DE112004001872D2 - Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor - Google Patents

Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor

Info

Publication number
DE112004001872D2
DE112004001872D2 DE112004001872T DE112004001872T DE112004001872D2 DE 112004001872 D2 DE112004001872 D2 DE 112004001872D2 DE 112004001872 T DE112004001872 T DE 112004001872T DE 112004001872 T DE112004001872 T DE 112004001872T DE 112004001872 D2 DE112004001872 D2 DE 112004001872D2
Authority
DE
Germany
Prior art keywords
electronic component
heat sink
cooled
cooling device
microprocessor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
DE112004001872T
Other languages
English (en)
Inventor
Harald Fonfara
Herbert Goestl
Thorsten Miltkau
Markus Eberi
Ralf Mollik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kermi GmbH
Original Assignee
Kermi GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kermi GmbH filed Critical Kermi GmbH
Publication of DE112004001872D2 publication Critical patent/DE112004001872D2/de
Withdrawn - After Issue legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112004001872T 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor Withdrawn - After Issue DE112004001872D2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10335197A DE10335197B4 (de) 2003-07-30 2003-07-30 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
PCT/DE2004/001361 WO2005015970A2 (de) 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor

Publications (1)

Publication Number Publication Date
DE112004001872D2 true DE112004001872D2 (de) 2006-06-14

Family

ID=34089012

Family Applications (3)

Application Number Title Priority Date Filing Date
DE10335197A Expired - Lifetime DE10335197B4 (de) 2003-07-30 2003-07-30 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
DE112004001872T Withdrawn - After Issue DE112004001872D2 (de) 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
DE502004012290T Active DE502004012290D1 (de) 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10335197A Expired - Lifetime DE10335197B4 (de) 2003-07-30 2003-07-30 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE502004012290T Active DE502004012290D1 (de) 2003-07-30 2004-06-28 Kühlvorrichtung für ein elektronisches bauelement, insbesondere für einen mikroprozessor

Country Status (5)

Country Link
US (1) US7508669B2 (de)
EP (1) EP1649736B1 (de)
AT (1) ATE501524T1 (de)
DE (3) DE10335197B4 (de)
WO (1) WO2005015970A2 (de)

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DE102004004440B4 (de) * 2004-01-28 2006-06-29 Kermi Gmbh Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
SE533224C2 (sv) * 2008-09-16 2010-07-27 Sapa Profiler Ab Kylkropp för kretskortkomponenter
CN101742875B (zh) * 2008-11-20 2011-10-05 英业达股份有限公司 散热组件
DE102009006924B3 (de) * 2009-02-02 2010-08-05 Knürr AG Betriebsverfahren und Anordnung zum Kühlen von elektrischen und elektronischen Bauelementen und Moduleinheiten in Geräteschränken
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US8422229B2 (en) * 2009-06-25 2013-04-16 Oracle America, Inc. Molded heat sink and method of making same
JP4802272B2 (ja) * 2009-09-30 2011-10-26 株式会社東芝 電子機器
CN102575906B (zh) * 2009-10-30 2013-09-25 惠普发展公司，有限责任合伙企业 用于刀片外壳的热汇流条
US20120279683A1 (en) * 2011-05-05 2012-11-08 Alcatel-Lucent Usa Inc. Cooling apparatus for communications platforms
US20130250522A1 (en) * 2012-03-22 2013-09-26 Varian Medical Systems, Inc. Heat sink profile for interface to thermally conductive material
US8937810B2 (en) 2012-09-14 2015-01-20 International Business Machines Corporation Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
US9066460B2 (en) 2013-01-17 2015-06-23 International Business Machines Corporation Disassemblable electronic assembly with leak-inhibiting coolant capillaries
WO2016027299A1 (ja) * 2014-08-18 2016-02-25 株式会社Ｍｕｒａｋｕｍｏ システム、情報処理装置およびラック
EP3800421A1 (de) * 2014-12-03 2021-04-07 Intelligent Platforms, Llc. Kombinierte energieableitungsvorrichtung
WO2017141215A1 (en) * 2016-02-18 2017-08-24 Eric Matte High efficiency heat dissipation methods and systems for electronic circuits and systems
DE102016109280A1 (de) * 2016-05-20 2017-11-23 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung zur Kühlung von elektronischen Komponenten
US20230320034A1 (en) * 2022-03-22 2023-10-05 Baidu Usa Llc Thermal management device for high density processing unit
US20230345669A1 (en) * 2022-04-20 2023-10-26 Quanta Computer Inc. Heat-Absorbing Chassis For Fan-Less Electronic Component

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DE1140613B (de) * 1959-07-09 1962-12-06 Decca Ltd Elektronische Baugruppe mit einem geschlossenen Gehaeuse und mit einer Kuehlanlage
DE3417986A1 (de) * 1984-05-15 1985-11-21 kabelmetal electro GmbH, 3000 Hannover Anordnung zum abfuehren der verlustwaerme von in gehaeusen angeordneten leiterplatten
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
JPS6338245A (ja) * 1986-08-01 1988-02-18 Ishikawajima Harima Heavy Ind Co Ltd コ−ルドプレ−ト
US4698728A (en) * 1986-10-14 1987-10-06 Unisys Corporation Leak tolerant liquid cooling system
JPH03208365A (ja) * 1990-01-10 1991-09-11 Hitachi Ltd 電子装置の冷却機構及びその使用方法
DE9003687U1 (de) * 1990-03-29 1990-05-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
DE4421025C2 (de) * 1994-06-16 1999-09-09 Abb Patent Gmbh Kühlkörper mit mindestens einem Kühlkanal
DE19514548C1 (de) * 1995-04-20 1996-10-02 Daimler Benz Ag Verfahren zur Herstellung einer Mikrokühleinrichtung
DE19612259A1 (de) * 1996-03-28 1997-10-02 Sel Alcatel Ag IC-Bauelement mit Kühlanordnung
US6205803B1 (en) * 1996-04-26 2001-03-27 Mainstream Engineering Corporation Compact avionics-pod-cooling unit thermal control method and apparatus
DE19646195A1 (de) * 1996-11-08 1998-05-14 Austerlitz Electronic Gmbh Modular aufgebauter stranggepreßter Flüssigkeitskühlkörper mit verbesserten und einstellbaren Kühleigenschaften
US5982616A (en) 1997-08-20 1999-11-09 Compaq Computer Corporation Electronic apparatus with plug-in heat pipe module cooling system
JPH11163565A (ja) * 1997-11-27 1999-06-18 Ando Electric Co Ltd プリント基板の冷却構造
JP3315649B2 (ja) * 1998-08-11 2002-08-19 富士通株式会社 電子機器
FR2784537A1 (fr) * 1998-10-07 2000-04-14 Ferraz Procede de montage d'une installation electrique ou electronique de puissance et echangeur de chaleur pour composants electriques ou electroniques de puissance
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6519955B2 (en) * 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
DE20010663U1 (de) * 2000-06-15 2000-10-26 Schlomka Georg Kühlelement und Kühleinrichtung
DE10039770A1 (de) * 2000-08-16 2002-02-28 Bosch Gmbh Robert Kühlvorrichtung
US6796370B1 (en) * 2000-11-03 2004-09-28 Cray Inc. Semiconductor circular and radial flow cooler
US6393853B1 (en) * 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms
US6381135B1 (en) * 2001-03-20 2002-04-30 Intel Corporation Loop heat pipe for mobile computers
AU2002306161A1 (en) * 2001-06-12 2002-12-23 Liebert Corporation Single or dual buss thermal transfer system
US6587336B2 (en) * 2001-06-27 2003-07-01 International Business Machines Corporation Cooling system for portable electronic and computer devices
US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
WO2003007376A1 (en) * 2001-07-09 2003-01-23 Daikin Industries, Ltd. Power module and air conditioner
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US6804117B2 (en) * 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems
US7012807B2 (en) * 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack

Also Published As

Publication number Publication date
US20070274044A1 (en) 2007-11-29
ATE501524T1 (de) 2011-03-15
DE502004012290D1 (de) 2011-04-21
EP1649736A2 (de) 2006-04-26
DE10335197B4 (de) 2005-10-27
US7508669B2 (en) 2009-03-24
DE10335197A1 (de) 2005-02-24
EP1649736B1 (de) 2011-03-09
WO2005015970A2 (de) 2005-02-17
WO2005015970A3 (de) 2007-07-05

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Legal Events

Date Code Title Description
8181 Inventor (new situation)

Inventor name: FONFARA, HARALD, 94551 LALLING, DE

Inventor name: GöSTL, HERBERT, 94227 ZWIESEL, DE

Inventor name: MILTKAU, THORSTEN, 94469 DEGGENDORF, DE

Inventor name: EBERL, MARKUS, 94563 OTZING, DE

Inventor name: MOLLIK, RALF, 94526 METTEN, DE

8130 Withdrawal