CN1624942A - 一种发光模块 - Google Patents

一种发光模块 Download PDF

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CN1624942A
CN1624942A CNA2004100741522A CN200410074152A CN1624942A CN 1624942 A CN1624942 A CN 1624942A CN A2004100741522 A CNA2004100741522 A CN A2004100741522A CN 200410074152 A CN200410074152 A CN 200410074152A CN 1624942 A CN1624942 A CN 1624942A
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light emitting
emitting module
light
metal
insulation layer
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CN100521262C (zh
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汤玛斯·摩里斯
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International Resistive Company of Texas LP
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
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    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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    • H—ELECTRICITY
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    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

本发明涉及一种发光模组，包括有一具有电绝缘层的金属基底；多个电路轨迹，其设置于电绝缘层上，且该电路轨迹具有相对应的多个端子及多个导电路径，该端子具有金属微滴连接；多个发光元件，其具有相对应的多个导线，用以接合至该相对应的具有金属微滴连接的端子；以及一金属涂层，其设置于该基底上，用于传导从该发光元件所产生的热至该基底。

Description

一种发光模块
技术领域
本发明涉及一种发光模块，尤指一种具有一散热基底，且能降低操作温度的发光模块。
背景技术
按，光源发展趋向于发光元件的模块化，例如现有的发光二极管LED。现有的发光二极管已被广范的使用在大体积的设备上，以提供大量的光照。其中一种应用于交通工具上，例如车头灯、车尾灯、及方向灯等。
高功率的发光二极管配合一般的支撑架于大量的使用下，会产生散热、及当发热温度大约100度时，发光效率会有不良的问题。目前市面上有二种针对该高功率的发光二极管的散热方式，第一种方法，将该高功率的发光二极管设置于一电路板上，该电路板利用黏着(粘着)剂胶合于一铝制的散热器上。但这不是一种有效的散热方法，因为该电路板与该黏着剂为热绝缘体，因此隔绝从散热器来的热源。第二种方法，是将该高功率的发光二极管设置于一环氧层上，该环氧层接合于一铝板上，该环氧层为一电绝缘体，亦为一热绝缘体，因此隔绝从散热器来的热源。
美国专利US5,857,767号揭露了该高功率的发光二极管借助导热胶黏剂设置于一铝散热器上，该铝散热器由电镀或涂布一层电绝缘层，其中该导热胶黏剂是散布着金属微粒。然，以此种方式散热存在有些问题。第一，该导热胶黏剂介于导电与导热之间。第二，该发光模块需要进行二阶段式的组装，其先涂上导热胶黏剂，然后才能进行锡焊等动作。有关美国专利，已被揭露的现有技术还包括有：US4,628,422号、US4,729,076号、US4,742,432号、US4,935,665号、US5,528,474号、US5,632,551号、US5,782,555号、US5,785,418号、US6,016,038号、US6,045,240号、US6,161,910号、US6,435,459号、US6,480,389号、US6,517,218号、及US6,582,100号。
是以，由上可知，上述现有的发光模块，在实际使用上，显然具有不便与缺点存在，而可待加以改善。
发明内容
本发明的主要目的是提供一种改良之发光模块。
本发明的另一目的是提供一种发光模块，其结合一具有电绝缘层的基底，且利用一或多个电路轨迹设置于该基底上，使得该一或多个发光元件可利用锡焊或打线接合的方式，以设置于该电绝缘层上。
本发明的再一目的是提供一种发光模块，该发光模块进一步包括有一电流限制电阻器。
本发明的再另一目的是提供一种发光模块，该发光模块包括有多个银贴片，其设置于该基底的电绝缘层上，用以增加从该发光元件所产生的反射光。
为了实现上述的目的，本发明提供一种发光模块，包括有：一具有电绝缘层的金属基底，该电绝缘层具有少于1000微米的厚度；多个电路轨迹，其设置于该电绝缘层上，该等电路轨迹具有相对应的多个端子及多个导电路径，该等端子具有金属微滴连接；多个发光元件，其具有相对应的多个导线，用以接合至该相对应的具有金属微滴连接的端子；以及一金属涂层，其设置于该基底上，用于传导从该等发光元件所产生的热至该基底。
为进一步说明本发明为实现预定目的所采取的技术、手段及功效，请参阅以下有关本发明的详细说明与附图，相信本发明的目的、特征与特点，当可由此得一深入且具体的了解，然而该附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
图1是本发明发光模块的基底的上视图；
图2是本发明发光模块第一施实例的剖视图；
图3是本发明发光模块第二施实例的剖视图；
图4是本发明发光模块第三施实例的剖视图；
图5是本发明发光元件于测试板的示意图；以及
图6是本发明发光元件于测试板的另一示意图。
其中，附图标记：
发光模块            10、10′、10″
基底                12、12′、12″、52
电路轨迹            14、56
发光元件            16、42′、42″
电绝缘层            18、18′、18″、54
端子                22、24、26、22′、24′、
                    58、64
面积                28
电流限制电阻器      29
贴片                30
亮漆                31、31″
保护涂层            32、32′
内部反光件          34、44′、44″
金属热传导件        36
导线                38、38′、38″
微滴                40、40′、40″、66
热转换元件          46′、46″
测试板              50
中心端子            60
发光二极管          62
狭槽                68、76
清洁的修饰层        70
一组发光组          55
四组发光组          72、74
电路轨迹            80、82
发光二极管          84、86
导线                88、90
端子                92、94
清洁的修饰层        96、98
测试板              100
基底                102
电绝缘层            106
开孔                104
电路轨迹            108、110
缺口                112
发光二极管          114
端子                116
微滴                118
三端子装置          122
缺口                123
段落                124、126、128
基底                132
清洁的修饰层        120、130；
具体实施方式
请参阅图1至图2所示，其为本发明发光模块的基底的上视图，及本发明发光模块第一施实例的剖视图。由图中可知，本发明提供一种发光模块10，其包括有：一基底12、多个设置于该基底12的电路轨迹14、一组发光元件16(其可为一LED)。该发光模块10用于提供一光源以作为不同变化的应用，例如交通工具的头灯、尾灯、煞车灯或非交通工具的光源应用，其中该光源是借助LED组来传递光源。
该基底12可为一散热器，且该基底12可为任一合适的材料所制成，该材料可提供良好的散热特性、高的强度、合适的成本、及可容置一薄的电绝缘层18(或涂层)。上述合适的材料可为铝、铝合金、镁、镁合金、锌、含锌锡的合金(pot metal)、或其它相似的材料。该电绝缘层18成形有10至1000微米的厚度，最佳的厚度为50至100微米。该电绝缘层18可为任何合适的型式，或可利用任何合适的方法来成形。该电绝缘层18可借助丝网印刷法(screen printing)涂布，然后利用火炉烘烤；或可借助等离子喷涂技术(plasma sprayingtechnique)，或以类似搪瓷(porcelain enamel)之方式来涂布。最佳之实施例，该电绝缘层18为一电镀涂层(anodized coating)，且该基底12使用可电镀的金属材料，例如铝、镁或其它的合金。该基底12最理想的材料为一电镀铝合金，因为该电镀铝合金具有高散热能力、高结构强度、及低成本的优点。该基底12包括一平坦表面，以方便于该平坦的表面上涂布薄或厚的薄膜层(film layer)，该基底12于该平坦表面的另一端，更进一步包括有散热鳍片、皱纹、或其它不规则的面积以增加起伏，用以增加该基底12的散热能力。
该电路轨迹14可利用现有的技术，以涂布薄或厚的薄膜层而成。传统的印刷技术包括有丝网印刷法(screen printing)、直接书写(direct writing)或其它相似的方法。印刷完后，将该基底12送入火炉中烘烤其上的油墨，使得油墨溶化以产生导电轨迹或路径14黏着于该电绝缘层18上。基于上述的理由，高电压设备借助薄膜技术制作而成，其中该导电轨迹由溅镀(sputtering)、蒸镀(vapor deposition)、或其它不需要高温而能产生薄膜的技术。一般该薄薄膜的厚度为200-20,000埃(angstrom)；而该厚薄膜的厚度为8-50微米(micro)。
该电路轨迹14延伸于不同端子22、24、及26之间，亦即，该电路轨迹14连接于该不同端子22、24、及26的末端，以提供该发光模块10的电路系统。在薄薄膜设备中，该电路轨迹14及该不同端子22、24及26为银所制成，以提供高导电、锡焊的兼容性、打线接合(wire-bonding)操作、及高的反射能力。在厚薄膜设备中，该电路轨迹14及该等端子22、24及26借助印刷一以银为底的油墨于该电绝缘层18上，然后再烘烤该油墨而成。该电路轨迹14及该等端子22、24及26最佳实施例系为相同材质所制，且在相同制程及时间设置完成。
某些端子26设置于该基底12的边缘，及借助由焊接或相似的方法，固设于一延伸于该发光模块10一端的连接器(图未示)，该连接器至少连接至一电源。该等端子26可自由选择地穿过该电路轨迹(图未示)至该电路轨迹14的下端。一或多个增加的零件系可依该发光模块10的需要，而设置于一成形于该基底12的面积28上。
本发明的重要特征在于能够结合一电流限制电阻器29(currentlimiting resistor)于该发光模块10的电路系统中。该电流限制电阻器29的厚度，可依电路轨迹14的薄膜厚度来决定，且该电流限制电阻器29可由如氮化钽的电阻材料所制成。该基底12及该电流限制电阻器29具有耐高温的特性，在小尺寸的情况下，不会产生散热的问题。
一贴片30是由金属制成，该贴片30设置于该发光元件16的底端，或邻近该发光元件16，用以将该发光元件16所产生的热量带走。本发明其中的一重要特征在于：该电路轨迹14、该等端子24、26及28、及贴片30。该电路轨迹14、该等端子24、26及28、及贴片30可利用如锡焊或打线接合等微滴连接(dropletconnection)方式，使得该发光元件16及该基底间产生良好的热传导能力，且从该发光元件16反射大量的光，使得该发光元件16以最少之能量，而得到最大的确良发光效率。
该贴片30最佳的实施方式，由与该电路轨迹14及该等端子22、24及26相同材质所制成，且与该电路轨迹14及该等端子22、24及26在相同制程及时间设置完成。为了让该贴片30失去光泽的情况降至最低，最好能在该贴片30上涂布干净或透明的亮漆31。
请参阅图1图及图2所示，一保护涂层32被设置于该基底12的平坦表面上，用以保护该电路轨迹14。当该保护涂层32被使用时，该等端子22、24及26、及该贴片30系由该保护涂层32所隐蔽。但当该等端子22、24及26需要锡焊时，该保护涂层32则不会遮蔽到该等端子22、24及26，且可防止该保护涂层32影响该等端子22、24及26的反光。如果使用干净或透明的保护层在全该基底12上，则可省略亮漆31的使用。
在图2的实施例中，该发光元件16用于产生光源，且该发光元件16包括一内部反光件34及一金属热传导件36。该热传导件36接触于该贴片30或与该贴片并列设置，用以增加从该发光元件16至该基底12的散热效率。该发光元件16的导线38是借助凝固的微滴40连接于该等端子22及24。该凝固的微滴40为打线接合或锡焊的操作。
请参阅图3所示，其为本发明发光模块第二施实例的剖视图。本发明是提供一种发光模块10′，其包括有：一基底12′、一组发光元件42′(其可为一LED)。该发光模块10′用于提供一光源以作为不同变化的应用，例如交通工具的头灯、尾灯、煞车灯或非交通工具的光源应用，其中该光源是借助LED组来传递光源。该发光元件42′用于产生光源，且该发光元件42′包括一内部反光件44′。且，第一实施例中，该贴片30被移除，而一热转换元件46′紧邻一电绝缘层18′。本实例亦包括：不同端子22′及24′、一保护涂层32′被设置于该基底12′的平坦表面上，以及发光元件42′的导线38′是借助凝固的微滴40′连接于该等端子22′及24′。
请参阅图4所示，其为本发明发光模块第三施实例的剖视图。本发明提供一种发光模块10″，其包括有：一基底12″、一组发光元件42″(其可为一LED)。该发光元件42″用于产生光源，且该发光元件42″包括一内部反光件44″。且，第一实施例中，该贴片30被移除，而一热转换元件46″紧邻一电绝缘层18″。发光元件42″的导线38″是借助凝固的微滴40″连接于端子。该基底12″是由一开孔48″所揭露，以提供一合适的反光效果。亮漆31″亦用于产生一良好的反光效果。
请参阅图5所示，其为发光元件于测试板的示意图。测试板50包括有基底52(其可为散热器)，该基底52具有电绝缘层54。一组发光模块55包括多个电路轨迹56、未端的端子58。该电路轨迹56环绕着一中心端子60而延伸。发光二极管62设置于该中心端子60上。该发光二极管62包括多个端子64，该等端子64是借助金属微滴66而接合在该等电路轨迹56上。清洁的修饰层70，用以降低银失去光泽的情况。狭槽68设置于该两相邻电路轨迹56之间。
该测试板50进一步包括两个四组发光组72、74。在电路轨迹80、82上的狭槽76可选择地设置于其上。发光二极管84、86系连续排列在一起，且该发光二极管84、86设有相对应的导线88、90。该电路轨迹80、82系具有多个端子92、94。清洁的修饰层96、98，用以降低银失去光泽的情况。
请参阅图6所示，其为发光元件于测试板的另一示意图。测试板100包括有基底102(其可为散热器)，该基底102具有电绝缘层106，该基底102是通过多个开孔104而露出来。一对电路轨迹108、110被使用在该电绝缘层106上，且被一缺口112给分离。发光二极管114包括多个端子116，该等端子116是借助金属微滴118，而设置于该电路轨迹108、110上。本发明亦提供三端子装置122，其中缺口123将银层分成三个段落124、126及128，用以接收三个导线以接合于该三端子装置122。基底132为另一种实施方式。清洁的修饰层120、130用以降低银失去光泽的情况。
以上所述内容，仅为本发明最佳的一的具体实施例的详细说明与图式，惟本发明的特征并不局限于此，并非用以限制本发明，凡合于本发明的精神与其类似变化的实施例，皆应包含于本发明的范畴中，本领域普通技术人员在本发明的领域内，可轻易思及的变化或修饰皆可涵盖在本发明的权利要求的范围之内。

Claims (17)

1、一种发光模块，包括有：
一具有电绝缘层的金属基底，该电绝缘层具有少于1000微米的厚度；
多个电路轨迹，其设置于该电绝缘层上，该电路轨迹具有相对应的多个端子及多个导电路径，该端子具有金属微滴连接；
多个发光元件，其具有相对应的多个导线，用以接合至该相对应的具有金属微滴连接的端子；以及
一金属涂层，其设置于该基底上，用于传导从该等发光元件所产生的热至该基底。
2、如权利要求1所述的发光模块，其特征在于，该金属基底可为铝、铝合金、镁或镁合金，且该电绝缘层为电镀层。
3、如权利要求1所述的发光模块，其特征在于，该电绝缘层为一薄膜涂层。
4、如权利要求1所述的发光模块，其特征在于，该该电绝缘层为一搪瓷。
5、如权利要求1所述的发光模块，其特征在于，该电绝缘层为一等离子涂层。
6、如权利要求1所述的发光模块，其特征在于，该金属涂层具有一发光金属贴片，用以反射从该发光元件产生的光，以增加该发光模块的反光能力。
7、如权利要求1所述的发光模块，其特征在于，该发光元件具有一金属低表面，该金属低表面紧靠该金属涂层。
8、如权利要求1所述的发光模块，其特征在于，该电路轨迹及该金属涂层具有相同的材质。
9、如权利要求8所述的发光模块，其特征在于，该该电路轨迹及该金属涂层为银。
10、如权利要求9所述的发光模块，其特征在于，进一步包括有一设置于该金属涂层上端的清洁的修饰层，用以降低银失去光泽的情况。
11、如权利要求1所述的发光模块，其特征在于，该电路轨迹及该金属涂层为银及玻璃的混合物。
12、如权利要求1所述的发光模块，其特征在于，该电路轨迹为厚薄膜轨迹。
13、如权利要求1所述的发光模块，其特征在于，该电路轨迹为薄薄膜轨迹。
14、如权利要求1所述的发光模块，其特征在于，该金属微滴为锡焊连接。
15、如权利要求1所述的发光模块，其特征在于，该金属微滴为打线接合。
16、如权利要求1所述的发光模块，其特征在于，该电绝缘层具有至少一成形于其内的开孔，该发光元件至少其中之一定位该开孔上方。
17、如权利要求16所述的发光模块，其特征在于，该基底借助该开孔而曝露，用以增加反光的效果。
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