frame 43 and a pressure port 44 having.

Deviating from the in the 2 to 4 illustrated stencil device 40 is the template setup 51 with a Flügelradeinrichtung 52 provided by the template device 40 used filling chamber 47 replaced. The Flügelradeinrichtung 52 has an impeller 53 with wings 54 on, which, in particular, out 7 apparent across the width of the interior 45 extend. As further from the 6 and 7 can be seen, the Flügelradeinrichtung 52 for filling the template openings 48 in the perforated disc 41 translationally and with a rotation overlaid on the perforated disc 41 moved away. It drives the Flügelradeinrichtung 52 the amount of Lotmaterialformstücken 20 in front of him, wherein simultaneously with the preferably elastic wings 54 Lotmaterialformstücke 20 into the template openings 48 be urged.

In order to prevent that before arrangement of the template device 51 on the substrate 49 Lotmaterialformstücke 20 from the template openings 48 can get out, is the perforated disc 41 with a closing disc 55 provided, the one with the perforated disc 41 has matching hole pattern and by relative displacement relative to the perforated disc 41 in her in 5 shown closed position a closure of the template openings 48 allows. In her in 6 Open position shown are the openings in the closing disc 55 in one with the template openings 48 aligned arrangement.

In the 8th and 9 is a template setup 56 represented at the same time as a removal device for the removal of Lotmaterialformstücken 20 from a reservoir 57 serves. For this purpose, the template device 56 with her perforated disc 58 in the reservoir 57 lowered and an interior 59 the template device 56 through a pressure connection 61 subjected to negative pressure. Due to the fact that the Lotmaterialformstücke 20 larger in diameter than template openings 60 in a perforated disk 58 the template device 56 , remain sporadic pieces of soldering material 20 when removing the template device 56 from the reservoir 57 at opening cross sections 62 the template openings 60 stick in an exposed position.

9 shows the arrangement of the solder material fittings carried out in preparation for a subsequent remelting operation 20 on pads 63 a substrate 64 , How out 9 can be seen in this embodiment, the template ein direction 56 the contact pressure necessary for the contact contact of the Lotmaterialformstücke 20 against the pads 63 also mechanically via a pressure exerted on the template device contact pressure or by the weight of the template device 56 erfolgem.

In the 10 and 11 is a template setup 65 that, like those in the 8th and 9 illustrated template device 56 also for the occasional removal of Lotmaterialformstücken 20 from a reservoir 57 is suitable, in a removal position ( 10 ) and an application position ( 11 ). Like the ones in the 8th and 9 illustrated template device 56 is also the template setup 65 with a perforated disc 66 , a transparent back wall 67 and a sidewall frame 68 Mistake. As 10 further shows, is by a distance a between the perforated disc 66 and the back wall 67 an interior 69 or gap, wherein the distance a is smaller than the diameter d of the Lotmaterialformstücke 20 , On the other hand, the diameters D of template openings 70 in the perforated disc 66 formed larger than the diameter d of the Lotmaterialformstücke 20 , Hence, if over pressure connections 71 in the sidewall frame 68 The interior 69 is subjected to negative pressure, the in 10 illustrated configuration in which the Lotmaterialformstücke 20 in the template openings 70 are adversely affected.

In the in 11 shown application position is the template device 65 at a short distance above the substrate 64 arranged. Shaping to make a contact between the solder material 20 and associated pads 63 of the substrate 64 becomes the interior 69 via the pressure connections 71 subjected to overpressure.

In the 12 and 13 is a sectional view of a bottom view of the perforated disc 66 shown, which shows that the perforated disc 66 with a contact surface 72 which is the individual template openings 70 interconnecting channels 73 having. As 13 makes clear, allow the channels 73 an outflow of one in the interior 69 under overpressure gas, so that the defined arrangement of the template device 65 or the perforated disc 66 a touch contact of the contact surface 72 with the substrate 64 is possible without this would prevent the outflow of the gas under pressure.

14 shows a perforated disc 74 a template device 75 in plan view showing a plurality of template segments 76 having. The template device 75 is with a filling chamber already described in its function and structure 47 Mistake. From the sectional view of the filling chamber 47 according to 15 it becomes clear that the side walls 46 the filling chamber 47 transverse to the surface extent of the perforated disc 74 have a multilayer wall structure. Between two outer, metal and wear resistant surface layers 77 and 78 there is a compression layer 79 made of a flexible plastic, such as polyamide.

16 shows a partial sectional view of the perforated disc 74 and 17 Finally, a partial enlargement of this partial sectional view. Out 17 it becomes clear that the perforated disc 74 one essentially with the side walls 46 the filling chamber 47 has matching wall construction. Between two outer, wear-resistant surface layers 80 . 81 there is a compliant formed compression layer 82 ,

In cooperation, the thus constructed side walls 46 the filling chamber 47 and the perforated disc 74 a deformability, as for example in 3 is shown, wherein the perforated disk shown there 41 an identical with respect to the wall structure wall structure as the perforated disc 74 having. 3 makes it clear that even larger surface curvatures or deformations of the substrate can be compensated by such a wall structure, so that impairments in the implementation of the described with various variants and embodiments method for placing and remelting a plurality of Lotmaterialformstücken on pads of a substrate can be largely prevented ,

18 shows a Flügelradeinrichtung 83 as a variant of the in the 5 . 6 and 7 illustrated Flügelradeinrichtung 52 , Like the Flügelradeinrichtung 52 is the Flügelradeinrichtung 83 in a template device 84 with its axis of rotation 85 guided translationally. For this purpose, in the present embodiment in the template device 84 lateral guide slots 93 intended. As indicated by the arrows in 18 indicated, in the present embodiment, the translation of the axis of rotation 85 an opposing rotation are superimposed. How out 18 can be seen, is the axis of rotation 85 with a gas supply formed in the present case as a bore 86 provided in the longitudinal axis of rotation 85 extending Gasaustritseinrichtungen 87 empties. The gas outlet devices 87 For example, pastures may be formed as longitudinal slots or as rows of holes. Regardless of the design, the gas outlet devices open 87 in of wings 88 the Flügelradeinrichtung 83 limited transport chamber departments 89 and allow, as well as out 18 seen, an admission of in the transport chamber departments 89 arranged Lotmaterialformstücken 20 with a gas flow 90 , The gas flow 90 On the one hand serves, possibly on the elastic wings 88 adhesive Lotmaterialformstücke 20 to remove. On the other hand, the gas flow is used 90 in addition, the blade mechanism acting as a squeegee 83 to aid in their effect.

In particular, when a loading of the Lotmaterialformstücke 20 with a gas flow 90 inert gas is a cover of an interior 91 the template device 84 with a transparent cover 92 , such as a glass, makes sense. To a sticking the Lotmaterialformstücke 20 on the wings 88 To counteract, the use of dry gases has been found to be advantageous. The use of nitrogen for the gas flow also proves to be advantageous.

Claims (19)

A method for placing a plurality of Lotmaterialformstücken on a plurality of pads having pad arrangement of a substrate and then remelting the Lotmaterialformstücke on the pads; characterized by the method steps: - arrangement of a template device ( 21 . 40 . 51 . 56 . 65 . 75 ) with a plurality of template openings ( 27 . 48 . 61 . 70 ) for holding Lotmaterialformstücken ( 20 ) with respect to one having a pad arrangement ( 29 ) provided substrate ( 23 . 49 . 64 ), in such a way that the pieces of solder material are attached to the individual connection surfaces ( 28 . 50 . 63 ), - scanning the template openings ( 27 . 48 . 61 . 70 ) with an optical scanning device ( 32 ) for the detection of solder material fittings ( 20 ), And subsequent loading in the template openings ( 27 . 48 . 61 . 70 ) received solder material fittings ( 20 ) with a backward to the template device ( 21 . 40 . 51 . 56 . 65 . 75 ) arranged laser device ( 39 ), such that the Lotmaterialformstücke be applied through the template means with laser energy. Method according to claim 1, characterized in that in the template device ( 40 . 51 ) a separation of the solder material fittings ( 20 ) from a quantity of solder material fittings accommodated in the template device by filling in a perforated disk ( 41 ) arranged template openings ( 48 ) he follows. Method according to claim 1, characterized in that by the template device ( 56 . 65 ) a separation of the solder material fittings ( 20 ) from an outside of the template device arranged amount ( 57 ) of Lotmaterialformstücken by a filling in a perforated disc ( 58 . 66 ) arranged template openings ( 60 . 70 ) he follows. A method according to claim 3, characterized in that the loading of the Lotmaterialstücke ( 20 ) with laser energy via the optical scanning device ( 32 ) he follows. A method according to claim 2, characterized in that the filling of the in the perforated disc ( 41 ) of the template device ( 40 ) arranged template openings ( 48 ) by means of a movable over the perforated disc and away from the perforated disc open filling chamber ( 47 ) he follows. A method according to claim 2, characterized in that the filling of the in the perforated disc ( 41 ) of the template device ( 51 ) arranged template openings ( 48 ) by means of a guided parallel to the surface of the perforated disc and rotating about its axis of motion Flügelradeinrichtung ( 52 ) he follows. A method according to claim 3, characterized in that the filling of the in the perforated disc ( 58 . 66 ) of the template device ( 56 . 65 ) arranged template openings ( 60 . 70 ) is carried out by means of negative pressure. Method according to one or more of the preceding claims, characterized in that one on the in the template openings ( 70 ) received solder material fittings ( 20 ) applied contact pressure for generating a contact contact with the pads ( 63 ) is generated by means of overpressure. Device for placing a plurality of solder material fittings ( 20 ) on one of a plurality of pads ( 50 ) ( 29 ) of a substrate ( 49 ) and for subsequent remelting of the Lotmaterialformstücke on the pads with a receptacle ( 47 . 51 ) for receiving a lot of Lotmaterialformstücken having template device ( 40 . 51 ), wherein the receptacle as a perforated disc ( 41 ) formed container wall for transferring Lotmaterialformstücken on the pad arrangement ( 29 ), and the perforated disc with a singulator ( 47 . 52 ), in such a way that isolated from the set of Lotmaterialformungen and individual pads ( 50 ) of the pad arrangement ( 29 ), in template openings ( 48 ) of the perforated disc ( 41 ) are placed exposed Lotmaterialformstücke exposed their presence by means of a detection device ( 38 ) is detectable individually and by means of a laser device ( 39 ) can be acted upon backward with laser energy. Apparatus according to claim 9, characterized in that the separating device ( 47 . 52 ) over the perforated disc ( 41 ) is formed movable away; Apparatus according to claim 10, characterized in that the singulation device as a via the perforated disc ( 41 ) movable away and to the perforated disc open filling chamber ( 47 ) is trained. Apparatus according to claim 10, characterized in that the singulation device as a via the perforated disc ( 41 ) movable Flügelradeinrichtung ( 52 ) with wings ( 54 ) of the Flügelradeinrichtung limited and radially open Transportkammerabteilungen is formed. Device according to one or more of claims 9 to 12, characterized in that the separating device ( 47 . 52 ) in one through the template device ( 40 . 51 ) closed space ( 45 ), of which the perforated disc ( 41 ) oppositely arranged rear wall ( 42 ) is transparent. Device for placing a plurality of solder material fittings ( 20 ) on one of a plurality of pads ( 63 ) having a contact surface arrangement of a substrate ( 64 ) and for the subsequent remelting of the Lotmaterialformstücke on the connection surfaces with a designed as a separating device template device ( 56 . 65 ), which has a housing with a perforated disc ( 58 . 66 ) with a plurality of template openings ( 60 . 70 ) for receiving Lotmaterialformstücken and opposite the perforated disc a transparent rear wall ( 67 ), with a detection device ( 38 ) for detecting the individual pieces of solder material and a laser device ( 39 ) for the rearward loading of the Lotmaterialformstücke. Apparatus according to claim 14, characterized in that in the perforated disc ( 58 ) formed template openings ( 60 ) are smaller in diameter than the smallest diameter of the Lotmaterialformstücke ( 20 ). Apparatus according to claim 14, characterized in that in the perforated disc ( 66 ) formed template openings ( 70 ) are larger in diameter than the largest diameter of the Lotmaterialformstücke ( 20 ) and one between the perforated disc and the rear wall ( 67 ) trained distance a is smaller than the smallest diameter d of the Lotmaterialformstücke ( 20 ). Device according to one or more of claims 9 to 16, characterized in that the perforated disc ( 24 . 41 . 58 . 66 . 74 ) and / or side walls ( 46 ) of the filling chamber movable over the perforated disk ( 47 ) have a transverse to the surface extent of the perforated disc flexible wall structure. Device according to claim 17, characterized in that the wall construction comprises at least three layers with a surface layer (2) designed to be wear-resistant. 77 . 78 . 80 . 81 ) and yieldingly designed compression layer ( 79 . 82 ) having. Device according to claim 18, characterized in that the compression layer ( 79 . 82 ) made of plastic and the surface layers ( 77 . 78 . 80 . 81 ) are made of metal.