CN1213071A - 复合散热器 - Google Patents

复合散热器 Download PDF

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CN1213071A
CN1213071A CN98120832A CN98120832A CN1213071A CN 1213071 A CN1213071 A CN 1213071A CN 98120832 A CN98120832 A CN 98120832A CN 98120832 A CN98120832 A CN 98120832A CN 1213071 A CN1213071 A CN 1213071A
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radiator
heat transfer
transfer medium
fins
substrate
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德怀特·M·戴维斯
基思·A·戈塞特
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Nokia of America Corp
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Lucent Technologies Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

本发明为一种带有用于增强散热器的传热能力的传热介质的散热器。在一个实施例中,散热器包含若干带有空腔的肋片、基板和流体传热介质。肋片与基板热接触且被设置形成一排纵向通道,空气或流体介质可流经该通道。流体传热介质装在每个空腔中。流体传热介质能增强散热器的传热能力而不增大其表面积、体积和/或重量。尤其是,汽化流体传热介质需要较大量能量。于是可将大量的热从基板传导给流体传热介质。相反,当汽化后的流体传热介质在肋片上部较冷壁上冷凝时,将较大量能量从汽化的流体传热介质传导给肋片。

Description

复合散热器
本发明涉及从热源向外进行传热，更具体涉及散热器。
在电子设备的设计结构中，散热器被用来从热源如电子元器件向较低温环境传热。散热器的目的在于降低热生成装置的温度以防止性能退化并延长热源的寿命。典型的散热器由基板和若干肋片组成。若干肋片垂直固定在基板上，且被设置形成一排纵向通道。为从热源传热，散热器的基板固定在热源上，使之与热源之间形成热接触。热从热源传到基板，然后又传到肋片，在此通过向较低温环境，例如流经纵向通道的空气，传热而进行散热。散热器的典型传热速率是从50到200瓦/平方英尺，取决于可能提供的展开面积、运行环境温度、以及材料/材料厚度。
散热器的效率取决于它从热源向较低温环境传热的能力。影响这一能力的因素包括：散热器构成材料的传热速率和散热器的表面积。使用具有较高传热速率的材料来构造散热器会提高散热器的传热能力。散热器一般包含一片固体材料，该材料具有高导热率且有适当的机械强度用于辅助支承功能。具有这些性能的材料包括金属或镀金属塑料，例如铝和铜。上述金属和镀金属塑料的传热速率分别为0.19摄氏度/瓦-英寸和0.1摄氏度/瓦-英寸。也可通过增大经其散热的表面积来提高散热器的传热能力，例如，加长肋片。然而，这将导致散热器体积和重量的增加。而这种增加是不希望有的，当空间有限时尤其如此。
本发明为一种带有传热介质的散热器，该介质用于增强散热器的传热能力而不增大其体积和/或重量。在一个实施例中，散热器包含若干带有空腔的肋片、基板和流体传热介质。每个肋片均与基板热接触且被设置形成一排纵向通道，空气或流体介质可流经该通道。肋片和基板由导热材料制成，该材料具有适当的机械强度用于辅助支承功能。流体传热介质装在每个空腔中。流体传热介质可以是一种流体，该流体的热阻和沸点分别低于用于构造肋片和基板的材料的热阻和软化点。这种流体传热介质由于它的汽化与冷凝的潜热，增强了散热器的传热能力。尤其是，汽化流体传热介质需要大量能量。于是可将大量的热从基板传导给流体传热介质。相反地，当汽化后的流体传热介质在肋片上部较冷壁上冷凝时，将大量能量从汽化的流体传热介质传导给肋片。这样，就将大量的热从流体传热介质传导给肋片，然后再由肋片向较低温环境散热。
下述说明、所附权利要求和附图将使本发明的特征、情况及优点得到更加充分地理解，附图中：
图1画出了根据本发明的散热器；
图2画出了基板带有储液腔的散热器，该储液腔中装有流体传热介质；
图3画出了具有矩形肋片的散热器；
图4画出了基板带有储液腔的散热器的非水平应用；
图5画出了基板带有储液腔的散热器，该储液腔中装有流体传热介质和虹吸芯；
图6画出了图1的散热器，其中肋片空腔中装有多孔金属虹吸芯50；
图7画出了图2的散热器，其中肋片空腔中装有多孔金属虹吸芯。
图1画出了根据本发明的散热器10。散热器10包含基板12、若干肋片14和传热介质16。基板12根据其预定用途可以是任何所需尺寸和形状，如矩形平板。通常，基板12的尺寸和形状应该使热源和散热器之间形成良好的热接触。例如若热源为矩形且有平顶面，基板则应为矩形且有平底面，以便与热源的顶部形成良好的热接触。基板12由导热材料构成，例如铝、铝合金、铜、铜合金、以及导热或薄壁聚合物。
肋片14与基板12热接触，且其底部13垂直定位于基板12的顶面以增大散热器10的表面积。肋片14被设置形成纵向通道，空气或流体传热介质可从中流过并散热。肋片14可以是任何所需的尺寸和形状。通常，肋片14为板状、圆柱形或矩形，其中肋片14的宽度从肋片14的底部13到尖端15逐渐减小。肋片14由导热材料构成，例如铝、铝合金、铜及铜合金。
每个肋片14具有肋片空腔18，空腔18中装有传热介质16。肋片空腔18可以完全封闭在肋片14壁内，如图1所示，或用基板12封闭。根据应用的需要，传热介质可以是流体传热介质或热传导介质。流体传热介质包括下述任何流体：即流体的热阻与沸点分别低于用来构成肋片和基板的材料的热阻与软化点。此外，流体传热介质不应使肋片和/或基板被腐蚀。流体传热介质包括的流体如：自来水、蒸馏水、酒精或上述流体的混合物。流体传热介质16应当仅部分充满空腔18，以便于汽化与冷凝。
流体传热介质增强了散热器的传热能力，而不增大其表面积、体积或重量。这种增强是由于流体传热介质汽化与冷凝的潜热。尤其是，汽化流体传热介质需要高量能量。于是可将大量的热从基板(或肋片底部)传导给流体传热介质。相反地，当汽化后的流体传热介质在肋片上部较冷壁上冷凝时，将高量能量从汽化的流体传热介质传导给肋片。这样，就将大量的热从流体传热介质传导给肋片。
肋片空腔18被抽真空并且密封住，以防止空气或流体进入或流出肋片空腔18。每个肋片14可有一个小孔，经该孔将空气从肋片空腔18中抽出，并将流体传热介质导入肋片空腔18中。该小孔用孔塞19密封。密封孔塞19可以用导热材料制成，如金属钎焊、锡焊料、高温焊料、聚合树脂、或带螺纹的金属旋塞/活门系统。
第二类传热介质为热传导介质，它包括下述任何导热材料(固体或液体)，即其热阻低于用来构成肋片和/或基板的材料的热阻。这种传热介质还应当是轻质(与肋片和/或基板相比)且低成本的。热传导介质的例子包括导热聚合物、固体金属、锡、锡合金、锡焊料、填充金属型聚合物，以及导热的液体聚合物。热传导介质应完全充满空腔，以使肋片与基板之间形成良好的热接触。
散热器10的尺寸应随每种热用途而改变。下述例子仅供用于说明，而不应在任何意义上被认做是对本发明加以限制。在该例子中，基板12为一矩形，厚75到125毫米、长304毫米、宽304毫米。肋片14为板状，高500毫米，底部径向为20到40毫米，顶端径向为10到20毫米。肋片壁厚约10毫米。如果热传导介质为蒸馏水，则散热器的传热速率大致为800到1000瓦/平方英尺。这大大高于典型的先有技术散热器的传热速率。
根据本发明一个实施例，图2图示了基板22带有储液腔24的散热器20，该储液腔中装有流体传热介质26。每个肋片25有一个肋片空腔27，该空腔与储液腔24及其它肋片空腔27共同形成散热器空腔28。或者，基板22可有多个储液腔，用于与肋片空腔形成多个散热器空腔。散热器20含有唯一一个小孔，经该孔将空气从散热器空腔28中抽出，并将流体传热介质26导入散热器空腔28中。该小孔用孔塞30密封。图2的肋片25为板形。图3图示了带有矩形肋片25的散热器20。
在水平应用(或位置)时，流体传热介质应当均匀遍布储液腔24。图2和图3所示散热器20在非水平应用时，将会导致储液腔24中的流体传热介质不均匀分布。特别是，流体传热介质将朝储液腔24较低侧汇集。图4示出了散热器20的非水平应用。流体传热介质在储液腔24中均匀分布能使流体传热介质与基板之间形成更好的热接触。流体传热介质非均匀分布则会相反地影响其与基板之间的热接触，就会减弱散热器的传热能力。
根据本发明一个实施例，图5示出了基板22带有储液腔44的散热器40，该储液腔中装有流体传热介质46和虹吸芯48。虹吸芯48使流体传热介质能够更均匀地遍布储液腔44，在散热器40非水平应用时尤其如此。虹吸芯48应为多孔的，用于毛细式传输流体传热介质46，它可由诸如铜和铝等金属、塑料、玻璃或陶瓷制成。
根据本发明的其它实施例，图6图示了图1的散热器10，其中在肋片空腔18中装有多孔的金属虹吸芯50，图7图示了图2的散热器20，其中肋片空腔28中含有多孔的金属虹吸芯60。在这些实施例中，多孔的金属虹吸芯50、60使流体传热介质能在肋片空腔和储液腔中更均匀地分布，而与散热器20、30的取向无关。从而无论在任何取向时，都能够确保进行传热操作。
尽管已经参照特定实施例对本发明做了相当详尽的说明，但仍可能有其它的改型。因此，本发明的精神与范围不应受限于对本文所含实施例的说明。

Claims (20)

1．一种散热器，其特征在于：
基板；
若干带有空腔的肋片，以及
传热介质，装在所述空腔中并且与所述基板热接触。
2．如权利要求1所述的散热器，其特征在于：所述传热介质为热传导介质。
3．如权利要求1所述的散热器，其特征在于：所述传热介质为流体，其热阻与沸点低于所述基板和所述若干肋片的热阻与软化点。
4．如权利要求3所述的散热器，其特征还在于：所述空腔中装有多孔的虹吸芯。
5．如权利要求1所述的散热器，其特征在于：所述传热介质包括水。
6．如权利要求1所述的散热器，其特征在于：所述传热介质包括酒精。
7．如权利要求1所述的散热器，其特征在于：所述传热介质包括导热材料，该材料的热阻低于所述基板和所述若干肋片的热阻。
8．如权利要求1所述的散热器，其特征在于：所述若干肋片被设置形成纵向通道。
9．如权利要求1所述的散热器，其特征在于：所述若干肋片中的每一个均由导热材料制成。
10．如权利要求1所述的散热器，其特征在于：所述基板由导热材料制成。
11．一种散热器，其特征在于：
带有储液腔的基板；
若干带有肋片空腔的肋片，被定位为使得所述肋片空腔与所述储液腔构成一个或多个散热器空腔；以及
传热介质，装在所述散热器空腔内。
12．如权利要求11所述的散热器，其特征在于：所述传热介质为热传导介质。
13．如权利要求11所述的散热器，其特征在于：所述传热介质为流体，其热阻与沸点低于所述基板和所述若干肋片的热阻与软化点。
14．如权利要求13所述的散热器，其特征还在于：所述储液腔中装有多孔的虹吸芯。
15．如权利要求13所述的散热器，其特征还在于：所述肋片空腔中装有多孔的虹吸芯。
16．如权利要求11所述的散热器，其特征在于：所述传热介质包括水。
17．如权利要求11所述的散热器，其特征在于：所述传热介质包括酒精。
18．如权利要求11所述的散热器，其特征在于：所述传热介质包括导热材料，该材料的热阻低于所述基板和所述若干肋片的热阻。
19．如权利要求11所述的散热器，其特征在于：所述若干肋片被设置形成纵向通道。
20．如权利要求11所述的散热器，其特征在于：所述若干肋片和所述基板由导热材料制成。
CN98120832A 1997-09-30 1998-09-29 复合散热器 Pending CN1213071A (zh)

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