CN1237623C - 在衬底上成形晶体管的方法和含聚亚苯基聚酰亚胺的衬底 - Google Patents
在衬底上成形晶体管的方法和含聚亚苯基聚酰亚胺的衬底 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 230000008569 process Effects 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 229920001721 polyimide Polymers 0.000 claims abstract description 44
- 239000004642 Polyimide Substances 0.000 claims abstract description 38
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 238000000151 deposition Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 21
- 229920000265 Polyparaphenylene Polymers 0.000 claims abstract description 19
- -1 polyphenylene Polymers 0.000 claims abstract description 19
- 238000002161 passivation Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 13
- 230000008021 deposition Effects 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052710 silicon Inorganic materials 0.000 abstract description 12
- 239000010703 silicon Substances 0.000 abstract description 12
- 238000012545 processing Methods 0.000 abstract description 11
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229920001646 UPILEX Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- ZWVMLYRJXORSEP-LURJTMIESA-N (2s)-hexane-1,2,6-triol Chemical compound OCCCC[C@H](O)CO ZWVMLYRJXORSEP-LURJTMIESA-N 0.000 description 1
- 206010019332 Heat exhaustion Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000010339 dilation Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
Abstract
通过在包含聚亚苯基聚酰亚胺的衬底上沉积至少一个半导体材料层来制造晶体管。该衬底允许在用于成形该晶体管的过程中采用超过300℃的加工温度，从而能够制成高质量硅半导体层。该衬底还具有低热膨胀系数，与硅的膨胀系数密切匹配，从而可减少任何硅层龟裂或脱层的倾向。
Description
技术领域
本发明涉及一种制造薄膜晶体管的方法。
薄膜晶体管(TFT)已知在，特别是，控制各种类型显示器方面有用；例如，TFT被普遍用来控制便携式电脑和类似电子装置中使用的液晶显示器。TFT还可用来控制电泳显示器；例如参见WO-A-00/67327；WO-A-01/08241；WO-A-01/170209；WO-A-01/17040；和WO-A-01/17041。在此，所有这些申请的公开内容均收作参考。
虽然大多数TFT迄今一直是在刚性衬底上制造的，然而对在柔性衬底，尤其是在柔性聚合物薄膜上制造TFT的兴趣正与日俱增。在此种柔性衬底上制造的TFT可构成既轻又结实的大显示器的基础，因而使它们得以用在移动装置中。基于无定形硅半导体的TFT由于能以最少的工艺步骤制造并且热量消耗低，故用于此种柔性衬底颇受青睐。无定形硅晶体管是在超薄不锈钢衬底(例如参见Ma等人，《应用物理通讯》74(18)，2661(1999))上和在聚酰亚胺薄膜(参见Gleskova等人，《IEEE电子器件通讯》20(9)，473(1999))上制造的。
然而，后一篇文章所描述的方法使用的聚酰亚胺，以商品名“Kapton”市售供应，仅具有约300℃的玻璃化转变温度，这就限制了制造过程中能够采用的温度，并因而生产出不甚令人满意的无定形硅半导体层。此种聚酰亚胺还具有高吸湿(约4wt％)的特性，而此种高吸湿又可造成衬底的溶胀以及随之而来在衬底上沉积的薄层的龟裂或薄层从衬底上的剥离。虽然不锈钢衬底能够耐受远高于300℃的温度，但此种衬底要求在其上制造晶体管之前进行钝化和平面化的步骤。要求钝化为的是保证准备在衬底上形成的邻接金属导体之间有恰当的电气绝缘，以及保证不锈钢中潜在杂质不会扩散到晶体管中。不过，不锈钢衬底却又具有高尺寸稳定性和在制造环境中容易操作的优点。
现已发现，某些类型聚酰亚胺具有使其非常适合在TFT制造中作为使用。
因此，本发明提供一种通过在衬底上沉积至少一层半导体材料从而在该衬底上成形至少一个晶体管的方法。在本发明方法中，衬底包含聚亚苯基聚酰亚胺。该方法尤其预期用于成形无定形硅晶体管，而在此种情况下，半导体材料当然是一种无定形硅。
本发明还提供在包含聚亚苯基聚酰亚胺的衬底上成形的晶体管，该衬底载有至少一个晶体管。
唯一的附图是按本发明方法在聚酰亚胺衬底上成形的薄膜晶体管阵列的一个晶体管的剖面示意图。
优选用于本发明方法中的聚亚苯基聚酰亚胺是由UBE(美国)公司(55 East 59th Street，18th Floor，纽约NY 10022，美国)以商品名Upilex-S和Upilex-VT市售供应的那些。这两种材料据制造商称，具有通式：
其中R是亚烷基基团。此种聚酰亚胺是联苯-3，3’，4，4’-四羧酸与α，ω-链烷二胺如1，6-己二胺(正式地称己烷-1，6-二胺)的衍生物。这两种材料之间的主要区别在于，Upilex-S是简单聚酰亚胺薄膜，而Upilex-VT是一侧表面经过了处理，以促使薄膜不用粘合剂，仅靠热就能层合到陶瓷或金属箔上。为达到本发明的目的，Upilex VT可层合到不锈钢背衬薄膜上。另一种优选用于本发明方法中的聚酰亚胺是Upilex-50SS，得自同一制造商。
聚亚苯基聚酰亚胺具有比此前用作晶体管衬底的其他聚酰亚胺高得多的玻璃化转变温度和低得多的吸水性。上面已经提到的市售Upilex材料具有超过400℃的玻璃化转变温度和不超过约1.4％的吸水性。这样高的玻璃化转变温度允许在制造过程中采用比此前作为晶体管衬底使用的聚酰亚胺迄今可能达到的温度更高的温度(大于约300℃，优选大于约400℃)，而此种更高的加工温度将生产出具有较高可移动性和较低超限漏电流的较高品质硅层。聚亚苯基聚酰亚胺在加工期间还具有高尺寸稳定性和表面光滑的优点，这对于薄膜晶体管成形中使用的薄层材料的沉积至关重要；例如，上面提到的Upilex-50SS具有约0.01％的尺寸稳定性和约20～30nm的平均表面粗糙度。聚亚苯基聚酰亚胺的另一个优点是它们的低热膨胀系数，典型值为约2～10×10-6℃-1，相比之下此前使用的聚酰亚胺的典型值为35×10-6℃-1。鉴于硅的热膨胀系数为约3×10-6℃-1，聚亚苯基聚酰亚胺衬底的系数与沉积在其上的硅层匹配密切得多，因此硅层龟裂和/或脱层的倾向低得多。
聚亚苯基聚酰亚胺衬底的上述性能使得本发明方法能很好地适应卷材到卷材的加工，其中半导体材料的沉积是在聚酰亚胺衬底的连续片材上进行的。
上面已经提到，本发明方法中使用的聚亚苯基聚酰亚胺在其准备沉积半导体材料的相反一面可以具有，也可以不具有金属背衬层。此种金属背衬层对提高晶体管制造过程中薄膜的机械整体性有用，从而避免，例如，操作期间聚酰亚胺薄膜拉长或畸变的任何倾向，减少在衬底上成形晶体管期间衬底的畸变。另外，金属背衬层还可起到挡光的作用，以减少任何由聚酰亚胺薄膜背面入射的光在半导体材料中造成的不希望的光效应(例如，在无定形硅膜中的光生电流)。金属背衬层不必是连续的；该层可具有贯通层的孔，以降低挺度并从而赋予带金属背衬的衬底以更高的柔性。倘若设有此种孔，出于显而易见的原因较好的是，它们可成形为一种规则图形，相应地，某些或全部孔可用于衬底与制造过程所用设备之间的机械套准。的确，在某些情况下，图形金属背衬层可作为荫罩用于在衬底上成形晶体管期间的光刻胶曝光图案成形步骤中。替代或附加地，可能有利的是，在聚酰亚胺本身中加入染料以阻止或消除此种不希望的光效应。
如同在某些现有技术方法中那样，可能较好的是，在向此种衬底上沉积晶体管之前先在衬底上沉积一种二氧化硅、氮化铝、氮化硅或其他材料的钝化层。就典型而言，此种钝化层的厚度可介于约20～约100nm。钝化不仅对提高聚酰亚胺表面的表面电阻，从而增加连接导体之间的电气绝缘有用，而且通过防止衬底在加工期间吸水还能提高衬底的尺寸稳定性，而为达到后一目的，较好的是，在衬底两个表面都设置钝化层。较好的还有，对衬底进行热处理(“烘烤”)以便在钝化层沉积之前从衬底中除掉水分；此种烘烤通常在至少约150℃的温度持续至少约1分钟的时间，优选约3分钟。
可能有利的还有，对钝化的衬底实施后烘烤。按照Philips研究实验室题为“聚合物衬底上的AMLCD和电子学”(《欧洲显示器)1996)的文章，在275℃加热10小时后自由放置的聚酰亚胺薄膜的收缩率可降低2个数量级，而在同样温度下100小时后降低2.4个数量级。在该文章中描述的一个具体实验中，275℃下烘烤100小时后，聚酰亚胺薄膜(未指出品牌)收缩了3ppm h-1。据此，若要求对钝化衬底实施此种后烘烤，它应在至少250℃的温度持续至少5小时的时间。尚未在实验中确定上述结果是否适用于张紧卷材形式中的衬底，也未在实验中确定降低收缩是否在预烘烤的衬底在经过冷却、退绕、为在其上成形晶体管所需要的加工、张力下再成卷以及随后预热几天之后，也如同在卷材到卷材加工中在衬底上成形晶体管那样必要。替代地，衬底可在临实施成形晶体管所要求的层沉积之前在传送带烘炉中进行预烘烤。
然而，聚亚苯基聚酰亚胺的表面电阻却是如此之高(典型值大于1016Ω)，以致在许多情况下，有可能在相邻导体之间不需要此种钝化层便能获得足够的电气绝缘。若省略钝化层，在衬底上沉积半导体层之前烘烤衬底以赶出水分和任何其他吸收在聚酰亚胺上的挥发性材料，仍然是有利的，因为这样可降低聚酰亚胺因吸水造成的溶胀并可提高在聚酰亚胺上成形晶体管期间聚酰亚胺的尺寸稳定性。此种烘烤较好在大于250℃的温度持续至少1小时的时间。在下面描述的一种优选实施方案中，衬底加热到接近其玻璃化转变温度的350℃，并持续4小时。
下面描述的本发明目前优选实施方案采用倒相晶体管设计，其中门(或栅)电极紧靠衬底布置。为成形此种倒相晶体管，第一步(按所描述的方式完成对衬底的任何可能钝化和/或预烘烤之后)是在衬底上沉积金属层。为此目的，优选的金属是铬。在沉积半导体材料以便形成要成形的晶体管阵列的门电极和选通线之前，通常优选将铬或其他金属沉积为连续膜，典型厚度介于50～200nm，然后使金属膜图形化，典型方法采用传统光刻技术。方法的下一个步骤通常是介电材料的沉积，例如氮化硅；此种沉积可通过等离子增强的化学气相沉积而方便地完成。随后成形半导体材料，优选无定形硅，依然方便地采用等离子增强的化学气相沉积。如同在上面提到的WO-A-00/67327中所讨论的，在一种适当设计中，无定形硅层(以及相联系的介电层)可保持为非图形的，因此该无定形硅层连续延伸在一对相邻晶体管之间。接着，在该无定形硅上沉积n-型硅层，同样，方便地采用等离子增强的化学气相沉积。最后，通常在清洗步骤以除掉化学气相沉积过程留下的残余物之后，在n-型硅层上沉积金属层，例如，铝层，该金属层仍可方便地采用热蒸发来沉积。随后，该金属层通过传统光刻技术转化为图形，以便形成源和漏电极，然后该图形化的金属层被用作n-型硅层的反应离子腐蚀用的腐蚀掩模；用四氟化碳/氧气混合物进行腐蚀，据发现令人满意。
下面将结合附图详细描述本发明优选的实施方案，然而仅作为举例说明而已，图中显示按本发明方法在聚亚苯基聚酰亚胺衬底上成形的一个晶体管的断面示意图。
该附图显示在聚亚苯基聚酰亚胺衬底12上成形的晶体管阵列(总称为10)的一个晶体管。图中画出的衬底12备有不锈钢金属背衬层14，沿整个背衬按规则间隔分布着通孔16，在图中仅画出一个。如同上面已经提到的，金属背衬层14的存在在本发明方法中是任选的，尽管此种金属背衬层的确给衬底提供额外的机械整体性，并因此便于衬底的操作，尤其当本发明在卷材到卷材的涂布设备上实施时。
在衬底12的上表面上(如图所示)，沉积着由二氧化硅或氮化硅形成的钝化层18。如上所述，此种钝化层18的存在是任选的，而在某些情况下，钝化层18可以省略，因为聚亚苯基聚酰亚胺的高表面电阻在相邻晶体管之间已提供足够绝缘。然而，在省掉钝化层18时须小心，因为倘若不存在这一层，则从聚酰亚胺衬底12排出的气体往往会导致各种各样层与该衬底的脱层。
在钝化层18的上表面，沉积着按一定间隔排列的金属门电极的阵列20(图中仅看到一个门电极)，而在电极20的上面顺序地沉积着由氮化硅形成的介电层22和无定形硅的层24。如上面提到的WO-A-00/67327所讨论的，介电层22和无定形硅层24可保持为非图形的，因此不必使这些层图形化，从而大大降低了晶体管阵列的制造成本。最后，该晶体管阵列包含n-型硅的层26和金属电极层28；这两个层采用任何传统方法转化为图形以提供晶体管的源和漏电极。
本发明第二优选实施方案大体类似于上面所描述的方案，只是使用了不带金属背衬或钝化层的聚酰亚胺衬底。在该第二优选实施方案中，上述Upilex-50SS首先在350℃烘烤4小时以去掉水分和任何其他存在的溶剂。一个100nm厚的铬层通过热蒸发沉积在烘烤的衬底上，然后光刻成图形，从而形成最终晶体管阵列的门电极和选通线。接着，通过等离子增强的化学气相沉积(PECVD)使用硅烷/氨混合物在衬底上沉积320nm氮化硅介电层；在此沉积期间，衬底达到其最高加工温度350℃。然后，通过PECVD由纯硅烷沉积160nm无定形硅半导体材料层，随后通过PECVD由硅烷/膦混合物沉积40nm n-型无定形硅层。
在这些PECVD步骤后，在衬底上沉积铝层，并通过光刻成形为图形，于是形成晶体管阵列的源和漏电极。随后，衬底利用四氟化碳/氧气混合物接受反应性离子腐蚀，以图形状铝层作为腐蚀掩模使n-型硅层图形化。最后，采用低分辨率成图步骤使无定形硅和氮化硅层图形化，从而制成与选通粘合线部位的电气接触。
如此制造的薄膜晶体管可直接用于制造电泳显示器或其他类型显示器，而不需要进一步加工。例如，附图所述薄膜晶体管阵列可通过WO-A-00/36465所描述的方法结合到电泳显示器中；在此将该共同未决申请的整个公开内容收作参考。在某些情况下，较好的是提供一种覆盖薄膜晶体管的阻挡层以保护晶体管免遭溶剂或往往会从电泳显示器中扩散出来的其他材料的侵害。
按本发明方法生产的薄膜晶体管阵列尤其准备用于电泳显示器中，特别是封装电泳显示器，如以下文献中描述的那些：美国专利5,930,026；5,961,804；6,017,584；6,067,185；6,118,426；6,120,588；6,120,839；6,124,851；6,130,773；6,130,774；和6,172,798，以及国际申请公开WO 97/04398；WO 98/03896；WO98/19208；WO 98/41898；WO 98/41899；WO 99/10769；WO 99/10768；WO99/10767；WO 99/53373；WO 99/56171；WO 99/59101；WO 99/47970；WO00/03349；WO 00/03291；WO 99/67678；WO 00/05704；WO 99/53371；WO00/20921；WO 00/20922；WO 00/20923；WO 00/26761；WO 00/36465；WO00/38000；WO 00/38001；WO 00/36560；WO 00/20922；WO 00/36666；WO00/59625；WO 00/67110；WO 00/67327和WO 01/02899.在此，所有这些专利和公开的申请的全部公开内容一并收作参考。
在不偏离本发明精神和技术的前提下，从已给出的本发明方法的优选实施方案中可制定出许许多多修改和变化。例如，本发明不限于如附图所示的下门电极晶体管的制造，该方法也可用于上门电极晶体管的制造，其中首先在衬底上制造源和漏电极(带或不带钝化层)，然后在电极上面成形无定形硅层和介电层，最后成形门电极作为结构的顶层。可见，上面的描述应视为说明性的，而不是限制性的。
综上所述，可以看出，本发明方法提供一种在柔性衬底上成形晶体管的方法，它允许使用比现有技术方法高的加工温度，因此它能生产出比现有技术方法质量高的半导体层。本发明方法中使用的衬底的热膨胀系数与大多数半导体层的热膨胀系数最接近匹配，因此可减少因该层与衬底之间热膨胀差异造成半导体层龟裂和/或脱层的危险。本发明提供一种能很好地适应卷材到卷材操作的方法，因此本发明方法非常适合在柔性衬底上制造大面积晶体管阵列。
Claims (15)
1.一种在衬底(12)上成形至少一个晶体管(10)的方法，该方法包括在衬底(12)上沉积至少一层半导体材料(24，26)，其特征在于，衬底(12)包含聚亚苯基聚酰亚胺，该聚亚苯基聚酰亚胺是联苯-3，3’，4，4’-四羧酸的衍生物。
2.按照权利要求1的方法，其特征在于，该聚酰亚胺是联苯-3，3’，4，4’-四羧酸与α，ω-链烷二胺的衍生物。
3.按照权利要求1中的方法，其特征在于，在半导体材料(24，26)沉积到衬底(12)上之前，在衬底(12)的一个或两个表面沉积钝化层(18)。
4.按照权利要求3的方法，其特征在于，钝化层(18)包含二氧化硅或氮化铝，和/或厚度介于20～100nm。
5.按照权利要求3的方法，其特征在于，衬底(12)在沉积钝化层(18)之前在高于150℃的温度加热至少1分钟的时间.
6.按照权利要求3的方法，其特征在于，衬底(12)在沉积了钝化层(18)之后在高于250℃的温度加热至少5小时的时间。
7.按照权利要求1的方法，其特征在于，衬底(12)在沉积半导体材料(24，26)之前在高于250℃的温度加热至少1小时的时间。
8.按照权利要求1的方法，其特征在于，衬底(12)包含位于其远离半导体材料(24，26)的一面上的金属层(14)。
9.按照权利要求8的方法，其特征在于，金属层(14)具有通孔(16)。
10.按照权利要求1的方法，其特征在于，半导体材料(24)的沉积是在超过300℃的温度进行的。
11.按照权利要求1的方法，其特征在于，半导体材料(24)包含无定形硅。
12.按照权利要求11的方法，其特征在于，无定形硅未制成图形，因此它连续地延伸在至少某些相邻晶体管对之间。
13.按照权利要求1的方法，其特征在于，半导体材料(24，26)的沉积是在衬底(12)的连续片材上进行的。
14.一种包含聚亚苯基聚酰亚胺的衬底(12)，该衬底载有至少一个晶体管(10)，该聚亚苯基聚酰亚胺是联苯-3，3’，4，4’-四羧酸的衍生物。
15.权利要求14的衬底，其特征在于具有权利要求1～13中任一项规定的任何一个或多个特征。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19773100P | 2000-04-18 | 2000-04-18 | |
| US60/197,731 | 2000-04-18 |
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| Publication Number | Publication Date |
|---|---|
| CN1441967A CN1441967A (zh) | 2003-09-10 |
| CN1237623C true CN1237623C (zh) | 2006-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB018081681A Expired - Fee Related CN1237623C (zh) | 2000-04-18 | 2001-04-17 | 在衬底上成形晶体管的方法和含聚亚苯基聚酰亚胺的衬底 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6825068B2 (zh) |
| EP (1) | EP1275156B1 (zh) |
| JP (1) | JP2003531487A (zh) |
| KR (1) | KR100767233B1 (zh) |
| CN (1) | CN1237623C (zh) |
| AT (1) | ATE438927T1 (zh) |
| AU (1) | AU2001253575A1 (zh) |
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| WO (1) | WO2001080287A2 (zh) |
Families Citing this family (197)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7259744B2 (en) | 1995-07-20 | 2007-08-21 | E Ink Corporation | Dielectrophoretic displays |
| US7999787B2 (en) | 1995-07-20 | 2011-08-16 | E Ink Corporation | Methods for driving electrophoretic displays using dielectrophoretic forces |
| US8139050B2 (en) | 1995-07-20 | 2012-03-20 | E Ink Corporation | Addressing schemes for electronic displays |
| US6866760B2 (en) * | 1998-08-27 | 2005-03-15 | E Ink Corporation | Electrophoretic medium and process for the production thereof |
| US7848006B2 (en) | 1995-07-20 | 2010-12-07 | E Ink Corporation | Electrophoretic displays with controlled amounts of pigment |
| US7583251B2 (en) | 1995-07-20 | 2009-09-01 | E Ink Corporation | Dielectrophoretic displays |
| US7193625B2 (en) | 1999-04-30 | 2007-03-20 | E Ink Corporation | Methods for driving electro-optic displays, and apparatus for use therein |
| US7327511B2 (en) * | 2004-03-23 | 2008-02-05 | E Ink Corporation | Light modulators |
| US7411719B2 (en) | 1995-07-20 | 2008-08-12 | E Ink Corporation | Electrophoretic medium and process for the production thereof |
| US8040594B2 (en) | 1997-08-28 | 2011-10-18 | E Ink Corporation | Multi-color electrophoretic displays |
| US20020113770A1 (en) | 1998-07-08 | 2002-08-22 | Joseph M. Jacobson | Methods for achieving improved color in microencapsulated electrophoretic devices |
| US7119772B2 (en) | 1999-04-30 | 2006-10-10 | E Ink Corporation | Methods for driving bistable electro-optic displays, and apparatus for use therein |
| US7012600B2 (en) * | 1999-04-30 | 2006-03-14 | E Ink Corporation | Methods for driving bistable electro-optic displays, and apparatus for use therein |
| US7119759B2 (en) * | 1999-05-03 | 2006-10-10 | E Ink Corporation | Machine-readable displays |
| US8115729B2 (en) | 1999-05-03 | 2012-02-14 | E Ink Corporation | Electrophoretic display element with filler particles |
| US8009348B2 (en) | 1999-05-03 | 2011-08-30 | E Ink Corporation | Machine-readable displays |
| US7893435B2 (en) | 2000-04-18 | 2011-02-22 | E Ink Corporation | Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough |
| US6816147B2 (en) | 2000-08-17 | 2004-11-09 | E Ink Corporation | Bistable electro-optic display, and method for addressing same |
| KR100586241B1 (ko) * | 2000-10-28 | 2006-06-02 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 어레이기판 및 제조방법 |
| AU2002230610A1 (en) * | 2000-12-05 | 2002-06-18 | E-Ink Corporation | Portable eclectronic apparatus with additional electro-optical display |
| JP4198999B2 (ja) * | 2001-03-13 | 2008-12-17 | イー インク コーポレイション | 図面を表示するための装置 |
| US20050156340A1 (en) | 2004-01-20 | 2005-07-21 | E Ink Corporation | Preparation of capsules |
| EP1666964B1 (en) * | 2001-04-02 | 2018-12-19 | E Ink Corporation | Electrophoretic medium with improved image stability |
| US8390918B2 (en) | 2001-04-02 | 2013-03-05 | E Ink Corporation | Electrophoretic displays with controlled amounts of pigment |
| US7679814B2 (en) | 2001-04-02 | 2010-03-16 | E Ink Corporation | Materials for use in electrophoretic displays |
| US6870661B2 (en) * | 2001-05-15 | 2005-03-22 | E Ink Corporation | Electrophoretic displays containing magnetic particles |
| WO2002093246A1 (en) | 2001-05-15 | 2002-11-21 | E Ink Corporation | Electrophoretic particles |
| US6982178B2 (en) | 2002-06-10 | 2006-01-03 | E Ink Corporation | Components and methods for use in electro-optic displays |
| ATE349028T1 (de) * | 2001-07-09 | 2007-01-15 | E Ink Corp | Elektrooptische anzeige und kleberzusammensetzung |
| US7535624B2 (en) * | 2001-07-09 | 2009-05-19 | E Ink Corporation | Electro-optic display and materials for use therein |
| AU2002354672A1 (en) * | 2001-07-09 | 2003-01-29 | E Ink Corporation | Electro-optical display having a lamination adhesive layer |
| US6819471B2 (en) * | 2001-08-16 | 2004-11-16 | E Ink Corporation | Light modulation by frustration of total internal reflection |
| US6825970B2 (en) * | 2001-09-14 | 2004-11-30 | E Ink Corporation | Methods for addressing electro-optic materials |
| JP2003168800A (ja) * | 2001-11-30 | 2003-06-13 | Mitsubishi Gas Chem Co Inc | 薄膜トランジスタ基板 |
| JP3631992B2 (ja) * | 2001-11-13 | 2005-03-23 | 日東電工株式会社 | 配線回路基板 |
| US8593396B2 (en) | 2001-11-20 | 2013-11-26 | E Ink Corporation | Methods and apparatus for driving electro-optic displays |
| US7952557B2 (en) | 2001-11-20 | 2011-05-31 | E Ink Corporation | Methods and apparatus for driving electro-optic displays |
| US9412314B2 (en) | 2001-11-20 | 2016-08-09 | E Ink Corporation | Methods for driving electro-optic displays |
| US8558783B2 (en) | 2001-11-20 | 2013-10-15 | E Ink Corporation | Electro-optic displays with reduced remnant voltage |
| US9530363B2 (en) | 2001-11-20 | 2016-12-27 | E Ink Corporation | Methods and apparatus for driving electro-optic displays |
| US8125501B2 (en) | 2001-11-20 | 2012-02-28 | E Ink Corporation | Voltage modulated driver circuits for electro-optic displays |
| JP4615860B2 (ja) | 2001-11-20 | 2011-01-19 | イー インク コーポレイション | マルチ−ステイブル電子光学ディスプレイの駆動方法、デバイスコントローラ及びマルチ−ステイブル電子光学ディスプレイ |
| US6885032B2 (en) | 2001-11-21 | 2005-04-26 | Visible Tech-Knowledgy, Inc. | Display assembly having flexible transistors on a flexible substrate |
| US6885146B2 (en) | 2002-03-14 | 2005-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising substrates, contrast medium and barrier layers between contrast medium and each of substrates |
| US6950220B2 (en) * | 2002-03-18 | 2005-09-27 | E Ink Corporation | Electro-optic displays, and methods for driving same |
| US7223672B2 (en) | 2002-04-24 | 2007-05-29 | E Ink Corporation | Processes for forming backplanes for electro-optic displays |
| US7190008B2 (en) | 2002-04-24 | 2007-03-13 | E Ink Corporation | Electro-optic displays, and components for use therein |
| US9470950B2 (en) | 2002-06-10 | 2016-10-18 | E Ink Corporation | Electro-optic displays, and processes for the production thereof |
| US7110164B2 (en) * | 2002-06-10 | 2006-09-19 | E Ink Corporation | Electro-optic displays, and processes for the production thereof |
| US8049947B2 (en) | 2002-06-10 | 2011-11-01 | E Ink Corporation | Components and methods for use in electro-optic displays |
| US7554712B2 (en) | 2005-06-23 | 2009-06-30 | E Ink Corporation | Edge seals for, and processes for assembly of, electro-optic displays |
| US7649674B2 (en) | 2002-06-10 | 2010-01-19 | E Ink Corporation | Electro-optic display with edge seal |
| US7843621B2 (en) | 2002-06-10 | 2010-11-30 | E Ink Corporation | Components and testing methods for use in the production of electro-optic displays |
| US8363299B2 (en) | 2002-06-10 | 2013-01-29 | E Ink Corporation | Electro-optic displays, and processes for the production thereof |
| US20080024482A1 (en) | 2002-06-13 | 2008-01-31 | E Ink Corporation | Methods for driving electro-optic displays |
| US20110199671A1 (en) * | 2002-06-13 | 2011-08-18 | E Ink Corporation | Methods for driving electrophoretic displays using dielectrophoretic forces |
| CN101373581B (zh) | 2002-06-13 | 2014-07-16 | 伊英克公司 | 具有多个像素的电光显示器 |
| US7839564B2 (en) | 2002-09-03 | 2010-11-23 | E Ink Corporation | Components and methods for use in electro-optic displays |
| JP2005537519A (ja) | 2002-09-03 | 2005-12-08 | イー−インク コーポレイション | 電気光学ディスプレイ |
| WO2004023202A1 (en) | 2002-09-03 | 2004-03-18 | E Ink Corporation | Electrophoretic medium with gaseous suspending fluid |
| US20130063333A1 (en) | 2002-10-16 | 2013-03-14 | E Ink Corporation | Electrophoretic displays |
| KR100985418B1 (ko) * | 2002-11-26 | 2010-10-05 | 이 잉크 코포레이션 | 가요성 전자 회로 및 디스플레이 |
| US20170052422A1 (en) * | 2002-11-26 | 2017-02-23 | E Ink Corporation | Flexible electronic circuits and displays |
| CN101118362A (zh) | 2002-12-16 | 2008-02-06 | 伊英克公司 | 电光显示器的底板 |
| US6922276B2 (en) | 2002-12-23 | 2005-07-26 | E Ink Corporation | Flexible electro-optic displays |
| US6987603B2 (en) | 2003-01-31 | 2006-01-17 | E Ink Corporation | Construction of electrophoretic displays |
| US7910175B2 (en) | 2003-03-25 | 2011-03-22 | E Ink Corporation | Processes for the production of electrophoretic displays |
| US7339715B2 (en) | 2003-03-25 | 2008-03-04 | E Ink Corporation | Processes for the production of electrophoretic displays |
| ATE485535T1 (de) | 2003-03-27 | 2010-11-15 | E Ink Corp | Elektrooptische baugruppen |
| US10726798B2 (en) | 2003-03-31 | 2020-07-28 | E Ink Corporation | Methods for operating electro-optic displays |
| JP4921163B2 (ja) * | 2003-05-06 | 2012-04-25 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 切替え可能素子における駆動電圧の低減 |
| EP1639574B1 (en) | 2003-06-30 | 2015-04-22 | E Ink Corporation | Methods for driving electro-optic displays |
| US8174490B2 (en) | 2003-06-30 | 2012-05-08 | E Ink Corporation | Methods for driving electrophoretic displays |
| WO2005010598A2 (en) | 2003-07-24 | 2005-02-03 | E Ink Corporation | Electro-optic displays |
| WO2005020199A2 (en) * | 2003-08-19 | 2005-03-03 | E Ink Corporation | Methods for controlling electro-optic displays |
| EP1665214A4 (en) | 2003-09-19 | 2008-03-19 | E Ink Corp | METHOD FOR REDUCING EDGE EFFECTS IN DISPLAYS |
| ATE405916T1 (de) * | 2003-10-08 | 2008-09-15 | E Ink Corp | Elektro-benetzungs-displays |
| US8319759B2 (en) | 2003-10-08 | 2012-11-27 | E Ink Corporation | Electrowetting displays |
| US7551346B2 (en) | 2003-11-05 | 2009-06-23 | E Ink Corporation | Electro-optic displays, and materials for use therein |
| EP1680774B9 (en) | 2003-11-05 | 2018-05-16 | E Ink Corporation | Electrophoretic medium for electro-optic displays |
| US7672040B2 (en) | 2003-11-05 | 2010-03-02 | E Ink Corporation | Electro-optic displays, and materials for use therein |
| US8177942B2 (en) | 2003-11-05 | 2012-05-15 | E Ink Corporation | Electro-optic displays, and materials for use therein |
| US20110164301A1 (en) | 2003-11-05 | 2011-07-07 | E Ink Corporation | Electro-optic displays, and materials for use therein |
| US8928562B2 (en) | 2003-11-25 | 2015-01-06 | E Ink Corporation | Electro-optic displays, and methods for driving same |
| US7206119B2 (en) | 2003-12-31 | 2007-04-17 | E Ink Corporation | Electro-optic displays, and method for driving same |
| US7075703B2 (en) | 2004-01-16 | 2006-07-11 | E Ink Corporation | Process for sealing electro-optic displays |
| US7388572B2 (en) * | 2004-02-27 | 2008-06-17 | E Ink Corporation | Backplanes for electro-optic displays |
| US7492339B2 (en) * | 2004-03-26 | 2009-02-17 | E Ink Corporation | Methods for driving bistable electro-optic displays |
| US8289250B2 (en) | 2004-03-31 | 2012-10-16 | E Ink Corporation | Methods for driving electro-optic displays |
| US20050253777A1 (en) * | 2004-05-12 | 2005-11-17 | E Ink Corporation | Tiled displays and methods for driving same |
| JP2006003775A (ja) * | 2004-06-21 | 2006-01-05 | Hitachi Metals Ltd | ディスプレイ用基板 |
| KR100626007B1 (ko) * | 2004-06-30 | 2006-09-20 | 삼성에스디아이 주식회사 | 박막 트랜지스터, 상기 박막 트랜지스터의 제조방법, 이박막 트랜지스터를 구비한 평판표시장치, 및 이평판표시장치의 제조방법 |
| US20080136774A1 (en) | 2004-07-27 | 2008-06-12 | E Ink Corporation | Methods for driving electrophoretic displays using dielectrophoretic forces |
| US11250794B2 (en) | 2004-07-27 | 2022-02-15 | E Ink Corporation | Methods for driving electrophoretic displays using dielectrophoretic forces |
| WO2006015044A1 (en) | 2004-07-27 | 2006-02-09 | E Ink Corporation | Electro-optic displays |
| US7259106B2 (en) * | 2004-09-10 | 2007-08-21 | Versatilis Llc | Method of making a microelectronic and/or optoelectronic circuitry sheet |
| TWI253759B (en) * | 2004-11-22 | 2006-04-21 | Au Optronics Corp | Method and apparatus for forming thin film transistor |
| JP2008521065A (ja) | 2005-01-26 | 2008-06-19 | イー インク コーポレイション | ガス状流体を用いる電気泳動ディスプレイ |
| US8576162B2 (en) * | 2005-03-14 | 2013-11-05 | Sipix Imaging, Inc. | Manufacturing processes of backplane for segment displays |
| US8357616B2 (en) * | 2005-04-14 | 2013-01-22 | President And Fellows Of Harvard College | Adjustable solubility in sacrificial layers for microfabrication |
| US20080043318A1 (en) | 2005-10-18 | 2008-02-21 | E Ink Corporation | Color electro-optic displays, and processes for the production thereof |
| KR101269304B1 (ko) | 2005-10-18 | 2013-05-29 | 이 잉크 코포레이션 | 전기-광학 디스플레이용 컴포넌트 |
| US20070091417A1 (en) * | 2005-10-25 | 2007-04-26 | E Ink Corporation | Electrophoretic media and displays with improved binder |
| US7621794B2 (en) * | 2005-11-09 | 2009-11-24 | International Display Systems, Inc. | Method of encapsulating an organic light-emitting device |
| US8390301B2 (en) | 2006-03-08 | 2013-03-05 | E Ink Corporation | Electro-optic displays, and materials and methods for production thereof |
| US7843624B2 (en) | 2006-03-08 | 2010-11-30 | E Ink Corporation | Electro-optic displays, and materials and methods for production thereof |
| TWI350793B (en) | 2006-03-08 | 2011-10-21 | E Ink Corp | Methods for production of electro-optic displays |
| US8610988B2 (en) | 2006-03-09 | 2013-12-17 | E Ink Corporation | Electro-optic display with edge seal |
| US7952790B2 (en) | 2006-03-22 | 2011-05-31 | E Ink Corporation | Electro-optic media produced using ink jet printing |
| US7903319B2 (en) | 2006-07-11 | 2011-03-08 | E Ink Corporation | Electrophoretic medium and display with improved image stability |
| US8018640B2 (en) | 2006-07-13 | 2011-09-13 | E Ink Corporation | Particles for use in electrophoretic displays |
| US7932548B2 (en) | 2006-07-14 | 2011-04-26 | 4D-S Pty Ltd. | Systems and methods for fabricating self-aligned memory cell |
| US20080024429A1 (en) * | 2006-07-25 | 2008-01-31 | E Ink Corporation | Electrophoretic displays using gaseous fluids |
| US7986450B2 (en) | 2006-09-22 | 2011-07-26 | E Ink Corporation | Electro-optic display and materials for use therein |
| US7477444B2 (en) | 2006-09-22 | 2009-01-13 | E Ink Corporation & Air Products And Chemical, Inc. | Electro-optic display and materials for use therein |
| US7649666B2 (en) | 2006-12-07 | 2010-01-19 | E Ink Corporation | Components and methods for use in electro-optic displays |
| TWI386313B (zh) | 2007-01-22 | 2013-02-21 | E Ink Corp | 用於光電顯示器之多層薄片 |
| US7688497B2 (en) | 2007-01-22 | 2010-03-30 | E Ink Corporation | Multi-layer sheet for use in electro-optic displays |
| US7826129B2 (en) | 2007-03-06 | 2010-11-02 | E Ink Corporation | Materials for use in electrophoretic displays |
| US10319313B2 (en) | 2007-05-21 | 2019-06-11 | E Ink Corporation | Methods for driving video electro-optic displays |
| US9199441B2 (en) | 2007-06-28 | 2015-12-01 | E Ink Corporation | Processes for the production of electro-optic displays, and color filters for use therein |
| WO2009006248A1 (en) | 2007-06-29 | 2009-01-08 | E Ink Corporation | Electro-optic displays, and materials and methods for production thereof |
| US8902153B2 (en) | 2007-08-03 | 2014-12-02 | E Ink Corporation | Electro-optic displays, and processes for their production |
| US20090122389A1 (en) | 2007-11-14 | 2009-05-14 | E Ink Corporation | Electro-optic assemblies, and adhesives and binders for use therein |
| WO2009117730A1 (en) | 2008-03-21 | 2009-09-24 | E Ink Corporation | Electro-optic displays and color filters |
| ES2823736T3 (es) | 2008-04-11 | 2021-05-10 | E Ink Corp | Procedimientos para excitar dispositivos de visualización electroópticos |
| JP5346078B2 (ja) * | 2008-05-20 | 2013-11-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 熱および寸法安定性ポリイミドフィルム、ならびに、これに関する方法 |
| EP2366270A4 (en) | 2008-12-02 | 2013-04-10 | Univ Arizona | PROCESS FOR PREPARING A SOFT SUBSTRATE AND SOFT SUBSTRATE THUS OBTAINED |
| US9991311B2 (en) | 2008-12-02 | 2018-06-05 | Arizona Board Of Regents On Behalf Of Arizona State University | Dual active layer semiconductor device and method of manufacturing the same |
| US9721825B2 (en) | 2008-12-02 | 2017-08-01 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Method of providing a flexible semiconductor device and flexible semiconductor device thereof |
| US9601530B2 (en) | 2008-12-02 | 2017-03-21 | Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Dual active layer semiconductor device and method of manufacturing the same |
| US20100159635A1 (en) * | 2008-12-24 | 2010-06-24 | Weyerhaeuser Company | Method of patterning conductive layer and devices made thereby |
| US8457013B2 (en) | 2009-01-13 | 2013-06-04 | Metrologic Instruments, Inc. | Wireless dual-function network device dynamically switching and reconfiguring from a wireless network router state of operation into a wireless network coordinator state of operation in a wireless communication network |
| US8234507B2 (en) | 2009-01-13 | 2012-07-31 | Metrologic Instruments, Inc. | Electronic-ink display device employing a power switching mechanism automatically responsive to predefined states of device configuration |
| TWI484273B (zh) | 2009-02-09 | 2015-05-11 | E Ink Corp | 電泳粒子 |
| US8098418B2 (en) | 2009-03-03 | 2012-01-17 | E. Ink Corporation | Electro-optic displays, and color filters for use therein |
| EP2436029A4 (en) | 2009-05-29 | 2013-04-10 | Univ Arizona | PROCESS FOR PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AT HIGH TEMPERATURES AND FLEXIBLE SEMICONDUCTOR DEVICE THEREFOR |
| CN104656977B (zh) | 2009-10-28 | 2018-01-26 | 伊英克公司 | 具有触摸传感器的电光显示器 |
| US8654436B1 (en) | 2009-10-30 | 2014-02-18 | E Ink Corporation | Particles for use in electrophoretic displays |
| JP2013511600A (ja) * | 2009-11-20 | 2013-04-04 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 薄膜トランジスタ組成物、およびそれに関連する方法 |
| US8319299B2 (en) * | 2009-11-20 | 2012-11-27 | Auman Brian C | Thin film transistor compositions, and methods relating thereto |
| KR101125567B1 (ko) * | 2009-12-24 | 2012-03-22 | 삼성모바일디스플레이주식회사 | 고분자 기판 및 그 제조 방법과 상기 고분자 기판을 포함하는 표시 장치 및 그 제조 방법 |
| US8446664B2 (en) | 2010-04-02 | 2013-05-21 | E Ink Corporation | Electrophoretic media, and materials for use therein |
| JP2011233858A (ja) * | 2010-04-09 | 2011-11-17 | Dainippon Printing Co Ltd | 薄膜素子用基板の製造方法、薄膜素子の製造方法、薄膜トランジスタの製造方法、薄膜素子、および薄膜トランジスタ |
| KR101793352B1 (ko) | 2010-04-09 | 2017-11-02 | 이 잉크 코포레이션 | 전기광학 디스플레이의 구동 방법 |
| WO2012021197A2 (en) | 2010-05-21 | 2012-02-16 | Arizona Board Of Regents, For And On Behalf Of Arizona State University | Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof |
| WO2012021196A2 (en) | 2010-05-21 | 2012-02-16 | Arizona Board Of Regents, For And On Behalf Of Arizona State University | Method for manufacturing electronic devices and electronic devices thereof |
| TWI484275B (zh) | 2010-05-21 | 2015-05-11 | E Ink Corp | 光電顯示器及其驅動方法、微型空腔電泳顯示器 |
| KR101101943B1 (ko) * | 2010-05-31 | 2012-01-02 | 한국철강 주식회사 | 태양전지용 기판의 열처리 방법 |
| US8383469B2 (en) * | 2011-01-07 | 2013-02-26 | Eastman Kodak Company | Producing transistor including reduced channel length |
| JP2012238687A (ja) * | 2011-05-11 | 2012-12-06 | Sony Corp | 半導体パッケージ、半導体装置の製造方法、および固体撮像装置 |
| US20130125910A1 (en) | 2011-11-18 | 2013-05-23 | Avon Products, Inc. | Use of Electrophoretic Microcapsules in a Cosmetic Composition |
| US11467466B2 (en) | 2012-04-20 | 2022-10-11 | E Ink Corporation | Illumination systems for reflective displays |
| WO2013159093A1 (en) | 2012-04-20 | 2013-10-24 | E Ink Corporation | Illumination systems for reflective displays |
| WO2014106955A1 (ja) * | 2013-01-07 | 2014-07-10 | 株式会社ニコン | 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法 |
| WO2014110394A1 (en) | 2013-01-10 | 2014-07-17 | E Ink Corporation | Electro-optic display with controlled electrochemical reactions |
| US9715155B1 (en) | 2013-01-10 | 2017-07-25 | E Ink Corporation | Electrode structures for electro-optic displays |
| CN105917265B (zh) | 2014-01-17 | 2019-01-15 | 伊英克公司 | 具有双相电极层的电光显示器 |
| WO2017034645A2 (en) | 2015-06-09 | 2017-03-02 | ARIZONA BOARD OF REGENTS, a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY | Method of providing an electronic device and electronic device thereof |
| WO2015156891A2 (en) | 2014-01-23 | 2015-10-15 | Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University | Method of providing a flexible semiconductor device and flexible semiconductor device thereof |
| US10381224B2 (en) | 2014-01-23 | 2019-08-13 | Arizona Board Of Regents On Behalf Of Arizona State University | Method of providing an electronic device and electronic device thereof |
| KR20160119195A (ko) | 2014-02-07 | 2016-10-12 | 이 잉크 코포레이션 | 전기-광학 디스플레이 백플레인 구조들 |
| US10317767B2 (en) | 2014-02-07 | 2019-06-11 | E Ink Corporation | Electro-optic display backplane structure with drive components and pixel electrodes on opposed surfaces |
| US10446585B2 (en) | 2014-03-17 | 2019-10-15 | E Ink Corporation | Multi-layer expanding electrode structures for backplane assemblies |
| EP3143641A4 (en) | 2014-05-13 | 2018-01-17 | Arizona Board of Regents, a Body Corporate of the State of Arizona acting for and on behalf of Arizona State University | Method of providing an electronic device and electronic device thereof |
| ES2959493T3 (es) | 2014-11-07 | 2024-02-26 | E Ink Corp | Baldosa electroóptica |
| US10446582B2 (en) | 2014-12-22 | 2019-10-15 | Arizona Board Of Regents On Behalf Of Arizona State University | Method of providing an imaging system and imaging system thereof |
| US9741742B2 (en) | 2014-12-22 | 2017-08-22 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Deformable electronic device and methods of providing and using deformable electronic device |
| US9835925B1 (en) | 2015-01-08 | 2017-12-05 | E Ink Corporation | Electro-optic displays, and processes for the production thereof |
| US10475396B2 (en) | 2015-02-04 | 2019-11-12 | E Ink Corporation | Electro-optic displays with reduced remnant voltage, and related apparatus and methods |
| US10997930B2 (en) | 2015-05-27 | 2021-05-04 | E Ink Corporation | Methods and circuitry for driving display devices |
| EP3314328B1 (en) | 2015-06-29 | 2021-03-03 | E Ink Corporation | Electro-optic display device and method of manufacturing thereof |
| WO2017184816A1 (en) | 2016-04-22 | 2017-10-26 | E Ink Corporation | Foldable electro-optic display apparatus |
| US10527899B2 (en) | 2016-05-31 | 2020-01-07 | E Ink Corporation | Backplanes for electro-optic displays |
| WO2018160546A1 (en) | 2017-02-28 | 2018-09-07 | E Ink Corporation | Writeable electrophoretic displays including sensing circuits and styli configured to interact with sensing circuits |
| WO2018183240A1 (en) | 2017-03-28 | 2018-10-04 | E Ink Corporation | Porous backplane for electro-optic display |
| TWI682261B (zh) | 2017-05-19 | 2020-01-11 | 美商電子墨水股份有限公司 | 包含數位化及觸控感測的可折疊電光顯示器 |
| US11404013B2 (en) | 2017-05-30 | 2022-08-02 | E Ink Corporation | Electro-optic displays with resistors for discharging remnant charges |
| EP3631575A4 (en) | 2017-05-30 | 2021-01-13 | E Ink Corporation | ELECTRO-OPTICAL INDICATORS |
| US10882042B2 (en) | 2017-10-18 | 2021-01-05 | E Ink Corporation | Digital microfluidic devices including dual substrates with thin-film transistors and capacitive sensing |
| US10824042B1 (en) | 2017-10-27 | 2020-11-03 | E Ink Corporation | Electro-optic display and composite materials having low thermal sensitivity for use therein |
| CN111226163B (zh) | 2017-11-03 | 2021-10-22 | 伊英克公司 | 用于生产电光显示器的工艺 |
| US11081066B2 (en) | 2018-02-15 | 2021-08-03 | E Ink Corporation | Via placement for slim border electro-optic display backplanes with decreased capacitive coupling between t-wires and pixel electrodes |
| US11175561B1 (en) | 2018-04-12 | 2021-11-16 | E Ink Corporation | Electrophoretic display media with network electrodes and methods of making and using the same |
| PL3834038T3 (pl) | 2018-08-07 | 2024-04-02 | E Ink Corporation | Elastyczne kapsułkowane ośrodki elektrooptyczne |
| US11353759B2 (en) | 2018-09-17 | 2022-06-07 | Nuclera Nucleics Ltd. | Backplanes with hexagonal and triangular electrodes |
| KR102577837B1 (ko) | 2018-10-15 | 2023-09-12 | 이 잉크 코포레이션 | 디지털 미세유체 전달 디바이스 |
| US11145262B2 (en) | 2018-11-09 | 2021-10-12 | E Ink Corporation | Electro-optic displays |
| EP3894934A4 (en) | 2018-12-13 | 2022-07-20 | E Ink Corporation | LIGHTING SYSTEMS FOR REFLECTIVE DISPLAYS |
| TWI728631B (zh) | 2018-12-28 | 2021-05-21 | 美商電子墨水股份有限公司 | 電光顯示器 |
| EP3903303A4 (en) | 2018-12-30 | 2022-09-07 | E Ink California, LLC | ELECTRO-OPTICAL DISPLAYS |
| JP7407293B2 (ja) | 2020-02-07 | 2023-12-28 | イー インク コーポレイション | 薄膜上部電極を伴う電気泳動ディスプレイ層 |
| JP2023529136A (ja) | 2020-06-03 | 2023-07-07 | イー インク コーポレイション | 非伝導性支持板を含む折り畳み可能電気泳動ディスプレイモジュール |
| TW202314665A (zh) | 2021-08-18 | 2023-04-01 | 美商電子墨水股份有限公司 | 用於驅動電光顯示器的方法 |
| WO2023164078A1 (en) | 2022-02-25 | 2023-08-31 | E Ink Corporation | Electro-optic displays with edge seal components and methods of making the same |
| US11830449B2 (en) | 2022-03-01 | 2023-11-28 | E Ink Corporation | Electro-optic displays |
| US20230350263A1 (en) | 2022-04-27 | 2023-11-02 | E Ink Corporation | Electro-optic display stacks with segmented electrodes and methods of making the same |
Family Cites Families (226)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE25363E (en) | 1961-10-27 | 1963-04-02 | Magnetic writing materials set | |
| US3384565A (en) | 1964-07-23 | 1968-05-21 | Xerox Corp | Process of photoelectrophoretic color imaging |
| JPS4915377B1 (zh) | 1968-10-04 | 1974-04-15 | ||
| US3892568A (en) | 1969-04-23 | 1975-07-01 | Matsushita Electric Ind Co Ltd | Electrophoretic image reproduction process |
| US3612758A (en) | 1969-10-03 | 1971-10-12 | Xerox Corp | Color display device |
| US3870517A (en) * | 1969-10-18 | 1975-03-11 | Matsushita Electric Ind Co Ltd | Color image reproduction sheet employed in photoelectrophoretic imaging |
| US3668106A (en) | 1970-04-09 | 1972-06-06 | Matsushita Electric Ind Co Ltd | Electrophoretic display device |
| US3767392A (en) | 1970-04-15 | 1973-10-23 | Matsushita Electric Ind Co Ltd | Electrophoretic light image reproduction process |
| US3792308A (en) | 1970-06-08 | 1974-02-12 | Matsushita Electric Ind Co Ltd | Electrophoretic display device of the luminescent type |
| US3670323A (en) | 1970-12-14 | 1972-06-13 | Zenith Radio Corp | Image-display devices comprising particle light modulators with storage |
| JPS4917079B1 (zh) | 1970-12-21 | 1974-04-26 | ||
| US3850627A (en) | 1971-01-06 | 1974-11-26 | Xerox Corp | Electrophoretic imaging method |
| JPS5121531B2 (zh) | 1971-07-29 | 1976-07-03 | ||
| US4273672A (en) | 1971-08-23 | 1981-06-16 | Champion International Corporation | Microencapsulation process |
| GB1458045A (en) | 1973-08-15 | 1976-12-08 | Secr Defence | Display systems |
| US4001140A (en) | 1974-07-10 | 1977-01-04 | Ncr Corporation | Capsule manufacture |
| US4045327A (en) | 1974-08-28 | 1977-08-30 | Matsushita Electric Industrial Co., Ltd. | Electrophoretic matrix panel |
| US4041481A (en) | 1974-10-05 | 1977-08-09 | Matsushita Electric Industrial Co., Ltd. | Scanning apparatus for an electrophoretic matrix display panel |
| JPS584762B2 (ja) | 1976-02-20 | 1983-01-27 | 株式会社日立製作所 | パ−セント表示装置 |
| FR2351191A1 (fr) | 1976-05-11 | 1977-12-09 | Thomson Csf | Dispositif a electrophorese perfectionne |
| US4088395A (en) | 1976-05-27 | 1978-05-09 | American Cyanamid Company | Paper counter-electrode for electrochromic devices |
| US4068927A (en) | 1976-09-01 | 1978-01-17 | North American Philips Corporation | Electrophoresis display with buried lead lines |
| US4071430A (en) | 1976-12-06 | 1978-01-31 | North American Philips Corporation | Electrophoretic image display having an improved switching time |
| US4203106A (en) | 1977-11-23 | 1980-05-13 | North American Philips Corporation | X-Y addressable electrophoretic display device with control electrode |
| US4261653A (en) | 1978-05-26 | 1981-04-14 | The Bendix Corporation | Light valve including dipolar particle construction and method of manufacture |
| US4324456A (en) | 1979-08-02 | 1982-04-13 | U.S. Philips Corporation | Electrophoretic projection display systems |
| US4218302A (en) | 1979-08-02 | 1980-08-19 | U.S. Philips Corporation | Electrophoretic display devices |
| JPS56104387A (en) | 1980-01-22 | 1981-08-20 | Citizen Watch Co Ltd | Display unit |
| US4305807A (en) | 1980-03-13 | 1981-12-15 | Burroughs Corporation | Electrophoretic display device using a liquid crystal as a threshold device |
| US4311361A (en) | 1980-03-13 | 1982-01-19 | Burroughs Corporation | Electrophoretic display using a non-Newtonian fluid as a threshold device |
| JPS57181146A (en) | 1981-04-30 | 1982-11-08 | Hitachi Ltd | Resin-sealed semiconductor device |
| JPS57188853A (en) * | 1981-05-18 | 1982-11-19 | Hitachi Ltd | Plastic molded type semiconductor device |
| US4418346A (en) | 1981-05-20 | 1983-11-29 | Batchelder J Samuel | Method and apparatus for providing a dielectrophoretic display of visual information |
| US4390403A (en) | 1981-07-24 | 1983-06-28 | Batchelder J Samuel | Method and apparatus for dielectrophoretic manipulation of chemical species |
| US4450440A (en) | 1981-12-24 | 1984-05-22 | U.S. Philips Corporation | Construction of an epid bar graph |
| US4522472A (en) | 1982-02-19 | 1985-06-11 | North American Philips Corporation | Electrophoretic image display with reduced drives and leads |
| FR2527843B1 (fr) | 1982-06-01 | 1986-01-24 | Thomson Csf | Electrode comprenant un film de polymere electrochrome pouvant servir dans un dispositif d'affichage ou de stockage d'energie |
| FR2527844B1 (fr) | 1982-06-01 | 1986-01-24 | Thomson Csf | Dispositif electrochromique pouvant servir au stockage d'energie et systeme d'affichage electrochromique |
| US4439507A (en) | 1982-09-21 | 1984-03-27 | Xerox Corporation | Layered photoresponsive imaging device with photogenerating pigments dispersed in a polyhydroxy ether composition |
| GB8328750D0 (en) | 1983-10-27 | 1983-11-30 | Philp R | Contact-less electronic connectors |
| US4514583A (en) * | 1983-11-07 | 1985-04-30 | Energy Conversion Devices, Inc. | Substrate for photovoltaic devices |
| JPS614020A (ja) | 1984-06-18 | 1986-01-09 | Nissha Printing Co Ltd | マルチカラ−液晶表示装置 |
| US4655897A (en) | 1984-11-13 | 1987-04-07 | Copytele, Inc. | Electrophoretic display panels and associated methods |
| JPH0616506B2 (ja) | 1984-12-26 | 1994-03-02 | 株式会社半導体エネルギー研究所 | 積層体の側周辺に選択的に被膜を形成する方法 |
| US4648956A (en) | 1984-12-31 | 1987-03-10 | North American Philips Corporation | Electrode configurations for an electrophoretic display device |
| US4741604A (en) | 1985-02-01 | 1988-05-03 | Kornfeld Cary D | Electrode arrays for cellular displays |
| US4643528A (en) | 1985-03-18 | 1987-02-17 | Manchester R & D Partnership | Encapsulated liquid crystal and filler material |
| US4598960A (en) | 1985-04-29 | 1986-07-08 | Copytele, Inc. | Methods and apparatus for connecting closely spaced large conductor arrays employing multi-conductor carrier boards |
| JPS6258222A (ja) | 1985-09-09 | 1987-03-13 | Ricoh Co Ltd | マトリクス型表示装置 |
| US4686524A (en) | 1985-11-04 | 1987-08-11 | North American Philips Corporation | Photosensitive electrophoretic displays |
| JPS6293974A (ja) * | 1985-10-19 | 1987-04-30 | Nitto Electric Ind Co Ltd | 薄膜トランジスタアレイ |
| US4742345A (en) | 1985-11-19 | 1988-05-03 | Copytele, Inc. | Electrophoretic display panel apparatus and methods therefor |
| JPS62163316A (ja) * | 1986-01-14 | 1987-07-20 | Canon Inc | 半導体素子の製造方法 |
| US4746917A (en) | 1986-07-14 | 1988-05-24 | Copytele, Inc. | Method and apparatus for operating an electrophoretic display between a display and a non-display mode |
| US4850919A (en) | 1986-09-11 | 1989-07-25 | Copytele, Inc. | Monolithic flat panel display apparatus and methods for fabrication thereof |
| JPH0682894B2 (ja) * | 1986-09-27 | 1994-10-19 | 住友ベ−クライト株式会社 | フレキシブルプリント回路用基板の製造方法 |
| US5194852A (en) | 1986-12-01 | 1993-03-16 | More Edward S | Electro-optic slate for direct entry and display and/or storage of hand-entered textual and graphic information |
| US4892607A (en) | 1986-12-04 | 1990-01-09 | Copytele, Inc. | Chip mounting techniques for display apparatus |
| US5279694A (en) | 1986-12-04 | 1994-01-18 | Copytele, Inc. | Chip mounting techniques for display apparatus |
| US5028841A (en) | 1989-07-18 | 1991-07-02 | Copytele, Inc. | Chip mounting techniques for display apparatus |
| US4833464A (en) | 1987-09-14 | 1989-05-23 | Copytele, Inc. | Electrophoretic information display (EPID) apparatus employing grey scale capability |
| JPH01207324A (ja) | 1988-02-15 | 1989-08-21 | Hitachi Chem Co Ltd | 溶媒可溶なポリイミド |
| US4883561A (en) | 1988-03-29 | 1989-11-28 | Bell Communications Research, Inc. | Lift-off and subsequent bonding of epitaxial films |
| US5070326A (en) | 1988-04-13 | 1991-12-03 | Ube Industries Ltd. | Liquid crystal display device |
| US4947159A (en) | 1988-04-18 | 1990-08-07 | 501 Copytele, Inc. | Power supply apparatus capable of multi-mode operation for an electrophoretic display panel |
| DE3851223T2 (de) | 1988-05-03 | 1994-12-22 | Copytele Inc | Monolithische Flachtafel-Anzeigevorrichtung. |
| US5731116A (en) | 1989-05-17 | 1998-03-24 | Dai Nippon Printing Co., Ltd. | Electrostatic information recording medium and electrostatic information recording and reproducing method |
| JPH0731326B2 (ja) | 1988-06-01 | 1995-04-10 | シャープ株式会社 | 液晶表示装置 |
| US5502889A (en) | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US4931019A (en) | 1988-09-01 | 1990-06-05 | Pennwalt Corporation | Electrostatic image display apparatus |
| US5119218A (en) | 1988-09-28 | 1992-06-02 | Ube Industries, Ltd. | Liquid crystal display device having varistor elements |
| NL8802409A (nl) | 1988-09-30 | 1990-04-17 | Philips Nv | Weergeefinrichting, steunplaat voorzien van diode en geschikt voor de weergeefinrichting en werkwijze ter vervaardiging van de steunplaat. |
| US4947157A (en) | 1988-10-03 | 1990-08-07 | 501 Copytele, Inc. | Apparatus and methods for pulsing the electrodes of an electrophoretic display for achieving faster display operation |
| JPH02131221A (ja) | 1988-11-11 | 1990-05-21 | Pioneer Electron Corp | 光導電型液昌ライトバルブ |
| US5892244A (en) | 1989-01-10 | 1999-04-06 | Mitsubishi Denki Kabushiki Kaisha | Field effect transistor including πconjugate polymer and liquid crystal display including the field effect transistor |
| US5041824A (en) | 1989-03-02 | 1991-08-20 | Copytele, Inc. | Semitransparent electrophoretic information displays (EPID) employing mesh like electrodes |
| US5587264A (en) | 1989-03-16 | 1996-12-24 | Dai Nippon Printing Co. Ltd. | Electrostatic information recording medium and electrostatic information recording and reproducing method |
| US5053763A (en) | 1989-05-01 | 1991-10-01 | Copytele, Inc. | Dual anode flat panel electrophoretic display apparatus |
| US5302235A (en) | 1989-05-01 | 1994-04-12 | Copytele, Inc. | Dual anode flat panel electrophoretic display apparatus |
| JPH03109526A (ja) | 1989-06-20 | 1991-05-09 | Japan Synthetic Rubber Co Ltd | 液晶表示装置用アクティブマトリックス基板 |
| US5066946A (en) | 1989-07-03 | 1991-11-19 | Copytele, Inc. | Electrophoretic display panel with selective line erasure |
| US5220316A (en) | 1989-07-03 | 1993-06-15 | Benjamin Kazan | Nonlinear resistor control circuit and use in liquid crystal displays |
| JPH0344621A (ja) | 1989-07-12 | 1991-02-26 | Alps Electric Co Ltd | 表示方法及び装置並びにこれに用いる表示媒体 |
| US5128785A (en) | 1989-08-08 | 1992-07-07 | Ube Industries, Ltd. | Liquid crystal display device substantially free from cross-talk having varistor layers coupled to signal lines and picture electrodes |
| JP2813428B2 (ja) | 1989-08-17 | 1998-10-22 | 三菱電機株式会社 | 電界効果トランジスタ及び該電界効果トランジスタを用いた液晶表示装置 |
| US5254981A (en) | 1989-09-15 | 1993-10-19 | Copytele, Inc. | Electrophoretic display employing gray scale capability utilizing area modulation |
| JP2712046B2 (ja) | 1989-10-18 | 1998-02-10 | 宇部興産株式会社 | 液晶表示装置 |
| CA2027440C (en) | 1989-11-08 | 1995-07-04 | Nicholas K. Sheridon | Paper-like computer output display and scanning system therefor |
| US5128226A (en) | 1989-11-13 | 1992-07-07 | Eastman Kodak Company | Electrophotographic element containing barrier layer |
| US5077157A (en) | 1989-11-24 | 1991-12-31 | Copytele, Inc. | Methods of fabricating dual anode, flat panel electrophoretic displays |
| EP0443571A3 (en) | 1990-02-23 | 1992-04-15 | Ube Industries, Ltd. | Liquid crystal display panel |
| JPH063528B2 (ja) * | 1990-03-16 | 1994-01-12 | 富士ゼロックス株式会社 | 光変調表示素子及び表示方法 |
| JPH049916A (ja) | 1990-04-27 | 1992-01-14 | Victor Co Of Japan Ltd | 記録装置および記録ヘッド |
| JP2554769B2 (ja) | 1990-05-16 | 1996-11-13 | 株式会社東芝 | 液晶表示装置 |
| GB2244860A (en) | 1990-06-04 | 1991-12-11 | Philips Electronic Associated | Fabricating mim type device array and display devices incorporating such arrays |
| US5206749A (en) | 1990-12-31 | 1993-04-27 | Kopin Corporation | Liquid crystal display having essentially single crystal transistors pixels and driving circuits |
| US5250938A (en) | 1990-12-19 | 1993-10-05 | Copytele, Inc. | Electrophoretic display panel having enhanced operation |
| US5362671A (en) | 1990-12-31 | 1994-11-08 | Kopin Corporation | Method of fabricating single crystal silicon arrayed devices for display panels |
| US5223823A (en) | 1991-03-11 | 1993-06-29 | Copytele, Inc. | Electrophoretic display panel with plural electrically independent anode elements |
| JP2603037B2 (ja) | 1991-03-11 | 1997-04-23 | コピイテル，インコーポレイテッド | 電気的に独立した複数のアノード素子を有する電気泳動ディスプレイパネル |
| US5187609A (en) | 1991-03-27 | 1993-02-16 | Disanto Frank J | Electrophoretic display panel with semiconductor coated elements |
| JPH04313266A (ja) * | 1991-04-10 | 1992-11-05 | Fuji Xerox Co Ltd | 薄膜半導体装置 |
| DE4113791A1 (de) * | 1991-04-26 | 1992-10-29 | Solvay Deutschland | Verfahren zur abscheidung einer bor und stickstoff enthaltenden schicht |
| US5315312A (en) | 1991-05-06 | 1994-05-24 | Copytele, Inc. | Electrophoretic display panel with tapered grid insulators and associated methods |
| US5375044A (en) | 1991-05-13 | 1994-12-20 | Guritz; Steven P. W. | Multipurpose optical display for articulating surfaces |
| US5223115A (en) | 1991-05-13 | 1993-06-29 | Copytele, Inc. | Electrophoretic display with single character erasure |
| JP3086718B2 (ja) | 1991-06-24 | 2000-09-11 | 株式会社東芝 | 液晶表示素子 |
| US5689282A (en) | 1991-07-09 | 1997-11-18 | U.S. Philips Corporation | Display device with compensation for stray capacitance |
| JPH0519306A (ja) | 1991-07-16 | 1993-01-29 | Nippon Sheet Glass Co Ltd | 全固体調光装置およびそれを用いた調光方法 |
| GB9115402D0 (en) | 1991-07-17 | 1991-09-04 | Philips Electronic Associated | Matrix display device and its method of operation |
| WO1993004411A1 (en) | 1991-08-16 | 1993-03-04 | Eastman Kodak Company | Migration imaging with dyes or pigments to effect bleaching |
| US5216416A (en) | 1991-08-19 | 1993-06-01 | Copytele, Inc. | Electrophoretic display panel with interleaved local anode |
| WO1993005425A1 (en) | 1991-08-29 | 1993-03-18 | Copytele, Inc. | Electrophoretic display panel with internal mesh background screen |
| US5463492A (en) | 1991-11-01 | 1995-10-31 | Research Frontiers Incorporated | Light modulating film of improved clarity for a light valve |
| US5463491A (en) | 1991-11-01 | 1995-10-31 | Research Frontiers Incorporated | Light valve employing a film comprising an encapsulated liquid suspension, and method of making such film |
| US5247290A (en) | 1991-11-21 | 1993-09-21 | Copytele, Inc. | Method of operation for reducing power, increasing life and improving performance of epids |
| US5266937A (en) | 1991-11-25 | 1993-11-30 | Copytele, Inc. | Method for writing data to an electrophoretic display panel |
| US5174882A (en) | 1991-11-25 | 1992-12-29 | Copytele, Inc. | Electrode structure for an electrophoretic display apparatus |
| EP0618715A4 (en) | 1991-12-13 | 1996-12-18 | Ace Denken Kk | ELECTRONIC NOTEPAD. |
| JP3203736B2 (ja) * | 1992-02-13 | 2001-08-27 | 株式会社日立製作所 | 液晶ドライバ用テープキャリアパッケージ及び液晶表示装置 |
| US5293528A (en) | 1992-02-25 | 1994-03-08 | Copytele, Inc. | Electrophoretic display panel and associated methods providing single pixel erase capability |
| US5412398A (en) | 1992-02-25 | 1995-05-02 | Copytele, Inc. | Electrophoretic display panel and associated methods for blinking displayed characters |
| US5298833A (en) | 1992-06-22 | 1994-03-29 | Copytele, Inc. | Black electrophoretic particles for an electrophoretic image display |
| US5270843A (en) | 1992-08-31 | 1993-12-14 | Jiansheng Wang | Directly formed polymer dispersed liquid crystal light shutter displays |
| US5705424A (en) | 1992-09-11 | 1998-01-06 | Kopin Corporation | Process of fabricating active matrix pixel electrodes |
| TW226478B (en) | 1992-12-04 | 1994-07-11 | Semiconductor Energy Res Co Ltd | Semiconductor device and method for manufacturing the same |
| US5345251A (en) | 1993-01-11 | 1994-09-06 | Copytele, Inc. | Electrophoretic display panel with interleaved cathode and anode |
| US5402145A (en) | 1993-02-17 | 1995-03-28 | Copytele, Inc. | Electrophoretic display panel with arc driven individual pixels |
| TW241377B (zh) | 1993-03-12 | 1995-02-21 | Semiconductor Energy Res Co Ltd | |
| JPH07152024A (ja) | 1993-05-17 | 1995-06-16 | Sharp Corp | 液晶表示素子 |
| EP0635748B1 (en) * | 1993-07-23 | 2001-12-12 | Sharp Kabushiki Kaisha | Liquid crystal display apparatus and method for producing the same |
| TW259845B (zh) | 1993-07-30 | 1995-10-11 | Sharp Kk | |
| US5477073A (en) | 1993-08-20 | 1995-12-19 | Casio Computer Co., Ltd. | Thin film semiconductor device including a driver and a matrix circuit |
| JPH09502540A (ja) | 1993-09-09 | 1997-03-11 | コピイテル，インコーポレイテッド | 選択的文字アドレス指定可能な電気泳動表示装置パネル |
| JPH09505900A (ja) | 1993-10-01 | 1997-06-10 | コピイテル，インコーポレイテッド | 選択的キャラクタアドレス制御性を有する電気泳動式表示パネル |
| US5545291A (en) | 1993-12-17 | 1996-08-13 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
| US5904545A (en) | 1993-12-17 | 1999-05-18 | The Regents Of The University Of California | Apparatus for fabricating self-assembling microstructures |
| US5383008A (en) | 1993-12-29 | 1995-01-17 | Xerox Corporation | Liquid ink electrostatic image development system |
| US5508720A (en) | 1994-02-02 | 1996-04-16 | Copytele, Inc. | Portable telecommunication device with removable electrophoretic display |
| WO1995026545A1 (en) | 1994-03-18 | 1995-10-05 | Philips Electronics N.V. | Active matrix display device and method of driving such |
| US5744283A (en) | 1994-04-12 | 1998-04-28 | U.S. Philips Corporation | Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material |
| EP0706678B1 (en) | 1994-04-28 | 1999-02-24 | Koninklijke Philips Electronics N.V. | Method of photolithographically producing a copper pattern on a plate of an electrically insulating material |
| US5543589A (en) | 1994-05-23 | 1996-08-06 | International Business Machines Corporation | Touchpad with dual sensor that simplifies scanning |
| CA2191084A1 (en) | 1994-05-26 | 1995-12-07 | Wei-Hsin Hou | Fluorinated dielectric suspensions for electrophoretic image displays and related methods |
| US5623585A (en) | 1994-07-15 | 1997-04-22 | Eastman Kodak Company | Method and apparatus for parallel processing of a document image |
| GB2292119B (en) | 1994-08-10 | 1998-12-30 | Chemitech Inc | A process for producing a magnetic display sheet using microcapsules |
| US5709979A (en) | 1994-10-21 | 1998-01-20 | Sheldahl, Inc. | Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor |
| EP0709713A3 (en) | 1994-10-31 | 1997-03-26 | Fujikura Ltd | Electrically controlled color display method and device |
| CN1116623C (zh) | 1994-11-07 | 2003-07-30 | 美国3M公司 | 标志制品及其制造方法 |
| US5650872A (en) | 1994-12-08 | 1997-07-22 | Research Frontiers Incorporated | Light valve containing ultrafine particles |
| US5745094A (en) * | 1994-12-28 | 1998-04-28 | International Business Machines Corporation | Electrophoretic display |
| NO952545D0 (no) | 1995-06-23 | 1995-06-23 | Opticon As | Fremgangsmåte til skriving av data i et optisk minne |
| NO301506B1 (no) | 1995-06-23 | 1997-11-03 | Opticom As | Fremgangsmåte ved optisk datalagring samt databærende medium |
| NO303098B1 (no) | 1995-06-23 | 1998-05-25 | Opticom As | Optisk datalagringsmedium med diffraktive optiske elementer og fremgangsmÕte til skriving og lesing av data i dette |
| NO302987B1 (no) | 1995-07-18 | 1998-05-11 | Opticom As | Optisk logisk element og fremgangsmåter til henholdsvis dets preparering og optiske adressering, samt anvendelse derav i en optisk logisk innretning |
| US6710540B1 (en) * | 1995-07-20 | 2004-03-23 | E Ink Corporation | Electrostatically-addressable electrophoretic display |
| US6120839A (en) | 1995-07-20 | 2000-09-19 | E Ink Corporation | Electro-osmotic displays and materials for making the same |
| US6120588A (en) | 1996-07-19 | 2000-09-19 | E Ink Corporation | Electronically addressable microencapsulated ink and display thereof |
| US6124851A (en) | 1995-07-20 | 2000-09-26 | E Ink Corporation | Electronic book with multiple page displays |
| US6515649B1 (en) * | 1995-07-20 | 2003-02-04 | E Ink Corporation | Suspended particle displays and materials for making the same |
| US6017584A (en) | 1995-07-20 | 2000-01-25 | E Ink Corporation | Multi-color electrophoretic displays and materials for making the same |
| US6727881B1 (en) * | 1995-07-20 | 2004-04-27 | E Ink Corporation | Encapsulated electrophoretic displays and methods and materials for making the same |
| US6118426A (en) | 1995-07-20 | 2000-09-12 | E Ink Corporation | Transducers and indicators having printed displays |
| JP3444035B2 (ja) * | 1995-08-01 | 2003-09-08 | 宇部興産株式会社 | ポリイミドフィルム |
| FR2740318B1 (fr) | 1995-10-31 | 1999-03-05 | Moulinex Espana Sa | Grille-pain electrique |
| US5650199A (en) | 1995-11-22 | 1997-07-22 | Aem, Inc. | Method of making a multilayer electronic component with inter-layer conductor connection utilizing a conductive via forming ink |
| US5717514A (en) | 1995-12-15 | 1998-02-10 | Xerox Corporation | Polychromal segmented balls for a twisting ball display |
| US5737115A (en) | 1995-12-15 | 1998-04-07 | Xerox Corporation | Additive color tristate light valve twisting ball display |
| DE69614370T2 (de) | 1995-12-30 | 2001-11-22 | Casio Computer Co Ltd | Anzeigervorrichtung für anzeigeoperation gemäss lichtsignal und steuerverfahren dafür |
| US5625199A (en) | 1996-01-16 | 1997-04-29 | Lucent Technologies Inc. | Article comprising complementary circuit with inorganic n-channel and organic p-channel thin film transistors |
| US5786875A (en) | 1996-03-15 | 1998-07-28 | Brader; Lawrence Allen | Thermal liquid crystal display using thermoelectric link |
| WO1997035298A2 (en) | 1996-03-18 | 1997-09-25 | Philips Electronics N.V. | Display device |
| US5709976A (en) * | 1996-06-03 | 1998-01-20 | Xerox Corporation | Coated papers |
| EP0811648B1 (en) * | 1996-06-07 | 1999-12-22 | Unitika Limited | Polyimide precursor solution, process for the production thereof and process for producing a film or coating therefrom |
| JP3262514B2 (ja) | 1996-06-07 | 2002-03-04 | ユニチカ株式会社 | ポリイミド前駆体溶液、それから得られるポリイミド塗膜又はポリイミドフィルム、及びそれらの製造方法 |
| CN1182435C (zh) | 1996-06-12 | 2004-12-29 | 奥普蒂科姆公司 | 光逻辑元件和光逻辑器件 |
| GB9613065D0 (en) | 1996-06-21 | 1996-08-28 | Philips Electronics Nv | Electronic device manufacture |
| US6055091A (en) * | 1996-06-27 | 2000-04-25 | Xerox Corporation | Twisting-cylinder display |
| US6027958A (en) | 1996-07-11 | 2000-02-22 | Kopin Corporation | Transferred flexible integrated circuit |
| US5969376A (en) | 1996-08-23 | 1999-10-19 | Lucent Technologies Inc. | Organic thin film transistor having a phthalocyanine semiconductor layer |
| JP3082679B2 (ja) * | 1996-08-29 | 2000-08-28 | 日本電気株式会社 | 薄膜トランジスタおよびその製造方法 |
| JPH1093090A (ja) * | 1996-09-13 | 1998-04-10 | Toshiba Corp | 半導体装置、半導体装置の製造方法、及び半導体装置用の有機樹脂基板 |
| US5894367A (en) | 1996-09-13 | 1999-04-13 | Xerox Corporation | Twisting cylinder display using multiple chromatic values |
| US5930026A (en) | 1996-10-25 | 1999-07-27 | Massachusetts Institute Of Technology | Nonemissive displays and piezoelectric power supplies therefor |
| US5961804A (en) | 1997-03-18 | 1999-10-05 | Massachusetts Institute Of Technology | Microencapsulated electrophoretic display |
| US5866284A (en) | 1997-05-28 | 1999-02-02 | Hewlett-Packard Company | Print method and apparatus for re-writable medium |
| DE69839882D1 (de) * | 1997-06-06 | 2008-09-25 | Ibiden Co Ltd | Mehrschichtige gedruckte leiterplatte und verfahren zu deren herstellung |
| NO972803D0 (no) | 1997-06-17 | 1997-06-17 | Opticom As | Elektrisk adresserbar logisk innretning, fremgangsmåte til elektrisk adressering av samme og anvendelse av innretning og fremgangsmåte |
| US6839158B2 (en) * | 1997-08-28 | 2005-01-04 | E Ink Corporation | Encapsulated electrophoretic displays having a monolayer of capsules and materials and methods for making the same |
| US6067185A (en) | 1997-08-28 | 2000-05-23 | E Ink Corporation | Process for creating an encapsulated electrophoretic display |
| US6177921B1 (en) * | 1997-08-28 | 2001-01-23 | E Ink Corporation | Printable electrode structures for displays |
| US6130774A (en) | 1998-04-27 | 2000-10-10 | E Ink Corporation | Shutter mode microencapsulated electrophoretic display |
| US6497969B2 (en) * | 1997-09-05 | 2002-12-24 | Nessdisplay Co., Ltd. | Electroluminescent device having an organic layer including polyimide |
| US5936259A (en) | 1997-10-16 | 1999-08-10 | Lucent Technologies Inc. | Thin film transistor and organic semiconductor material thereof |
| JP3571198B2 (ja) * | 1997-10-30 | 2004-09-29 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| GB9726094D0 (en) | 1997-12-10 | 1998-02-11 | Philips Electronics Nv | Thin film transistors and electronic devices comprising such |
| EP0924551A1 (en) | 1997-12-18 | 1999-06-23 | The Technology Partnership Public Limited Company | Method and apparatus for matrix addressing of an electrophoretic display device |
| JP2004506309A (ja) * | 1997-12-31 | 2004-02-26 | エルパック（ユーエスエー）、インコーポレイテッド | モールドされた電子パッケージ、製作方法およびシールディング方法 |
| JP3566524B2 (ja) | 1998-01-14 | 2004-09-15 | キヤノン株式会社 | 電気泳動表示装置 |
| US6054071A (en) * | 1998-01-28 | 2000-04-25 | Xerox Corporation | Poled electrets for gyricon-based electric-paper displays |
| SE513858C2 (sv) * | 1998-03-06 | 2000-11-13 | Ericsson Telefon Ab L M | Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler |
| JP3691956B2 (ja) * | 1998-03-18 | 2005-09-07 | 株式会社東芝 | インターコネクタおよび液晶表示装置 |
| US7075502B1 (en) * | 1998-04-10 | 2006-07-11 | E Ink Corporation | Full color reflective display with multichromatic sub-pixels |
| DE69918308T2 (de) * | 1998-04-10 | 2004-10-21 | E Ink Corp | Elektronische anzeige basierend auf organischen feldeffekt-transistoren |
| TW430827B (en) * | 1998-05-22 | 2001-04-21 | Advanced Refractory Tech | Resistors with low temperature coefficient of resistance and methods of making |
| TW410478B (en) * | 1998-05-29 | 2000-11-01 | Lucent Technologies Inc | Thin-film transistor monolithically integrated with an organic light-emitting diode |
| US6239896B1 (en) | 1998-06-01 | 2001-05-29 | Canon Kabushiki Kaisha | Electrophotographic display device and driving method therefor |
| GB9812742D0 (en) * | 1998-06-12 | 1998-08-12 | Philips Electronics Nv | Active matrix electroluminescent display devices |
| GB9812739D0 (en) * | 1998-06-12 | 1998-08-12 | Koninkl Philips Electronics Nv | Active matrix electroluminescent display devices |
| CA2336101A1 (en) * | 1998-07-08 | 2000-01-20 | E Ink Corporation | Method and apparatus for sensing the state of an electrophoretic display |
| US6184856B1 (en) * | 1998-09-16 | 2001-02-06 | International Business Machines Corporation | Transmissive electrophoretic display with laterally adjacent color cells |
| EP1118039B1 (en) * | 1998-10-07 | 2003-02-05 | E Ink Corporation | Illumination system for nonemissive electronic displays |
| US6506438B2 (en) * | 1998-12-15 | 2003-01-14 | E Ink Corporation | Method for printing of transistor arrays on plastic substrates |
| US6724519B1 (en) * | 1998-12-21 | 2004-04-20 | E-Ink Corporation | Protective electrodes for electrophoretic displays |
| EP1737054B1 (en) | 1999-01-29 | 2012-04-11 | Seiko Epson Corporation | Piezoelectric transducer |
| JP2002536695A (ja) * | 1999-02-05 | 2002-10-29 | エイリアン・テクノロジイ・コーポレーション | アセンブリを形成するための装置および方法 |
| JP4582914B2 (ja) * | 1999-04-06 | 2010-11-17 | イー インク コーポレイション | カプセルベースの起電ディスプレイにおける使用のための液滴を作製するための方法 |
| US6842657B1 (en) * | 1999-04-09 | 2005-01-11 | E Ink Corporation | Reactive formation of dielectric layers and protection of organic layers in organic semiconductor device fabrication |
| US6504524B1 (en) * | 2000-03-08 | 2003-01-07 | E Ink Corporation | Addressing methods for displays having zero time-average field |
| US6531997B1 (en) * | 1999-04-30 | 2003-03-11 | E Ink Corporation | Methods for addressing electrophoretic displays |
| US6693620B1 (en) * | 1999-05-03 | 2004-02-17 | E Ink Corporation | Threshold addressing of electrophoretic displays |
| US6323034B1 (en) * | 1999-08-12 | 2001-11-27 | Industrial Technology Research Institute | Amorphous TFT process |
| US6545291B1 (en) * | 1999-08-31 | 2003-04-08 | E Ink Corporation | Transistor design for use in the construction of an electronically driven display |
| EP1224505B1 (en) * | 1999-10-11 | 2005-01-12 | University College Dublin | Electrochromic device |
| US6197663B1 (en) * | 1999-12-07 | 2001-03-06 | Lucent Technologies Inc. | Process for fabricating integrated circuit devices having thin film transistors |
| US6672921B1 (en) * | 2000-03-03 | 2004-01-06 | Sipix Imaging, Inc. | Manufacturing process for electrophoretic display |
-
2001
- 2001-04-17 CN CNB018081681A patent/CN1237623C/zh not_active Expired - Fee Related
- 2001-04-17 AT AT01927094T patent/ATE438927T1/de not_active IP Right Cessation
- 2001-04-17 JP JP2001577586A patent/JP2003531487A/ja not_active Ceased
- 2001-04-17 AU AU2001253575A patent/AU2001253575A1/en not_active Abandoned
- 2001-04-17 DE DE60139463T patent/DE60139463D1/de not_active Expired - Lifetime
- 2001-04-17 EP EP01927094A patent/EP1275156B1/en not_active Expired - Lifetime
- 2001-04-17 WO PCT/US2001/012429 patent/WO2001080287A2/en active Application Filing
- 2001-04-17 KR KR1020027013880A patent/KR100767233B1/ko active IP Right Grant
- 2001-04-17 US US09/836,884 patent/US6825068B2/en not_active Expired - Lifetime
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2004
- 2004-08-17 US US10/919,657 patent/US7365394B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1441967A (zh) | 2003-09-10 |
| KR100767233B1 (ko) | 2007-10-17 |
| JP2003531487A (ja) | 2003-10-21 |
| AU2001253575A1 (en) | 2001-10-30 |
| DE60139463D1 (de) | 2009-09-17 |
| WO2001080287A3 (en) | 2002-05-23 |
| WO2001080287A2 (en) | 2001-10-25 |
| US20020019081A1 (en) | 2002-02-14 |
| ATE438927T1 (de) | 2009-08-15 |
| US20050067656A1 (en) | 2005-03-31 |
| US7365394B2 (en) | 2008-04-29 |
| US6825068B2 (en) | 2004-11-30 |
| EP1275156B1 (en) | 2009-08-05 |
| KR20020089479A (ko) | 2002-11-29 |
| EP1275156A2 (en) | 2003-01-15 |
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