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Publication numberCN1200822 C
Publication typeGrant
Application numberCN 01805481
PCT numberPCT/JP2001/001253
Publication date11 May 2005
Filing date21 Feb 2001
Priority date22 Feb 2000
Also published asCN1404445A, DE60137117D1, DE60144452D1, EP1258370A1, EP1258370A4, EP1258370B1, EP1843280A1, EP1843280B1, US6779733, US20030029921, WO2001062517A1
Publication number01805481.1, CN 01805481, CN 1200822 C, CN 1200822C, CN-C-1200822, CN01805481, CN01805481.1, CN1200822 C, CN1200822C, PCT/2001/1253, PCT/JP/1/001253, PCT/JP/1/01253, PCT/JP/2001/001253, PCT/JP/2001/01253, PCT/JP1/001253, PCT/JP1/01253, PCT/JP1001253, PCT/JP101253, PCT/JP2001/001253, PCT/JP2001/01253, PCT/JP2001001253, PCT/JP200101253
Inventors秋田雅典, 伊藤釭司, 森俊裕, 野上义生, 仓本佳男
Applicant东丽工程株式会社
Export CitationBiBTeX, EndNote, RefMan
External Links: SIPO, Espacenet
Noncontact ID card or the like and method of manufacturing the same
CN 1200822 C
Abstract  translated from Chinese
本发明的法接触式ID卡类,由在基体材料上形成天线的天线电路基板以及在埋设IC芯片的基体材料上形成连接前述IC芯片的电极的放大电极的插入基板构成,为了将前述天线电极与前述放大电极接合将两个基板叠层。 Method contact ID cards of the present invention, the antenna circuit board forming an antenna on a base material and inserting the substrate connecting the aforementioned IC chip electrodes enlarged electrode is formed on a buried IC chip base material, for the aforementioned antenna electrode and joining the two aforementioned amplification electrode laminate substrates.
Claims(16)  translated from Chinese
1.一种非接触式ID卡类,其特征在于,它包括:包含天线基体材料和形成在天线基体材料上的天线的天线电路基板;和插入基板,其包含具有芯片埋设用孔的插入基体材料、埋设在该芯片埋设用孔中的IC芯片、及形成在所述插入基体材料上以对所述IC芯片的电极进行连接的放大电极;所述两个基板叠层,以将所述天线的电极与所述放大电极进行接合。 A non-contact ID cards, characterized in that it comprises: comprising an antenna base material and forming an antenna circuit board on the antenna base material of the antenna; and inserting a substrate, which comprises a chip embedding hole insert substrate material, embedded in the chip embedding hole in an IC chip, and is formed on a base material is inserted to the pair of electrodes of the IC chip electrically connected to the amplifying; the two substrates laminated to the antenna The electrodes and the electrodes are bonded to enlarge.
2.如权利要求1所述的非接触式ID卡类,其特征在于,所述天线电极与所述放大电极用导电性接合材料结合。 2. The non-contact ID cards according to claim 1, wherein said antenna electrode and said conductive electrode is coupled amplifying bonding material.
3.如权利要求1所述的非接触式ID卡类,其特征在于,通过所述天线电路基板的基体材料与所述插入基板的基体材料的接合,所述天线电极与所述放大电极直接接合。 3. The non-contact ID cards according to claim 1, characterized in that the bonding substrate base material by the base material of the antenna and the circuit board is inserted, the antenna electrode and the electrode directly enlarge engagement.
4.如权利要求2或3所述非接触式ID卡类,其特征在于,在所述天线电路基板的基体材料与所述插入基板的基体材料之间配置绝缘性接合材料,以封接所述天线电路基板的天线形成部及所述IC芯片的电极形成部。 Claim 2 or 3, wherein the non-contact ID cards claim, characterized in that between the base material of the antenna circuit substrate and the substrate is inserted an insulating base material bonding material to seal the electrode forming portion of said antenna portion forming an antenna circuit board and the IC chip.
5.如权利要求4所述的非接触式ID卡类,其特征在于,所述IC芯片电极形成阻挡金属衬层。 5. The non-contact ID cards according to claim 4, wherein said IC chip electrode is formed a barrier metal layer.
6.如权利要求5所述的非接触式ID卡类,其特征在于,所述插入基板的基体材料及所述天线电路基板的基体材料由树脂膜构成。 6. The non-contact ID cards according to claim 5, characterized in that said insert base material and the base material of the substrate of the antenna circuit board made of a resin film.
7.一种非接触式ID卡类的制造方法,其特征在于,其包括以下工序:在天线电路基体材料上形成天线、以获得包含所述天线电路基体材料和所述天线的天线电路基板的工序;在插入基体材料上形成芯片埋设用孔的工序;将芯片埋设在所述插入基体材料的芯片埋设用孔中的工序;在所述插入基体材料上形成放大电极以对所述IC芯片的电极进行连接,以获得包含所述插入基体材料、所述IC芯片及所述放大电极的插入基板的工序;以及将所述插入基板与所述天线电路基板叠层以将所述天线的电极与所述放大电极进行接合的工序。 A method of manufacturing a non-contact ID card and the like, characterized in that it comprises the following steps of: forming an antenna on an antenna circuit base material, to obtain the antenna circuit board comprising the antenna circuit substrate and said antennas step; the chip embedded substrate insertion hole is formed in the step of; the chip embedded in the chip embedded in the matrix material is inserted with the hole in the step of; forming an electrode on an enlarged base material to the insertion of the IC chip connecting electrodes to obtain said insert comprising a base material, the IC chip and the electrode of the amplification step of inserting the substrate; and the insertion of the antenna circuit board substrate and to laminate the electrodes and the antenna The amplification step of joining the electrode.
8.如权利要求7所述的非接触式ID卡类的制造方法,其特征在于,以用导电性接合材料将所述天线电极及所述放大电极接合的方式将两个基板叠层。 8. A method of manufacturing a non-contact type ID card according to claim 7, characterized in that, in order to engage with a conductive electrode material and the electrode is jointed manner to enlarge the antenna laminate two substrates.
9.如权利要求7所述的非接触式ID卡类的制造方法,其特征在于,以借助将所述天线电路基板的基体材料与所述插入基板的基体材料接合将所述天线电极与所述放大电极直接接合的方式将两个基板叠层。 9. A method of manufacturing a non-contact type ID card according to claim 7, characterized in that, to the base material by means of the antenna circuit substrate and the substrate insertion material bonded to the base electrode of the antenna Enlarge said electrodes are directly connected to the two substrates laminated manner.
10.如权利要求9所述的非接触式ID卡类的制造方法,其特征在于,覆盖所述IC芯片的电极形成部而在经过所述电极形成工序的插入基板上附着绝缘性接合材料的接合材料附着工序之后,将两个基板叠层。 10. A method for manufacturing non-contact ID cards according to claim 9, characterized in that the electrode forming portion covering the IC chip and the electrode forming step after the insertion of an insulating substrate adhesion bonding material After the bonding material adhering step, the two laminated substrates.
11.如权利要求10所述的非接触式ID卡类的制造方法,其特征在于,利用丝网印刷法形成所述放大电极。 11. A method for manufacturing non-contact ID cards according to claim 10, characterized in that the amplification by screen printing electrode.
12.一种非接触式ID卡类的制造方法,其特征在于,它包括以下工序:在天线电路基板的原材料上形成多个由天线和天线电极而成的天线电路的工序;在插入基板的原材料上形成多个芯片埋设用孔的工序;将IC芯片埋设在所述芯片埋设用孔中的工序;在所述插入基板的原材料上形成与所述IC芯片导通的放大电极的工序;从所述插入基板的原材料冲裁出具有IC芯片和放大电极的插入基板的工序;将已冲裁出的插入基板的放大电极与所述天线电极在导通状态下进行接合的工序。 12. A method of manufacturing a non-contact ID card and the like, characterized in that it comprises the following steps: a plurality of step electrodes antenna circuit formed by the antenna and the antenna is formed on the antenna circuit board raw material; insertion substrate a plurality of chip embedding holes on the step of forming the raw material; the IC chip embedded in the chip embedding hole of the step; step of forming on the substrate material and the inserted IC chip conducting electrode is enlarged; from The insert substrate material punched out process interposer substrate having an IC chip and an enlarged electrodes; will enlarge the electrode has been punched out and inserted into the base of the antenna electrode in the conduction state engagement process.
13.一种非接触式ID卡类的制造方法,其特征在于,它包括以下工序:从形成有放大电极的插入基板的原材料冲裁出具有IC芯片和放大电极的插入基板的工序,该放大电极与预先埋设在多个芯片埋设用孔中的IC芯片导通;以及在形成由天线和天线电极而成的多个天线电路的天线电路基板的原材料上,将冲裁出的插入基板的放大电极与所述天线电极在导通状态下进行接合的工序。 13. A method of manufacturing a non-contact ID card and the like, characterized in that it comprises the following steps of: amplifying an electrode formed from the substrate material punched out of the insertion step inserting the substrate having an IC chip and an electrode of amplification, the amplified a plurality of electrodes and buried in advance with the chip embedded in the IC chip hole conduction; zoom in raw materials and a plurality of antennas by the antenna and the antenna circuit electrodes formed by the antenna circuit substrate, the substrate is punched out of the insert electrode and the antenna electrode in the conduction state engagement process.
14.如权利要求13所述的非接触式ID卡类的制造方法,其特征在于,所述插入基板的原材料和所述天线电路基板的原材料预先卷成卷状。 14. A method for manufacturing non-contact ID cards according to claim 13, characterized in that the antenna circuit board raw material and the interposer board raw material previously wound into a roll.
15.一种非接触式ID卡类的制造装置,其特征在于,它包括:从形成有放大电极的插入基板的原材料冲裁出具有IC芯片和放大电极的插入基板的装置,其中该放大电极与预先埋设在多个芯片埋设用孔中的IC芯片导通;以及在形成由天线和天线电极而成的多个天线电路的天线电路基板的原材料上,将冲裁出的插入基板的放大电极与所述天线电极在导通状态下进行接合的装置。 15. An apparatus for manufacturing non-contact ID card and the like, characterized in that it comprises: amplifying an electrode formed from the substrate material blanking insertion means having an IC chip and an enlarged electrode insertion substrate, wherein the enlarged electrode embedded in advance a plurality of holes in the chip embedded IC chip is turned on; and in the material forming the plurality of antennas by the antenna and the antenna circuit electrodes formed by the antenna circuit board, the insertion of the blanking electrode substrate amplification It means engaging with the antenna electrode in the conductive state.
16.如权利要求15所述的非接触式卡类的制造装置,其特征在于,其包括将所述插入基板的原材料和所述天线电路基板的原材料预先卷成卷状的装置。 16. The apparatus for manufacturing the non-contact type card according to claim 15, characterized in that it comprises the insert material and the antenna circuit board substrate material previously wound into a roll apparatus.
Description  translated from Chinese
非接触式识别信息卡类及其制造方法 Non-contact identification information cards and its manufacturing method

技术领域 Technical Field

本发明涉及非接触式ID(识别信息)卡类及其制造方法。 The present invention relates to a non-contact type ID (identification information) cards and its manufacturing method.

背景技术 Background

在现有技术中,例如,如加在商品上的标签那样,大多数条形码都通过印刷到或粘贴到卡状的纸上获得识别信息,这种条形码由于仅仅印刷到纸上,所以生产效率高,价格低廉。 In the prior art, for example, as a label applied to the goods, as are most of the bar code printed or pasted via the card-like sheet obtained identification information, since only this bar code printed onto the paper, so that high production efficiency , low prices.

另一方面,IC(集成电路)芯片与条形码不同,不仅仅简单的显示信息,而且极大地提高了信息量,而且可以进行信息的擦写。 On the other hand, IC (integrated circuit) chips with different bar codes, display information not only simple, but also greatly increase the amount of information, and the information can be erased. 并且随着IC芯片的生产率提高其价格也变得便宜起来。 And with the increase in productivity IC chips have become cheaper the price up. 因此,开始采用安装到天线电路基板上的IC芯片的所谓非接触式ID卡及非接触标签等(下面将其统称之为非接触式ID卡类)。 Thus, we began to use to install a so-called non-contact ID card and contactless IC chip on the tag antenna circuit board or the like (hereinafter referred to its system of non-contact ID cards).

众所周知,非接触式ID卡类可以同时读出和写入大量的信息,而且,从其很高的安全性的角度来看,在ID识别及电子结帐等方面蕴含着广泛的应用可能性。 As we all know, the non-contact ID cards can simultaneously read and write a lot of information, but also from its high safety standpoint, the ID recognition and electronic billing and other aspects contains a wide range of application possibilities. 从而,如果能够降低其制造成本的话,会飞快地促进其广泛地应用。 Thus, if we can reduce the manufacturing cost, it will quickly promote their wider application.

但是,非接触式ID卡类一般如图16所示,通过将粘贴各向异性导电膜(ACF:Anisotropic Conductive Film)1的天线回路基板2的天线电极3a,3b与IC芯片4的凸起部5a,5b在精确对位的状态下热压接,即,将两者结合进行制造。 However, non-contact ID cards generally shown in Figure 16, by pasting an anisotropic conductive film (ACF: Anisotropic Conductive Film) an antenna circuit board 2 of the antenna electrode 3a, 3b and 4 of the IC chip protrusion 5a, 5b in the exact position of the state at the thermocompression bonding, i.e., the combination of both manufacturing.

因此,存在着需高精度的连接设备、提高制造成本(主要组装成本)的问题。 Thus, there is a need to connect high-precision equipment, increase manufacturing cost (mainly assembly cost) problem. 而且,伴随着IC芯片4的进一步小型微细化,要求更高精度的组装技术,即使连接设备的价格进一步提高其生成率仍然很低,从而难以阻止成本的增加。 Moreover, along with the IC chip 4 further miniaturization finer, more precise assembly technology requirements, even if the price of the device is connected to further improve its production rate is still very low, making it difficult to prevent an increase in cost.

此外,以跨越连接到天线电极3a,3b上的天线6的方式,通过热压接将IC芯片4的凸出部5a,5b结合到天线电路基板2的天线电极3a,3b上,但天线6形成多匝,例如6匝(参照图17),在其两端上形成天线电极3a,3b。 In addition, connected to the antenna across the electrodes 3a, 3b on the way of the antenna 6 by thermocompression bonding the IC chip of the projecting portion 5a 4, 5b coupled to an antenna circuit board 2 of the antenna electrode 3a, the 3b, but the antenna 6 forming a plurality of turns, for example 6 turns (see Fig. 17), are formed on both ends of the antenna electrode 3a, 3b. 因此,随着IC芯片4的小型微细化。 Thus, as the IC chip 4 is small miniaturized. 天线6的线的宽度必须微细化,要求高精度的天线形成技术,就此而论,也很难阻止制造成本的增加。 The line width of the antenna 6 to be miniaturized, the antenna requires precision forming techniques, in this connection, it is difficult to prevent the increase in manufacturing cost.

本发明的第一个目的是提供一种即使IC芯片小型微细化也可以很容易地进行芯片电极和天线电路基板的天线电极的位置对准,阻止非接触式ID卡类的制造成本(主要是组装成本)的增加的非接触式ID卡类及其制造方法。 A first object of the present invention is to provide an even finer small IC chip can also be easily chip electrodes and the antenna circuit board of the antenna electrode positioning, prevent the manufacturing cost of non-contact ID cards (mainly assembly costs) increased non-contact ID cards and its manufacturing method.

此外,本发明的第二个目的是提供一种在天线电路基板与插入基板的叠层结构的非接触式ID卡中,可以在规定的部位保持良好的绝缘,且保持IC芯片电极与天线电路基板的天线电极良好的电连接的状态的非接触式ID卡类及其制造方法。 Further, a second object of the present invention is to provide a laminate structure non-contact ID card and the inserted antenna circuit board substrate, good insulation can be maintained in a predetermined position, and to keep the antenna circuit and the IC chip electrodes non-contact ID cards and antenna electrode substrate manufacturing method good electrical connection state.

发明内容 DISCLOSURE

为达到上述目的,本发明的非接触式ID卡类,其特征在于,它包括:包含天线基体材料和形成在天线基体材料上的天线的天线电路基板;和插入基板,其包含具有芯片埋设用孔的插入基体材料、埋设在该芯片埋设用孔中的IC芯片、及形成在所述插入基体材料上以对所述IC芯片的电极进行连接的放大电极;所述两个基板叠层,以将所述天线的电极与所述放大电极进行接合。 To achieve the above purpose, non-contact ID cards of the present invention is characterized in that it comprises: includes the antenna base material and forming the antenna circuit board on the antenna base material of the antenna; and interposer substrate, which comprises a chip embedded with Insert the base material of the hole, embedded in the chip embedding hole in an IC chip, and is formed on a base material is inserted to the pair of electrodes of the IC chip is electrically connected to the amplifying; the two substrates laminated to The electrode of the antenna and the electrodes are bonded amplification.

这样,由于中间经过放大电极以将IC芯片电极和天线电极接合将两个基板叠层,不受IC芯片小型微细化的影响可以简单地进行两个电极彼此之间的定位,从而,可以阻止非接触式ID卡类的制造成本(主要是组装成本)的增加。 Thus, since the amplified intermediate electrode and the electrode of the IC chip to the antenna electrode bonded laminate two substrates, IC chip small not affect miniaturization can be easily positioned between the two electrodes to each other, so that can prevent non- manufacturing cost contactless ID cards (mainly assembly cost) increases.

在本发明中,在接合天线电极和放大电极时,可以用导电性接合材料将天线电极和放大电极接合,或者,也可以通过将天线电路基板的基体材料与插入基板的基体材料粘接,将天线电极和放大电极直接接合。 In the present invention, when joining the antenna electrode and amplified electrodes can be a conductive bonding material to the antenna electrode and amplified electrode lands, or may be by the matrix material bonding the base material of the antenna circuit board and the insertion of the substrate, the antenna electrode and amplified electrodes are directly connected.

此外,为了将天线电路基板的天线形成部及IC芯片的电极形成部封接,可以在天线电路基板的基体材料与插入基板的基体材料之间配置绝缘性接合材料。 Further, the antenna for the antenna formed on the circuit board and the electrode portions are formed portion sealing the IC chip, can be configured to engage an insulating material between the substrate and the antenna circuit board inserted into the substrate base material. 进而,IC芯片电极也可以形成阻挡金属衬层(アンダ-バリヤ-メタル层)。 (- Ba ri Yakult - ア メ Tatari Hikaru nn the inter layer) Furthermore, IC chip electrode may also form a barrier metal layer.

通过在天线电路基板与插入基板之间填充绝缘性接合材料,可强化规定部位的绝缘和两个基板的结合,并且通过在IC电极上形成阻挡金属衬层(UBM层),可以很好地保持IC芯片电极与天线电路基板的天线电极的电接合状态(保持在导通状态)。 By inserting between the antenna and the circuit board substrate filled with an insulating bonding material, can enhance the binding sites and two predetermined insulating substrate and formed on an IC electrode by a barrier metal layer (UBM layer), can be well maintained the antenna electrode electrically IC chip electrodes and the antenna circuit board engagement state (maintained in the conductive state). 此外插入基板的基体材料及天线电路基板的基体材料可以用树脂膜构成。 Further insertion of the substrate the base material of the base material and the antenna circuit board may be a resin film.

另一方面,本发明的非接触式ID卡类的制造方法,其特征为,其包括以下工序:在天线电路基体材料上形成天线、以获得包含所述天线电路基体材料和所述天线的天线电路基板的工序;在插入基体材料上形成芯片埋设用孔的工序;将芯片埋设在所述插入基体材料的芯片埋设用孔中的工序;在所述插入基体材料上形成放大电极以对所述IC芯片的电极进行连接,以获得包含所述插入基体材料、所述IC芯片及所述放大电极的插入基板的工序;以及将所述插入基板与所述天线电路基板叠层以将所述天线的电极与所述放大电极进行接合的工序。 On the other hand, a method of manufacturing non-contact ID cards of the present invention, wherein, comprising the steps of: forming an antenna on the antenna circuit substrate, to obtain said antenna comprising an antenna circuit substrate and said antenna Step circuit substrate; a step of forming a hole on a chip embedded in the matrix material is inserted; the chip embedded in the matrix material is inserted in the chip embedding hole step; zoom electrode formed on the base material to the insertion of the electrodes connected to the IC chip, to obtain a matrix material comprising the insert, the IC chip and the electrode of the amplification step of inserting a substrate; and inserting the antenna circuit substrate and the laminate substrate to the antenna The electrode and the step of engaging the enlarged electrode.

这样,由于在埋设IC芯片的插入基板的基体材料上形成放大电极,并为使该放大电极与天线电极接合将两个基板叠层,所以,不受IC芯片小型微细化的影响可简单地进行两个电极彼此之间的定位,从而,可以阻止非接触式ID卡类的制造成本(主要是安装成本)。 Thus, since the electrodes are formed to enlarge an IC chip embedded in the base material of the substrate is inserted, and to enable the amplified electrode and antenna electrode bonded laminate of two substrates, so that the IC chip is not small fine impact may simply be positioned between the two electrodes to each other, whereby the manufacturing cost can be prevented contactless ID cards (mainly installation costs).

在将绝缘性接合材料夹在两个基体材料之间的情况下,为了覆盖IC芯片电极形成部在经过电极形成工序之后的插入基板上附着绝缘性接合材料的接合材料附着工序之后,可以将两个基板叠层。 In the case where after the insulating bonding material is sandwiched between two base materials, the electrode is formed to cover the IC chip adhesion portion adhered to the bonding material joining step insulating material on the substrate after the electrode forming step is inserted after the two can be laminate substrates. 此外,可以用简单的丝网印刷法形成放大电极。 In addition, a simple screen printing forming an enlarged electrode.

另外,本发明还提供一种非接触式ID卡类的制造方法,其特征在于,它包括以下工序:在天线电路基板的原材料上形成多个由天线和天线电极而成的天线电路的工序;在插入基板的原材料上形成多个芯片埋设用孔的工序;将IC芯片埋设在所述芯片埋设用孔中的工序;在所述插入基板的原材料上形成与所述IC芯片导通的放大电极的工序;从所述插入基板的原材料冲裁出具有IC芯片和放大电极的插入基板的工序;将已冲裁出的插入基板的放大电极与所述天线电极在导通状态下进行接合的工序。 Further, the present invention also provides a method of manufacturing a non-contact type ID card, characterized in that it comprises the following steps: a plurality of step electrodes antenna circuit formed by the antenna and the antenna is formed on the antenna circuit board raw material; forming a plurality of chip embedding holes on the step of inserting a substrate material; the IC chip embedded in the chip embedding hole of the step; and amplifying said IC chip electrode is formed on a conductive substrate material of the insert a step; from the insertion of the substrate material having an IC chip and punched out to enlarge the electrode insertion substrate; will enlarge the electrode has been punched out and inserted into the base of the antenna electrode in the conduction state engagement process .

另外,本发明还提供一种非接触式ID卡类的制造方法,其特征在于,它包括以下工序:从形成有放大电极的插入基板的原材料冲裁出具有IC芯片和放大电极的插入基板的工序,该放大电极与预先埋设在多个芯片埋设用孔中的IC芯片导通;以及在形成由天线和天线电极而成的多个天线电路的天线电路基板的原材料上,将冲裁出的插入基板的放大电极与所述天线电极在导通状态下进行接合的工序。 Further, the present invention also provides a method of manufacturing a non-contact type ID card type, characterized in that it comprises the following steps: amplifying material formed from the electrode substrate insertion punched out and inserted into an IC chip having an enlarged base electrode step, the amplified electrode buried in advance a plurality of chip embedding holes in an IC chip is turned on; and in the material forming the plurality of antennas by the antenna and the antenna circuit electrodes formed by the antenna circuit board, the punched-out Enlarge electrode inserted into the base of the antenna electrode in the conduction state engagement process.

另外,本发明还提供一种非接触式ID卡类的制造装置,其特征在于,它包括:从形成有放大电极的插入基板的原材料冲裁出具有IC芯片和放大电极的插入基板的装置,其中该放大电极与预先埋设在多个芯片埋设用孔中的IC芯片导通;在形成由天线和天线电极而成的多个天线电路的天线电路基板的原材料上,将冲裁出的插入基板的放大电极与所述天线电极在导通状态下进行接合的装置。 Further, the present invention provides apparatus for manufacturing a non-contact type ID card, characterized in that it comprises: amplifying an electrode formed from the substrate material blanking insertion means having an IC chip and an enlarged electrode insertion substrate, wherein the amplified electrode buried in advance a plurality of chip embedding holes in an IC chip is turned on; material formed on a plurality of antennas by the antenna and the antenna circuit electrodes formed by the antenna circuit board, the board is inserted into the punching It means joining an enlarged electrode and the antenna electrode in the conductive state.

附图说明 Brief Description

图1、是表示根据本发明的非接触式ID卡类的基板叠层的形式的正视图。 Figure 1 is a representation according to the form of non-contact ID cards of the present invention is a front view of the substrate stack.

图2、是图1的平面图。 Figure 2 is a plan view of FIG.

图3、是插入基板的正视图。 Figure 3 is a front view of the insertion of the substrate.

图4、是图3的平面图。 Figure 4 is a plan view of FIG. 3.

图5、是表示形成IC回路的晶片的图示。 Figure 5 shows the formation of a wafer IC circuit diagram.

图6、是表示晶片切割形式的图示。 Figure 6 is a diagram illustrating the form of wafer dicing.

图7、是表示制造插入基板用的原材料的图示,(A)为平面图,(B)为正视图。 FIG. 7 is a diagram illustrating substrate inserted manufacture raw material, (A) is a plan view, (B) is a front view.

图8、是表示将IC芯片插入到芯片埋入用孔中的形式的图示。 Figure 8 shows the IC chip is inserted into the hole in the chip embedded in the form of illustration.

图9、是插入基板的主要部分的放大图。 9, the substrate is inserted into the main portion enlarged view.

图10、是表示根据本发明的非接触式ID卡类的另外的基板叠层形式的正视图。 Figure 10 shows a laminated substrate according to another form of non-contact ID card like a front view of the present invention.

图11、是表示插入基板的另一个例子的图示。 FIG 11 is a diagram of another example of the insertion of the substrate shown.

图12、是表示插入基板的再一个例子的图示。 Figure 12 is showing a further example of the insertion of the substrate. FIG.

图13、是表示挤压叠层的天线电路基板和插入基板的形式的图示。 Figure 13 shows the extrusion laminated antenna circuit board and the interposer substrate in the form of illustration.

图14、是表示非接触式ID卡类制造装置的结构的图示。 Figure 14 is a diagram showing the structure of a non-contact type ID card class manufacturing apparatus.

图15、是图14的ZZ线的向视图。 FIG. 15 is a view of FIG. 14 ZZ line.

图16、是表示现有技术的非接触式ID卡类的接合形式的图示。 16, is a form of art engaging non-contact ID cards illustration.

图17、是图16的天线形成部的平面图。 FIG 17 is a plan view of the antenna pattern portion 16 is formed.

具体实施方式 DETAILED DESCRIPTION

下面参照附图对本发明进行详细说明。 Referring to the drawings the present invention will be described in detail.

在本发明中,将天线电路基板和插入基板叠层构成非接触式ID卡类。 In the present invention, the antenna circuit board and inserted into the base stack constituting a non-contact ID cards. 其形态示于作为正视图的图1上,其平面视图的形态示于图2。 Its shape as shown in the front view of FIG. 1, which forms a plane view shown in Fig. 在两个图中,下侧的天线电路基板2与上侧的插入基板7中间经过导电性接合材料8接合成导通状态。 In both figures, the antenna circuit board is inserted at the 2 and 7 on the upper side of the substrate through the middle of the conductive bonding material 8 joined into a conducting state.

并且,天线电路基板2,在用树脂膜构成的基体材料9上,形成天线6及与之连接的一对天线电极3a,3b(参照图17)。 Further, the antenna circuit board 2, on a substrate using a resin film 9 to form a pair of antennas and antenna electrode 6 connected thereto 3a, 3b (see FIG. 17). 另一方面,插入基板7,将IC芯片4埋设到树脂膜构成的基体材料10内,并且形成连接到IC芯片4的一对电极上的一对放大电极11a,11b。 On the other hand, the substrate 7 is inserted, the IC chip 4 is embedded in the base material of the resin film 10, and is connected to the IC chip are formed a pair of electrodes 4, a pair of amplification electrodes 11a, 11b.

此外,插入基板7的放大的形式示于图3,4上,在两个图中,IC芯片的一对电极12a,12b,例如为铝电极,这些电极分别连接到放大电极11a,11b的细的引线部11a1,11b1上。 In addition, the insertion magnified form on a substrate 7 shown in FIG. 3 and 4, in both figures, a pair of electrodes of the IC chip 12a, 12b, for example, aluminum electrodes which are connected to the amplifying thin electrodes 11a, 11b of the 11a1,11b1 the lead portion. 这样,插入基板7在埋设IC芯片4的基体材料10上形成与IC芯片4的电极12a,12b连接的放大电极11a,11b。 Thus, the substrate 7 is formed on the inserted IC chip embedded in the matrix material 4 and the IC chip 10 electrode 4 12a, 12b connected to the amplifying electrode 11a, 11b.

因此,在将插入基板7在导通的状态下叠层到天线电路基板2上面的情况下,可以简单地进行放大电极11a,11b对天线电极3a,3b的对位。 Therefore, under the interposer substrate 7 in the conductive state of the stack to the antenna circuit board 2 above case, you can simply zoom in electrodes 11a, 11b of the antenna electrodes 3a, 3b on the bit. 并且,据此,操作人员用适当的器具保持插入基板7进行叠层或者操作人员直接用手把持插入基板7进行叠层,可以用手工操作进行非接触式ID卡类的组装。 And, accordingly, the operator with an appropriate instrument remains inserted laminated substrate 7 or operator hand gripping inserted directly laminated substrate 7, can be assembled by hand contactless ID card category. 从而,即使IC芯片小型微细化,也可以防止制造成本(主要是组装成本)的增加。 Thus, even a small IC chip miniaturization, it is possible to prevent the manufacturing cost (mainly assembly cost) is increased.

此外,将天线电路基板2与插入基板7接合成导通状态用的导电性接合材料8,可以是有接合性或粘接性的糊状或带状材料,可以是各向异性的也可以是各向同性的。 In addition, the antenna circuit board 7 connected to the substrate 2 and the insertion synthesizing a conducting state by a conductive bonding material 8, there may be bonded or adhesive paste or strip material may be anisotropic may also be isotropic. 通过使用具有粘接性的材料,根据需要,可以简单地将叠层(组装)到天线电路基板2上地插入基板7卸下。 By using a material with an adhesive, if necessary, it can simply be stacked (assembly) to the antenna circuit board 2 is inserted on the substrate 7 removed.

上述接合材料8在两个基板叠层之前预先涂布或粘贴到天线电路基板2的天线电极3a,3b或插入基板7的放大电极11a,11b上。 8 until the bonding material is a laminate of two substrates previously coated or pasted to the antenna circuit board 2 of the antenna electrode 3a, 3b or the electrode substrate 7 is an enlarged insert 11a, upper 11b. 一般地,涂布或粘贴到天线电极基板2的天线电极3a,3b上。 Generally, the coating or paste to the antenna electrode substrate electrode 3a 2 of the antenna, the 3b.

此外,和导电性接合材料8的涂布或粘贴一起,为了将天线电路基板2的天线形成部及IC芯片4的电极形成部封接,优选地在天线电路基板2的基体材料9与插入基板7的基体材料10之间的封接部13(参照图1)内填充绝缘性接合材料14,借此,即可以防止短路,又可以强化插入基板7与天线电路基板2的接合,因此,可以很好地保持放大电极11a,11b与天线电极3a,3b的电接合状态(导通状态)。 In addition, the conductive bonding material and coated together or paste 8, the antenna to the antenna circuit board 2 and the IC chip electrode formation portions are formed in the sealing portion 4, preferably in the antenna circuit board substrate 9 and the insertion of the substrate 2 7 matrix material 10 is filled between the sealing portion 13 (see FIG. 1) within the insulating bonding material 14, thereby, which can prevent a short circuit, and can engage the substrate 7 and the reinforcing insert the antenna circuit board 2, and therefore, can be well maintained zoom electrodes 11a, 11b and the antenna electrode 3a, 3b electrical engagement state (conductive state).

该绝缘性接合材料14和导电性接合材料8一样可以是具有接合性或粘接性的糊状材料或带状材料。 The insulating bonding material 14 and a conductive bonding material 8 may be the same as an adhesive or adhesive tape material or pasty material.

此外,为了降低成本,放大电极11a,11b及天线6优选地用印刷方法,例如丝网印刷方法形成。 Further, in order to reduce costs, amplification electrodes 11a, 11b and the antenna 6 is preferably a printing method, such as screen printing method of forming. 但也可以根据需要使用其它印刷方法,例如胶印印刷方法,或者也可以使用除印刷以外的方法,例如溅射法等。 But may also need to use other printing methods, such as offset printing method, or by using a method other than printing, such as a sputtering method or the like.

导电性接合材料8及绝缘性接合材料14,一般地采用热固化材料,除此之外,也可以采用常温固化型材料等,在使用前一种材料的情况下,在制造时的规定工序中进行加热固化。 Conductive bonding material 8 insulative adhesive material 14, typically hot curing materials, in addition, can also be used at room temperature curable material, in the case of a material prior to use, provides a step in the manufacture of and heating and curing.

IC芯片电极12a,12b为了能够与放大电极11、11b可靠地连接,优选地形成阻挡金属衬层(下面称之为UBM层)。 IC chip electrodes 12a, 12b can be securely connected to the amplifying electrode 11,11b, preferably formed a barrier metal layer (hereinafter referred to as UBM layer).

上述IC芯片4可以按如下方式制造。 The IC chip 4 can be manufactured as follows. 在图5中,首先准备在上表面形成非接触式ID卡类用的IC电路的晶片15,为了露出该电路的电极12a,12b(例如铝电极),用弱酸性液体蚀刻除去玻璃钝化膜22(氧化膜)。 In FIG. 5, first, on the surface of the non-contact type ID card with an IC circuit chip 15 is formed, in order to expose the electrodes of the circuit 12a, 12b (e.g., aluminum electrode), a liquid with a weak acid etched glass passivation film is removed 22 (oxide film).

接着,在进行活化处理后,例如在90℃的非电解镀镍槽内浸渍20分钟,仅在铝电极12a,12b上形成约3μm的镍镀层17,接着在非电解镀金槽内浸渍10分钟,在镍镀层17上形成约0.1μm的金镀层18。 Next, after performing activation treatment, e.g., 20 minutes immersed in an electroless nickel plating bath 90 ℃ formed about 3μm nickel plating on the aluminum electrode 17 only 12a, 12b, and then immersed in an electroless gold plating bath for 10 minutes, formed about 0.1μm gold plating 18 on the nickel plating 17.

这样形成的镍镀层17及金镀层18,可防止铝电极12a,12b的恶化,并且确保铝电极12a,12b与外部端子可靠的连接。 Nickel plating and gold plating layer 17 thus formed is 18 to prevent aluminum electrodes 12a, 12b of the deterioration, and to ensure 12a, 12b and the external terminal connection reliable aluminum electrode. 镀层17和18构成UBM层19。 17 and 18 constituting the UBM plating layer 19.

然后,用丝网印刷机在除掉铝电极12a,12b部分之外的晶片15的整个上表面上印刷阻焊膜20,接着利用加热炉加热使之固化,形成厚度20μm的绝缘层。 Then, using a screen printing machine in the removal of the aluminum electrode 12a, on the entire upper surface of the portion 12b of the wafer 15 outside the printing solder mask 20, followed by the use of a heating furnace heated to cure to form an insulating layer of a thickness of 20μm. 此外,代替阻焊膜,使用热固型聚酰亚胺油墨等也是有效地的。 Further, instead of solder mask, use a thermosetting polyimide inks also effective places.

其次,用丝网印刷机在铝电极12a,12b的开口部(未印刷阻焊膜20的部分)上印刷填充分散有银粒子的导电性涂膏21,将其加热固化。 Then, using a screen printing machine in the opening portion of the aluminum electrode 12a, 12b (not part of the solder resist film 20 is printed) printing filled with dispersed conductive particles coated with silver paste 21, which was heat cured.

然后,研磨所述晶片15的表面23(不形成非接触式ID卡类用IC电路一侧的面),将其厚度加工到例如50μm后,如图6所示,在晶片15的上表面(形成非接触式ID卡类用IC电路的面)上粘贴支持膜24,然后,通过使金刚石刀片25旋转,将晶片15切割成规定的大小(例如1.6mm×2.0mm),可以将这样制得的IC芯片4从支持膜24上卸下,将其排列在用电铸镍制成的托盘内。 Then, the polishing of the wafer 15 surface 23 (not forming a non-contact type ID card with an IC circuit side surface), which was processed to a thickness of 50μm after e.g., shown in Figure 6, the upper surface (the wafer 15 forming a non-contact ID cards with IC circuit surface) paste support film 24, and then, by the diamond blade 25 is rotated, the size of the chip 15 cut to a predetermined (for example 1.6mm × 2.0mm), can be thus obtained The IC chip 4 is removed from the support film 24, which is arranged in a tray made of nickel electroforming.

IC芯片4的制造也可以采用与上述方法不同的其它方法进行,利用这些方法,例如,可以获得其大小为1.2mm×1.6mm,在其对角线的位置上形成每边为100μm的正方形铝电极12a,12b的矩形的IC芯片。 4 IC chip manufacturing method described above may be employed with various other methods, using these methods, for example, you can obtain a size of 1.2mm × 1.6mm, in its position on each side of the diagonal of a square formed of aluminum 100μm rectangular IC chip electrodes 12a, 12b of. 此外,金刚石刀片25的前端设置成V字形,利用它切割晶片15,也可以获得具有锥形侧壁的IC芯片4。 In addition, the front end of the diamond blade 25 disposed in a V-shape by cutting the wafer 15 which can be obtained with an IC chip 4 tapered sidewalls.

对于插入基板7,例如,可按照以下方式制造。 For insertion of the substrate 7, for example, can be produced in the following manner. 首先准备如作为平面图的图7(A)所示的宽度比较宽的、即、箔状的树脂膜(例如,厚度100μm的聚酯系合金膜)构成的原材料30,以规定的图形在其上加工出多个芯片埋设用孔31。 First prepared as a plan view in FIG. 7 (A) shown in a relatively wide width, i.e., the foil-like resin film (e.g., thickness 100μm polyester alloy film) 30 composed of material, a predetermined pattern thereon processing a plurality of chip embedding hole 31.

例如,将形成多个与IC芯片4为相似形的突起的镍制的金属模加热到240℃,把该加热的金属模压到树脂膜30上,压制10秒钟后,急剧冷却金属模,冷却到80℃后,抽出金属模,加工成孔在纵向和横向方向上的间距为10mm,开口部为1.2mm×1.6mm,深度为50μm的芯片埋设用孔31(参照图7(B))。 For example, after forming a plurality of IC chips 4 is similar figures protrusions nickel metal mold was heated to 240 ℃, the heating of the metal mold to the resin film 30, pressing for 10 seconds, rapidly cooling metal mold, cooling after 80 ℃, extraction mold, processed into the hole spacing in the longitudinal and transverse direction is 10mm, the openings of 1.2mm × 1.6mm, a depth of 50μm chip embedded with holes 31 (see FIG. 7 (B)).

此外,作为芯片埋设用孔31的加工方法,也可以采用激光烧蚀法,等离子体蚀刻法,化学蚀刻法等。 Further, as the chip embedding hole 31 using processing method, laser ablation method can also be used, plasma etching method, chemical etching method or the like.

上述原材料30并不局限于非叠层型材料,也可采用叠层材料。 30 is not limited to the above-mentioned raw material non-laminated materials may also be used laminate. 例如,可以采用用树脂膜构成的第一原料和用树脂膜或金属箔构成的第二原材料叠层形成的双层结构。 For example, a two-layer structure of the first material and the second material laminated with a resin film or a metal foil with a resin film formed. 在双层结构原材料的情况下,从孔的加工的容易性的角度出发,优选地,将贯穿芯片埋设用孔31的第一原材料,叠层到第二种原材料上。 In the case of two-layer structure of the material, from the perspective of ease of machining starting hole, preferably, the chips are embedded with a first through hole 31 of the raw material, laminated to the second material.

然后,将IC芯片4插入并固定到原材料30的芯片埋设用孔31内。 Then, the IC chip 4 is inserted and fixed to the material of the chip 30 is embedded inside the hole 31. 这时,例如,如图8所示,优选地,在用复制销将极少量的低粘度的环氧树脂32复制到芯片埋设用孔31的底部上之后,将IC芯片4插入。 In this case, for example, it is shown in Figure 8, preferably, in a very small amount of an epoxy resin of low viscosity reproduced by copying the pin 32 to use after the chip is embedded on the bottom of the hole 31, the IC chip 4 is inserted.

IC芯片4从未设铝电极12a,12b的端部插入到芯片埋设用孔31内,并利用树脂32将插入的IC芯片4暂时固定。 IC chip 4 has never provided an aluminum electrode 12a, the end portion 12b is inserted into the chip embedding hole 31, and a resin 32 is inserted IC chip 4 is temporarily fixed. 然后将粘接剂填充到IC芯片4的侧面与芯片埋设用孔31的侧面之间的空隙内。 The adhesive is then filled into the IC chip side surface of the chip 4 is embedded with the gaps between the side surface of hole 31.

但是,也可以在芯片埋设用孔31的底部及侧壁上涂布粘接剂之后插入IC芯片4。 However, it may also be used on the side wall and the bottom of the hole after applying the adhesive 31 is inserted into the IC chip 4 is embedded in the chip. 此外,优选地,在芯片埋设用孔31的底部上贯穿放气孔,以便使热固化粘接剂时产生的气体逸出。 In addition, preferably, the chip embedded in the bottom of the hole 31 through the bleed hole, so that the gas generated during thermal curing adhesive agent escape.

这样,在仅露出铝电极12a,12b的形式下,可以将IC芯片4埋设在原材料30内。 Thus, only the form of the exposed aluminum electrodes 12a, 12b of the next, the IC chip 4 can be embedded in the material 30. 在进行这种埋设时,采用例如外径为1.5mm在中央部有0.5mm的吸气孔的喷嘴(图中未示出),吸附IC芯片将其从所排列的托盘取出,插入到原材料30的埋设用孔31内。 When performing this embedding, using, for example an outer diameter of 1.5mm in the center portion of the suction hole of 0.5mm has a nozzle (not shown), the adsorption of the IC chip to remove it from the tray are arranged, is inserted into the raw material 30 It is embedded within the hole 31.

此外,如前面所述,在制成具有锥形侧壁的IC芯片4的情况下,可以更简单地将IC芯片4插入到芯片埋设用孔31内。 In addition, as described above, in the case where the IC chip is made with tapered sidewalls 4, it can be more easily inserted into the IC chip 4 with a chip embedding hole 31. 即,由于IC芯片4,其表面用绝缘层保护,所以和一般的电子元件一样,可以进行批量处理。 That is, the IC chip 4 with an insulating layer to protect the surface, so and general electronic components, as can be batch processing. 因此,可以向形成多个侧面为锥形的芯片埋设用孔31的原材料30上供应IC芯片4,使原材料30进行超声波振动,将IC芯片4插入到芯片埋设用孔31内。 Thus, a plurality of side surfaces formed to be tapered chip embedded IC chip with the raw material supply hole 31 30 4, so that the raw material 30 was subjected to ultrasonic vibration, the IC chip 4 is inserted into the hole 31 of the chip is embedded. 这是,通过把侧壁制成锥形,可顺滑地进行IC芯片4的埋设,所以可极大地提高插入基板7的生产效率。 It is formed by the tapered side walls can be smoothly embedded IC chip 4, it is possible to greatly improve the production efficiency of the substrate 7 is inserted.

其次,形成连接IC芯片4的铝电极12a,12b的放大电极11a,11b。 Second, the formation of the aluminum electrode 4 connected to the IC chip amplifying electrodes 12a, 12b of the 11a, 11b. 这可以通过用丝网印刷机将预先分散有70%的银粒子的导电膏印刷到埋设于原材料30内的IC芯片4的铝电极12a,12b露出的面上形成。 This can be done using a screen printing machine will have 70% of the pre-dispersed conductive paste printed silver particles to the IC chip embedded in the material 30 of the aluminum electrode 4 12a, 12b formed on the surface exposed. 该导电膏和前面所述的导电膏21(参阅图5)相同。 21 (see Figure 5) the same as the previously described conductive paste and conductive paste.

例如,可以形成厚度约15μm,引线部11a1,11b1的宽度0.2mm,放大部的大小为3mm正方形,一个放大部与另一个放大部分的间距为8mm的放大电极11a,11b。 For example, formed to a thickness of about 15μm, the width of the lead portion 11a1,11b1 0.2mm, the size of an enlarged portion of 3mm square, an enlarged portion with an enlarged pitch of the other electrode is an enlarged portion of 8mm 11a, 11b.

接着,通过将形成放大电极11a,11b的原材料30冲裁成规定的大小,制得插入基板7。 Subsequently, by amplifying the formed electrodes 11a, 11b of material 30 punched out into a predetermined size, to obtain the substrate 7 is inserted. 例如,冲裁成10mm的方形。 For example, punched out into a 10mm square. 这样获得的插入基板7的一部分放大地示于图9。 Inserting a portion of the substrate 7 thus obtained is shown enlarged in Fig. 此外,如从上面的描述中可以看出的,插入基板7的基板材料与原材料30是同一种材料。 Moreover, as seen from the above description can be seen, the substrate material and the substrate material insert 30 is the same material 7.

另一方面,天线电路基板2可按下述方式制造。 On the other hand, the antenna circuit board 2 can be manufactured in the following manner. 一般地,选择和上述原材料30相同质地的原材料(例如厚100μm的聚酯合金膜)。 Generally, the selection and said the same texture 30 raw materials (for example, 100μm thick polyester alloy film). 在该原材料上不设置芯片埋设用孔31,将其宽度加工成规定的大小。 Not provided with a chip embedding hole 31, which will be processed to a predetermined width size on the raw materials.

将这种原材料以卷到卷的方式间歇地运送利用丝网印刷向其上印刷银膏,按一定间隔相继形成天线电路(天线6及天线电极3a,3b)。 In this way the material roll to roll intermittently transported thereto by screen printing on the printed silver paste, are formed at regular intervals successively antenna circuit (antenna 6 and antenna electrode 3a, 3b).

然后,在后一工序中,冲裁成规定的大小,即,冲裁成基体材料9的单位大小。 Then, in the latter step, punched out into a predetermined size, i.e., punched out into the size of the base material 9 units. 此外,也可以在把形成放大电极11a,11b的插入基板7组装(结合)到形成天线6及天线电极3a,3b到原材料上之后进行把基体材料9冲裁成单位大小的工序。 In addition, amplification may be formed in the electrodes 11a, 11b are inserted into the base assembly 7 (binding) to form an antenna 6 and an antenna electrode 3a, the substrate 9 were punched out into the size of the unit after step 3b to the raw material.

这样,例如,可以形成配线宽度0.25mm,其间距0.5mm,匝数为6匝,最外周为75mm×45mm的天线,并且在天线6的两端上形成大小为3mm的方形,间距为8mm的天线电极3a,3b(参照图17)天线电路基板2的基体材料9并不局限于上述非叠层材料,也可以是叠层型的。 Thus, for example, the line width can be formed 0.25mm, the spacing 0.5mm, the number of turns 6 turns, the outermost periphery of the antenna 75mm × 45mm, and the antenna 6 formed on both ends of a square size of 3mm, pitch 8mm The antenna electrode 3a, 3b (see FIG. 17) of the antenna circuit board 9 of the base material 2 is not limited to the above-described non-laminated material, or may be a laminate type. 例如,也可以采用将树脂构成的第一原材料和树脂膜或金属箔(例如,铝箔)构成的第二原材料叠层的结构。 For example, the first material may be used and the resin constituting the resin film or a metal foil (e.g., aluminum) laminate material composed of a second structure.

然后,将插入基板7叠层在所得到的天线电路基板2上。 Then, insert the antenna circuit board substrate 7 is laminated on the obtained 2. 这时,由于在插入基板7上形成放大电极11a,11b,所以可以利用手工操作很容易地一面将放大电极11a,11b置于天线电路基板2的天线电极3a,3b上,一面将两个基板重叠。 In this case, since the substrate is formed in the insertion zoom electrodes 11a, 11b on 7, can be easily manually utilize the enlarged side electrodes 11a, 11b placed on the antenna circuit board 2 of the antenna electrode 3a, the 3b, one side of the two substrates overlap.

在进行这种叠层之前,例如,在天线电极3a,3b上涂布导电性粘接剂,并且在封接部13(参照图1)内填充绝缘性接合材料14。 Before such a laminate, e.g., in the antenna electrode 3a, 3b coated conductive adhesive, and the insulating bonding material is filled in the sealing portion 13 (see FIG. 1) 14. 然后,在叠层之后,加热固化导电性接合材料8和绝缘性接合材料14,例如,在90℃加热固化5分钟将两者固定(结合)。 Then, after the lamination, heat curing electroconductive bonding material 8 and the insulating bonding material 14, e.g., heat cured at 90 ℃ 5 minutes the two fixed (bound).

通过上述手工操作进行的叠层,其叠层精度±1.0mm至±1.5mm的范围,这样可以制成非接触式ID卡类。 Stack via the manual operation, the scope of its laminated accuracy ± 1.0mm to ± 1.5mm, which can be made non-contact ID cards. 这种ID卡类是所谓内插件,将其进行适当的外包装制成市售产品。 Such ID cards are within the so-called plug-in, which is proper packaging is made of commercially available products.

在本发明中,也可以以图10所示的方式进行插入基板7对天线电路基板2的叠层。 In the present invention, it may be in the manner shown in FIG. 10 insert the antenna circuit board substrate 7 of the laminate 2. 该图表示将插入基板7接合到天线电路基板2上时的形式,绝缘性接合材料14及非绝缘性接合材料35a,35b粘贴到插入基板7的基体材料10上。 This figure shows the insertion of the substrate 7 joined to form 2 when the antenna circuit substrate, an insulating bonding material 14 and non-insulated bonding material 35a, 35b paste it into interposer substrate base material 7 on 10.

此外,绝缘性接合材料14由绝缘性粘接(接合)带构成,接合材料35a,35b由压敏粘接(接合)带构成。 In addition, insulating material 14 bonded by an insulating adhesive (bonded) with configuration, the bonding material 35a, 35b from the pressure-sensitive adhesive (bonded) with composition. 这些绝缘性粘接带及压敏粘接带都是两面胶带。 The insulating adhesive tape and the pressure-sensitive adhesive tape is double-sided tape.

从而,通过把插入基板7压接到天线电路基板2的基体材料9上,可以简单地将两个基体材料相互简单地粘接起来,并且,可以使天线电路基板2的天线电极3a,3b与插入基板7的放大电极11a,11b直接接触,接合成导电状态。 Thus, by inserting the substrate 7 is pressed to the antenna circuit board 2 on the base material 9, it can simply be two simple matrix material bonded to each other, and can make an antenna circuit board 2 of the antenna electrode 3a, 3b and Enlarge electrode 7 inserted into the base 11a, 11b direct contact seamed conductive state.

在上述描述中,将绝缘性接合材料14及接合材料35a,35b粘接到插入基板7上,但也可以把绝缘性接合材料14粘贴到插入基板7上,把接合材料35a,35b粘贴到天线电路基板2上。 In the above description, the bonding material 14 and an insulating joining materials 35a, 35b is adhered to the substrate 7 is inserted, but can also be joined to the insulating material 14 attached to the insert substrate 7, the bonding material 35a, 35b attached to the antenna 2 on the circuit board.

此外,也可以把绝缘性接合材料14粘贴到天线电路基板2侧,把接合材料35a,35b粘贴到天线电路基板2侧。 In addition, it can be an insulating bonding material 14 attached to the second side of the antenna circuit board, the bonding material 35a, 35b attached to an antenna circuit board 2 side. 但是,由于利用简单的动作即可将两者粘贴到插入基板7上对于叠层是最优选的。 However, since a simple operation of the two can be attached to the substrate 7 for inserting the laminate is most preferred.

此外,绝缘性接合材料14及接合材料35a,35b也可以是糊状的,但由于粘接胶带比涂布糊状材料更容易,所以优选地选择胶带。 In addition, an insulating bonding material 14 and the bonding material 35a, 35b may be a paste, but since the adhesive tape is easier than applying a paste material, it is preferably selected tape.

此外,接合材料35a,35b一般采用压敏性材料,但也可以采用热固性材料或其它材料例如常温固化型材料,在使用热固型材料时,在制造的规定工序中加热固定。 In addition, the bonding material 35a, 35b generally use pressure sensitive material, but may also be thermosetting materials or other materials such as room temperature curing type material, when using the thermosetting materials, the manufacturing process of the predetermined heat-fixed. 进而,如果需要的话,可以在天线电极6或放大电极11a,11b上涂布或粘贴导电性接合材料8。 Further, if desired, the antenna electrode 6 can be enlarged or electrodes 11a, 11b on the conductive coating or paste bonding material 8.

根据本发明的插入基板7并不限于图9所示的形式,也可以设置成其它的形式。 According to the present invention is inserted into the substrate 7 is not limited to the form shown in Figure 9, it may be provided in other forms.

例如,如图11所示,也可以把覆盖在晶片15的电极以外的部分的玻璃钝化膜22原封不动地用作晶片表面的绝缘层,在这种玻璃钝化膜22作为绝缘层的埋设IC芯片4的插入基板7的基体材料10上形成放大电极11a,11b。 E.g., 11, may be the cover glass wafer passivation film 15 other than the electrode portion 22 of the insulating layer as intact wafer surface, in which a glass passivation film 22 as an insulating layer, embedded IC chip into an enlarged electrode substrate 4 is formed on the substrate 10 7 11a, 11b.

此外,如图12所示,也可以在以玻璃钝化膜22作为绝缘膜的埋设IC芯片4的插入基板7上的基体材料10上以仅在电极12a,12b的部分上开口的方式形成感光性环氧树脂层36,并且在该感光性环氧树脂层36上形成放大电极11a,11b。 In addition, 12, is also available on a glass passivation film 22 as an insulating film is embedded IC chip into the substrate 4 7 base material 10 by way of the portion of the electrode 12a, 12b open only to form a photosensitive epoxy resin layer 36, and forming an electrode on the amplification of the photosensitive epoxy resin layer 36 11a, 11b. 进而,也可以代替上述感光性环氧树脂层36,形成阻焊膜20。 Further, may be used instead of the photosensitive epoxy layer 36, solder resist film 20 is formed.

这种感光性环氧树脂层36或代替它的阻焊层20,在将IC芯片4插入原材料30的芯片埋设用孔31固定之后,例如用丝网印刷机印刷规定的厚度形成,然后,接着在这样形成的感光性环氧树脂层36或阻焊膜20上形成放大电极11a,11b之后通过把原材料30冲裁成基体材料10的单位的大小,可以制成图12所示的结构的插入基板7。 Such photosensitive epoxy resin layer 36 or the solder resist layer 20 in place of it, after the IC chip 4 is inserted into the chip embedded material 31 of the fixing holes 30, for example, a screen printing machine is formed by printing a predetermined thickness, and then, followed by inserting an electrode is formed on the photosensitive amplifying epoxy layer or solder resist 36 thus formed film 20 11a, 11b by the size of the material after punching a base material 30 units 10, 12 may be made of the structure shown in FIG. 7 substrate.

此外,图9及图12所示的插入基板7,由于利用阻焊膜20或环氧树脂层36保护IC芯片4,与不形成上述膜20或层36的图11所示的插入基板7相比,抗拒热的影响的能力更强,且容易进行处理。 In addition, the insertion of the substrate 7 and 9 shown in FIG. 12, since the solder resist 20 or the epoxy layer 36 protect the IC chip 4, and the film 20 is not formed above layer 36 or substrate 11 is inserted as shown in FIG. 7 with than the ability to resist the influence of heat is stronger and easier to handle.

此外,在图9所示的插入基板7与图12所示的插入基板的对比中,前者,在基体材料10的上表面(形成放大电极11a的面)与阻焊膜20的上表面容易产生阶梯差,与此相比,后者不容易产生阶梯差,因此,对于形成放大电极11a,11b而言,后者有利。 The upper surface (surface forming an enlarged electrode 11a) and the solder mask Moreover, in contrast to FIG. 9 is inserted in the insertion substrate shown substrate 7 shown in FIG. 12, the former, on the surface of the base material 10 easy to produce 20 step difference, compared with the latter step is not easy to produce poor, therefore, 11a, 11b, the latter is advantageous for the formation of an enlarged electrode.

这种放大电极11a,11b的形成,并不局限于用上述丝网印刷法形成,也可以利用其它方法形成。 This amplification electrodes 11a, 11b is formed, is not limited to the above-mentioned screen printing method, it may be formed by other methods. 例如,在埋设于原材料30上的IC芯片4的铝电极12a,12b露出的整个面(全部面)上通过铝溅射形成金属膜,其次通过在整个金属膜的面上涂布抗蚀剂,干燥后,曝光,显影,形成抗蚀剂图形掩模,接着,利用铝蚀刻液除去掩模开口部的铝,可以形成放大电极11a,11b。 For example, the material 30 is embedded on the IC chip 4 of the aluminum electrode 12a, 12b formed by sputtering the entire surface of the exposed (entire surface) by the aluminum metal film, followed by coating the entire surface of the metal film resist, After drying, exposure and development to form a resist pattern mask, followed by an etching solution to remove aluminum aluminum mask opening portion may be formed to enlarge an electrode 11a, 11b.

此外,放大电极11a,11b及天线电极3a,3b根据需要也可以是其它材料,其形状,大小,厚度等可根据需要适当决定。 In addition, amplification electrodes 11a, 11b and the antenna electrode 3a, 3b as required may be other materials, shape, size, thickness and the like can be appropriately determined according to need.

此外,IC芯片4的制造方法,也可以是其它方法。 In addition, the manufacturing method of the IC chip 4, may be other methods. 例如,利用上表面形成非接触式ID卡类用的IC电路的上述晶片15,研磨,制成规定的厚度(例如,50μm),涂布光致抗蚀剂,干燥后,用光掩模仅对铝电极12a,12b的部分曝光,显影,除去光致抗蚀剂,仅露出铝电极12a,12b。 For example, is formed on the surface of the wafer by the above non-contact ID cards with the IC circuit 15, the grinding to produce a predetermined thickness (e.g., 50μm), coating a photoresist, after drying, a photomask only aluminum electrodes 12a, 12b are partially exposed, developed to remove the photoresist, exposing only the aluminum electrodes 12a, 12b.

然后,用等离子体处理晶片15,除去铝电极12的表面氧化膜后,利用溅射形成规定仅厚度(例如0.5μm)的钛钨层,在该钛钨层上形成规定厚度(例如例如0.05μm)的金层,最后剥离光致抗蚀剂。 Then, the wafer 15 with the plasma processing after removing the surface oxide film of the aluminum electrode 12, only a predetermined thickness is formed by sputtering (e.g. 0.5μm) of the titanium-tungsten layer is formed in a predetermined thickness on the titanium-tungsten layer (e.g., 0.05μm e.g. ) The gold layer, and finally stripping the photoresist. 这种钛钨层和金层是UBM层。 Such titanium-tungsten layer and a gold layer is UBM layer.

然后,使金刚石刀旋转,将晶片15切割成规定的大小,将这样获得的IC芯片4从支持膜24上取下也可。 Then, the diamond blade rotates, the wafer 15 is cut into a predetermined size, thus obtained IC chip 4 may be removed from the support film 24.

此外,天线电路基板2与插入基板7的叠层,一般地从上侧将插入基板7叠层到下侧的天线电路基板2上,但也可以从下侧将插入基板7接合到上侧的天线电路基板2上。 In addition, the insertion of the substrate 2 of the antenna circuit board 7 of the laminate, typically from the upper side of the substrate 7 is inserted laminated onto the lower side of the antenna circuit board 2, but can also be inserted from the lower side of the substrate 7 bonded to the side 2 on the antenna circuit board.

这时,作为,插入基板7相对于天线电路2定位用的机构,例如可以在天线电路基板2上设定L型标记,或者通过设置导销可以达到一定的叠层或接合精度。 At this time, as the insert 7 with respect to the substrate 2 is positioned with the antenna circuit means, e.g., the L-shaped mark may be set on the antenna circuit board 2, or can be achieved by providing guide pins laminated or joined a certain accuracy.

此外,可以如图13所示,利用上下一对密接工具36a,36b挤压叠层的两个基板2,7,可以增强接合强度。 In addition, 13, a pair of upper and lower adhesion utilization tool 36a, 36b of the two substrates 2,7 extrusion lamination, the bonding strength can be enhanced. 在插入基板7向天线电路基板2上粘贴的位置上涂布常温下瞬间固化型的绝缘性粘接剂,在粘贴插入基板7之后,通过利用密接工具36a,36b挤压电极,可以组装成非接触式ID卡类。 2 is inserted in the paste on the antenna circuit board 7 on the lower substrate position is applied instantaneously room temperature curing type insulating adhesive, the substrate 7 is inserted after pasting, adhesion by the use of tool 36a, 36b extruded electrode, can be assembled into a non- contactless ID cards. 例如,如果预先在货物等的票单上形成天线电路的话,根据需要可以粘贴插入基板。 For example, if an antenna circuit formed in advance at the ticket goods, etc, then you can paste as needed to insert the substrate. 形成天线电路的天线电路基板的尺寸及材料可以任意选择。 Dimensions and materials forming the antenna circuit board antenna circuit may be arbitrarily selected. 此外,以将带状的插入基板卷绕成卷,根据需要和条形码用标签一样抽出切断,将其粘贴导天线电路基板上。 In addition, the strip is inserted into the substrate is wound into a roll, according to the needs and the bar code label as out of cut and paste it on the antenna circuit board guide.

在本发明中,如上面所述,由于以中间经由放大电极11a,11b将IC芯片4的电极12a,12b及天线6的电极3a,3b接合的方式将两个基板叠层,所以,不受IC芯片小型微细化的影响,可以简单地进行两个电极彼此之间的位置对准,从而,能够用手工操作制造非接触式ID卡及非接触式标签等非接触式ID卡类,也可以用图14所示的装置进行制造。 In the present invention, as described above, since the intermediate electrode via the amplifier 11a, 11b will 3a, 3b engaging manner IC chip 4 electrodes 12a, 12b and the antenna 6 of the two laminated substrates, therefore, not subject to IC chip miniaturization of the impact of small, can easily be aligned with each other between the two electrode positions, which can be done by hand and manufacture of non-contact ID card and contactless tags and other non-contact ID cards, you can also manufactured by apparatus 14 shown in FIG.

该制造装置配备有天线电路基板用原材料开卷机40,天线电路印刷机41,加热炉42,插入基板用原材料开卷机43,压力切割装置44,剩余原材料卷取机45,插入基板临时粘贴机46,插入基板运送装置47,插入基板主粘贴机48,干燥机49,制品卷取机50。 This manufacturing apparatus is equipped with an antenna circuit board raw material uncoiler 40, the antenna circuit 41 presses, furnace 42, insert substrate material uncoiler 43, pressure cutting device 44, the remaining material coiler 45, inserted into the base machine 46 temporary Paste , insertion of the substrate conveying means 47, 48 inserted into the machine for attachment of the substrate principal, dryer 49, winder 50 products.

在该制造装置中,在从天线电路基板用原材料开卷机40输出的原材料37上,利用天线电路印刷机41印刷天线电路(天线6及天线电极3a,3b),然后,利用加热炉42加热固定天线电路。 In this manufacturing apparatus, the raw output from the antenna circuit board raw material uncoiler 40 37, 41 presses the antenna printed circuit antenna circuit (antenna 6 and antenna electrode 3a, 3b), and then using the heating furnace 42 is fixed antenna circuit. 与此同时,利用压力切割装置44冲裁从插入基板用原材料开卷机43输出的原材料30,获得规定大小的插入基板7,冲裁插入基板7之后剩余的原材料30被剩余原材料卷取机45卷取。 At the same time, the cutting device 44 by the pressure from the insertion punched substrate material uncoiler 43 outputs the raw material 30, obtained the required size of the interposer substrate 7, 7 remaining after punching 30 is inserted into the base material remaining 45 volumes of raw materials coiler take.

从原材料30上冲裁下来的插入基板7由插入基板运送装置47保持运送到接合部位(叠层位置),即,运送到在原材料37的上表面上形成的天线电路的上方。 Punched down from the raw material 30 into the substrate 7 by the holding means 47 is inserted above the substrate conveyed to the joint (stack location), i.e., transported to the upper surface of the antenna circuit 37 is formed of the material transport. 这时,由于在插入基板7上形成了放大电极11a,11b,所以可以很容易进行相对于形成在原材料37上的天线电路的定位。 In this case, since the substrate 7 is formed in the insertion enlarged electrode 11a, 11b, it can be easily carried out with respect to the antenna circuit 37 is formed on the positioning material.

此外,从插入基板用原材料开卷机43输出的原材料30,其上埋设有IC芯片4,形成有放大电极11a,11b,并且粘贴有绝缘性接合材料14和接合材料35a,35b(参照图10),进而还用保护带51保护粘接面,所述原材料30预先在前一工序中被卷绕成卷,安装到插入基板用原材料开卷机40上。 In addition, the output from the insertion of the substrate material 43 of material uncoiler 30, on which an IC chip embedded 4, there is formed an enlarged electrode 11a, 11b, and an insulating paste bonding material 14 and the bonding materials 35a, 35b (see Fig. 10) and then also used to protect the adhesive surface protection tape 51, the raw material 30 in advance in the previous step is wound into a roll mounted to the interposer substrate material uncoiler 40. 此外,在原材料30输出时,将保护带51卷绕起来,从原材料30上剥离。 Further, when the output of raw materials 30, the protective tape 51 is wound up, peeled from the raw material 30. 从而露出绝缘性接合材料14及接合材料35a,35b的粘接面(图10中的下表面侧)。 Thereby exposing the insulating bonding material 14 and the bonding material 35a, (lower side surface in FIG. 10) 35b of the adhesive surface.

在图15中,表示出插入基板7的运送形式,在该图中,插入基板运送装置47配备有由固定在机座47a的轨47b进行导向可沿图中的箭头方向移动的装有卡盘的滑子47c,以及用吸附器47d吸附保持从原材料30上冲裁下来的插入基板7、将其移交给滑子47c的吸附传送带47e。 In Figure 15, shown inserted in the form of conveyance of the substrate 7, in this figure, the insertion of the substrate 47 provided with a conveying device for guiding movable in the direction of the arrow in FIG mounted by a chuck fixed in the seat rail 47b 47a The slider 47c, and 47d with adsorber attract and hold the punching down from the raw material 30 into the substrate 7, which was handed over to the slider 47c adsorption belt 47e.

因此,当装有卡盘的滑子47c用卡盘夹持插入基板7向右侧的点划线的部位移动时,向其上方移动的插入基板临时粘贴机46的吸附头46a向下方移动,吸附保持插入基板7,接着向上方移动之后,进一步向右侧的原材料37的上方移动。 Thus, when the slider is equipped with chuck chuck 47c interposer substrate holder 7 is moved to the right of the dotted line of the site, its upward movement inserted into the base 46 of the provisional paste machine adsorption head 46a moves downward, attracting and holding the substrate 7 is inserted, and then move upward after further upward to the right side 37 of the material. 这样,可以向形成在原材料37的上表面上的天线电路的上方运送插入基板7,然后,通过吸附头46a向下方移动,进行临时定位(临时接合)。 Thus the top, may be formed on the upper surface 37 of the material of the antenna circuit board 7 is inserted conveyance, then, through the suction head 46a moves downward, temporarily positioning (temporarily joined).

此外,压力切割装置44,可以利用固定侧的下部金属模44a和可动侧的上部金属模44b从原材料30上冲裁插入基板7,并且冲裁完毕后,将金属模44b向上方移动。 In addition, the cutting device 44 the pressure, can lower portion 44a of the fixed side mold and the movable-side upper mold 44b from the substrate material 30 punched insert 7, and after completion of punching, the metal mold 44b moves upward. 这样,吸附传送带(バンド)47e的轴臂47f旋转,吸附器47d向下部金属模44a的上方移动,然后,轴臂47f向下方移动。 Thus, the adsorption belt (ba nn ド) 47f rotating shaft of the arm 47e, 47d adsorber down portion 44a of the metal mold is moved upward, and then, the arm shaft 47f moves downward.

从而,可以用吸附器47d吸附保持从原材料30上冲裁下来的插入基板7,接着,轴臂47f向上方移动并且旋转,吸附保持插入基板7的吸附器47d向装置卡盘的滑子47c上移动。 Thus, it can attract and hold the adsorption device 47d punched down from the raw material 30 into the substrate 7, then moved upward axis arm 47f and rotation, attracting and holding the substrate 7 inserted adsorber 47d slider 47c of the device on the chuck Mobile.

在上面的描述中,吸附器47d及吸附头46a接触图10所示的基板材料10的上表面(未涂布或粘贴接合材料35a,35b及绝缘性接合材料14的面),并对其吸附保持,此外,装有卡盘的滑子47c的前述卡盘把持基板材料10的左右端(图10中未涂布或粘贴接合材料35a,35b的左右端)。 In the above description, the upper surface of the absorber 47d and the suction head 46a contacts the substrate material shown in FIG. 10. 10 (uncoated or paste 35a, 35b and the insulating surface 14 of the bonding material bonding material), and its adsorption holding, in addition, it is equipped with chuck sliders 47c preceding chuck grip around the end of the substrate material 10 (FIG. 10 uncoated or paste bonding material 35a, 35b of the left and right side).

此外,在插入基板7的冲裁过程中及运送过程中,原材料30的运送停止,在上述插入基板7的冲裁过程及运送过程结束时在开始运送。 In addition, the interposer substrate 7 punching process and delivery process, delivery of raw material 30 is stopped, at the completion of the punching process interposer substrate 7 at the start of the delivery process and delivery. 这样,间歇式地运送原材料30。 Thus, the raw material 30 transported intermittently. 另一方面,原材料37以规定的速度连续地运送。 On the other hand, raw material 37 continuously transported at a predetermined speed. 此外,下部金属模44a的凸出部及上部金属模44b的凹部,用接合材料35a,35b及绝缘性接合材料14难以附着的材料构成。 In addition, the lower mold and the upper projecting portion 44a of the metal mold recess 44b, with the bonding material 35a, 35b and the insulating bonding material 14 attached hard material.

其次,向相对于原材料37的粘接部位的上方运送的插入基板7,利用插入基板7的临时粘贴机46暂时定位(暂时接合),即,中间经过绝缘性接合材料14及接合材料35a,35b暂时定位,接着被运送到插入基板主粘贴机48处,在该处,通过挤压等进行主(正式)定位(主接合),用干燥机49进行加热固化绝缘性接合材料14及接合材料35a,35b之后,用产品卷绕机50卷绕。 Secondly, with respect to the insert base material adhered to the upper portion 37 of conveyance of 7, by inserting the temporary substrate 46 is temporarily attached positioning device 7 (temporarily bonded), i.e., the intermediate bonding material through an insulating bonding material 14 and 35a, 35b temporary location, then be transported to the insert substrate principal pasting machine 48, where, by extrusion principal (official) location (main bonding), a dryer 49 for heating solidified insulating bonding material 14 and the bonding material 35a After 35b, with a product winder 50 winding.

此外,为提高制造速度,可以构成多头型压力切割装置44,插入基板运送装置47,插入基板暂时定位装置46及插入基板主定位装置48。 In addition, in order to improve production speed, can be constructed long type pressure cutting device 44 inserted into the substrate conveying means 47, positioning means 46 is temporarily inserted into the base plate and the base plate main positioning means 48 is inserted.

采用上述一系列的制造生产线,不需要高精度的焊接机就可以廉价高速地制造非接触式ID卡类。 With the above series of manufacturing production lines, no high-precision welding machine can be cheap to manufacture high-speed non-contact ID cards.

工业上的可利用性根据上面所述的本发明,由于使用埋设有IC芯片且形成连接到IC芯片的电极上的放大电极的插入基板,所以在将插入基板以导通状态叠层到天线电路基板上时,可以将放大电极的位置与天线电路基板的天线电极对准,所以,即使IC芯片小型微细化,也可以防止增加非接触式ID卡类的制造成本(主要是组装成本)。 INDUSTRIAL APPLICABILITY According to the present invention described above, since the IC chip is embedded and the insertion of the substrate is formed an enlarged electrode electrically connected to the IC chip on the substrate to be inserted so that the conduction state to the antenna circuit laminate When the substrate, an electrode can be amplified antenna electrode position aligned with the antenna circuit board, so that even a small IC chip miniaturization, it is possible to prevent an increase in manufacturing cost of non-contact ID cards (mainly assembly costs).

此外,在天线电路基板与插入基板之间的封接部内填充绝缘性接合材料,强化两个基板的接合,通过在IC芯片电极上形成阻挡金属衬层(UBM层),在天线电路基板与插入基板的叠层结构中,在规定的部位绝缘,并且,可以良好地保持IC芯片电极与天线电路基板的天线电极的电连接合状态(导通状态)。 Furthermore, in the sealing portion is filled between the circuit board and the antenna board insertion insulating bonding material, reinforcing joining two substrates, is formed on the IC chip by a barrier metal electrode layer (UBM layer), is inserted in the circuit board and the antenna laminated structure of the substrate, the predetermined portion of the insulation, and electrical connection can be satisfactorily maintained engaged state (conductive state) antenna electrode and the electrode of the IC chip antenna circuit board.

Classifications
International ClassificationG06K19/077
Cooperative ClassificationH01L2924/01079, H01L2224/73204, G06K19/07722, G06K19/07752, G06K19/07749, G06K19/07718, H01L2224/16, H01L2924/01078, H01L2224/05571, H01L2224/05026, H01L2224/05022, H01L2224/05001
European ClassificationG06K19/077D, G06K19/077E2, G06K19/077T2A, G06K19/077T
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