CN1330990C - Optical interference type reflecting panel and manufacturing method thereof - Google Patents
Optical interference type reflecting panel and manufacturing method thereof Download PDFInfo
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- CN1330990C CN1330990C CNB031787665A CN03178766A CN1330990C CN 1330990 C CN1330990 C CN 1330990C CN B031787665 A CNB031787665 A CN B031787665A CN 03178766 A CN03178766 A CN 03178766A CN 1330990 C CN1330990 C CN 1330990C
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- thin film
- optical thin
- light interference
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Abstract
The present invention relates to an optical interference type reflecting panel and a manufacturing method thereof. The manufacturing method has the steps: firstly, a supporting layer is manufactured on the surface of a baseplate; secondly, a first conductor, namely an optical film lamination, a gap layer, a second conductor layer, etc. are orderly manufactured; finally, the gap layer is removed, and a light interference adjuster is manufactured on the baseplate. In the manufacturing steps, the supporting layer is manufactured before the first layer, namely the optical film lamination is manufactured, so the supporting layer is manufactured without an accurate back-side expose step. The present invention has the advantages that the manufacturing process is simplified, and the manufacturing efficiency is improved.
Description
Technical field
The present invention relates to a kind of light interference reflection panel and manufacture method thereof, refer to especially a kind ofly before the first conductor optical thin film lamination applies, finish supporting layer earlier, to simplify the light interference reflection panel and the manufacture method thereof of processing procedure.
Background technology
Because there is bulky defective in the conventional cathode ray tube screen, thereby flat-panel screens is taken advantage of a situation and rises.Common LCD is the wherein a kind of of flat-panel screens at present, it significantly dwindles compared to the CRT screen on volume, but industry is is still constantly researched and developed the flat-panel screens of other type, and reason is: LCD has increased the power load of portable electronic product (as mobile phone, personal digital assistant PDA, e-book etc.).Promptly become one of research and development emphasis of flat-panel screens so how to reduce the power consumption of display as far as possible.
With regard to conventional liquid crystal, power consumption the maximum comes from its back light member, and industry to solve the technical scheme of this problem be to adopt reflective panel, it utilizes extraneous natural light irradiation to form reflection on panel, so promptly need not use backlight (or use chance of minimizing backlight), so can significantly reduce its power consumption.
Yet reflective panel is identical with conventional liquid crystal, must establish color filter film (Color Filter), light polarizing film (Polarizer) etc. in panel, so that the direct of travel of display color picture and control light.Although filter coating, light polarizing film etc. possess the light-permeable characteristic, when light passes through film, will cause damage, and influence the light operation efficiency.For solving this problem, industrial community is to develop a kind of light interference reflection panel, it mainly utilizes the interference of light (Interference) phenomenon of visible light in different thin film dielectricss, design suitable film combinations element, the three primary colors of light such as red to show, blue, green, and white, black spectrum.By this, reflective panel need not re-use traditional color filter film and light polarizing film, can be in order to the display color picture, and can improve the penetrance of light, and the portable electronic product that is suitable for tool low power consumption demand uses.
The essential structure of relevant aforementioned lights interfere type panel, see also shown in Figure 3, it is the synoptic diagram in single picture element zone, mainly be to be arranged with one first conductor optical thin film lamination 71 and supporting layer 72 on substrate 70 surfaces of glass or macromolecular material formation, 72 of supporting layers are covered with one second conductor layer 73 (also claiming mechanical layer), and make second conductor layer 73 and 71 of the first conductor optical thin film laminations form an appropriate gap.
Utilize the driving circuit of the former reason of MEMS (micro electro mechanical system) (MEMS) outside respectively the first conductor optical thin film lamination 71, second conductor layer 73 to be applied electric field again, can make second conductor layer 73 form to paste and put phenomenon towards the first conductor optical thin film lamination, 71 directions, regulate to constitute the interference of light, because the space change of second conductor layer 73 and the first conductor optical thin film lamination 71, so can produce different interference effects to incident light, to constitute different demonstration coloured light.
Only the structure and the manufacture method of aforementioned light interference reflection panel still have the space of progressing greatly, and its concrete manufacture method is step as shown in Figure 4:
On a substrate 70, make the first conductor optical thin film lamination 71 and clearance layer 701 patterns such as (shown in Fig. 4 A, B) with processing procedures such as existing thin film deposition, little shadow and film etchings;
At aforementioned first conductor optical thin film lamination 71 and the negative photoresist of clearance layer 701 surface coated, and utilize steps such as back-exposure (Back-side expose), development to carry out patterning, with the negative photoresist of removal, and between this local location, make supporting layer 72 (shown in Fig. 4 C) at the pellicular cascade local location;
Make second conductor layer 73 (shown in Fig. 4 D) on aforementioned gap layer 701, this second conductor layer 73 is across on each supporting layer 72;
Remove the clearance layer 701 of second conductor layer, 73 belows, make it be supported (shown in Fig. 4 E) by supporting layer 72.
In aforementioned processing procedure, owing on substrate 70, make the first conductor optical thin film lamination 71 earlier, when it makes supporting layer 72, step at exposure imaging, must bear photoresist to aim at (that is back-exposure automatically to the first conductor optical thin film lamination 71 and clearance layer 701 surface coated by the back side of substrate 70, as described above shown in Fig. 4 C), thereby make fabrication steps many and complicated, so the space of further simplification is arranged.
Summary of the invention
Fundamental purpose of the present invention is to overcome the deficiencies in the prior art and defective, and a kind of light interference reflection panel and manufacture method thereof of simplifying processing procedure is provided.
For reaching the major technique means that aforementioned purpose takes is to make supporting layer earlier in a substrate surface; Making the first conductor optical thin film lamination on the substrate and between the adjacent supports layer, wherein this first conductor optical thin film lamination has covered the part surface of adjacent supports layer; On substrate, make and planarization one clearance layer; On clearance layer and supporting layer, make second conductor layer; And after after second conductor layer is finished, clearance layer being removed, promptly on substrate, finish the making of interference of light regulator;
Aforementioned fabrication steps is advanced to supporting layer and finishes making before the first conductor optical thin film lamination applies, so when making supporting layer, only must can finish through general exposure imaging step, and can save accurate back-exposure (Back-side expose) step, so can simplify processing procedure, lifting manufacturing efficient.
The aforementioned first conductor optical thin film lamination comprises a transparency conductive electrode, an absorption layer and a dielectric layer at least.
The aforementioned first conductor optical thin film lamination is made up of a transparency conductive electrode, first dielectric layer, an absorption layer and second dielectric layer etc.
Aforementioned second conductor layer comprises a reflection layer at least.
The present invention's time purpose is to provide a kind of light interference reflection panel.
Aforementioned light interference reflection panel comprises at least:
One substrate;
Supporting layer is positioned at the aforesaid base plate surface;
The first conductor optical thin film lamination is located at substrate surface, and is partially overlapped on the supporting layer; And
Second conductor layer, it is formed on this first conductor optical thin film lamination.
Aforementioned second conductor layer, the first conductor optical thin film lamination and supporting layer with respect to substrate to constitute the homonymy lamination.
Description of drawings
Figure 1A～E is a fabrication steps synoptic diagram of the present invention;
Fig. 2 A～D is the different lamination combination synoptic diagram of the present invention's first conductor optical thin film lamination;
Fig. 3 is the cut-open view of existing light interference type panel;
Fig. 4 A～E is the interference of light regulator processing procedure synoptic diagram of existing Reflector Panel.
Symbol description among the figure
10 substrates, 11 supporting layers
12 first conductor optical thin film laminations
121 transparency conductive electrodes, 122 absorption layers
123 dielectric layers, 124 dielectric layers
13 clearance layer, 14 second conductor layers
70 substrates, 701 clearance layer
72 supporting layers, 73 second conductor layers
71 first conductor optical thin film laminations
Embodiment
The idiographic flow of relevant manufacture method of the present invention sees also shown in Figure 1ly, and it may further comprise the steps:
On the substrate 10 of glass or macromolecular material formation, make supporting layer 11 (shown in Figure 1A);
On aforesaid base plate 10, make the first conductor optical thin film lamination 12 (shown in Figure 1B);
Form clearance layer 13 (or claiming sacrifice layer) on substrate 10 surfaces, to carry out planarization (shown in Fig. 1 C);
On the clearance layer 13 of adjacent supports layer 11, make second conductor layer 14 (shown in Fig. 1 D);
Remove the clearance layer 13 of second conductor layer, 14 belows, make second conductor layer 14 be supported (shown in Fig. 1 E), to constitute interference of light regulator by supporting layer 11; Wherein:
In the aforementioned fabrication steps, supporting layer 11 is finished by general exposure imaging technology, need not utilize the back-exposure technology.Again, this first conductor optical thin film lamination 12 is formed (shown in Fig. 2 A) by a transparency conductive electrode 121, an absorption layer 122 and a dielectric layer 124 at least, dielectric layer 124 in its lamination also can be more than one deck, shown in Fig. 2 B～D in the lamination, promptly comprise first dielectric layer 123, second dielectric layer 124, it can make up as the different lamination of icon with transparency conductive electrode 121,122 of absorption layers.Second conductor layer 14 comprises a reflection layer at least again.
Utilize light interference reflection panel that aforementioned processing procedure finishes because of need not accurate aligning, this first conductor optical thin film lamination 12 is after finishing etching, still have the part lamination to be overlapped on the supporting layer 11, be located at the lap of the first conductor optical thin film lamination 12 at supporting layer 12 end faces so aforementioned second conductor layer 14 is actually to stride.
Can save the accurate processing procedure of back-exposure with aforementioned light interference reflection panel, have the effect of simplification for overall process, the simplification because of processing procedure simultaneously can reduce cost of equipment and promote production efficiency.So really possessed significant practicality and progressive with aforesaid light interference reflection panel and manufacture method thereof.
Claims (11)
1. the manufacture method of a light interference reflection panel is characterized in that,
Make supporting layer in a substrate surface in advance;
Making the first conductor optical thin film lamination on the substrate and between the adjacent supports layer, wherein this first conductor optical thin film lamination has covered the part surface of adjacent supports layer;
On substrate, make and planarization one clearance layer;
On clearance layer and supporting layer, make second conductor layer; And
After second conductor layer is finished, clearance layer is removed.
2. the manufacture method of light interference reflection panel as claimed in claim 1, it is characterized in that, this first conductor optical thin film lamination is for partially overlapping supporting layer, and second conductor layer is to stride to be located at the place of overlapping that the first conductor optical thin film is stacked in the supporting layer end face.
3. the manufacture method of light interference reflection panel as claimed in claim 2 is characterized in that, this substrate is made of glass or macromolecular material.
4. the manufacture method of light interference reflection panel as claimed in claim 2 is characterized in that, this first conductor optical thin film lamination is made up of a transparency conductive electrode, an absorption layer and a dielectric layer at least, and wherein dielectric layer can be one or more layers.
5. the manufacture method of light interference reflection panel as claimed in claim 2 is characterized in that, this second conductor layer comprises a reflection layer at least.
6. a light interference reflection panel is characterized in that, includes:
One substrate;
Supporting layer is positioned at the aforesaid base plate surface;
The first conductor optical thin film lamination is located at substrate surface, and is partially overlapped on the supporting layer; And
Second conductor layer, it is formed on this first conductor optical thin film lamination.
7. light interference reflection panel as claimed in claim 6 is characterized in that, this second conductor layer, the first conductor optical thin film lamination and supporting layer with respect to substrate to constitute the homonymy lamination.
8. light interference reflection panel as claimed in claim 6 is characterized in that this substrate is made of glass or macromolecular material.
9. light interference reflection panel as claimed in claim 6 is characterized in that, this first conductor optical thin film lamination is made up of a transparency conductive electrode, an absorption layer and a dielectric layer at least, and wherein dielectric layer can be one or more layers.
10. light interference reflection panel as claimed in claim 6 is characterized in that, this second conductor layer comprises a reflection layer at least.
11. light interference reflection panel as claimed in claim 6 is characterized in that, this first conductor optical thin film lamination comprises an absorption layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031787665A CN1330990C (en) | 2003-07-18 | 2003-07-18 | Optical interference type reflecting panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031787665A CN1330990C (en) | 2003-07-18 | 2003-07-18 | Optical interference type reflecting panel and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1570746A CN1570746A (en) | 2005-01-26 |
| CN1330990C true CN1330990C (en) | 2007-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031787665A Expired - Fee Related CN1330990C (en) | 2003-07-18 | 2003-07-18 | Optical interference type reflecting panel and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1330990C (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999052006A2 (en) * | 1998-04-08 | 1999-10-14 | Etalon, Inc. | Interferometric modulation of radiation |
| US6040937A (en) * | 1994-05-05 | 2000-03-21 | Etalon, Inc. | Interferometric modulation |
| US20030072070A1 (en) * | 1995-05-01 | 2003-04-17 | Etalon, Inc., A Ma Corporation | Visible spectrum modulator arrays |
-
2003
- 2003-07-18 CN CNB031787665A patent/CN1330990C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6040937A (en) * | 1994-05-05 | 2000-03-21 | Etalon, Inc. | Interferometric modulation |
| US20030072070A1 (en) * | 1995-05-01 | 2003-04-17 | Etalon, Inc., A Ma Corporation | Visible spectrum modulator arrays |
| WO1999052006A2 (en) * | 1998-04-08 | 1999-10-14 | Etalon, Inc. | Interferometric modulation of radiation |
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| Publication number | Publication date |
|---|---|
| CN1570746A (en) | 2005-01-26 |
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| ASS | Succession or assignment of patent right |
Owner name: QUALCOMM MEMS SCIENCE & TECHNOLOGY CO.,LTD. Free format text: FORMER OWNER: YUANTAI SCIENCE, TECHNOLOGY + INDUSTRY CO. LTD. Effective date: 20060421 |
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Effective date of registration: 20060421 Address after: American California Applicant after: Qualcomm MEMS Technology Corp. Address before: No. 3, No. 1, Li Gong Road, Hsinchu Science Industrial Park, Taiwan, Hsinchu Applicant before: Yuantai Science and Technology Industry Co., Ltd. |
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Effective date of registration: 20161024 Address after: American California Patentee after: NUJIRA LTD. Address before: American California Patentee before: Qualcomm MEMS Technology Corp. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20070808 Termination date: 20180718 |