CN1438825A - Method for making photoelectric device and apparatus thereof, photoelectric apparatus, electronic instrument - Google Patents
Method for making photoelectric device and apparatus thereof, photoelectric apparatus, electronic instrument Download PDFInfo
- Publication number
- CN1438825A CN1438825A CN03104391A CN03104391A CN1438825A CN 1438825 A CN1438825 A CN 1438825A CN 03104391 A CN03104391 A CN 03104391A CN 03104391 A CN03104391 A CN 03104391A CN 1438825 A CN1438825 A CN 1438825A
- Authority
- CN
- China
- Prior art keywords
- adhesives
- area
- parts
- electro
- bonding agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 89
- 239000000463 material Substances 0.000 claims abstract description 132
- 239000000853 adhesive Substances 0.000 claims abstract description 121
- 230000001070 adhesive effect Effects 0.000 claims abstract description 118
- 238000004519 manufacturing process Methods 0.000 claims abstract description 58
- 230000008569 process Effects 0.000 claims description 49
- 238000002788 crimping Methods 0.000 claims description 42
- 238000009434 installation Methods 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000012298 atmosphere Substances 0.000 claims description 15
- 238000012360 testing method Methods 0.000 claims description 14
- 238000007711 solidification Methods 0.000 claims description 11
- 230000008023 solidification Effects 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 239000011261 inert gas Substances 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000003760 hair shine Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 256
- 239000007767 bonding agent Substances 0.000 description 242
- 238000000576 coating method Methods 0.000 description 122
- 239000011248 coating agent Substances 0.000 description 120
- 238000007789 sealing Methods 0.000 description 117
- 230000014509 gene expression Effects 0.000 description 29
- -1 Merlon Polymers 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 24
- 239000004593 Epoxy Substances 0.000 description 21
- 238000001723 curing Methods 0.000 description 18
- 230000006866 deterioration Effects 0.000 description 18
- 239000012530 fluid Substances 0.000 description 18
- 239000000976 ink Substances 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 17
- 239000007789 gas Substances 0.000 description 16
- 230000009471 action Effects 0.000 description 13
- 230000005855 radiation Effects 0.000 description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- 239000002841 Lewis acid Substances 0.000 description 12
- 150000007517 lewis acids Chemical class 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000033228 biological regulation Effects 0.000 description 7
- 150000001768 cations Chemical class 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 229920003002 synthetic resin Polymers 0.000 description 7
- 239000000057 synthetic resin Substances 0.000 description 7
- 230000001052 transient effect Effects 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 6
- 238000010538 cationic polymerization reaction Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 239000000975 dye Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 230000000630 rising effect Effects 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 229920000058 polyacrylate Polymers 0.000 description 4
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000006735 epoxidation reaction Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000008204 material by function Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- DCZNSJVFOQPSRV-UHFFFAOYSA-N n,n-diphenyl-4-[4-(n-phenylanilino)phenyl]aniline Chemical class C1=CC=CC=C1N(C=1C=CC(=CC=1)C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 DCZNSJVFOQPSRV-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 2
- 238000006303 photolysis reaction Methods 0.000 description 2
- 230000015843 photosynthesis, light reaction Effects 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 2
- 229920001643 poly(ether ketone) Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- KIWUVOGUEXMXSV-UHFFFAOYSA-N rhodanine Chemical compound O=C1CSC(=S)N1 KIWUVOGUEXMXSV-UHFFFAOYSA-N 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- MVVGSPCXHRFDDR-UHFFFAOYSA-N 2-(1,3-benzothiazol-2-yl)phenol Chemical compound OC1=CC=CC=C1C1=NC2=CC=CC=C2S1 MVVGSPCXHRFDDR-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- FFDNCLQDXZUPCF-UHFFFAOYSA-N [V].[Zn] Chemical compound [V].[Zn] FFDNCLQDXZUPCF-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012458 free base Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000013110 organic ligand Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 150000003219 pyrazolines Chemical class 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/032—Gluing
Abstract
The present invention provides a method of manufacturing an electrooptical device including a first member on which an electrooptical element is disposed, and a second member covering the electrooptical element. The method includes (a) feeding an adhesive material to the first region and second region of the joint region to bond the first member and second member; (b) bonding the first member and second member with interposition of the adhesive material; (c) hardening the adhesive material fed to the first region of the joint region; and (d) hardening the adhesive material fed to the second region of the joint region after step (c). The present invention provides a method of manufacturing the electrooptical device having high productivity.
Description
Technical field
The present invention relates to the manufacture method of electrooptics (electric light) device and manufacturing installation, electro-optical device, electronic instrument, particularly relate to the manufacture method of the electro-optical device that has light-emitting components such as organic EL and manufacturing installation, electro-optical device, electronic instrument.
Background technology
Past liquid crystal, organic EL (electroluminescence; Electroluminescence) device waits electro-optical device, has the structure that is laminated with a plurality of circuit elements, electrode, liquid crystal or EL element etc. on substrate.For example have constituting of light-emitting component in the organic El device and contain the luminescent layer of luminescent substance by the electrode layer clamping of anode and negative electrode, the anode-side injected hole is combined with the cathode side injected electrons again, utilize phenomenon luminous when excited state goes to swash.
Yet there is following problem in above-mentioned existing electro-optical device.
For making organic El device have current drive illuminant element, make it between anode and negative electrode, to flow through electric current when luminous with above-mentioned formation.Its result, element heating when luminous exists when component ambient under the situation of oxygen and moisture content, owing to these oxygen and moisture content cause that the oxidation of element constituent material is made the element deterioration by promotion.The alkali metal that uses of negative electrode and alkali-earth metal characteristic particularly with easy oxidation.Because of oxidation and water cause that the representative phenomenon of element deterioration is the growth that stain and stain occur.Stain is a kind of luminous defective.So the deterioration effect of light-emitting component increases the weight of with the driving of organic El device, exist luminosity to reduce or ageing stabilities such as luminous instability reduce and the problem of the lost of life.
As a kind of countermeasure that can suppress above-mentioned deterioration effect, be to make substrate and hermetic unit that light-emitting component is set integrated with bonding agent, light-emitting component is arranged in the space that is formed by substrate, encapsulant and bonding agent, thus with a kind of technology of atmospheric isolation.Yet in manufacturing process, for example transfer when the electro-optical device, in case do not carry before the full solidification as yet at bonding agent, between substrate and encapsulant, will produce dislocation, so problem is to carry before the bonding agent full solidification, must lower transporting velocity even perhaps carry also, reduce to cause productivity ratio.
Summary of the invention
The present invention In view of the foregoing, purpose is to provide a kind of manufacture method and electro-optical device and the electro-optical device that can keep large-duty electro-optical device when substrate and encapsulant are fitted, has the electronic instrument of this electro-optical device.
The manufacture method of electro-optical device of the present invention is the manufacture method of electro-optical device that has first parts that electrooptic element is set and cover second parts of this electrooptic element, wherein has:
(a) operation of giving binding material with the first area and the second area of bonding part in these first parts and second part bonding,
(b) make the operation of these first parts and second part bonding with this adhesives,
(c) make operation that this adhesives of being given on this first area of this bonding part solidifies and
(d) after the operation (c), make the operation of this adhesives curing of being given on this second area of this bonding part.
In the above-mentioned manufacture method, operation (a) should have following operation:
(a-1) give the operation of first adhesives in this first area of this bonding part;
(a-2) give the operation of second adhesives different at this second area of this bonding part with this first adhesives.
According to the present invention, by first material and second material are set at conformable region, using the material that for example can solidify the short time to do first as first adhesives handles, can at short notice first parts and second parts temporarily be fixed by enough first adhesivess, thereby can shorten the curing stand-by period.Thereby can efficiently carry out manufacturing process thereafter, keep high production rate.And then, can make the electro-optical device that uses this second adhesives performance desired properties by adopting high and the material of sealing property as second adhesives with desired properties.Therefore,, use the strong material of sealing property, light-emitting component hermetic can be sealed between first parts and second parts as second adhesives by between these first parts and second parts, forming this light-emitting component.In this case, this first adhesives is the photo-curable material, and this second adhesives is a thermosets, and operation (c) has:
(C-1) to the irradiation process of the described photo-curable material irradiation provision wavelengths light of giving described first area, described operation (d) has:
(d-1) operation of the described thermosets heating that described second area is endowed.
Like this by at short notice first parts and second temporarily being fixed to light such as the first material irradiation ultraviolet radiations.And by adopting thermosets can improve sealing property as second material.Wherein first adhesives and second adhesives, can be can be with the bonding agent of first parts and second adhering components, except that above-mentioned ultra-violet solidified material and thermosets, the thermoplastic that also can use EB (electron beam) curable material and two liquid mixed type curable material and can be called heat molten type.That is to say,, can solidify at short notice and the material that first parts and second parts are temporarily fixing is suitable for as first adhesives; As second adhesives, can suppress atmosphere and moisture content and invade the material in formed space between first parts and second parts and be suitable for.
In the above-mentioned manufacture method, preferably under inert gas atmosphere, carry out from operation (a) to operation (d).Can prevent the light-emitting component deterioration like this.Inert gas described here is meant light-emitting component is inert gasses, can enumerate nitrogen and argon gas.
And in the above-mentioned manufacture method, operation (a) preferably has following operation.
(a-3) this bonding part this first and second the zone discontinuous operation of giving this adhesives.
In this case, operation (b) preferably has following operation.
(b-1) in operation (a-3), the discontinuous described adhesives that is endowed is contacted with each other, with the operation of described first parts and the mutual crimping of described second parts.
Like this in the operation (b) under the situation to first parts and the mutual crimping of second parts, though overflowing because of the part outside the bonding part, adhesives causes poor sealing, but because first adhesives or second adhesives are provided with in discontinuous mode, so in the initial stage of crimping, the compressed gas of the interior volume that forms between first parts and second parts might be discharged to the outside from formed discontinuous part (space).Thereafter, first parts and second parts produce capillarity because very approaching, and adhesives becomes continuous shape, and institute is so that space that forms between first parts and second parts and external environment condition are isolated fully, the formation sealing state.
In addition,, for example have hygroscopic material, can suppress moisture content and invade to light-emitting component, can further prevent the element deterioration from the outside by also using other materials with first, second adhesives.Therefore as other materials, have the material of required function by employing, can make the electro-optical device high performance.Other materials described here both can be can bonding first parts and the bonding agent of second parts, also can be the material beyond the bonding agent.
In addition, in the above-mentioned manufacture method, preferred this second area of this bonding part also can be wideer than this second area, and operation (a) has
(a-4) operation of giving the photo-curable material to this first and second zone of this bonding part, operation (c) has
(c-1) to the irradiation process of this photo-curable material irradiation provision wavelengths light of giving this first area, operation (d) has
(d-2) at least to the irradiation process of this photo-curable material irradiation provision wavelengths light of giving this second area.
According to the present invention, by giving the photo-curable material in the bonding part, and,, can make the photo-curable material cured of first area at short notice that first parts and second parts are temporarily fixing to the first area irradiation light at first irradiation process (c-1).Thereby can shorten the curing stand-by period, manufacturing process is thereafter efficiently carried out.And the second area irradiates light by the zone wideer than second irradiation process (d-2) first area, make the photo-curable material cured of second area, can increase the bonding force of first parts and second parts.Like this, the part of photo-curable material is cured, separately first parts and second parts are carried out the first temporarily fixing irradiation process and, make completely crued second irradiation process of photo-curing material, can improve operation and productivity.And, in second irradiation process,, can obtain high sealing performance by the photo-curable material is all solidified, prevent the light-emitting component deterioration, make the electro-optical device that can bring into play desired properties.If wherein distinct area is separated with second area in the first area, then in first irradiation process by the first area of irradiate light, will less than the set photo-curable material in bonding part all 50%.On the other hand, be envisioned for when the first area under the situation of a second area part, in first irradiation process by the first area of irradiate light, also can be less than 100% of the set photo-curable material in bonding part all (being second area).
In this case, this of this bonding part first and second zones are preferably determined according to the range of exposures of this light in operation (c) and the operation (d).
And in this case, preferably have following operation:
(e) after operation (d), make under the state of described first parts and described second part bonding, to be exposed to the operation in the set point of temperature atmosphere specified time limit.
Like this,, make photo-curable material full solidification, the cohesive force between first parts and second parts is further strengthened by under the set point of temperature atmosphere gas, placing specified time limit.Therefore, preferably use ultra-violet solidified material as this photo-curable material, preferably ultraviolet to this first area and the irradiation of this second area with light.
In addition, the manufacturing installation of electro-optical device of the present invention is to make to have a kind of device that first parts that are provided with electrooptic element and the electro-optical device that covers second parts of this electrooptic element are used, and wherein has:
Described first parts and described second part bonding with the bonding part, first area and second area give the adhesives applicator of adhesives,
With the coupling device of described adhesives with described first parts and described second part bonding,
The first adhesives solidification equipment that the adhesives that the described first area of described bonding part is endowed solidifies and
After with the described first adhesives solidification equipment described adhesives being solidified, the second adhesives solidification equipment that the described adhesives of the described second area of described bonding part is solidified.
In this case, this adhesives applicator, preferably have first applicator of this first area of this bonding part being given first adhesives, and second applicator of this second area of this bonding part being given second adhesives that is different from this first adhesives.
According to the present invention, by give first adhesives that can solidify the short time in the bonding part with first applicator, can make first parts and second parts temporarily fixing with first adhesives at short notice, shorten and solidify the stand-by period.Thereby can carry out thereafter manufacturing process efficiently.And, can improve the sealing property of light-emitting component by for example give the second high adhesives of sealing property with second applicator, prevent the element deterioration.Thereby make the electro-optical device of manufacturing can bring into play required performance.And,, boost productivity so can also give first adhesives and second adhesives simultaneously owing to have two applicators on the structure.Certainly, applicator is not limited to two, also can be made of a plurality of arbitrarily more than three.It constitutes decapacitation is giving on the parts outside second adhesives with second applicator giving first adhesives on the parts simultaneously with first applicator, can also be with giving same adhesives on first applicator and each comfortable parts of second applicator.
In this case, this first applicator and second applicator preferably can move independently of each other with respect to this bonding part.Such first applicator and second applicator can dispose first binding material and second adhesives simultaneously respectively under mutual interference-free situation.Thereby can improve operability.
And in above-mentioned manufacturing installation, preferably have this bonding part of detection and first and second applicators distance detection device separately, and adjust the adjusting device that this first and second applicators position is used based on the testing result of this checkout gear.Such first applicator and second applicator can be given adhesives in the optimum position of distance bonding part respectively, give required adhesives on the desired location of bonding part.
In the above-mentioned manufacturing installation, this adhesives applicator preferably can be given this adhesives with predetermined pattern.Like this for the bonding part owing to can on desired location, give the adhesives of requirement, so can when improving cementability, suppress the waste of adhesives, engage efficiently.
And in the above-mentioned manufacturing installation, this second area of this bonding part is preferably wide than the first area, the adhesives of being given by described adhesives applicator is the photo-curable material, the described first and second adhesives solidification equipments respectively have first and second irradiation units that irradiation can make the light of described photo-curable material cured wavelength.
According to the present invention, with the adhesives applicator photo-curable material is set in the bonding part, by with first irradiation unit to first area irradiation light as photo-curable material a part of zone, photo-curable material in the first area is solidified at short notice, can make first parts and second parts temporarily fixing at short notice like this, shorten and solidify the stand-by period.Thereby can carry out thereafter manufacturing process efficiently.And utilize second irradiation unit to the second area irradiation light wider than the first area, make the photo-curable material cured of second area, can strengthen between first parts and second parts cohesive force.Be provided with independently so respectively and can make a part of photo-curable material cured, thereby with first parts and the first temporarily fixing irradiation unit of second parts, and second irradiation unit that makes whole photo-curable material cured, so can improve operability and productivity ratio.And, can make and to obtain high sealing performance, prevent the electro-optical device of light-emitting component deterioration, performance desired properties by using second irradiation unit to make whole photo-curable material cured.
In this case, this first irradiation unit, the light that preferably has the light supply apparatus of this light of emission, this light supply apparatus is penetrated along separate routes usefulness branch apparatus, make the illuminated portion of a plurality of assigned position irradiation light of this bonding part being used by this branch apparatus light along separate routes, and this first area of this bonding part is definite according to the assigned position that this illuminated portion can shine.
Use the light source just can be like this to a plurality of assigned positions while irradiation light of the photo-curable material of giving the bonding part.Thereby simple in structure, can carry out rapidly temporarily fixing to the many places of first parts and second parts, can also realize the stabilisation of locating.
In this case, preferably have the holding device that can keep at least one parts in these first parts and second parts, this illuminated portion remains on this holding device.So for example second parts are remained on respect to first parts under the state of crimping, adhesives is solidified by irradiation light with holding device.
And electro-optical device of the present invention, has electrooptic element, carry first parts of this electrooptic element, cover second parts of this electrooptic element, that these first parts and this second part bonding are used, give the first area, bonding part, make these first parts and this second parts fixing first adhesives of usefulness temporarily, and second adhesives of giving this bonding part second area, these first parts and this second parts permanent fixation being used.
In this case, this first adhesives preferred light curable material, the preferred thermosets of this second adhesives.
And electronic instrument of the present invention has above-mentioned electro-optical device of the present invention.
Description of drawings
Fig. 1 is that expression a kind of electro-optical device execution mode of the present invention is wanted portion's profile.
Fig. 2 is the profile along Figure 1B-B direction of arrow.
Fig. 3 is the schematic diagram of expression a kind of electro-optical device implementation method of the present invention.
Fig. 4 is the schematic diagram of expression a kind of electro-optical device execution mode of the present invention.
Fig. 5 is the view of another execution mode of expression the present invention, shows the figure above first parts.
Fig. 6 is the view of another execution mode of expression the present invention, shows the figure above first parts.
Fig. 7 is that expression a kind of electro-optical device execution mode of the present invention is wanted portion's profile.
Fig. 8 is the profile along Fig. 7 B-B direction of arrow.
Fig. 9 is the schematic diagram of expression a kind of electro-optical device implementation method of the present invention.
Figure 10 is the expression figure of apparatus for coating at the photo-curable material of fit area setting.
Figure 11 is the schematic diagram of first irradiation unit and holding device in the manufacturing installation of expression electro-optical device of the present invention.
Figure 12 is the figure of another kind of irradiation unit of expression and holding device execution mode.
Figure 13 is that the expression another kind fits first parts and second parts with the view of light curable material embodiment.
Figure 14 is that the another kind of electro-optical device embodiment of the present invention of expression wants the profile of portion.
Figure 15 is the profile of expression along Figure 14 B2-B2 direction of arrow.
Figure 16 is a stereogram of representing to have the electronic instrument example of organic EL display respectively, and being respectively (a) is portable phone, (b) is Wristwatch-type electronic instrument, (c) portable information processing device.
Among the figure:
1, substrate (first parts)
2, hermetic sealing substrate (second parts)
3, light-emitting component
21, first bonding agent (first material)
22, second bonding agent (second material)
23, the 3rd material
31, first apparatus for coating
32, second apparatus for coating
41, first checkout gear (checkout gear)
42, second checkout gear (checkout gear)
50, first irradiation unit
51, light supply apparatus
53, optical fiber (branch apparatus)
54, illuminated portion
60, holding device
70, second irradiation unit
A, organic El device (electro-optical device)
AR1, first area
AR2, second area
AR3, the 3rd zone
K, seal cavity
R, bonding part
Embodiment
Following with reference to the manufacture method of description of drawings electro-optical device of the present invention and first kind of execution mode of manufacturing installation, electro-optical device and electronic instrument.
Here be that example is illustrated as the situation of organic El device for example with electro-optical device of the present invention.
Fig. 1 is that organic El device (electro-optical device) is wanted the profile of portion.The hermetic sealing substrate (second parts) 2 that organic El device among Fig. 1 (electro-optical device) A has substrate (first parts) 1, is arranged on the light-emitting component 3 on the substrate 1 and is fitted in sealing material use on the substrate 1.
Organic El device A wherein shown in Figure 1, it is a kind of execution mode that is fetched into the device outside from the light that light-emitting component 3 is sent in the side of substrate 1, the formation material of substrate 1 be can transmitted light transparent or semitransparent material, for example can enumerate transparent synthetic resin such as transparent glass, quartz, sapphire or polyolefin, polyester, polyacrylate, Merlon, polyether-ketone etc.Wherein suitable with inexpensive soda-lime glass as the formation material of substrate 1.
Take out under the radiative situation from the opposite of substrate 1 in addition, substrate 1 also can be opaque, can use the surperficial material through insulation processing such as oxidation processes of metal sheets such as ceramic material, stainless steel, thermosetting resin, thermoplastic resins etc. such as aluminium oxide in this case.
Light-emitting component 3 exposes the insulating barrier 7, organic luminous layer 8, electron supplying layer 9 and the negative electrode 10 that form by the anode 5 that forms on the substrate 1, hole transporting layer 6, surface that anode 5 is combined with hole transporting layer 6 substantially and is constituted.
Though can be constituted by aluminium (Al), gold (Au), silver (Ag), magnesium (Mg), nickel (Ni), zinc-vanadium (ZnV), indium (In), tin simple substance and their compound and mixtures such as (Sn) and the conductive adhesive that contains metallic stuffing as anode material 5, be used ITO (indium oxide) here.The formation of this anode 5 though preferably use sputtering method, ion plating method, vacuum deposition method to carry out, also can be adopted wet type rubbing methods such as spin-coating method, heliogravure rubbing method, cutter Tu Fa, and silk screen print method, aniline printing method form.And the light penetration of anode 5 preferably sets more than 80%.
As hole transporting layer 6, for example make carbazole polymer and TPD: triphenyl compound codeposition forms the deposited film of 10～1000 nanometers (preferred 100～700 nanometers) thickness.Wherein there is no particular restriction as the formation material of hole transporting layer 6, can use known material, for example pyrazoline derivative, arylamine derivative, poly-diphenyl ethylene derivatives, triphenyl diamine derivative etc.Specifically can enumerate the spy open clear 63-70257, same 63-175860, spy open flat 2-135359, same 2-135361, same 2-209988, same 3-37992, with put down in writing in the 3-152184 equal sign communique those, preferred triphenyl diamine derivative, wherein with 4,4 '-two (N (3-aminomethyl phenyl)-N-phenyl amine) biphenyl is the most suitable.
Wherein also can form hole injection layer and replace hole transporting layer, can also form hole injection layer and hole transporting layer the two.In this case, form material as hole injection layer, for example can enumerate phthalocyanine bronze (CuPc) and with the polyphenylene vinylene, 1 of poly-tetrahydrochysene thio-phenyl penylene form, 1-pair-(4-N, N-xylyl aminophenyl) cyclohexane, three (oxine) aluminium etc. preferably uses phthalocyanine bronze (CuPc).
As additive method, for example use the ink jet method, after spraying the ink composite that contains hole injection, transfer layer material on the anode 5, on anode 5, form hole transporting layer 6 by carrying out dried and heat treatment.That is to say, after ejection on the electrode surface of anode 5 contains the ink composite of above-mentioned cavity conveying layer material or hole injection layer material,, can on anode 5, form hole transporting layer (hole injection layer) by carrying out dried and heat treatment.For example, the ink composite that will contain cavity conveying layer material or hole injection layer material is filled among the ink-spraying-head (not shown), the nozzle that makes ink-spraying-head makes ink-spraying-head and substrate 1 relatively move on one side facing to the electrode surface of anode 5, to electrode surface spray droplet of ink that the every dropping liquid amount that from nozzle spray all be controlled on one side.Then the droplet of ink after the ejection is carried out dried, make polar solvent evaporation contained in the ink composite, form hole transporting layer (hole injection layer).
Wherein as ink composite, for example can use mixture with polythiofuran derivatives such as polyethylene dioxo thiophene and polystyrolsulfon acid etc. to be dissolved in material in the isopropyl alcohol isopolarity solvent.Wherein Pen Chu droplet of ink blazons on the electrode surface of the anode of handling through the oleophylic China ink 5.Droplet of ink is on the insulating barrier of handling through oleophobic China ink 7 and non-cohesive on the other hand.Therefore, though droplet of ink depart from the ejection position of regulation be ejected in insulating barrier 7 above, not moistening above this by droplet of ink, the droplet of ink of not being stained with is transferred on the anode 5.
Wherein after hole transporting layer 6 forms operation,, preferably in inert gas atmospheres such as nitrogen atmosphere, argon gas atmosphere, carry out in order to prevent the oxidation of hole transporting layer 6 and organic luminous layer 8.
Insulating barrier 7 is for example made raw material with TEOS and oxygen etc., after substrate is made oxide-film or nitride film on comprehensively, can adopt photoetching technique and corrosion technology to form pattern with plasma CVD method.
Organic luminous layer 8, same with above-mentioned hole transporting layer 6, for example utilize ink-jet method and mask vapour deposition method, contain luminescent layer with behind the ink composite of material in ejection on the hole transporting layer 6, can on hole transporting layer 6, form through dried or heat treatment.Constitute the luminescent material of organic luminous layer 8, can use fluorenes be polymeric derivative and, (gather) phenylenevinylene supports derivative, polyphenylene derivatives, the low molecule organic EL Material that gathers fluorene derivative, Polyvinyl carbazole, polythiofuran derivative, perylene based dye, coumarin series dyestuff, rhodanine based dye, other solubilities in benzene derivative, macromolecule organic EL Material etc.Wherein be suitable for the material that ink-jet method adopts, for example can enumerate the phenylenevinylene and support derivative, polyphenylene derivatives, poly-fluorene derivative, Polyvinyl carbazole, polythiofuran derivative, being suitable for material that the mask evaporation adopts, can to enumerate perylene based dye, coumarin series colorant and rhodanine be colorant etc.
And as electron supplying layer 9, be the metal complex that will form by metal and organic ligand, preferably evaporations such as Alq3 (three (oxine) aluminium complex), Znq2 (two (oxine) zinc complex), Bebq2 (two (oxine) beryllium complex), Zn-BTz (2 (o-hydroxy-phenyl) benzothiazole zinc), perylene derivative become the method for film of 10～1000 (preferred 100～700) nano thickness stacked.
Though it is not shown here, but the organic El device A of present embodiment is an active array type, in fact be arranged to a plurality of data wires and a plurality of scan line latticed, drive by switching transistor and driving transistors etc. and to use TFT, above-mentioned light-emitting component 3 is connected to is configured to be defined as on each rectangular pixel by these data wires and scan line.And in a single day supply with drive signal by data wire and scan line, and will between electrode, flow through electric current and make light-emitting component 3 luminous, light penetrates from the outside of transparency carrier 1 and lights this pixel.In addition, the present invention is not limited to active array type, much less also can be applicable to the passive matrix display element.
Fig. 2 is the cutaway view along B-B arrow among Fig. 1.As shown in Figure 2, the bonding part R that fits with hermetic sealing substrate 2 on substrate 1 is provided with (comprise methods such as utilizing coating, spraying, evaporation give on the surface, bonding part) first bonding agent 21 and second bonding agent 22.First bonding agent 21 is set at from quadrangle and cuts out one than medial region (first area) AR1 the bonding part of the quadrangle form of the little circle of this quadrangle, and second bonding agent 22 is set at exterior lateral area (second area) AR2.
The Photocurable adhesive agent of forming first bonding agent 21 can be enumerated the ultraviolet ray of 200～400nm reaction, through ultraviolet irradiation (for example 1～10 second) ultraviolet ray (UV) curable bonding agent of solidifying at short notice.Ultra-violet solidified bonding agent, for example can enumerate radical polymerization free radicals such as various acrylate, various methacrylates such as ester class acrylate, urethane acrylate, epoxy acrylate, melamine acrylate, ethers acrylate is bonding agent, cationic polymerizations such as epoxy compounds, vinyl ethers compound, oxidation (オ キ セ Application) compound are bonding agent with cation, and mercaptan-alkene hydrocarbon add-on type resin system bonding agent etc.; Not influenced by oxygen, the cation that also can carry out polymerization reaction after the irradiate light is a bonding agent.Cation is a bonding agent, and the ultra-violet solidified epoxy of preferred cationic aggretion type is a bonding agent.The ultra-violet solidified epoxy of so-called cationic polymerization type is a bonding agent, be meant as main Photoepolymerizationinitiater initiater and wherein contain through irradiate light such as ultraviolet ray and the lewis acid type curing agent that photolysis is emitted, the lewis acid that produces through rayed is a catalyst, with the oligomer of epoxy radicals, with the bonding agent of the polymerization of cationic polymerization type reaction mechanism, curing type as main component.
Make the epoxy compounds that above-mentioned bonding agent main component is used, can enumerate epoxidation of olefins compound, aromatic epoxy compound, aliphatic epoxy compound, alicyclic epoxide compound, line style epoxy compounds etc.And, can enumerate aromatic series two azo father-in-law's lewis acid, diaryl iodine father-in-law's lewis acid, triaryl sulphur father-in-law's lewis acid, triaryl selenium father-in-law's lewis acid etc. as above-mentioned Photoepolymerizationinitiater initiater.In addition, for moisture resistance with adjust viscosity and also can add clay mineral and fillers such as whisker, synthesis of clay, and can also add surfactants such as silane coupling agent for the character of improving above-mentioned inorganic filler and substrate interface.
As the heat-curable adhesive of forming second bonding agent 22, can use and with the known bonding agents such as bonding agent of thermosets such as two liquid mixed type bonding agents of curing agent and employing epoxy, amide groups acid imide, phenol, melamine.These bonding agents are characterised in that, general easy employing crosslink density height and the good resin of moisture resistance are so that produce polymerization and curing by means of dewater because of heat polymerization and functional group's activation.And with above-mentioned inorganic filler and the surfactant that adds for the moisture resistance purpose that equally also can import.
In addition, in order to make hermetic sealing substrate 2 remain on specified altitude, specifically make on hermetic sealing substrate 2 and organic EL structure keeps to such an extent that contact with each other and portion the is bonding height, also can in first bonding agent 21 and second bonding agent 22, mix pad at least a bonding agent.By in bonding agent, mixing pad, can adjust the height of hermetic sealing substrate 2 easily.As gasket seal, can enumerate spherical or fibrous glass, quartz, resin etc., special optimum fiber shape glass etc.Wherein said pad both can be blended in the bonding agent in advance, also can sneak into when bonding.
Following with reference to Fig. 3, just have that the bonding process of substrate 1 and hermetic sealing substrate 2 describes among the organic El device A of above-mentioned formation.Wherein Fig. 3 (a1)～(d1) is the side schematic view of each operation, (a2)～(d2) is the view on substrate 1 surface in the expression (a1)～(d1).
Fig. 4 (a) is that expression is made in the manufacturing installation of organic El device A, can make the schematic isometric of the manufacturing installation that substrate 1 and hermetic sealing substrate 2 fit, this manufacturing installation have can support substrate 1 stand ST, first apparatus for coating 31 of first bonding agent 21 can be set on the substrate 1 that is supported on the stand ST and second apparatus for coating 32 of second bonding agent 22 can be set on substrate 1.
And the bonding process of following explanation, in order to prevent the deterioration of optical element 3, should under inert gas atmospheres such as nitrogen and argon gas, carry out.
At first shown in Fig. 3 (a), the substrate 1 that is provided with the light-emitting component 3 of band anode and negative electrode is placed on the stand ST.Stand ST can be in the directions X of a direction in the horizontal plane, the horizontal plane moves respectively with the Y direction of directions X orthogonal direction and with the Z direction of directions X and Y direction quadrature.Stand ST for example keeps substrate 1 by vacuum chuck or electrostatic chuck.So can to the substrate 1 that is stated from the stand ST first bonding agent 21 and second bonding agent 22 be set respectively with first apparatus for coating 31 and second apparatus for coating 32.
First apparatus for coating 31 and second apparatus for coating 32 are made of the dripping device with can quantitatively drip on substrate 1 first bonding agent 21 and second bonding agent 22 respectively.Dripping device is the fluid that can quantitatively spue, a kind of device of the fluid that can intermittently quantitatively drip.Thereby the bonding agent that first apparatus for coating 31 that will use as dripping device and second apparatus for coating 32 drip separately is called fluid.
So-called fluid is meant the medium of (dripping) certain viscosity that can be spued by the nozzle of dripping device.Material (being bonding agent in the case) is dissolved or be dispersed in the organic solvent for making it to have the flowability (viscosity) that can spue from nozzle, can enumerating, and material is heated to the fluid that forms under the above temperature of fusing point.And, even in fluid, sneak into solid matters such as pad as mentioned above but can also be fluid generally.Outside desolventizing, also can add other functional materials such as dyestuff and pigment.
Described dripping device can be enumerated distributor and ink discharge device.For example, adopt the bonding agent coating process of ink-jetting style, can be with the bonding agent of cheap apparatus in substrate 1 lip-deep optional position coating any thickness.Wherein, can adopt piezoelectricity mode by means of the change in volume ejecting fluid of piezoelectric element as ink-jetting style, and by heating the mode of the steam ejecting fluid that sharply produces.
First apparatus for coating 31 and second apparatus for coating 32 are set to and can move along directions X, Y direction and Z direction respectively with respect to independent respectively the moving of substrate 1 that is carried on the stand ST.And the ejection action of first apparatus for coating 31 and second apparatus for coating 32, also can independently carry out respectively.Therefore, first apparatus for coating 31 and second apparatus for coating 32 by with respect to the independent mobile ink-jet on one side of substrate 1 that is carried on the stand ST, can be provided with first bonding agent 21 and second bonding agent 22 with predetermined pattern on one side.
First apparatus for coating 31 and second apparatus for coating 32 have first checkout gear 41 and second checkout gear 42 that can detect with substrate 1 surface distance respectively.First checkout gear 41 and second checkout gear 42 are made of optical sensing element respectively, detect irradiate light on substrate 1 by making, utilization detects the light that sends from substrate 1 behind the detection light of above-mentioned irradiation, can detect distance with substrate 1, shown in Fig. 4 (b), can detect first apparatus for coating 31 and second apparatus for coating 32 separately with the distance of substrate 1 on the Z direction.First apparatus for coating 31 and second apparatus for coating 32, according to first checkout gear 41 and second checkout gear 42 testing result separately, adjust the position on each comfortable substrate 1 short transverse (Z direction), (Z direction position) is to substrate 1 bonding agent that drips from the optimum height position.So, concavo-convex even the surface of substrate 1 has, also can suppress first and second the apparatus for coating 31 and 32 nozzle 31a separately and the interference of 31b and substrate 1 respectively, prevent substrate 1 damage.In addition, first checkout gear 41 and second checkout gear 42 both can have the structure that is separately fixed on first apparatus for coating 31 and second apparatus for coating 32, also can have the structure with respect to first apparatus for coating 31 and second apparatus for coating, 32 independent design.In the structure with respect to first apparatus for coating 31 and second apparatus for coating, 32 independent design, checkout gear detects the tip of apparatus for coating nozzle and the distance between the substrate 1 with optical mode.
First apparatus for coating 31 and second apparatus for coating 32 are provided with bonding agent respectively on the bonding part R of regulation on the substrate 1.And first apparatus for coating 31 inboard regulation zone (first area) AR1 in the R of bonding part first bonding agent 21 is set, and second apparatus for coating 32 is provided with second bonding agent 22 at the fixed zone of side mark, bonding part R China and foreign countries (second area) AR2.
When bonding agent is set, first apparatus for coating 31 and second apparatus for coating 32, Yi Bian independently move separately along directions X and Y direction respectively, Yi Bian be coated with first bonding agent 21 and second bonding agent 22 at first area AR1 and second area AR2 respectively simultaneously.At this moment, as mentioned above, first apparatus for coating 31 and second apparatus for coating 32, respectively based on the testing result of first checkout gear 41 and second checkout gear 42, limit adjustment and substrate 1 be coated with action (ink-jet action) apart from the limit.Therefore, shown in Fig. 3 (a2), difference is pattern setting first bonding agent 21 and second bonding agent 22 according to the rules.
Wherein shown in Fig. 3 (a2), first apparatus for coating 31 is provided with first bonding agent 21 at first area AR1 discontinuously with predetermined distance.On the other hand, second marginal portion of apparatus for coating 32 in second area AR2 be in discontinuous mode, and beyond in the marginal portion second bonding agent 22 is set in a continuous manner.That is to say that second marginal portion of bonding agent 22 in second area AR2 is set to and presents discrete state.
In addition, when coating adhesive on the substrate 1, also can make the coating of stand ST side shifting limit in the limit.And under the situation that the coating action of first apparatus for coating 31 and second apparatus for coating 32 is not carried out simultaneously, after can also stopping in the coating action of first apparatus for coating 31 (or second apparatus for coating 32), carry out the coating action of second apparatus for coating 32 (or first apparatus for coating 31) again.In addition, the coating of first apparatus for coating 31 and second apparatus for coating 32 action also can hocket.
And the coincideing of first position between apparatus for coating 31 and first area AR1, for example can coincide and finish by means of being arranged on not shown position on the substrate 1 with mark (adjustment mark).For example detect and use senser by not shown adjustment mark position, detect the position of adjusting mark with optical mode, according to this testing result, make as the first area AR1 of base position setting and position and this adjustment mark of first apparatus for coating 31 and coincide.Equally, also can the position between second apparatus for coating 32 and the second area AR2 be coincide by being arranged on the adjustment mark on the substrate 1.
If respectively first bonding agent 21 and second bonding agent 22 are set on the first area of substrate 1 AR1 and second area AR2, shown in Fig. 3 (b1), then can hermetic sealing substrate 2 be transported on the substrate 1 with conveying device 50.Conveying device 50 for example is used for keeping and conveying hermetic sealing substrate 2 by means of vacuum suction.And conveying device 50 makes the lower surface C of hermetic sealing substrate 2 on one side, coincide with the position of the bonding part R that bonding agent is set in the substrate 1, Yi Bian lower surface C is contacted with bonding part R, under authorized pressure substrate 1 and hermetic sealing substrate 2 added and is connected together.
Be set at the bonding agent on the R of bonding part, be issued to specific thickness, shown in Fig. 3 (b2), expand to dispensing area simultaneously in the crimping of substrate 1 and hermetic sealing substrate 2.That is to say, before the crimping, be set to overlook the first rounded bonding agent 21 and become and overlook ovalize.And should set the coating weight of preceding first bonding agent 21 of crimping and the optimal values of coating position in advance, so that first bonding agent 21 does not overflow from bonding part R and lower surface C after making crimping.
Equally, should make applied second bonding agent, 22 crimping preceding discontinuous, but but can make the discontinuous part of crimping rear edge become continuous in the marginal portion of second area AR2.By making second bonding agent 22 continuous, can interdict the circulation of gas between formed seal cavity K inside and outside after the crimping.Wherein should set the coating weight of preceding second bonding agent 22 of crimping and the optimal values of coating position in advance, so that second bonding agent 22 is not overflowed from bonding part R and lower surface C after crimping, and discontinuous part can be connected to each other after crimping.
Crimping is preceding by second bonding agent 22 is provided with discontinuous part, 2 gases that form in the space of substrate 1 and hermetic sealing substrate can drain into the outside by discontinuous part when making crimping, so can suppress the rising of interior volume pressure, thereby the substrate 1 that interior volume pressure is risen caused moves with the position of 2 of hermetic sealing substrates and is inhibited, thereby can stably carry out crimping and move.And after the crimping by make second bonding agent 22 in second area AR2 all continuously, can limit seal cavity K inner with outward between gas communication.
With first bonding agent 21 with substrate 1 and hermetic sealing substrate 2 temporary transient fixing after, shown in Fig. 3 (d1), organic El device A can be placed in the heating chamber 70.The heat treatment of in heating chamber 70, second bonding agent 22 being heated (second handles).Second bonding agent 22 that itself is heat-curable adhesive solidifies through heat treatment.The coating weight of second bonding agent 22 should be set than first bonding agent more than 21, make it in second area AR2, be continuous state, thereby, improve the cohesive force between substrate 1 and the hermetic sealing substrate 2 by second bonding agent 22 is solidified, strengthen the sealing property of seal cavity K simultaneously.
In sum, by first bonding agent 21 that can solidify at short notice through ultraviolet irradiation is set at the first area of bonding part R AR1, simultaneously Thermocurable second bonding agent 22 is set at the second area AR2 different with first area AR1, like this can be substrate 1 and hermetic sealing substrate 2 is temporarily fixing at short notice with first bonding agent 21 through ultraviolet irradiation, shorten the stand-by period that bonding agent solidifies, can prevent that not only the position between substrate 1 and the hermetic sealing substrate 2 from moving, and can also carry out operation (carrying operation etc.) thereafter.And,, can make organic El device A by enough this Thermocurable bonding agents 22 with high sealing performance by adopting the strong Thermocurable bonding agent of sealing property as second bonding agent 22.Thereby can make required performances such as organic El device A performance long lifetime and high identity.
Bonding process is owing to being to carry out under the inert gas atmosphere at nitrogen and argon gas etc. for light-emitting component 3, so can prevent the deterioration of light-emitting component 3 in the manufacturing process.
Before the crimping process, make these bonding agents be provided with discontinuous part when being coated with first bonding agent 21 or second bonding agent 22, the space internal pressure that forms between substrate 1 and hermetic sealing substrate 2 when substrate 1 and hermetic sealing substrate 2 crimping rises, this pressure rising can make substrate 1 produce the position with hermetic sealing substrate 2 and move, but when these bonding agents are provided with to such an extent that carry out crimping after discontinuous part is arranged, the gas of interior volume is discharged to the outside from the discontinuous part that forms.Thereby can prevent to move because of the position that the rising of interior volume pressure causes.
Design to such an extent that can independently move respectively by first apparatus for coating 31 and second apparatus for coating 32 that will be coated with first bonding agent 21 and second bonding agent, 22 usefulness with respect to substrate 1, and can spray bonding agent independently of one another, this first apparatus for coating 31 and second apparatus for coating 32 can be coated with first bonding agent 21 and second bonding agent 22 according to required pattern and coating weight at short notice.Thereby can improve adherence and productivity ratio.
Be provided with and detect the substrate 1 and first apparatus for coating 31 and second apparatus for coating 32 distance detection device 41 and 42 separately, testing result based on checkout gear 41 and 42, owing to can adjust first apparatus for coating 31 and second apparatus for coating 32 position in short transverse, so first apparatus for coating 31 and second apparatus for coating 32 separately can be from the bonding agents that drips with respect to R optimum height position, bonding part, thereby can in the desired location of bonding portion R bonding agent be set with best coating weight.
In addition, in the formation of above-mentioned execution mode, be behind coating adhesive on the C of the lower surface of hermetic sealing substrate 2, also substrate 1 and hermetic sealing substrate 2 can be fitted certainly at the bonding part of substrate 1 R coating adhesive.
In the above-mentioned execution mode, though with first bonding agent 21 is ultra-violet solidified bonding agent, second bonding agent is that heat-curable adhesive is illustrated, but so long as can substrate 1 and hermetic sealing substrate 2 is bonding, first bonding agent can also use EB (electron beam) curable material and the mixing cured property of the two liquid material that can solidify at short notice.
In the formation of above-mentioned execution mode, though be that medial region AR1 in the R of bonding part is provided with first bonding agent 21, at exterior lateral area AR2 second bonding agent 22 is set, but as shown in Figure 5, also second bonding agent 22 can be set at the medial region AR1 among the R of bonding part, first bonding agent 21 be set at exterior lateral area AR2.
And in the non-formation of above-mentioned execution mode,, be not limited to the marginal portion though the discontinuous part of second bonding agent 22 is located at the marginal portion of second area AR2, also can be located at limit portion.That is to say, can set the configuration pattern of first bonding agent 21 and second bonding agent 22 arbitrarily.
As shown in Figure 6, zone (the 3rd zone) AR3 that also can be in the R of bonding part between first bonding agent 21 and second bonding agent 22 is provided with the 3rd material 23, and substrate 1 and hermetic sealing substrate 2 are fitted.And Fig. 6 is the vertical view of expression substrate 1 sealed substrate 2 crimping metacoxal plates 1.The 3rd material 23 can be can adhesive base plate 1 and the bonding agent of hermetic sealing substrate 2, and this bonding agent can be a synthetic resin material arbitrarily such as polyacrylate, polymethacrylates or polyester, polyethylene, polypropylene and composition thereof.Wherein as the formation material of the 3rd material 23, for example preferred the employing has hygroscopic material.Can suppress moisture content like this and invade light-emitting component 3 from the outside, can further prevent the element deterioration.And the allocation position of the 3rd material, be not limited between first bonding agent 21 and second bonding agent 22, can be in the R of bonding part on the optional position, for example configurations such as the outside of the inboard of first bonding agent 21 and second bonding agent 22.
In addition, technical scope of the present invention is not limited to above-mentioned execution mode, can make various changes in the scope that does not exceed main points of the present invention.
Make seal cavity K be empty shape in for example above-mentioned execution mode, also can in K, dispose regulation materials such as synthetic resin at this seal cavity.
In addition, above-mentioned execution mode is with a kind of example of light-emitting component 3 by substrate 1 side ejaculation to the outside form, but the form that also can adopt light-emitting component 3 to penetrate from cathode side as substrate 1 offside by hermetic sealing substrate 2.In this case, hermetic sealing substrate 2 can adopt the transparent or semitransparent material that can take out light.
When hermetic sealing substrate 2 adopts under the situation of transparent material, in case, should consider the adverse effect that ultraviolet ray produces light-emitting component 3 for first bonding agent 21 is solidified from the top irradiation ultraviolet radiation.Therefore with under the situation of ultraviolet irradiation, on the position corresponding that can grade at the central portion of hermetic sealing substrate 2 light-blocking member (mask) is set with light-emitting component 3, only make the regional AR1 that is configured in first bonding agent 21 by ultraviolet irradiation.
In the above-mentioned execution mode, be based on the testing result of first and second checkout gears 41 and 42, adjust on one side first and second apparatus for coating 31 and 32 and the distance of substrate 1, situation about being coated with is illustrated on one side, but also can adopt first and second checkout gears 41 and 42 to detect the surface configuration (not being coated with action this moment) of substrate 1 in advance, this testing result is stored in the storage device in advance, while the height and position of adjusting first and second apparatus for coating 31 and 32 according to this result who stores in advance is coated with action.Execution mode 2
Fig. 7 is that the organic El device (electro-optical device) that second embodiment of the invention relates to is wanted the view profile of portion.Among Fig. 7, the hermetic sealing substrate of using as seal member (second parts) 2 that organic El device (electro-optical device) A has on substrate (first parts) 1, the substrate 1 light-emitting component 3 that is provided with and fits with substrate 1.
Fig. 8 is the cutaway view along the B-B arrow of Fig. 7.As shown in Figure 8, the component R of fitting with hermetic sealing substrate 2 on substrate 1 is provided with bonding agent 21.Bonding agent 21 be arranged on with spreading continuously bonding part R all on.
Bonding agent 21 is made of Photocurable adhesive agent (photo-curable material).As the photo-curable bonding agent of forming bonding agent 21, can enumerate in the reaction of 200～400nm ultraviolet range, shine ultraviolet ray (UV) the curable bonding agent that can solidify at short notice by means of ultraviolet light.Ultra-violet solidified bonding agent, can enumerate for example various acrylate such as ester class acrylate, urethane acrylate, epoxy acrylate, melamine acrylate, ethers acrylate, the free base system bonding agent that radical polymerizations such as various methacrylates are used, and epoxy compounds, vinyl ether compound, cationic polymerizations such as oxidized compound are bonding agent with cation, mercaptan-alkene hydrocarbon add-on type resin system bonding agent etc.; Not influenced by oxygen, the cation that also can carry out polymerization reaction after the irradiate light is a bonding agent.Cation is a bonding agent, and the ultra-violet solidified epoxy of preferred cationic aggretion type is a bonding agent.The ultra-violet solidified epoxy of so-called cationic polymerization type is a bonding agent, be meant as main Photoepolymerizationinitiater initiater and wherein contain through irradiate light such as ultraviolet ray and the lewis acid type curing agent that photolysis is emitted, the lewis acid that produces through rayed is a catalyst, with the oligomer of epoxy radicals, with the bonding agent of the polymerization of cationic polymerization type reaction mechanism, curing type as main component.
Make the epoxy compounds that above-mentioned bonding agent main component is used, can enumerate epoxidation and wash olefin(e) compound, aromatic epoxy compound, aliphatic epoxy compound, alicyclic epoxy compound, line style epoxy compounds etc.And, can enumerate aromatic series two azo father-in-law's lewis acid, diaryl iodine father-in-law's lewis acid, triaryl sulphur father-in-law's lewis acid, triaryl selenium father-in-law's lewis acid etc. as above-mentioned Photoepolymerizationinitiater initiater.In addition, the crosslink density when solidifying in order further to improve also can be unlikely the heating curing that causes the organic EL damaged condition.These heating also can be carried out make epoxy compounds and Photoepolymerizationinitiater initiater polymerization with low molecular forms volatilization through ultraviolet irradiation after.
In the present embodiment, adopt acrylic acid series radical polymerization type bonding agent or epoxy cation aggretion type bonding agent, consider viscosity adjustment and moisture resistance, wherein can add the inorganic filler (mineral clay, ultramicro powder material) of the following particle diameter of 70% weight below 5 microns, wherein can also add the sphere or the needle-like pad (inorganic oxide class) of 4～10 microns of particle diameters in 0.5～5.0 weight % scope for control thickness.And, can also add surfactants such as silane coupling agent in order to improve the dispersiveness of these mineral-type materials and bonding agent composition.
And in the present embodiment, can adopt vitaglass (preferred alkali-free glass) as hermetic sealing substrate 2, and can use the surface smoothness Ra (arithmetic surface smoothness) of the lower surface C that contacts with bonding agent 21 to be in below 1 micron, Rmax (maximum height) is in below 3 microns.The recess of hermetic sealing substrate 2 (seal cavity K one side) can be carved flat glass into 0.3～0.6 millimeter with sandblast or grinding and polishing method.
The following bonding process that will illustrate, adopt have can support substrate 1 stand ST, can carry out the apparatus for coating 31 of substrate 1 placement of adhesives 21 supported by stand SR, the manufacturing installation that can launch first irradiation unit 50 of provision wavelengths light and can launch second irradiation unit 70 of provision wavelengths light.And the following bonding process that will illustrate, for preventing optical element 3 deteriorations, should under inert gas atmospheres such as nitrogen or argon gas, carry out.
At first shown in Fig. 9 (a), the substrate 1 that is provided with the light-emitting component 3 that comprises anode and negative electrode is contained on the stand ST.Stand ST can be respectively moves with the Y direction of directions X orthogonal direction and with the Z direction of directions X and Y direction quadrature in the directions X, horizontal plane of a direction in the horizontal plane.Stand ST for example keeps substrate 1 by vacuum chuck or electrostatic chuck.So can bonding agent 21 be set with the substrate 1 that 31 pairs of apparatus for coating are stated from the stand ST.
Apparatus for coating 31 can constitute quantitatively the drip dripping device of bonding agent 21 of substrate 1 by having.Dripping device is the fluid that can quantitatively spue, and a kind of device of the fluid that intermittently quantitatively drips.Thereby the bonding agent that will drip as the apparatus for coating 31 that dripping device is used is called fluid.
So-called fluid is meant the medium of (dripping) certain viscosity that can be spued by the nozzle of dripping device.Material (being bonding agent in the case) is dissolved or be dispersed in the organic solvent for making it to have enough flowabilities (viscosity) that can spue from nozzle, can enumerating, and material is heated to the material that forms fluid more than the fusing point.And, even in fluid, sneak into solid matters such as pad as mentioned above but can also be fluid generally.Outside desolventizing, also can add other functional materials such as dyestuff and pigment.
Can enumerate distributor and ink discharge device as dripping device.For example, adopt ink-jetting style to make the coating process of bonding agent, can on substrate 1 surperficial optional position, be coated with the bonding agent of any thickness with cheap apparatus.Wherein ink-jetting style both can adopt the piezoelectricity mode of utilizing piezoelectric element change in volume ejecting fluid, also can adopt and utilize heating that steam is sharply produced and the mode of ejecting fluid.
Apparatus for coating 31 is set to and can moves with respect to the substrate 1 that is carried on the stand ST, and relates to such an extent that can move along directions X, Y direction and Z direction respectively.So apparatus for coating 31, while, can bonding agent 21 be set with predetermined pattern by moving ink-jet with respect to the substrate 1 that is carried on the stand ST.
In addition, on substrate 1, during coating adhesive,, stand ST is coated with while being moved.
Apparatus for coating 31 has the checkout gear 41 that can detect with substrate 1 surface distance.Checkout gear 41 is made of optical sensing element, by irradiating and detecting light on substrate 1, detection light according to above-mentioned irradiation receives the light that sends from substrate 1, can detect the distance with substrate 1 like this, and apparatus for coating 31 and the distance of substrate 1 on the Z direction.Apparatus for coating 31 according to the testing result of first checkout gear 41, is adjusted the position with respect to substrate 1 short transverse (Z direction), and (Z direction position) is to substrate 1 bonding agent that drips from the optimum height position.So, concavo-convex even the surface of substrate 1 has, also can suppress the interference of the nozzle 31a and the substrate 1 of apparatus for coating 31, prevent substrate 1 damage.Wherein the structure of checkout gear 41 both can be to be fixed on the apparatus for coating 31, also can be with respect to apparatus for coating 31 independent settings.In with respect to the apparatus for coating 31 independent structures that are provided with, checkout gear detects the tip of apparatus for coating nozzle and the distance between the substrate 1 with optical mode.
The bonding part R of regulation is provided with bonding agent 21 in 31 pairs of substrates 1 of apparatus for coating.And when bonding agent 21 was set, apparatus for coating 31 moved along directions X and Y direction on one side, on one side to bonding part R coating adhesive 21.This moment, apparatus for coating 31 was based on the testing result of checkout gear 41 as mentioned above, limit adjustment and substrate 1 be coated with action (ink-jet action) apart from the limit.Pattern setting bonding agent 21 according to the rules by this way.
Wherein apparatus for coating 31, and as shown in figure 10, the marginal zone in the R of bonding part is in discontinuous mode, and beyond in the marginal zone bonding agent 21 are set in a continuous manner.That is to say that the marginal zone of bonding agent 21 in the R of bonding part is set to and presents discrete state.
In addition, apparatus for coating 31 coincide with the position of bonding part R, for example can coincide and finishes with mark (adjustment mark) with being arranged on not shown position on the substrate 1.For example detect and use senser to detect the position of adjusting mark,, make as the bonding part R of home position setting usefulness and the position of apparatus for coating 31 and coincide with the adjustment mark according to this testing result with optical mode by not shown adjustment mark position.
After the bonding part of substrate 1 R is provided with bonding agent 21, shown in Fig. 9 (b), can hermetic sealing substrate 2 be transported on the substrate 1 with holding device 60.The position of bonding part R that bonding agent 21 is set in the lower surface C that holding device 60 makes hermetic sealing substrate 2 on one side and the substrate 1 is identical, Yi Bian lower surface C is contacted with bonding part R, under authorized pressure substrate 1 and hermetic sealing substrate 2 is crimped on together.Shine the light (ultraviolet ray) of provision wavelengths with 50 pairs of bonding agents of first irradiation unit 21 then.
Followingly describe with regard to first irradiation unit 50 and holding device 60 with reference to Figure 11.Figure 11 (a) is the end view of first irradiation unit 50 and holding device 60, and Figure 11 (b) is that look up (the Z direction) of Figure 11 (a) schemed.
As shown in figure 11, first irradiation unit 50 has the light supply apparatus 51 of emission ultraviolet light and the ultraviolet ray that light supply apparatus 51 penetrates is directed to the optical fiber (branch apparatus) 53 that the illuminated portions below the holding plate 61 that is arranged on holding device 60 are used.Can be penetrated the illuminated portion 54 of ultraviolet irradiation by light supply apparatus 51, holding plate 61 is provided with many places, and in the present embodiment, shown in Figure 11 (b), is set up the Si Jiaochu that overlooks to plane holding plate respectively.So the ultraviolet ray that optical fiber 53 will penetrate from a light source 51 is the everywhere of a plurality of illuminated portions along separate routes.From the ultraviolet ray that light source 51 penetrates, penetrate from a plurality of illuminated portions 54 respectively by optical fiber 53.
Holding device 60, having can be with the holding plate that contacts above 61 of hermetic sealing substrate 2, be arranged on adsorption hole 62 and the vacuum pump 64 (adsorbent equipment) that is connected with adsorption hole 62 by flow passage 63 below the holding plate 61.In the present embodiment, adsorption hole 62 is arranged on the holding plate 61 following positions of central authorities substantially.Holding device 60 makes holding plate 61 contact with hermetic sealing substrate 2, utilizes the vacuum suction effect maintenance hermetic sealing substrate 2 of the action of vacuum pump 64 by adsorption hole 62, thereby realizes conveying operations.
In addition, holding device 60 also can utilize additive methods such as electrostatic chuck to keep hermetic sealing substrate 2.
Turn back to Fig. 9 (b) now, the position of bonding part R that bonding agent is set in the lower surface C that holding device 60 makes hermetic sealing substrate 2 on one side and the substrate 1 is identical, lower surface C is contacted on one side with bonding part R, substrate 1 is crimped on hermetic sealing substrate 2 with authorized pressure.
Be arranged on the bonding agent 21 on the R of bonding part, be set on the specific thickness, expand to dispensing area simultaneously by the crimping of substrate 1 with hermetic sealing substrate 2.That is to say that as shown in figure 10, applied the bonding agent 21 that is discrete state as shown in Figure 8, makes the discontinuous partial continuous in marginal portion after the crimping in the marginal portion of bonding part R before the crimping.Gas passage blocking by making bonding agent become continuously formed seal cavity K is inner with outside after the crimping.Wherein should before crimping, make the coating weight and the coating position optimization of bonding agent 21 in advance,, and after crimping, discontinuous part be coupled together so that bonding agent 21 is not overflowed from bonding part R and lower surface C.
Crimping is preceding by bonding agent 21 is provided with discontinuous part, 2 gases that form in the space of substrate 1 and hermetic sealing substrate can drain into the outside by discontinuous part during crimping, so can suppress the rising of interior volume pressure, thereby the substrate 1 and mobile being inhibited of 2 positions of hermetic sealing substrate that interior volume pressure are risen caused, thereby can stably carry out crimping and move.And after the crimping by making bonding agent 21 all continuous at bonding part R, can limit the gas communication between seal cavity K inside and the outside.
From the ultraviolet ray of illuminated portion 54, as shown in Figure 8, be radiated at the regulation zone (first area) of bonding part R institute placement of adhesives 21.As the regional AR1 part in part zone in the bonding agent 21, solidify at short notice through ultraviolet irradiation.So, 21 of the bonding agents of the first area AR1 that just is cured of substrate 1 and hermetic sealing substrate 2 are temporary transient fixing.
In addition, for can be at short notice temporary transient fixing operation, and substrate 1 and hermetic sealing substrate 2 are neither peeled off and are not misplaced in the conveying operation in the operation of back etc., should set the best coating weight (unit are suitable coating weight) of bonding agent 21 in advance.And, scope (being first area AR1) through first irradiation unit, 50 irradiation ultraviolet radiations also should be made optimal setting in advance, so that substrate 1 is neither peeled off with hermetic sealing substrate 2 and do not misplaced in the conveying operation etc. of back operation, and make temporarily to be fixed in the time of lacking as far as possible and carry out.And the size and the shape of first irradiation unit, 50 illuminated portions can set arbitrarily, shown in Figure 12 (a), for example the shape separately of illuminated portion 54 can be overlooked down forming quadrangle.The position (part that bonding agent 21 is solidified) that is provided with of illuminated portion 54 also is not limited to the marginal portion in addition, also can be set in the limit portion shown in Figure 12 (b).And adsorption hole 62 also is not limited to one, can set it arbitrarily and number is set and the position is set.Wherein the first area AR1 that solidifies in first irradiation process should set forr a short time than still uncured zone (second area AR2).
In addition, in the present embodiment, the crimp force by holding device 60 applies for example can be set in 9.8～980kPa.And crimping process and first irradiation process can carry out under set point of temperature (for example 20～50 ℃) atmosphere.
Second irradiation unit 70, have and to penetrate provision wavelengths light (in the present embodiment, be the ultraviolet ray of wavelength 300～380nm) light supply apparatus 71, with the supportive device 72 of light source support device 71, by seeing through bonding agent 21 all irradiation ultraviolet radiations that 2 couples of bonding part R of ultraviolet hermetic sealing substrate are provided with.That is to say that in the present embodiment second irradiation unit 70 can also carry out irradiate light to first area AR1 except that to the second area AR2 irradiation light in the bonding agent 21.So, the bonding agent 21 that is configured in bonding part 5 is all solidified, substrate 1 and hermetic sealing substrate 2 are coupled together.
Wherein second irradiation process is at regulation illumination (30～100mW/cm for example
3) under carry out the stipulated time irradiation in (for example 30～200 seconds).Can make bonding agent 21 integrally curings of ultra-violet solidified material composition through this irradiation.And this second irradiation process, for example also can under 20～50 ℃ set point of temperature atmosphere, carry out.
In this external second irradiation process, all carry out ultraviolet irradiation from the top to hermetic sealing substrate 2, should consider the adverse effect of ultraviolet ray light-emitting component 3 for bonding agent 21 is solidified.Therefore under the situation of irradiation ultraviolet radiation, shown in dotted line among Fig. 9 (c), in the central portion of hermetic sealing substrate 2 position corresponding that grade light-blocking member (mask) 73 should be set, so that can be only to R place, the bonding part irradiation ultraviolet radiation of bonding agent 21 is set with light-emitting component 3.
Second irradiation process places organic El device A in the heating curing chamber 80 after stopping.Carry out the maintenance operation in heating curing chamber 80, promptly the bonding agent 21 to adhesive substrates 1 and hermetic sealing substrate 2 carries out maintenance under set point of temperature (for example 30～80 ℃) atmosphere.Curing time wherein for example was set in 30 minutes～2 hours, and heating curing chamber 80 inner settings under atmospheric pressure.By heating curing the crosslink density of bonding agent 21 is further increased and solidify, improving between substrate 1 and the hermetic sealing substrate 2 in the cohesive force sealing property of astonished raising seal cavity K.
In sum, by the bonding agent 21 that ultra-violet solidified material is formed is set at bonding part R, to first area AR1 irradiation ultraviolet radiation, make the bonding agent 21 of first area AR1 solidify and substrate 1 and hermetic sealing substrate 2 temporarily can be fixed at first irradiation process.Thereby can shorten the stand-by period that bonding agent solidifies, can carry out manufacturing process thereafter efficiently.And, the bonding agent 21 of second area AR2 is solidified by the wider second area AR2 irradiation ultraviolet radiation of contrast first area AR1, can improve the caking property between substrate 1 and the hermetic sealing substrate 2.Therefore, by a part of bonding agent 21 is solidified substrate 1 and hermetic sealing substrate 2 temporary transient first fixing irradiation process and second irradiation process that bonding agent 21 is all solidified, because first irradiation process can parallelly carry out with second irradiation process, so can improve operability and productivity ratio.And, in second irradiation process,, can obtain high sealing performance by bonding agent 21 is all solidified, prevent the light-emitting component deterioration, make the organic El device A that can bring into play desired properties.
And second irradiation process except that to the second area AR2 irradiation light, also comprise first area AR1 irradiation light, so in first irradiation process to after a part of irradiation light in the bonding agent 21, can be in first irradiation process to bonding agent 21 all irradiation light, after temporarily fixedly operation is carried out, can bonding agent 21 all be solidified.
In addition, though be to be that the situation of zones of different is illustrated to first area AR1 and second area AR2 in the present embodiment, the present invention is applicable to that also second area AR2 comprises the situation of first area AR1.For example first area AR1 accounts for all for example 90% the zones of bonding agent 21, and second area AR2 is that second area AR2 becomes wider than first area AR1 under the situation of bonding agent 21 Zone Fulls (promptly 100%).And in first irradiation process, first irradiation unit 50 can be to bonding agent 21 all shining with lower area with 100% more than 5%.
Behind second irradiation process,, bonding agent 21 is all solidified, thereby can further improve the cementability between substrate 1 and the hermetic sealing substrate 2 owing to will under set point of temperature atmosphere, be carried out maintenance by substrate 1 and the hermetic sealing substrate 2 that bonding agent 21 is fitted.
Bonding process is owing to being at nitrogen and argon gas etc. light-emitting component 3 to be to carry out under the inert gas atmosphere, so can prevent light-emitting component 3 deterioration in manufacturing process.
And first irradiation unit 50, during it constitutes because have the ultraviolet light supply apparatus 51 of emission, ultraviolet ray that light supply apparatus 51 is sent along separate routes optical fiber 53 and make illuminated portion 54 through a plurality of assigned positions of optical fiber 53 ultraviolet irradiation bonding part R along separate routes, so use the light source 51 can be to a plurality of assigned position irradiation ultraviolet radiations of bonding agent 21.Therefore, apparatus structure is simple, and the substrate 1 and the many places that temporarily are fixed on of hermetic sealing substrate 2 are realized, makes temporary transient fixing stabilisation.
Before the crimping process, when the coating adhesive 21, by these bonding agents that make coating discontinuous part is arranged, when substrate 1 and hermetic sealing substrate 2 are carried out crimping, the space pressure of substrate 1 and 2 formation of hermetic sealing substrate rises, because the rising of this pressure can make substrate 1 produce the position with hermetic sealing substrate 2 and move, but because these bonding agents have disposed discontinuous part, the gas of interior volume can drain into the outside from the discontinuous part that forms.Therefore, can prevent to move phenomenon because of the position that the rising of interior volume pressure causes.
Setting can detect distance detection device 41 between the bonding part R of substrate 1 and the apparatus for coating 31, can adjust the position of apparatus for coating 31 based on the testing result of checkout gear 41 in short transverse, so apparatus for coating 31 can be from the bonding agent that drips with respect to R optimum height position, bonding part, thereby can be with the desired location placement of adhesives of best coating weight at bonding part R.
In the above-mentioned execution mode, be just based on the testing result of checkout gear 41, limit adjustment apparatus for coating 31 and 1 situation about being coated with apart from the limit of substrate are illustrated, but also can detect the surface configuration (this moment, the coating action was not carried out) of substrate 1 in advance with checkout gear 41, this testing result is stored in the storage device in advance, while the height and position of adjusting apparatus for coating 31 based on this result who stores in advance is coated with.
And the formation of above-mentioned execution mode is that bonding agent is coated on the bonding part R of substrate 1, but can certainly behind the C coating adhesive of the lower surface of hermetic sealing substrate 2 substrate 1 and hermetic sealing substrate 2 be bonded.
In addition, in the formation of above-mentioned execution mode, keep 2 pairs of substrates of hermetic sealing substrate 1 to carry out crimping with holding device 60, but the formation that can certainly adopt holding device 60 to keep 1 pair of hermetic sealing substrate of substrate 2 to carry out crimping.
Just be illustrated as bonding agent 21 in the above-mentioned execution mode with ultra-violet solidified bonding agent, so long as can be, also can use EB (electron beam) curable material that to solidify at short notice etc. as bonding agent 21 with substrate 1 bonding agent with hermetic sealing substrate 2 bondings.
Be to be illustrated in the above-mentioned execution mode with regard to the situation that bonding agent 21 is configured in bonding part R equally, but also can be in the R of bonding part placement of adhesives 21 respectively in the zones of different.For example as shown in figure 13, also the formation that can adopt is medial region and exterior lateral area difference placement of adhesives 21A and the 21B at bonding part R, bonding agent 21A to the medial region configuration carries out first irradiation process, bonding agent 21A by means of this medial region configuration carries out temporarily fixing to substrate 1 and hermetic sealing substrate 2, then the bonding agent 21B that is configured in exterior lateral area is carried out second irradiation process, bonding agent 21A and 21B are all solidified.
Figure 13 is the expression crimping, solidifies the view of back state, so that bonding agent 21A is used for is temporary transient fixing gapped also harmless.On the other hand, bonding agent 21B is owing to being used for sealing, so should dispose continuously.
Can also be in the R of bonding part area configurations prescribed material beyond the placement of adhesives 21, substrate 1 and hermetic sealing substrate 2 are fitted.This prescribed material both can be can adhesive base plate 1 with the bonding agent of hermetic sealing substrate 2, also can be synthetic resin material arbitrarily such as polyacrylate, polymethacrylates or polyester, polyethylene, polypropylene and composition thereof.Wherein preferred the employing has the formation material of hygroscopic material as prescribed material.So, can suppress moisture content and invade the light-emitting component 3, further prevent the element deterioration from the outside.And the allocation position of prescribed material also is not particularly limited, and can be arranged on the inboard and the outside of bonding agent 21, and on the optional position in the R of bonding part.
In addition, seal cavity K is empty shape in the above-mentioned execution mode, but also can dispose filler as shown in figure 14 in this seal cavity K.Figure 14 is the figure of the another kind of organic El device embodiment of expression, and the component part identical or equal with organic El device A shown in Figure 7 is marked with same-sign.
In organic El device A2 shown in Figure 14, be filled with filler 90 in the seal cavity K.And the hermetic sealing substrate among the organic El device A2 2 is tabular, and bonding agent 21 extends configuration above it.
Figure 15 (a) is the profile of Figure 14 along the B2-B2 arrow.As shown in this figure, bonding agent 21 interrupted (discontinuous) configuration, the filler 90 in space is allowed to the outside of space K and is overflowed between bonding agent 21.So, substrate 1 will be inhibited with the effect of 2 pairs of light-emitting component 3 excess forces of hermetic sealing substrate.Wherein the allocation position of bonding agent 21 and plan view shape can be set arbitrarily, and the formation shown in Figure 15 (b) also is possible.As the formation material of filler 90, be solid under the preferred room temperature (normal temperature), can enumerate thermoplastic resins such as polyolefin-based resins such as polyester, polyethylene, EVA, polyester based resin.Perhaps also can use ultra-violet solidified material, thermosets, two liquid mixed type curable material etc.These curable resins, can enumerate epoxy is resin, acrylic resin, polyurethane series resin etc.
By filler 90 is set, can make organic El device with superior strength.
In addition, technical scope of the present invention is not limited to above-mentioned execution mode, can make various variations in the scope of main points of the present invention.
For example above-mentioned execution mode is that situation about penetrating to the outside with the light that light-emitting component 3 is sent by means of substrate 1 is that example is illustrated, but also can adopt the mode that light that light-emitting component 3 sends is penetrated through hermetic sealing substrate 2 from the cathode side of substrate 1 dorsal part.In this case, hermetic sealing substrate 2 can adopt the transparent or semitransparent material that can take out light.
The electronic instrument that below just has the organic El device A of above-mentioned execution mode 1 and 2 is that example describes.
Figure 16 (a) is the stereogram of a kind of portable phone example of expression.Among Figure 16 (a), symbol 1000 expression portable phone main bodys, the display part that above-mentioned organic El device A is used in symbol 1001 expressions.
Figure 16 (b) is the stereogram of a kind of watch style electronic instrument of expression.Among Figure 16 (b), the portable wrist-watch main body of symbol 1100 expressions, the display part that above-mentioned organic El device A is used in symbol 1101 expressions.
Figure 16 (c) is the stereogram of a kind of examples of portable information processing device such as expression word processor, personal computer.Among Figure 16 (c), symbol 1200 expression information processors, importations such as symbol 1202 expression keyboards, 1204 expression information processor main bodys, the display part that above-mentioned organic El device A is used in 1206 expressions.
Electronic instrument shown in Figure 16 (a)～(c), owing to have the organic El device A of above-mentioned execution mode, so can realize slim, as to have organic EL of long-life display part electronic instrument.
In sum, by between first parts and second parts, dispose first material that can solidify the short time and second material respectively with desired properties such as sealing properties, and carry out cured, can be at short notice first parts and second parts are temporarily fixing with first material, thereby can carry out thereafter manufacturing process efficiently.And by making second material cured can obtain sealing property.Therefore, can make the electro-optical device of suppression element deterioration, performance desired properties with high production rate.
In addition,, in first irradiation process,, can make the photo-curable material cured of first area to the first area irradiation light by at bonding part R configuration photo-curable material, at short notice that first parts and second parts are temporarily fixing.Thereby solidify the stand-by period and can efficiently carry out thereafter manufacturing process owing to can shorten.And, make the photo-curable material cured of second area by to second area irradiation light as the zone wideer than the first area, can improve the cementability of first parts and second parts like this.Therefore, owing to make a part of photo-curable material cured with first parts and the first temporarily fixing irradiation process of second parts, be divided into for two steps with second irradiation process that makes whole photo-curable material cured and carry out, so can improve operability and productivity ratio when making electro-optical device.
Claims (20)
1, a kind of manufacture method of electro-optical device is the manufacture method of electro-optical device that has first parts that electrooptic element is set and cover second parts of this electrooptic element, wherein has:
(a) operation of giving binding material with the first area and the second area of bonding part in described first parts and described second part bonding,
(b) make the operation of described first parts and described second part bonding with described adhesives,
(c) the described adhesives that the described first area of described bonding part the is endowed operation of solidifying and
(d) after the operation (c), the operation that the described adhesives that the described second area of described bonding part is endowed solidifies.
2, according to the manufacture method of the described electro-optical device of claim 1, wherein operation (a) has:
(a-1) give in the described first area of described bonding part first adhesives operation and
(a-2) give the operation of second adhesives that is different from described first adhesives at the described second area of described bonding part.
3, according to the manufacture method of the described electro-optical device of claim 2, wherein said first adhesives is the photo-curable material, and described second adhesives is a thermosets, and operation (c) has:
(C-1) to the irradiation process of the described photo-curable material irradiation provision wavelengths light of giving described first area, described operation (d) has:
(d-1) operation of the described thermosets heating that described second area is endowed.
4, according to the manufacture method of the described electro-optical device of claim 1, wherein operation (a) to operation (d) is carried out under inert gas atmosphere.
5, according to the manufacture method of the described electro-optical device of claim 1, wherein operation (a) has:
(a-3) in the discontinuous operation of giving described adhesives in described first and second zones of described bonding part.
6, according to the manufacture method of the described electro-optical device of claim 5, wherein operation (b) has:
(b-1) the discontinuous described adhesives that is endowed is contacted with each other, with the operation of described first parts and the mutual crimping of described second parts.
7, according to the manufacture method of the described electro-optical device of claim 1, the described second area in wherein said bonding part, wideer than described second area, operation (a) has:
(a-4) operation of giving the photo-curable material to described first and second zones, described bonding part, operation (c) has:
(c-1) the described photo-curable material that described first area is endowed shines the irradiation process of provision wavelengths light, and operation (d) has:
(d-2) the described photo-curable material that at least described second area is endowed shines the irradiation process of provision wavelengths light.
8, according to the manufacture method of the described electro-optical device of claim 7, described first and second zones of wherein said bonding part can be determined according to the range of exposures of the light described in operation (c) and the operation (d).
9, according to the manufacture method of the described electro-optical device of claim 7, wherein have:
(e) after operation (d), make under the state of described first parts and described second part bonding, to be exposed to the operation in the set point of temperature atmosphere specified time limit.
10, a kind of manufacturing installation of electro-optical device is a kind of manufacturing installation with electro-optical device of first parts that electrooptic element is set and second parts that cover this electrooptic element, wherein has:
Described first parts and described second part bonding with the bonding part, give the adhesives applicator of adhesives to first area and second area,
With the coupling device of described adhesives with described first parts and described second part bonding,
The first adhesives solidification equipment that the adhesives that the described first area of described bonding part is endowed solidifies and
After with the described first adhesives solidification equipment described adhesives being solidified, the second adhesives solidification equipment that the described adhesives that is endowed on the described second area of described bonding part is solidified.
11, according to the manufacturing installation of the described electro-optical device of claim 10, wherein said adhesives applicator has:
Give first applicator of first adhesives to the described first area of described bonding part, and
The described second area of described bonding part is given second applicator of second adhesives that is different from described first adhesives.
12, according to the manufacturing installation of the described electro-optical device of claim 11, wherein said first applicator and second applicator can move independently of each other with respect to described bonding part.
13, according to the manufacturing installation of the described electro-optical device of claim 11, wherein have:
Described bonding part and with detect described first and second applicators distance detection device separately,
Adjust the adjusting device that the described first and second applicator positions are used based on the testing result of described checkout gear.
14, according to the manufacturing installation of the described electro-optical device of claim 10, wherein said adhesives applicator can be given described adhesives with predetermined pattern.
15, according to the manufacturing installation of the described electro-optical device of claim 10, the described second area of wherein said bonding part is wideer than described first area, the adhesives of being given by described adhesives applicator is the photo-curable material, the described first and second adhesives solidification equipments respectively have first and second irradiation units that irradiation can make the light of described photo-curable material cured wavelength.
16, according to the manufacturing installation of the described electro-optical device of claim 15, wherein said first irradiation unit has:
Launch the light supply apparatus of described light,
Make light that described light supply apparatus penetrates along separate routes branch apparatus and
A plurality of assigned positions to described bonding part shine by the illuminated portion of described branch apparatus light along separate routes,
And the described first area of described bonding part is determined according to the assigned position that described illuminated portion can shine.
17, according to the manufacturing installation of the described electro-optical device of claim 16, wherein have:
The holding device that can keep at least one parts in described first parts and described second parts,
Described illuminated portion remains on the described holding device.
18, a kind of electro-optical device wherein has:
Electrooptic element,
Carry first parts of described electrooptic element,
Cover second parts of described electrooptic element,
That described first parts and described second part bonding are used, give the first area, bonding part, be used for the first temporarily fixing adhesives of described first parts and described second parts, and
Second adhesives of giving the second area of described bonding part, described first parts and the described second parts permanent fixation being used.
19, according to the described electro-optical device of claim 18, wherein said first adhesives is the photo-curable material, and described second adhesives is a thermosets.
20, a kind of electronic instrument that has the described electro-optical device of claim 18.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002034699A JP4069639B2 (en) | 2002-02-12 | 2002-02-12 | Manufacturing method of electro-optical device |
| JP2002034700A JP4069640B2 (en) | 2002-02-12 | 2002-02-12 | Electro-optical device and electronic apparatus |
| JP200234700 | 2002-02-12 | ||
| JP200234699 | 2002-02-12 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101515814A Division CN1913193B (en) | 2002-02-12 | 2003-02-12 | Electrooptical device and electronic appliances |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1438825A true CN1438825A (en) | 2003-08-27 |
| CN1282398C CN1282398C (en) | 2006-10-25 |
Family
ID=27736482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031043917A Expired - Fee Related CN1282398C (en) | 2002-02-12 | 2003-02-12 | Method for making photoelectric device and apparatus thereof, photoelectric apparatus, electronic instrument |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6791660B1 (en) |
| KR (1) | KR100553493B1 (en) |
| CN (1) | CN1282398C (en) |
| TW (1) | TWI233317B (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7821197B2 (en) | 2006-01-27 | 2010-10-26 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and fabricating method of the same |
| US7825594B2 (en) | 2006-01-25 | 2010-11-02 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and fabricating method of the same |
| US7834550B2 (en) | 2006-01-24 | 2010-11-16 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and fabricating method of the same |
| US7837530B2 (en) | 2006-03-29 | 2010-11-23 | Samsung Mobile Display Co., Ltd. | Method of sealing an organic light emitting display by means of a glass frit seal assembly |
| US7944143B2 (en) | 2006-01-25 | 2011-05-17 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display device with frit seal and reinforcing structure bonded to frame |
| US8038495B2 (en) | 2006-01-20 | 2011-10-18 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display device and manufacturing method of the same |
| US8063561B2 (en) | 2006-01-26 | 2011-11-22 | Samsung Mobile Display Co., Ltd. | Organic light emitting display device |
| US8120249B2 (en) | 2006-01-23 | 2012-02-21 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of fabricating the same |
| US8164257B2 (en) | 2006-01-25 | 2012-04-24 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of fabricating the same |
| CN102738089A (en) * | 2012-03-07 | 2012-10-17 | 苏州晶方半导体科技股份有限公司 | Semiconductor packaging structure and module thereof |
| US8299705B2 (en) | 2006-01-26 | 2012-10-30 | Samsung Display Co., Ltd. | Organic light emitting display device and manufacturing method thereof |
| US8415880B2 (en) | 2006-01-20 | 2013-04-09 | Samsung Display Co., Ltd. | Organic light-emitting display device with frit seal and reinforcing structure |
| US8729796B2 (en) | 2006-01-25 | 2014-05-20 | Samsung Display Co., Ltd. | Organic light emitting display device including a gap to improve image quality and method of fabricating the same |
| CN104023427B (en) * | 2013-03-01 | 2017-04-12 | 松下知识产权经营株式会社 | Lighting device |
| CN110476261A (en) * | 2017-04-06 | 2019-11-19 | 日本碍子株式会社 | Optical component and the transparent body |
| CN110831364A (en) * | 2018-08-07 | 2020-02-21 | Lg 电子株式会社 | Display device |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69908194T2 (en) * | 1999-12-17 | 2004-02-05 | Osram Opto Semiconductors Gmbh | ENCLOSURE FOR ORGANIC LEDS |
| US7394153B2 (en) * | 1999-12-17 | 2008-07-01 | Osram Opto Semiconductors Gmbh | Encapsulation of electronic devices |
| EP1320862B1 (en) * | 2000-09-06 | 2006-03-29 | Osram Opto Semiconductors GmbH | Encapsulation for oled devices |
| JP4281293B2 (en) * | 2002-05-10 | 2009-06-17 | セイコーエプソン株式会社 | Electro-optical device manufacturing method and electro-optical device manufacturing apparatus |
| JP4240276B2 (en) | 2002-07-05 | 2009-03-18 | 株式会社半導体エネルギー研究所 | Light emitting device |
| KR100710163B1 (en) * | 2002-11-28 | 2007-04-20 | 엘지.필립스 엘시디 주식회사 | method for manufacturing of LCD |
| KR101032337B1 (en) | 2002-12-13 | 2011-05-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Light emitting device and manufacturing method thereof |
| TWI352553B (en) | 2002-12-26 | 2011-11-11 | Semiconductor Energy Lab | Light emitting device and a method for manufacturi |
| JP4401657B2 (en) * | 2003-01-10 | 2010-01-20 | 株式会社半導体エネルギー研究所 | Method for manufacturing light emitting device |
| JP4159910B2 (en) * | 2003-03-20 | 2008-10-01 | シャープ株式会社 | Liquid crystal display |
| US6937315B2 (en) * | 2003-05-01 | 2005-08-30 | Chunghwa Picture Tubes, Ltd. | Liquid crystal panel with isolation wall structure and its producing method |
| US20050023974A1 (en) * | 2003-08-01 | 2005-02-03 | Universal Display Corporation | Protected organic electronic devices and methods for making the same |
| US7164520B2 (en) | 2004-05-12 | 2007-01-16 | Idc, Llc | Packaging for an interferometric modulator |
| TW200600934A (en) * | 2004-06-18 | 2006-01-01 | Innolux Display Corp | Liquid crystal display panel and process for producing it |
| TWI333249B (en) * | 2004-08-24 | 2010-11-11 | Himax Tech Inc | Sensor package |
| US7551246B2 (en) * | 2004-09-27 | 2009-06-23 | Idc, Llc. | System and method for display device with integrated desiccant |
| US20060076631A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for providing MEMS device package with secondary seal |
| US7259449B2 (en) | 2004-09-27 | 2007-08-21 | Idc, Llc | Method and system for sealing a substrate |
| US20060076634A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for packaging MEMS devices with incorporated getter |
| US7710629B2 (en) | 2004-09-27 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | System and method for display device with reinforcing substance |
| KR100669779B1 (en) * | 2004-11-22 | 2007-01-16 | 삼성에스디아이 주식회사 | Sealant pattern for flat panel display and FPD with the same |
| US8303756B2 (en) | 2004-12-07 | 2012-11-06 | Lg Display Co., Ltd. | Method for bonding a glass cap and mask for curing sealant |
| JP4539368B2 (en) | 2005-02-24 | 2010-09-08 | ソニー株式会社 | Manufacturing method of display device |
| US7564471B2 (en) | 2005-03-10 | 2009-07-21 | Seiko Epson Corporation | Line head module, exposure apparatus, and image forming apparatus |
| JP2006278213A (en) * | 2005-03-30 | 2006-10-12 | Seiko Epson Corp | Substrate for electronic device, electronic device, manufacturing method of electronic device, and electronic equipment |
| KR100949503B1 (en) * | 2005-06-20 | 2010-03-24 | 엘지디스플레이 주식회사 | An Apparatus for dispensing a sealant, method of manufacturing Liquid Crystal Display Device using the same, and Liquid Crystal Display manufactured by the method |
| US20070000603A1 (en) * | 2005-07-01 | 2007-01-04 | Nordson Corporation | Method of forming at least one continuous line of viscous material between two components of an electronic assembly |
| JP4123251B2 (en) * | 2005-07-07 | 2008-07-23 | セイコーエプソン株式会社 | Semiconductor device manufacturing substrate and semiconductor device manufacturing method |
| KR100696811B1 (en) * | 2005-09-28 | 2007-03-19 | 삼성에스디아이 주식회사 | Method for winding electrode roll of secondary battery |
| US7431628B2 (en) * | 2005-11-18 | 2008-10-07 | Samsung Sdi Co., Ltd. | Method of manufacturing flat panel display device, flat panel display device, and panel of flat panel display device |
| US20070120478A1 (en) * | 2005-11-28 | 2007-05-31 | Au Optronics Corporation | Double-sided display device and method of making same |
| US7561334B2 (en) * | 2005-12-20 | 2009-07-14 | Qualcomm Mems Technologies, Inc. | Method and apparatus for reducing back-glass deflection in an interferometric modulator display device |
| JP4624309B2 (en) * | 2006-01-24 | 2011-02-02 | 三星モバイルディスプレイ株式會社 | Organic electroluminescent display device and manufacturing method thereof |
| KR100688796B1 (en) * | 2006-01-25 | 2007-03-02 | 삼성에스디아이 주식회사 | Organic light emitting display device and method of manufacturing the same |
| KR100732808B1 (en) * | 2006-01-26 | 2007-06-27 | 삼성에스디아이 주식회사 | Preparing method of organic light-emitting display device |
| KR100688790B1 (en) * | 2006-01-27 | 2007-03-02 | 삼성에스디아이 주식회사 | Organic light emitting display device and fabricating method of the same |
| KR100703519B1 (en) * | 2006-02-21 | 2007-04-03 | 삼성에스디아이 주식회사 | Method for manufacturing organic light emitting display device |
| KR100703446B1 (en) * | 2006-02-21 | 2007-04-03 | 삼성에스디아이 주식회사 | Method for manufacturing organic light emitting display device |
| US7807547B2 (en) * | 2006-03-28 | 2010-10-05 | Innovative Micro Technology | Wafer bonding material with embedded rigid particles |
| EP1979268A2 (en) | 2006-04-13 | 2008-10-15 | Qualcomm Mems Technologies, Inc. | Packaging a mems device using a frame |
| KR100703458B1 (en) * | 2006-04-20 | 2007-04-03 | 삼성에스디아이 주식회사 | Organic light emitting display device and method of manufacturing the same |
| TWI349130B (en) * | 2006-05-12 | 2011-09-21 | Chimei Innolux Corp | Liquid crystal panel |
| US8040587B2 (en) | 2006-05-17 | 2011-10-18 | Qualcomm Mems Technologies, Inc. | Desiccant in a MEMS device |
| US20100141881A1 (en) * | 2006-05-31 | 2010-06-10 | Odisea Batistatos | Security document incorporating optical component |
| EP2029473A2 (en) * | 2006-06-21 | 2009-03-04 | Qualcomm Incorporated | Method for packaging an optical mems device |
| KR100801623B1 (en) * | 2006-06-23 | 2008-02-11 | 삼성전자주식회사 | Manufacturing method for display device and manufacturing appratus for the same and display device made by the same |
| KR101274785B1 (en) * | 2006-06-30 | 2013-06-13 | 엘지디스플레이 주식회사 | organic electro-luminescence display device and method for fabricating the same |
| TWI350400B (en) * | 2006-11-27 | 2011-10-11 | Chimei Innolux Corp | Substrate used in liquid crystal panel, liquid crystal panel and liquid crystal display device |
| US7816164B2 (en) | 2006-12-01 | 2010-10-19 | Qualcomm Mems Technologies, Inc. | MEMS processing |
| WO2008142966A1 (en) * | 2007-05-16 | 2008-11-27 | Ulvac, Inc. | Apparatus for manufacturing organic el device |
| US8330339B2 (en) * | 2007-06-28 | 2012-12-11 | Samsung Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| US8258696B2 (en) * | 2007-06-28 | 2012-09-04 | Samsung Mobile Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| KR100879864B1 (en) * | 2007-06-28 | 2009-01-22 | 삼성모바일디스플레이주식회사 | Light emitting display device and method of manufacturing the same |
| WO2009041951A1 (en) * | 2007-09-28 | 2009-04-02 | Qualcomm Mems Technologies, Inc. | Optimization of desiccant usage in a mems package |
| FR2922203B1 (en) * | 2007-10-15 | 2009-11-20 | Commissariat Energie Atomique | METHOD OF MAKING A STRUCTURE HAVING AN ADJUSTED SEAL CORD AND STRUCTURE OBTAINED |
| JP2009110785A (en) * | 2007-10-30 | 2009-05-21 | Toppan Printing Co Ltd | Organic el element panel and its manufacturing method |
| US7815480B2 (en) * | 2007-11-30 | 2010-10-19 | Corning Incorporated | Methods and apparatus for packaging electronic components |
| KR100918402B1 (en) * | 2008-02-01 | 2009-09-24 | 삼성모바일디스플레이주식회사 | Organic light emitting display apparatus and method of manufacturing thereof |
| US20100020382A1 (en) * | 2008-07-22 | 2010-01-28 | Qualcomm Mems Technologies, Inc. | Spacer for mems device |
| US8410690B2 (en) * | 2009-02-13 | 2013-04-02 | Qualcomm Mems Technologies, Inc. | Display device with desiccant |
| US8416370B2 (en) * | 2009-04-22 | 2013-04-09 | Japan Display Central Inc. | Liquid crystal display device having patterned alignment fiducial mark and method for manufacturing the same |
| GB0913456D0 (en) | 2009-08-03 | 2009-09-16 | Cambridge Entpr Ltd | Printed electronic device |
| US8379392B2 (en) | 2009-10-23 | 2013-02-19 | Qualcomm Mems Technologies, Inc. | Light-based sealing and device packaging |
| TWI503044B (en) * | 2010-04-13 | 2015-10-01 | Au Optronics Corp | Electro-luminescent device package and packaging process thereof |
| TWI426815B (en) * | 2010-04-27 | 2014-02-11 | Au Optronics Corp | Electroluminescent display and method for manufacturing the same |
| CN102947969B (en) | 2010-06-22 | 2017-02-22 | 皇家飞利浦电子股份有限公司 | Organic electroluminescence device with separating foil |
| KR101201720B1 (en) * | 2010-07-29 | 2012-11-15 | 삼성디스플레이 주식회사 | Display device and organic light emitting diode display |
| KR20120065136A (en) | 2010-12-10 | 2012-06-20 | 삼성모바일디스플레이주식회사 | Organic light emitting diode display, manufacturing method and manufacturing equipment thereof |
| TW201243287A (en) * | 2011-04-28 | 2012-11-01 | Hon Hai Prec Ind Co Ltd | Laser range finder |
| JP6090868B2 (en) * | 2011-08-19 | 2017-03-08 | エルジー・ケム・リミテッド | Polarizer |
| WO2013073846A1 (en) * | 2011-11-14 | 2013-05-23 | 주식회사 엘지화학 | Adhesive film and method for encapsulating organic electronic device using same |
| US20130128150A1 (en) * | 2011-11-18 | 2013-05-23 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Flat Panel Display Device and Stereoscopic Display Device |
| US8625067B2 (en) * | 2011-11-23 | 2014-01-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Sealant applying apparatus and sealant applying method for LCD substrate |
| US9381714B2 (en) | 2012-05-09 | 2016-07-05 | Seiko Epson Corporation | Adhesive label production device |
| US9095018B2 (en) * | 2012-05-18 | 2015-07-28 | Joled Inc. | Display panel and display panel manufacturing method |
| US20140054553A1 (en) * | 2012-08-24 | 2014-02-27 | Chihche Liu | Active matrix organic light-emitting diode panel packaging structure |
| WO2014091767A1 (en) * | 2012-12-13 | 2014-06-19 | パナソニック株式会社 | Organic electroluminescent light-emitting device and illumination device |
| CN103869550A (en) * | 2012-12-17 | 2014-06-18 | 展晶科技(深圳)有限公司 | Method for manufacturing liquid crystal display panel |
| KR102071007B1 (en) * | 2013-02-13 | 2020-01-30 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
| KR102036908B1 (en) | 2013-04-19 | 2019-10-28 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
| ITTO20130595A1 (en) * | 2013-07-15 | 2015-01-16 | St Microelectronics Rousset | ASSEMBLY OF A MEMS ENVIRONMENTAL SENSOR DEVICE WITH IMPROVED RESISTANCE AND ITS MANUFACTURING PROCEDURE |
| CN104576707B (en) * | 2015-01-28 | 2018-04-06 | 京东方科技集团股份有限公司 | OLED panel and preparation method thereof and display device |
| JP6952038B2 (en) * | 2015-12-29 | 2021-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | Adhesive addition manufacturing method and adhesive articles |
| KR102466959B1 (en) | 2015-12-31 | 2022-11-11 | 엘지디스플레이 주식회사 | Organic Light Emitting Display Device |
| US10429892B1 (en) | 2016-01-12 | 2019-10-01 | Apple Inc. | Electronic devices with thin display housings |
| CN206774584U (en) * | 2017-06-06 | 2017-12-19 | 京东方科技集团股份有限公司 | Thin-film packing structure and display device |
| KR102623375B1 (en) | 2018-06-08 | 2024-01-11 | 삼성디스플레이 주식회사 | Display device and method for manufacturing the display device |
| KR102127763B1 (en) * | 2020-01-21 | 2020-06-30 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
Family Cites Families (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122011A (en) * | 1980-02-29 | 1981-09-25 | Sharp Corp | Sealing structure of liquid crystal panel |
| JPS62231927A (en) * | 1986-04-01 | 1987-10-12 | Seiko Epson Corp | Production of liquid crystal display element |
| JPS6372665A (en) | 1986-09-12 | 1988-04-02 | Fuji Xerox Co Ltd | Production of electric charge transporting material for electrophotography |
| JPS63175860A (en) | 1987-01-16 | 1988-07-20 | Fuji Xerox Co Ltd | Electrophotographic sensitive body |
| JP2651237B2 (en) | 1989-02-10 | 1997-09-10 | 出光興産株式会社 | Thin-film electroluminescence device |
| US5096282A (en) * | 1988-01-05 | 1992-03-17 | Hughes Aircraft Co. | Polymer dispersed liquid crystal film devices |
| US4938568A (en) * | 1988-01-05 | 1990-07-03 | Hughes Aircraft Company | Polymer dispersed liquid crystal film devices, and method of forming the same |
| US5070326A (en) * | 1988-04-13 | 1991-12-03 | Ube Industries Ltd. | Liquid crystal display device |
| JPH0273229A (en) * | 1988-09-08 | 1990-03-13 | Seiko Epson Corp | Structure of liquid crystal display panel |
| JPH02135359A (en) | 1988-11-16 | 1990-05-24 | Fuji Xerox Co Ltd | Electrophotographic sensitive body |
| JPH02135361A (en) | 1988-11-16 | 1990-05-24 | Fuji Xerox Co Ltd | Electrophotographic sensitive body |
| JPH0317630A (en) * | 1989-06-15 | 1991-01-25 | Victor Co Of Japan Ltd | Image information converting element |
| JPH0337992A (en) | 1989-07-04 | 1991-02-19 | Idemitsu Kosan Co Ltd | Manufacture of organic electroluminescence element |
| US5223959A (en) * | 1989-07-17 | 1993-06-29 | Polytronix, Inc. | Red, blue and green serial encapsulated liquid crystal display and driving method |
| JPH03152184A (en) | 1989-11-08 | 1991-06-28 | Nec Corp | El element of organic thin film |
| US5075789A (en) * | 1990-04-05 | 1991-12-24 | Raychem Corporation | Displays having improved contrast |
| US5680185A (en) * | 1990-11-26 | 1997-10-21 | Seiko Epson Corporation | Polymer dispersed liquid crystal (PDLC) display apparatus |
| JPH04199024A (en) * | 1990-11-29 | 1992-07-20 | Hitachi Ltd | Liquid crystal display element and display device using the same |
| US5170271A (en) * | 1991-01-31 | 1992-12-08 | Hughes Aircraft Company | Shaped voltage pulse method for operating a polymer dispersed liquid crystal cell, and light valve employing the same |
| US5138472A (en) * | 1991-02-11 | 1992-08-11 | Raychem Corporation | Display having light scattering centers |
| US5299289A (en) * | 1991-06-11 | 1994-03-29 | Matsushita Electric Industrial Co., Ltd. | Polymer dispersed liquid crystal panel with diffraction grating |
| ES2088266T3 (en) * | 1991-12-09 | 1996-08-01 | Merck Patent Gmbh | THERMOCROMIC EFFECT PIGMENT AND PROCESS FOR ITS PRODUCTION. |
| US5469278A (en) * | 1992-09-25 | 1995-11-21 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal panel and viewfinder for video camera and projection display using liquid crystal panel |
| KR100257886B1 (en) * | 1993-01-29 | 2000-06-01 | 손욱 | Polymer liquid crystal |
| US5760860A (en) * | 1994-02-25 | 1998-06-02 | The Secretary Of State For Defense In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland | Electro-optic scattering type devices with color polariser for switchable color |
| IT1276692B1 (en) * | 1995-06-09 | 1997-11-03 | Sniaricerche S C P A | POLYMER STABILIZED LIQUID CRYSTALS (PSLC) AND FLEXIBLE DEVICES FOR THEM |
| JPH09211471A (en) | 1996-01-31 | 1997-08-15 | Sony Corp | Sticking device and sticking method |
| US5973763A (en) * | 1996-10-16 | 1999-10-26 | Seiko Epson Corporation | Liquid crystal device including supporting columns |
| JP3290375B2 (en) * | 1997-05-12 | 2002-06-10 | 松下電器産業株式会社 | Organic electroluminescent device |
| JPH1133458A (en) | 1997-07-22 | 1999-02-09 | Toshiba Corp | Liquid body coating device |
| JP3907804B2 (en) * | 1997-10-06 | 2007-04-18 | 株式会社半導体エネルギー研究所 | Liquid crystal display |
| TW507091B (en) * | 1997-10-30 | 2002-10-21 | Matsushita Electric Ind Co Ltd | Method of manufacturing liquid crystal display devices |
| JP2845239B1 (en) * | 1997-12-17 | 1999-01-13 | 日本電気株式会社 | Organic thin film EL device and manufacturing method thereof |
| JPH11264991A (en) * | 1998-01-13 | 1999-09-28 | Matsushita Electric Ind Co Ltd | Manufacture of liquid crystal display element |
| KR100287863B1 (en) * | 1998-04-30 | 2001-06-01 | 구자홍 | Organic electroluminescence device |
| US6219126B1 (en) * | 1998-11-20 | 2001-04-17 | International Business Machines Corporation | Panel assembly for liquid crystal displays having a barrier fillet and an adhesive fillet in the periphery |
| JP2000311782A (en) | 1999-04-27 | 2000-11-07 | Nec Corp | Organic el display, and manufacture thereof |
| US6465437B1 (en) * | 1999-06-30 | 2002-10-15 | Pfizer Inc. | Diphosphate salt of a 4″-substituted-9-deoxo-9A-AZA-9A- homoerythromycin derivative and its pharmaceutical composition |
| JP2001035659A (en) * | 1999-07-15 | 2001-02-09 | Nec Corp | Organic electroluminescent element and its manufacture |
| DE19943149A1 (en) | 1999-09-09 | 2001-04-05 | Siemens Ag | Process for encapsulating components |
| JP3358606B2 (en) * | 1999-12-14 | 2002-12-24 | 日本電気株式会社 | Liquid crystal display panel manufacturing method |
| KR100347436B1 (en) * | 1999-12-16 | 2002-08-03 | 엘지.필립스 엘시디 주식회사 | Method of forming a seal pattern for liquid crystal display device |
| JP3409764B2 (en) * | 1999-12-28 | 2003-05-26 | 日本電気株式会社 | Manufacturing method of organic EL display panel |
| KR100493870B1 (en) * | 1999-12-29 | 2005-06-10 | 엘지.필립스 엘시디 주식회사 | Method of forming a seal pattern for liquid crystal display device |
| JP3817103B2 (en) | 2000-01-25 | 2006-08-30 | 東北パイオニア株式会社 | Manufacturing method of display panel device |
| JP2001230070A (en) | 2000-02-10 | 2001-08-24 | Toyota Motor Corp | Manufacturing method of organic el element |
| US6650392B2 (en) * | 2000-03-15 | 2003-11-18 | Kabushiki Kaisha Toshiba | Cell structure of liquid crystal device |
| JP2001264780A (en) | 2000-03-17 | 2001-09-26 | Toshiba Corp | Device and method for manufacture of liquid crystal display device |
| JP2002015862A (en) * | 2000-06-30 | 2002-01-18 | Sharp Corp | Organic light-emitting element |
| US6747724B2 (en) * | 2000-07-26 | 2004-06-08 | Casio Computer Co., Ltd. | Liquid crystal display device having non-display area with reduced width |
| KR100617025B1 (en) * | 2000-11-08 | 2006-08-29 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display panel and Method for manufacturing the same |
| KR20020039453A (en) * | 2000-11-21 | 2002-05-27 | 구본준, 론 위라하디락사 | Liquid Crystal Display Device |
| US6473148B1 (en) * | 2000-11-28 | 2002-10-29 | Yafo Networks, Inc. | Seal pattern for liquid crystal device |
| KR100865284B1 (en) * | 2001-10-31 | 2008-10-27 | 엘지디스플레이 주식회사 | A sealing structure of liquid crsytal panel |
| TW515062B (en) * | 2001-12-28 | 2002-12-21 | Delta Optoelectronics Inc | Package structure with multiple glue layers |
| JP2003216059A (en) * | 2002-01-24 | 2003-07-30 | Sharp Corp | Indicating element and method of manufacturing the same |
| KR100662496B1 (en) * | 2002-03-23 | 2007-01-02 | 엘지.필립스 엘시디 주식회사 | Liquid Crystal Display Device and Method of manufacturing the same |
| KR100885840B1 (en) * | 2002-03-23 | 2009-02-27 | 엘지디스플레이 주식회사 | Liquid crystal panel having conpensatable cell gap |
-
2003
- 2003-02-03 US US10/356,467 patent/US6791660B1/en not_active Expired - Fee Related
- 2003-02-11 KR KR1020030008530A patent/KR100553493B1/en not_active IP Right Cessation
- 2003-02-11 TW TW092102780A patent/TWI233317B/en not_active IP Right Cessation
- 2003-02-12 CN CNB031043917A patent/CN1282398C/en not_active Expired - Fee Related
-
2004
- 2004-08-06 US US10/912,249 patent/US7317281B2/en not_active Expired - Fee Related
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9004972B2 (en) | 2006-01-20 | 2015-04-14 | Samsung Display Co., Ltd. | Organic light-emitting display device with frit seal and reinforcing structure |
| US8038495B2 (en) | 2006-01-20 | 2011-10-18 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display device and manufacturing method of the same |
| US8415880B2 (en) | 2006-01-20 | 2013-04-09 | Samsung Display Co., Ltd. | Organic light-emitting display device with frit seal and reinforcing structure |
| US8120249B2 (en) | 2006-01-23 | 2012-02-21 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of fabricating the same |
| CN103762319B (en) * | 2006-01-24 | 2016-08-17 | 三星显示有限公司 | OLED and manufacture method thereof |
| US7834550B2 (en) | 2006-01-24 | 2010-11-16 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and fabricating method of the same |
| CN103762319A (en) * | 2006-01-24 | 2014-04-30 | 三星显示有限公司 | Organic light emitting display and fabricating method of the same |
| US7944143B2 (en) | 2006-01-25 | 2011-05-17 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display device with frit seal and reinforcing structure bonded to frame |
| US8164257B2 (en) | 2006-01-25 | 2012-04-24 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of fabricating the same |
| US8729796B2 (en) | 2006-01-25 | 2014-05-20 | Samsung Display Co., Ltd. | Organic light emitting display device including a gap to improve image quality and method of fabricating the same |
| US7825594B2 (en) | 2006-01-25 | 2010-11-02 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and fabricating method of the same |
| US8299705B2 (en) | 2006-01-26 | 2012-10-30 | Samsung Display Co., Ltd. | Organic light emitting display device and manufacturing method thereof |
| US8063561B2 (en) | 2006-01-26 | 2011-11-22 | Samsung Mobile Display Co., Ltd. | Organic light emitting display device |
| US7821197B2 (en) | 2006-01-27 | 2010-10-26 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and fabricating method of the same |
| US7837530B2 (en) | 2006-03-29 | 2010-11-23 | Samsung Mobile Display Co., Ltd. | Method of sealing an organic light emitting display by means of a glass frit seal assembly |
| CN102738089A (en) * | 2012-03-07 | 2012-10-17 | 苏州晶方半导体科技股份有限公司 | Semiconductor packaging structure and module thereof |
| CN104023427B (en) * | 2013-03-01 | 2017-04-12 | 松下知识产权经营株式会社 | Lighting device |
| CN110476261A (en) * | 2017-04-06 | 2019-11-19 | 日本碍子株式会社 | Optical component and the transparent body |
| CN110831364A (en) * | 2018-08-07 | 2020-02-21 | Lg 电子株式会社 | Display device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20050036090A1 (en) | 2005-02-17 |
| US7317281B2 (en) | 2008-01-08 |
| US6791660B1 (en) | 2004-09-14 |
| TW200308179A (en) | 2003-12-16 |
| KR100553493B1 (en) | 2006-02-20 |
| KR20030068425A (en) | 2003-08-21 |
| TWI233317B (en) | 2005-05-21 |
| CN1282398C (en) | 2006-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1282398C (en) | Method for making photoelectric device and apparatus thereof, photoelectric apparatus, electronic instrument | |
| CN1913193A (en) | Electrooptical device and electronic appliances | |
| CN1199520C (en) | Organic electroluminescence device and making method and electronic equipment | |
| CN1229655C (en) | Color filter and electro-optical device | |
| CN1925138A (en) | Organic EL element manufacturing method, organic EL element and organic EL panel | |
| CN1815751A (en) | Light emitting device, method of manufacturing light emitting device, and electronic apparatus | |
| CN1748445A (en) | Organic electroluminescent device and method for manufacturing same | |
| CN1221388C (en) | Liquid filling method of drop spray nozzle and spray device, photoelectric device manufacturing method | |
| CN1300845C (en) | Adhesive thin sheet for producing semiconductor device, semiconductor device and its producing method | |
| CN1481204A (en) | Compsn. and organic conductive membrane using same, and its mfg. method | |
| CN1210153C (en) | Liquid filling method of drop spray nozzle and spray device, method for manufacturing photoelectric device | |
| CN1875298A (en) | Method of manufacturing optical film | |
| CN1449229A (en) | Light-emitting device and method for manufacturing the same | |
| CN1543276A (en) | Light emitting device, electronic equipment and apparatus for manufacturing the same | |
| CN1591527A (en) | Electrooptical apparatus and its mfg method, and electronic apparatus | |
| CN1535087A (en) | Display device, electronic machine and diplsy device mfg. method | |
| CN1797704A (en) | Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body and method | |
| CN1658719A (en) | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus | |
| CN1533682A (en) | Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element | |
| CN1819302A (en) | Light-emitting device, method for manufacturing light-emitting device, and electronic apparatus | |
| CN1550334A (en) | Base board ,device and manufacturing method ,active matrix base board manufacturing method and electro-optical device | |
| CN1406390A (en) | Image display device, method of manufacture thereof, and apparatus for charging sealing material | |
| CN1483576A (en) | Injection head cap and liquid drop injection device having same, method for mfg of photoelectric device | |
| CN1526850A (en) | Mask and producing process thereof, mask producing apparatus and film forming method for luminous material | |
| CN1681375A (en) | Method for forming film pattern, method for manufacturing device, electro-optical apparatus, and electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061025 Termination date: 20160212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |