DE102009016953A1 - Conversion unit with several conversion modules, commissioning method of the conversion unit and such a conversion unit having optical arrangement - Google Patents

Abstract

Conversion modules (20/20 ') are arranged in a conversion unit (50/50') in at least one arrangement direction (35, 36) adjacent to one another to form a conversion arrangement (30/30 ') to generate electrical energy in radiant energy or vice versa on a settable scale convert. For cooling, they are supplied with coolant via a coolant supply and removal device (40). In the region of a heat receiving surface (21 *), in each case a semiconducting conversion element (10/10 ') for forming a conversion module (20/20') is fastened to a heat conducting body (21), which is divided into three sections; the heat receiving surface (21 *) carrying heat receiving portion (21 a), a heat emitting portion (21 c) having a coolant-wetted heat release surface (26 *) in at least one recess (26), and a heat conducting portion (21 b) which between the heat receiving portion (21 21a) and the heat-dissipating portion (21c). In the conversion arrangement (30/30 '), an opening (27) in the heat-dissipating section (21c) communicates with the recess therein and faces the conversion module (20/20') adjacent in the arrangement direction. The heat-conducting section (21b) has at least one sealing surface (24) via which a seal is made, which contributes to the inclusion of coolant in coolant flow passages (37) between the heat-dissipating sections (21c) of adjacent conversion modules (20/20 '). The coolant flow takes place in the ...

Description

The The invention relates to a conversion unit for converting electrical Energy in radiant energy or for the conversion of radiant energy in electrical energy according to the preamble of claim 1.

A such converted as a radiation source conversion unit has Accordingly, at least one as a radiation emission arrangement trained conversion arrangement and at least one coolant supply and -abführeinrichtung on.

The Coolant supply and removal device has at least a radiative outlet facing the radiator outlet, via the at least one coolant of the radiation emission arrangement is supplied, and at least one of the radiation emission arrangement facing coolant inlet through which the coolant is removed from the radiation emission arrangement.

The Radiation emission arrangement has several, in operation radiation emitting semiconductor modules as conversion modules, which are described in at least one arrangement direction at least partially each other are arranged adjacent.

In the radiation emission arrangement consists of at least one coolant guide, in the course of which the flow of the semiconductor components is provided with the coolant.

The Semiconductor modules have at least one electrically contactable In operation, emitting radiation in at least one emission direction Semiconductor device as a conversion element and at least a Wärmeleitkörper with at least one heat receiving portion, the has at least one heat receiving surface on the semiconductor device is attached, and at least one Heat emitting portion, the at least one heat transfer surface for dissipating heat to the flowing coolant has.

One Example of such a radiation source sees as Radiation emission arrangement a diode laser stack before, in the the semiconductor devices are diode laser devices that are edge-emitting Laser diode bars as semiconductor devices and microchannel heat sinks have as Wärmeleitkörper.

Such a radiation source is known from the published patent application DE 197 50 879 A1 known.

adversely at the relevant radiation source is on the one hand, the large Extension (here: thickness) of the heat conducting body in Stacking direction, which is a reduced distance between adjacent ones Semiconductor modules (here: diode laser devices) limited. To the Another disadvantage is that the stack height due to the pressure loss is limited due to the serial coolant flow through the heat conducting results.

It It is therefore an object of the invention to describe a radiation source, which does not have the aforementioned disadvantages.

Especially It is an object of the invention to describe a conversion unit, their conversion elements - in the case of a radiation source it radiation-emitting semiconductor devices - in terms of area take the largest possible fill factor and are as cool as possible.

The Task is solved by a conversion unit with the Features of claim 1. Preferred embodiments are Subject of the dependent claims.

According to the invention the heat discharge portion with respect to the heat receiving portion completely in at least one heat conduction direction inclined to the arrangement direction arranged, and has at least one, the heat transfer surface extensive recess on and at least one opening, on one, the heat-emitting portion of the Wärmeleitkörpers an adjacent - for example, emitting radiation Semiconductor module trained - conversion module opposite, first outside, and with the recess communicates.

there can the heat-emitting surface having recess be regarded as a cooling channel. In contrast, points the heat receiving portion according to the invention no from the coolant wetted surface.

Of Further, the coolant guide according to the invention has coolant flow passages between the heat-dissipating sections of heat-conducting bodies neighboring conversion modules and is for a first Coolant flow to the flow of a first group one or more conversion modules and one, the first coolant flow fluidically parallel, second coolant flow for the flow of a second group of one or more conversion modules educated.

Furthermore, according to the invention, the heat-conducting body in each case has at least one heat-conducting section which is arranged between the heat-absorbing section and the heat-dissipating section and has at least one sealing surface via which a seal takes place at least in sections; leading to an inclusion of coolant in the coolant contributes to river passages.

After all is from the coolant supply and discharge device According to the invention, at least the section in the direction of heat conduction arranged away from the conversion arrangement, the coolant outlet and / or having the coolant inlet.

The Conversion unit according to the invention is both as a radiation source and as a radiation receiver can be formed.

In form a radiation source according to the invention the radiation-emitting semiconductor components, the main heat sources a heat transfer device, with the formed radiation source according to the invention becomes.

In a radiation receiver according to the invention The radiation-absorbing semiconductor components form the main heat sources a heat transfer device, with the Radiation receiver according to the invention is trained.

The Heat exchangers are in both cases the Conversion modules according to the invention, the modular Building blocks of the conversion arrangement are.

in the Case of the radiation source, the conversion arrangement is a radiation emission arrangement, the modular composed of radiation-emitting semiconductor modules assembled is the at least one radiation in at least one direction of emission having emitting semiconductor device.

in the Trap of the radiation receiver is the conversion arrangement a radiation receiving arrangement, the modular radiation-absorbing semiconductor components is composed of at least one radiation of at least an irradiation direction absorbing semiconductor device exhibit.

The Coolant forms the main heat sink in both cases.

The Invention is directed to both radiation emitting semiconductor devices of the edge emitting type as well as the surface emitting type applicable and suitable for both types. In the beam path arranged optics can thereby homogenization if necessary the intensity distribution of the radiation and / or a collimation or focusing the radiation effect.

Similarly the invention is directed to radiation-absorbing semiconductor devices, the both surface receiver as edge receiver could be. In the beam path arranged optical means can If necessary, a local increase in the intensity of Radiation by concentration or bundling or focus and thus the irradiance increase the radiation-absorbing semiconductor device.

One Example of a radiation according to the invention The semiconductor absorbing device is a solar cell, wherein the Conversion modules are solar modules and the conversion unit photovoltaic generator is.

One another example of an inventive Radiation-absorbing semiconductor device is a thermoelectric Chip with a radiation absorption layer facing the irradiation direction, where the conversion modules are Peltier modules and the conversion unit is a thermoelectric generator.

vicarious for a radiation receiver and its components is henceforth related to the radiation source with its components taken. In this case, the said with respect to the radiation source transferred analogously to a radiation receiver under a proviso which takes into account the reverse energy conversion.

is the radiation-emitting semiconductor component has an edge emitter, for example, an edge emitting laser diode, an edge emitting laser diode bar or an edge emitting light emitting diode, so are the electrical Contact surfaces - a first and at least one, to the first electrical contact surface gegenpolige, second - the Edge-emitting semiconductor device usually parallel to the direction of radiation and on opposite sides Side of the edge-emitting semiconductor device arranged.

is the radiation-emitting semiconductor component has a surface emitter, For example, a surface emitting laser diode (VCSEL = vertical cavity surface emitting laser), a surface emitting Laser diode array (VCSEL array) or a surface emitting LED, so are the electrical contact surfaces - a first and at least one, opposite to the first electrical contact surface, second - the edge-emitting semiconductor device usually perpendicular to the direction of radiation and on each other opposite sides of the edge-emitting semiconductor device arranged.

Nevertheless, the electrical contact surfaces for both emission types may be inclined with respect to their said regular arrangement and / or arranged on one and the same side of the semiconductor component. For simplification However, the explanation of the advantages of the radiation source according to the invention is based on the regular arrangements.

Preferably are the electrical contact surfaces parallel to the Heat receiving surface, although inclined arrangements possible are. This is the heat absorption section in a heat source projection of the semiconductor device perpendicular to the electrical contact surfaces.

The Radiation emission arrangement can be both linear with only one arrangement direction present or areal with more than one arrangement direction, For example, two arrangement directions that a common arrangement level span. The single arrangement direction in the linear case can assigned a certain level of arrangement with the requirement this plane comprises both the linear arrangement direction as well as a direction in which a second linear radiation emitter array a first linear radiation emitter array, preferably may be adjacent without the radiation of the first linear radiation emitter array to hinder.

A Arranging direction can then be understood as an adjacency direction are, if between two, in the said arrangement direction each other Not even immediately adjacent arranged semiconductor devices sections, a further semiconductor device is arranged.

In the graphically simplest case - and henceforth assumed - there is only one single emission direction and only one arrangement plane which is oriented perpendicular to the single emission direction. However, this is not mandatory. In an arrangement plane inclined, for example, not by 90 ° but only by 60 ° to the direction of emission, the beam spacing of adjacent semiconductor modules could be reduced by a factor sin 60 ° = 0.87. If the inclination of the arrangement plane with respect to the emission direction is further reduced, it must be ensured below a certain inclination angle, for example 10 °, that the bundles of rays are not shaded by adjacent semiconductor modules. In order to avoid this, the semiconductor components are to be offset in one direction at an angle to the emission direction, for example in the direction of the normals of the arrangement plane. With such an offset can be realized with an inclination of the arrangement plane of 10 ° relative to the emission direction, a beam spacing of adjacent semiconductor modules in the size of the offset, such as in the US patent US 5,987,043 A described. In an alternative approach, this arrangement allows for the existence of a plurality of assembly-independent arrangement levels, which are each assigned to a semiconductor module and arranged parallel to one another perpendicular to the emission direction by said offset.

In clearly the simplest case is the direction of heat conduction from the heat receiving portion via the heat conduction portion to the heat dissipation section perpendicular to the assembly plane. If the arrangement plane is directed perpendicular to the emission direction, Thus, the heat conduction direction of the radiation direction is opposite.

Generally, each semiconductor device, each semiconductor device, and even each individual one of a plurality of emitters of a semiconductor device or a semiconductor device can be assigned its own emission direction. By way of example, the emission directions of different emitters can be aligned in such a way that their beams or bundles of rays cross at a specific distance from the respective semiconductor component or overlap in a perspective manner. In this regard, for example, the disclosure of the EP 1 113 543 A1 directed. This arrangement with semiconductor modules are conceivable, which are aligned at small angles of 0.1 ° to 30 ° to each other inclined radiation directions. In this case, each emission direction or each semiconductor module can either be allocated its own arrangement level or-as long as the sections of the semiconductor modules are valid-a plane of arrangement common to all emission directions or semiconductor components, which assumes its own angle of inclination with respect to each emission direction.

Of the For simplicity, one becomes approximately perpendicular to the direction of radiation rectangular cross section of the heat conducting body or Semiconductor modules accepted Thus, the arrangement of the semiconductor modules in stacked arrangement one above the other or in a row arrangement coexist. Also field arrangement of several stacks in series next to each other or several rows in the stack one above the other are possible. In a stack, that is in the layout plane lying adjacent direction the stacking direction, in which the semiconductor modules on top of each other are arranged. In a row is the lying in the arrangement level Adjacent direction, the row direction in which the semiconductor modules next to each other or arranged.

Nevertheless, the cross-section of the heat-conducting body can also be other than rectangular, for example triangular or hexagonal, where with more than two directions of proximity can exist.

Regarding the neighborhood of two elements, for example diode laser devices or cooling channels, let it be agreed that two elements be regarded as immediately adjacent if there is no further Element of the same type is arranged. They are considered indirect adjacent, if between them at least one more element of the same type is arranged.

in the Doubts apply with regard to their direct or indirect Neighborhood unspecified, adjacent elements as immediately adjacent to each other.

Preferably is the stacking and / or row direction perpendicular to the emission direction educated. Although this is not mandatory, but facilitates one descriptive description of the invention.

For Surface emitting semiconductor devices are so all directions of proximity in the plane of the heat receiving surface, arranged on a front side of the heat conducting body is, whose normal is parallel to the radiation direction, that means: The arrangement level is parallel to the heat receiving surface.

For edge emitting semiconductor devices are neighbor directions both perpendicular to the heat receiving surface as well in the plane of the heat receiving surface and inclined possible. The heat absorption surface is thus preferably on an outer side perpendicular to a front side arranged the Wärmeleitkörpers. In other words: the normal of the heat absorption surface is parallel to. It applies to surface-emitting semiconductor devices hereafter agreed that a stacking direction in the direction of smaller cross-sectional dimension of the rectangular Wärmeleitkörpers lies one row direction towards the larger one Cross-sectional dimension.

For Edge-emitting semiconductor devices, it is agreed that that a stacking direction perpendicular to the heat receiving surface the rectangular Wärmeleitkörpers is located, a Row direction parallel to it.

in the The following will be limited without departing from the scope of the invention representative of all radiation-emitting semiconductor components including light emitting diode and light emitting diode fields Laser diode elements, which are both single emitter as well as monolithic one- or two-dimensional emitter field arrays both the surface emitting and the edge emitting Laser diode type include. Besides, without the scope to restrict the invention representative of all semiconductor devices are referred to diode laser devices taken.

By the inventive provision of a cooling channel, preferably a plurality of cooling channels forming recesses, in heat conduction away from the heat receiving portion can in the heat dissipation section on the cooling channels Closing layers are omitted, because the Inventive seal on Wärmeleitabschnitt a leakage of the coolant from the areas of the invention Coolant flow passages between the diode laser devices in derogation.

clear This situation is characterized by the fact that the heat-conducting section as between the heat-receiving portion and the heat-dissipating portion considered that he is at least partially in the arrangement level completely through the heat-conducting body extends, and the inventive feature missing, wetted by the coolant, surfaces in the heat receiving portion takes into account, whereby a coolant flow in the heat absorption section is excluded.

This The circumstance serves advantageously to reduce the distance between adjacent diode laser devices, because the expansion of the heat conducting body in the direction of adjacency according to the invention alone after the expansion of Cooling channels in Adjacent direction can be measured.

In order to is an increased packing density of laser diode elements possible in a diode laser stack, resulting in one opposite the prior art increased surface power density the emitted radiation can result.

at Edge-emitting semiconductor devices is the heat-emitting portion according to the invention outside the above defined Heat source projection. The heat flow is thereby in the heat receiving section deflected by 90 ° and oriented in stacking against the direction of radiation.

Moreover, the coolant supply and discharge device according to the invention with respect to the radiation emission arrangement - for example, a diode laser array or a diode laser stack - arranged so that it does not preclude the formation of a high packing density of diode laser devices. In the case of a two-dimensional field arrangement of diode laser elements, the presence of at least two adjacent directions, preferably in a plane perpendicular to the direction of emission, provides, for example, the rearward direction, that is to say the direction of emission gengesetzten, arrangement of the coolant supply and discharge before.

With surface emitting laser diode devices leaves such a fill factor, that's the ratio from emissive to total area, the radiation emitter array reach, which is preferably greater than 90%.

Analogous can be received with surface radiation Solar cells so a fill factor - in this case is it the ratio of radiation to electricity converting Receiving surface to the total area - the reach photovoltaic receiving arrangement, preferably larger than 90% is. This advantage comes especially with an optical Arrangement according to claim 31, in which the incident solar radiation with one for the photovoltaic Reception arrangement common single look - for example a concave mirror or a Fresnel lens - the sun's rays is also concentrated on the areas between the solar cells. According to the invention These areas are kept very small, so that little solar radiation is lost for electric power generation. The good Cooling the solar cells also ensures a high Conversion efficiency.

a Another advantage for cooling technology operation offers the inventive provision at least two flow-parallel guided coolant flows in the radiation emission or reception arrangement. It will possible, the pressure loss compared to the purely serial coolant flow in the prior art already lower by half. The provision of further fluidically guided in parallel Coolant flows, on the other hand, can reduce the pressure loss further reduce.

Ideally be as many as possible, preferably every other second, particularly preferably each diode laser component of a radiation emission arrangement with a flow-parallel coolant supply and a fluidically parallel coolant discharge Mistake.

The inventive presence of coolant flow passages between the heat-dissipating sections of heat-conducting bodies adjacent semiconductor devices allow it in this context For example, at least one of the coolant flow passages between adjacent semiconductor modules for a coolant intake and / or -delivery from or to the opposite of Radiation emission arrangement arranged rearwardly Provide coolant supply and discharge device. Alternatively or optionally, the heat-conducting body have rearward openings, the communicate with the cooling channels and coolant receive from the coolant supply and discharge device and / or deliver to them.

With the Kühlmittelzu- and Abführeinrichtung can be beneficial both the Coolant distribution on the cooling channels the diode laser components as well as the coolant collection from the cooling channels of the diode laser components outside of the heat conducting bodies perform occupied area in the diode laser stack. Connected This is an advantageous saving of Wärmeleitkörpermaterial and the advantageous restriction of the pressure loss, in particular in a variety of diode laser devices, for example more than ten, in the diode laser stack, to a minimum of that value, the has a single diode laser device.

In Advantageously, thus theoretically diode laser stack and rows with an unlimited number of diode laser devices produced. Likewise, a principle theoretically unlimited Number of diode laser stacks are juxtaposed when the coolant supply and discharge device in one Direction of radiation opposite direction with respect the radiation emission arrangement is arranged.

Preferably exists an electrically conductive connection of a second electrical contact surface of the laser diode element with the first electrical contact surface of a laser diode element one in adjacent diode laser device. Preferably the electrical connection serial, less preferably parallel. Combinations of parallel and serial electrical connection of different Laser diode elements and / or diode laser devices are also conceivable.

to further description of the invention will henceforth - without to limit the scope of the invention - thereof assumed that the first and the second contact surface on different, opposite sides an edge emitting laser diode element are arranged and the radiation emission surface of the edge-emitting laser diode element between the two contact surface planes perpendicular to oriented first and second contact surface arranged is, whereby the radiation direction parallel to the normal to the radiation emission surface is aligned.

Farther It is assumed that the heat absorption surface - and so that the first and second contact surface - respectively oriented perpendicular to the stacking direction, that is: Their normals are parallel to the stacking direction. Nevertheless, they are according to the invention also inclined orientations allowed.

After all becomes a restriction to a single stacking direction made, although according to the invention also several Stacking directions through each other in angles of magnitude less than 45 ° to each other positively or negatively inclined Heat receiving surfaces of adjacent diode laser components possible are.

The Edge emitting laser diode element is preferably a laser diode bar with a large number - for example, more than four - in to the first contact surface parallel width direction side by side arranged emitters.

Fewer Preferably, the edge emitting laser diode element is a laser diode with one or a few emitters. In this context, be sure noted that the dimensions of laser diodes opposite Laser diode bars usually differ in that laser diodes in lateral direction have a width which is less than their Length in resonator longitudinal direction. For laser diode bars the reverse applies.

According to the invention the laser diode element on the heat receiving surface attached to the heat receiving portion. It can be his first electrical contact surface an electrically conductive connection with the heat receiving surface, if this on an electrically conductive portion of the heat receiving portion is arranged. The attachment is preferably cohesive and preferably comprises at least one metallic Lotfuge between the heat receiving surface and the first electrical Contact surface on.

If the heat receiving portion is not electrically conductive at least in the region of the heat absorption surface, the power supply to the first contact surface, as in the published patent application EP 0 766 354 A1 proposed, via a metal foil, which is arranged between the heat receiving surface and the first electrical contact surface.

there an electrically conductive connection of the second electrical Contact surface of the laser diode element with the first electrical Contact surface of a laser diode element one in the stacking direction adjacent diode laser component, so this is preferably non-positively or cohesively and can a electrically conductive connecting element having at least at the second electrical contact surface by means of a material fit attached to an electrically conductive joining means is. The connection of the electrically conductive connection element can be cohesive or cohesive to an electrically conductive Pad of the adjacent Wärmeleitkörpers take place, in electrically conductive connection with the heat receiving surface this adjacent Wärmeleitkörpers is.

on the other hand For example, the electrically conductive connecting element may be the one mentioned above Form metal foil, the sections between the first contact surface of the now adjacent in the stack laser diode element and the Heat receiving surface of the adjacent Wärmeleitkörpers arranged is.

Nonetheless The electrical connection can also be without the participation of an electrically conductive Connecting element, for example, materially under Participation of a solder over a counter surface the adjacent Wärmeleitkörpers take place, the in electrically conductive connection with the heat receiving surface this adjacent and the second electrical contact surface the laser diode element is opposite.

The Materials for the heat-conducting body are in principle freely selectable under the proviso that an electric Contacting and optionally electrical connection of the laser diode elements ensured in the diode laser stack.

Of the Heat-conducting body, for example, completely made of electrically insulating material when between the Heat receiving surface and the laser diode element an electrically conductive region is present.

With a Wärmeleitkörper of electrically insulating Material may be the concern of a potential difference in the coolant be prevented, whereby the coolant also electrically can be conductive.

Consists the heat-conducting body completely made of electrical Conductive material, so it can be connected to an electrical Connection between the first and second contact surface be involved in adjacent laser diode elements. Kick the coolant so in contact with electrical potential-carrying areas in the case of water as a coolant limiting its electrical conductivity below 20 mS / cm.

moreover can the heat-conducting body of one or more Materials exist. Several materials can be layered or randomly in a composite or composite material, For example, in a metal-matrix composite, be combined. Preferably, materials are used whose thermal conductivity larger than that of the laser diode element. Especially preferably a material used is selected from the group of copper, Silver, gold, aluminum, molybdenum, tungsten, aluminum nitrite, Beryllium oxide, silicon carbide, graphite, boron nitride and diamond.

Particularly preferably, the heat-conducting body consists of at least one highly thermally conductive Material whose thermal conductivity is equal to or greater than that of copper. For example, the heat-conducting body mainly consist of CVD diamond whose thermal conductivity is greater than 1000 W / m / K.

Preferably the heat-conducting body consists of at least one Material whose thermal expansion coefficient is not more than 50% deviates from that of the laser diode element. For example, can the heat-conducting body made of beryllium oxide (7.8 ppm / K, 280 W / m / K) or a silver-diamond composite (7 ppm / K, 550 W / m / K), when the laser diode element is predominantly of gallium arsenide (6.5 ppm / K).

If the coefficient of thermal expansion of the heat-conducting body deviates by more than 50% from that of the laser diode element, then the heat-conducting body can have recesses which give the heat-conducting body structural resilience and, in the case of a thermally assisted connection to the laser diode element, keep the thermo-mechanical stresses which are below a certain damage threshold ( DE 197 01 680 A1 ). At least some of these recesses may have, at least in sections, the heat delivery surfaces according to the invention and be provided for the coolant guide.

Of the Heat receiving portion, the Wärmeleitabschnitt and the heat dissipation section can be off and on the same material, of several identical materials or of different ones Materials exist. So it may be in the sense of a required electrical Connection between top and bottom of the heat conducting body be advantageous that the heat receiving portion of a electrically conductive material. In the sense of required electrical insulation of the electrical connection the coolant, it is advantageous if at least the Wärmeleitabschnitt or the heat dissipation section consist of an electrically insulating material or - for the case that both made of electrically conductive material consist, at least one of the sections with an electrically insulating layer is provided.

There the heat release section completely outside the heat source projection perpendicular to the receiving surface of the edge-emitting laser diode element are none Coolant-carrying recesses below the edge emitting laser diode element in the heat conduction body available. Thus, the heat flow on the one hand unhindered from the heat receiving portion into the heat releasing portion be redirected.

The Recesses according to the invention are easy to produce and enable a simple and efficient coolant flow through the heat-dissipating section.

is the heat-conducting body preferably as a heat conducting plate formed, so are the receiving surface and the first outer surface for example, arranged on the top of the plate and the counter surface and the second outer surface on the underside of the plate. The thickness direction of the plate extends in the stacking direction from the top of the plate to the bottom of the plate. Extend with it the recesses according to the invention in the thickness direction.

A or more recesses can (a) in the heat conduction body away from the outer surfaces as a closed cooling channel be arranged or (b) as an open cooling channel in the form be introduced into the outer surfaces of a groove. The opening according to the invention belongs in case (a) to a second recess, in the outer surface is introduced and with the inventive Recess communicates.

in the Case (b) includes the opening according to the invention to the recess according to the invention. Both the inventive Recess in case (b) as well as the second recess in case (a) can completely or partially completely through the heat-dissipating portion from the first outer surface to to the second outer surface through in the form of openings extend.

in principle are not the recesses of the invention limited to a specific shape. Preferably the figure is prismatic, the cross section does not depend on a particular Form is limited. The recess shape can be round, elliptical, triangular, square, rectangular, etc. The cross section of the Recesses can change in the thickness direction. So are for example, wedges or truncated cones possible Shapes of the recesses, z. B. if they are by etching or laser cutting. Two or more recesses can lead to a common, branched recess pattern be united. For example, two recesses with rectangular cross-section an L, V, X, N or T-shaped Forming recess patterns; three recesses with rectangular cross-section may be a U, H, K, M or F-shaped recess pattern form and so on. Several identical or different recess patterns may be present in the heat release section.

One or more recesses may extend completely or in sections completely through the heat release section from the first outer surface to the second outer surface in the form of apertures. For the possible embodiments of the breakthroughs that applies to the Ausneh The statements made in analogy. Instead of the shape of a truncated cone, for example, a breakthrough may thus also be formed as a double truncated cone.

The Breakthroughs and / or recesses may be one have closed wall or a wall sections is interrupted at one or more points. For example, you can There are several rectangular openings from the top of the plate extend to the underside of the plate and thereby up to that of the heat receiving portion reach away from the rear surface of the heat conducting. This forms an open cooling rib structure the cooling fins are facing the direction of radiation extend away from the heat receiving area and that of the rear surface in the direction of the heat receiving portion can be flowed with a coolant.

The Inventive seal is not in principle in a certain way of sealing or in a certain way the seal is limited. You in any way Compound, for example a material or non-positive, be based and to seal with or without aids. A seal For example, on the direct adhesion between opposite sealing surfaces of two based adjacent Wärmeleitkörper.

aid for sealing according to the invention are in principle not limited to specific aids. That's the way it works in the tools to plates, films, rings or beads act, which contribute to an inclusion of the coolant. These sealing bodies can be electrically conductive, preferably be electrically insulating. They can be made of plastic, Made of metal or ceramic, for example made of an elastomer. Alternatively or optionally, the use of joining agents possible to seal. To these sealing joins include glasses, solders and adhesives. The adhesives can be electrically conductive, preferably electrically be insulating.

about the inventive arrangement of the seal between the Wärmeleitkörpern adjacent diode laser components In addition, the further course of the seal is not limited in principle with the proviso that they lead to an inclusion of the coolant in the way that contributes to a leakage of the coolant is prevented in the diode laser stack.

So is another course of the seal both on the top of the plate and / or the underside of the plate as well as alternatively or optionally via inclined to the upper and lower sides of the plates and between the upper and sub-levels arranged plate side surfaces possible as well as alternatively or optionally via the rear surface facing away from the heat receiving portion the heat conduction plate.

So For example, the sealing surface may be so on the transition section be arranged to heat flow from the heat receiving portion completely surrounded around the heat release section. The orientation of the sealing surface normals can be both vertical to the emission direction, that is, for example, in sections parallel to the stacking direction, as well as parallel or antiparallel (opposite) to the direction of radiation. The latter variant can by a trained as a sealing flange transition section be enabled.

By the solution according to the invention is so advantageously possible, an exchange of a diode laser component by removing it from the stack composite without the rest Remove diode laser components from the stack composite. A release of the seal is doing with a movement of the Diodenlaserbauelementes in the direction of radiation associated with that of limited to any other diode laser device of the stack becomes.

Possibly is the receiving surface opposite a top side Main surface of the heat conducting and / or the counter surface against a lower side major surface in plate thickness zueinan the arranged offset, for example by the top plate and / or the underside of the plate is stepped.

Preferably is the heat receiving portion of the heat conduction both in thickness and width greater than the heat release portion the heat conducting plate, wherein the transition from the heat receiving portion to the heat dissipation section stepwise over a inclined, preferably perpendicular to their normal against the Direction of radiation oriented, the plate in full surrounding, transition surface is carried out as inventive Sealing surface is used.

Vice versa can also change the width and thickness of the heat-dissipating section larger than those of the heat receiving section, the transition surface with its normal in Direction of radiation oriented forms the sealing surface.

In addition, the largest width and thickness may be limited to a transition portion between the heat receiving and heat-emitting portion, its outstanding on the heat absorption and heat-emitting portion both on its the Laserdiodenelement zugekom turned as well as on their side facing away from the laser diode element side can be used as sealing surfaces.

alternative or optionally, on the heat-conducting body in a transition area between the heat receiving section and heat dissipation portion attached auxiliary body contribute to the formation of a sealing surface. So, for example shrunk a ring whose between the inner and the outer Lateral surface located a sealing surface can form.

mixed variants between this and the previous one provide that either the width or the thickness of one of the named Wärmeleitkörperabschnitte larger than the other and the heat-conducting body portion, whose cross-section is larger, two opposite each other at the transition region to the other Wärmeleitkörperabschnitt has adjacent mounted auxiliary body, which leads to a Enlargement of the complementary extension - thickness or width - contributes. The sealing surface is then alternately from the partial sealing surfaces of the relevant Wärmeleitkörperabschnittes and Teildichtflächen composed of the auxiliary body.

A Another variant of the formation of the seal provides an additional body before, between the heat receiving portion and the heat emitting portion is arranged and over the heat receiving portion and heat dissipation section cohesively connect. In this case, the additional body protrudes on all sides at least one of the Wärmeleitkörperabschnitte in its width and thickness direction. The excellent Areas can in turn be on both the laser diode element facing away as well as on its side facing away from the laser diode element Side can be used as sealing surfaces.

in the However, the simplest case is the sealing surface of the heat-conducting body circulating in a transition region between the heat receiving section and Heat release section formed without one of the Wärmeleitkörperabschnitte in terms of its width and thickness over the other Wärmeleitkörperabschnitt is different, wherein the normal of the sealing surface is always perpendicular to the radiation direction is oriented.

According to the invention a fluidically parallel coolant supply to a first and at least a second group of diode laser devices. Preferably, the number of flow is parallel flows through groups greater than two. Preferably it is fluidically parallel coolant supply to every other of the diode laser components and at least one fluidically parallel coolant removal at least every other of the diode laser devices. As an illustration such a preferred course of the coolant flow through a diode laser stack with 10 diode laser devices each diode laser component of the stack in the stacking direction continuously provided with a number. The diode laser components are then split into two groups: a first group of odd numbers and a second group of even numbers. These are diode laser components the first group each next to each other adjacent and by a respective diode laser component of the second family of separated from the immediate neighborhood. Likewise, diode laser components the crowd group each next to each other adjacent and by a respective diode laser element of the Schar group of the separate immediate neighborhood. Each diode laser device the first group (with the exception of No. 1) are parallel and antiparallel to the stacking direction in each case one diode laser component of the second Group immediately (directly) adjacent. Each diode laser device the second family are parallel and antiparallel to the stacking direction in each case a diode laser component of the first group directly (directly) adjacent.

According to the invention for example, a parallel coolant supply to each Diode laser device of the first family of diode laser devices and a parallel coolant discharge from each diode laser device the second family of diode laser devices. The coolant is in Stack of diode laser devices of the first family to the neighboring ones Diode laser components of the second family of flow transferred serially. The inventive Seal prevents leakage of the coolant.

Vice versa can of course also a parallel coolant supply to each diode laser device of the second family of diode laser devices and a parallel coolant discharge from each diode laser device the first group of diode laser devices take place.

The number of flow-parallel-through groups of diode laser components according to the invention corresponds to the total number of diode laser components ( 10 ) divided by the number of serially flowed through crowds ( 2 ), namely: five. The group strength of flow-through in accordance with the invention in parallel corresponds to a number of diode laser components in the amount of the number of flocks - in other words: two.

Such an arrangement has the advantage that inlet and outlet openings of the coolant supply and discharge device larger and with a greater distance to may be formed each other than in parallel coolant supply and discharge to each of the diode laser devices in the stack.

Nonetheless Of course, according to the invention both the coolant supply fluidly parallel to each of the diode laser components as well as the coolant discharge fluidically parallel of each of the diode laser components respectively. In this case, for example, a gap between each other adjacent diode laser devices for the coolant flow be provided. For example, the coolant is backward fed into each of the diode laser elements, it may over the gaps leave the stack again, and vice versa. The seal of the invention prevents it leakage of the coolant.

Farther For example, the coolant in each diode laser device divide into two portions, which are in opposition to each other Drain gaps and there with the Coolant portions of the adjacent diode laser components unite.

About that In addition, it is possible to clear the gaps both at the coolant supply to the diode laser elements as also for coolant removal from the diode laser elements to contribute. This can on the one hand while maintaining the coolant flow or on the other hand, with the distribution of the refrigerant in two portions respectively. The coolant can through breakthroughs in the heat-dissipating portions of the diode laser devices flow through to the adjacent intermediate on the to reach the opposite side.

After all the gaps can be used to one Induce flow reversal in the diode laser stack. For this purpose, for example, in each diode laser component there is a first group recesses and a second set of recesses. The Coolant flows in the first group of recess in the direction of radiation through the heat-emitting section, in one or both adjacent spaces and from there in the second group of recesses, which are opposite to the direction of radiation flows through.

The inventive seal prevents it Leakage of the coolant.

According to the invention the coolant supply and discharge device for fluidic parallel coolant distribution on the cooling channels the fluidically connected in parallel groups of Diodenla serbauelementen as well as to the coolant collection from the cooling channels the fluidically parallel groups of Diode laser devices at. For this purpose, the coolant supply and Suction device sections as a coolant distribution unit and coolant collection unit. Both units can as a coolant guide unit be summarized.

Due invention it is advantageously possible, the coolant guide unit wholly on the opposite of the radiation emission Side of the diode laser stack. This is basically not only almost unlimited stack heights possible, but also the field arrangement of several, in principle, almost arbitrary many diode laser stack next to each other possible.

there For example, the coolant guide unit may be a chamber have a receiving opening over the the heat emitting portions of the diode laser devices in the chamber are inserted. A to the sealing surface on the heat conducting body corresponding counter-sealing surface, via the seal according to the invention to a closure of the chamber is formed, can in sections be arranged on the coolant guide unit. For example, it may be in the edge region of the receiving opening be arranged the chamber and receiving opening on the outside surrounded or inside the chamber. It can the Diodenlaserstapel introduced in sections in the chamber or each individual diode laser component in sections a separate chamber. Partitions between adjacent chambers can be a part of the invention Form seal between adjacent diode laser devices.

Heat source side, the chamber has at least one invention (inner) coolant outlet for coolant supply the diode laser components or the diode laser stack on and at least one inventive (inner) Kühlmitteleinass for coolant absorption of the Diode laser devices or the diode laser stack.

The Chamber has heat sink side openings or Breakthroughs to an external coolant inlet and coolant outlet of the coolant guide unit on, over which the chamber flows with a Coolant to be supplied and via the flowing Coolant can escape from the chamber. Lies several Chambers for the heat-emitting sections of several Wärmeleitkörper of laser diode elements in one Stack, row or array arrangement, so each chamber can each a first breakthrough to a common to the several chambers Have Kühlmittelzuführkanal having an outer Inlet has, as well as in each case a second breakthrough to a the multiple chambers common Kühlmittelabführkanal have, which has an outlet.

In analogously, a chamber containing the heat release sections several Wärmeleitkörper receives, several first Breakthroughs to a common Kühlmittelzuführkanal having an outer inlet, and a plurality of second openings to a common Kühlmittelabführkanal, which has an outer outlet.

The Coolant can be either gaseous or liquid be. In particular, optionally, the use of a liquid or gaseous coolant possible. It may also have both phases mixed, for example as steam or gas bubbles in a liquid. A phase transition of a coolant from one liquid to a gaseous phase when shooting the heat in the recesses according to the invention is also possible.

In In this sense, the coolant flow in the Radiation emission arrangement and the coolant supply and -Discharge completed and done freely, so that the radiation source is designed as a heat pipe, in which a cooling liquid in the recesses evaporated and the radiation emission arrangement on the Leaves coolant flow passages in vapor form. The coolant vapor condenses in the coolant supply. and -abführeinrichtung and is in liquid form by capillary forces from the coolant supply and Discharge device back into the invention Drawn recesses of the radiation emission assembly.

on the other hand can the flow of coolant through external Means be enforced. For gaseous coolants can both fan and gas pressure increasing Pumps are used. For liquid coolants can vary depending on the flow (coolant throughput volume per unit of time), pressure loss via the radiation source, Temperature as well as viscosity, density and other properties the coolant different pumps are used. Of the Completeness is based on the possibility of use referred to liquid metals as coolant, the suggest the use of a magneto-hydrodynamic pump.

Examples for gaseous coolants are air, nitrogen, Argon and its mixtures, examples of liquid non-metallic coolants are water, glycol, ethanol, Methanol, ammonia and their mixtures, examples of liquid Metallic coolants are mercury, gallium and eutectic Mixtures of gallium, indium and tin as well as sodium and potassium.

The Moreover, the radiation source according to the invention allows an advantageous method for their commissioning and testing individual inventive semiconductor components before the production of the radiation emission arrangement according to the invention from several of these semiconductor modules according to claim 30th

To is the respective semiconductor module separately to a Coolant supply and discharge device connected, which together with the semiconductor module is part of a coolant circuit. About the Inventive sealing surface on the heat conducting body the semiconductor assembly is at least partially a seal, the inclusion of the coolant in the coolant circuit contributes. Thereafter, functional tests of the radiation-emitting Semiconductor device performed by the semiconductor device is connected to a power source and at least one physical Parameters of the radiation-emitting semiconductor component in Form of a measured value is detected. These parameters include For example, the electrical operating current, the electrical operating voltage, the emitted radiation power as well as the spectrum and the spatial Profile of the emitted radiation.

These Function tests can be performed repeatedly be, for example at intervals, the to be used to test the semiconductor device test. With the parameters obtained from the functional test, the suitability the semiconductor device with regard to its use in the radiation source assessed and rated the semiconductor device itself become. This qualification procedure allows you to choose from a variety of tested semiconductor devices only those for to select the radiation emission arrangement that corresponds to the Application operation to the radiation source requirements all in all.

following The invention is still based on embodiments explained in more detail. Show this

1a 2 is a schematic oblique view of the heat conducting body of the first variant of a diode laser component of a first embodiment of the radiation source according to the invention,

1b 2 is a schematic oblique view of the first variant of the diode laser component of the first exemplary embodiment of the radiation source according to the invention in a partially exploded view;

1c FIG. 2 a schematic oblique view of a second variant of a diode laser component of the first embodiment of the radiation source according to the invention, FIG.

1d 2 is a schematic oblique view of an exploded view of a coolant supply and discharge device of the first and a seventh embodiment of the radiation source according to the invention,

1e 2 shows a schematic cross-sectional view of a detail of the radiation source according to the invention of the first exemplary embodiment with diode laser components of the first variant,

2a 2 is a schematic oblique view of an exploded view of a section of a radiation emission arrangement of a second embodiment of the radiation source according to the invention,

2 B 2 is a schematic oblique view of an exploded view of a coolant supply and discharge device of the second and a fifth embodiment of the radiation source according to the invention,

2c a schematic cross-sectional view of a section of the radiation source according to the invention of the second embodiment,

3a a schematic oblique view of the main body of a heat conducting body of a third embodiment of the radiation source according to the invention,

3b a schematic oblique view of the heat conducting body of the third embodiment of the radiation source according to the invention,

3c FIG. 2 a schematic oblique view of an exploded view of a coolant supply and removal device of the third embodiment of the radiation source according to the invention, FIG.

4a 2 is a schematic oblique view of an exploded view of a detail of a radiation emission arrangement of a fourth exemplary embodiment of the radiation source according to the invention;

4b 2 is a schematic oblique view of an exploded view of a coolant supply and removal device of the fourth exemplary embodiment of the radiation source according to the invention,

4c a schematic cross-sectional view of a section of the radiation source according to the invention of the fourth embodiment,

5a a schematic plan view of a diode laser component of a fifth embodiment of the radiation source according to the invention,

5b a schematic rear view of the diode laser component of the fifth embodiment of the radiation source according to the invention,

5c a schematic cross-sectional view of a section of the radiation source according to the invention of the fifth embodiment,

6a 2 is a schematic oblique view of a diode laser component of a sixth exemplary embodiment of the radiation source according to the invention;

6b a schematic rear view of a radiation emission arrangement of the sixth embodiment of the radiation source according to the invention,

6c a first schematic plan view of a coolant guide plate of a coolant supply and discharge device of the sixth embodiment of the radiation source according to the invention,

6d a second schematic plan view of the coolant guide plate of the coolant supply and discharge device of the sixth embodiment of the radiation source according to the invention,

6e a schematic plan view of coolant connections of the coolant supply and discharge device of the sixth embodiment of the radiation source according to the invention,

6f a schematic plan view of the radiation source according to the invention of the sixth embodiment,

6g a schematic cross-sectional view of an irradiation device according to the invention,

7a FIG. 2 a schematic oblique view of a diode laser component of a seventh exemplary embodiment of the radiation source according to the invention, FIG.

7b FIG. 2 a schematic oblique view of a section of a radiation emission arrangement of the seventh exemplary embodiment of the radiation source according to the invention, FIG.

7c a schematic oblique view of the radiation emission arrangement of the seventh embodiment of the radiation source according to the invention,

7d a schematic oblique view of an exploded view of a coolant supply and discharge device of the seventh embodiment the radiation source according to the invention with a first schematic oblique view of a coolant guide plate of the coolant supply and removal device,

7e a second schematic oblique view of the coolant guide plate of the coolant supply and discharge device of the seventh embodiment of the radiation source according to the invention,

7f a schematic cross-sectional view of a section of the radiation source according to the invention of the seventh embodiment,

8a 2 is a schematic oblique view of a diode laser component of an eighth exemplary embodiment of the radiation source according to the invention,

8b FIG. 2 a schematic oblique view of an intermediate piece for arrangement between two diode laser components in a radiation emission arrangement of the eighth exemplary embodiment of the radiation source according to the invention, FIG.

8c a schematic front view of a coolant supply and discharge device of the eighth embodiment of the radiation source according to the invention,

8d a schematic rear view of the coolant supply and discharge device of the eighth embodiment of the radiation source according to the invention,

8e a schematic oblique view of the radiation source according to the invention of the eighth embodiment,

8f a schematic cross-sectional view of the radiation source according to the invention of the eighth embodiment,

9a FIG. 2 a schematic oblique view of a diode laser component of a ninth exemplary embodiment of the radiation source according to the invention, FIG.

9b a schematic oblique view of a radiation emission arrangement of the ninth embodiment of the radiation source according to the invention,

9c a schematic cross-sectional view of the radiation source according to the invention of the ninth embodiment,

10a 2 is a schematic oblique view of a diode laser component of a tenth embodiment of the radiation source according to the invention,

10b a schematic cross-sectional view of a section of the radiation source according to the invention of the tenth embodiment,

11a FIG. 2 a schematic oblique view of a solar module of an eleventh exemplary embodiment of a conversion unit according to the invention designed as a photovoltaic radiation receiver, FIG.

11b a schematic plan view of the photovoltaic radiation receiver according to the invention of the eleventh embodiment and

11c a schematic cross-sectional view of a solar concentrator according to the invention.

Same or similar elements are in the figures with the same Provided with reference numerals.

In the following embodiments, the coolant outlet of the present invention facing the radiation emission device becomes the coolant supply and discharge device through an intake side coolant expansion groove 45a or a plurality of inflow-side Kühlmittelspreiznuten 45a or an inlet-side coolant guide opening 46a or a plurality of inlet-side coolant supply openings 46a educated. The term "inlet side" is to be understood in the sense that the coolant outlet of the coolant supply and removal device for radiation emission arrangement forms a coolant inlet.

Analogously, the invention the radiation inlet assembly facing away from the coolant inlet of the coolant supply and discharge device by a drain-side Kühlmittelspreiznut 45b or a plurality of drain-side Kühlmittelspreiznuten 45b or a drain-side coolant guide opening 46b or more drain-side coolant supply openings 46b educated. The term "downstream side" is to be understood in the sense that the coolant inlet of the coolant supply and removal device for radiation emission arrangement forms a coolant outlet.

Inlet side coolant distribution or spreading elements 42a . 45a . 46a . 47a . 47'a and 48a , Be together with the drain-side coolant collection or constriction elements 42b . 45b . 46b . 47b . 47'b and 48b Flow direction independently referred to as coolant guide elements, wherein the elements as grooves, apertures, channels, chambers, etc. may be formed and designated.

Of the arrangement or An proper direction signs 35 . 35a . 36 and 36a show the arrows 35 and 36 an arrangement that extends in the plane of the drawing. and the symbols 35a and 36a an arrangement that extends perpendicular to the plane of the drawing. The arrangement marks 35 and 35a refer to a stacked arrangement of the semiconductor devices and the arrangement symbols 36 and 36a on a row arrangement of the semiconductor modules. The characters, that is, the arrows and symbols, are used synonymous with the directions they indicate, and vice versa.

in the The following will be the first embodiment in terms on a mediation of understanding of the invention especially described in detail. The explanations below Embodiments will be detailed only in the manner which takes into account the distinction from the first embodiment. Incidentally, already at this point anticipatory and representative of the embodiments two to eight on the general character of the first Reference example, the other to her Interpretation can be consulted, where necessary and useful, for example, in the case of non-illustrated reference numerals and features. Moreover, the list of reference numerals referenced following the embodiments.

FIRST EMBODIMENT

Components of the first embodiment of a radiation source according to the invention 50 and a cross section through a portion of this radiation source 50 are in the 1a . 1b . 1d and 1e for a first variant, a diode laser component 20 shown. A second variant of the diode laser component 20 , which may alternatively be used instead of the first variant, shows 1c , The heat-conducting body 21 for the first variant of the diode laser component 20 is a T-shaped CVD diamond plate as Wärmeleitgrundkörper 21 ' , on the remote in the lower leg region of the upper leg metallization 28 is applied, extending from a formed as a plate top first outer surface 22 the plate 21 ' extends over a front end face of the front side of the plate onto a second outer face, which is formed as a plate underside and which is opposite the first outer face ( 1a ). In the lower leg of the plate 21 ' are a plurality of mutually parallel recess 26 introduced, on the one hand from the top of the plate 22 extend to the underside of the plate and on the other hand against the direction of radiation 15 to the one of the front surface opposite rear end surface on the back of the plate. The recesses 26 thus have both openings 27 in the first outer surface 22 on the top of the plate, openings in the second outer surface on the underside of the plate as well as openings in the rear end surface 23 on the back of the plate, via which a coolant can be introduced into the recesses and / or removed from the recesses.

A laser diode bar 10 has a first contact surface on a first side 11 and on one of the first side opposite the second side opposite to the first contact surface second contact surface 12 ,

On the metallization 28 is such a laser diode bar 10 from his first contact area 11 fastened by applying the method described in the patent DE 196 44 941 C1 described method via a Lotfuge with the heat-conducting body at the heat receiving surface 21 * is integrally connected ( 1b ). The composite of laser diode bars and heat conducting body is called a diode laser device 20 designated. During operation, the laser diode bar emits light 10 or the diode laser component 20 Near infrared light in a direction of radiation 15 which are perpendicular to the normal of the two contact surfaces of the laser diode bar 10 is aligned. The metallization 28 forms a first electrical contact for the laser diode bar 10 while an electrical connection element 29 at the second contact surface 12 of the laser diode bar 10 is firmly bonded, forms a second, opposite to the first electrical contact contact. The thickness of Metalli tion is in the range of 5 microns to 200 microns, consists essentially of copper, and is at least partially prepared by electrodeposition on a base metallization.

During operation of the laser diode bar, all of its light-emitting emitters form heat sources, the heat of which for the most part covers the heat-receiving surface 21 * the metallization 28 from the heat-conducting body 21 is recorded.

In the heat conducting body 21 lie between the recesses 26 cooling fins 26 ' via whose outer / inner surfaces heat can be delivered to a flowing through the recesses coolant. In the technical-constructive sense, the recesses are limited by the cooling fins and vice versa. The mutually facing inner surfaces of two adjacent cooling fins are thus assigned to a common recess and as heat dissipation surfaces according to the invention 26 * to watch. As shown by the brackets in 1b indicated, the heat-conducting body can be 21 divided into three sections: a heat absorption section 21a that the heat receiving surface 21 * carries a heat dissipation section 21c , the recesses 26 and cooling fins 26 ' includes and a Wärmeleitabschnitt 21b between the heat absorption cut 21a and the heat releasing section 21c is arranged.

All sections each extend from the top of the heat conducting body to its underside. All of these heat sources comprehensive heat source projection of the laser diode bar 10 in to the heat receiving surface 21 * vertical direction is - except for one through an optionally in the radiation direction 15 present bar overhang caused empty area - completely in the heat receiving section 21a , Both the Wärmeleitabschnitt 21b as well as the heat dissipation section 21c lie with respect to the heat receiving portion 21a in a direction of heat radiation opposite to the direction of radiation and thus completely outside the heat source projection.

At the Wärmeleitabschnitt 21b is an intermediate piece on the top side 34 and underside in intermediate piece 34a each attached cohesively. The intermediate pieces 34 and 34a can thus be considered part of the Wärmeleitkörpers 21 look at. The rear, opposite to the radiating direction, end surfaces of the upper leg of the T-shaped CVD diamond plate 21 ' the heat conducting body and the intermediate pieces 34 and 34a together form a sealing surface 24 that the heat conduction body 21 , especially its heat conduction area 21b completely surrounded.

Alternatively, the spacers 34 and 34a as not to the heat-conducting body 21 Belonging considered, so can the top and bottom mounting surfaces for the spacers in the region of the Wärmeleitabschnitts 21b be taken as a sealing surface according to the invention.

While in the described first variant of the diode laser component 20 All three thermal sections of the Wärmeleitkörpers 21 to one and the same basic body 21 ' belong, is the heat meleitkörper 21 the in 1c illustrated second variant of the diode laser component composed of three different cohesively interconnected components, each corresponding to a heat-technical portion of the heat conducting body and therefore also be referred to as such: The Wärmeleitabschnitt 21a is provided by an electrically conductive copper-tungsten composite. As the material of the heat receiving section 21a is electrically conductive, can on a heat receiving portion 21a surrounding metallization, which ensures the flow of heat from the bottom of the heat-conducting body on the upper side of the heat-conducting, are waived principle.

The thermal expansion coefficient of this composite does not deviate by more than 50% from that of the laser diode bar 10 from, so that a cohesive mounting means of a refractory solder, for example by means of a gold-rich eutectic gold-tin solder, the laser diode bar on the Wärmeleitabschnitt is possible without damaging the laser diode bar.

The heat conduction section 21b is through a plate 21b made of Berylliumoxidkeramik whose plate plane, top and bottom perpendicular to the heat conduction and to the radiation direction 15 lies. Optional metallizations on the top and bottom of the plate 21b may be a solder joint with the heat receiving portion 21a and the heat releasing section 21c facilitate. Instead of a Berylliumoxidkeramik the plate 21b also be a three-layer system consisting of an aluminum nitride ceramic layer between two copper layers each having the same layer thickness as the aluminum nitride ceramic layer. Both plate variants, BeO and Cu-AlN-Cu, have a thermal expansion coefficient of not more than 50% of that of the heat receiving section 21a deviate, so that a low-stress solder joint between the heat receiving portion 21a and the Wärmeleitabschnitt 21b is possible.

On the heat receiving section 21a opposite side of the Wärmeleitabschnitts 21b is a heat release section 21c , by one from the published patent application DE 197 01 680 A1 known diamond body 21c is provided at the Wärmeleitabschnitt 21b attached. This diamond body 21c has two groups of mutually parallel recesses 26 and 26a each extending from opposite end surfaces in sections past each other in the direction of the respective opposite end face (which in 1c visible back end face is with 23 designated). The distance between two mutually immediately adjacent mutually external recesses 26 and 26a corresponds to half the smallest distance between two group-like recesses 26 respectively 26a , The recesses of both groups of recesses 26 and 26a also extend from the top to the bottom, which are oriented perpendicular to the end surfaces of the diamond plate 21c so they have openings 27 in the top and bottom possess. The recesses 26 and 26a thus provide a concertina-shaped formation of the diamond body 21c , which absorbs only a relatively small mechanical stress on a parallel to the end surfaces, top and bottom mechanical deformation. This allows the diamond body 21c although it has a coefficient of thermal expansion which is greatly different from those of the heat receiving portion 21a , the heat conduction portion 21b and the laser diode bar 10 deviates, mechanically low stress on the Wärmeleitabschnitt 21b via a solder joint - for example, a Aktivlötverbindung that requires no metallization of the joining partners - attach.

Alternatively, instead of diamond, the heat-dissipating section can also be made of copper, whose thermal expansion coefficient is also very much that of the laser diode bar 10 differs.

Between group-like recesses are cooling fins 26 ' and 26'a before, which extend in the heat conduction direction. A coolant guide may be configured such that the coolant is forced through both groups of recesses 26 and 26a to flow before leaving the diamond body. The heat conduction section 21b forming plate 21b possesses at the the diamond body 21c facing side a sealing surface 24 representing the bonding surface of the diamond body 21c completely surrounded.

Both the first and the second variant of in 1b and 1c Diode laser devices shown 20 may alternatively and similarly for the inventive, radiation source 50 be used.

diode laser components 20 The first variant are to training a diode laser stack 30 as a radiation emission arrangement in a stacking direction 35 arranged one above the other in an arrangement plane in which the stacking direction 35 lies and perpendicular to the direction of radiation 15 is ( 1e ).

To the radiation source 50 also includes a coolant supply and discharge device 40 containing a coolant distribution unit 41 , a cover plate 43 and a coolant port plate 42 having ( 1d ). The cover plate 43 and the coolant port plate are sealing on opposite sides (top and bottom) of the coolant distribution unit 41a attached. The coolant distribution unit 41a has elongated receiving recesses in cross-section 44 extending from the top of the coolant distribution unit 41a in the direction of the underside of the coolant distribution unit opposite the top side 41a extend and with a tapered in cross-section stepped end, which - depending on the flow direction of the coolant - as the inlet-side Kühlmittelspreiznut 45a or drain-side Kühlmitteleinschnürungsnut 45b (collectively as Kühlmittelführungsnuten 45a and 45b designated) acts, complete in a small distance from the bottom.

The receiving recesses 44 are perpendicular to their longer cross-sectional dimension adjacent to each other in the stacking direction 35 arranged and separated from each other by walls 44 ' spaced. The walls end in a direction to the top of the coolant distribution unit facing direction at a certain distance from the top.

The upper side with respect to the coolant distribution unit arranged cover plate 43 has heat-conducting body openings 49 whose cross-section that of the receiving recesses 44 is similar. The cover plate 43 is so on top of the coolant distribution unit 41a positioned that their Wärmeleitkörperaufnahedurchbrüche 49 the receiving recesses 44 lie opposite.

The between the Wärmeleitkörperaufnahmitturchbruch 49 arranged webs lie the end faces of the walls 44 ' due to the offset of the end faces from the top, there is a void between each land and each end face serving as the coolant flow passage 37 between adjacent receiving recesses 44 serves.

About in 1d invisible coolant supply openings 46a and 46b are alternately each second receiving recesses 44 open towards the bottom. The coolant guide grooves 45a and 45b thereby promote the spread of the coolant over the larger of the cross-sectional dimensions of the receiving recesses 44 , For manufacturing reasons, the coolant distribution unit 41a be composed of several parts, wherein an interface between the Kühlmittelführungsnuten 45a / 45b and the receiving recesses 44 lies. To convey an idea of the position of the coolant supply openings 46a and 46b with respect to the Kühlmittelführungsnuten 45a respectively. 45b will be on the 7e of the seventh embodiment referred. The coolant guide breakthroughs 46a lie on an inlet-side coolant distribution channel 47a in the coolant connection plate 42 why they as inflow-side coolant supply breakthroughs 46a be designated. The coolant guide breakthroughs 46b lie a drain-side coolant collection channel 47b in the coolant connection plate 42 why they as inflow-side coolant supply breakthroughs 46b be designated.

Via the inlet-side coolant distribution channel 47a becomes the upstream coolant supply openings 46a during operation of the radiation source 50 Supplied coolant. It pours from there into the inlet-side Kühlmittelspreiznut 45a and continue in recording recesses 44 a first inflow-side group of receiving recesses 44 , Starting from closed Wärmeleitkörperaufnahedurchbrüchen 49 is in each of these receiving recesses 44 the coolant in two Portions divided, wherein a first portion of coolant via a left adjacent coolant flow passage 37 in a left adjacent receiving recess 44 and a second portion of coolant via a right adjacent coolant flow passage 37 in a right adjacent receiving recess 44 flows. Left and right adjacent receiving recesses 44 belong to a drain-side group of receiving recess 44 , from which the coolant via drain-side Kühlmitteleinschnürungsnuten 45b , drain-side coolant supply openings 46b and finally, the drain side coolant collecting passage 47b the radiation source leaves. The coolant flow path is through the coolant flow direction arrows 25 in 1e illustrated.

As continues in 1e As can be seen, is any diode laser device 20 integrated into the coolant guide by the through the recesses 26 formed cooling channels are flowed through by the coolant. For this purpose, each of the heat dissipation section 21c of the diode laser component 20 via a Wärmeleitkörperaufnaheddurchbruch 49 in a receiving recess 44 the coolant guide unit 41a introduced and abuts with its rear end face 23 to the projection, passing through the opposite of the receiving recess 44 in cross-section tapered Kühlmittelführungsnut 45a / 45b provided. Optionally, between end face 23 and projection to be introduced a joining agent. One between the sealing surface 24 of the diode laser component 20 and the top of the cover plate 43 introduced joining agent 33 provides a seal and a closure of the coolant flows through spaces 47a . 46a . 45a . 44 . 37 . 45b . 46b and 47b ,

The at the the heat conducting body 21 opposite side of the laser diode bar 10 fixed electrical connection element 29 is referring to that U.S. Patent No. 5,909,458 equipped with a structural flexibility that allows it to mechanically yield stress-free deformation in the stacking direction. It is thus able to tolerate the distances between adjacent Wärmeleitkörperaufnahedurchbrüchen 49 balance and at the same time the metallization 28 the adjacent Wärmeleitkörpers 21 over a layer of electrically conductive adhesive 31 to contact.

In the radiation source of the first embodiment are the diode laser components 20 in two flow-connected series serially, wherein the individual diode laser components 20 each to the half of the distance in the stacking direction 35 are offset between the diode laser components 20 a common crowd. In this respect no more than two diode laser components each 20 of the diode laser stack 30 flow-through serially. In the first group, the flow is through the cooling channels 26 essentially in the direction of radiation 15 and against the heat conduction direction, in the second family, the flow is in the opposite direction of the radiation 15 in thermal direction. This is made possible by (a) the coolant flow passages providing the serial flow flow 37 that between the heat receiving section 21a facing ends of the cooling channels and (b) through the walls 44 ' the coolant distribution unit 41a Moreover, they shield the cooling channels of adjacent diode laser components from each other from loss of coolant. The number of groups of diode laser devices 20 in the diode laser stack 30 flowing in parallel flow, determined by the total number of diode laser devices 20 in the diode laser stack divided by the number of flocks of two. The group strength corresponds to the number of flocks, ie in each case two diode laser components 20 ,

The present embodiment is based on the inflow-side division of the coolant flow into two coolant portions in diode laser components of the first family, which flow to two neighboring diode laser components of the second family and unite there with the coolant portions of the next but one neighbors of diode laser components of the first family. An alternative, not shown, embodiment provides that the coolant in each flow-parallel through-flow group of diode laser devices unportioned and completely each of a diode component 20 to flow the first family to an adjacent diode laser component of the second family. This is the coolant flow passage 37 between two adjacent groups closed or non-existent, while it is retained or provided within each group between the diode laser components of the two coulters.

In this case, the flow direction in the coolant flow passages 37 two adjacent groups oriented in the same direction or oriented in the opposite direction. The latter variant has the advantage that the Kühlmittelführungsdurchbrüche 46a respectively 46b for Kühlmittelzu- or discharge of two adjacent diode laser components and put together as a common for both diode laser components Kühlmittelführungsdurchbruch 46a respectively 46b can be trained. This finding is generally applicable to the coolant inlets and outlets according to the invention.

SECOND EMBODIMENT

From a second embodiment of the radiation source according to the invention 50 shows 2a a section of a diode laser stack 30 in exploded view. The diode laser device 20 has a heat-conducting body 21 , the metallization on the heat receiving section 28 made of copper and consists essentially of cubic boron nitride. On the metallization 28 is on the upper side at the edge to the front a laser diode bar 10 soldered. Outside the projection of the laser diode bar 10 perpendicular to the top surface 22 the Wärmeleitkörpers 21 are in the direction of radiation 15 opposite heat conduction a plurality of mutually parallel in the radiation direction 15 extensive recesses 26 inserted, extending from the top 22 to the underside of the heat conducting body 21 extend and back are open so that they can absorb or give back coolant. On both sides of this field of recesses 26 , in parallel to the top and to the radiation direction 15 vertical direction, each extending a Wärmeleitkörperbereich 1 mm beyond the rear end faces of the cooling fins. These Wärmeleitkörperverlängerungen give the heat-conducting body 21 a U shape. The between the end surface plane of the cooling fins 26 ' and the end surface plane of the outstanding Wärmeleitkörperbereiche lying space is in the radiation source 50 ( 2c ) as a chamber for the inlet-side coolant spread 48a or drain-side coolant constriction 48b intended.

The surface area of the heat conducting body 21 between the recesses and the mounting surface of the laser diode bar 21 serves as sealing surface both on the upper side and on the underside 24 , in addition, sections of the recesses 26 and extending the Wärmeleitkörperverlängerungen. The seal in the diode laser stack 30 via intermediate pieces 34 , which are introduced between adjacent diode laser components and in each case via a first electrically insulating, that is: electrically non-conductive, adhesive layer 33 at the top of the heat conducting body of a first diode laser component and via a second electrically insulating, that is: electrically non-conductive, adhesive layer 33a at the bottom of the heat conducting body 21 one, the first diode laser component adjacent, second diode laser component are mounted flat. The spacers are formed as alumina ceramic foils of 100 microns thickness, although glass or plastic films can alternatively be used. They each have an elongated opening 37 acting as a coolant flow passage 37 in the radiation source 50 serves and between the rear side facing away from the end portions of the recesses 26 adjacent heat conducting body is arranged ( 2c ). That of the opening 37 facing away, rear end of the intermediate piece 34 extends in Wärmeleitrichtung 500 microns over the ends of the Wärmeleitkörperverlängerungen and 1.5 mm over the ends of the cooling fins 26 ' out.

An in 2 B shown coolant supply and discharge device consists of a coolant distribution plate 41 and a coolant connection plate 42 , which are materially connected to each other.

The coolant distribution plate has in a first plate half a first row inlet side coolant supply openings 46a on and in a second plate half a second row of drain-side coolant supply openings 46b which are arranged parallel to the first row and in the row direction to the upstream side coolant supply openings 46a each offset by half the length of their mutual distance. As narrow grooves with a width of about one-tenth of this distance extending receiving recesses 44 in the top of the plate perpendicular to the row direction in pairs between the coolant guide openings 46a / 46b from the first plate half into the second plate half, each on a first groove side in the first plate half with an inlet-side coolant guide opening 46a the first row and in the second plate half on a, the first groove side opposite, second groove side with a drain-side coolant guide opening 46b merge.

In the top of the plate of the plate underside of the coolant distribution plate 41 opposite coolant distribution plate 42 lie on a supply side coolant distribution channel 47a the inlet-side coolant supply openings 46a and a downstream coolant collection channel 47b drain-side coolant supply openings 46b across from. By connecting the two plates 41 and 42 can these recesses 47a / 47b and 46a / 46b communicate with each other accordingly.

The receiving recesses 44 serve to receive the end portions of the spacers 34 , via the rear, that is, the laser diode bar opposite end of the Wärmeleitkörpers 21 protrude. The same adhesives of the layers 33 and 33a here ensure a seal of the coolant transfer from the inlet-side coolant supply openings 46a in the coolant expansion chambers 48a in which the coolant is on the cooling channels 26 is distributed in the heat conducting body, and of the Kühlmittelseinschnürungskammern 48b in which the coolant is collected from the cooling channels, in the drain-side coolant guide openings 46b ,

The coolant flow path through the diode laser components 20 the radiation source 50 runs fluidically identical to that in the first embodiment: There are two serially traversed flocks of diode laser devices 20 , in which, in the stacking direction side by side, flow-parallel through-flow groups of two diode laser components 20 are divided.

THIRD EMBODIMENT

The main body 21 ' the Wärmeleitkörpers 21 for the radiation source 50 of the third embodiment corresponds to the component of the heat-dissipating portion 21c the second variant of the Wärmeleitkörpers 21 of the first embodiment (shown in FIG 1c ): The main body is a concertina-shaped diamond plate, in which two groups of recesses 26 and 26a extend from opposite side surfaces of the plate in opposite directions and are entangled, so that the recesses of group foreign recesses are each arranged alternately adjacent to each other in sections adjacent ( 3a ). This design gives the diamond plate a structural resiliency in a width direction perpendicular to said extension of the recesses. This property can be achieved by means of a cohesive combination of the diamond body with plates of material having a higher coefficient of thermal expansion than that of the intended for mounting laser diode element 10 to be exploited, a heat-conducting body 21 to create whose thermal expansion coefficient in the width direction of the laser diode element corresponds at least to the extent that it deviates from it not more than 50%. This measure is for example from the patent US 5,848,083 and the publication DE 100 11 892 A1 known.

In the present embodiment, however, according to the invention only that, first, group of recesses 26 used as cooling channels whose recesses counter to the direction of radiation 15 in the rear end surface 23 the diamond plate 21 ' end up. The recesses of the other, second, group, in the direction of radiation 15 in the front end surface 23a end, have no cooling technical but only the mechanical function of flexibilization. On the top and bottom are cohesively metal layers 28 / 28a / 28b made of copper applied to the diamond body, at least in sections on the recesses 26 and 26a extend. For the electrical separation of the electrically conductive metallization 28 that the heat receiving surface 21 * carries, from the coolant-carrying areas of the Wärmeleitkörpers 21 this metallization is on top and bottom in two electrically separated layers 28 and 28a respectively 28 and 28b divided. The front-oriented metallization 28 covered on top and bottom only the recesses 26a the second group of recesses in their front sections, not between the recesses 26 the first group are arranged, via a metallization on the inner walls of the front-side sections, the top and bottom portions of the metallization 28 electrically connected to each other. The back-oriented metallizations 28a (upper side) and 28b (underside) cover the recesses 26 the first group almost completely and the sections of the recesses 26a the second group of recesses that are completely between the recesses 26 the first group of recesses are arranged. Between the metallization areas 28 and 28a respectively 28 and 28b remains a small portion of the recesses 26a the second group of recesses uncovered.

The metallization layers 28a and 28b have openings 27 and 27a on the front end portions of the cooling channels 26 opposite and the entry of the coolant in or the exit of the coolant from the cooling channels 26 enable.

Ends of the metallizations 28a and 28b protrude opposite the direction of radiation over the rear end surfaces 23 the Wärmeleitkörper addition. They facilitate the precise fitting of the diode laser components 20 , these are the heat conducting bodies 21 each provided with laser diode bars 10 , in corresponding receiving recesses 44 , side by side in stacking direction 35 perpendicular to its longitudinal axis in a coolant distribution plate 41 arranged together with the in 3c shown coolant connection plate 42 the coolant supply and discharge device according to the invention 40 forms.

At the same time, the ends of opposing metallizations always become 28a and 28b two different diode laser components 20 facing each other directly in the diode laser stack 30 are adjacent, spaced from each other in a common receiving recess 44 introduced, which arranged in a, arranged in a first plate half, drain-side coolant guide opening 46b opens, and the ends of the metallizations 28a and 28b the same diode laser component 20 in different receiving recesses 44 introduced into the arranged in a first plate half, drain-side coolant supply openings 46b open and in each case by a receiving recess 44 spaced, which in a, arranged in a second plate half, zulaufsei term coolant guide breakthrough 46a empties. In this case, the receiving recesses form on the inlet side 44 a coolant spreading groove 45a in which the coolant flows through the cooling channels 26 is distributed and fed into the Wärmeleitkörpers.

The further coolant flow in the radiation source 50 according to the in 3d designated coolant flow direction 25 Subsequently, the coolant occurs in all diode laser devices 20 in two portions left and right over the openings 27 and 27a in the metallizations 28a and 28b from the cooling channels 26 from and combines with the respective coolant portions of the directly adjacent diode laser components 20 in a gap that serves as a coolant flow passage 37 between the Wärmeleitkörpern the drain-side collection of the coolant in a through the coolant flow passage 37 provided Kühlmittelinschnürungskammer 48b for delivery to the respective drain-side Kühlmittelführungsdurchbruch 46b serves.

The coolant flow passages 37 between two immediately adjacent Wärmeleitkörpern are sealed against coolant outlet by a first joining agent 33 which all openings 27 and 27a a Wärmeleitkörpers together U-shaped surrounds and the metallizations 28a and 28b immediately adjacent Wärmeleitkörper cohesively connects to each other. In this case, the middle leg of the "U" formed from the joining means with respect to the openings 27 us 27a in the direction of radiation 15 , A second joining agent 33a on the inlet side seals the transition between the rear end of the heat conducting body and the Kühlmittelspreiznut 45a from.

A series connection of the laser diode bars 10 adjacent diode laser components 20 will be in stacking direction 35 by an electrically conductive adhesive 31 allows a joining zone between the second contact surface of the laser diode bar of a first diode laser component 20 and the bottom metallization 28 the Wärmeleitkörpers one, the first diode laser component 20 in the stacking direction 35 immediately adjacent second diode laser device 20 forms.

Unlike in the two previous embodiments, only a family of diode laser devices exist here 20 , which are all flowed through in parallel fluidically. Advantageously, the coolant inlet temperature is basically the same for all diode laser components. The number of flow-parallel through groups is identical to the number of diode laser components; her group strength is one.

FOURTH EMBODIMENT

The heat-conducting body of diode laser components 20 a fourth embodiment have as a body 21 ' a Berylliumoxidplatte (BeO plate), in which a plurality of openings is introduced, which has a cylindrical cross section of the top plate 22 to the underside of the plate 22a extend and the cooling channels according to the invention 26 provide ( 4a ). Formed as breakthroughs have these top side and bottom side openings of the invention 27 on. The arrangement of these apertures is limited to a cylindrical heat dissipation section in the base body whose circular cross-section in the plane of the plate is adapted to the shape of a sealing ring in an O-shape. Away from the heat release section, there is metallization at one edge of the BeO plate 28 Applied, extending from the top of the plate 22 over the front end surface 23a on the underside of the plate 22a extends and a laser diode bar 10 carries, whose direction of radiation 15 the bearing direction of the heat-emitting portion opposite to him opposite. Instead of an electrical connection of the metallization 28 from the top 22 on the bottom 22a over the front end surface 23a can also establish vias in the main body 21 ' be provided for this purpose. An electrical connection via one or both of the side surfaces is of course also possible.

Before its integration with the radiation emission device 30 become the diode laser devices 20 operated as a test. For this purpose, each diode laser component 20 integrated into a coolant circuit, wherein a connection to the coolant source and the coolant sink via sealing rings which surround the inlet portion of the heat discharge section on top and bottom and with their sealing support on the top 22 and the bottom 22a the Wärmeleitkörpers contribute to a seal of the coolant circuit. Furthermore, with the connection of the diode laser component 20 to a power source, the operation of the diode laser device and its emission of radiation. The functional test comprises taking measured values of a current-voltage characteristic and a current-power characteristic, in which case power refers to that of the emitted radiation. Optionally, the spectrum of the emitted radiation is detected and registered at one or more currents, whereby a determination of the thermal resistance of the diode laser component is possible.

The functional test is followed by a test-mode phase under maximum load conditions and / or conditions of use before the functional test is repeated and its Results are compared with those of the first functional test. As a result of this qualification procedure certain diode laser devices become 20 for use in the radiation source 50 selected.

Its construction is a stack of diode laser devices 20 to a diode laser stack 30 summarized by between adjacent diode laser devices 20 U-shaped spacers 34 inserted and by means of joining agent 33 / 33a cohesively on both sides of the upper or lower side of the adjacent diode laser components 20 to be connected ( 4a . 4c ). The legs of the intermediate piece in each case in the emission direction and laterally surround the projection of the heat release section, which is perpendicular to the plane of the plate, while the intermediate section remains open in the direction opposite to the direction of emission for the coolant absorption or discharge. The space between the side legs of the intermediate piece 34 forms the coolant flow passage according to the invention in the coolant flow path 37 between each other directly adjacent diode laser devices. The intermediate piece can consist of metal (for example stainless steel), ceramic (for example aluminum oxide) or plastic (for example polymethyl methacrylate or polycarbonate), etc. The side legs of the intermediate piece 34 extend about 1 mm beyond the back end surface 23 the Wärmeleitgrundkörpers 21 ' out. The protruding ends of the side legs facilitate the arrangement of the diode laser components to the stack, by their position by the receiving them groove-shaped receiving recesses 44 in the coolant distribution plate 41 is given, which together with the coolant connection plate 42 the coolant supply and discharge device forms ( 4b ). The receiving recesses arranged in series in the coolant distribution plate in a row perpendicular to its longitudinal axis have alternately coolant supply passages in one side of the plate half 46a and in the other plate half drain-side coolant supply openings 46b on. The through the intermediate piece 34 provided coolant flow passage 37 on the inlet side allows the distribution of coolant via the inlet-side coolant supply openings 46a in the radiation emission arrangement 30 flows in, over as breakthroughs 27 trained cooling channels 26 two adjacent diode laser components 20 and the drainage side, the collection of coolant from the cooling channels of two adjacent diode laser components 20 , which via the drain-side coolant supply openings 46b from the radiation emission arrangement 30 escapes. An inlet and outlet side sealing of the coolant flow passages 37 opposite to the coolant supply and discharge device takes place via the same joining agent 33 / 33a in the same joining zones, with which the diode laser components are connected to each other.

As in the previous third embodiment, the radiation source exists 50 just a bunch of diode laser devices 20 , which are all flowed through in parallel fluidically. The number of flow-parallel-running groups is identical to the number of diode laser components 20 ; her group strength is one.

In an alternative variant of the radiation source of the fourth exemplary embodiment, there is the heat-conducting base body 21 ' made of a silver-diamond composite that is electrically conductive. For electrical isolation of the diode laser component and / or protection against electrochemical corrosion to the coolant are the openings 27 and the surrounding sealing surfaces - as in the patent DE 10 2007 051 798 B3 proposed - provided with an inorganic electrically non-conductive protective layer and / or a final refractory metal layer.

FIFTH EMBODIMENT

In a fifth embodiment, a heat-conducting body 21 used, which is composed of 5 plates of copper, each 0.25 microns thick, which were connected after superficial oxidation by eutectic bonding in a direct copper bonding (DCB) method. In this body are three groups of cooling channel-forming recesses, which are oriented with their longitudinal axes parallel to the radiation direction ( 5a . 5b ): A first group of cooling channels 26 is on the upper side in the heat conducting body 21 introduced - thus has upper side openings according to the invention 27 - And flows backwards, that is in the direction of radiation 15 direction away, in a top-side recess, in the radiation source 50 as inflow-side coolant expansion chamber 48a or drain-side Kühlmittelseinschnürungskammer 48b Use finds ( 5c ). A second group of cooling channels 26a is symmetrical to the first in the bottom of the Wärmeleitkörpers 21 introduced and flows as well as the cooling channels of the first group backwards in one of the cooling channels 26a common recess. Between adjacent cooling channels 26 . 26a are heat-conducting cooling fins 26 ' . 26'a formed, the heat receiving surfaces according to the invention 26 * wear. A third group of cooling channels 26b connects the heat receiving portion facing ends of opposing cooling channels 26 and 26a the first group and the second group of cooling channels. Thus, there are a number of breakthroughs in the heat conducting body that of the front end portions of the cooling channels 26 and 26a the ers th group and the second group of cooling channels together with the cooling channels 26b the third group of cooling channels is formed.

to Suppression of electro-corrosive effects is the heat-conducting body on all surfaces that come into contact with the coolant come with a layer of diamond-like carbon Coated (DLC, diamond-like carbon).

A facing the cooling channels 26b the third group of cooling channels in the rearward direction between the cooling channels 26 and 26a The material region extending the first and the second group of cooling channels protrudes rearwardly beyond the region of the respective recesses common to the cooling channels of the first and second groups, as spring of a tongue and groove connection in the groove-shaped receiving recess 44 the coolant distribution plate 41 one to the coolant supply and removal device 40 of the second embodiment ( 2 B ) identical coolant supply and discharge device 40 intervene.

The laser diode bars 10 are each with indium solder on the heat-conducting body 21 soldered.

The between the diode laser devices 20 in the radiation source 50 trained coolant flow passages 37 their thickness correspond approximately to that of the laser diode bar plus the electrically conductive joining zone 31 for electrical connection with the adjacent Wärmeleitkörper 21 ; that is about 100 to 200 microns. In principle, even smaller distances of about 10 μm are possible, which are only possible by the thickness of the joining zone of the electrically insulating joining means 32 , which is arranged U-shaped around the region of the cooling channels, is predetermined, provided the laser diode bar 10 opposite the top of the heat conducting body 21 in stack / thickness direction 35 is arranged discontinuously. In fact, the thickness of the coolant passage should be between the diode laser devices 20 be kept as small as possible in this embodiment, thus flow and flow velocity of the coolant in the cooling channels 26 and 26a become maximum.

The coolant flow direction arrows 25 illustrate the flow of the coolant extending from the upstream coolant supply openings 46a in the inlet-side coolant expansion chambers 48a pours as the rear top or bottom recesses in the Wärmeleitkörpern 21 two immediately adjacent diode laser components 20 are formed. In two parallel coolant portions, the coolant flows through both the coolant flow passage 37 as well as the cooling channels 26 and 26a in sides facing each other immediately adjacent diode laser components 20 before the coolant flow completely divides by passing each portion of refrigerant through the channels 26b the third groups of channels formed on the opposite side of each of the flowed diode laser devices 20 occurs to there with the coolant portions of the next adjacent diode laser components 20 to unite. In the direction of radiation 15 opposite direction, the coolant flows in a row through the cooling channels 26 / 26a placed on the sides of the diode laser devices 20 are arranged, those of those cooling channels 26a / 26 opposite, which were previously traversed in the radiation direction. Through the drain-side coolant supply openings 46b the coolant leaves the diode laser stack 30 after being previously in the drain-side coolant constriction chambers 48b , as the rear upper side or lower side recesses in the Wärmeleitkörpern 21 two immediately adjacent diode laser components 20 are formed, emerging from the cooling channels 26 / 26a was collected.

As in the foregoing third and fourth embodiments, there exists in the radiation source 50 just a bunch of diode laser devices 20 , which are all flowed through in parallel fluidically. The number of flow-parallel-running groups is identical to the number of diode laser components 20 ; her group strength is one. The difference with respect to the third and fourth embodiments, however, is that in each diode laser component there are two groups of cooling channels, which are not flowed through in parallel but serially. This allows a higher flow velocity and consequently an improved heat transfer at the heat delivery surfaces in comparison to cooling channels through which the cooling channels flow in parallel 26 * achieve. However, this increases the pressure loss compared to parallel groups of cooling channels.

SIXTH EMBODIMENT

Instead of edge-emitting laser diode bars, the radiation source according to the invention in the sixth exemplary embodiment has the diode laser components 20 fields 10 of surface emitting laser diodes, which are each monolithically integrated in the laser diode element. These are hereafter referred to as VCSEL fields 10 designated. Such a VCSEL field 10 is in 6a shown, together with the Wärmeleitkörper 21 on which it is mounted. The black dots on the VCSEL field 10 indicate the individual VCSEL emitters whose entirety forms the field. A metallization extends on the emission side over the surface of the field, with the VCSEL emitter left out from the metallization. The Metal Lisierung allows a current distribution over all VCSEL emitter whose arrangement is offset from the center of gravity of the laser diode element in a first axial direction to one side (right in 6a ) Provide space for the connection of an electrical connection and / or contact element on the metallization. The radiation direction symbol 15a indicates that the direction of radiation from the image plane is oriented towards the viewer.

The heat-conducting body 21 consists of two components: a cooling fin body and a copper-aluminum nitride-copper composite, of which the VCSEL field 10 facing, first copper layer 28 a radiation reflection side electrical contact for the VCSEL field 10 forms. The VCSEL field 10 is opposite to the center of gravity of the copper layer 28 offset in the first axial direction opposite to the direction of displacement of the VCSEL emitter in the field to provide space on the copper layer for connection of an electrical connection and / or contact element to the metallization.

The cooling fin body is at the in 6a invisible, second copper layer soldered on the the VCSEL field 10 fixed to the opposite side of the aluminum nitride layer, and has a plurality of elongated cooling fins 26 ' square cross section, which is perpendicular to the cross section with respect to the laminated body in from the VCSEL field 10 extend in the opposite direction and between which cooling channels 26 are formed.

The radiation emission device is a diode laser field 30 formed, the diode laser components 20 in two directions 35 and 36 are arranged like a field ( 6b ). For positionally accurate fixation of the diode laser components 20 serves a cover plate 43 in whose openings the diode laser components are introduced by their cooling fin body. In the view of 6b the viewer sees in the direction of radiation 15a on the underside of the cover plate 43 and the cooling fin body against the direction from which the diode laser devices in the openings of the cover plate 43 were introduced. On the opposite, invisible side of the cover plate is around each breakthrough a sealing connection of the top of the cover plate 43 with an edge region of the second copper layer surrounding the cooling fin body.

Coolant flow passages according to the invention exist between the cooling rib bodies of adjacent diode laser components 37 , which are fed by coolant from the existing on the outer fins ribs according to the invention openings or feed coolant to the interstices of the cooling fins.

Furthermore, it can be seen that the four corner regions of the square cooling fin arrangement are recessed in the cooling fin body of cooling fins, as well as the central region of the cooling fin body. These cooling rib-free areas serve to collect or distribute the coolant from or in four main directions in the cooling fin body itself or at the corner points between four cooling rib bodies of diode laser components which are adjacent over the corner 20 ,

Introduced or discharged from these coolant-free areas, the coolant through the inlet-side coolant supply breakthroughs 46a or the drain-side coolant supply openings 46b a coolant distribution plate of which in 6c the top and in 6d the bottom can be seen. About introduced in the bottom of the coolant distribution plate as grooves inlet side coolant distribution channels 47a the coolant is applied to the upstream side coolant supply openings 46a distributed; via drainage-side coolant distribution channels introduced into the underside of the coolant distribution plate as grooves 47a the coolant is out of the drain-side coolant supply openings 46b collected. Both groups of coolant ducts 47a and 47b are at opposite ends of each at an elongated breakthrough 47'a respectively 47'b connected, which extends over the ends of each group and collects the coolant on their inlet side or collects the drain side.

An invisible end plate closes the coolant distribution plate 41 underside to form a Kühlmittelzu- and discharge device according to the invention, which by the 6e shown on the inlet side coolant connection 42a and drain side coolant connection 42b is completed by sealing this at the top of the coolant distribution plate 41 , the coolant supply channels 47'a and 47'b closing, be attached. The coolant connections are on the top side 42a and 42b designed as metal plates electrical connection elements 39a and 39b , whose function with regard to the diode laser as a radiation source 50 in 6f becomes clear: In it are the underside of the cover plate 43 of the diode laser field 30 and top of the coolant distribution plate 41 cohesively and coolant tightly connected. The VCSEL fields 10 are in the diode laser field 30 electrically connected in series with each other via electrical connection elements, which in each row of VCSEL fields in each case from the radiation emission side metallization of the VCSEL field 10 a first diode laser component 20 to the copper layer 28 one of the first diode laser device 20 adjacent diode laser component extends and contacted electrically conductive cohesively. Adjacent rows of VCSEL arrays are via intermediate electrical interconnect elements 29a and 29a , which act as metal layers on the tops of the coolant connections 42a and 42b are applied to each other electrically connected in series. The electrical chain of VCSEL fields is anode and cathode side by the already mentioned electrical connection elements 39a and 39b terminated.

fluidically consists of this two-dimensional array of diode laser devices the situation that the coolant, each centered introduced into the respective fin body is divided into four coolant portions of each at each of the four corners of the fin body united with the three portions of coolant, which from the Finned bodies come in the relevant Union area have a corner.

As in the foregoing third, fourth and fifth embodiments, there exists in the radiation source 50 just a bunch of diode laser devices 20 , which are all flowed through in parallel fluidically. The number of flow-parallel-running groups is identical to the number of diode laser components 20 ; her group strength is one.

With such a radiation source 50 For example, high optical performance of excellent optical quality is provided on a large, nearly continuous, luminous surface. The described components of this radiation source can be scaled in number, so that light emission panels of several square meters in size can be produced.

An application example shows 6g with an irradiation device according to the invention 60 for material treatment. It will be the diode laser 50 emerging radiation whose direction of radiation using the arrows 15 is characterized, via a telescope arrangement, first by means of a diverging optical system 61a diverged and collimated by means of a collection optic. It meets in the expanded state as a parallel beam on a on a support 64 stored workpiece 65 which undergoes an at least superficial material change process by at least partial absorption of the radiation. An example of such a workpiece is a glass plate carrying an amorphous silicon layer, wherein the amorphous silicon layer is transformed into a polycrystalline layer by annealing, for example, in the manufacturing process of thin film transistors (TFTs).

optical means for homogenizing the intensity distribution of the beam can be introduced into the beam path if required.

SEVENTH EMBODIMENT

The seventh embodiment has edge emitting laser diode bars as laser diode devices 10 compared to the embodiments one to five on the difference that the invention Nachachbarrichtung - that is, the direction in which the openings according to the invention 27 and in which the coolant flow passages according to the invention exist between the diode laser components - not the stacking direction 35 / 35a is, but the row direction 36 / 36a , For the difference between rows and stacking direction in edge-emitting semiconductor devices, reference is made to the description of the invention.

Nevertheless, the seventh embodiment is a radiation source 50 with a diode laser field 30 of several diode laser stacks arranged side by side in series.

A diode laser device 20 this diode laser stack is in 7a shown. The heat-conducting body 21 is made of four layers of copper by the DCB method (see fifth embodiment). The layer thicknesses are in order from bottom to top in the thickness direction 0.3 mm, 0.2 mm, 0.2 mm and 0.3 mm. The Wärmeleitkörper has a U-shape, wherein the center leg includes the heat receiving surface on which the laser diode bar 10 soldered with indium solder. The side limbs extend parallel to one another in the direction of heat conduction in the direction of radiation and leave a wedge-shaped intermediate space between them 48a which tapers from the rear side of the heat conduction body in the emission direction and forms a Kühlmittelspreizkammer. The left and right side surfaces facing away from the gap 22 / 22a of the Wärmeleitkörpers extend in the region of the side legs at an angle of 15 ° inclined to the emission direction in such a way that each side leg in plan view assumes the shape of a tapered in heat conduction trapezoid.

Each side leg has a variety of cooling channels 26 / 26a which extend from the intermediate space to the inclined side surfaces, whereby between the cooling channels 26 / 26a cooling fins 26 ' / 26'a , present, over the wall surfaces 26 * the heat is given off to a coolant flowing through the cooling channels. The openings according to the invention 27 / 27a the cooling channels 26 / 26a lie on the left side surface 22 or right side surface 22a the side legs, the Öff calculations 27a in 7a on the right side surface 22a are not designated because they are not visible.

The diode diode laser components 20 become a diode laser stack in a stacking direction 35 connected to each other, wherein in each case the diode laser components 20 remote contact surfaces of the laser diode bars 10 via an electrically conductive adhesive with the heat-conducting body 21 an immediately adjacent diode laser device 20 are connected, so that the diode laser components 20 of a stack are interconnected electrically in series ( 7b ). The heat conducting body 21 are away from the heat receiving surface, ie away from the laser diode bar, each with an electrically non-conductive adhesive 32 with the heat-conducting body 21 an immediately adjacent diode laser device 20 surface cohesively connected and form the seal of the invention over the coolant. The uppermost heat-conducting body 21 in the stack does not carry a laser diode bar 10 but serves only for the cooling-technical termination and electrical termination of the diode laser stack.

Several diode laser stacks continue to be in a row in the row direction 36 / 36a arranged side by side ( 7c . 7f ). An electrically non-conductive adhesive 32a connects two adjacent diode laser stacks materially, in which he the area between the heat receiving portions of adjacent Wärmeleitkörper 21 bridged sealingly against the coolant. The regions between the heat-dissipating sections of adjacent heat-conducting bodies remain free and form the coolant-flow passage according to the invention 37 out. Due to the inclination of the side surfaces, they are also wedge-shaped and tapered in the direction of radiation formed as the side leg intermediate spaces of the heat conducting body. This form allows a low-loss coolant distribution in or coolant collection from the cooling channels 26 and 26a of the diode laser field 30 , cover plates 43 and 43a are upper or lower side of the diode laser field 30 attached, contribute to the inclusion of the coolant in the radiation source 50 at and provide an electrical series or parallel connection of the diode laser stack ready and electrical connections for the diode laser field 30 , which are not explicitly shown.

The coolant flow in the radiation source 50 takes place in such a way that the coolant via the coolant supply and discharge device 40 represented in 7d into the coolant distribution chambers 48 is introduced by the spaces between them 48 the side legs of the heat-conducting body 21 be formed ( 7f ). From there, two portions of coolant branch off in opposite directions parallel to the row direction 36 / 36a in the cooling channels 26 and 26a every heat-conducting body 21 , On the interstices 48 opposite sides, the coolant portions emerge from the cooling channels 26 and 26a out and unite in the coolant flow passages 37 with the coolant portions from the diode laser components 20 of the respectively adjacent diode laser stack. About the coolant supply and discharge device 40 the coolant leaves the diode laser field 30 , Because of the electrically conductive heat conducting body 21 there is an electrical potential on surfaces wetted by the coolant, which is stepped by diode laser device 20 to diode laser device 20 In steps of the voltage drop across the pn junction of the laser diode bar varies, is used as the coolant water, which has only a low electrical conductivity of 5 μS / cm.

The coolant supply and discharge device 40 consists of a coolant distribution plate 41 and a coolant connection plate 42 , In the upper side of the coolant distribution plate, there are alternately inlet-side coolant expansion grooves in the row direction 45a and drain side Kühlmitteleinschnürungsnuten 45b introduced, the longitudinal axes in the plane of the plate parallel to each other and perpendicular to the row direction. From the lower side introduced into the coolant distribution plate coolant guide breakthroughs 46a and 46b are upstream ( 46a ) in a first half of the coolant distribution plate 41 arranged and are with the inlet-side Kühlmittelspreiznuten 45a Connection and expiration ( 46b ) in the second half, communicating with the drain-side coolant constriction grooves 45b keep in touch ( 7e ).

The coolant supply breakthroughs 46a and 46b on the coolant guide grooves 45a and 46a opposite side opposite coolant guide channels 47a and 47b in the coolant connection plate 42 serve the inlet side of the distribution of coolant to the inlet-side coolant supply openings 46a and the drain side of the collection of coolant from the drain-side coolant guide openings 46b ,

As in the foregoing third to sixth embodiments, there exists in the radiation source 50 just a bunch of diode laser devices 20 , which are all flowed through in parallel fluidically. The number of flow-parallel-running groups is identical to the number of diode laser components 20 ; her group strength is one.

Eighth Embodiment

The eighth embodiment relates to an embodiment of the radiation source according to the invention, in which the arrangement direction of the half conductor assemblies 20 is not arranged perpendicular to the radiation direction, as is the case in the seven preceding embodiments, but - in groups - parallel to it. Such an arrangement is possible, for example, when the radiation-emitting semiconductor components - in this case edge-emitting laser diode bars 10 Are arranged offset not only in the direction of radiation, but also perpendicular thereto, so that a laser diode component is not in the beam path of another ( 8e . 8f ).

Alternatively, of course, beam deflecting optics can be used to provide a missing offset perpendicular to the direction of radiation 15 to redirect the emitted beams in one direction, in which no laser diode bar 10 or diode laser device 20 is in the way. Such beam-deflecting optics can be integrated or mounted both in the laser diode element and in the heat-conducting body, with the result being a radiation direction which is perpendicular to the arrangement direction, as is the case in the sixth exemplary embodiment.

In the present embodiment, there is no beam deflection, and the diode laser components 20 - and with them the laser diode bars 10 - Are in a normal direction of the contact surfaces of the laser diode bar component so offset from one another that in the radiation direction 15 the radiation propagation on the optical axis is not hindered. The arrangement of the diode laser components 20 and with them the one of the laser diode bars 10 in or against the radiation direction 15 takes place in a depth direction 36b of successively arranged diode laser components 20 , The offset of the laser diode bars perpendicular to the depth direction is smaller than that in the depth direction 36b such that a high brilliance radiation field is emitted from the radiation source. For example, the offset is from diode laser devices 20 in this diode laser array in the depth direction 2 mm and perpendicular thereto 0.5 mm.

This results in the rest, a plurality of mutually parallel arrangement directions, each of which is associated with a diode laser component. In an alternative consideration, there is only one direction of arrangement, spanning the diode laser array, that is 14 ° (the arc tangent of the ratio of normal and depth direction offset) to the direction of emission 15 is inclined.

Optical collimation means, which can be arranged in front of each laser diode bar, are suitable for collimation of the radiation, which prevents otherwise divergent beam sections in the emission direction 15 arranged diode laser components 20 to meet. With respect to such an optical arrangement and its developments is on the publication WO 2007 061509 A2 directed.

The diode laser component of this embodiment has a plate-shaped heat conducting body 21 consisting of a composite of carbon nanofibers and copper ( 8a ). The heat receiving surface, which serves as a mounting surface for the laser diode bar 10 serves, is on a front end surface 23a facing the top of the panel 22 is inclined by 90 °, arranged. The laser diode bar is at the edge to the underside of the plate side of its first electrical contact surface by means of a gold-tin solder on the heat receiving surface 21 soldered. The direction of radiation 15 points in the direction of the underside normal of the Wärmeleitkörpers 21 , recesses 26 extend on top, recesses 26a on the underside, starting from the front end surface 23a about two thirds of the length of the heat sink in the radiation direction opposite rear end surface 15 ( 8a . 8f ). They were made by means of a metal circular saw in the heat-conducting body 21 brought in. The lower side cooling channels 26a end in radiation emission side direction 15 in a by the offset in the stacking direction of 0.5 mm greater distance from the front end surface 23a of the heat conducting body 21 as the topside cooling channels 26a , The upper and lower sides have as cooling channels 26 and 26a acting recesses openings of the invention 27 and 27a (the latter being located at the bottom, in 8a not visible and not labeled) on which the coolant into a space between immediately adjacent diode laser devices 20 can occur. One on the heat conduction body 21 remote, second electrical contact surface also secured with a gold-tin solder electrical connection element 29 is formed as a copper-molybdenum-composite metal sheet L-shaped, wherein the outer side of the longer leg, the contact surface with respect to the laser diode bar 10 includes.

Between two diode laser components adjacent in the diode laser arrangement, there is one intermediate piece in each case 34 provided that an elongated opening 37 facing the front end portions of the cooling channels 26 at the top 22 be positioned of the heat conducting body. An elongate recess in the rear end surface of the intermediate piece 34 is disposed opposite to the rear end portions of the cooling channels and serves as a coolant guiding chamber 48 , The top 22 the Wärmeleitkörpers 21 serves between the radiation emission side end portions of the openings 27 as a sealing surface according to the invention, wherein the intermediate piece 34 contributes his part to the seal. On both sides on the Intermediate piece applied, not designated adhesive layers are each two adjacent diode laser components connected to each other cohesively.

A space at the back between two over the ends of the channels 26 . 26a protruding side portions of the Wärmeleitkörpers 21 allowed on the inlet side a passage of the coolant from the top to the bottom of the heat conducting body and the outlet side a passage of the coolant from the bottom to the top of the heat conducting body 21 ,

A coolant distribution unit 41a completes the radiation source together with the diode laser array 50 , she is in 8c in front view, in 8d in rear view, in 8e in oblique view and in 8f shown in cross-sectional view and is stepped on the diode laser array side facing and ramped on the side facing away from the diode laser array side. Dashed lines in 8d . 8e and 8f indicate that the coolant distribution unit 41a consists of plates connected to each other surface of electrically non-conductive material - for example, LTC (low-temperature co-fired) ceramic - whose number corresponds to the stages plus one on which the diode laser components 20 are arranged by their rear end surface. At the level of each stage, there are alternately inlet-side coolant expansion grooves in the plate of the next step above 45a and drain side Kühlmitteleinschnürungsnuten 45b , on the diode laser array side facing the full extension width of the cooling channels 26 the Wärmeleitkörper are extended and on the side facing away from the diode laser array on grooves of almost half of this width are limited, where there inflow-side inlets and outflow-side outlets in different halves of the coolant distribution unit 41a are arranged and in each case extend to increase the channel cross section in the coolant flow paths in sections via two plates, in which the coolant in a diode laser component 20 is divided into two portions on the inlet side or is combined on the outlet side from two portions.

In the diode laser arrangement, the electrical connection element contacts 29 on the part of its outer surface on the shorter leg of the L-shape, the electrically conductive heat-conducting body of the row direction 35 adjacent diode laser component lower side, whereby the five existing diode laser components are electrically connected in series. The diode laser arrangement limiting heat conducting body 21 with the highest and the lowest electric potential serve both as a cooling / fluidic termination as well as an electrical connection, which is for a power source through at the outer Wärmeleitkörpern 21 fixed electrical connection elements 39a and 39b provided.

The flow-related course of the coolant provides on the inlet side a coolant separation into two parallel-flowing coolant portions, the upper and lower sides of the cooling channels 26 and 26a of Wärmeleitkörpern 21 a first family of diode laser devices 20 then flow in two opposite directions through the coolant passages 37 the adjacent intermediate pieces 34 in the top or bottom cooling channels 26 and 26a two immediately adjacent Wärmeleitkörpern 21 a second family of diode laser devices 20 entry. After flowing through these cooling channels, the coolant portions unite in the rearward free space of the heat conducting body with the coolant portions, which originate from the two, the diode laser component of the first family of diode laser components next adjacent, diode laser components of the first family of diode laser components.

The coolant flow path through the diode laser components 20 the radiation source 50 is thus fundamentally identical in terms of flow to those of the first and second embodiments: There are two serially traversed flocks of diode laser components 20 , which in, in the direction of adjacency juxtaposed, flow-parallel through-flow groups of two diode laser components 20 are divided, wherein, in contrast to the first two embodiments, the neighboring direction is not the stacking direction, but the row direction.

NINTH EMBODIMENT

The radiation source 50 of the ninth embodiment has a laser diode chip as a laser diode chip 10 whose width is smaller than its resonator length. In laser diode bars, it is reversed in the width direction due to the juxtaposition of a plurality of optically independently operable emitters. Said laser diode chips may have some emitters distributed side by side in the width direction. For example, four or two. In this case, the laser diode chip 10 only an emitter of 100 microns wide. Its width is 400 μm, its (resonator) length 4 mm. It is for forming a diode laser device 20 on the metallization 28 a Wärmeleitkörpers 21 soldered, extending from the middle of the top of the Wärmeleitkörpers tape-like over the direction of radiation 15 oriented front on the underside of the plate-shaped heat conducting body 21 extends and there mirror metric to the top ( 9a ). The heat receiving portion extends in projection of the laser diode chip perpendicular to the top of the plate through the heat conducting body 21 , On both sides left and right of the heat receiving portion are recesses in the width direction perpendicular to the radiation direction 26 . 26a introduced, from which a first group as cooling channels 26 in the direction of radiation 15 Seen right heat-conducting half of the right side surface of the Wärmeleitkörpers 21 up to about 0.5 mm to the heat receiving portion and from the top to the bottom extends a second group as cooling channels 26a in the direction of radiation 15 Seen left heat conduction half of the left side surface of the Wärmeleitkörpers 21 up to about 0.5 mm on the heat receiving portion and extends from the top to the bottom. There are thus two opposing heat conduction directions in the width direction.

Between the cooling channels 26 and 26a are due to the material inventory of Wärmeleitkörpers cooling fins 26 ' and 26'a formed, whose mutually facing surfaces heat transfer surfaces in the inventive sense. There are thus two opposing heat conduction directions in the width direction

A diode laser stack 30 is by stacking in the stacking direction 35 of diode laser devices 20 achieved, wherein between two directly adjacent diode laser components 20 in each case two U-shaped intermediate pieces are arranged, which on both sides arranged joining zones with opposite diode laser components 20 is integrally connected ( 9b ). This is the diode laser stack 30 a cohesive unit, wherein the top of the metallization layer 28 remote, second contact surface The U-shaped intermediate pieces are in the respective heat conduction direction to the side surfaces of the heat conducting body 21 open, wherein between the side legs of the intermediate pieces, the coolant flow passages according to the invention 37 available. The one in the diode laser stack 30 top heat-conducting body 21 does not carry a laser diode chip 10 but serves for the coolant technical and electrical termination of the diode laser stack 30 , wherein at the top-side portion of the metallization 28 a first electrical connection element 39a is attached. At the lower side portion of the metallization of the diode laser stack lowest in the diode laser stack 20 is a second, to the first electrical connection element 39a opposite pole, second electrical connection element 39b attached.

To complete the radiation source according to the invention 50 are on the left and right sides of the diode laser stack 30 each a coolant supply and - removal device attached ( 9c ), their components - namely the coolant distribution plate 41 and the coolant connection plate 42 - in 3c are shown, so that reference is made to their explanation to the description of the third embodiment.

In 9c invisible upper and lower cover plates seal the diode laser stack 30 opposite coolant outlet.

The flow flow takes place here left and right inlet side into a first group of the as coolant passages 37 trained interstices into and branching into two coolant portions in the cooling channels 26 respectively 26a two immediately adjacent diode laser components 20 , On the drain side, the coolant portions collect from the cooling channels 26 respectively 26a two immediately adjacent diode laser components 20 in a second group of the as coolant passages 37 formed gaps, which are opposite to the first set of gaps by the pitch between two immediately adjacent diode laser devices 20 is offset. It thus exists - as in the fourth embodiment - only a bevy of diode laser devices 20 , which are all flowed through in parallel fluidically.

In a modification, not shown, of the ninth embodiment, the intermediate piece 34 not U-shaped, but rectangular and has a slot-shaped opening on the heat receiving portion side facing, which acts as a coolant flow passage. In this case, the flow on the left and right takes place on the inlet side in the cooling channels 26 and 26a a first family of diode laser devices 20 and branched into two coolant portions in the slot-shaped openings in the respect to the respective diode laser components 20 opposite intermediate pieces. On the drain side, the coolant portions collect in the cooling channels 26 respectively 26a of diode laser devices 20 a second family of diode laser devices 20 facing the first set of diode laser devices 20 around the center distance between two directly adjacent diode laser devices 20 is offset.

In this case, as in the second embodiment, there are two sets of diode laser components flowing through in series 20 , which in the stacking direction side by side, flow-parallel through-flow groups of two diode laser components 20 are divided.

TENTH EMBODIMENT

In contrast to the ninth embodiment sees the diode laser device 20 the radiation source 50 of the tenth embodiment only a group of cooling channels 26 in the heat conducting body 21 which, in only one heat conduction direction perpendicular to the radiation direction 15 and parallel to the top 22 are arranged ( 10a ). The the laser diode chip 10 supporting heat receiving portion has in the two main directions perpendicular to the heat conduction - the thickness direction and the longitudinal direction - a larger cross-section than that of the cooling channels 26 or cooling fins having heat dissipation section at the step-like transition from the heat absorption to the heat-emitting portion is formed a heat conducting body circumferential sealing surface whose normal is oriented in heat conduction. A metallization 28 extends on the heat receiving portion from the top 22 , on which the laser diode chip is mounted, via a side surface on the underside of the Wärmeleitkörpers 21 wherein the side surface is arranged on the side facing away from the heat-emitting portion of the heat receiving portion.

In the radiation source 50 are the diode laser elements 20 one above the other in the stacking direction 35 arranged parallel to the top normal of the heat conducting body, wherein electrical connecting elements 29 the electrical contact between the top contact surface 12 of the laser diode chip 10 and the underside portion of the metallization 28 an adjacent diode laser element via electrically conductive joining means (not shown) mediate ( 10b ). The coolant supply and discharge device consists of the components of the cover plate 43 , the coolant distribution unit 41a and the coolant connection plate, for their representation 1d and to which the description is directed to that of the first embodiment.

Analogous to the arrangement of the first embodiment, the heat release cuts through the Wärmeleitkörperaufnahedurchbrüche in the cover plate 43 guided and in the receiving recesses of the coolant distribution unit 41a arranged. A seal is made between the sealing surfaces of the heat conducting body and the top of the cover plate at the areas surrounding the Wärmeleitkörperaufnahetrurchbrüche. The coolant flow is analogous to that of the first embodiment by two serially flowed flocks of diode laser elements, which are each flowed through in parallel flow.

ELEVENTH EMBODIMENT

The eleventh embodiment relates to a photovoltaic radiation receiver according to the invention 50 ' as conversion unit ( 11b ) photovoltaic generator. It has a field-like solar module arrangement 30 ' of solar modules 20 ' one of which is in 11a is shown and which in two arrangement directions - in the stacking direction 36 and row direction 36 - are arranged. The solar module 20 ' has a heat-conducting body 21 consisting of a copper-aluminum nitride-copper composite body and a fin body with cooling fins 26 ' , between which cooling channels 26 are present and directed away from the laminate perpendicular to the layer plane of the laminate. The remote from the fin body copper layer 28 of the laminated body serves as a mounting and heat receiving surface of the solar cell 10 ' that at least partially absorbs sunlight. In the present case, it is a tandem solar cell 10 ' gallium arsenide based on the radiation incident direction 15'a facing side, the p-bus bar structure of the top electrical contact metallization can be seen. In an alternative embodiment, the solar cell 10 ' a triple pile solar cell based on germanium. Before the integration of the solar modules 20 ' to the photovoltaic radiation receiver 50 ' becomes every single solar module 20 ' tested in a solar simulator. For this purpose, it is integrated by its cooling fins in a coolant circuit and at the copper layer 28 sealed opposite copper layer relative to the coolant circuit, for example, frictionally via a silicone film. The irradiation of the solar cell 10 ' of the solar module 20 ' done with a xenon high pressure lamp. The recording of the current-voltage characteristic leads to the generator characteristic as a yardstick for the quality of the solar module 20 ' , A test increase in the irradiance relative to the irradiance in the photovoltaic radiation receiver provides a reliability statement for the relevant solar module 20 ' ,

The arrangement of the solar modules 20 ' in the photovoltaic radiation receiver 50 ' corresponds to those of the diode laser elements 20 in the radiation source 50 of the sixth embodiment, including the connected coolant supply and discharge device to which the 6b to 6f with the corresponding description is referenced.

The Solar cells are according to the invention in such a way arranged closely adjacent to that, a fill factor of greater as 90% of radiant energy converting to electrical energy Area is reached.

The photovoltaic radiation receiver 50 ' becomes a solar concentrator 60 ' integrated, the sun tracking unit from radiation receiver 50 ' , Boom 62 and concave mirror 61 on a tripod anchored in the ground 63 is stored ( 11c ). The concave mirror 61 concentrates the parallel incident sunrays on the photovoltaic radiation receiver 50 ' standing at a concave mirror 61 opposite end of the boom 62 is attached. For the present radiation receiver 50 ' meet due to the planar arrangement of the solar cells 10 ' the sunrays 15 ' from different, with respect to the normal of the receiving surfaces inclined directions to the solar cells 10 ' , In a preferred embodiment, the arrangement of the solar modules 20 ' in the radiation receiver 50 ' not flat but convex. This will work for all solar cells 10 ' achieved a substantially vertical light.

The advantage of this simply concentrating solar system over the arrangements equipped with multiple concentrating Fresnel lens fields arrangements is the use of a much smaller and more compact radiation receiver. The radiation receiver according to the invention 50 ' allows a low-radiation loss for all solar modules 20 ' of the radiation receiver 50 ' common concentration of sunlight in a particularly efficient way.

In a preferred embodiment of the eleventh embodiment of the concave mirror 61 equipped with higher reflective areas and with lower reflective areas between the higher reflective areas, the higher reflective areas are adapted in number, arrangement and area size to the number, arrangement and area size of the solar cell. In this case, the concave mirror is segmented into partial mirrors which have radiation-permeable interspaces. This advantageously prevents radiation from striking the areas between the solar cells.

In an alternative variant of the eleventh exemplary embodiment, the conversion unit is a thermoelectric generator ( 50 ' ), which instead of solar cells thermoelectric chips ( 10 ' ) which are provided with a radiation absorption layer facing the irradiation direction.

Finally, it should be emphasized that, of course, all radiation sources 50 all embodiments one to ten and the radiation receiver 50 ' of the eleventh embodiment can be fluidically operated in a direction opposite to the description of the embodiments, reverse flow direction, wherein the coolant guide elements 42a . 42b 45a . 45b 46a . 46b . 47a . 47b . 47'a . 47b . 48a and 48b then in their respective upstream and downstream property to swap.

combinations of inventive features of the embodiments with other features, in particular those of other embodiments, are of course within the scope of the invention.

10

laser diode element

10

solar cell

11

first / lower-side contact area

12

second / upper-side contact area

15

Radiation direction, Radiation direction arrow

15a

Radiation direction, Radiation direction symbol

20

Semiconductor assembly, diode laser component

20 '

solar module

21

thermal conductors

21 '

Wärmeleitgrundkörper

21 *

Heat absorbing surface

21a

Heat receiving portion

21b

heat conduction

21c

Heat release section

22

first Outer surface, top / left side surface

22a

second Outer surface, underside / right side surface

23

rear End face, back

23a

front End face, front

24

sealing surface

25

Coolant flow direction Coolant flow direction arrow

26

Recess / cooling channel a first group

26a

Recess / cooling channel a second group

26b

Recess / cooling channel a third group

26i

recess without cooling function

26

Steg / cooling fin of a first type

26'a

Steg / cooling fin of a second type

26 *

Heat transfer surface

27

opening

27a

opening

28

metallization

28a

metallization

28b

metallization

29

electrical connecting element

29a

electrical Connecting intermediate element

29b

electrical Connecting intermediate element

30

Radiation emission arrangement Diode laser stack, diode laser array, diode laser array

30 '

Radiation receiving arrangement

31

electrical conductive joining agent / electrically conductive joining zone

32

electrical insulating joining agent / electrically insulating joining zone

32a

electrical insulating joining agent / electrically insulating joining zone

33

first Joining agent / first joining zone

33a

second Joining agent / second joining zone

34

connecting piece

34a

connecting piece

35

Stacking direction, Stacking direction arrow

35a

Stacking direction, Stacking direction symbol

36

Row direction, Row direction arrow

36a

Row direction, Row direction symbol

36b

Depth direction, Depth direction arrow

37

Coolant flow passage

39a

first electrical connection element

39b

second electrical connection element

40

coolant supply and drainage device

41

Coolant distribution plate

41a

Coolant distribution unit

42

Coolant connection plate

42a

tapered side Coolant connection

42b

drain-side Coolant connection

43

cover plate

43a

cover plate

44

receiving recess

44 '

wall

45a

supply-side Kühlmittelspreiznut

45b

drain-side Kühlmitteleinschnürungsnut

46a

tapered side Coolant circulation system breakdown

46b

drain-side Coolant circulation system breakdown

47a

tapered side Coolant distribution channel

47b

drain-side Coolant collecting channel

47'a

tapered side Coolant distribution channel

47'b

drain-side Coolant collecting channel

48

Coolant circulation chamber

48a

supply-side Kühlmittelspreizkammer

48b

drain-side Kühlmitteleinschnürungskammer

49

Wärmeleitkörperaufnahmedurchbruch

50

Radiation source diode laser

50 '

Radiation receiver, photovoltaic generator

60

irradiator

60 '

solar concentrator

61

concave mirror

61a

diverging optical system

61b

collection optics

62

boom

63

tripod

64

carrier

65

workpiece

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• DE 19750879 A1 [0008]
• - US 5987043 A [0036]
• EP 1113543 A1 [0038]
• EP 0766354 A1 [0068]
• - DE 19701680 A1 [0079, 0188]
• - DE 19644941 C1 [0179]
• US 5909458 [0200]
• US 5848083 [0211]
• DE 10011892 A1 [0211]
• - DE 102007051798 B3 [0225]
• - WO 2007061509 A2 [0260]

Claims (31)

Conversion unit ( 50 / 50 ' ) for converting electrical energy into radiant energy or for converting radiant energy into electrical energy with at least one conversion arrangement ( 30 / 30 ' ) and 2 at least one coolant supply and removal device ( 40 ) with 2.1 at least one of the conversion arrangement ( 30 / 30 ' ) facing coolant outlet ( 45a / 46a ), via which at least one coolant of the conversion arrangement ( 30 / 30 ' ), and 2.2 at least one of the conversion arrangement ( 30 / 30 ' ) facing coolant inlet ( 45b / 46a ), via which the coolant from the conversion arrangement ( 30 / 30 ' ), where 1 is the conversion arrangement ( 30 / 30 ' ) 1.1 several conversion modules ( 20 / 20 ' ) arranged in at least one arrangement direction ( 35 / 35a . 36 / 36a ) are arranged adjacent to each other at least in sections, and 1.2 has at least one coolant guide, in whose course the flow of the conversion modules ( 20 / 20 ' ) is provided with the coolant, and 1.1 the conversion modules ( 20 / 20 ' ) 1.1.1 at least one electrically contactable, semiconducting conversion element ( 10 / 10 ' ), the radiation in at least one emission direction ( 15 . 15a ) or radiation from at least one irradiation direction ( 15 ' . 15'a ), and 1.1.2 at least one heat-conducting body ( 21 ) with 1.1.2.1 at least one heat receiving section ( 21a ) having at least one heat receiving surface ( 21 * ), at which the conversion element ( 10 ), 1.1.2.2 at least one heat release section ( 21c ), the at least one of the coolant wetted heat transfer surface ( 26 * ) has heat transfer to the coolant, characterized in that 1.1.2.2 the heat release section ( 21c ) 1.1.2.2.1 with regard to the heat absorption section ( 21a ) completely in at least one of the arrangement direction ( 35 / 35a . 36 / 36a ) is arranged inclined Wärmeleitrichtung, and 1.2.2.2 at least one, the heat transfer surface ( 26 * ) comprehensive recess ( 26 / 26a / 26b ) and 1.1.2.2.3 at least one opening ( 27 / 27a ), which on at least one, the heat release section ( 21c ) of the heat conducting body ( 21 ) of an adjacent conversion module ( 20 ) at least partially opposite, first outer side ( 22 / 22a ) is arranged, and with the recess ( 26 / 26a / 26b ), 1.1.2.1 the heat absorption section ( 21a ) 1.1.2.1.1 has no surface wetted by the coolant, 1.2 the coolant guide 1.2.1 coolant flow passages ( 37 ) between the heat-dissipating sections ( 21c ) of heat conducting bodies ( 21 ) of neighboring conversion modules ( 20 ), 1.2.2 for a first coolant flow for the flow of a first group of one or more conversion modules ( 20 ) and 1.2.3 a, for the first coolant flow fluidly parallel, second coolant flow for the flow of at least a second group of one or more conversion modules ( 20 ), 1.1.2 the heat conducting body ( 21 ) 1.1.2.3 at least one heat-conducting section ( 21b 1.1.2.3.1 between the heat receiving section ( 21a ) and the heat release section ( 21c ) and 1.1.2.3.2 at least one sealing surface ( 24 ), via which, at least in sections, a seal takes place which leads to the inclusion of coolant in the coolant flow passages (US Pat. 37 ), and 2 from the coolant supply and discharge device ( 40 ) 2.3 at least one section which separates the coolant outlet ( 45a / 46a ) and / or the coolant inlet ( 45b / 46b ), in heat conduction away from the conversion arrangement ( 30 / 30 ' ) is arranged. Conversion unit according to claim 1, characterized in that the heat release section ( 21c ) a plurality of recesses ( 26 / 26a / 26b ) each having at least one heat transfer surface ( 26 * ), each with at least one opening ( 27 / 27a ), which on at least one, the heat release section ( 21c ) of the heat conducting body ( 21 ) of an adjacent semiconductor module ( 20 ) at least partially opposite, first outer side ( 22 / 22a ) is in communication. Conversion unit according to claim 2, characterized in that the recesses ( 26 / 26a ) each said opening ( 27 / 27a ) exhibit. Conversion unit according to claim 2 or 3, characterized in that the recesses ( 26 / 26a ) from the first outside ( 22 ) towards one of the first outer side ( 22 ) opposite second outer side ( 22a ) and / or from one of the first outer side ( 22 ) opposite second outer side ( 22a ) in the direction of the first outer side ( 22 ). Conversion unit according to claim 4, characterized in that the recesses ( 26 ) from the first outside ( 22 ) to one of the first outer side ( 22 ) opposite second outer side ( 22a ), wherein the recesses ( 26 ) at least one first opening ( 27 ), which on the first outer side ( 22 ) is arranged, and at least one second opening ( 27a ) on the second outer side ( 22a ) is arranged. Conversion unit according to claim 4, characterized in that the heat release section ( 21c ) a first group of recesses ( 26 ) and at least a second group of recesses ( 26a ), wherein the recesses of the first group of recesses ( 26 ) of a gap ( 48 ) between the first outer side ( 22 ) and one of the first outer side ( 22 ) opposite second outer side ( 22a ) to the first outer side ( 22 ) and the recesses of the second groups of recesses ( 26a ) from the gap to the second outer side ( 22a ) and the coolant guide for a first coolant flow for the flow through the first group of recesses ( 26 ) and a fluid flow to the first coolant flow, second coolant flow to flow through the second group of recesses ( 26a ) is trained. Conversion unit according to claim 4, characterized in that the heat release section ( 21c ) a first group of recesses ( 26 ) and at least a second group of recesses ( 26a ), wherein the recesses of the first group of recesses ( 26 ) from the first outside ( 22 ) towards one of the first outer side ( 22 ) opposite second outer side ( 22a ) and the recesses of the second groups of recesses ( 26a ) from one of the first outer side ( 22 ) opposite second outer side ( 22a ) in the direction of the first outer side ( 22 ) and the coolant flow for a serial coolant flow for successive flow through the first group of recesses ( 26 ) and the second group of recesses ( 26a ) is trained. Conversion unit according to one of claims 2 to 7, characterized in that the heat release section ( 21c ) is formed at least in sections as a cooling fin body, which in heat conduction from the heat receiving portion ( 21a ) protruding cooling fins ( 26 ' / 26'a ), between which formed for the inclusion of coolant recesses ( 26 / 26a ), which have at least one opening ( 27 / 27a ) are flowable with coolant and / or from which at least one opening ( 27 / 27a ) can drain the coolant. Conversion unit according to one of the preceding claims, characterized in that the heat-conducting body ( 21 ) is at least partially electrically conductive, the electrically conductive region of the heat conducting body ( 21 ) electrically with the conversion element ( 10 ) is connected and the heat release section ( 21c ) is provided at least on surfaces wetted by coolant with at least one electrically non-conductive, or one consisting of at least one refractory metal layer. Conversion unit according to one of the preceding claims, characterized in that the conversion element ( 10 ) at least one, arranged on a first side, the first electrical contact surface ( 11 ) and at least one, opposite to the first electrical contact surface, second contact surface ( 12 ). Conversion unit according to claim 10, characterized in that the first electrical contact surface of the conversion element ( 10 / 10 ' ) of a first conversion module ( 20 / 20 ' ) is in electrical connection with the second electrical contact surface of the conversion element of the first conversion module in at least one arrangement direction immediately adjacent second conversion module. Conversion unit according to one of the preceding claims, characterized in that the number of groups of conversion modules ( 20 / 20 ' ) equal to the number of conversion modules ( 20 / 20 ' ), whereby each group is exactly one conversion module ( 20 / 20 ' ) and all conversion modules ( 20 / 20 ' ) are flowed through parallel flow. Conversion unit according to claim 12, characterized in that the coolant flow passages ( 37 ) are opened in the coolant supply and discharge device facing direction and the recesses ( 26 / 26a ) of the conversion modules are opened in the coolant supply and discharge device facing direction, wherein the inlet side of the coolant into the recesses ( 26 / 26a ) of the conversion modules ( 20 / 20 ' ) is introduced, from which it is divided when leaving each in two coolant portions, which through the Kühlmit telflusspassagen ( 37 ) of opposite sides of conversion modules ( 20 / 20 ' ) and there with the coolant portions from the respectively next adjacent conversion modules ( 20 / 20 ' ) unify the conversion arrangement ( 30 ) via the coolant flow passage ( 37 ) to leave. Conversion unit according to claim 12, characterized in that the coolant flow passages ( 37 ) are opened in the coolant supply and discharge device facing direction and are divided into a first family of upstream and a second family of drain-side coolant flow passages, wherein the inlet-side and outlet-side coolant flow passages in the arrangement direction ( 35 / 35a . 36 / 36a ) alternately and on the inlet side, the coolant in the inlet-side coolant flow passages ( 37 ) is divided into two portions of coolant, which through the recesses ( 26 / 26a / 26b ) from opposite sides of the coolant flow passage ( 37 ) arranged conversion modules ( 20 / 20 ' ) and drain in the next adjacent downstream coolant flow passages ( 37 ) with the coolant portions from the next adjacent adjacent upstream coolant flow passages ( 37 ) in order to convert the conversion arrangement ( 30 ) via the drain-side coolant flow passages ( 37 ) to leave. Conversion unit according to one of claims 1 to 11, characterized in that the conversion modules ( 20 / 20 ' ) in a first set of conversion modules ( 20 / 20 ' ) and at least in a second group of conversion modules ( 20 / 20 ' ), wherein in each case at least one conversion module ( 20 / 20 ' ) the second set of conversion modules ( 20 / 20 ) at least one conversion module ( 20 / 20 ' ) the first set of conversion modules ( 20 / 20 ) downstream of the flow. Conversion unit according to claim 15, characterized in that the number of conversion modules ( 20 / 20 ' ) in a group of conversion modules ( 20 / 20 ' ) equal to the number of sets of conversion modules ( 20 / 20 ' ), so that the number of conversion modules ( 20 / 20 ' ) in total from multiplying the number of groups by the number of sets of conversion modules ( 20 / 20 ' ). Conversion unit according to claim 15 or 16, characterized in that the recesses ( 26 / 26a ) of the conversion modules in the coolant supply and discharge device facing direction are open and the conversion modules ( 20 / 20 ' ) in a first group of upstream conversion modules ( 20 / 20 ' ) and in a second group of downstream conversion modules ( 20 / 20 ' ) are present, with upstream and downstream conversion modules in the arrangement direction ( 35 / 35a . 36 / 36a ) alternately and on the inlet side, the coolant in the recesses ( 26 / 26a ) of the upstream conversion modules ( 20 / 20 ' ), from which it divides into two portions of coolant that leave through the coolant flow passages ( 37 ) on opposite sides of the upstream conversion modules ( 20 / 20 ' ) and drain in the next adjacent downstream conversion modules ( 20 / 20 ' ) with the coolant portions from the overflowingly adjacent upstream conversion modules ( 37 ) unite and united by the recesses ( 26 / 26a ) of the downstream conversion modules ( 20 / 20 ' ) flow around the conversion arrangement ( 30 ) to leave. Conversion unit according to one of the preceding claims, characterized in that the heat receiving surface ( 21a ) on the upper side of the heat conducting body ( 21 ) is arranged and the sealing surface ( 24 ) at least in sections on the upper and lower sides of the heat conducting body ( 21 ) and parallel or less than 45 ° to the heat receiving surface ( 21a ) is inclined. Conversion unit according to one of claims 1 to 17, characterized in that the heat absorption area ( 21a ) one to the top and bottom of the heat conducting body ( 21 ) inclined front end surface ( 23a ) and the sealing surface 24 the heat conducting body ( 21 ) in the heat-conducting section ( 21b ) circumferentially and parallel or less than 45 ° to the front end face ( 23a ) is inclined. Conversion unit according to one of the preceding claims, characterized in that between each other in the arrangement direction ( 35 / 35a . 36 / 36a ) adjacent conversion modules ( 20 / 20 ' ) an intermediate piece ( 34 ) is arranged, which the coolant flow passage ( 37 ) in the form of a recess. Conversion unit according to one of claims 1 to 19, characterized in that between each other in the arrangement direction ( 35 / 35a . 36 / 36a ) adjacent conversion modules ( 20 / 20 ' ). a sealant ( 33 ), which measures the distance between the opposing sealing surfaces ( 24 ) of neighboring conversion modules ( 20 / 20 ' ) bridges or contributes to a tight bridging of the same and between two sealant areas as a coolant flow passage ( 37 ) is formed free space. Conversion unit according to one of the preceding claims, characterized in that the conversion unit is used as a radiation source ( 50 ), wherein the conversion arrangement comprises a radiation emission arrangement ( 30 ), the conversion modules are radiation-emitting semiconductor components ( 20 ) and the semiconducting conversion elements are radiation-emitting semiconductor components ( 10 ) are. Conversion unit according to claim 22, characterized in that the radiation-emitting semiconductor component is a laser diode element ( 10 ) and the semiconductor device is a diode laser element ( 20 ). Conversion unit according to claim 23 there characterized in that the laser diode element is an edge-emitting laser diode element ( 10 ) is that on a first side at least a first electrical contact surface ( 11 ) and on a first side opposite the second side at least one second electrical contact surface ( 12 ) and a radiation exit surface inclined to the first and / or the second contact surface, from which radiation a radiation direction ( 15 / 15a ) is emitted, and by its first side cohesively to the heat receiving portion ( 21a ) is attached. Conversion unit according to claim 24, characterized in that the heat release section ( 21c ) at least in sections in projection of the edge emitting laser diode element ( 10 ) perpendicular to the heat receiving surface ( 21 * ) is arranged, the heat conduction direction perpendicular to the heat receiving surface ( 21 * ) and the diode laser components ( 20 ) in a depth direction ( 36b ) parallel to the radiation direction ( 15 / 15a ) are arranged at least in sections one behind the other, wherein in each case the laser diode element ( 10 ) of a first diode laser device ( 20 ) opposite to the radiation direction immediately adjacent second diode laser component ( 20 ) with respect to the laser diode element ( 10 ) of the first diode laser component ( 20 ) is offset against the direction of heat conduction. Conversion unit according to claim 24, characterized in that the diode laser components 20 in a stacking direction ( 35 / 35a ) perpendicular to the heat receiving surface ( 21 * ) and / or perpendicular to the heat conduction sections are arranged one above the other, and the heat-emitting portion ( 21c ) completely outside a stacking direction ( 35 / 35a ) facing projection of the edge emitting laser diode element ( 10 ) is arranged. Conversion unit according to claim 24 or 26, characterized in that the diode laser components 20 in a row direction ( 36 / 36a ) parallel to the Värmeaufnahmefläche ( 21 * ) and / or perpendicular to the heat conduction sections are juxtaposed, and the heat release section ( 21c ) completely outside a perpendicular to the heat receiving surface ( 21 * ) extending projection of the edge emitting laser diode element ( 10 ) is arranged. Conversion unit according to one of claims 1 to 21, characterized in that the conversion unit is as a radiation receiver ( 50 ' ), wherein the conversion arrangement comprises a radiation receiving arrangement ( 30 ' ), the conversion modules are radiation-absorbing semiconductor components ( 20 ' ) and the semiconducting conversion elements radiation-absorbing semiconductor components ( 10 ' ) are. Conversion unit according to claim 28, characterized in that the radiation receiver as a photovoltaic generator ( 50 ' ), wherein the radiation-absorbing semiconductor modules are solar modules ( 20 ' ) and the radiation-absorbing semiconductor components solar cells ( 10 ' ) are. Method for starting up a conversion unit according to one of the preceding claims, characterized in that the conversion modules ( 20 / 20 ' ) before being arranged for conversion ( 30 / 30 ' ) are operated as a test, wherein the radiation power is detected on or from the conversion module as well as on the conversion module or present electrical power. Optical arrangement ( 60 ' ) with a conversion unit ( 50 ' ) according to claim 29 characterized by a collection optics, the radiation beam of the sun with increased irradiance on the entirety of the solar cells ( 10 ' ) of the radiation receiving arrangement ( 30 ' ) steers.