CN1085408C - 半导体封装及引线框架 - Google Patents

半导体封装及引线框架 Download PDF

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CN1085408C
CN1085408C CN95103012A CN95103012A CN1085408C CN 1085408 C CN1085408 C CN 1085408C CN 95103012 A CN95103012 A CN 95103012A CN 95103012 A CN95103012 A CN 95103012A CN 1085408 C CN1085408 C CN 1085408C
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孙德洙
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MagnaChip Semiconductor Ltd
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Abstract

一种半导体封装包括至少一块半导体芯片；一个带有支撑半导体芯片的芯片衬片、与芯片丝焊的内引线及从内引线延伸出的外引线；密封该芯片及引线框架内引线的塑封模压复合体，其中的引线框架外引线被安排在塑封模压复合体底表面的一区域内。一种用于该半导体封装的引线框架包括：待与半导体芯片焊盘相连接的内引线；从内引线延伸出的待与其它电路相连接的外引线，该外引线是从内引线的内侧端部向下弯曲的。

Description

半导体封装及引线框架
本发明涉及一种半导体封装及用于该半导体封装的引线框架，特别涉及引线框架的外引线位于该半导体封装底表面中部的半导体封装，以使当装配到印刷电路板上时，可将该半导体封装所占用的装配面积减至最小。
制造一种塑封的半导体封装通常所采用的工艺包括下列步骤：在晶片制造工艺后用锯开工艺将半导体芯片分开；将分开的芯片固定在引线框架的衬片上；给芯片的焊盘与内引线框架焊线以完成电连接；以及用树脂，如环氧树脂模压复合物模压成一个包括半导体芯片和引线框架内引线的预定体积。
普通的半导体封装有各式各样的封装类型，一些通常的类型示于图1(A)、(B)和(C)。
图1(A)表示一种“J”引出封装(SOJ型)，图1(B)表示一种鸥翼引出封装，而图1(C)表示另一种“J”引出封装。这些封装类型可根据引线框架的外引线在封装模块两边或四边的弯曲方式来分类。
SOJ型、底部引出封装型及鸥翼引出封装型是用于表面装配到印刷线路板上的半导体封装，而双列直插封装型、SIP、ZIP、QUIP型半导体封装是用于通孔型的半导体封装。
这类半导体封装的结构包括：至少一块半导体芯片1、支撑该半导体芯片1的芯片衬片2a、丝焊到芯片上的引线框架2的部件-许多内/外引线2b、2c，形成向半导体芯片1的外部传递电信号的路径、多根将半导体芯片1的焊盘分别与引线框架2的内引线2b作电连接的金属丝3、以及密封和保护半导体芯片1、引线框架2的内引线2b及金属丝3的塑封模压复合体4。
通过将位于塑料封装4的两边或四边的引线框架2的外引线2c焊成PWB图形把这类常规的半导体封装安装到印刷线路板上。
然而，对于如上所述常规半导体封装，因位于塑封模压复合体4两边或四边的引线框架2的外引线2c，在装配时，该封装会占用较大的装配面积，因而难以减小尺寸、重量、厚度等等。特别是在连续装配封装的情况下，由于离保持相邻封装间的距离最小来装配封装，基板必然还会变宽。在装配时，还担心由于回流焊接技术会在相邻封装的引线之间形成桥式连接。
所以，本发明的一个目的在于提供一种具有引线框架外引线的半导体封装，该外引线位于塑封模压复合体底表面中部，以使装配面积减至最小，足以使产品变得轻、薄、尺寸短小。
本发明的另一个目的在于提供一种用于本发明的半导体封装的引线框架。
为实现本发明的目的，本发明提供一种半导体封装包括：至少一个半导体芯片、一个具有支撑半导体芯片的芯片衬片的引线框架、多根丝焊到芯片上的内引线和多根由内引线延伸出的外引线、以及一个将芯片和引线框架的内引线密封起来的塑封模压复合体，其中，引线框架的外引线是从封装体的内部向下弯，外引线的端部在封装体底表面的区域之内。
引线框架的外引线按预定的间距安排在塑封模压复合体底表面的中部。
为达到本发明的其它目的，提供一种用于半导体封装的引线框架，包括：多根待分别连接到半导体芯片焊盘上的内引线；以及多根从内引线延伸出的、待与其它电路相连接的外引线，其中，该外引线是从内引线的内侧端部向下弯曲的，使得外引线适合于从半导体封装的低表面伸出。
根据本发明的半导体封装，因为构成从芯片向封装外部传递信号路径的引线框架的外引线被安排在塑封模压复合体底表面的中部，在装配到PWB上的情况下，封装的外引线和PWB的焊丝的连接部位位于被封装所占用部位的内部，因而其装配区域变小。即，在连续装配多个半导体封装的情况下，可减小相邻封装间距离，并能避免因焊接缺陷引致相邻封装间的有害接触。结果可使PWB或PCB变小。
下面参照附图通过对本发明优选实施例的详细描绘更加明白本发明的上述目的和其它优选点。
图1(A)、(B)和(C)是表示常规半导体封装的各种形式的局部剖视透视图；
图2和图3分别表示本发明的实施例，其中图2是表示本发明半导体封装结构的局部剖视图；图3是用于本发明半导体封装的引线框架透视图；
图4和图5分别表示本发明的另一个实施例，其中图4是表示本发明半导体封装结构的局部剖视透视图；图5是用于本发明半导体封装的引线框架的透视图。
下面参照附图详细地描述本发明的半导体封装。
图2是表示局部剖开的半导体封装内部结构的透视图，如该图所示，本发明的半导体封装采用将引线框架20的外引线23不伸向围绕芯片的塑封模压复合体左右两边，而将外引线按预定间距安排在底表面中部的一种结构。
这里，半导体芯片1被连接固定在引线框架20的芯片衬片21上，所说的半导体芯片1和引线框架20的内引线22通过金属丝3形成电连接。该半导体芯片1、引线框架20的内引线22及金属丝3从外部被塑封模压复合体4密封。该引线框架20的外引线23从塑封模压复合体的底表面中部伸出。
图3表示用于上述本发明半导体封装的引线框架的结构。如图3所示，其构成是将多根待与印刷线路板连接的外引线23从待与半导体芯片1连接的内引线22的内侧端部弯曲。这些外引线在芯片衬片2a的正下方，以使这些外引线23在塑封工艺过程中正好位于塑封模压复合体4底表面的中部。
即，将外引线23从水平位于芯片衬片21上部的内引线22的内侧端部弯成90度角，在附图中，从内引线22垂直下行的引线是外引线23，而条板24起到支撑内引线22的作用，以形成连续的引线框架。
这里，虽然表明一个将内引线22对称围绕芯片衬片21安排的实例，但也可安排成其它形式，例如将内引线22放射式地安排在芯片衬片21周围，也可不设置芯片衬片21。在使用引线框架完成小片接合焊、丝焊及模压工艺之后，通过切掉、修理伸到塑封模压复合体4外部的引线可得到图2所示的半导体封装。
按照这种半导体封装，由于其外引线23是在塑封模压复合体4底表面中部的同一平面露出，因而可做表面装配。在如此的表面装配的情况下，因无需外引线与PWB金属线间的连接空间，而不同于常规的鸥翼引出封装型，因而可以减少引线连接空间。
如上所述，依照本发明的半导体封装，由于构成向芯片外部传递信号路径的引线框架的外引线被安排在塑封模压复合体底表面中部，封装的外引线与PCB的金属线的连接部位完全可包含在封装区域中。即，在多个半导体封装连续装配的情况下，可最大限度地减少相邻封装间的间距，并可避免因不良焊接与相邻封装的有害接触。
图4和图5用来解释本发明的另一实施例，分别表示局部剖开封装的透视图及用于该封装的引线框架。
如图所示，根据本实施例的半导体封装，没有把安排在密封和保护半导体芯片1、引线框架30的内引线32及金属丝3的塑封模压复合体4底表面中部的外引线33做成上述实施例1的表面装配形式。而是引线从模压复合体表面伸出而形成，以便能装配到适合通孔型封装的PCB上。引线框架的外引线结构未弯成两个阶梯状，仅弯成一个与内引线垂直的阶梯而形成，从而引线框架的外引线基本上垂直地从塑封模压复合体的底表面伸出，因而可进行通孔型安装。
本实施例的封装和引线框架的其余结构与实施例1类同。
如上所述，依照本实施例的半导体封装，由于引线框架的外引线也安排在塑封模压复合体底部区域之内，因而封装的外引线和PCB的金属线连接部位也可包含在封装区域之内。即，在连续装配多个半导体封装的情况下，可最大限度地压缩相邻封装间的间距，并可避免由于焊接缺陷引致的相邻装的有害接触。

Claims (13)

1、一种半导体封装，包括：
至少一块半导体芯片；
带有支撑一块半导体芯片的芯片衬片、多根丝焊到芯片上的内引线及多根由内引线延伸出的外引线的引线框架；以及
密封该芯片和引线框架内引线的塑封模压复合体，
其特征在于，引线框架的外引线是从封装体的内部向下弯，外引线的端部在封装体底表面的区域之内。
2、如权利要求1所述的半导体封装，其特征在于所述的引线框架的外引线从塑封模压复合体的底表面露出，因而可做表面安装。
3、如权利要求1所述的半导体封装，其特征在于引线框架的外引线弯成一个与内引线垂直的阶梯，使得所述的引线框架的外引线垂直地从塑封模压复合体的底表面伸出，因而可进行通孔型安装。
4、一种用于半导体封装的引线框架，包括：
多根待分别连接到半导体芯片焊盘上的内引线；
以及多根从内引线延伸出的、待与其它电路相连接的外引线，
其特征在于，该外引线是从内引线的内侧端部向下弯曲的，使得外引线适合于从半导体封装的底表面伸出。
5、如权利要求4所述的引线框架，其特征在于，外引线被弯成两个阶梯。
6、如权利要求4所述的引线框架，其特征在于，进一步包括在中部区域形成的芯片衬片。
7、如权利要求6所述的引线框架，其特征在于，内引线相对于芯片衬片对称地安排。
8、如权利要求6所述的引线框架，其特征在于，内引线相对于芯片衬片呈放射状地安排。
9、如权利要求4所述的引线框架，其特征在于，外引线被弯成一个阶梯。
10、如权利要求9所述的引线框架，其特征在于，该引线框架还包括在中部区域形成的芯片衬片。
11、如权利要求9所述的引线框架，其特征在于，内引线相对于芯片衬片对称地安排。
12、如权利要求9所述的引线框架，其特征在于，内引线相对于芯片衬片呈放射状地安排。
13、如权利要求9所述的引线框架，其特征在于，外引线的端部形成类似一种三角形。
CN95103012A 1994-03-29 1995-03-22 半导体封装及引线框架 Expired - Lifetime CN1085408C (zh)

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KR1019940006391A KR970010676B1 (ko) 1994-03-29 1994-03-29 반도체 패키지 및 이에 사용되는 리드 프레임
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CN1120734A (zh) 1996-04-17

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