CN1272646C - 用于10gb/s收发机的高频发射器和检测器组装方案 - Google Patents

用于10gb/s收发机的高频发射器和检测器组装方案 Download PDF

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CN1272646C
CN1272646C CNB028075978A CN02807597A CN1272646C CN 1272646 C CN1272646 C CN 1272646C CN B028075978 A CNB028075978 A CN B028075978A CN 02807597 A CN02807597 A CN 02807597A CN 1272646 C CN1272646 C CN 1272646C
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optical
optical module
assembly
light
photodetector
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CN1526082A (zh
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A·阿尔杜伊诺
D·克拉夫茨
S·佩达达
B·扎波尔斯基
S·弗莱舍尔
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Intel Corp
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4246Bidirectionally operating package structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4277Protection against electromagnetic interference [EMI], e.g. shielding means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4279Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Abstract

一种设备和组装方案,确保在收发机中的信号发送和检测部件之间的对准被最佳化并在设备的使用期限期间被保持。这是通过使用一对聚合物光学模块完成的,聚合物光学模块用来耦合被发送到各个纤维光缆的光和从各个纤维光缆接收的光。在预对准处理期间,聚合物光学模块的头端部分被插入到在支座中形成的相应插槽,支座被安装在光学子组件上,在其上安装有发射器和检测器,由此这些插槽被配置成使得在组装期间头端部分沿着插槽的侧壁滑动。在随后的有效对准处理期间,每个聚合物光学模块相对于它的各个发射器或检测器进行放置,直至检测到最大信号为止,在这时候,通过使用紫外线敏感的粘结剂快速设定部件的位置。然后,可以加上附加粘结剂,进一步固定部件。

Description

用于10GB/S收发机的高频发射器和检测器组装方案
技术领域
本发明总的涉及非常高带宽的收发机,更具体地,涉及用于非常高带宽的收发机的组装方案,其中发射器和检测器被组装在一个单个单元中。
背景技术
网络通信大大地增加数据使用,使得能够发送越来越大量的数据。为了便于达到越来越增加的对于数据传输的要求,通信系统逐步增加它们的带宽。例如,以太网技术的开发商提供10Mb/s,100Mb/s,和1Gb/s的传输速率的标准。最近,正在定出用于10Gb/s以太网的标准。
网络通信牵涉到通常通过一个或多个中间设备耦合的、两个末端设备(例如,计算机)之间的数据传输。例如,当通过互联网使用数据时,用于数据路径(即,其上传输数据的网络连接路由)的中间设备可包括一个或多个网关以及各种路由器和交换机。当使用局域网(LAN)时,数据路径典型地包括一个或多个网络集线器和/或路由器。在数据路径上的每个设备必须提供适当的连接,这使得通过网络电缆连接提供的信号能够被这些设备接收和发送。
为了支持更高的带宽信号,Gb/s网络通常需要纤维光缆连接,它比起铜线连接提供几个优点。光纤连接提供两个功能:它把由发射器产生的发送光信号耦合到纤维光缆连接,以及提供用于把在纤维光缆上接收的光信号耦合到接收部件(典型的,包括检测器)的装置。随着网络信号的带宽增加,它们的信号噪声比降低,使得更高带宽的信号,即使通过光缆连接被载送时,也对扰动(诸如EMI辐射等等)更敏感。这需要连接器中的部件非常精确地对准。另外,必须采取增加的测量,以阻止外部扰动。
被设计来用于高带宽应用的一个传统的组装方案在工业上被称为“TO can”组装。采用TO can组装的连接器包括用于耦合发送信号和接收信号的分开的组装件。这些组装件的输出通常被耦合到电路板,它使能进一步路由和/或处理发送或接收信号。当前,TO can组装通常支持约2.5Gb/s的带宽。
发明内容
本发明提供了一种用于高带宽的收发机的光学子组件,包括:基板,其上安装有光发射器和光检测器;第一光学模块,用来把从第一光缆接收的光光耦合到光检测器;第二光学模块,用来把由光发射器产生的光光耦合到第二光缆;被固定地安装到基板上的支座,第一和第二光学模块各被牢固地固定到所述支座上,其中,第一和第二光学模块每个都包括头端部分,且支座包括在其中形成的两个凹槽,所述凹槽用来在组装操作期间滑动地接合相应的光学模块的头端部分,每个所述头端部分在完成组装操作时被牢固地固定在相应的凹槽内。
所述每个第一和第二光学模块可由单块聚合物形成的。
本发明还提供了一种组装用于高带宽的收发器的光学子组件的方法,包括:把第一光学模块预对准光检测器,所述第一光学模块用来把从第一光缆接收的光光耦合到光检测器;把第二光学模块预对准光发射器,所述第二光学模块用来把由光发射器产生的光光耦合到第二光缆;把第一光学模块有效地对准光检测器,以产生第一最佳对准,其中由光检测器检测的信号被最大化;把第二光学模块有效地对准光发射器,以产生第二最佳对准,其中由光发射器产生的信号被最大化;以及牢固地固定第一和第二最佳对准。
附图说明
当结合附图参考以下的详细说明时,将更容易理解和更好地了解本发明的上述的方面和许多附属优点,其中:
图1是显示具有按照本发明的组装方案的光学子组件的主要部件的分解图;
图2是图1的光学子组件的支座和基板的详细的等轴视图;
图3A和3B分别显示在光学子组件中使用的聚合物光学模块的详细的正视图和等轴视图。
图4是沿图1的截断线从截取的聚合物光学模块,支座和基板的截面图;
图5是显示在光学子组件组装期间使用的对准处理的流程图;以及
图6是用于显示聚合物光学模块对准的光学子组件的等轴视图。
具体实施方式
本发明提供可被用于高带宽的收发机的光学子组件,其具有可确保在设备的使用期限中信号发送和检测部件之间的对准被最佳化和被保持的组装方案。组装方案包括一对聚合物光学模块,它们被用来耦合被发送到各个纤维光缆的光和从各个纤维光缆接收的光。在预对准处理期间,聚合物光学模块的头端部分被插入到在支座中形成的各个插槽,支座被安装在光学子组件基板上,在基板上安装有发射器和检测器。在随后的有效对准处理期间,每个聚合物光学模块相对于它的各个发射器或检测器进行放置,直至检测到最大信号为止,在这时候,通过使用对于紫外线(UV)敏感的粘结剂快速设定部件的位置。可任选地,可以使用附加粘结剂,进一步固定部件。最后得到的组装方案提供支持发射机和接收机连接功能的单个单元,而同时支持相应于10Gb/s信号的带宽。
图1上显示实施本发明的组装方案的光学子组件(OSA)的主要部件的分解图。这些部件包括光学子组件(OSA)基板12,基板12上安装有垂直腔表面发射激光器(VCSEL)14,功率监视器16,检测器18,和放大器20。光学子组件还包括支座22,一对聚合物光学模块24和一对帽28。
VCSEL 14用来产生光信号,它被用于高带宽通信(例如,10GHz/s)。在一个实施例中,光的波长大约是800-900纳米(nm)(标称值850nm)。在其他实施例中,VCSEL 14被配置成产生具有分别约为1300nm和1550nm波长的光。另外,也可以使用适合于高带宽通信信号环境的其他的波长。可被用于VCSEL 14的适用的部件包括Emcore(Albuquerque,NM)8585-8050镓砷(GaAs)VCSEL,或由Honeywell公司制造的、具有类似特性的GaAs VCSEL。由VCSEL 14发射的光功率由功率监视器16进行监视,功率监视器优选地包括低频功率监视器光电二极管,它提供对于由VCSEL 14发射的功率的有效控制。从VCSEL 14发射的光功率的一部分由设置在VCSEL上面的透镜56反射,这样,被发射的光入射到功率监视器16的口面,其中入射光被校准以表示由VCSEL 14输出的实际的光功率。
检测器18被用来检测具有类似于由VCSEL 14产生的光信号的特性的高带宽(例如,10GHz/s)光信号。用于检测器18的适当的部件包括由Microsemi公司(Santa Ana,California)制造的各种GaAs检测器。放大器20接收来自检测器18的低电流信号,以及提供增益给该信号,而同时也注入尽可能少的噪声到数据流。这个部件通常将包括变阻抗(TIA)型放大器,或预放大器。Nortel公司制造可被用来执行放大器20的功能的SiGe TIA放大器。
优选地,功率监视器16被连线固定到OSA基板12,基板优选地包括硅、陶瓷、或FR4。放大器20也可被连线固定到OSA基板12,或可以通过使用在电子制造期间通常使用的其他技术(诸如,波焊?-请填写你可能使用的另一个方法),被电连接到OSA基板。这些部件通过在OSA基板12上的内部的或表面的轨迹(未示出)接收功率和电信号,这些轨迹被路由到被沉积在OSA基板的周边附近的多个C4焊料凸起32。
图2中显示组件上OSA基板12和支座22的详细的视图。支座22包括一对基本上立方体形状的凹槽38和40,用来接纳聚合物光学模块24的块形的头端部分,由此,凹槽的头端部分和侧壁在组件上滑动接合(即,互相滑动),它们的进一步的细节在下面描述。在凹槽38和40的开孔处也确定一对倒角44和46,以及一对埋头孔34和36。为了增强信号质量,支座22优选地应当包括EML屏蔽,以减小和/或阻止接收信号与发送信号之间的串扰。因此,在一个实施例中,金或其他适当的金属通过使用例如蒸汽沉积被沉积在凹槽38和40的表面上。在另一个实施例中,金属屏蔽被模制在凹槽38和40的侧壁。
聚合物光学模块被用来重新引导由VCSEL 14产生的光,这样,光可被光缆接收,以及重新引导从光缆接收的光,以使得它在检测器18处被接收。因此,聚合物光学模块24由能够传输具有相应于在使用该设备的宽带环境中所使用的光信号的波长的光的材料制成。例如,在一个实施例中,光波长大约是800-900nm。正如上面讨论的,也可以使用1300nm和1550nm的光信号,以及其他波长。聚合物光学模块24也包括在一个末端处形成的圆柱孔50,孔50被配置成用来接纳纤维光缆54的末端部分52,正如图3A,3B和4所示的。孔50也包括逐步下降的部分55,用于接纳光缆54的光纤末端或区域57。适用于聚合物光学模块24的材料包括Uitem 1000,一种由GeneralElectric(通用电气公司)制造的聚合物,它具有大约为3的折射率。
聚合物光学模块24包括一对透镜56和58,它们被用来对准进出的光信号,如用光通道60描绘的。优选地,透镜56和58直接被形成在聚合物光学模块24上。可任选地,透镜56和58可包括被安装在模块内的分开的部件。聚合物光学模块24优选地在它的大部分长度上具有圆柱形状,向着它的头端形成倒角66,倒角与倒角44和46配合。
聚合物光学模块24还包括凹槽64,它优选地充满空气。当光沿着光通道60行进时,它照射到在凹槽64中形成的表面62,在其上光被重新指向约90度。这个“镜面”效应是由于表面62两侧的不同的折射率(对于Uitem 1000为3,对于空气为1)而产生的。帽28被用来确保凹槽64中的空气保持没有灰尘和其他杂质。
为了使得性能最大化,VCSEL 14和检测器18相对于聚合物光学模块24中的透镜56的对准需要被精确地控制。这些部件的精确的对准是通过两个阶段的预对准和有效对准处理而达到的。预对准阶段保证在有效对准阶段期间需要执行最小的位置对准。这是组件的累积的公差最小化的结果。因此,VCSEL 14和检测器18相对于在OSA基板12上已知的基准或对准点被放置,以使得位置误差约为+/-20μm。而且,埋头孔34和36相对于在OSA基板12上已知的基准或对准点被放置,以使得在组装时位置误差约为+/-20μm。OSA基板和支座优选地通过使用环氧树脂或类似的粘结剂而被组装。最后,凹槽38和40的深度被精确地控制,以使在适当的情况下透镜56的焦点落在发射器14或检测器18上。
为了得到上述的对准结果,在支座22和聚合物光学模块24的各种表面和特性必须非常精确。因此,支座22和聚合物光学模块24需要精确的制造过程,诸如精密注塑模制。在替换的实施例中,这些精密表面和特性可以通过使用铸造后机械加工而达到。
参照图5的流程图,预对准阶段从方块100开始,其中把粘结剂70施加到头端48的侧壁和/或凹槽40的侧壁和/或底部。可任选地,粘结剂70可以在下面讨论的方块102执行的步骤后,被注入在头端48和凹槽的侧壁之间的缝隙,如图6所示。优选地,粘结剂70将包括对于紫外(UV)光敏感的氰基丙烯酸脂或环氧树脂,这样粘结剂在暴露在UV光时快速固化。可任选地,粘结剂70可包括两种或多种粘结剂,其中一种粘结剂是对于UV光敏感的,而另一种粘结剂在固化后为组件提供附加的硬度,诸如各种熟知的高强度的环氧树脂。
接着,在方块102,聚合物光学模块24的头端部分42被插入到凹槽38(或40),以及截断的圆锥凸台58被插入到埋头孔36(或34)。接合零件的尺寸和各种特性的配置是使得在头端42的侧壁与凹槽的相应侧壁之间有稍许缝隙,以及在埋头孔的成角度的面与截断的圆锥凸台58的圆锥面之间有约100μm的缝隙。这时,对准过程的预对准阶段完成。
对准过程的下一个部分包括每个聚合物光学模块24相对于支座22(因此,相对于VCSEL 14和检测器18)的有效对准。正如由方块104提供的,这是通过调节每个聚合物光学模块24的位置而同时测量由VCSEL 14产生的光的输出信号强度或由检测器18测量的输入信号强度(当对于该聚合物光学模块适当时)实现的,在其中不断进行定位直至检测到最大信号为止。信号强度测量如图6的方块72和74所示。
在检测到最大信号后,在方块106,UV光被应用到粘结剂70上,以便快速固定位置。如果先前没有被加上,则附加的粘结剂(诸如高强度环氧树脂)可被施加到在头端48与凹槽36的侧壁之间的缝隙中,以便固定位置,正如由方块108提供的。
然后,对于另一面在聚合物光学模块上执行类似的对准过程。可任选地,两个聚合物光学模块的有效对准可以基本上同时执行。
在粘结剂被固化后,最后得到的组件包括适合于在千兆比特收发机中使用的单个高密度SFF(小型中间(factor))连接器,允许水平光纤耦合。由于有效对准处理过程,收发机的信号强度被最大化。
本发明的所示实施例的以上说明并不打算枚举的,或把本发明限于所揭示的精确的形式。虽然本发明的具体的实施例和例子在这里是为了说明的目的被描述的,但在本发明的范围内可作出各种等效的改进,正如本领域技术人员将会看到的。因此,本发明的范围无论如何不打算限于以上的说明,而是完全参照以下的权利要求被确定。

Claims (22)

1.一种用于高带宽的收发机的光学子组件,包括:
基板,其上安装有光发射器和光检测器;
第一光学模块,用来把从第一光缆接收的光光耦合到光检测器;
第二光学模块,用来把由光发射器产生的光光耦合到第二光缆;
被固定地安装到基板上的支座,第一和第二光学模块各被牢固地固定到所述支座上,
其中,第一和第二光学模块每个都包括头端部分,且支座包括在其中形成的两个凹槽,所述凹槽用来在组装操作期间滑动地接合相应的光学模块的头端部分,每个所述头端部分在完成组装操作时被牢固地固定在相应的凹槽内。
2.如权利要求1所述的光学子组件,其中每个第一和第二光学模块包括从该光学模块的头端部分向外延伸的凸台,且在每个凹槽的底部形成相应的孔,所述孔用来在组装操作期间与相应的凸台接合。
3.如权利要求2所述的光学子组件,其中凸台包括形成圆锥角的截断圆锥形状,且每个孔包括一个埋头孔,所述埋头孔具有与圆锥角相匹配的角度。
4.如权利要求1所述的光学子组件,其中每个第一和第二光学模块包括用来分别耦合到第一光缆和第二光缆的末端部分的相应的孔,用于瞄准从相应的光缆接收的或引导到相应的光缆的光的第一透镜,以及用于对准从光发射器接收的或引导到光检测器的光的第二透镜。
5.如权利要求4所述的光学子组件,其中每个第一和第二光学模块是由单块聚合物形成的。
6.如权利要求4所述的光学子组件,其中每个第一和第二光学模块的第一和第二透镜被放置成互相成90度,且每个光学模块还包括被填充以一种材料的凹槽,所述材料具有与制成光学模块的材料的折射率不同的折射率,并确定一反射面,从而由第一和第二透镜中的一个透镜接收的光被重新引导向另一个透镜。
7.如权利要求6所述的光学子组件,其中每个第一和第二光学模块还包括相应的帽,所述帽覆盖相应的光学模块的凹槽,以防止杂质进入该相应的凹槽。
8.如权利要求1所述的光学子组件,其中光发射器包括垂直腔表面发射激光器。
9.如权利要求1所述的光学子组件,其中第一光学模块相对于光检测器被放置成使得从第一光缆接收的最大量的光被引导向光检测器。
10.如权利要求9所述的光学子组件,其中第一光学模块通过采用有效对准过程相对于光检测器被放置,其中第一光学模块与光检测器之间的对准被调节,直至在光检测器处检测到最大信号为止,此时对准被牢固地固定。
11.如权利要求1所述的光学子组件,其中第二光学模块相对于光发射器被放置成使得由光发射器产生的最大量的光被第二光缆接收。
12.如权利要求11所述的光学子组件,其中第二光学模块通过采用有效对准过程相对于光发射器被放置,其中第二光学模块与光发射器之间的对准被调节,直至在第二光缆处检测到最大信号为止,此时对准被牢固地固定。
13.如权利要求1所述的光学子组件,其中基板还包括多个焊料凸起,用于连接到外部的部件,外部的部件的一部分被电耦合到光发射器和光检测器。
14.如权利要求1所述的光学子组件,其中支座还包括沿着它的两个凹槽的侧壁放置的屏蔽,用于防止传输通过第一和第二光学模块的头端部分的光信号之间的串扰。
15.如权利要求1所述的光学子组件,还包括被安装在基板上的放大器,所述放大器接收由光检测器输出的光检测信号;以及被安装在基板上的功率监视器,所述功率监视器有效地控制提供到光发射器的功率水平。
16.组装用于高带宽的收发器的光学子组件的方法,包括:
把第一光学模块预对准光检测器,所述第一光学模块用来把从第一光缆接收的光光耦合到光检测器;
把第二光学模块预对准光发射器,所述第二光学模块用来把由光发射器产生的光光耦合到第二光缆;
把第一光学模块有效地对准光检测器,以产生第一最佳对准,其中由光检测器检测的信号被最大化;
把第二光学模块有效地对准光发射器,以产生第二最佳对准,其中由光发射器产生的信号被最大化;以及
牢固地固定第一和第二最佳对准。
17.如权利要求16所述的方法,还包括:
把粘结剂施加到第一和第二光学模块的一部分上;以及
使得粘结剂快速固化,以固定第一和第二最佳对准。
18.如权利要求16所述的方法,其中每个第一和第二光学模块被固定到支座,所述支座被安装在其上安装有光检测器和光发射器的基板上。
19.如权利要求18所述的方法,其中支座包括一对凹槽,所述凹槽用来在预对准处理期间滑动地接合第一和第二光学模块的头端部分,以使第一光学模块预对准光检测器和使第二光学模块预对准光发射器。
20.如权利要求19所述的方法,其中支座还包括在相应凹槽的底部形成的一对孔,且每个第一和第二光学模块包括从该光学模块向外延伸的凸台,还包括在预对准处理期间使每个光学模块的凸台与相应的孔配合。
21.如权利要求16所述的方法,其中第一光学模块的有效对准包括调节第一光学模块相对于光检测器的位置,直至在光检测器处检测到最大信号为止。
22.如权利要求16所述的方法,其中第二光学模块的有效对准包括调节第二光学模块相对于光发射器的位置,直至在第二光缆处检测到最大信号为止。
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