CN1573568A

CN1573568A - Substrate processing apparatus and method for adjusting a substrate transfer position

Info

Publication number: CN1573568A
Application number: CN 200410048415
Authority: CN
Inventors: 伊藤和彦; 石丸和俊; 大仓淳; 木下道生; 道木裕一
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 2003-06-03
Filing date: 2004-06-03
Publication date: 2005-02-02
Anticipated expiration: 2024-06-03
Also published as: JP4376116B2; CN1296985C; JP2005019963A

Abstract

To align a substrate with high accuracy for a short time in acquiring the data of a substrate delivery position to a substrate holding part beforehand with respect to a substrate conveying means conveying the substrate in and out of a processing unit performing predetermined processes to the substrate. With respect to a mark that is formed on the surface of a substrate for alignment delivered to a substrate holding part by a substrate conveying means, the positions of the marks are respectively imaged before and after the time when the substrate holding part is rotated 180[deg.], for example. After the misregistration between the positions of the center of the substrate and the rotational center of the substrate holding part is calculated on the basis of the positional data of this mark, the existence of the misregistration calculated by this means is decided. There is such a constitution that the substrate is rearranged to the substrate conveying means in such a manner that the center of the substrate coincides with the rotational center of the substrate holding part at the time when it is decided that there is misregistration.

Description

The method of adjustment of substrate board treatment and substrate transfer position

Technical field

The present invention relates to substrate is given remaining on substrate on the substrate maintaining part when for example carrying out processing unit that the predetermined process such as coating, development, heating of resist use, obtain the substrate board treatment of position data of substrate supply unit and the method for adjusting the delivery position of substrate in advance.

Background technology

So far, in photoresist operation as one of semiconductor manufacturing process, for example on the surface of semiconductor wafer (to call wafer in the following text), resist is applied as film like, make the exposure of this resist with the figure of regulation after, develop, form the mask graph of regulation.In general, use exposure device is connected substrate board treatment on the coating developing device that the coating of carrying out resist develops, carry out such processing.

In order to ensure high productivity, and seek the low capacityization of device occupied area, to apply the treating apparatus blocking respectively of multiple different disposal such as processing, development treatment, heating cooling processing to substrate, the unit of each processing institute necessary amount assembles with these, constitute above-mentioned substrate board treatment, be provided with in addition substrate sent into and send the substrate supply unit that each processing unit is used.

Such substrate board treatment now is described simply,, enumerates coating developing device shown in Figure 15 for example as an example.In this device, for example will accommodate the substrate carrier 10 of 25 wafer W and deliver on the carriage 11, utilize handing-over arm 12 to take out wafer W, by the junction of frame unit 13a, be transported in the treatment region 14.In treatment region 14, supply unit is set at central authorities, is provided with around it: above-mentioned coating liquid is coated in the coating element of using on the wafer W 16; Have and make the desiccant low-temperature heat of above-mentioned coating liquid unit, cure and handle curing the unit, being cured for example 3 frame unit 13a, 13b, the 13c of the processing units such as solidified cell of handling usefulness of usefulness, utilize supply unit 15 that these each unit are carried out the handing-over of wafer W.

, each processing unit is in order to carry out high-precision processing to substrate, requires wafer W is placed in the rest area of regulation of this processing unit accurately.Specifically, for example in coating element 16, after being coated in coating liquid on the surface of wafer W, make wafer W around vertical axle rotation on one side, with remover liquid nozzle the cleaning solution supplying edge is cleaned on one side, carry out this processing that is called edge flushing, so if position that the edge is not cleaned and the edge situation at the position that the width greater than Rack has been cleaned then takes place sometimes at the center of the misalignment turning axle of wafer W.In heating, cooling unit, it is discrete to produce temperature sometimes in face in addition.Therefore, actual begin to handle before, make the operation of the delivery position of supply unit 15 study wafer W in advance, so that wafer W is placed in the suitable put area.This operation is commonly referred to as teaching, existing teaching method has adopted such method: at first for example use reflection sensor, detection is placed on the edge of the wafer W in the put area, judge whether wafer W is placed in the put area of regulation, according to this judged result, adjust delivery position (for example, with reference to patent documentation 1).The situation of for example enumerating coating element 16 is an example, with reference to Figure 16 one example of existing teaching is described, among the figure, and the 2nd, one side keeps wafer W from the back side, can make the spinner of this wafer W around vertical axle rotation simultaneously.In addition, the 21st, reflection sensor utilizes not shown driving mechanism, can be along the radially advance and retreat of wafer W.

Adopt following method to carry out teaching.At first, give spinner 2 with wafer W with supply unit 15, secondly, make the sensor 21 waited in the outside of the periphery of wafer W with the speed of regulation along laterally moving, the top at the edge by wafer W.Then, sensor 21 is turned back in front of the position of light reflection,, for example, detect the edge of wafer W by sensor 21 being retreated lentamente with a recurrent interval in order to improve precision.Again at interval, wafer W is changeed around vertical axle rotation 3, under such state, carry out same processing, calculate, obtain the center of wafer W according to the position data of 4 on the periphery of thus obtained wafer W with 90 degree.Make the center of this wafer consistent then, perhaps again wafer is placed on (tentative again) in the allowed band with the center of the turning axle of the spinner of grasping in advance.At this moment, follow and try, deviation diminishes, and carries out at most in general just trying for 5 times again and can restrain.

[patent documentation 1] spy open the 2000-349133 communique (paragraph 0069～0072, Fig. 9)

, in above-mentioned teaching, whole unit of substrate board treatment are respectively equipped with sensor 21, and are very uneconomical, use public sensor 21 so actual conditions are operating personnel, when carrying out teaching the processing unit that becomes object adjusted.Particularly in having assembled the above-mentioned coating developing device of a plurality of processing units, in order to reduce the device occupied area, and make the each processing unit miniaturization, on one side so on one side operating personnel carry out axle and aim at, there is time-consuming problem in adjustment sensor 21 in the unit.

Under the situation of the sensor 21 that has used the light reflection-type, disperse owing to for example atmosphere on every side such as dust or illuminance produces the sensitivity of sensor 21 sometimes in addition, therefore worry to detect accurately the edge of wafer W.

Summary of the invention

The invention that the present invention carries out with regard to being based on such item, its purpose be to provide the substrate board treatment of the contraposition that just can carry out substrate in a kind of precision height and short time and substrate to method for position.

The substrate that substrate board treatment of the present invention has flatly remaining on vertical axle rotation substrate maintaining part freely carries out the processing unit that predetermined process is used, obtain the substrate that undertaken by the substrate supply unit data in advance to the delivery position of substrate maintaining part, substrate board treatment is characterised in that, has:

Shooting has been given the image unit that the mark that forms on the surface of the substrate that the contraposition of aforesaid substrate maintaining part uses is used by the aforesaid substrate supply unit;

The straight line that the position of the above-mentioned mark that photographs respectively is bonded mutually according to the front and back when aforesaid substrate maintaining part Rotate 180 is spent is decided to be the data of 1/2 position, the unit that the position offset of the rotation center of the center of substrate and substrate maintaining part is carried out computing;

The unit that has or not of the position offset that judgement is tried to achieve by this unit;

When being arranged, position offset the substrate supply unit is reapposed substrate, when having concluded so that the unit consistent, the center of substrate with the rotation center of substrate maintaining part; And

The storage unit of the position data of the substrate supply unit the when center of memory substrate is consistent with the rotation center of substrate maintaining part.

Above-mentioned mark for example also can be formed centrally in substrate surface.In addition, judge that the unit of above-mentioned position offset also can be such structure: according to the kind of predefined processing unit, have and regard the permissible value consistent as, judge whether above-mentioned position offset is bigger than permissible value with rotation center.

In addition, the substrate board treatment on the other hand of invention has and carries out the processing unit of predetermined process to flatly remaining on substrate on the substrate maintaining part, obtain the substrate that undertaken by the substrate supply unit data in advance to the delivery position of substrate maintaining part, substrate board treatment is characterised in that, has:

Shooting has been given the image unit that the mark that is formed centrally that the contraposition of aforesaid substrate maintaining part uses is used by the aforesaid substrate supply unit in substrate surface; And

According to the shooting results of the shooting results of the above-mentioned mark that is undertaken by this image unit and the mark that in the substrate maintaining part that photographs in advance, is formed centrally, the judging unit whether center of judging substrate and the center of substrate maintaining part be consistent.

The substrate board treatment of inventing another aspect has and carries out the processing unit of predetermined process to flatly remaining on substrate on the substrate maintaining part, obtain the substrate that undertaken by the substrate supply unit data in advance to the delivery position of substrate maintaining part, substrate board treatment is characterised in that, has:

Shooting has been given the image unit that the mark that is formed centrally that the contraposition of aforesaid substrate maintaining part uses is used by the aforesaid substrate supply unit in substrate surface;

According to the shooting results of the shooting results of the above-mentioned mark that is undertaken by this image unit and the mark that in the substrate maintaining part that photographs in advance, is formed centrally, the unit that the position offset at the center of the center of substrate and substrate maintaining part is carried out computing;

The judging unit whether position offset that judgement is tried to achieve by this unit is bigger than permissible value;

When having concluded that position offset is bigger than permissible value, the substrate supply unit is reapposed substrate, so that the unit consistent, the center of substrate with the center of substrate maintaining part; And

The storage unit of the position data of the substrate supply unit the when center of memory substrate is consistent with the center of substrate maintaining part.

The substrate board treatment of another aspect of invention has and carries out the processing unit of predetermined process to flatly remaining on substrate on vertical axle rotation substrate maintaining part freely, obtain substrate that a plurality of conveying arms by the substrate supply unit carry out data in advance to the delivery position of substrate maintaining part, substrate board treatment is characterised in that, has:

Give a conveying arm of aforesaid substrate maintaining part with the substrate that contraposition is used;

The image unit that the mark that forms on the surface of the substrate that the contraposition of this substrate maintaining part uses and the mark that can become the center of aforesaid substrate maintaining part are used has been given in shooting;

With above-mentioned another the different conveying arm of a conveying arm that keeps this image unit;

According to the photographed data of the mark of the above-mentioned mark that is photographed by above-mentioned image unit and the center that can become the aforesaid substrate maintaining part, the position data of trying to achieve coordinate position data obtains program;

Utilize above-mentioned position data to obtain program, the substrate that contraposition is used is placed on the aforesaid substrate maintaining part, each coordinate position data that the shooting results of the above-mentioned mark that photographs respectively according to the front and back when Rotate 180 is spent is tried to achieve;

The coordinate position data that will be decided to be 1/2 coordinate position data to the straight line that links above-mentioned each coordinate position data and try to achieve as the center of aforesaid substrate maintaining part compares, and position offset is carried out the operation program of computing;

The determining program that has or not of the position offset that judgement is tried to achieve by computing;

Having under the situation of above-mentioned position offset, the aforesaid substrate supply unit is reapposed substrate, so that the center of the substrate tentative again program consistent with the above-mentioned coordinate position data of trying to achieve as the center of substrate maintaining part; And

Store the storage unit of the position data of the coordinate data of coordinate data and the center of aforesaid substrate maintaining part at center of the substrate that above-mentioned contraposition the uses aforesaid substrate supply unit when consistent.In the case, also can be such structure: in above-mentioned determining program,, the permissible value of regulation is arranged according to the kind of predefined processing unit.

The aforesaid substrate supply unit can be such structure also: have a plurality of conveying arms free to advance or retreat independently of one another when being arranged above and below, the substrate and the image unit that keep contraposition to use respectively on a conveying arm among these a plurality of conveying arms and another conveying arm.In the case, after the delivery position of the substrate on conveying arm is determined, give the substrate maintaining part by the substrate that another conveying arm is used contraposition, on the conveying arm beyond this another conveying arm, keep image unit in addition, the data that obtain the delivery position of the substrate on another conveying arm get final product, in addition, the image unit that keeps on this another conveying arm also can pass through the substrate maintaining part, transfer on another conveying arm conveying arm in addition, perhaps another conveying arm also can be the arm that keeps the special use of image unit.In addition, can be such structure also: have under the state of the rear side of supporting substrate can lifting base plate supports portion, make the close image unit of the substrate of having been given the aforesaid substrate maintaining part with this substrate elevating portion, take.

The method of adjustment of substrate transfer position of the present invention be a kind of by the substrate supply unit with substrate give be arranged on to substrate carry out in the processing unit that predetermined process uses, when freely the substrate maintaining part of vertical axle rotation, obtain the method for adjustment of substrate transfer position of the position data of substrate supply unit, it is characterized in that, comprise following operation:

To form the operation that substrate that the contraposition of mark uses is given the aforesaid substrate maintaining part from the teeth outwards by the substrate supply unit;

180 front and back when spending, the operation of taking above-mentioned mark by image unit have been rotated making the aforesaid substrate maintaining part;

The straight line that is interlinked according to the position of each mark that will obtain in this operation is decided to be the data of 1/2 position, the operation that the position offset of the rotation center of the center of substrate and substrate maintaining part is carried out computing;

The operation that has or not of the position offset that judgement is tried to achieve in this operation;

Concluded when position offset is arranged, consistent for the center that makes substrate with the rotation center of substrate maintaining part, and the substrate supply unit is reapposed the operation of substrate; And

When consistent, obtain the operation of the position data of substrate supply unit at the center of substrate with the rotation center of substrate maintaining part.

The method of adjustment of the substrate transfer position of another aspect of the present invention is that a kind of substrate being given by the substrate supply unit is arranged on when substrate carried out substrate maintaining part in the processing unit of predetermined process, obtain the method for adjustment of substrate transfer position of the position data of substrate supply unit, it is characterized in that, comprise following operation:

To in the surface, be formed centrally the operation that substrate that the contraposition of mark uses is given the aforesaid substrate maintaining part by the substrate supply unit;

Follow the operation of taking above-mentioned mark by image unit; And

According to the shooting results that in this operation, obtains, the operation whether center of judging substrate and the center of substrate maintaining part be consistent.

Follow the operation of taking above-mentioned mark by image unit;

According to the image pickup result that in this operation, obtains, the operation that the position offset at the center of the center of substrate and substrate maintaining part is carried out computing;

The operation whether position offset that judgement is tried to achieve in this operation is bigger than permissible value;

When position offset is bigger than permissible value, consistent for the center that makes substrate with the center of substrate maintaining part, and the substrate supply unit is reapposed the operation of substrate; And

The aforesaid substrate supply unit also can have a plurality of conveying arms free to advance or retreat independently of one another when being arranged above and below, a conveying arm among these a plurality of conveying arms is advanced, after the substrate that contraposition is used has been given the substrate maintaining part, this conveying arm is retreated, another conveying arm among a plurality of conveying arms is advanced, take mark on the substrate that contraposition uses by remaining on image unit on this another conveying arm.In the case, also can comprise following operation: after the delivery position of the substrate on conveying arm was determined, the substrate of contraposition being used by another conveying arm was given the operation of substrate maintaining part; And then on the conveying arm beyond this another conveying arm, keep image unit, obtain the operation of the position data of another conveying arm, also can comprise following operation in addition: the image unit that keeps on another conveying arm is placed on operation on the substrate maintaining part; And the conveying arm beyond another conveying arm receives the operation be placed on the image unit on the substrate maintaining part, perhaps also can be with the arm of another conveying arm as the special use that keeps image unit.In addition, in the operation of the mark on taking substrate surface, also can take by supporting the close image unit of substrate elevating portion that the substrate of having given the substrate maintaining part carries out lifting from rear side.

According to the present invention, by being formed on the substrate maintaining part substrate that the contraposition that keeps having formed on the surface mark is used, track according to the mark that makes this substrate when vertical axle rotates, try to achieve the structure at the center of turning axle, can grasp substrate the off-centring turning axle the center how far, and this skew of minimizing is become simply, can make mutual center unanimity at short notice in addition.In addition, under the non-rotary situation of substrate maintaining part,, carry out the contraposition of substrate supply unit, thereby can carry out contraposition more accurately by grasping the center of substrate maintaining part and the center of substrate with image unit.In addition,, by this substrate supply unit image unit is directed to camera site in the processing unit simultaneously, can reduces the needed time of adjustment, so can carry out the adjustment of delivery position at short notice by supporting image unit with the substrate supply unit.

Description of drawings

Fig. 1 is the planimetric map of the coating developing device of expression example of the present invention.

Fig. 2 is the oblique view of the coating developing device of expression example of the present invention.

Fig. 3 is the oblique view of the substrate supply unit of the above-mentioned coating developing device of expression.

Fig. 4 is the key diagram of the coating element assembled in the above-mentioned coating developing device of expression.

Fig. 5 is the key diagram of the heating unit assembled in the above-mentioned coating developing device of expression.

Fig. 6 is the oblique view that expression is installed in ccd video camera the form of the wafer that the shooting contraposition is used in the main supply unit.

Fig. 7 is the key diagram of the teaching unit used in the above-mentioned coating developing device of expression.

Fig. 8 is the process chart of expression teaching operation.

The key diagram of the view data that Fig. 9 obtains when being the expression teaching.

Figure 10 is another routine process chart of expression teaching operation.

The key diagram of the view data that Figure 11 obtains when being the expression teaching.

Figure 12 is another routine process chart of expression teaching operation.

The key diagram of the offset phenomenon when Figure 13 is the decline of expression wafer.

Figure 14 is another the routine key diagram that is illustrated in the mark that forms on the surface of the wafer that contraposition uses.

Figure 15 is the planimetric map of the existing coating developing device of expression.

Figure 16 is the key diagram that the form of existing teaching is carried out in expression.

Embodiment

The coating developing device of the example of substrate board treatment of the present invention at first is described with reference to Fig. 1 and Fig. 2.B1 sends into to send to have accommodated 13 box loading parts as box 3 usefulness of the wafer W of substrate hermetically among the figure, is provided with: the box platform 30 that has the loading part 30a that can load a plurality of boxes 3; From this box platform 30, be arranged on the switching portion 31 on the wall in the place ahead; And from box 3, take out the handing-over unit A1 that wafer is used by switching portion 31.In addition, the rear side of box loading part B1 is connecting handling part B2, is provided with in this handling part B2: with the unit multipolarity of heating and cooling system frame unit U1, U2, U3; Liquid processing unit U4, U5 that the liquid of wafer W being stipulated with treating fluid is handled; And the main supply unit A2, the A3 that each unit are carried out the handing-over of wafer W.That is, main supply unit A2, A3 are constituted as and can visit each adjacent unit, and wafer W can freely move to the frame unit U3 of the other end from the frame unit U1 of an end in handling part B1.In addition, among the figure the 32, the 33rd, the temperature control equipment of the treating fluid of using in each unit and have the temperature humidity regulon that temperature humidity is regulated the pipeline etc. of usefulness.

Liquid processing unit U4, U5 are for example as shown in Figure 2, supply with on the resettlement section 34 in space of usefulness multistage for example 5 grades of stacked coating element (COT), developing cell (DEV) and anti-reflective film formation unit (BARC) etc. at the soup that makes coating liquid (resist liquid) and developer solution.In addition, the pre-treatment of multistage for example 10 grades of processing of in liquid processing unit U4, U5, carrying out that frame unit U1, U2, the U3 that had said is stacked and the various unit that aftertreatment is used, its combination comprise to wafer W heat the heating unit of (curing), cooling unit that wafer W is cooled off etc.

The rear side of frame unit U3 in handling part B2 is the interface portion B3 by being made of first conveying chamber 35 and second conveying chamber 36 for example, connects the exposure B4 of portion.Be provided with two handing-over unit A4, A5 of the handing-over usefulness of between handling part B2 and the B4 of exposure portion, carrying out wafer W in interface portion B3 inside, in addition, also be provided with frame unit U6 and buffer pocket C0.

About the line production of the wafer W in this coating developing device, for instance, at first, accommodated the box 3 of wafer W in case be loaded in the loading part 30a from the outside, the lid of box 30 is just opened with switching portion 31, and unit A1 takes out wafer W by handing-over.Then, wafer W is by the handing-over unit (not shown) of the one-level of formation frame unit U1, given main supply unit A2, in the frame in frame unit U1～U3, pre-treatment as the coating processing, for example carry out anti-reflective film and form processing, cooling processing, then coating resist liquid in coating element (COT).Secondly, wafer W heats (curing processing) in the heating unit of a frame that constitutes frame unit U1～U3, and after having carried out cooling off, the handing-over unit via frame unit U3 is admitted among the interface portion B3 again.In this interface portion B3, wafer W for example through handing-over unit A4 → frame unit U6 → such path of U5, handing-over unit, is fed to the B4 of exposure portion, exposes.After the exposure, wafer W is sent to main supply unit A2 through opposite path, develops in developing cell (DEV), forms the resist figure with this.Wafer W turns back in the original box 30 of loading part 30a then.

Here describe above-mentioned main supply unit A2 (A3) in detail with Fig. 3 as the substrate supply unit.Main supply unit A2 (A3) has and utilizes not shown driving mechanism, the energy lifting also can be around the mobile matrix 40 of vertical axle rotation, move on the matrix 40 at this, the conveying arm 4D that is arranging edge along the vertical direction, carrying for example 3 conveying arm 4A (4B, 4C) that this wafer W uses and teaching to use with horizontal attitude from rear side supporting wafers W, each conveying arm 4A (4B, 4C, 4D) utilizes this not shown driving mechanism simultaneously, can constitute independently free to advance or retreatly.In addition, as hereinafter described, conveying arm 4D is the arm of teaching with the special use that is provided with, and can be removed after all teaching finishes.In addition, main supply unit A2 (A3) uses the partition 41 in isolation processing space to surround around it, by the delivery port that is arranged above and below 42 that forms on the side wall surface of this partition 41, carries out sending into of wafer W and send in processing units at different levels.That is, main supply unit A2 (A3) utilizes advance and retreat direction (R axle) and the turning axle (θ axle) of conveying arm 4A (4B, 4C), and according to polar coordinates, the position of decision in-plane utilizes above-below direction (Z axle), the position of Decision Height direction simultaneously.That is, determine the position of conveying arm 4A～4C,, carry out the control of its amount of movement by being controlled at work that each goes up the independent driving mechanism that is provided with for example scrambler by R, θ, Z position coordinates.

In coating developing device, be provided with different a plurality of processing units of the apparatus structure that carries out mutually different processing usefulness as mentioned above, owing to being sent into wafer W with public main supply unit A2 (A3), these processing units send, so in order more effectively to carry out teaching, selecting to adopt the teaching method corresponding to this apparatus structure is a kind of very wise move.Therefore, in this example, as hereinafter described,, adopt mutually different teaching method under the situation of the wafer mounting table of the processing unit that becomes teaching object rotation and under the non-rotary situation.Here, coating element (COT) has been shown, as an example of the processing unit of function, in addition among Fig. 4 with the wafer W of making rotation, the heating unit (BAKE) that wafer W is heated usefulness has been shown, as an example of the processing unit of the function that does not have the wafer W of making rotation among Fig. 5.

Now describe coating element (COT) in detail, 5 is rotary chucks as the substrate maintaining part that absorption keeps the back side of wafer W to use among the figure.This rotary chuck 5 is connected with driving mechanism 52 by axial region 51, is keeping with horizontal attitude under the state of wafer W, can be around vertical axle rotation.Be provided with outer cover 53, surround the outer periphery that is maintained at the wafer W on the rotary chuck 5.In addition, the surface with wafer W is provided with the coating liquid supply nozzle 54 that coating is used as the resist liquid of coating liquid opposite to each other.In addition, below wafer W, be provided with the cleaning fluid ejection portion 55 that the edge of cleaning solution supplying wafer W is used.Be provided with for example 3 base plate supports bars 56 as substrate elevating portion in the lower rear of rotary chuck 5, this base plate supports bar 56 can be from the back support wafer W along with lifting unit 57 rises.

In such coating element (COT), keep under the state of wafer W with flat-hand position at conveying arm 4A (4B, 4C), by the delivery port on the partition 41 42, enter in this unit, the delivery position that wafer W is configured in regulation is the top position of the substrate retaining zone of rotary chuck 5 for example.Then, by with base plate supports bar 56 concerted actions of carrying out lifting, wafer W is placed on the surface of rotary chuck 5.Then, after conveying arm 4A (4B, 4C) retreated, coating liquid supply nozzle 54 made wafer W around vertical axle rotation the central part of resist liquid supply wafer W simultaneously, utilizes action of centrifugal force, makes resist liquid spread on the surface of wafer W.Then, by making the wafer W high speed rotating, make resist liquid Rotary drying after, wafer W is rotated, and meanwhile from cleaning fluid ejection portion 55 with the cleaning solution supplying periphery, clean the edge flushing of the resist liquid that is applied on the periphery.

Then describe heating unit (BAKE) in detail.6 is to place the mounting table as the substrate maintaining part that wafer W is used among the figure.Be provided with well heater 61 in the inside of this mounting table 6, the surface of mounting table 6 constitutes the heating plate of heated chip W.In addition, in order to suppress particulate attached on the wafer W, a plurality of back sides that make wafer W are set on mounting table 6 float the jut 62 near pillar of being called of usefulness slightly from mounting table 6, one of them is arranged on the center of the wafer W put area of mounting table 6.In addition, be provided with the through hole 63 of up/down perforation on the surface of mounting table 6, by this through hole 63, haunting is provided with base plate supports bar 64 as substrate elevating portion freely.In such heating unit (BAKE), conveying arm 4A (4B, 4C) by the delivery port on the partition 41 42, enters in the unit under the state that has kept wafer W, and the delivery position that wafer W is configured in regulation is the top position of the put area of mounting table 6 for example.Then, by with base plate supports bar 64 concerted actions of carrying out lifting, wafer W is given base plate supports bar 64, and then base plate supports bar 64 descends, wafer W is placed on the mounting table 6.Be placed on after wafer W on the mounting table 6 is heated to the temperature of regulation, by with the path of foregoing reversed in order, from the unit, be sent.

Then, have the teaching unit of above-mentioned coating developing device with Fig. 6 and Fig. 7 explanation.W1 is the wafer that the contraposition used in the teaching is used among the figure, in its surface and for example for example be formed centrally in its surface in the position of regulation that diameter is the circular mark M of 5mm.In addition, the 70th, for example with the identical anchor clamps of wafer W 1 size, the zone forms peristome 70a in the central.Be provided with for example ccd video camera 71 in the upper surface side of anchor clamps 70 in addition, utilize this ccd video camera 71, can take lower zone by above-mentioned peristome 70a as image unit.In more detail, when teaching, anchor clamps 70 on the conveying arm 4D that teaching is used with wafer W 1 similarly under the state that keeps with horizontal attitude, be directed into and be maintained at the position in opposite directions, surface of the wafer W 1 on the rotary chuck 5, can take the mark M of wafer W 1.The control part 8 that this ccd video camera 71 for example passes through to connect up with as the teaching control system is connected.

Now explain control part 8,81 is the image data storage portions that store the view data that is photographed by ccd video camera 71 among the figure, the 82nd, temporarily store the working storage of the position (X, Y coordinate) etc. of the mark M on the wafer W 1 of each position of rotation of rotary chuck 5,83,84 is respectively first tutorial program and second tutorial program.Though in fact these programs 83,84 are stored in the storer (storage part), for convenience of explanation, make program enclose symbol and describe.Prepared in this embodiment: in order to obtain for example processing unit that is not rotated of the mounting table of coating element (COT) and the wafer W data of the transition of the main supply unit A2 (A3) of heating unit (BAKE) for example of processing unit that the mounting table that corresponds respectively to wafer W is rotated, for this carries out first tutorial program 83 that teaching is used to coating element (COT) etc.; And heating unit (BAKE) etc. carried out second tutorial program 84 that teaching is used.First tutorial program 83 has: according to the view data that is obtained by ccd video camera 71 on each position of rotation of rotary chuck 5, the position data that obtains the position (coordinate position of X, Y coordinate) of the mark M in each position of rotation obtains program 83a; According to the position of the mark M in each position of rotation, obtain the operation program 83b of position offset at the center of the rotation center of rotary chuck 5 and wafer W 1; According to the result who tries to achieve by this operation program 83b, judge the determining program 83c that has or not of position offset; And concluded when position offset is arranged, reappose the tentative again program 83d of wafer W 1 (tentative again) with conveying arm 4A (4B, 4C).

In addition, second tutorial program 84 has: according to the view data that obtains on ccd video camera 71, the position data that obtains the position of the position of jut 62 of mark at the center that can become the mounting table 6 of heating unit (BAKE) (heating plate) and the mark M on the wafer W 1 obtains program 84a; According to obtained result, computing is carried out in the skew of the position of the mark M of the position of jut 62 and wafer W 1, judge the whether determining program 84b in predefined scope (allowed band) of this position offset; And when having concluded beyond the allowed band, try program 84c again with what conveying arm 4A (4B, 4C) reapposed wafer W 1 (tentative again).

In addition, 85 is positions of jut 62 of the mark at the center that can become mounting table 6, the center of the rotation center consistent location of the center of the wafer W 1 that is admitted to and rotary chuck 5 or wafer W 1 when being positioned at the allowed band of regulation among the figure, and each processing unit is stored the storage part that the delivery position of the wafer W 1 of each conveying arm 4A (4B, 4C) is used.That is, be stored in data in this storage part 85 by the delivery position data of the conveying arm 4A of teaching (4B, 4C), the value with R, θ, Z manages as mentioned above.In addition, the 86th, the input block that constitutes by guidance panel etc. for example, for example picture that display operation is used during teaching.The 87th, CPU, the 88th, according to control signal from control part 8, the cell controller of controlled processing unit, the 89th, according to control signal, control the arm controller of main supply unit A2, A3 from control part 8.In addition, B is a bus.

Then, the operation of the teaching of carrying out conveying arm 4A (4B, 4C) is described, but the situation of the coating element as processing unit (COT) of the function with the wafer W of making 1 rotation is described here with Fig. 8 and Fig. 9.At first, shown in step S1, as preparation, the wafer W 1 that contraposition is used is supported on the conveying arm 4C of for example upper level that carries out teaching, anchor clamps 70 is supported on the conveying arm 4D of teaching special use simultaneously.Secondly, for example basis is according to the position of the rotary chuck 5 of design data storage, make conveying arm 4D forwards (R direction of principal axis) stretch out, ccd video camera 71 is taken rotary chuck 5 on one side under this state, on one side in order to adsorb its approximate centre position, the back side of wafer W for example, and confirm the position (step S2) of the vacuum hole that the centre of surface at rotary chuck 5 forms.Therefore, near the approximate centre of the shooting area of the anchor clamps 70 that are centered close to conveying arm 4D support of rotary chuck 5.At this moment, the position coordinates of conveying arm 4D is stored in the working storage 82.After this,, conveying arm 4C is advanced, wafer W 1 is configured in delivery position according to the position coordinates of this storage.At this moment, in coating element (COT), by base plate supports bar 56, wafer W 1 is given rotary chuck 5 (step S3) from conveying arm 4C as mentioned above.

Secondly, conveying arm 4C retreats, shown in step S4, the conveying arm 4D of support fixture 70 is according to the position coordinate data of obtaining in above-mentioned steps S2, enter in the unit, anchor clamps 70 are directed into and are maintained at the position in opposite directions, surface of the wafer W 1 on the rotary chuck 5, utilize ccd video camera 71 to take the lip-deep mark M of wafer W 1.The view data 200 that this shooting obtains is taken into image data storage portion 81, then obtain program 83a according to position data, by computing, obtain the position data data of the position coordinates of X=1, Y=1 for example in the shooting area of view data 200, store into (step S5) in the working storage 82.Then, shown in step S6,, make wafer W 1, similarly obtain the position data of each phase place respectively around the angle of the every rotation regulation of vertical axle 90 degree for example by spinning movement by cell controller 88 control rotary chucks 5.Obtained position data is more than two positions at least and for example is even number, gets final product in opposite directions 180 ° position before and after the rotation.For example shown in Fig. 9 (a), as this example, under the situation of the position data that obtains 0 degree, 90 degree, 180 degree, 4 positions of 270 degree, carry out the work of step S4～S6 repeatedly, till obtaining these position datas whole (step S7).

Then, shown in step S8,, obtain the center of turning axle according to operation program 83b according to the position data that obtains above-mentioned 4 positions that program 83a obtains according to position data.Specifically, for example shown in Fig. 9 (b), will link the straight line of 0 degree and 180 position datas of spending or link 90 degree and the crossing point (X of the straight line of the position data of 270 degree ₀=0, Y ₀=0) as the center of turning axle, it is stored in the working storage 82 as the center position coordinates corresponding to conveying arm 4C.In addition, for example under the situation of the position data that has obtained two positions, will link the position coordinates of 1/2nd distance of straight line of mutual alignment data as the center position coordinates of turning axle.Then, conveying arm 4C receives the wafer W 1 on the rotary chuck 5, retreat into the outside back (step S10) of unit, according to the center position coordinates that in step S8, obtains as the result of position data, give rotary chuck 5 (step S11) with wafer W 1, the operation of execution in step S4～S8 is carried out obtaining of data for the second time.Here, shown in step S9, for the second time position data obtains after the work, is not one or has set allowed band but not under the situation in this scope, conclude by determining program 83c whether offset is arranged at the position coordinate value of the mark M on 1 surface of the wafer W on each position of rotation.Then,, shown in step S10,, proofread and correct θ axle and R axle according to tentative program 83d again having concluded when offset is arranged, so that position coordinate value skew each other diminishes,, carry out the work of step S3～S8 once more according to this position coordinate value.For example according to the kind of processing unit, determine above-mentioned allowed band, for example can enumerate following example: under the situation of coating element (COT), the change distance for example is set at the following off-centre of 0.1mm; Under the situation of developing cell (DEV), for example be set at the following off-centre of 0.3mm; In addition, in the back under the situation of described heating unit, for example be set at following poor of 0.5mm.Then, in step S9, if conclude position data (no offset) consistent with each other, then shown in step S11, the setting value of at this moment delivery position as the setting value of conveying arm 4C with respect to this coating element (COT), is stored in the storage part 85, finishes the teaching of conveying arm 4C.In fact by making wafer W 1 rotation, see whether the rotational trajectory of mark M has off-centre, can improve aligning accuracy more reliably.

Then, shown in step S12, under the situation that other conveying arm 4B, the 4A that do not carry out teaching are arranged, the for example conveying arm 4B of middle rank that then carries out teaching enters in the unit, obtain wafer W 1 and retreat from rotary chuck 5, turn back to step S2, carry out the teaching of conveying arm 4B.In addition, if the teaching of the conveying arm 4B of middle rank finishes, then carry out the teaching of the conveying arm 4A of subordinate equally.In addition, after the processing unit that becomes benchmark had for example carried out at first in the processing unit of teaching, carried out the contraposition of conveying arm 4A～4C, it is just much of that some among conveying arm 4A～4C carries out contraposition.Its reason is that remaining arm has been obtained relative position data with respect to the delivery position of this arm.

According to above-mentioned example, owing on the surface of identical with the processed substrate of the reality wafer W 1 as substrate, form mark M, remain on the rotary chuck 5, the track of mark M when making 1 rotation of this wafer W, ask the center of turning axle, so the skew that can quantize simply with the center of the center of grasping wafer W 1 and turning axle has much.Therefore, can reset the setting value (corrected value) of carrying out again when tentative simply.Consequently, can reduce tentative again number of times, make the center of wafer W 1 consistent, so can carry out teaching with the short time with the center of turning axle.In addition, under the situation of the transmittance type sensor of in using " background technology " item, putting down in writing, for example in order to adjust with 50 microns precision, mostly must carry out trying again about 5 times under the situation, if but according to the present invention, the inventor has confirmed that the number of times that carries out lacking than it for example tries for twice again, just can reach identical precision.About its reason, the inventor considers as follows.When for example detecting the edge of wafer W 1 with the light transmission type sensors, sensor and conveying arm have coordinate system separately, therefore at right angles entering with respect to the moving direction of transmittance type sensor with conveying arm is prerequisite, in addition, the data that one-time detection obtains are data of a direction (X or Y direction), for example turn 90 degrees, can obtain the position data of two directions Xs and the position data of two Y directions by wafer W 1 is whenever revolved.

Different therewith, in the present invention, by ccd video camera 71 is installed on the conveying arm 4A, concerning each processing unit, make the coordinate system socialization of the coordinate system and the conveying arm 4A～4D of this ccd video camera 71, the position data of the mark M of one-time detection (shooting) acquisition in the present invention is to determine the data of X, two coordinates of Y simultaneously, by whenever being revolved, wafer W 1 turn 90 degrees, 4 these data can be obtained, so as a result of, 4 data of directions X and 4 data of Y direction can be obtained.Because such difference, as the offset information of wafer W 1, therefore precision height of the present invention can think that more tentative number of times reduces.The needed time of single test was approximately about 2 minutes, but for a plurality of processing units, owing to carry out test of many times, so as a result of, can seek as can be known to shorten the time significantly.

In addition, in order to ask the rotation center of rotary chuck 5 according to the track of mark M, at least the position data that obtains the mark M in each position of rotation at two positions gets final product, in this embodiment owing to obtain the position data of mark M in the position of rotation at mutually different 4 positions of per 90 degree, the intersection point that differs the straight line that links up between the coordinate of 180 degree is mutually asked as rotation center, so calculation process is easy.In addition, if obtain the position data at two positions, a position coordinates of/2nd of the straight line of mutual position data will be linked, promptly the position coordinates of the mid point of this straight line then can be used a spot of position data as the center position coordinates of turning axle, tries to achieve the center of turning axle, in addition, obtaining in the few part of number of position data, owing to can carry out teaching at short notice, so be favourable.

In addition, if adopt above-mentioned example, then owing to support the anchor clamps 70 that have as the ccd video camera 71 of image unit with conveying arm 4D, with this conveying arm 4D anchor clamps 70 are directed to camera site in the unit simultaneously, for example compare, can save operating personnel's time significantly, so as a result of with the situation that sensor is arranged on cell side, the needed time of teaching can be sought to shorten, operating personnel's burden can also be alleviated.

Operation when then, being object with heating unit as the processing unit of the function that wafer W 1 is rotated with Figure 10 and Figure 11 explanation.At first, shown in step S101, as preparation, the wafer W 1 that contraposition is used is supported on for example higher level conveying arm 4C that carries out teaching, anchor clamps 70 is supported on the conveying arm 4D of teaching special use simultaneously.Then, for example basis is based on the center of the heating unit of design data storage, make conveying arm 4D forwards (R direction of principal axis) stretch out the back static, shooting can become the jut 62 of mark at the center of the wafer placement area on the mounting table 6, and view data 200 is taken into (step S102) in the image data storage portion 81.Then, obtain program 84a, obtain the position coordinates (the center data of mounting table 6) of the jut 62 of the center in the shooting area of view data 200, be stored in (step S103) in the working storage 82 according to position data.

Then, conveying arm 4D is retreated, according to above-mentioned position coordinates conveying arm 4C is advanced simultaneously, wafer W 1 is configured on the delivery position.At this moment, in heating unit (BAKE), as mentioned above, by base plate supports bar 64, wafer W 1 is given mounting table 6 (step S104) from conveying arm 4C.Then, conveying arm 4C retreats, shown in step S105, higher level's conveying arm 4D of support fixture 70 is according to the data of the center position coordinates that obtains in step S103, enter in the unit, anchor clamps 70 are directed into and remain on the position in opposite directions, surface of the wafer W 1 on the mounting table 6, take the lip-deep mark M of wafer W 1 with ccd video camera 71, and this view data 200 is taken in the image data storage portion 81.Then, obtain program 84a, obtain the position coordinates of the position data of the M that serves as a mark, be stored in (step S106) in the working storage 82 according to position data.

Then shown in step S107, read determining program 84b, the position data of wafer W 1 and the center data of mounting table 6 are compared, though under the consistent or inconsistent situation in predetermined allowed band of these position datas, conclude that wafer W 1 is placed in suitable position.On the other hand, inconsistent again not under the situation in allowed band in position data, according to tentative program 84c again, the value of proofreading and correct θ axle and R axle, so that the mutual skew of position data little (step S108) retreats (step S109) after the wafer W 1 on the conveying arm 4C reception mounting table 6.The delivery position that to proofread and correct then carries out the work of step S104～S106 once more as new setting value.Then,, shown in step S110, the setting value of at this moment delivery position as the setting value of conveying arm 4C with respect to this heating unit, is stored in the storage part 85, finishes the teaching of conveying arm 4C if in step S107, conclude mutual position data unanimity.

Then, shown in step S111, under the situation that the other conveying arm that does not carry out teaching is arranged, the for example conveying arm 4B of middle rank that then carries out teaching enters in the unit, after receiving wafer W 1, rotary chuck 5 retreats, carry out the work shown in step S104～S110, carry out the teaching of this conveying arm 4B.In addition, if the teaching of the conveying arm 4B of middle rank finishes, then similarly carry out the teaching of the conveying arm 4A of subordinate.

According to above-mentioned example, as the processing unit of object no matter the function that does not still make wafer W 1 rotation is arranged, by the center data of wafer W 1 and the center data of mounting table 6 are compared, can easily grasp great skew, in addition, can set new setting value (corrected value) simply, so that reduce skew, so can obtain and the above-mentioned same effect of situation.In addition, in this example, be not limited to the structure of the adjustment of carrying out delivery position, for example also can confirm whether wafer W 1 is placed on the unit use at the position of regulation only as judged result according to step S107.

Then, with reference to Figure 12 explanation above-mentioned coating element (COT) is carried out the example of another operation of teaching.In addition, if situation about will take under wafer W 1 is supported on state on the base plate supports bar 56 is removed, then the example of putting down in writing among the detailed operation in each step and Fig. 8 is identical.At first, the wafer W of for example contraposition being used 1 is supported on the conveying arm 4C, simultaneously anchor clamps 70 is supported on conveying arm 4D and goes up (step S201).Secondly, make conveying arm 4D forwards (R direction of principal axis) stretch out, take rotary chucks 5 with ccd video camera 71, confirm its approximate centre position, its position coordinates is stored in (step S202) in the working storage 82.Then, according to the above-mentioned position coordinates of being stored, conveying arm 4C is advanced, by the synergy of base plate supports bar 56 and conveying arm 4C, wafer W is given rotary chuck 5 (step S203).

After this, conveying arm 4C retreats into the outside of unit, base plate supports bar 56 is risen, wafer W is set near the position that lifting position (camera site) for example joins with conveying arm 4C, the conveying arm 4D of support fixture 70 enters in the unit simultaneously, takes the mark M (step S204) of the wafer W 1 on the base plate supports bar 56 with ccd video camera 71.That is to say, utilizing base plate supports bar 56 to make wafer W approach under the state of ccd video camera 71 shot mark M as the body that is taken.The view data of the 0 degree position that this shooting obtains is taken into image data storage portion 81, then obtains program 83a according to position data, obtains position data, is stored in (step S205) in the working storage 82.Then, base plate supports bar 56 is descended, give rotary chuck 5, utilize this rotary chuck 5 to make wafer W 1 rotate for example 90 degree or 180 degree, obtain the position data of the mark M of position (step S206～208) in opposite directions equally around vertical axle with wafer W 1.Then, carry out the work of above-mentioned steps S206～208 repeatedly, more than at least two positions and for example be the number of even number, 180 ° position before and after rotation is obtained (step S209) till the position data in opposite directions.

Then, shown in step S210,,, ask the center of turning axle according to operation program 83b according to obtained position data.Specifically, at first, judgement is corresponding to the position coordinates of the 0 degree position of obtaining in step S205 and the position coordinates obtained in step S202 (for the second time, before the position coordinates of the central shaft once in step S210, obtained) between whether offset is arranged, concluding when not having offset, with two position datas in opposite directions, for example with the position coordinates of 1/2nd distance of the straight line that links up of position datas of the position datas of 0 degree and 180 degree or 90 degree and 270 degree center as turning axle.On the other hand, when for example wafer W descends, laterally moving of this wafer W that generation is caused by air bearing phenomenon etc., concluded when two position coordinateses have skew, try to achieve this offset direction and side-play amount by computing, carry out the correction of each position data, with the position coordinates of 1/2nd distance of the straight line of the position data after the correction that links in opposite directions center position coordinates as turning axle.

Like this, if primary data obtain end, then then conveying arm 4C receives wafer W from base plate supports bar 56, temporarily retreat into the outside back (step S211,212) of unit, as mentioned above according to obtained center position coordinates, enter in the unit, by with the synergy of base plate supports bar 56, give rotary chuck 5 (step S213) with wafer W 1.Then, similarly carry out the work of step S204～S210, carrying out secondary data obtains, but this secondary position data obtains after the work, the position coordinate value of wafer W 1 lip-deep mark M during rotation becomes one, if perhaps conclude in allowed band, then incites somebody to action the setting value of delivery position at this moment as the setting value of conveying arm 4C with respect to this coating element (COT), be stored in the storage part 85, finish the teaching (step S214) of conveying arm 4C.

On the other hand, in step S211, if conclude that according to determining program 83c the position coordinate value of the wafer W 1 lip-deep mark M in when rotation is not one or not in allowed band, then conveying arm 4C receives wafer W from base plate supports bar 56, temporarily retreat into the outside back (step S212) of unit, for the tentative again program 83d of basis, make the mutual skew of position data little, to proofread and correct the delivery position of θ axle and R axle as new setting value, conveying arm 4C enters in the unit, gives base plate supports bar 56 (step S213) with wafer W 1.And then carry out the work of step S204～S210.

Then, shown in step S215, under the situation that the other conveying arm that does not carry out teaching is arranged, the for example conveying arm 4B of middle rank that then carries out teaching enters in the unit, after rotary chuck 5 receives wafer W 1, retreat, turn back to step S2, carry out the teaching of this conveying arm 4B.In addition, if the teaching of the conveying arm 4B of middle rank finishes, then similarly carry out the teaching of the conveying arm 4A of subordinate.

Even such structure also can be according to obtained position data, the position offset of grasping the center of the center of wafer W 1 and turning axle simply has much, so can obtain and the above-mentioned same effect of situation.In addition, under this routine situation, make wafer W approach ccd video camera 71, take, so even the distance that for example can take owing to its performance is short, for example under the situation of using cheap ccd video camera 71, also can guarantee the precision of view data, at length as described below, can reduce the influence that utilizes base plate supports bar 56 that the wafer W lifting is produced before and after taking, carry out teaching.

That is, during the down maneuver of the wafer W of being undertaken by base plate supports bar 56, for example shown in Figure 13 (a), and rotary chuck 5 between the wafer W lateral attitude skew that caused by air bearing phenomenon etc. for example takes place sometimes.If same unit and be the wafer W 1 of same size, then in the offset direction of the wafer W 1 that causes by this offset phenomenon and the side-play amount repeatability is arranged roughly, so if carry out teaching, the decision delivery position, then during after this PROCESS FOR TREATMENT, each wafer W does not change delivery position.In this example, at each position of rotation, by base plate supports bar 56 wafer W is risen, take, so for example the position offset of 0 degree position and 180 degree positions is different, then the teaching of leaving the center of actual turning axle of the center position coordinates of the turning axle of trying to achieve by computing does not restrain sometimes.Therefore, in this example, use corresponding to the position coordinates of the 0 degree position of in step S205, obtaining and the position coordinates in step S202, obtained (for the second time, before the position coordinates of the central shaft once in step S210, obtained), the direction and the side-play amount of the offset that produces when asking wafer W to descend by computing, carry out the position coordinates of inferior fractional part of the down maneuver of wafer W by correction, the influence that the wafer W lifting is produced, even perhaps have, also can make its influence minimum.

In addition, in the above-described embodiment, obtained the position data of 0 degree after, obtain with its position data of 180 in opposite directions before, also can carry out carrying out reapposing of wafer W 1 on the conveying arm 4C of teaching (4A, 4B).The moment of wafer W 1 being given conveying arm 4C (4A, 4B) for example is between above-mentioned step S205 and step S206.In the case, carry out 180 degree rotations by reapposing wafer W 1, obtain comprise offset 0 the degree position data (with reference to Figure 13 (a)) and for example shown in Figure 13 (b), obtain and comprise that the offset direction is the position data of 180 degree of 180 degree offsets in opposite directions, can ask the center of turning axle, so can obtain and the above-mentioned same effect of situation.In addition, shown in above-mentioned heating unit, even do not make the processing unit of the function of wafer W 1 rotation, also can make wafer W approach ccd video camera 71 by base plate supports bar 56, under this state, take, even in this case, for example use cheap ccd video camera 71, also can carry out teaching, this point is favourable.

In the present invention, being not limited to use the structure of maintenance as the arm of the special use of the anchor clamps 70 of image unit, for example also can be the structure of carrying anchor clamps by operating personnel's hand repacking.Specifically, when not having the teaching of the main supply unit A2 (A3) that has conveying arm 4A (4B, 4C) of 3 conveying arm 4D of teaching special use, at first anchor clamps 70 are supported on higher level's conveying arm 4C, after the teaching of having carried out another conveying arm 4A (4B), also anchor clamps 70 repacking can be loaded in another arm for example on the conveying arm 4A, in the teaching of carrying out this conveying arm 4C.Even such structure also can obtain the effect same with above-mentioned situation.

In addition, in the present invention, by for example on the anchor clamps 70 power supplys such as battery being set, the transmitting element that can send view data with wireless mode is set simultaneously, make this ccd video camera 71 wirelessization, also can form the structure that for example can between each conveying arm 4A～4C, carry out the handing-over of anchor clamps by rotary chuck 5.In the case, operating personnel can save the time that anchor clamps 70 are carried in repacking, so can carry out teaching at short notice more reliably, this is a very wise move.

In addition, in the present invention, the mark M of the wafer W 1 that contraposition is used is not limited to be formed centrally in its surface, for example also can be as shown in figure 14, also can be concentric circles and dispose a plurality of mark M with the center of wafer W 1 as benchmark.Even such structure also can obtain the effect same with above-mentioned situation.

In addition, in the present invention, substrate board treatment is not limited to coating developing device, for example also can be applied to be assembled in the substrate supply unit that forms in the film forming device that interlayer dielectric or unit protection film use etc.In addition, substrate of the present invention is not limited to wafer W, for example also can be applied to LCD substrate, photomask with in the heated wash device of former plate substrate, the LCD device.

Claims

1, a kind of substrate board treatment, have and carry out the processing unit of predetermined process flatly remaining on substrate on vertical axle rotation substrate maintaining part freely, obtain the substrate that undertaken by the substrate supply unit data in advance to the delivery position of substrate maintaining part, substrate board treatment is characterised in that, has:

2, by the described substrate board treatment of claim 1, it is characterized in that:

Above-mentioned be marked at substrate surface in be formed centrally.

3, by the described substrate board treatment of claim 1, it is characterized in that:

Judge the kind of the unit of above-mentioned position offset, have and regard the permissible value consistent as, judge whether above-mentioned position offset is bigger than permissible value with rotation center according to predefined processing unit.

4, a kind of substrate board treatment, have and carry out the processing unit of predetermined process flatly remaining on substrate on the substrate maintaining part, obtain the substrate that undertaken by the substrate supply unit data to the delivery position of substrate maintaining part in advance, substrate board treatment is characterised in that, has:

5, a kind of substrate board treatment, have and carry out the processing unit of predetermined process flatly remaining on substrate on the substrate maintaining part, obtain the substrate that undertaken by the substrate supply unit data to the delivery position of substrate maintaining part in advance, substrate board treatment is characterised in that, has:

6, by any described substrate board treatment in the claim 1 to 5, it is characterized in that:

The aforesaid substrate supply unit has a plurality of conveying arms free to advance or retreat independently when being arranged above and below separately, the substrate and the image unit that keep contraposition to use respectively on a conveying arm among these a plurality of conveying arms and another conveying arm.

7, a kind of substrate board treatment, have and carry out the processing unit of predetermined process flatly remaining on substrate on vertical axle rotation substrate maintaining part freely, obtain substrate that a plurality of conveying arms by the substrate supply unit carry out data in advance to the delivery position of substrate maintaining part, substrate board treatment is characterised in that, has:

Store the storage unit of the position data of the coordinate data of coordinate data and the center of aforesaid substrate maintaining part at center of the substrate that above-mentioned contraposition the uses aforesaid substrate supply unit when consistent.

8, by the described substrate board treatment of claim 7, it is characterized in that:

In above-mentioned determining program,, the permissible value of regulation is arranged according to the kind of predefined processing unit.

9, by the described substrate board treatment of claim 6, it is characterized in that:

After the delivery position of the substrate on conveying arm is determined, give the substrate maintaining part by the substrate that another conveying arm is used contraposition, on the conveying arm beyond this another conveying arm, keep image unit in addition, obtain the data of the delivery position of the substrate on another conveying arm.

10, by the described substrate board treatment of claim 9, it is characterized in that:

The image unit that keeps on another conveying arm is transferred on another conveying arm conveying arm in addition by the substrate maintaining part.

11, by the described substrate board treatment of claim 6, it is characterized in that:

Another conveying arm is the arm that keeps the special use of image unit.

12, by any described substrate board treatment in the claim 1 to 5,7,8 and 10, it is characterized in that:

Have under the state of the rear side of supporting substrate can lifting base plate supports portion, make the close image unit of the substrate of having been given the aforesaid substrate maintaining part with this substrate elevating portion, take.

13, a kind of method of adjustment of substrate transfer position, this be a kind of by the substrate supply unit with substrate give be arranged on to substrate carry out in the processing unit of predetermined process, when freely the substrate maintaining part of vertical axle rotation, obtain the method for adjustment of substrate transfer position of the position data of substrate supply unit, it is characterized in that, comprise following operation:

14, a kind of method of adjustment of substrate transfer position, this is that a kind of substrate being given by the substrate supply unit is arranged on when substrate carried out substrate maintaining part in the processing unit of predetermined process, obtain the method for adjustment of substrate transfer position of the position data of substrate supply unit, it is characterized in that, comprise following operation:

Follow the operation of taking above-mentioned mark by image unit; And

According to the image pickup result that in this operation, obtains, the operation whether center of judging substrate and the center of substrate maintaining part be consistent.

15, a kind of method of adjustment of substrate transfer position, this is that a kind of substrate being given by the substrate supply unit is arranged on when substrate carried out substrate maintaining part in the processing unit of predetermined process, obtain the method for adjustment of substrate transfer position of the position data of substrate supply unit, it is characterized in that, comprise following operation:

Follow the operation of taking above-mentioned mark by image unit;

According to the shooting results that in this operation, obtains, the operation that the position offset at the center of the center of substrate and substrate maintaining part is carried out computing;

16, by the method for adjustment of any described substrate transfer position in the claim 13 to 15, it is characterized in that:

The aforesaid substrate supply unit has a plurality of conveying arms free to advance or retreat independently of one another when being arranged above and below,

A conveying arm among these a plurality of conveying arms is advanced, after the substrate that contraposition is used has been given the substrate maintaining part, this conveying arm is retreated, another conveying arm among a plurality of conveying arms is advanced, take mark on the substrate that contraposition uses by remaining on image unit on this another conveying arm.

17, by the method for adjustment of the described substrate transfer position of claim 16, it is characterized in that, comprise following operation:

After the delivery position of the substrate on conveying arm was determined, the substrate of contraposition being used by another conveying arm was given the operation of substrate maintaining part; And

Then on the conveying arm beyond this another conveying arm, keep image unit, obtain the operation of the position data of another conveying arm.

18, by the method for adjustment of the described substrate transfer position of claim 16, it is characterized in that, comprise following operation:

The image unit that keeps on another conveying arm is placed on operation on the substrate maintaining part; And the conveying arm beyond another conveying arm receives the operation that is placed on the image unit on the substrate maintaining part.

19, by the method for adjustment of the described substrate transfer position of claim 16, it is characterized in that:

Another conveying arm is the arm that keeps the special use of image unit.

20, by the method for adjustment of claim 13 to 15 and 17 to 19 described substrate transfer positions, it is characterized in that:

Take the operation of the mark on the substrate surface,,, take near image unit by supporting the substrate elevating portion that the substrate of having given the substrate maintaining part carries out lifting from rear side.

21, by the described substrate board treatment of claim 7, it is characterized in that:

After the delivery position of the substrate on conveying arm is determined, give the substrate maintaining part by the substrate that another conveying arm is used contraposition, in addition, image unit is remained on the conveying arm beyond this another conveying arm, obtain the data of delivery position of the substrate of another conveying arm.

22, by the described substrate board treatment of claim 7, it is characterized in that:

Another conveying arm is the arm that keeps the special use of image unit.