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Publication numberCN2767460 Y
Publication typeGrant
Application numberCN 200420002309
Publication date29 Mar 2006
Filing date2 Feb 2004
Priority date31 Jan 2003
Also published asUS7087144, US20040149573, US20060237308
Publication number200420002309.6, CN 200420002309, CN 2767460 Y, CN 2767460Y, CN-Y-2767460, CN200420002309, CN200420002309.6, CN2767460 Y, CN2767460Y
InventorsH赫奇恩
Applicant应用材料股份有限公司
Export CitationBiBTeX, EndNote, RefMan
External Links: SIPO, Espacenet
Contact ring assembly for supporting a substrate in an electrochemical plating system
CN 2767460 Y
Abstract
The utility model provides a contact assembly for a substrate in an electrochemical plating system, which comprises a conductive contact ring, a first electrical insulating layer covered on the outer surface of the contact ring and a plurality of elastic and conductive finger-shaped contact pieces inwards extended from the radial direction of the contact ring, wherein each finger-shaped contact piece is provided with a substrate contact tail end attached to the terminal of the remote end of each finger-shaped contact piece. The contact assembly for substrate in electrochemical plating system also comprises a second electrical insulating layer of a body part for covering the finger-shaped contact pieces, the second electrical insulating layer is bent following the finger-shaped contact pieces, and meanwhile, the electrical insulation of the body is kept.
Claims(18)  translated from Chinese
1.一用来支承在电化学镀敷系统中的一基底的接触环组件,其特征在于,包括多个从环组件的下表面径向向内延伸的弹性的和导电的基底接触指形件,多个指形件各具有一由第一导电材料制成的导电的内芯件,以及一用黄铜镀敷到内芯件上的导电的基底接触末端,该接触末端由一不同于第一导电材料的第二导电材料制成。 1. A for supporting in an electrochemical plating system of a substrate contact ring assembly comprising a plurality of resilient ring assembly from the lower surface extending radially inwardly of the conductive substrate and the contact fingers , a plurality of fingers each having a conductive inner core member made of the first conductive material, and a brass plating to the conductive substrate contacts on the ends of the inner core member, which differs from the first contact end by a The second conductive material is made of a conductive material.
2.如权利要求1所述的接触环组件,其特征在于,多个弹性的和导电的基底接触指形件还包括一形成在内芯件上的外电气绝缘层。 2. The contact ring assembly according to claim 1, characterized in that a plurality of resilient contact fingers and the conductive substrate shaped member further comprising an outer electrically insulating layer is formed on the inner core member.
3.如权利要求2所述的接触环组件,其特征在于,内导电芯件和外电气绝缘层是弹性的。 2 contact ring assembly according to claim, characterized in that the inner conductive core and an outer electrically insulating layer is elastic.
4.如权利要求2所述的接触环组件,其特征在于,第一导电材料是不锈钢,第二导电材料是下列材料中的至少一种:铂、钽、钛、铟、钯和它们的合金。 The contact ring assembly according to claim 2, characterized in that the first conductive material is stainless steel, the second conductive material is at least one of the following materials: platinum, tantalum, titanium, indium, palladium, and alloys thereof .
5.一用于电化学镀敷系统的接触环,其特征在于,包括:一上环件;一通过多个支承件固定在上环件上的下环件,下环件具有一向内延伸的突缘;多个从下环件径向向内延伸的垂直的弹性的导电接触销;一覆盖多个垂直的弹性的导电接触销的电气绝缘层;以及多个附连在多个垂直的弹性的导电接触销的各个终端上的导电末端件。 5. A system for the electrochemical plating of the contact ring, characterized by comprising: an upper ring member; a support member by a plurality of ring member fixed to the lower ring, the lower ring member has an inwardly extending flange; a plurality of conductive contact pins extending from the lower annular member radially inwardly of the vertical elasticity; a plurality of vertical covering conductive resilient contact pins electrically insulating layer; and a plurality of elastic attached in a plurality of vertical each terminal of the conductive terminal member on the conductive contact pin.
6.如权利要求5所述的接触环,其特征在于,上环件、下环件、支承件,以及突缘由第一导电材料制成。 5 6. The contact ring according to claim, characterized in that the upper ring, the lower ring member, the support member is made, and the first conductive material projecting reason.
7.如权利要求6所述的接触环,其特征在于,末端件是由第二导电材料制成,第二导电材料不同于第一导电材料。 7. The contact ring according to claim 6, characterized in that the end piece is composed of a second conductive material, second conductive material different from the first conductive material.
8.如权利要求7所述的接触环,其特征在于,末端件由下列材料中的至少一个制成:铂、钽、钛、铟、钯和它们的合金,其中,环件、支承件,以及突缘由钢制成。 8. The contact ring according to claim 7, characterized in that the end piece is made from at least one of the following materials: platinum, tantalum, titanium, indium, palladium, and alloys thereof, wherein the ring member, the support member, and sudden cause steel.
9.如权利要求8所述的接触环,其特征在于,多个导电末端件是用黄铜镀敷到多个垂直的弹性的导电接触销的终端上。 9. contact ring according to claim 8, wherein the plurality of conductive terminal member is made of brass plated with a plurality of vertical plating to the elastic conductive contact terminal pins.
10.如权利要求9所述的接触环,其特征在于,还包括一形成在下环件的上表面上的环形隆起件,该环形隆起件构造成接合附连在推力板组件上的环形密封件。 10. The contact ring according to claim 9, characterized in that it further comprises an annular ridge member formed on the upper surface of the lower ring member, the annular ridge is configured to engage the attachment member on the thrust plate assembly of an annular seal .
11.如权利要求5所述的接触环,其特征在于,电气绝缘层在接触销垂直移动的过程中对多个垂直的弹性的导电接触销提供连续的绝缘层。 11. The contact ring according to claim 5, characterized in that the electrically insulating layer in contact with the vertical movement of the pin to provide a continuous process of the insulating layer on a conductive resilient contact pins of a plurality of vertical.
12.一用于电化学镀敷系统的基底接触组件,其特征在于,包括:一导电接触环;一覆盖接触环的外表面的第一电气绝缘层;多个从接触环径向向内地延伸的导电的弹性的接触指形件,各接触指形件具有一附连到其远端的终端处的基底接触末端;以及一覆盖接触指形件的本体部分的第二电气绝缘层,第二电气绝缘层构造成随接触指形件而弯曲,同时,保持本体部分的电气绝缘。 12. A contact assembly for an electrochemical plating base deposition system, characterized by comprising: an electrically conductive contact ring; a first electrically insulating layer covering the outer surface of the contact ring; a plurality of radially extending inwardly from the contact ring conductive resilient contact fingers, each contact finger having a terminal attached thereto at the distal end of the substrate contacting end; and a second contact fingers electrically insulating covering layer of the body portion of the shaped member, a second electrically insulating layer is configured with the contact fingers bent, while maintaining the electrically insulating body portion.
13.如权利要求12所述的基底接触组件,其特征在于,接触末端由下列材料中的至少一个制成:铂、钽、钛、铟、钯和它们的合金。 13. The substrate contact assembly according to claim 12, characterized in that the contact tip is made from at least one of the following materials: platinum, tantalum, titanium, indium, palladium, and alloys thereof.
14.如权利要求13所述的基底接触组件,其特征在于,接触末端是用黄铜镀敷到接触指形件的终端上。 14. The substrate contact assembly according to claim 13, characterized in that the contact terminal is brass plating on the terminal of the contact fingers.
15.如权利要求14所述的基底接触组件,其特征在于,接触环和接触指形件由不锈钢制成。 15. The substrate contact assembly according to claim 14, characterized in that the contact ring and the contact fingers are made of stainless steel.
16.如权利要求12所述的基底接触组件,其特征在于,多个接触指形件一体地形成到接触环中。 16. The substrate contact assembly according to claim 12, wherein the plurality of contact fingers are integrally formed into the contact ring.
17.如权利要求12所述的基底接触组件,其特征在于,接触指形件和接触末端由不同的材料制成。 17. The substrate contact assembly according to claim 12, characterized in that the contact fingers and contact tip made of different materials.
18.如权利要求17所述的基底接触组件,其特征在于,接触指形件由不锈钢制成,而接触末端由铂制成,其中,接触末端是用黄铜镀敷到接触指形件上。 18. The substrate contact assembly 17 to the contact fingers of the cladding member formed on claim, characterized in that the contact fingers made of stainless steel, while the contact tip is made of platinum, wherein the contact terminal is brass plated .
Description  translated from Chinese
用来支承在电化学镀敷系统中的一基底的接触环组件 For supporting in an electrochemical plating system of a substrate contact ring assembly

技术领域 FIELD

本实用新型的实施例一般涉及电化学镀敷,具体来说,涉及一用于电化学镀敷系统的接触环。 Embodiment of the present utility model generally relates to electrochemical plating, particularly to a contact ring for an electrochemical plating system.

背景技术 BACKGROUND

不到四分之一微米尺寸的部件的金属镀敷是当代和未来几代集成电路制造工艺的基本技术。 Less than a quarter micron-sized metal plated parts are present and future generations of integrated circuit fabrication processes underlying technology. 具体来说,在诸如超大规模集成类型器件的器件中,即,具有带有一百万个逻辑门的集成电路的器件中,位于这些器件心脏的多级互连,通常通过充填高纵横比(例如,大于约4∶1)的带有导电材料(例如,铜或铝)的互连部件而形成。 Specifically, in the types of devices such as very large scale integrated devices, i.e., having an integrated circuit device with one million logic gates, the multilevel interconnection is located in the heart of these devices, typically by filling high aspect ratio ( e.g., greater than about 4) of the interconnecting member with a conductive material (e.g., copper or aluminum) is formed. 传统上,诸如化学蒸发沉积(CVD)和物理蒸发沉积(PVD)的沉积技术已被用来充填这些互连部件。 Traditionally, chemical vapor deposition (CVD) and physical vapor deposition such as (PVD) deposition techniques have been used to fill the interconnecting member. 然而,随着互连尺寸减小和纵横比增加,通过传统的金属镀敷技术的无间隙的互连部件充填不断地变得困难。 However, as the interconnect sizes decrease and aspect ratios increase, by a conventional technique of plating a metal interconnection member is filled without a gap continuously difficult. 其结果,出现了诸如电化学镀敷(ECP)和非电解镀敷之类的镀敷技术的有前途的工艺过程,它们在集成电路制造工艺中用于不到四分之一微米尺寸高纵横比的互连部件的无间隙充填。 As a result, there has been such an electrochemical plating (ECP) and electroless plating plating technology like a promising process, they are used for less than a quarter the size of high-aspect-micron integrated circuit manufacturing process No gap-filling than the interconnection member.

例如,在ECP工艺过程中,形成为基底(或其上沉积的镀层)表面的不到四分之一微米尺寸高纵横比的部件,可以用诸如铜之类的导电材料进行有效地充填。 For example, in the ECP process, is formed as less than a quarter micron sized substrate (or a deposition coating) the surface of high aspect ratio member, may be a conductive material such as copper effectively filled. 一ECP工艺通常包括:首先,在表面上沉积一籽晶层并沉积到基底的部件内(籽晶层沉积过程通常独立于ECP镀敷过程),然后,基底的表面部件暴露在电化学镀敷溶液中,同时,一电偏置施加在基底和定位在镀敷溶液中的一阳极之间。 An ECP process generally includes: First, on a surface and depositing a seed layer is deposited onto the substrate member (seed layer deposition process is usually independent of ECP plating process), and then, the surface of the base member is exposed in an electrochemical plating solution, while an electrical bias is applied between the substrate and positioned in the plating solution in an anode. 镀敷溶液通常富有被镀敷到基底表面上去的正离子,因此,施加电偏置致使这些正离子跑出镀敷溶液而被镀敷到籽晶层上。 Plating solution is generally rich plated surface of the substrate up to the positive ions, therefore, an electrical bias is applied so that the positive ions Ran plating solution is plated onto the seed layer.

典型地,电偏置通过分布在被镀敷的基底周缘周围的一个或多个电接触供应到基底上。 Typically, electrical bias is supplied to a plated through distributed around the periphery of the substrate or in a plurality of electrical contacts on the substrate. 通常地,形成在基底上的籽晶层可从基底倾斜边缘周围的镀敷表面延伸,并可延伸到基底的非镀敷表面或背面上。 Generally seed layer, formed on the substrate may be inclined around the edge of the plating deposited surface extends from the base, and may extend to the non-plating surface or back surface of the substrate. 因此,对于不同的系统,电接触可以与基底的镀敷表面(正面)或非镀敷表面(背面)发生电气的接触。 Thus, for different systems, the electrical contact with the substrate plating surface (front surface) or non-plated surface (back surface) of the electrical contact occurs. 不管什么部位,通常要求将电接触以及基底的非镀敷表面与镀敷材料隔绝,以避免正离子镀敷到电接触上,因为在电接触上镀敷可变化电接触的电阻,并对基底的均匀镀敷产生不利影响。 No matter what position, typically require non-plated surface of the substrate and in electrical contact with the plated material isolated to avoid positive ion plating onto electrical contact, since the electrical contact plated electrical contact resistance can be varied, and the substrate uniform plating adversely affected. 将电接触以及非镀敷表面与镀敷溶液隔绝的传统的方法通常包括:提供一个或多个密封元件来接触与电接触相同的基底表面。 The traditional method of the electrical contact and non-plating surface of the plating solution is isolated and generally comprises: providing one or more sealing elements in contact with the electrical contact to the same surface of the substrate. 例如,定位成接合镀敷表面的密封件可放置在定位成接触镀敷表面的电接触的附近。 For example, positioned to engage the plated surface of the seal member is positioned to be placed in the vicinity of the contact plating of the electrical contact surface. 密封件和电接触也提供对基底的支承。 Seals and electrical contact is also provided to the substrate support. 然而,电接触和相关的密封的组合通常占据镀敷表面区域的周缘的若干毫米(一般约在3和7毫米之间)。 However, a combination of electrical contacts and associated sealing surface of the plated area typically occupy the periphery of a few millimeters (typically between about 3 and 7 mm). 由于该表面区域用来用作电气的和密封的接触,所以,该区域不能用来支持器件的形成。 Since the surface area is used as electrical and sealing contact, and therefore, the area can not be used to support the formation of the device.

在努力利用该周缘的表面区域中,某些系统可包括:定位成接合非镀敷表面的密封件,其邻近定位成接触非镀敷表面的电接触。 In efforts to use the peripheral edge of the surface area, some systems may include: positioned to engage a non-plated surface of the seal member, which is positioned adjacent the electrical contact with the non-plated contact surfaces. 然而,在镀敷表面上没有密封件或电接触来支承基底,可能需要某些其它的装置来支承基底。 However, on the plating surface is no seal or electrical contact to a supporting substrate, may require some other means for supporting the substrate. 通常地,一真空施加到基底上,来抽拉非镀敷表面接触密封件和电接触。 Typically, a vacuum is applied to the substrate, to pull the non-plating surface contact seal and the electrical contact. 然而,施加到基底上的真空可在基底上产生应力,并可导致基底的破裂。 However, a vacuum can be applied to the stress on the substrate on the substrate, the substrate can lead to rupture. 如果密封件恰巧泄漏,则真空可能不能用足够的力保持基底抵靠电接触,而镀敷溶液可进入真空,造成对真空的损坏。 If the seal leakage happens, the vacuum may not be maintained with sufficient force against the electric contact substrate, and plating solution can enter the vacuum, causing damage to the vacuum. 此外,在接触销接合基底的镀敷表面的系统中,接触销通常被一密封包围,该密封构造成防止电镀溶液与电接触销接触。 In addition, the contact pin engages the substrate plating surface system, the contact pins are usually surrounded by a seal which is configured to prevent the plating solution in contact with the electrical contact pin. 尽管干接触销的概念值得注意,但这种结构存在若干的缺点。 Although the concept of dry contact pin is noteworthy, but this configuration has several disadvantages. 即,干接触结构在基底之间保持流体紧密密封方面提出挑战,这样,流体经常渗透过密封并暴露到接触销,这可变化销的电阻和镀敷的均匀性。 That is, the dry contact between the substrate holding structure fluid tight seal challenging aspects, so that the fluid permeates through the seal and frequently exposed to the contact pin, which can change the resistance of the pin and the plating uniformity. 此外,传统的接触环利用固定的电接触,因此,当一被镀敷的基底不是完全的平面时,各种固定的接触对基底的接触将具有不同的成功程度。 In addition, the use of conventional contact ring fixed electrical contact, and therefore, when a substrate to be plated is not completely flat, the various fixed contacts contact the substrate will have varying degrees of success.

因此,需要有一改进的装置来将一基底固定在电化学镀敷系统中。 Therefore, there is a need for improved means to a fixed substrate in an electrochemical plating system.

实用新型内容本实用新型的实施例通常提供一用来支承电化学镀敷系统中的基底的接触组件,其中,该接触组件包括一接触环和一推力板组件。 The present utility model Utility Model embodiments generally provide an electrochemical plating system for supporting the substrate in the contact assembly, wherein the contact assembly comprises a contact ring and a thrust plate assembly. 接触环包括一具有一上表面和一下表面的环形的环件,一定位在上表面上的环形的隆起件,以及多个从下表面径向向内延伸的弹性的和导电的基底接触指形件。 Comprises a contact ring having an upper surface and a lower surface of the annular ring member, a positioning ridge on the upper surface of the annular member, and a plurality of elastic extending radially inwardly from the lower surface of the substrate and the conductive contact finger pieces. 推力板包括一环形板件,其尺寸做成被接纳在环形的环件内,以及一从板件径向向外延伸的密封件,该密封件构造成接合环形隆起件,以与其形成一流体密封。 Thrust plate comprises an annular plate member sized to be received within the annular ring member, and a seal member extending radially outwardly from the plate member, the seal member configured to engage an annular ridge member to form a fluid therewith seal.

一用来支承电化学镀敷系统中的一基底的接触环组件包括多个从环组件的下表面径向向内延伸的弹性的和导电的基底接触指形件,多个指形件各具有一由第一导电材料制成的导电的芯件,以及一用黄铜镀敷到芯件上的导电的基底接触末端,该接触末端由一不同于第一导电材料的第二导电材料制成。 An electrochemical plating system for supporting a substrate in contact with the ring assembly comprises a plurality of resilient ring assembly from the lower surface of the radially inwardly extending conductive substrate and contact fingers, each having a plurality of fingers a conductive core member by a first electrically conductive material, and a brass plating to the base end of the contact on the conductive core member, the contact end by a second conductive material different from the first conductive material formed .

本实用新型的实施例还提供一用于电化学镀敷系统的接触环组件。 The utility model embodiments also provide a contact ring assembly for an electrochemical plating system. 接触环组件一般包括一上环件,一通过多个支承件固定在上环件上的下环件,下环件具有一向内延伸的突缘,多个从下环件径向向内延伸的垂直的弹性的导电接触销,一覆盖多个垂直的弹性的导电接触销的电气绝缘层,以及多个附连在多个垂直的弹性的导电接触销的各个终端上的导电末端件。 Contact ring assembly generally includes an upper ring member, a support member by a plurality of ring member fixed to the lower ring, the lower ring member has an inwardly extending flange, a plurality of radially extending downwardly from the ring member inwardly conductive contact pin vertical elastic, a plurality of vertical elastic covering electrically insulating layer of electrically conductive contact pins, and a conductive terminal member attached to each of the plurality of terminals in a plurality of vertical resilient conductive contact pins on the.

本实用新型的实施例还提供一用于支承电化学镀敷系统中的一基底的接触环组件。 The utility model embodiments also provide a contact ring assembly for supporting an electrochemical plating system of a substrate. 环组件包括多个从环组件的下表面径向向内地延伸的弹性和导电的基底接触指形件。 Base ring assembly includes a plurality of elastic and conductive ring assembly from the lower surface of the radial extension of the mainland contact fingers. 多个指形件各具有一用第一导电材料制成的导电内芯件,以及一用黄铜镀敷到内芯件上的导电基底接触末端,该接触末端由一不同于第一导电材料的第二导电材料制成。 A plurality of fingers each having a conductive inner core member with a first electrically conductive material, and a brass plating to the conductive substrate contacts on the end of the inner core member, the contact end by a conductive material different from the first a second electrically conductive material.

本实用新型的实施例还提供一用于电化学镀敷系统的基底接触组件。 The utility model embodiments also provide a base contact assembly for electrochemical plating system. 接触组件包括一导电接触环,一覆盖接触环的外表面的第一电气绝缘层,以及多个从接触环径向向内地延伸的导电的弹性的接触指形件,各接触指形件具有一附连到其远端的终端处的基底接触末端。 A contact assembly comprising an elastic conductive contact ring, a contact ring covering the outer surface of a first electrically insulating layer, and a plurality of radially extending inwardly from the contact ring of electrically conductive contact fingers, each contact finger having a attached to the base of its distal end at the terminal ends of the contact. 接触组件还包括一覆盖接触指形件的本体部分的第二电气绝缘层,第二电气绝缘层构造成随接触指形件而弯曲,同时,保持本体部分的电气绝缘。 Contact assembly further comprises a cover means of the second electrically insulating layer contacting the body portion of the shaped member, a second electrically insulating layer is configured with the contact fingers bent, while maintaining the electrically insulating body portion.

附图的简要说明所以,因要详细地能理解本实用新型上述的诸特征,可参照本实用新型的实施例对以上概括的本实用新型作更特别详细的描述,某些实施例图示在附后的附图中。 BRIEF DESCRIPTION So, because they have to be able to understand in detail the utility model, all the above features, can refer to a more detailed description of particular embodiments of the utility model outlined above for the utility model, certain embodiments illustrated in in the attached drawings. 然而,应该指出的是,附图只是示出本实用新型的典型的实施例,因此,不认为限制本实用新型的范围,因为,本实用新型可允许其它同样有效的实施例。 However, it should be noted that the figures are only shown the utility model of exemplary embodiments, therefore, are not considered as limiting the scope of the utility model, because the utility model may allow other equally effective embodiments.

图1示出包含本实用新型的一接触环的实施例的示范的电化学镀敷的电解槽的截面图。 1 shows a sectional view of the present utility model comprises an electrochemical a contact ring exemplary embodiment of plating cell of FIG.

图2是带有定位成与接触环接触的推力板的本实用新型的一示范的接触环的立体图。 Figure 2 is a perspective view of the contact with the ring positioned in contact with the thrust plate contact the utility model of a demonstration of the ring.

图3是本实用新型的一示范的接触环的截面图。 Figure 3 is a cross-sectional view of a contact of the utility model demonstration of the ring.

图4是本实用新型的一示范的接触销环的平面图。 Figure 4 is a plan view of the contact pin ring a demonstration of the utility model.

具体实施方式 DETAILED DESCRIPTION

本实用新型的实施例一般提供一构造成固定和电气地接触在电化学镀敷系统中的一基底的接触环。 The utility model provides a general embodiment configured to be secured and electrically contacted in an electrochemical plating system of a substrate contact ring. 该接触环一般包括多个电接触销,其径向地定位并构造成电气地接触靠近基底周缘的被镀敷的基底。 The contact ring generally includes a plurality of electrical contact pins, which are radially positioned and configured to electrically contact the substrate near the periphery of the substrate to be plated. 此外,尽管接触销嵌入在绝缘本体内,但接触销构造成部分的弹性,并实现为一湿式接触结构。 In addition, although the contact pin is embedded in the insulating body, but the elastic contact pins configured as part of, and is implemented as a wet contact structure.

图1示出本实用新型示范的电化学镀敷(ECP)系统100。 Figure 1 shows a demonstration of the utility model of the electrochemical plating (ECP) system 100. ECP系统100一般包括一头组件致动器102,一基底保持器组件110,以及一镀敷盆组件160。 ECP system 100 generally includes an actuator assembly 102, a substrate holder assembly 110, and a plating basin assembly 160. 头组件致动器102通常通过一可枢转地安装的支承臂106附连在一支承底座104上。 Head assembly actuator 102 typically by a pivotally mounted support arm 106 attached to a support base 104 on. 头组件致动器102适于支承在镀敷盆160上方不同位置处的基底保持器组件110(通常也称之为一ECP接触环),具体来说,头组件致动器102构造成将基底保持器组件110定位到包含在盆160内的镀敷溶液中,以便进行镀敷操作。 Head assembly actuator 102 is adapted to support the plating pot 160 at different locations above the substrate holder assembly 110 (also commonly referred to as a contact ring ECP), specifically, the head assembly actuator 102 is configured in the substrate holder assembly 110 is positioned within the basin 160 to contain a plating solution for plating operation. 头组件致动器102通常构造成:在基底120放置在镀敷溶液中之前、之中和之后,能转动,垂直致动,以及倾斜附连在其上的基底保持器组件110。 Head assembly actuator 102 is typically configured to: in the base 120 is placed in the plating solution before, during and after, can rotate, the vertical actuator, and an inclined attachment of the substrate on which the holder assembly 110.

镀敷盆组件160通常包括一内盆162,其包含在一较大直径的外盆164内。 Plating basin assembly 160 generally includes an inner basin 162, which is included in a larger diameter of the outer bowl 164. 可采用任何合适的技术来将一镀敷溶液供应给镀敷盆组件160。 Any suitable technique to a plating solution is supplied to the plating basin assembly 160. 例如,一镀敷溶液可通过在内盆162底表面处的入口166供应到内盆162。 For example, a plating solution 166 may be supplied to the bowl 162 through the bottom surface of the inner basin 162 at the entrance. 入口166可连接到一供应管,例如,从一电解液容器系统(未示出)引出的供应管。 Inlet 166 may be connected to a supply pipe, for example, from an electrolyte container system (not shown) led out of the supply tube. 可操作外盆164来收集来自内盆162的流体,并通过一流体排放管168排出收集的流体,排放管168也可连接到电解液容器系统,并构造成将收集的流体返回到容器。 An outer basin 164 is operable to collect fluid from the bowl 162, and the collected fluid through a fluid discharge pipe 168 is discharged, the discharge pipe 168 may also be connected to the electrolyte solution container system, and configured to collect the fluid returned to the vessel.

一阳极组件170一般定位在内盆162的下部区域内。 An anode assembly 170 is generally positioned within the lower region of the inner basin 162. 一扩散部件172可大致地横贯在阳极组件170上方的位置处的内盆的直径定位。 A diffusion member 172 may be substantially across the top of the anode assembly 170 in diameter positioned at a location within the basin. 阳极组件170可以是任何合适的消耗的或非消耗型的阳极,例如,铜、铂等。 The anode assembly 170 may be any suitable non-consumable anode consumption, e.g., copper, and platinum. 扩散部件172可以是任何合适类型的渗透材料,例如,多孔的陶瓷盘形件。 Diffusion member 172 may be any suitable type of porous material, e.g., a porous ceramic disc-shaped member. 扩散部件172通常构造成产生一沿被镀敷基底的方向通过其间的均匀的电解液流,此外,对通过阳极和被镀敷基底之间的电通量提供一定程度的控制。 Diffusion member 172 is generally configured to generate an edge of the substrate to be plated by a uniform electrolyte flow direction therebetween, in addition, to pass between the anode and the plating of the substrate to provide a degree of electric flux control. 可采用任何合适的方法来提供对阳极组件170的电气连接。 Any suitable method may be employed to provide an anode assembly for an electrical connection 170. 例如,与阳极组件170的电气连接可通过一阳极电极触头174来提供。 For example, the anode assembly 170 is electrically connected may be provided by an anode electrode contact 174. 阳极电极触头174可由任何可在镀敷溶液中溶解的合适的材料制成,例如,钛、铂和镀铂的不锈钢。 The anode electrode contact 174 may be made of any suitable material may be dissolved in a plating solution, e.g., titanium, platinum and platinum-plated stainless steel. 如图所示,阳极电极触头174可通过镀敷槽组件160的底表面延伸,并可连接到电源(未示出)上,例如,通过任何合适的布线导管。 As shown, the anode electrode contact 174 may be a plating tank assembly bottom surface 160 extends, and is connected to the power source (not shown), for example, by any suitable wiring conduit.

基底保持器组件110示于图2的立体图和图3的截面图中,它一般包括一通过垂直的附连/支承件116附连到下接触环114上的上接触环安装件112。 The substrate holder assembly 110 shown in FIG. 2 and FIG perspective sectional view of FIG. 3, which typically includes a through vertical attachment / support member 116 is attached to the lower contact ring 114 on the contact ring mounting member 112. 安装件112一般允许将基底保持器组件110附连到头组件致动器102上。 Mounting member 112 generally allows the substrate holder assembly 110 is attached to the head assembly actuator 102. 上接触环安装件112一般构造成从电源(未示出)接受电源,并通过支承件116将电源传导到在下接触环114内的接触销310。 The contact ring mounting member 112 is generally configured from a power source (not shown) to accept the power supply, and the support member 116 through the power conduction to the contact pin 310 within the lower contact ring 114. 电源通常通过对应部件的内部导电部分(未示出)传导通过对应的元件。 Power is usually (not shown) through a corresponding conductive portion of the interior element is conducted through the corresponding member. 或者,安装件和支承件116可由一导电材料制成,这样,部件本身可用来将电源传导到接触销310。 Alternatively, the mounting member and the support member 116 may be made of a conductive material, so that the components themselves may be used to contact the power transmitted to the pin 310. 然而,在此实施例中,对应部件的导电表面一般镀敷或覆盖电气绝缘材料,因为当组件浸没在镀敷溶液中时,暴露的导电表面将被镀敷。 However, in this embodiment, the conductive surface of the corresponding member of the general plating or covering the electrically insulating material, because when the component when immersed in the plating solution, the exposed conductive surface will be plated. 在本实用新型的一实施例中,基底保持器组件110的导电表面用诸如Aflon、Viton的PTFE材料,或任何其它合适的抗镀敷的涂覆材料涂覆。 In the utility model one embodiment, the conductive surface of the substrate holder assembly 110 with such Aflon, Viton the PTFE material, or any other suitable anti-plating coating material is coated.

下接触环部分114一般沿支承件116的径向向内地延伸。 Under section 114 radial contact ring 116 is generally along the support extended to the mainland. 此外,环部分114一般包括接触销310,其通过一集成制造的工艺或通过一添加的工艺形成。 In addition, the ring portion 114 generally includes a contact pin 310, or by which a process of forming by adding an integrated manufacturing process. 例如,图4示出一示范的接触销环400的平面图,其中,环400构造成固定到下环部分114上,以形成接触销310。 For example, Figure 4 shows a plan view of an exemplary contact pin ring 400, wherein the ring 400 configured to be secured to the lower ring portion 114, to form the contact pin 310. 接触销环400一般包括一外基座部分401,其具有多个从其上径向向内地延伸的弹性的导电元件402。 Contact pin ring 400 generally includes an outer base portion 401 having a plurality of conductive elements therefrom resilient inwardly extending radial 402. 基座部分401一般还包括多个通过其间形成的孔403,其允许环400被螺栓连接,黄铜镀敷,或其它方法附连到接触环组件、例如组件110的下表面。 Usually the base portion 401 further includes a plurality of apertures 403 formed therethrough, which allows the ring 400 is bolted, brass plating, or other method of attachment to the contact ring assembly, such as assembly 110 of the lower surface.

参照图3,基底保持器组件110一般包括上部件(图3中未示出),支承或中间部件116,以及环部件114。 Referring to Figure 3, the substrate holder assembly 110 generally comprises an upper member (not shown in FIG. 3), or intermediate supporting member 116, and the ring member 114. 如果接触销310不是一体地制造在环部件114上,则诸如示于图4中的环400的接触销组件通常附连到环114的下表面。 If the contact pin contact pin assembly 310 is not integrally fabricated on the ring member 114, such as is shown in Figure 4 the ring 400 is typically attached to the lower surface of the ring 114. 示于图3中的示范的接触销组件包括一导电的内芯件306,其可由不锈钢、铜、金,或其它导电材料制成,该材料在室温下或低于室温下,例如,在ECP工艺中电化学镀敷溶液的温度下,也具有至少最小量的弹性。 Exemplary contact pin assembly shown in Figure 3 comprises an electrically conductive inner core member 306, which may be stainless steel, copper, gold, or other conductive material, the material at room temperature or below room temperature, e.g., in ECP Under the process of electrochemical plating solution temperature, also have at least a minimum amount of elasticity. 导电内芯306一般涂覆抗镀敷溶液的电气绝缘层304,即,涂层不与镀敷溶液反应,或便于在涂层上的镀敷。 Conductive inner core 306 coated with the anti-plating solution is generally electrically insulating layer 304, i.e., the coating is not reacted with the plating solution, or to facilitate the coating of plating. 绝缘层304一般是Viton或Aflon层,或是既电气绝缘又抗电化学镀敷溶液的其它的材料层,以及是弹性的和/或能弯曲而无开裂,断裂,或另外允许镀敷溶液通过涂层渗透到下层。 Insulating layer 304 is typically Viton or Aflon layer, or both electrical insulation and anti electrochemical plating solution of the other layer of material, and is and / or can be bent without cracking elasticity, fracture, or otherwise allow plating By coating the solution to penetrate into the lower deck.

接触销310一般定位在接触环114上,其构造成接触销310接触定位在接触环114上的基底的周缘,例如,接触销310一般定位在环形的图形中,并沿径向向内延伸,这样,基底的周缘可被接触销310的终端/接触点308支承。 Contact pin 310 is generally positioned on the contact ring 114, which is configured to contact pin 310 contacts the contact ring 114 is positioned on the periphery of the substrate, e.g., the contact pin 310 is generally positioned in the graphics annular and extends radially inwardly, Thus, the periphery of the base contact pin 310 may be a terminal / contact point 308 is supported. 接触销310数量上可变化,例如,根据被镀敷基底的尺寸。 Contact pins 310 may vary the number, for example, according to the size of the substrate to be plated. 此外,接触销310可由任何合适的导电材料制成,例如,铜(Cu)、铂(Pt)、鉭(Ta)、钛(Ti)、金(Au)、银(Ag)、不锈钢、铟、钯以及它们的合金,或其它顺从于电化学镀敷工艺的导电材料。 Moreover, the contact pin 310 may be formed of any suitable electrically conductive material, e.g., copper (Cu), platinum (Pt), tantalum (Ta), titanium (Ti), gold (Au), silver (Ag), stainless steel, indium, palladium and alloys thereof, or other amenable to electrochemical plating process of a conductive material. 然而,本实用新型的实施例构思采用单一的导电材料,其在传统的镀敷温度、即在ECP过程中镀敷槽内的温度下具有一定程度的弹性(不完全刚性)。 However, embodiments of the present utility model adopts the idea of a single electrically conductive material deposited in the conventional plating temperature, with a certain degree of flexibility (not completely rigid) i.e. in the ECP process under plating bath temperature. 功率可通过电源(未示出)供应到接触销310。 Power by power supply (not shown) supplied to the contact pin 310. 电源可协调地将电功率供应到所有的电气接触销310,成排或成组的电气接触销310,或单独地供应到各个接触销310。 Power can be coordinated electrical power supplied to all electrical contact pin 310, or groups of rows of electrical contact pins 310, or separately supplied to the respective contact pin 310. 在电流供应到成组的或单独的接触销310的实施例中,可使用一电流控制系统来控制施加到各组或各排的销上的电流。 In the current supplied to the embodiment or separate groups of contact pins 310, a current control system may be used to control the current applied to each group or pin on each row.

大致地示于图3中所接触销310一般附连到接触环114的下表面上。 Substantially shown in Figure 3 as the contact pin 310 is generally attached to the lower surface of the contact ring 114. 然而,本实用新型的实施例不限于这种结构,因为可以构思:接触销310可一体地形成在接触环114上,或附连在不同结构中的接触环114。 However, embodiments of the present utility model is not limited to such a configuration, since it is contemplated: the contact pin 310 may be integrally formed on the contact ring 114, or attached to various structures in contact ring 114. 各个单独的接触销310包括一导电的内芯306。 Each individual contact pin 310 includes a conductive inner core 306. 用来制造内芯306的导电材料一般选为既导电又有弹性,因为单独的接触销构造成至少沿一个方向是弹性的。 Used to make the core 306 of conductive material is generally chosen both conductive and elastic, because the individual contact pins configured to at least one direction is resilient. 具体来说,各个接触销310一般构造成沿水平方向移动,即,沿箭头311的方向,以便与不完全是平面的基底的接合。 Specifically, the respective contact pin 310 is generally configured to move in the horizontal direction, i.e., along the direction of arrow 311, so as not to completely engaged with the plane of the substrate. 例如,如果一基底不完全是平面的(或如果接触销不在水平平面内对齐),则定位在本实用新型的接触环内的基底将接合某些接触销310而不是其它。 For example, if a base is not completely flat (or if the contact pins are not aligned within the horizontal plane), then positioned within the utility model substrate contact ring will engage some of the contact pins 310 and not the other. 因此,各个单独的接触销310构造成弹性,这样,这种类型的情形可通过对基底的背面施加压力得到矫正。 Thus, each individual contact pin 310 configured elasticity, so that this type of situation can be corrected by applying pressure to the back of the substrate. 该压力致使基底压靠在接触销310上,并沿箭头311的方向略微地向下挠曲销。 The pressure causes the substrate is pressed against the contact pins 310, and the direction of the arrow 311 the pin is slightly bent downward. 该向下的挠曲致使基底接合先前未接合的其余的接触销310。 The downward deflection causes the base contact pin 310 engages the remaining not previously engaged. 因此,接触销310的弹性允许较佳地接触基底,即,所有接触销310被致使电气地接合基底。 Thus, resilient contact pins 310 contact the substrate is preferably allowed, i.e., all of the contact pin 310 is caused to electrically engage the substrate.

绝缘层304形成在上环部件112、垂直支承件116,以及下环部件114的导电表面上,以简化制造过程和降低成本。 Insulating layer 304 is formed on 112, the vertical support member 116, and a conductive surface on the ring member 114 of the lower ring member, to simplify the manufacturing process and reduce costs. 具体来说,在传统的接触环应用中,一导电内芯必须形成到接触环的绝缘本体中,其成本高且制造过程耗时。 Specifically, in the conventional contact ring applications, an electrically conductive inner core must be formed to the contact ring of the insulating body, its high cost and the manufacturing process is time-consuming. 本实用新型的实施例通过用导电材料制造接触环部件、然后用绝缘层304涂覆导电表面来解决该问题。 Embodiment of the present utility model by a conductive material in contact with the ring member, and then coated with a conductive surface of the insulating layer 304 to solve the problem. 如果要求的话,可采用各种绝缘层,即,可使用一绝缘材料(例如,一刚性材料)来涂覆环部件112、114和116,然后,可使用另一绝缘层(例如,弹性层)来涂覆接触销306。 If desired, various insulating layer, i.e., an insulating material may be used (e.g., a rigid material) to coat the ring member 112, 114 and 116, then, can use another insulating layer (e.g., elastic layer) coated contact pins 306.

为了对基底施加压力,以使销310弯曲,通常利用图1中讨论的推力板140。 In order to apply pressure to the substrate, so that the pin 310 is bent, generally use the thrust plate 140 discussed in FIG. 具体来说,推力板140一般以垂直的方式被致动,以实体地接合被定位在接触环114内的基底的背面,以便实施镀敷。 Specifically, the thrust plate 140 is generally in a vertical manner is actuated to physically engage the back surface of the substrate is positioned within the contact ring 114 so as to be plated. 推力板140推靠在基底的背面上,机械地偏压基底抵靠在接触销310上,在此过程中,与基底上高的点接合的销310,或定位在高于(垂直向)其它销310的销,被导致向下挠曲或弯曲。 Thrust plate 140 pushes against the back of the substrate, the substrate is mechanically biased contact pin 310 abuts against the, in this process, the pin 310 on the high point of engagement of the substrate, or positioned above the (vertical) Other pin pin 310 is caused to flex or bend downward. 该向下的运动允许其余的接触销310也接合基底,这样,所有的接触销310与基底实体地和电气地接合。 The downward motion allows the rest of the contact pin 310 also engages the base, so that all of the contact pin 310 engages with the substrate physically and electrically.

此外,推力板组件140还可包括密封装置,其构造成防止液体延伸超过晶片的背面。 In addition, the thrust plate assembly 140 may further include a sealing means, which is configured to prevent liquid extends over the back surface of the wafer. 密封装置在其操作来防止发生背面流体的接触时是理想的。 Sealing means operative to prevent contact with the back surface is ideal when the fluid occurs. 这使得更容易地去除任何背面上的沉积残余,并有助于确保机器手刀片获得一干的晶片,以便施加真空。 This makes it easier to remove any residual deposition on the back, and helps ensure that the robot blade to get a dry wafer, for applying a vacuum. 密封件302一般定位在推力板140的上部,并构造成在推力板140延伸和接触基底122时接合接触环114的上部。 Seal member 302 is generally positioned in the upper thrust plate 140 and thrust plate 140 configured to extend and contact the substrate 122 engages contact ring 114 of the upper portion. 密封件302一般包括一弧形的密封面315,其构造成接合形成在接触环114的上表面上的一密封隆起317。 Seal member 302 generally comprises an arcuate sealing surface 315, which is configured to engage the contact ring 114 is formed on the upper surface of a sealing ridge 317. 密封表面315和密封隆起317一般呈环形,并具有相同的半径,这样,当推力板延伸时,隆起和表面连续地相遇。 Sealing surface 315 and sealing ridge 317 is generally annular, and have the same radius, so that when the thrust plate extends, bumps and surface continuously met. 一般来说,可操作密封件302来防止镀敷溶液流过接触环114的外周缘和流到被镀敷的基底的背面。 Generally, the seal 302 is operable to prevent the plating solution flowing through the outer periphery of the contact ring 114 and flow to the back surface of the substrate to be plated. 该密封件302可由诸如腈、丁纳橡胶、硅橡胶、氯丁橡胶、聚氨酯,以及包封特氟纶(teflon)的弹性体的材料制成。 The seal member 302 may be formed such as nitrile, Buna made of a material, silicone rubber, neoprene, polyurethane, and Teflon encapsulated (teflon) elastomer. 此外,密封件302可至少部分地由全氟弹性体材料制成,例如,以商标名为Chemraz、Kalrez、Perlast、Simriz和Viton出售的全氟弹性体材料。 In addition, the seal 302 may be at least in part, by perfluoro elastomeric material, e.g., under the trademark name Chemraz, Kalrez, Perlast, Simriz and Viton sold perfluoro elastomeric material. 此外,涂覆到接触销310上的绝缘涂层可用与制造密封件302相同的材料进行涂覆。 In addition, the insulating coating applied to the contact pin 310 can be used on the same and manufacture of the seal material 302 is coated.

密封件302可包括一附连到推力板组件140上的本体部分352,以及一从本体部分352延伸的环形部分315。 Seal member 302 may include a thrust plate assembly attached to the body portion 352 on 140, and an annular portion 315 extending from the body portion 352. 如图中所示,环形部分315可大致地垂直于本体部分352。 As shown, the annular portion 315 may be substantially perpendicular to the body portion 352. 密封件302可适于用环形部分315接合形成在接触环114的顶表面上的环形环118。 Seal member 302 may be adapted to form an annular contact ring 114 on the top surface of the annular portion 315 engages with the ring 118. 尤其是,环形部分315的一内表面可接合环形隆起/环317的外表面。 In particular, an inner surface of the annular portion 315 may engage the outer surface of the annular ridge / ring 317. 因此,环形部分315可作用一径向向内、即基本上平行于基底120的方向的径向密封力(FRADIAL)。 Thus, the annular portion 315 can effect a radially inward, i.e., substantially parallel to the radial direction of the base 120 of the sealing force (FRADIAL).

可设计密封件302的尺寸和形状来确保产生足够的径向力,以提供充分的密封。 Seal member 302 can be designed to a size and shape to ensure that sufficient radial force, in order to provide an adequate seal. 例如,背侧的径向密封302(朝向环形部分315的外表面)的外直径可选择为略微大于(例如,小于5mm)隆起317的外直径。 For example, the back side of the radial seal 302 (toward the outer surface of the annular portion 315) is selected to be slightly larger than the outer diameter (e.g., less than 5mm) the outer diameter of the ridge 317. 由于推力板140下降来固定基底120,环形部分315可径向向外地弯曲,以与环形隆起317接合,导致一充分的径向密封而不必施加过分的向下的力。 Since the thrust plate 140 to decrease the fixing base 120, annular portion 315 may be bent radially outwardly to engage with the annular ridge 317, resulting in a fully radial seal without excessive downward force is applied. 此外,如图所示,背侧密封件302的内边缘,其中,环形部分315从本体部分352延伸,内边缘可大致地倒圆以与环形隆起317的大致倒圆的顶表面匹配。 Further, as shown, the inner edge of the rear seal 302, wherein the annular portion 315 extending from the body portion 352, the inner edges may be rounded to a substantially annular ridge substantially rounded top surface 317 of the match.

在本实用新型的另一实施例中,各个单独的接触销310包括附连到各个接触销310的远端的接触点的导电末端件。 In the utility model to another embodiment, each individual contact pin 310 includes a conductive terminal member attached to the respective contact pin 310 of the distal end of the contact points. 末端件通常由铜(Cu)、铂(Pt)、鉭(Ta)、钛(Ti)、金(Au)、银(Ag)、不锈钢、铟、钯和/或它们的合金制成。 End piece is typically made of copper (Cu), platinum (Pt), tantalum (Ta), titanium (Ti), gold (Au), silver (Ag), stainless steel, indium, palladium and / or alloys thereof. 利用这种结构,接触环的芯部分306可由更加成本上节约的材料制成,而电气上接合基底表面的接触环的诸部分(即,接触销310的远端308)可由已改进内芯材料上的电气接触特性的材料制成。 With this structure, the contact portion 306 of the core ring is formed on the material may be more cost-saving, and various portions of the electrical contact ring engaging surface of the substrate (i.e., the distal end 310 of the contact pin 308) may have improved the core material electrical contact properties of materials. 尽管接触环的内芯可由用于电气接触基底的同样的材料制成,由接触/末端的材料制造内芯通常将显著地增加接触环的成本。 Although the contact ring of the inner core may be a substrate for the cost of electrical contact is made of the same material, the inner core material from contact / terminal typically will significantly increase the contact ring. 因此,为了保持成本节约的接触环,尽管也在接触环和基底之间提供改进的电气接触特性,但本实用新型的诸实施例利用一种包括一成本节约的内芯部分的接触环,该内芯部分的材料提供铜镀敷或其它方法附连到接触指形件310的远端部分308上的改进的电气接触特性。 Therefore, in order to maintain contact with the ring cost savings, provide improved electrical contact properties of the contact between the ring and the base is also in spite of, but the utility model Embodiments include a cost-saving use of a contact ring portion of the inner core, which Materials inner core portion is provided copper plating or other methods to improve the contact fingers attached to the distal end portion 308 shaped member 310 on electrical contact characteristics.

该实施例的接触环可包括一内芯,其由一标准钢材制成,例如,不锈钢。 Contact ring of this embodiment may include an inner core, which is made from a standard steel, e.g., stainless steel. 内芯提供一通过接触环的主本体的导电介质,并大致提供接触环的支承结构或骨干。 Core providing a conductive medium by the contact ring of the main body, and generally provide support contact ring structure or backbone. 然而,由于钢一般提供与半导体基底的差的电接触特性,并与电化学镀敷溶液反应较差,所以,各个接触指形件310的终端或接触点308可包括一部分其它的金属。 However, due to poor electrical contact characteristics of the steel is generally provided with a semiconductor substrate, and the electrochemical reaction of the plating solution is poor, so the respective contact means terminal shaped member 310 or the contact point 308 may comprise a portion of another metal. 例如,各个末端308可具有一黄铜镀敷其上的下列材料的条棒:铜(Cu)、铂(Pt)、鉭(Ta)、钛(Ti)、金(Au)、银(Ag)、不锈钢、铟、钯和/或它们的合金。 For example, each terminal 308 may have a bar is a brass plating thereon of the following materials: copper (Cu), platinum (Pt), tantalum (Ta), titanium (Ti), gold (Au), silver (Ag) , stainless steel, indium, palladium and / or alloys thereof. 黄铜镀敷到接触末端308上的条棒做成的尺寸和形状以便于最佳的基底接触。 Brass plating to the bar on the contact tip 308 made of a size and shape to facilitate optimal contact with the base.

尽管以上描述针对本实用新型的实施例,但在不脱离本实用新型的基本范围的前提下,还可设计本实用新型的其它的和进一步的实施例,本实用新型的范围由附后的权利要求书予以确定。 While the above description of the utility model for the embodiments without departing from the basic premise of the utility model range, but also the design of the utility model and the other further embodiments, the utility model range by the attached rights claims to be determined.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
CN103426831A *17 May 20134 Dec 2013应用材料公司Seal rings in electrochemical processors
CN103426831B *17 May 201331 May 2017应用材料公司电化学处理器中的密封环
CN105164591A *26 Mar 201416 Dec 2015尤尼韦索有限公司Mount for treating micromechanical components
CN105164591B *26 Mar 201431 May 2017尤尼韦索有限公司用于处理微机械部件的支座和包括该支座的组件
Classifications
International ClassificationC25D17/00, C25D17/06, C25D7/12
Cooperative ClassificationC25D17/06, C25D7/123, C25D17/001
European ClassificationC25D7/12, C25D17/06
Legal Events
DateCodeEventDescription
29 Mar 2006C14Granted
28 Dec 2011C56Change in the name or address of the patentee