CN1393653A - 发光二极管的模块化安装装置和方法 - Google Patents
发光二极管的模块化安装装置和方法 Download PDFInfo
- Publication number
- CN1393653A CN1393653A CN02107997A CN02107997A CN1393653A CN 1393653 A CN1393653 A CN 1393653A CN 02107997 A CN02107997 A CN 02107997A CN 02107997 A CN02107997 A CN 02107997A CN 1393653 A CN1393653 A CN 1393653A
- Authority
- CN
- China
- Prior art keywords
- module
- led
- illuminator
- heat
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/0404—Signs, boards or panels, illuminated from behind the insignia the light source being enclosed in a box forming the character of the sign
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/007—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for shipment or storage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Abstract
提供了一种模块化发光二极管(LED)装配结构,包括光源模块,带有配置为串联阵列的多个预封装LED。模块包括导热主体部分,适于将LED产生的热传导到相邻散热片。导热粘结胶带将LED模块粘贴在安装表面。结果,LED能够工作在比通常所允许的要高的电流下。因此,LED的亮度和性能增强,而LED的寿命没有降低。多个LED模块能以基本连续的方式用导线连在一起,并且装进给料器,如卷盘或盒。因此,如要安装多个这种LED模块,只需工作人员简单地按需要从给料器将模块拉出,将适当数量的模块固定就位,并将组装的模块接至电源。
Description
技术领域
本发明一般而言涉及发光二极管(LED)照明装置,更具体地说,涉及这样的LED照明模块:其所具有的导热性改进了LED的效率和性能。
背景技术
大多数照明应用使用白炽灯泡或充气灯泡,特别是在照明需要比低水平更高的照明应用中。这种灯泡一般工作寿命不长,并因此而需要经常更换。如荧光管或氖管这样的充气灯泡可能有较长的寿命,但要使用危险的高电压进行工作,并且比较贵。而且,灯泡和充气灯泡二者都相当耗电。
相反,发光二极管(LED)比较便宜,工作在低电压,并且工作寿命长。另外,LED耗电较少并且较紧凑。这些特点使得LED成为特别合乎需要的并适用于许多应用场合。然而,LED的一个缺点是对需要高于低水平照明的应用场合,一般不能提供足够的亮度。
众所周知,虽然通过增加LED的供给电流,能增加LED的发光亮度,但增加的电流也增加了LED的结温。增加的结温可能降低LED的效率和寿命。例如,已然注意到,在一特定温度之上,温度每增加10℃,硅树脂(silicone)和砷化镓的工作寿命就下降2.5到3倍。LED常常用半导体材料制造,这些具有许多与硅树脂和砷化镓类似的特性。
在LED使用中的另一个因素是,在大多数系统中,必须将一系列LED连接在一起,并且安装到表面。这种连接和安装通常是耗时耗力的工序。
因此,在本领域中需要一种方便有效的装置,用以将LED装到表面上。在本领域中还需要使用LED的照明系统,该照明系统所提供的照明水平相对于那些白炽灯和充气管灯更具有可比性。
发明内容
本发明的照明系统定向用于一种LED安装装置,其中,在优选实施例中该装置适用于提供增加的LED亮度。
根据一个优选实施例提供了一种照明系统,该系统包括多个适于安装到导热元件表面上的照明模块。每个模块包括多个发光二极管(LED)和多个导电触点。每个所述LED至少与一个所述触点以使该LED在所述模块相对的第一和第二边之间形成串联阵列的方式电气连接。设置具有第一侧和第二侧的绝缘层。所述触点连接到所述绝缘层的第一侧。每个模块进一步包括一个粘结剂层,适于将所述模块固定到一个导热元件表面,使得热从模块通过粘结剂而被导入导热元件中。
根据另一优选实施例,一种照明系统具有多个适于安装到一个导热元件表面上的照明模块。每个模块包括多个发光二极管(LED)、多个导电触点、以及支撑触点的绝缘层。每个所述LED至少与一个所述触点以使得该LED在所述模块上形成串联阵列的方式电气连接。所述模块彼此电气连接,使得每个模块的串联阵列与其它模块的串联阵列并联。另外,其中这些互连的模块被放在给料器中,使得互连模块的选定部分可从给料器连续地被分发,并从其截断。
根据又一优选实施例,本发明提供了一种方法,将多个照明模块安装到一个导热表面上,使得热从模块被吸收进导热表面。多个照明模块连续地彼此电气相连。每个模块包括多个LED、多个导电触点、以及具有第一侧和第二侧的绝缘层。每个所述LED至少与一个所述触点电气连接,连接方式使得这些LED形成串联阵列。所述触点连接到所述绝缘层的第一侧。每个模块的串联阵列以并联方式与其它模块的串联阵列连接。设置了给料器,并且将其构成为包括了多个互连模块。从所述给料器连续地拽出模块,并使用导热胶带而将其连续地安装到所述导热表面上。
还根据另一优选实施例,提供了一种生产照明系统的方法。提供有多个LED模块,每个模块具有多个置于串联阵列中的LED。将一个胶带层施加在各LED模块的一侧,使得胶带越过模块的相对边向外伸展。通过使用柔性导体来电气地连接相邻模块,从而形成LED模块的线性链。通过将所述各模块绕成圈或将所述各模块折叠成盘旋模式,而将所述模块线性链紧密地封装起来。
为了简述本发明装配结构的目的,以及所取得的超过现有技术的优点,而在上面说明了一些优点。当然可以理解,并非根据某一特定实施例,即可取得所有这些优点。因此举例来说,本领域技术人员会认识到,可以这样一种方式来实施本发明:以该方式可以取得或优化在此所述的一个或一组优点,而无需实现在此所描述或建议的其它目的或优点。
所有这些实施例都要包含在本发明范围内。对于本领域普通技术人员来说,通过结合附图对优选实施例所作的下述详细说明,这些实施例及其它实施例即会显而易见。本发明并不限于某个特定实施例。
附图说明
图1是具有如一个实施例所述特性的LED模块的透视图;
图2是一个典型的预封装LED灯的侧视图;
图3是图1的LED模块的俯视图;
图4是图3装置的侧视图;
图5是安装到导热元件上的图3装置的特写侧视图;
图6是安装到一个导热平坦表面上的图3装置的另一侧面剖视图;
图7是具有如另一个实施例所述特性的LED模块的侧视图;
图8是具有如再另一个实施例所述特性的LED模块的侧视图;
图9是再另外一个实施方案的LED模块的平面图;
图10示出图9的LED模块,包括一个遮蔽层;
图11是沿图10中的线11-11所得LED模块的剖视图;
图12是图10的LED模块的透视图,表示出了其上所包含的一条反射带;
图13是图9的LED模块安装在一个平坦表面上的侧视图;
图14是图9的LED模块安装到一个弯曲表面上的特写侧视图;
图15是装有LED模块的管路照明装置的透视图;
图16是沿图14中的线16-16剖开的侧面剖视图;
图17是图15装置侧壁的局部视图,沿图15中的线17-17剖开;
图18是安装到图15装置侧壁上的LED模块俯视图;
图19示出多个模块,如图9的LED模块,用导线连在一起;
图20是电路图,示出图19连接到电源的结构;
图21是多个以导线连接到一起的LED模块,如图9的LED模块,放置在给料卷轴上的侧视图;
图22示出以导线连接到一起的模块,从图21的给料卷轴被安装进管路照明装置;
图23示出多个以导线连接到一起的LED模块,如图9的LED模块,放置在箱式给料器中的平面图;
图24是带有模块导线连接器的LED模块的平面图。
具体实施方式
首先,参照图1,公开了发光二极管(LED)照明模块30的一个实施方案。在所述的实施方案中,LED模块30包括5个预先封装的LED32,沿该模块30的前边放置。然而,可以理解,可将LED模块制成为具有任何数量的LED32,这些LED32被装配在任何所需结构中。
下面参照图2,典型的LED组件32包括封装在树脂基体36中的二极管芯片34。所述LED组件32通常具有在基体36上的调焦镜部分38,以及一对引线40、44,其中一个引线是负的而另一个是正的。负引线40连接到所述二极管芯片34的阳极侧42,而正引线44连接到所述二极管芯片34的阴极侧46。正引线44优选包括反射器部分48,以助于将光从二极管34导向调焦镜部分38。
现参照图1至图5,LED模块30优选包括5个预先封装的LED灯32,这5个LED灯32以线性阵列安装在电路板50上,并且以串联方式电气连接。所述LED灯32可包括Hewlett Packard的HLMT-PL00型电灯,该灯使用预先封装的铝铟磷化镓(ALInGaP)芯片34。在图示实施方案中,每个预先封装的LED基本一致,所以它们发射出相同颜色的光。但应理解,也可使用不同的LED,以实现某些所希望的照明效果。
所示的电路板50优选厚约0.05英寸,长1英寸,宽0.5英寸。它包括三层:铜接触层52、环氧树脂绝缘层54、以及铝主体层56。所述铜接触层54由一串6个细长且大体平行的扁平铜片60组成,该扁平铜片适于连接到LED32的引线40、44上。每个铜触点60都通过绝缘层54而与其它铜触点60互相电绝缘。优选使铜触点60基本处于同一个平面上。
所述预封装LED32被固定到电路板50的一个侧面上,使每个LED的基体部分36基本靠到电路板50的一侧。这样LED调焦镜部分38就方向朝外,从而能沿与电路板50基本在同一平面的方向引导光。LED引线40、44焊接在触点60上,从而产生LED的串联阵列。如果愿意的话,可去掉单个预封装LED灯引线的多余部分。每个触点60,除第一个和最后一个触点62、64外,都在其上附有一根负引线40和一根正引线44。所述第一个和最后一个触点62、64中,其中一个仅在其上附有一根负引线40;而另一个仅在其上附有一根正引线44。
触点的焊接区域66接受引线40、44,优选将其用焊锡68焊接在触点60上;不过,每个触点60优选具有比所述焊接区域66中焊接所需区域大很多的表面区域。增大的接触表面区域使每个触点60能起到散热片的作用,有效地吸收LED引线40、44的热。为最大限度地发挥这一作用,优选将触点60制成尽可能大的形状,而同时仍与电路板50相配。
绝缘层54优选具有强绝缘特性以及较高的导热特性,并且,最好尽可能的薄。例如,在图示实施方案中,所述绝缘层54由约0.002英寸厚的Thermagon环氧树脂层所构成。
应理解,可将各种材料和厚度用于绝缘层54。通常,绝缘层54所用材料的热导率越低,则该绝缘层就应该越薄,以取得所述模块的最大导热性。然而,即便使用了Thermagon环氧树脂这样的材料(该材料具有高热导率),所述绝缘层仍最好尽可能薄,以使热阻最小。某些陶瓷材料,如氧化铍和氮化铝,不导电但导热强。这些材料,还有其它材料,也是可接受用于绝缘层的材料。
在图示实施方案中,主体56占据了电路板50的大部分厚度,并且该主体56优选由扁平铝板构成。对于各单个触点60,所述主体56起导热管的作用,通过绝缘层54从触点60吸热,从而传导热离开LED32。然而,主体56作为共同导热管,从所有触点60吸热,而不是仅从单个LED32吸热。同样地,在图示实施方案中,主体56的表面区域大约相等于所有单个触点60表面区域的总和。主体56可明显地比图示实施方案所示更大,但为在安装照明模块30时加大多功能性,优选其比较紧凑的形状。另外,主体56比较硬,并且为照明模块30提供结构支撑。
在图示实施方案,主体56用铝制造,有高的导热特性,并且在制造中易于加工。然而应理解,可以接受具有有利导热特性的任何材料(如热导率大于每米每开氏温标(Kelvin)100瓦特(W/m*K))。
在图示实施方案,有一对穿过电路板50而形成的孔70,而且这对孔适于容纳一对铝制波普空心铆钉(pop rivet)72。这对波普空心铆钉72将电路板50牢固地保持在导热安装部件76上。导热安装部件76起散热片的作用,或与散热片相连。这样,热量从LED32以较小热阻通过模块30被传导到附加散热片76,从而使LED32中的二极管芯片34的结温不超过最大希望值。
现再参照图3和图5,电源线78跨接在电路板50的第一个和最后一个触点62、64上,以便给串联连接的LED32提供电流。电源优选12V的系统,并且可以是AC、DC或任何其它适合的电源。12V的AC系统可以是完全整流的。
小型的LED模块30具有通用性,从而能将多个模块安装在不同地方和不同结构中。例如,某些应用仅包括单个模块,用于特殊的照明应用,而其它的照明应用使用彼此在电气上并联连接的多个模块。
还应理解,一个模块中可以包括任何数目的LED。例如,某些模块可使用2个LED,而其它模块可使用10或更多个LED。确定在单个模块中包括的LED数量的方式之一是首先确定所希望的模块中单个LED的工作电压以及电源电压。于是,希望用于模块的LED数量即大致等于电源电压除以单个LED工作电压。
本发明的LED模块能从各LED32的二极管芯片34将热迅速传导走,从而使LED32能在超过预封装LED32的正常工作参数的状态下工作。特别是所述散热片使LED电路能够在比可能用于典型LED装配结构要大的长期电流下,以连续的无脉冲方式被驱动。该工作电流明显大于制造商推荐的最大值。LED在所述更大电流下的发光也明显大于制造商推荐的最大值。
LED模块30的导热装置,尤其有利于包装较小的预封装LED32和单个二极管LED灯。例如,图示实施方案中使用的HLMT-PL00型的LED灯仅使用了单个二极管,但由于热能从单二极管通过导线和电路板被有效吸进散热片,所以,该二极管能在比该LED通常工作时更大的电流下运行。在该电流下,单个二极管LED发出的光比许多使用两个或更多二极管的LED灯还亮,也比在传统工作状态下的单个二极管灯亮。当然,有多个二极管的预封装LED灯与本发明的装配结构一起使用也是有利的。可以理解,通过使散热片附加在导线上更靠近二极管芯片的位置,HLMT-PL00型灯的较小包装有助于导热。
下面参照图5,第一反射层80优选直接附加在电路板50的触点60的顶上,并且被铆钉72保持就位。第一反射层80优选超过LED32向外延伸。反射材料优选包括不导电膜层,如3M供应的可见反射膜。第二反射层82优选附加在安装部件76,与LED灯32直接相邻。第二反射层82优选以本领域已知的方式使用粘结剂粘到安装面76。
再参照图6,第一反射层80优选弯曲的,以相对LED32形成凸起的反射导板。这一凸起导板适于将LED32发出的光线引导向外,而使反射器层80、82之间的最小反射最小。另外,从LED发出的光,通过反射层80、82而导向某一大体特定的方向。图6还示出,电路板50可被直接安装到任何安装面76。
在另一实施方案中,铝主体部分56可以减少厚度,或可以用某种较软金属制成,以便用户能使模块30至少局部变形。这样,即可调整模块30,以装到各种表面上而无论其平或是弯曲。由于能就表面调整模块的适配,主体和相邻散热片之间共有接触面可以达到最大,因此改进了导热特性。其它实施方案可使用紧固件而不是铆钉,将模块在安装表面/散热片上保持就位。这些其它的紧固件可以包括任何已知的固定手段,如焊接、导热粘线剂、或其它类似手段。
如上所述,LED模块的电路板部分可使用不同材料。现具体参照图7,LED模块86的另一实施方案包括一串细长的平触点88,类似于那些结合图3所说明的。触点88直接装在主体部分89上。主体89由基本平的陶瓷板构成。陶瓷板组成电路板的大部分,并且为触点88提供结构支撑。同样,陶瓷板具有表面区域,大约相当于触点的组合表面区域。通过这种方式,该板就足够大,能为触点88提供结构支撑并将热从各触点88传走,但又足够小,使模块86可以较小而且便于使用。陶瓷板89优选不导电,但导热率高。因此,各触点88彼此电气绝缘,但易于将触点88的热传导到陶瓷板89,并且导进相邻散热片。
现参照图8,示出另一实施方案的LED照明模块90。LED模块90包括电路板92,该电路板92具有与以上结合图3说明的电路板50基本相似的特性。LED96的二极管部分94基本上直接装在照明模块90的触点60上。如此,通过将热从二极管94直接传导到各散热片触点60,热从这些散热片触点60传导到主体56再传出模块90,即排除了由预封装LED导线产生的任何热阻。在此结构中,导热特性得到了进一步改善。
参看图9至图12,示出LED模块100的另一实施方案。如以上所述的LED模块30,LED模块100优选包括有接触层52的电路板50、绝缘层54、以及主体层56。接触层52包括一系列电气连线和触点,这会在以下进一步具体说明。绝缘层54使连线和触点彼此电气上绝缘。主体层56提供支撑,并且帮助引导热离开接触层52和绝缘层54。
如图9示出的接触层52的平面图所示,接触层52包括6个触点60,该触点60由细长并且大体平行的导电平板构成。5个LED32的引线40、44附加在触点60上,从而形成5个预封装LED32的线性阵列,这5个预封装LED32配置成彼此串联连接。
第一和第二细长电源连线102、104大体沿平行的板60的横向方向伸展,但平行于上述的串联阵列。同触点60一样,电源连线102、104由导电材料构成,并且彼此之间和与触点之间由绝缘层54绝缘。在相邻于电路板50的第一和第二侧边110和112还配备了第二连接部分106。第二连接部分106也通过绝缘层54而与触点60和电源连线102、104绝缘。
第一连接器连线118伸展在第一触点62和第一电源连线102的第一端之间。第二连接器连线122伸展在最后触点64和第二电源连线104的第二端之间。连接器连线118、122使其各自触点62、64与相应的电源连线102、104相电气连接。
图10示出的图与图9类似,除了在电路板50顶面130选定部分使用薄遮蔽层126之外。图11是一截面图,示出模块100的各层。遮蔽层126覆盖在触点60及连线102、104,118、122的某些部分。这些被覆盖的部分在图10中以虚线表示。触点和连线的其它部分留下没有被覆盖,以起焊点的作用,从而便于与其它元件电气连接。遮蔽层126有美观作用,并且还保护不用于电气连接的触点区域免受环境因素的影响。
现继续参照图10和图11,遮蔽层126部分覆盖各触点60。然而,各触点60具有未覆盖的连接区域66并接纳相关LED32的引线40、44。第一个和最后一个触点62、64的连接部分132也没有被遮蔽层126覆盖。遮蔽层126部分覆盖各电源连线102、104。各电源连线102、104的第一端连接部分134配备在最靠近电路板50第一侧边110的一端。类似地,各电源连线102、104的第二端连接部分134配备在最靠近电路板50第二侧边122的一端。遮蔽层126在连接部分134、136上没不覆盖电源连线。第一和第二柔性导体,如导线114、116(见图19)可连接到连接部分134、136,以供电给LED阵列。
再参照图12,胶带层140加在LED模块100的底面142。如图所示,胶带140优选伸展横跨底面142,并从电路板50相对的第一和第二侧边110、112向外伸展,形成胶带140的第一和第二翼或耳状物144、146。胶带140最好有延展性并易于弯曲。胶带140上有背衬148。背衬148能被揭开以露出胶带层,而且通过使模块100牢固地保持就位在所希望的表面上的方式,而将所述胶带/模块贴在该表面上。
反射层80也最好附加在电路板50上。反射层80优选通过在遮蔽层126和反射板80之间起作用的胶带,保持在电路板50上。反射层80优选以上述方式伸展在LED32之上。
再参照图13和图14,胶带140将模块固定100在平面或曲面76上。在曲面情况下,如果所述模块不能有效弯曲以继续保持模块与曲面的接触,则胶带的翼或耳仍能够使该模块牢固地附在所述曲面上。当然可以理解,胶带层140可以配有或者不配有耳状物144、146,并且,耳状物也可具有任何所希望的大小和形状。
如前所述,LED模块100有良好的导热性。胶带140优选具有补充模块导热性的特性。在一个实施方案中,胶带140包括其上涂有导热粘结剂的铝带。所述铝带能贴合曲面或波面,并且还能有效地将热从模块传导到其所附加到的表面。当模块100固定在弯曲的散热片表面76(如图14所示),或者模块电路板50大部分没有直接接触曲面时,这一点具有特殊价值。在此情况下,热从电路板50经耳状物144、146而传导到散热片76。
在另一实施方案,LED模块的主体用可弯曲材料制成,这使该模块能够更紧密、更方便地贴合到弯曲壁的表面。
如上所述,具有上述实施方案特性的LED模块能被用在许多实际用途上,例如室内外装饰照明、商业照明、局部照明,甚至是房间照明。还能将这种LED模块用在使用多个这种模块的实际用途上,以适当点亮发光装置,如管路照明装置160(见图15)。管路照明装置常用于包括界线及文字在内的标记。在这些装置中,壁构件以壁中的一个或多个管路而描绘出希望照明的形状。光源装在所述管路里,并且,一般将一个平面透明散射体设置在壁的顶边,以封闭管路。通过这种方式,即可通过由镜片和/或LED的颜色定义的所希望颜色,来照明所希望的形状。
现参照图15,公布一种管路照明装置160的实施方案,该照明装置包括“P”形壳体162。壳体162包括多个壁164和一个底166,共同界定至少一个管路。壁164和底166的表面是散射反射的,最好用平坦白色涂层涂覆。壁164优选用坚实耐用、有较高导热性的金属制成。在图示实施方案,多个LED照明模块30以间隔方式装在壳162的壁164上。透明光散射镜(未示出)优选放在壁164的顶边168,并且封闭管路。
现再参照图16,用波普铆钉72(或任何其它紧固方法)将LED模块30牢固地保持在管路装置的壁164上。模块30与壁164的连接优选有助于将热从模块30传导到壁164。管路壁有较大的表面区域,有利于有效地将热传到环境,并且使管路壁164能起散热片的作用。
现继续参照图15到图17,在图示装置160中,LED模块30优选与其它模块30彼此在电气上并联连接。电源线170优选通过壳体162的一个壁164或底面166进入,并且,优选包括两条18AWG的主线172。短线174装在各模块30的第一个和最后一个触点62、64,并且,优选使用绝缘位移连接器(insulation diaplacement connector,IDC)176与各自的主线172相连,如图17所示。
尽管所述模块30中的LED32工作在比典型预封装LED大的电流下,但仍保留LED的功率效率特性。例如,使用多个LED模块的管路照明装置160可预计使用的功率约为4.5瓦。
仍参照图17,最好将所述LED模块30放置得使LED32面大体向下,引导光离开散射体。光优选被引到壳体162的散射反射壁和底面164、166。通过将光引离散射体,避免了与更直接形式的照明(如典型的白炽及充气灯装置)相关的“过热点”。
LED模块30的反射器80、82帮助引导发自LED的光线朝向散射反射表面。然而可以理解,还可适当使用不利用反射器的、或仅利用第一反射器80的LED模块30。
各LED模块相对低的外形有助于间接方法照明,因为,模块在其被放在壁164上时,基本上没有阴影产生。较高轮廓的照明模块可能将阴影投射到透镜上,产生所不希望的、可见的昏暗区域。为将潜在的阴影减到最小,希望使模块30和附属电线172、174与壁164的顶边168隔开至少约1/2英寸距离。更可取的是令模块30与壁164的顶168隔开1英寸以上
LED模块30的小尺寸和低外形使模块能沿管路壁164被安装在各种地方。例如,参照图15和图18,照明模块30有时必须安装在壁164的弯曲部分178。图示模块30长约1英寸到
英寸,并因此能容纳安装于弯曲壁178上。
图15所示的实施方案中,壳体壁164深约3到4英寸,壁之间的管路宽约3到4英寸。在这一尺寸的装置中,模块30最好间隔开约5到6英寸。如可以预见的,较大的管路装置很可能会需要略微不同的LED模块方案,包括使用更多的LED模块。例如,管路宽1到2英尺的管路照明装置可以在两个壁上都使用LED模块,甚至可使用多排LED模块。另外,在这种大型管路照明装置中,各模块的方位可以变化。例如,可能希望使某些LED模块倾斜,从而以不同的相对于散射反射表面的角度引导光。
为避免产生过热点,最好避免从LED32到散射体的直接光路。然而应理解,可便利地使有散射反射镜的预封装LED灯指向管路文字镜(channel letter lens)。
单个LED一般发出单色光。因此,最好相对于照明装置希望的照明颜色选择LED类型。另外,如果使用散射体,散射体最好选择与LED基本相同的颜色。这样的方案有助于希望的亮度和颜色结果。还应理解,可涂覆散射反射壁和底面,从而与希望的照明颜色相匹配。
使用LED模块30来照明管路照明装置160,在制造过程中节约显著。例如,可将若干LED模块与相应的布线和硬件包括在一个组件中,使技术人员能够通过简单地沿壳体壁将模块固定就位并适当使用IDC或类似方式连接布线,而方便地组装照明装置。无需像充气灯泡所要求的那样,对于光源进行常规的成形。因此制造难度和成本显著降低。
当然应理解,具有任何上述或下述LED模块实施方案特性的LED模块都能用于用这样一种管路照明装置,或者类似装置。
现参照图19和图20,以上参照图9至图14所述的LED模块100的电气连线102、104配置成通过简单使用一对较短的导线114、116(这对导线位于各模块100的电气连线102、104之间),并将导线114、116在电气连线连接部分134、136上焊接到位,就能方便地使多个模块100彼此连接。这样,就将多个LED模块100用导线连接在一起,形成了电气上并联结构中其相应的LED串联阵列。
现继续参照图19,导线114、116优选具有相同长度。因此,多个模块100能被导线连接在一起,形成模块的串或链。因为导线114、116长度相同,所以,长串模块便于连续地成批生产产品。最好在通常位于电路板50相对侧上的连接部分134、136,使导线连接到模块100。通过这种方式,模块100与相关的柔性导线114、116就基本上在纵向对齐。这种方案提供了导线对电路板50的牢固接连。
现参照图21至图23,如图19和图20的实施方案中所示的用导线连在一起的多个模块100,能被放进给料器180里,从而能非常方便和快速地将模块100装进灯具,如管路文字(channel letter)160。
具体参照图21和图22,给料卷轴182可配有绕在卷轴184上的多个这种预封装LED模块100。为将LED模块100装进管路文字160或其它装置中,工作人员只要简单地将管路文字放在LED模块的卷轴182旁,拉出第一个LED模块100,并通过其背胶层而将该模块固定就位在所述管路文字的壁164上。随该模块从给料器拉出,相邻连接的模块也被从给料器拽出。因此,一旦安装了一个模块100,与这第一个模块用导线预连在一起的另一模块100也准备就续,等待被装到管路文字壁上,如图22所示。就这样,工作人员顺序安装这些预封装LED模块100,而给料卷轴182如所需要地分发模块。
当安装了适当数量的LED模块100时,工作人员简单地剪断导线114、116,将已安装的LED模块同仍在给料卷轴182上的LED模块断开。随后,将已安装模块的导线114、116接到电源186上,如图20所示。这种安装方法速度非常快。工作人员无需进行焊接,并且,布线非常少。
图23示出用于分发多个LED模块的另一方法和装置。在这一实施方案中,提供了盒式给料器190或其它类型的给料器,以重叠曲折的型式将多个用导线连接在一起的LED模块100放在其中。需要时从该给料器拽出LED模块100,并且,随其被拽出而在盒式给料器190内展开。
可以理解,对于图21及图23的实施方案,都能配置按尺寸制造的给料器180,以保持足够的LED模块100来提供及满足许多管路文字160(或其它形式的照明装置)的照明需要,从而使这类装置的生产高效而简便。这种给料器能容纳任何所需数量的模块。例如,卷轴能以这种方式按尺寸被制成容纳50、100、1000或更多个模块,使得这些互连的模块不至被缠住。
虽然给料器180图示为卷轴182或盒190,但应理解,能够使用任何形状或形式的给料器。在另一实施方案中,这一连串导线连接的模块能自行卷绕,而不是绕在卷轴上。
虽然优选的模块100使用胶带来将模块固定在表面,但应理解的是,上述分发方案可用于不通过胶带,而通过其它方式(如铆钉、螺钉、胶、环氧树脂等)固定的模块。
在图18所示的实施方案中,供电线114、116直接焊在电气连线连接部分134、136上。应理解,在其它实施方案中,可在连线上配有连接器,而且导线自身可带有连接件,以与配备在LED模块上的所述连接器相匹配。例如,图23示出LED模块,带有置于其上的模块连接器192。连接器192的引线194用焊锡连接到第一和第二电气连线102、104上。就这样,连接器192电气连接到触点60上。连接器192的安装部分196接合并焊接在触点连接部分132及辅助连接部分106上,从而更牢固地将连接器192固定到LED模块100上。模块连接器192适于与配对的导线连接器198接合。所述导线连接器198附加在供电线114、116上。因此,在连接器192、198接合的情况下,即运用了所希望的电气并联方案。在使用连接器的实施方案中,通过在需要时组装模块和导线部件,并简单地通过所述连接器来将这些部件连接起来,即可组装管路文字或其它照明装置。
尽管结合特定优选实施方案和实施例对本发明进行了描述,但本领域技术人员会理解,本发明可超过具体描述的实施方案范围,扩展到其它可选的实施方案、和/或对本发明的使用、以及其明显的改进及等同方案。另外,尽管已详细表示并描述了若干变例,但其它处于本发明范围内的改进,在本公开的基础上,对于本领域技术人员来说是显而易见的。还可进行所述实施方案具体特性和方面的各种组合或分组合而仍属本发明范围内。另外,应可理解,上述实施方案的各种特性及方面,可彼此组合或相互替换,从而形成所公开的模块结构和方法的不同形式。因此,本发明范围不应受限于上述特定的公开实施方案,而应仅由所附权利要求书所确定。
Claims (34)
1.一种照明系统,包括:
多个适于安装在导热元件表面上的照明模块,各照明模块包括:
多个发光二极管(LED);
多个导电触点,每个所述LED至少与一个所述触点电气连接,其连接方式使得所述LED在所述模块相对的第一和第二边之间形成串联阵列;
一绝缘层,具有第一侧和第二侧,所述触点连接到所述第一侧;
其中,每个所述模块进一步包括一胶带层,该胶带层适于将所述模块紧固在一导热元件的表面,使得热从所述模块通过该胶带而被导入所述导热元件。
2.如权利要求1的照明系统,其中模块主体包括所述触点和绝缘层以及一对柔性粘结件,该柔性粘结件从所述模块主体的第一和第二边伸展,用于将所述模块主体紧固到一表面上。
3.如权利要求2的照明系统,其中所述柔性粘结件由导热胶带构成。
4.如权利要求2的照明系统,其中所述柔性粘结件由导热粘结剂构成,使得热从所述模块通过该柔性粘结件被导入所述导热元件。
5.如权利要求1的照明系统,进一步包括与所述绝缘层的第二侧导热连接的导热胶带层,该导热胶带层适于将所述模块固定到所述导热元件的表面。
6.如权利要求5的照明系统,其中每个模块包括一主体层,配置在所述胶带层和所述绝缘层之间。
7.如权利要求5的照明系统,其中所述胶带层包括所述粘结剂层。
8.如权利要求7的照明系统,其中所述胶带层包括一金属薄层。
9.如权利要求8的照明系统,其中所述金属薄层由铝构成。
10.如权利要求1的照明系统,其中所述多个模块相互电气连接,使得其LED串联阵列以并联方式排列。
11.如权利要求10的照明系统,进一步包括一给料器,其中在所述给料器中放置有多个互连的模块。
12.如权利要求11的照明系统,其中所述给料器包括一卷轴,而且所述多个互连模块绕所述卷轴缠绕,缠绕方式使得所述互连的模块能从所述卷轴展开。
13.如权利要求11的照明系统,其中所述多个互连模块在所述给料器中以弯曲堆叠的形式放置,从而能从所述给料器连续地取下所述互连模块。
14.如权利要求1的照明系统,其中,第一导电电源连线和第二导电电源连线被置于所述绝缘层的第一侧,第一个所述触点电气连接到所述第一连线而第二个所述触点电气连接到所述第二连线,该第一触点电气连接到所述LED串联阵列的正引线上,而该第二触点电气连接到所述LED串联阵列的负引线上。
15.如权利要求14的照明系统,其中所述第一和第二电源连线是细长的,并且大体平行于所述LED串联阵列放置。
16.如权利要求15的照明系统,其中将柔性导体附加到所述各模块细长的第一和第二电源连线的一般相对的端部,使得所述各模块的第一和第二电源连线分别电气连接到其它各模块的第一和第二电源连线上。
17.如权利要求14的照明系统,其中多个模块相互电气连接,连接方式使得第一模块的第一和第二电源连线电气连接到第二模块的第一和第二电源连线上。
18.如权利要求17的照明系统,其中所述第一和第二模块通过第一导线(伸展于所述模块的第一连线之间)和第二导线(伸展于所述模块的第二连线之间)连接。
19.如权利要求17的照明系统,其中在每个所述第一和第二模块上配置一连接器,与各自模块上第一和第二连线电气连接;而且配置一对导线,在该对导线的端部带有导线连接器,该导线连接器适于与所述模块连接器匹配接合。
20.如权利要求1的照明系统,其中所述绝缘层由Thermagon环氧树脂构成。
21.一种照明系统,包括:
多个适于安装在导热元件表面上的照明模块,各照明模块包括:
多个发光二极管(LED);
多个导电触点,每个所述LED至少与一个所述触点电气连接,其连接方式使得所述LED在所述模块上形成串联阵列;
一绝缘层,支撑所述模块;
其中所述模块电气互连,使得每个模块串联阵列在电气上并联于其它模块串联阵列;
其中所述互连的模块放置在一给料器中,使得所述互连模块的选定部分可从该给料器连续地分发并从其上取下。
22.如权利要求21的照明系统,其中每个所述模块包括胶带层,适于将所述模块紧固在导热元件的表面,使得热从所述模块通过该胶带而被导入所述导热元件。
23.如权利要求21的照明系统,其中所述给料器包括线盘,而且所述互连的模块绕该线盘缠绕。
24.如权利要求21的照明系统,其中所述给料器包括一外壳,并且,所述互连的模块放置在该外壳中互相重叠,从而在所述外壳中形成了模块的弯曲堆叠。
25.如权利要求21的照明系统,其中所述绝缘层由Thermagon环氧树脂构成。
26.一种将多个照明模块安装在一导热表面上,使得热从所述模块被导入所述导热表面的方法,包括:
提供多个彼此连续地电气连接的照明模块,每个模块包括:
多个发光二极管(LED);
多个导电触点,每个所述LED至少与一个所述触点电气连接,其连接方式使得所述LED形成串联阵列;
一绝缘层,具有第一侧和第二侧,所述触点连接到所述第一侧;
其中,每个模块串联阵列以电气上并联的方式与其它模块串联阵列连接;
提供一给料器,将该给料器配置为容纳多个互连的模块;
从所述给料器中拽出连续的模块;
将所述模块用导热胶带连续地安装到所述导热表面。
27.如权利要求26的方法,其中每个所述模块包括一粘结层,而且还包括令各模块的所述粘结层与所述导热表面相接合,使得热从所述模块通过所述粘结层被导入所述导热表面。
28.如权利要求26的方法,其中,每个模块包括一导热胶带层,而且该胶带层包括一对柔性胶带件(该柔性胶带件从所述模块的相对边伸展),并且还包括使所述柔性胶带件与所述导热表面相接合。
29.如权利要求28的方法,其中所述导热胶带层包括薄而柔的铝层。
30.如权利要29的方法,其中所述导热胶带层包括一导热粘结层。
31.一种生产照明系统的方法,包括:
提供多个发光二极管(LED)模块,每个LED模块带有多个配置为串联阵列的LED;
在每个LED模块的一侧加以一胶带层,并使所述胶带越过所述模块的相对边而向外伸展;
通过使用柔性导体电气连接相邻模块,形成线性的一连串LED模块;
通过将所述模块绕成卷或者以弯曲方式折叠所述模块,将所述线性的一连串模块紧凑地封装起来。
32.如权利要求31的方法,其中所述胶带包括粘结剂层。
33.如权利要求31的方法,其中所述胶带由导热材料构成。
34.如权利要求31的方法,其中所述胶带包括薄而柔的金属层。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30195101P | 2001-06-29 | 2001-06-29 | |
US60/301,951 | 2001-06-29 | ||
US09/948,338 | 2001-09-05 | ||
US09/948,338 US6578986B2 (en) | 2001-06-29 | 2001-09-05 | Modular mounting arrangement and method for light emitting diodes |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1393653A true CN1393653A (zh) | 2003-01-29 |
CN1280574C CN1280574C (zh) | 2006-10-18 |
Family
ID=26972684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021079978A Expired - Fee Related CN1280574C (zh) | 2001-06-29 | 2002-03-26 | 发光二极管的模块化安装装置和方法 |
Country Status (2)
Country | Link |
---|---|
US (4) | US6578986B2 (zh) |
CN (1) | CN1280574C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102289995A (zh) * | 2011-08-26 | 2011-12-21 | 苏州晶雷光电照明科技有限公司 | 一种led灯牌 |
CN102620256A (zh) * | 2005-11-29 | 2012-08-01 | 吉尔科有限公司 | 制造发光组件的方法 |
CN103208717A (zh) * | 2013-04-10 | 2013-07-17 | 深圳市大族激光科技股份有限公司 | 半导体单芯管的转接装置 |
CN108701732A (zh) * | 2015-12-08 | 2018-10-23 | 奥塔装置公司 | 用于柔性太阳能电池的多功能柔性电路互连 |
Families Citing this family (171)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6712486B1 (en) * | 1999-10-19 | 2004-03-30 | Permlight Products, Inc. | Mounting arrangement for light emitting diodes |
US6660935B2 (en) * | 2001-05-25 | 2003-12-09 | Gelcore Llc | LED extrusion light engine and connector therefor |
US6578986B2 (en) * | 2001-06-29 | 2003-06-17 | Permlight Products, Inc. | Modular mounting arrangement and method for light emitting diodes |
US6932495B2 (en) * | 2001-10-01 | 2005-08-23 | Sloanled, Inc. | Channel letter lighting using light emitting diodes |
US20030193055A1 (en) * | 2002-04-10 | 2003-10-16 | Martter Robert H. | Lighting device and method |
US6882331B2 (en) * | 2002-05-07 | 2005-04-19 | Jiahn-Chang Wu | Projector with array LED matrix light source |
CN1653297B (zh) * | 2002-05-08 | 2010-09-29 | 佛森技术公司 | 高效固态光源及其使用和制造方法 |
US6715901B2 (en) * | 2002-08-15 | 2004-04-06 | Shi-Hwa Huang | Image projector system having a light source that includes at least four light emitting diode modules |
US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US7800121B2 (en) * | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
US7101056B2 (en) * | 2002-12-04 | 2006-09-05 | Gelcore Llc | Illuminated LED street sign |
DE20321622U1 (de) * | 2003-04-19 | 2008-07-17 | Leica Biosystems Nussloch Gmbh | Beleuchtungseinrichtung in einem Kryostat |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
TW200500926A (en) * | 2003-06-17 | 2005-01-01 | Darfon Electronics Corp | Light emitting module and keyboard using the same |
US20050052118A1 (en) * | 2003-09-05 | 2005-03-10 | Shuit-Tong Lee | Organic electroluminescent devices formed with rare-earth metal containing cathode |
US7329024B2 (en) * | 2003-09-22 | 2008-02-12 | Permlight Products, Inc. | Lighting apparatus |
US7102172B2 (en) * | 2003-10-09 | 2006-09-05 | Permlight Products, Inc. | LED luminaire |
US7819550B2 (en) * | 2003-10-31 | 2010-10-26 | Phoseon Technology, Inc. | Collection optics for led array with offset hemispherical or faceted surfaces |
US7524085B2 (en) * | 2003-10-31 | 2009-04-28 | Phoseon Technology, Inc. | Series wiring of highly reliable light sources |
US7390108B1 (en) * | 2003-11-04 | 2008-06-24 | Cmc Electronics, Inc. | LED source for liquid crystal display |
US7314296B2 (en) * | 2003-12-08 | 2008-01-01 | Honeywell International Inc. | Multi-platform aircraft forward position light utilizing LED-based light source |
EP1704752A4 (en) | 2003-12-11 | 2009-09-23 | Philips Solid State Lighting | METHOD AND DEVICES FOR THERMAL ADMINISTRATION FOR LIGHTING DEVICES |
US7561753B2 (en) * | 2004-01-09 | 2009-07-14 | The Boeing Company | System and method for comparing images with different contrast levels |
US20050151708A1 (en) * | 2004-01-12 | 2005-07-14 | Farmer Ronald E. | LED module with uniform LED brightness |
DE102004004777B4 (de) * | 2004-01-30 | 2013-08-29 | Osram Opto Semiconductors Gmbh | Verformbares Beleuchtungsmodul |
US7434970B2 (en) * | 2004-03-12 | 2008-10-14 | Honeywell International Inc. | Multi-platform LED-based aircraft rear position light |
WO2005091392A1 (en) * | 2004-03-18 | 2005-09-29 | Phoseon Technology, Inc. | Micro-reflectors on a substrate for high-density led array |
US7114841B2 (en) * | 2004-03-22 | 2006-10-03 | Gelcore Llc | Parallel/series LED strip |
US7210957B2 (en) * | 2004-04-06 | 2007-05-01 | Lumination Llc | Flexible high-power LED lighting system |
US7429186B2 (en) * | 2004-04-06 | 2008-09-30 | Lumination Llc | Flexible high-power LED lighting system |
US20050227529A1 (en) * | 2004-04-08 | 2005-10-13 | Gelcore Llc | Multi-conductor parallel splice connection |
DK1756876T3 (da) * | 2004-04-12 | 2011-07-18 | Phoseon Technology Inc | LED-opstilling med høj densitet |
US7241031B2 (en) * | 2004-04-14 | 2007-07-10 | Sloanled, Inc. | Channel letter lighting system using high output white light emitting diodes |
EP1738156A4 (en) * | 2004-04-19 | 2017-09-27 | Phoseon Technology, Inc. | Imaging semiconductor strucutures using solid state illumination |
US20050243556A1 (en) * | 2004-04-30 | 2005-11-03 | Manuel Lynch | Lighting system and method |
US8188503B2 (en) * | 2004-05-10 | 2012-05-29 | Permlight Products, Inc. | Cuttable illuminated panel |
US7165863B1 (en) | 2004-09-23 | 2007-01-23 | Pricilla G. Thomas | Illumination system |
WO2006042271A2 (en) * | 2004-10-08 | 2006-04-20 | Tempo Industries, Inc. | Radiance lighting system and method |
US20060098165A1 (en) * | 2004-10-19 | 2006-05-11 | Manuel Lynch | Method and apparatus for disrupting digital photography |
US7331691B2 (en) * | 2004-10-29 | 2008-02-19 | Goldeneye, Inc. | Light emitting diode light source with heat transfer means |
US7587901B2 (en) * | 2004-12-20 | 2009-09-15 | Amerigon Incorporated | Control system for thermal module in vehicle |
KR101288758B1 (ko) * | 2004-12-30 | 2013-07-23 | 포세온 테크날러지 인코퍼레이티드 | 산업 공정에서 광원을 사용하는 시스템 및 방법 |
US8125137B2 (en) * | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
US7284882B2 (en) | 2005-02-17 | 2007-10-23 | Federal-Mogul World Wide, Inc. | LED light module assembly |
US7377669B2 (en) * | 2005-03-28 | 2008-05-27 | U.S. Led, Ltd. | LED module and system of LED modules with integral branch connectors |
DE102005018175A1 (de) * | 2005-04-19 | 2006-10-26 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | LED-Modul und LED-Beleuchtungseinrichtung mit mehreren LED-Modulen |
US20060274526A1 (en) * | 2005-04-26 | 2006-12-07 | Tir Systems Ltd. | Integrated sign illumination system |
US7918591B2 (en) * | 2005-05-13 | 2011-04-05 | Permlight Products, Inc. | LED-based luminaire |
US7766518B2 (en) * | 2005-05-23 | 2010-08-03 | Philips Solid-State Lighting Solutions, Inc. | LED-based light-generating modules for socket engagement, and methods of assembling, installing and removing same |
US7703951B2 (en) * | 2005-05-23 | 2010-04-27 | Philips Solid-State Lighting Solutions, Inc. | Modular LED-based lighting fixtures having socket engagement features |
US20070022644A1 (en) * | 2005-08-01 | 2007-02-01 | Lynch Peter F | Merchandise display systems |
US7296912B2 (en) * | 2005-09-22 | 2007-11-20 | Pierre J Beauchamp | LED light bar assembly |
NL1030161C2 (nl) | 2005-10-11 | 2007-04-12 | Matthijs Dirk Meulenbelt | Presentatie-inrichting. |
US7872430B2 (en) * | 2005-11-18 | 2011-01-18 | Cree, Inc. | Solid state lighting panels with variable voltage boost current sources |
EP2372224A3 (en) | 2005-12-21 | 2012-08-01 | Cree, Inc. | Lighting Device and Lighting Method |
TWI421438B (zh) | 2005-12-21 | 2014-01-01 | 克里公司 | 照明裝置 |
JP2009527071A (ja) | 2005-12-22 | 2009-07-23 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明装置 |
US7156686B1 (en) | 2005-12-27 | 2007-01-02 | Gelcore Llc | Insulation displacement connection splice connector |
US7642527B2 (en) * | 2005-12-30 | 2010-01-05 | Phoseon Technology, Inc. | Multi-attribute light effects for use in curing and other applications involving photoreactions and processing |
US7852009B2 (en) * | 2006-01-25 | 2010-12-14 | Cree, Inc. | Lighting device circuit with series-connected solid state light emitters and current regulator |
US7946731B1 (en) | 2006-02-15 | 2011-05-24 | J&J Electronics, Inc. | Power LED channel letter lighting module |
US8710765B2 (en) | 2010-05-08 | 2014-04-29 | Robert Beland | LED illumination systems |
EP1845755A3 (en) * | 2006-04-10 | 2014-04-02 | EMD Technologies, Inc. | Illumination systems |
TWI460880B (zh) | 2006-04-18 | 2014-11-11 | Cree Inc | 照明裝置及照明方法 |
US9084328B2 (en) | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
US8513875B2 (en) | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
EP2008019B1 (en) | 2006-04-20 | 2015-08-05 | Cree, Inc. | Lighting device and lighting method |
US7625103B2 (en) * | 2006-04-21 | 2009-12-01 | Cree, Inc. | Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods |
US7648257B2 (en) | 2006-04-21 | 2010-01-19 | Cree, Inc. | Light emitting diode packages |
DE102006021973A1 (de) * | 2006-05-03 | 2007-11-15 | Schefenacker Patents S.à.r.l. | Leuchte mit wenigstens einer Leuchtmitteleinheit für Fahrzeuge, vorzugsweise für Kraftfahrzeuge |
US7649327B2 (en) * | 2006-05-22 | 2010-01-19 | Permlight Products, Inc. | System and method for selectively dimming an LED |
EP2027412B1 (en) * | 2006-05-23 | 2018-07-04 | Cree, Inc. | Lighting device |
KR20140116536A (ko) | 2006-05-31 | 2014-10-02 | 크리, 인코포레이티드 | 조명 장치 및 조명 방법 |
US8985795B2 (en) | 2006-06-30 | 2015-03-24 | Electraled, Inc. | Elongated LED lighting fixture |
US8956005B2 (en) * | 2006-06-30 | 2015-02-17 | Electraled, Inc. | Low-profile elongated LED light fixture |
US8038320B2 (en) * | 2006-06-30 | 2011-10-18 | The Sloan Company, Inc. | Packaging for lighting modules |
US8235539B2 (en) * | 2006-06-30 | 2012-08-07 | Electraled, Inc. | Elongated LED lighting fixture |
US7842960B2 (en) * | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
EP2076712B1 (en) * | 2006-09-21 | 2020-08-12 | IDEAL Industries Lighting LLC | Lighting assembly, method of installing same, and method of removing same |
US7481563B2 (en) * | 2006-09-21 | 2009-01-27 | 3M Innovative Properties Company | LED backlight |
US9028087B2 (en) | 2006-09-30 | 2015-05-12 | Cree, Inc. | LED light fixture |
US9243794B2 (en) | 2006-09-30 | 2016-01-26 | Cree, Inc. | LED light fixture with fluid flow to and from the heat sink |
US7686469B2 (en) | 2006-09-30 | 2010-03-30 | Ruud Lighting, Inc. | LED lighting fixture |
US20090086491A1 (en) | 2007-09-28 | 2009-04-02 | Ruud Lighting, Inc. | Aerodynamic LED Floodlight Fixture |
US7952262B2 (en) * | 2006-09-30 | 2011-05-31 | Ruud Lighting, Inc. | Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules |
US20080080184A1 (en) * | 2006-10-03 | 2008-04-03 | Cao Group Inc. | Pixilated LED Light Source for Channel Letter Illumination |
US9564070B2 (en) * | 2006-10-05 | 2017-02-07 | GE Lighting Solutions, LLC | LED backlighting system for cabinet sign |
US20090027900A1 (en) * | 2006-10-31 | 2009-01-29 | The L.D. Kichler Co. | Positionable outdoor lighting |
US8029155B2 (en) | 2006-11-07 | 2011-10-04 | Cree, Inc. | Lighting device and lighting method |
US8439531B2 (en) * | 2006-11-14 | 2013-05-14 | Cree, Inc. | Lighting assemblies and components for lighting assemblies |
EP2095014B1 (en) * | 2006-11-14 | 2017-05-10 | Cree, Inc. | Light engine assemblies |
WO2008067447A1 (en) * | 2006-11-30 | 2008-06-05 | Cree Led Lighting Solutions, Inc. | Self-ballasted solid state lighting devices |
US9441793B2 (en) | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
WO2008073794A1 (en) | 2006-12-07 | 2008-06-19 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
US7815341B2 (en) * | 2007-02-14 | 2010-10-19 | Permlight Products, Inc. | Strip illumination device |
CN101657671B (zh) | 2007-02-22 | 2012-07-11 | 科锐公司 | 照明装置、照明方法、滤光器和滤光方法 |
US8703492B2 (en) * | 2007-04-06 | 2014-04-22 | Qiagen Gaithersburg, Inc. | Open platform hybrid manual-automated sample processing system |
US8262253B2 (en) * | 2007-05-02 | 2012-09-11 | Luminator Holding Lp | Lighting method and system |
EP2142844B1 (en) | 2007-05-08 | 2017-08-23 | Cree, Inc. | Lighting device and lighting method |
EP2142843B1 (en) | 2007-05-08 | 2016-12-14 | Cree, Inc. | Lighting device and lighting method |
BRPI0811561A2 (pt) | 2007-05-08 | 2015-06-16 | Cree Led Lighting Solutions | Dispositivo de iluminação e método de iluminação |
EP2156090B1 (en) | 2007-05-08 | 2016-07-06 | Cree, Inc. | Lighting device and lighting method |
US8075149B2 (en) * | 2007-05-29 | 2011-12-13 | Cooper Technologies Company | Switched LED nightlight for single-gang junction box |
US7863635B2 (en) | 2007-08-07 | 2011-01-04 | Cree, Inc. | Semiconductor light emitting devices with applied wavelength conversion materials |
EP2210036B1 (en) | 2007-10-10 | 2016-11-23 | Cree, Inc. | Lighting device and method of making |
US8322881B1 (en) * | 2007-12-21 | 2012-12-04 | Appalachian Lighting Systems, Inc. | Lighting fixture |
US8240872B1 (en) | 2008-01-29 | 2012-08-14 | Cannon Safe Inc. | Security safe interior lighting system |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US8851356B1 (en) | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US8143631B2 (en) | 2008-03-06 | 2012-03-27 | Metrospec Technology Llc | Layered structure for use with high power light emitting diode systems |
US8007286B1 (en) | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
JP4794587B2 (ja) * | 2008-02-19 | 2011-10-19 | シャープ株式会社 | 光源ユニット、照明装置及び表示装置 |
DE102008011862A1 (de) * | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung |
US8410720B2 (en) | 2008-04-07 | 2013-04-02 | Metrospec Technology, LLC. | Solid state lighting circuit and controls |
US20090278465A1 (en) * | 2008-05-09 | 2009-11-12 | U.S. Led, Ltd. | Power conversion unit for led lighting |
CA2725835A1 (en) * | 2008-05-27 | 2009-12-03 | Ruud Lighting, Inc. | Method for led-module assembly |
GB0809650D0 (en) * | 2008-05-29 | 2008-07-02 | Integration Technology Ltd | LED Device and arrangement |
US8240875B2 (en) | 2008-06-25 | 2012-08-14 | Cree, Inc. | Solid state linear array modules for general illumination |
US8419212B2 (en) * | 2008-07-29 | 2013-04-16 | Tyco Electronics Corporation | Circuit board assembly with light emitting element |
US8288951B2 (en) | 2008-08-19 | 2012-10-16 | Plextronics, Inc. | Organic light emitting diode lighting systems |
WO2010022105A2 (en) * | 2008-08-19 | 2010-02-25 | Plextronics, Inc. | Organic light emitting diode products |
TWI537900B (zh) * | 2008-08-19 | 2016-06-11 | 索爾維美國有限公司 | 使用者可組態之鑲嵌發光裝置 |
EP2332195A2 (en) * | 2008-08-19 | 2011-06-15 | Plextronics, Inc. | Organic light emitting diode lighting devices |
DK2344939T3 (en) | 2008-09-24 | 2018-06-25 | Luminator Holding Lp | Methods and systems for maintaining the illumination intensity of light emitting diodes |
WO2010042186A2 (en) | 2008-10-07 | 2010-04-15 | Electraled | Led illuminated member within a refrigerated display case |
US8251543B2 (en) * | 2008-11-22 | 2012-08-28 | Innovative Lighting, Inc. | Interior corner mounting module for rope light system |
KR100894258B1 (ko) * | 2008-11-24 | 2009-04-21 | 진영정보통신 주식회사 | Led 조명 모듈 |
US20100226139A1 (en) * | 2008-12-05 | 2010-09-09 | Permlight Products, Inc. | Led-based light engine |
US9080745B2 (en) * | 2008-12-12 | 2015-07-14 | The Sloan Company, Inc. | Angled emitter channel letter lighting |
US8192048B2 (en) * | 2009-04-22 | 2012-06-05 | 3M Innovative Properties Company | Lighting assemblies and systems |
US8921876B2 (en) | 2009-06-02 | 2014-12-30 | Cree, Inc. | Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements |
KR20120094477A (ko) | 2009-09-25 | 2012-08-24 | 크리, 인코포레이티드 | 낮은 눈부심 및 높은 광도 균일성을 갖는 조명 장치 |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
TWM381740U (en) * | 2010-02-03 | 2010-06-01 | Benny Lin | Lamp facilitating replacement of light source |
US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
TWI420048B (zh) * | 2010-06-04 | 2013-12-21 | Everlight Electronics Co Ltd | 光源模組 |
US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
US8461752B2 (en) * | 2011-03-18 | 2013-06-11 | Abl Ip Holding Llc | White light lamp using semiconductor light emitter(s) and remotely deployed phosphor(s) |
US8803412B2 (en) | 2011-03-18 | 2014-08-12 | Abl Ip Holding Llc | Semiconductor lamp |
US8272766B2 (en) * | 2011-03-18 | 2012-09-25 | Abl Ip Holding Llc | Semiconductor lamp with thermal handling system |
ITMI20110775A1 (it) * | 2011-05-06 | 2012-11-07 | Insigna Industry S R L | Insegna luminosa |
WO2013016631A2 (en) * | 2011-07-27 | 2013-01-31 | Grote Industries, Llc | Method and system for flexible illuminated devices having edge lighting utilizing light active sheet material with integrated light emitting diode |
US9989267B2 (en) | 2012-02-10 | 2018-06-05 | Gentherm Incorporated | Moisture abatement in heating operation of climate controlled systems |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
US9416925B2 (en) | 2012-11-16 | 2016-08-16 | Permlight Products, Inc. | Light emitting apparatus |
ITMI20122237A1 (it) * | 2012-12-27 | 2014-06-28 | Fael Spa | Proiettore a led. |
US9777895B2 (en) | 2013-02-21 | 2017-10-03 | John Paul Bokun | Retractable light string inside an ornament device |
US9528689B2 (en) | 2013-03-13 | 2016-12-27 | Palo Alto Research Center Incorporated | LED lighting device with cured structural support |
US9353932B2 (en) * | 2013-03-13 | 2016-05-31 | Palo Alto Research Center Incorporated | LED light bulb with structural support |
US9004719B2 (en) * | 2013-03-14 | 2015-04-14 | The Sloan Company, Inc. | Trim cap illuminated channel letter lighting system and letter construction system |
US10443824B2 (en) * | 2013-03-15 | 2019-10-15 | The Sloan Company, Inc. | Sign box lighting system |
US10446065B2 (en) * | 2013-03-15 | 2019-10-15 | The Sloan Company, Inc. | Sign box lighting system |
US9644829B2 (en) * | 2013-04-25 | 2017-05-09 | Xtralight Manufacturing, Ltd. | Systems and methods for providing a field repairable light fixture with a housing that dissipates heat |
CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
KR20150015905A (ko) * | 2013-08-02 | 2015-02-11 | 삼성디스플레이 주식회사 | 광원 모듈 및 이를 포함하는 백라이트 어셈블리 |
US9577169B2 (en) * | 2013-11-08 | 2017-02-21 | Osram Sylvania Inc. | LED lead frame for laminated LED circuits |
CN106028874B (zh) | 2014-02-14 | 2020-01-31 | 金瑟姆股份公司 | 传导对流气候控制座椅 |
US9561930B2 (en) * | 2014-08-13 | 2017-02-07 | Kurt Gordon Gremley | String light storage lattice |
US10414302B2 (en) | 2014-10-17 | 2019-09-17 | Gentherm Incorporated | Climate control systems and methods |
US9702618B2 (en) | 2014-10-30 | 2017-07-11 | Electraled, Inc. | LED lighting array system for illuminating a display case |
US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
US11033058B2 (en) | 2014-11-14 | 2021-06-15 | Gentherm Incorporated | Heating and cooling technologies |
US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
CN105261689B (zh) * | 2015-10-25 | 2018-10-16 | 复旦大学 | 全串联的高功率密度led芯片封装结构 |
CA3024860A1 (en) | 2016-05-21 | 2017-11-30 | JST Performance, LLC | Method and apparatus for vehicular light fixtures |
EP3475608B1 (en) | 2016-06-28 | 2020-11-04 | Signify Holding B.V. | Lighting assembly for emitting high intensity light, a light source, a lamp and a luminaire |
US20200035898A1 (en) | 2018-07-30 | 2020-01-30 | Gentherm Incorporated | Thermoelectric device having circuitry that facilitates manufacture |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
DE202019100126U1 (de) * | 2019-01-11 | 2020-04-15 | Zumtobel Lighting Gmbh | Leuchtenanordnung für eine längliche Leuchte |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
Family Cites Families (90)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2872750A (en) * | 1957-09-09 | 1959-02-10 | Willis C Holcomb | Sign |
US3936686A (en) * | 1973-05-07 | 1976-02-03 | Moore Donald W | Reflector lamp cooling and containing assemblies |
US4143411A (en) | 1977-01-07 | 1979-03-06 | Roberts Thomas E | Architectural lighting apparatus |
US4173035A (en) * | 1977-12-01 | 1979-10-30 | Media Masters, Inc. | Tape strip for effecting moving light display |
JPS60161639U (ja) | 1984-04-06 | 1985-10-26 | スタンレー電気株式会社 | リヤウインド等に取付ける車両用灯具 |
US4729076A (en) | 1984-11-15 | 1988-03-01 | Tsuzawa Masami | Signal light unit having heat dissipating function |
US4739076A (en) * | 1985-03-15 | 1988-04-19 | Southwick Philip L | Substituted 3-pyrroline-2-one amino blocking reagents and intermediates therefor |
US4612606A (en) | 1985-04-01 | 1986-09-16 | Roberts James R | Apparatus for indirect lighting of stairs |
US4720773A (en) * | 1986-05-27 | 1988-01-19 | Ahroni Joseph M | Decorative light assembly |
US4761720A (en) | 1987-05-14 | 1988-08-02 | Wolo Manufacturing Corporation | Illuminated tape |
ES2048821T3 (es) | 1988-02-18 | 1994-04-01 | Chainlight Int | Cordon de iluminacion, piezas para dicho cordon de iluminacion y dispositivo de presentacion visual provisto de dicho cordon de iluminacion, asi como metodos para producir bloques de montaje y con ellos un cordon de iluminacion. |
GB8807387D0 (en) | 1988-03-29 | 1988-05-05 | Lightgraphix Ltd | Improvements relating to lighting apparatus |
US4908743A (en) | 1989-06-15 | 1990-03-13 | Miller Jack V | Strip lighting assembly |
US5167508A (en) * | 1989-08-21 | 1992-12-01 | Mc Taggart Stephen I | Electronic book |
GB2243548B (en) | 1990-05-02 | 1994-10-12 | K T Lalvani | Nasal drops or spray containing sulphacetamide and a sympathomimetic imidazoline compound |
JPH0731460Y2 (ja) | 1990-08-07 | 1995-07-19 | スタンレー電気株式会社 | 車両用信号灯具 |
CA2023699A1 (en) | 1990-08-21 | 1992-02-22 | Lawrence A. Sears | Stairlights |
CN2124214U (zh) | 1992-07-16 | 1992-12-09 | 廖南辉 | 灯串包装盒 |
US5388367A (en) * | 1992-07-31 | 1995-02-14 | Theodore B. Rydell | Sheath-guard |
US5278432A (en) * | 1992-08-27 | 1994-01-11 | Quantam Devices, Inc. | Apparatus for providing radiant energy |
US5388357A (en) * | 1993-04-08 | 1995-02-14 | Computer Power Inc. | Kit using led units for retrofitting illuminated signs |
EP0632511A3 (en) | 1993-06-29 | 1996-11-27 | Mitsubishi Cable Ind Ltd | Light emitting diode module and method for its manufacture. |
US5607227A (en) | 1993-08-27 | 1997-03-04 | Sanyo Electric Co., Ltd. | Linear light source |
US5697175A (en) * | 1993-10-12 | 1997-12-16 | Spectralight, Inc. | Low power drain illuminated sign |
WO1995031416A1 (en) * | 1994-05-13 | 1995-11-23 | Micropyretics Heaters International | Sinter-homogenized heating products |
US5559681A (en) * | 1994-05-13 | 1996-09-24 | Cnc Automation, Inc. | Flexible, self-adhesive, modular lighting system |
JP3438957B2 (ja) * | 1994-08-11 | 2003-08-18 | 日清紡績株式会社 | 補強材用の水性表面処理剤、該水性表面処理剤で処理された補強材及び補強材により強化された複合材 |
US5499170A (en) | 1994-10-18 | 1996-03-12 | Gagne; Bertrand | Lighting system |
US5660461A (en) | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
US5565262A (en) | 1995-01-27 | 1996-10-15 | David Sarnoff Research Center, Inc. | Electrical feedthroughs for ceramic circuit board support substrates |
US5581876A (en) | 1995-01-27 | 1996-12-10 | David Sarnoff Research Center, Inc. | Method of adhering green tape to a metal support substrate with a bonding glass |
US5598985A (en) * | 1995-05-23 | 1997-02-04 | Winesett; Sandy C. | Christmas light reel |
JP3260593B2 (ja) | 1995-06-09 | 2002-02-25 | 株式会社小糸製作所 | 自動車用信号灯 |
US5661953A (en) * | 1995-06-26 | 1997-09-02 | Jolley; Kathy Marie | Christmas light wrapper and storage apparatus |
JP3713088B2 (ja) | 1996-02-19 | 2005-11-02 | ローム株式会社 | 表示装置 |
US5936353A (en) | 1996-04-03 | 1999-08-10 | Pressco Technology Inc. | High-density solid-state lighting array for machine vision applications |
US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
US5695148A (en) * | 1996-08-08 | 1997-12-09 | Christensen; Karl Russell | Light string storage reel |
US5857767A (en) | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
AU5156198A (en) * | 1996-10-29 | 1998-05-22 | Xeotron Corporation | Optical device utilizing optical waveguides and mechanical light-switches |
CA2273289A1 (en) | 1996-11-29 | 1998-06-04 | Takao Yoshikawa | Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same |
US6582103B1 (en) | 1996-12-12 | 2003-06-24 | Teledyne Lighting And Display Products, Inc. | Lighting apparatus |
TW330233B (en) | 1997-01-23 | 1998-04-21 | Philips Eloctronics N V | Luminary |
US6528954B1 (en) * | 1997-08-26 | 2003-03-04 | Color Kinetics Incorporated | Smart light bulb |
US6548967B1 (en) * | 1997-08-26 | 2003-04-15 | Color Kinetics, Inc. | Universal lighting network methods and systems |
US6042248A (en) | 1997-10-15 | 2000-03-28 | Lektron Industrial Supply, Inc. | LED assembly for illuminated signs |
TW408497B (en) | 1997-11-25 | 2000-10-11 | Matsushita Electric Works Ltd | LED illuminating apparatus |
US6412971B1 (en) * | 1998-01-02 | 2002-07-02 | General Electric Company | Light source including an array of light emitting semiconductor devices and control method |
US5941388A (en) * | 1998-05-27 | 1999-08-24 | Spielberger; William L. | Christmas light storage system |
US5957401A (en) * | 1998-06-23 | 1999-09-28 | O'donnell; Patricia Sessum | Device for storing a string of lights |
US6056420A (en) | 1998-08-13 | 2000-05-02 | Oxygen Enterprises, Ltd. | Illuminator |
US6507747B1 (en) * | 1998-12-02 | 2003-01-14 | Board Of Regents, The University Of Texas System | Method and apparatus for concomitant structural and biochemical characterization of tissue |
EP1006506A1 (en) * | 1998-12-03 | 2000-06-07 | Hewlett-Packard Company | Optical vehicle display |
EP1056971A1 (en) | 1998-12-17 | 2000-12-06 | Koninklijke Philips Electronics N.V. | Light engine |
US6371637B1 (en) * | 1999-02-26 | 2002-04-16 | Radiantz, Inc. | Compact, flexible, LED array |
DE19909399C1 (de) * | 1999-03-04 | 2001-01-04 | Osram Opto Semiconductors Gmbh | Flexibles LED-Mehrfachmodul, insb. für ein Leuchtengehäuse eines Kraftfahrzeuges |
US6075701A (en) | 1999-05-14 | 2000-06-13 | Hughes Electronics Corporation | Electronic structure having an embedded pyrolytic graphite heat sink material |
US6676279B1 (en) * | 1999-10-04 | 2004-01-13 | David A. Hubbell | Area lighting device using discrete light sources, such as LEDs |
US6712486B1 (en) * | 1999-10-19 | 2004-03-30 | Permlight Products, Inc. | Mounting arrangement for light emitting diodes |
US6244728B1 (en) | 1999-12-13 | 2001-06-12 | The Boeing Company | Light emitting diode assembly for use as an aircraft position light |
US6455930B1 (en) * | 1999-12-13 | 2002-09-24 | Lamina Ceramics, Inc. | Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology |
US6885035B2 (en) * | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
US6554446B1 (en) * | 2000-01-03 | 2003-04-29 | Targetti-Tivoli Inc. | Step illumination apparatus |
JP2001230503A (ja) * | 2000-02-18 | 2001-08-24 | Minebea Co Ltd | 部品実装用fpc及び面状照明装置 |
US6283612B1 (en) | 2000-03-13 | 2001-09-04 | Mark A. Hunter | Light emitting diode light strip |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
US6394626B1 (en) * | 2000-04-11 | 2002-05-28 | Lumileds Lighting, U.S., Llc | Flexible light track for signage |
US6648496B1 (en) | 2000-06-27 | 2003-11-18 | General Electric Company | Nightlight with light emitting diode source |
US6758573B1 (en) | 2000-06-27 | 2004-07-06 | General Electric Company | Undercabinet lighting with light emitting diode source |
US6582100B1 (en) * | 2000-08-09 | 2003-06-24 | Relume Corporation | LED mounting system |
US6481130B1 (en) * | 2000-08-11 | 2002-11-19 | Leotek Electronics Corporation | Light emitting diode linear array with lens stripe for illuminated signs |
US6350039B1 (en) | 2000-10-06 | 2002-02-26 | Lee Chien-Yu | Wall switch and lamp assembly |
US6642666B1 (en) | 2000-10-20 | 2003-11-04 | Gelcore Company | Method and device to emulate a railway searchlight signal with light emitting diodes |
JP2002163907A (ja) | 2000-11-24 | 2002-06-07 | Moriyama Sangyo Kk | 照明システム及び照明ユニット |
US6505956B1 (en) | 2000-12-22 | 2003-01-14 | Lektron Industrial Supply, Inc. | Reeled L.E.D. assembly |
US6481874B2 (en) * | 2001-03-29 | 2002-11-19 | Gelcore Llc | Heat dissipation system for high power LED lighting system |
US6478450B1 (en) * | 2001-04-30 | 2002-11-12 | Zdenko Grajcar | Lighting system |
US6518502B2 (en) * | 2001-05-10 | 2003-02-11 | Lamina Ceramics, In | Ceramic multilayer circuit boards mounted on a patterned metal support substrate |
US6660935B2 (en) * | 2001-05-25 | 2003-12-09 | Gelcore Llc | LED extrusion light engine and connector therefor |
WO2002097884A1 (en) | 2001-05-26 | 2002-12-05 | Gelcore, Llc | High power led module for spot illumination |
US6485160B1 (en) | 2001-06-25 | 2002-11-26 | Gelcore Llc | Led flashlight with lens |
US6578986B2 (en) * | 2001-06-29 | 2003-06-17 | Permlight Products, Inc. | Modular mounting arrangement and method for light emitting diodes |
US6700136B2 (en) * | 2001-07-30 | 2004-03-02 | General Electric Company | Light emitting device package |
US6566824B2 (en) | 2001-10-16 | 2003-05-20 | Teledyne Lighting And Display Products, Inc. | Flexible lighting segment |
US6871983B2 (en) * | 2001-10-25 | 2005-03-29 | Tir Systems Ltd. | Solid state continuous sealed clean room light fixture |
US6796698B2 (en) | 2002-04-01 | 2004-09-28 | Gelcore, Llc | Light emitting diode-based signal light |
US6641283B1 (en) * | 2002-04-12 | 2003-11-04 | Gelcore, Llc | LED puck light with detachable base |
US6573536B1 (en) * | 2002-05-29 | 2003-06-03 | Optolum, Inc. | Light emitting diode light source |
US6787999B2 (en) | 2002-10-03 | 2004-09-07 | Gelcore, Llc | LED-based modular lamp |
-
2001
- 2001-09-05 US US09/948,338 patent/US6578986B2/en not_active Expired - Lifetime
-
2002
- 2002-03-26 CN CNB021079978A patent/CN1280574C/zh not_active Expired - Fee Related
-
2003
- 2003-04-16 US US10/417,896 patent/US6846093B2/en not_active Expired - Lifetime
-
2004
- 2004-08-02 US US10/909,933 patent/US7108396B2/en not_active Expired - Fee Related
-
2005
- 2005-12-06 US US11/294,974 patent/US7387406B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102620256A (zh) * | 2005-11-29 | 2012-08-01 | 吉尔科有限公司 | 制造发光组件的方法 |
CN102289995A (zh) * | 2011-08-26 | 2011-12-21 | 苏州晶雷光电照明科技有限公司 | 一种led灯牌 |
CN103208717A (zh) * | 2013-04-10 | 2013-07-17 | 深圳市大族激光科技股份有限公司 | 半导体单芯管的转接装置 |
CN103208717B (zh) * | 2013-04-10 | 2015-08-05 | 大族激光科技产业集团股份有限公司 | 半导体单芯管的转接装置 |
CN108701732A (zh) * | 2015-12-08 | 2018-10-23 | 奥塔装置公司 | 用于柔性太阳能电池的多功能柔性电路互连 |
Also Published As
Publication number | Publication date |
---|---|
US20050063183A1 (en) | 2005-03-24 |
US20030002282A1 (en) | 2003-01-02 |
CN1280574C (zh) | 2006-10-18 |
US6846093B2 (en) | 2005-01-25 |
US6578986B2 (en) | 2003-06-17 |
US7108396B2 (en) | 2006-09-19 |
US20030218878A1 (en) | 2003-11-27 |
US7387406B2 (en) | 2008-06-17 |
US20060087844A1 (en) | 2006-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1280574C (zh) | 发光二极管的模块化安装装置和方法 | |
US9291316B2 (en) | Integrated linear light engine | |
CN203615157U (zh) | 灯以及照明装置 | |
US8317358B2 (en) | Method and apparatus for providing an omni-directional lamp having a light emitting diode light engine | |
JP5340763B2 (ja) | Ledランプ | |
TWI640713B (zh) | 用於一般照明的發光二極體導線架陣列 | |
US20040257815A1 (en) | Mounting arrangement for light emitting diodes | |
CN107388062A (zh) | 灯泡装置与制作照明装置的方法 | |
WO2016172719A2 (en) | Method and apparatus for chip-on board flexible light emitting diode | |
WO2009111148A2 (en) | Modular led lighting fixtures | |
CN1902757A (zh) | 照明组件 | |
WO2012043543A1 (ja) | 発光装置及び照明装置 | |
CN1617362A (zh) | 发光器件和利用该发光器件的发光设备和制造发光器件的方法 | |
WO2012109059A2 (en) | Solid state lighting device with elongated heatsink | |
CN104040247A (zh) | 固态照明设备 | |
CN101042226A (zh) | 大功率led照明灯模组 | |
JP2012069834A (ja) | 発光装置及び照明装置 | |
US10900653B2 (en) | LED mini-linear light engine | |
US20150009662A1 (en) | Light-Emitting Module and Luminaire | |
CN101451689A (zh) | 平板式led光源芯片 | |
US11175019B2 (en) | Carrier for lighting modules and lighting device | |
KR20160066569A (ko) | 다이칩을 집적화한 고휘도, 고출력 led 소자를 이용한 공장등 | |
CN201187694Y (zh) | 条状led照明灯 | |
JP2007066906A (ja) | 発光ダイオード電球 | |
JP5896125B2 (ja) | 発光装置及び照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061018 Termination date: 20120326 |