DE03748885T1 - Verfahren zur herstellung von rfid etiketten - Google Patents

Verfahren zur herstellung von rfid etiketten Download PDF

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Publication number
DE03748885T1
DE03748885T1 DE03748885T DE03748885T DE03748885T1 DE 03748885 T1 DE03748885 T1 DE 03748885T1 DE 03748885 T DE03748885 T DE 03748885T DE 03748885 T DE03748885 T DE 03748885T DE 03748885 T1 DE03748885 T1 DE 03748885T1
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DE
Germany
Prior art keywords
rfid
sections
antennas
indexing
transport element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE03748885T
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English (en)
Inventor
Alan Green
Rene Dennis BENOIT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avery Dennison Corp
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26983984&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE03748885(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Publication of DE03748885T1 publication Critical patent/DE03748885T1/de
Pending legal-status Critical Current

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Classifications

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    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y10T156/1077—Applying plural cut laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1097—Lamina is running length web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Abstract

Verfahren zur Ausbildung eines RFID – (Radio- bzw. Funkfrequenz-Identifikation) – Gegenstands, wobei das Verfahren die folgenden Schritte aufweist:
– Vorsehen eines RFID Bahnmaterials aus polymerischem Material mit einer Vielzahl von Ausnehmungen, wobei jede der Ausnehmungen einen RFID Chip enthält;
– Vorsehen einer zweiten Bahn mit darauf beabstandeten Antennen;
– Aufteilen des RFID Bahnmaterials in eine Vielzahl von Abschnitten, wobei jeder der Abschnitte einen oder mehrere der RFID Chips aufweist; v Indizieren bzw. Takten des Abstandes der RFID Abschnitte von einer hohen Dichte auf dem RFID Bahnmaterial auf eine verhältnismäßig niedrige Dichte auf einem RFID Innenmaterial; und
– Anbringen der Abschnitte an eine Vielzahl von Antennen in einem automatischen, kontinuierlichen Prozess, so dass jeder der RFID Chips sich benachbart zu einer der Antennen befindet, um das RFID Innenmaterial zu bilden.

Claims (45)

  1. Verfahren zur Ausbildung eines RFID – (Radio- bzw. Funkfrequenz-Identifikation) – Gegenstands, wobei das Verfahren die folgenden Schritte aufweist: – Vorsehen eines RFID Bahnmaterials aus polymerischem Material mit einer Vielzahl von Ausnehmungen, wobei jede der Ausnehmungen einen RFID Chip enthält; – Vorsehen einer zweiten Bahn mit darauf beabstandeten Antennen; – Aufteilen des RFID Bahnmaterials in eine Vielzahl von Abschnitten, wobei jeder der Abschnitte einen oder mehrere der RFID Chips aufweist; v Indizieren bzw. Takten des Abstandes der RFID Abschnitte von einer hohen Dichte auf dem RFID Bahnmaterial auf eine verhältnismäßig niedrige Dichte auf einem RFID Innenmaterial; und – Anbringen der Abschnitte an eine Vielzahl von Antennen in einem automatischen, kontinuierlichen Prozess, so dass jeder der RFID Chips sich benachbart zu einer der Antennen befindet, um das RFID Innenmaterial zu bilden.
  2. Verfahren nach Anspruch 1, wobei der Indizierungs- bzw. Taktungsschritt ein Inbeziehungbringen der RFID Abschnitte mit den Antennen in einer bahnabwärtigen Richtung umfasst.
  3. Verfahren nach Anspruch 1, wobei der Indizierungs- bzw. Taktungsschritt ein Inbeziehungbringen der RFID Abschnitte mit den Antennen in einer Bahnquerrichtung umfasst.
  4. Verfahren nach Anspruch 1, wobei die Abschnitte durch Stanzen gebildet werden.
  5. Verfahren nach Anspruch 1, wobei die Aufteilungs- und Indizierungs- bzw. Taktungsschritte unter Verwendung eines Schneidelementes und eines Transportelementes bewirkt werden, das RFID Bahnmaterial durch einen Schneideort zwischen dem Schneidelement und einem Transportelement läuft, wobei Abschnitte aus dem RFID Bahnmaterial geschnitten und mit dem Transportelement in Eingriff gebracht werden bzw. das Transportelement an den Abschnitten angreift.
  6. Verfahren nach Anspruch 5, wobei das Transportelement die Abschnitte von dem Schneideort zu einem Übertragungsort befördert, an dem jeder der Abschnitte mit einer Antenne verbunden wird.
  7. Verfahren nach Anspruch 6, wobei das Schneidelement und das Transportelement jeweils zumindest Eines aus der Gruppe sind, die aus Rollen und Gurten gebildet ist.
  8. Verfahren nach Anspruch 5, wobei das Transportelement mit zumindest Einem aus der Gruppe, die aus Vakuumhaltern und Klemmen gebildet ist, an den Abschnitten angreift bzw. mit den Abschnitten zusammenwirkt.
  9. Verfahren nach Anspruch 5, wobei bei dem Indizierungs- bzw. Taktungsschritt die bahnabwärtige Beabstandung der sich auf dem RFID Bahnmaterial befindlichen RFID Chips bei der Aufteilung korrespondierender Abschnitte auf dem Transportelement vergrößert wird, um der Beabstandung der Antennen angeglichen zu werden, mit denen diese Chips am Übertragungsort verbunden werden.
  10. Verfahren nach Anspruch 5, wobei der Indizierungs- bzw. Taktungsschritt ferner den Transportschritt des RFID Bahnmaterials umfasst, so dass die Weiterschaltung bzw. Taktung bzw. Indizierung des bahnabwärtigen Abstandes des RFID im Verhältnis zu dem Abstand dieser Chips auf dem Transportelement bewirkt wird.
  11. Verfahren nach Anspruch 6, wobei der Anbringungsschritt das Inkontaktbringen jedes der Abschnitte auf dem Transportelement mit jeweiligen Antennen auf der Antennenbahn unter Druck umfasst.
  12. Verfahren nach Anspruch 11, ferner mit dem Schritt des Abschirmens der RFID Chips auf den Abschnitten gegen Druck an einem Übertragungsort.
  13. Verfahren nach Anspruch 11, ferner mit dem Schritt des Verbindens jeweiliger Abschnitte und Antennen miteinander unter Verwendung eines leitenden oder nicht leitenden Haftmittels, das auf der Antennenbahn strukturiert ist.
  14. Verfahren nach Anspruch 1, wobei das Verfahren ferner folgende Schritte umfaßt: – Abrollen einer ersten Deckmaterialrolle und Laminieren der ersten Deckmaterialrolle auf das RFID Innenmaterial und – Abwickeln einer zweiten Deckmaterialrolle und Anbringen des Deckmaterials von der zweiten Rolle auf das RFID Innenmaterial gegenüber dem ersten Deckmaterial.
  15. Verfahren nach Anspruch 1, wobei nach dem Anbringungsschritt der Abschnitte an einer Vielzahl von Antennen in einem automatischen, kontinuierlichen Prozess das Verfahren ferner den Schritt des Ausbildens eines Haftetiketts umfasst.
  16. Verfahren nach Anspruch 1, wobei Antennen auf der zweiten Bahn gebildet werden durch Eine aus der Gruppe gebildet aus: (i) Drucken leitender Tinte; (ii) Sputtern bzw. Aufstäuben bzw. Aufsprühen von Metall; (iii) Laminieren einer Folie; und (iv) Heißpressen bzw. Heißprägen.
  17. Verfahren nach Anspruch 3, wobei der Indizierungs- bzw. Taktungsschritt in der Bahnquerrichtung das Aufspalten des RFID Bahnmaterials aus polymerischem Material in Spuren umfasst.
  18. Verfahren zur Ausbildung eines RFID Gegenstands, wobei das Verfahren die folgenden Schritte aufweist: – Vorsehen eines RFID Bahnmaterials aus polymerischem Material mit einer Vielzahl von Ausnehmungen, wobei jede der Ausnehmungen einen RFID Chip enthält; – Vorsehen einer zweiten Bahn mit, darauf beabstandeten Antennen; – Aufteilen des RFID Bahnmaterials in eine Vielzahl von Abschnitten, wobei jeder der Abschnitte einen oder mehrere der RFID Chips aufweist; – Weiterschalten bzw. Takten bzw. Indizieren des Abstandes der RFID Abschnitte von einer hohen Dichte auf dem RFID Bahnmaterial auf eine verhältnismäßig niedrige Dichte auf dem RFID Innenmaterial sowohl in bahnabwärtiger Richtung als auch in Bahnquerrichtung; und – Anbringen der Abschnitte an eine Vielzahl von Antennen in einem automatischen, kontinuierlichen Prozess, so dass jeder der RFID Chips sich benachbart zu einer der Antennen befindet, um ein RFID Innenmaterial zu bilden.
  19. Verfahren nach Anspruch 18, wobei die Abschnitte durch Stanzen gebildet werden.
  20. Verfahren nach Anspruch 18, wobei die Aufteilungs- und Indizierungs- bzw. Taktungsschritte unter Verwendung eines Schneidelements und eines Transportelementes bewirkt werden, wobei das RFID Bahnmaterial durch einen Schneideort zwischen dem Schneidelement und dem Transportelement läuft, und wobei Abschnitte aus dem RFID Bahnmaterial geschnitten und mit dem Transportelement in Eingriff gebracht werden, bzw. wobei das Transportelement an den Abschnitten angreift.
  21. Verfahren nach Anspruch 20, wobei das Transportelement Abschnitte von dem Schneideort zu einem Übertragungsort befördert, an dem jeder der Abschnitte mit einer Antenne verbunden wird.
  22. Verfahren nach Anspruch 20, wobei das Schneidelement und das Transportelement jeweils zumindest Eines aus der Gruppe sind, die aus Rollen oder Gurten gebildet ist.
  23. Verfahren nach Anspruch 20, wobei das Transportelement mit zumindest Einem aus der Gruppe, die aus Vakuumhaltern oder Klemmen gebildet ist, an den Abschnitten angreift bzw. mit den Abschnitten zusammenwirkt.
  24. Verfahren nach Anspruch 20, wobei bei dem Indizierungs- bzw. Taktungsschritt die bahnabwärtige Beabstandung der sich auf dem RFID Bahnmaterial befindlichen RFID Chips bei der Aufteilung korrespondierender Abschnitte auf dem Transportelement vergrößert wird, um der Beabstandung der Antennen angeglichen zu werden, mit denen diese Chips an dem Übertragungsort verbunden werden.
  25. Verfahren nach Anspruch 20, wobei der Indizierungs- bzw. Taktungsschritt ferner den Transportschritt des RFID Bahnmaterials umfasst, so dass eine Weiterschaltung bzw. Taktung bzw. Indizierung des bahnabwärtigen Abstandes des RFID im Verhältnis zum Abstand dieser Chips auf dem Transportelement bewirkt wird.
  26. Verfahren nach Anspruch 18, wobei das Verfahren ferner folgende Schritte umfasst: – Abrollen einer ersten Deckmaterialrolle und Laminieren der ersten Deckmaterialrolle auf das RFID Innenmaterial und – Abwickeln einer zweiten Deckmaterialrolle und Anbringen des Deckmaterials von der zweiten Rolle auf das RFID Innenmaterial gegenüber dem ersten Deckmaterial.
  27. Verfahren nach Anspruch 18, wobei nach dem Anbringungsschritt der Ab schnitte an eine Vielzahl von Antennen in einem automatischen, kontinuierlichen Prozess, das Verfahren ferner den Schritt der Ausbildung eines Haftetikettes umfasst.
  28. Verfahren nach Anspruch 18, wobei Antennen auf der zweiten Bahn gebildet werden durch Eine aus der Gruppe gebildet aus: (i) Drucken leitender Tinte; (ii) Sputtern bzw. Aufstäuben bzw. Aufsprühen von Metall; (iii) Laminieren einer Folie; und (iv) Heißpressen bzw. Heißprägen.
  29. Verfahren nach Anspruch 18, wobei der Indizierungs- bzw. Taktungsschritt in der Bahnquerrichtung das Aufspalten des RFID Bahnmaterials aus polymerischem Material in Spuren umfasst.
  30. Verfahren zur Ausbildung eines RFID Gegenstandes, wobei das Verfahren die folgenden Schritte aufweist: – Vorsehen eines RFID Bahnmaterials aus polymerischem Material mit einer Anordnung von RFID Chips; – Vorsehen einer zweiten Bahn mit darauf beabstandeten Antennen; – Aufteilen des RFID Bahnmaterials in eine Vielzahl von Abschnitten, wobei jeder der Abschnitte einen oder mehrere der RFID Chips aufweist; – Weiterschalten bzw. Takten bzw. Indizieren des Abstandes der RFID Abschnitte von einer hohen Dichte auf dem RFID Bahnmaterial auf eine verhältnismäßig niedrige Dichte auf einem RFID Innenmaterial; und – Anbringen der Abschnitte an eine Vielzahl von Antennen in einem automatischen, kontinuierlichen Prozess, so dass jeder der RFID Chips sich benachbart zu einer der Antennen befindet, um das RFID Innenmaterial zu bilden.
  31. Verfahren nach Anspruch 30, wobei der Indizierungs- bzw. Taktungsschritt ein Inbeziehungbringen der RFID Abschnitte mit den Antennen in einer bahnabwärtigen Richtung umfasst.
  32. Verfahren nach Anspruch 30, wobei der Indizierungs- bzw. Taktungsschritt ein Inbeziehungbringen der RFID Abschnitte mit den Antennen in einer Bahnquerrichtung umfasst.
  33. Verfahren nach Anspruch 30, wobei die Abschnitte durch Stanzen gebildet werden.
  34. Verfahren nach Anspruch 30, wobei die Aufteilungs- und Indizierungs- bzw. Taktungsschritte unter Verwendung eines Schneidelementes und eines Transportelementes bewirkt werden, das RFID Bahnmaterial durch einen Schneideort RFID Bahnmaterial läuft und mit dem Transportelement in Eingriff gebracht wird bzw. das Transportelement an dem RFID Bahnmaterial angreift.
  35. Verfahren nach Anspruch 34, wobei das Transportelement Abschnitte von dem Schneideort zu einem Übertragungsort fördert, an dem jeder der Abschnitte mit einer Antenne verbunden wird.
  36. Verfahren nach Anspruch 34, wobei das Schneidelement und das Transportelement jeweils zumindest Eines aus der Gruppe sind, die aus Rollen oder Gurten gebildet ist.
  37. Verfahren nach Anspruch 34, wobei das Transportelement mit zumindest Einem aus der Gruppe, die aus Vakuumhaltern oder Klemmen gebildet ist, an den Abschnitten angreift bzw. mit den Abschnitten zusammenwirkt.
  38. Verfahren nach Anspruch 34, wobei der Indizierungs- bzw. Taktungsschritt die bahnabwärtige Beabstandung der sich auf dem RFID Bahnmaterial befindlichen RFID Chips bei der Aufteilung der korrespondierenden Abschnitte auf dem Transportelement vergrößert wird, um der Beabstandung der Antennen angeglichen zu werden, mit denen diese Chips an dem Übertragungsort verbunden werden.
  39. Verfahren nach Anspruch 34, wobei der Indizierungs- bzw. Taktungsschritt fer ner einen Transportschritt des RFID Bahnmaterials umfasst, so dass eine Indizierung des bahnabwärtigen Abstandes des RFID relativ zu dem Abstand dieser Chips auf dem Transportelement bewirkt wird.
  40. Verfahren nach Anspruch 34, wobei das Verfahren ferner folgende Schritte aufweist: – Abrollen einer ersten Deckmaterialrolle und Laminieren der ersten Deckmaterialrolle auf das RFID Innenmaterial und – Abwickeln einer zweiten Rolle von Deckmaterial und Anbringen des Deckmaterials von der zweiten Rolle auf das RFID Innenmaterial gegenüber dem ersten Deckmaterial.
  41. Verfahren nach Anspruch 34, wobei nach dem Anbringungsschritt der Abschnitte an eine Vielzahl von Antennen in einem automatischen, kontinuierlichen Prozess, das Verfahren ferner den Schritt der Ausbildung eines Haftetikettes umfasst.
  42. Verfahren nach Anspruch 34, wobei Antennen auf der zweiten Bahn gebildet werden durch Eine aus der Gruppe gebildet aus: (i) Drucken leitender Tinte; (ii) Sputtern bzw. Aufstäuben bzw. Aufsprühen von Metall; (iii) Laminieren einer Folie; und (iv) Heißpressen bzw. Heißprägen.
  43. Verfahren nach Anspruch 32, wobei der Indizierungs- bzw. Taktungsschritt in der Bahnquerrichtung ein Aufspalten des RFID Bahnmaterials aus polymerischem Material in Spuren umfasst.
  44. Verfahren nach Anspruch 32, wobei der Indizierungs- bzw. Taktungsschritt in der Bahnquerrichtung ferner das Aufspalten des RFID Bahnmaterials in Spuren mit einem RFID Chip pro Spur umfasst.
  45. Verfahren nach einem der Ansprüche 7, 22 oder 36, wobei das Transportelement einen elastomerischen Gurt aufweist.
DE03748885T 2002-01-18 2003-01-17 Verfahren zur herstellung von rfid etiketten Pending DE03748885T1 (de)

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