CN106430085A - Protection method for MEMS pressure sensor packaging - Google Patents
Protection method for MEMS pressure sensor packaging Download PDFInfo
- Publication number
- CN106430085A CN106430085A CN201611125109.3A CN201611125109A CN106430085A CN 106430085 A CN106430085 A CN 106430085A CN 201611125109 A CN201611125109 A CN 201611125109A CN 106430085 A CN106430085 A CN 106430085A
- Authority
- CN
- China
- Prior art keywords
- pressure sensor
- mems pressure
- encapsulation
- filled media
- mems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a protection method for MEMS pressure sensor packaging. Isolated packaging is carried out through adoption of gel, silicone oil and poly-p-xylene. The method comprises the steps of filling a core body equipped with a pressure sensor chip with a filling medium, and carrying out isolated protection on the pressure sensor chip and leads; and growing a layer of poly-p-xylene on a surface formed by the filling medium. Through application of above-mentioned mode, according to the protection method for the MEMS pressure sensor packaging provided by the invention, pollution of external moisture, ions and so on can be effective insulated; the filling medium can be effectively protected; when the pressure is changed, the pressure sensor chip and the leads connected with a shell are prevented from being damaged due to expansion of the air entering the medium, wherein the expansion results from the fact that the air pressure is reduced too fast; further the MEMS pressure sensor packaging is prevented from being damaged; and functions that the sensor core body is pollution resistant and transmits the pressure precisely are effectively realized. The technology is simple and the cost is low, so the production cost of the sensor can be effectively reduced.
Description
Technical field
The present invention relates to integrated antenna package field, more particularly, to a kind of guard method of MEMS pressure sensor encapsulation.
Background technology
In the encapsulation process of MEMS pressure sensor, oil-filled and convoluted diaphragm mode is usually used and carries out pressure transducer
The protection of chip, but because this technical matters is complex and relatively costly, for the cost of product will be increased in commercial production.
In addition, chip list cake Silica hydrogel guard method although chip can be protected not to be subject to steam, ion, dust
Deng contamination, but can suddenly diminish because of ambient atmos pressure in use, cause the gas entering in Silica hydrogel in environment under high pressure
Expanding occurs in body, and leads to gel to produce the phenomenon of bubbling, the electrical connection performance of impact lead.
Content of the invention
The invention mainly solves the technical problem of providing a kind of guard method of MEMS pressure sensor encapsulation, adopt
The core body of MEMS pressure sensor encapsulation instills that to grow a strata xylol on filling medium, and the surface being generated at it thin
Film, is stained with completely cutting off extraneous steam, ion etc., and can effectively protect filling medium, it is to avoid in pressure change, air pressure drop
Low lead to soon very much in medium enter air expansion, damage pressure sensor chip and with cage connection lead, and then protect
MEMS pressure sensor encapsulation will not destroy, and have effectively achieved sensor core stain resistant, the function of the accurate transmission of pressure.By
In process is simple, with low cost, the production cost of sensor can be effectively reduced.
For solving above-mentioned technical problem, one aspect of the present invention is：A kind of MEMS pressure sensor is provided
The guard method of encapsulation, carries out insulation package using gel, silicone oil and Parylene to chip, the method includes：
Using filled media, filling is carried out to the core body being provided with pressure sensor chip, pressure sensor chip and lead are entered
Row insulation blocking；
The superficial growth one strata xylol being formed in described filled media.
In a preferred embodiment of the present invention, described Parylene growth technique is typical vacuum electrode process,
Can be selected for other distinct temperature growth conditionss, form dense film on described filled media surface, for MEMS pressure sensor
Chip and the protection of surface filled media.
In a preferred embodiment of the present invention, the thickness of described dense film is less than 1 millimeter.
In a preferred embodiment of the present invention, described filled media is Silica hydrogel, polymethylphenyl siloxane fluid, methyl-silicone oil or olive
Olive oil.
The invention has the beneficial effects as follows：A kind of guard method of MEMS pressure sensor encapsulation that the present invention provides, adopts
Process is simple, with low cost, be suitable for batch production, can strengthen MEMS pressure sensor core body stain resistant ability and realize press
The accurate transmission of power.
Brief description
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, will make to required in embodiment description below
Accompanying drawing be briefly described it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained other according to these accompanying drawings
Accompanying drawing, wherein：
Fig. 1 is an a kind of preferred embodiment typical MEMS pressure of the guard method of MEMS pressure sensor of present invention encapsulation
The generalized section of sensor encapsulation；
Fig. 2 is an a kind of preferred embodiment typical MEMS pressure of the guard method of MEMS pressure sensor of present invention encapsulation
The structural representation of sensor encapsulation；
Fig. 3 is an a kind of preferred embodiment MEMS pressure sensor of the guard method of MEMS pressure sensor of present invention encapsulation
Encapsulation pours into the generalized section after filling medium；
Fig. 4 is an a kind of preferred embodiment MEMS pressure sensor of the guard method of MEMS pressure sensor of present invention encapsulation
Generalized section after encapsulation growth Parylene.
Specific embodiment
The enforcement it is clear that described will be clearly and completely described to the technical scheme in the embodiment of the present invention below
Example is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiment that technical staff is obtained under the premise of not making creative work, broadly falls into the model of present invention protection
Enclose.
As Figure 1-4, the embodiment of the present invention includes：
A kind of guard method of MEMS pressure sensor encapsulation, is isolated to chip using gel, silicone oil and Parylene
Encapsulation, the method includes：
Using filled media, filling is carried out to the core body being provided with pressure sensor chip, pressure sensor chip and lead are entered
Row insulation blocking；
The superficial growth one strata xylol being formed in described filled media.
Wherein, described Parylene growth technique is typical vacuum electrode process, also can be selected for the life of other distinct temperature
Elongate member, forms dense film on described filled media surface, for MEMS pressure sensor chip and surface filled media
Protection.
Further, the thickness of described dense film is less than 1 millimeter.
Further, described filled media is Silica hydrogel, polymethylphenyl siloxane fluid, methyl-silicone oil or olive oil.
Wherein, Fig. 1 is the generalized section of typical MEMS pressure sensor encapsulation in the present invention, and 1a, 1b press for MEMS
Force transducer shell, 2 is MEMS pressure sensor chip；MEMS pressure sensor chip is fixed on outer casing bottom by glue 3；Outward
The lead 6 that shell extraction electrode 4 is formed by lead key closing process with MEMS pressure sensor chip electrode 5 is connected.The knot of encapsulation
Composition is as shown in Figure 2.
In order to protect MEMS pressure sensor chip and connecting lead wire, in the cavity pocket of outer cover loading pressure sensor chip
Pour into filling medium 7, as shown in Figure 3.If from Silica hydrogel as filling medium, needing to wait for gel room temperature or heating cure；
If from oil mediums such as silicone oil, can direct growth Parylene.
Gas due to when ambient pressure changes to low pressure, entering filling medium 7 from high pressure has little time to arrange under low pressure
Go out and can expand, impact pressure transducer performance, Silica hydrogel solidification after or oiliness filling medium filling finish after, make
Form one layer of parylene film 8 with typical vacuum electrode process on filled media surface and shell top layer, as shown in Figure 4.
The vacuum growing environment of Parylene makes the gas in filling medium discharge, and the parylene film 8 on surface makes filling be situated between
Matter 7 is completely isolated with outside air, for the protection of MEMS pressure sensor chip and surface filled media.
In sum, the invention provides a kind of guard method of MEMS pressure sensor encapsulation, have Parylene
The filling medium of protective layer can prevent filling protection medium during pressure effect from being affected by external pressure with external environs
And destroyed, be furthermore possible to effectively to increase the water vapor on filled media surface, ion stain ability, have effectively achieved
Sensor stain resistant, the function of the accurate transmission of pressure, and the process is simple adopting, with low cost, it is suitable for batch production.
The foregoing is only embodiments of the invention, not thereby limit the present invention the scope of the claims, every using this
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in the technology neck of other correlations
Domain, is included within the scope of the present invention.
Claims (4)
1. the guard method of a kind of MEMS pressure sensor encapsulation, using gel, silicone oil and Parylene chip is carried out every
From encapsulation it is characterised in that the method includes：
Using filled media, filling is carried out to the core body being provided with pressure sensor chip, pressure sensor chip and lead are entered
Row insulation blocking；
The superficial growth one strata xylol being formed in described filled media.
2. the guard method of MEMS pressure sensor encapsulation according to claim 1 is it is characterised in that described gather to diformazan
Benzene growth technique is typical vacuum electrode process, also can be selected for other distinct temperature growth conditionss, on described filled media surface
Form dense film, for the protection of MEMS pressure sensor chip and surface filled media.
3. the guard method of MEMS pressure sensor according to claim 2 encapsulation is it is characterised in that described dense film
Thickness be less than 1 millimeter.
4. the guard method of MEMS pressure sensor according to claim 1 encapsulation is it is characterised in that described filled media
For Silica hydrogel, polymethylphenyl siloxane fluid, methyl-silicone oil or olive oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611125109.3A CN106430085A (en) | 2016-12-09 | 2016-12-09 | Protection method for MEMS pressure sensor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611125109.3A CN106430085A (en) | 2016-12-09 | 2016-12-09 | Protection method for MEMS pressure sensor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106430085A true CN106430085A (en) | 2017-02-22 |
Family
ID=58217462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611125109.3A Pending CN106430085A (en) | 2016-12-09 | 2016-12-09 | Protection method for MEMS pressure sensor packaging |
Country Status (1)
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| CN (1) | CN106430085A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107894297A (en) * | 2017-11-07 | 2018-04-10 | 无锡必创传感科技有限公司 | A kind of pressure sensor chip and its manufacture method |
| CN108020356A (en) * | 2017-11-27 | 2018-05-11 | 江西新力传感科技有限公司 | A kind of MEMS pressure sensor and its method for packing |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6550337B1 (en) * | 2000-01-19 | 2003-04-22 | Measurement Specialties, Inc. | Isolation technique for pressure sensing structure |
| US20080066550A1 (en) * | 2003-08-27 | 2008-03-20 | Shay Kaplan | Method for protecting resonating sensors and protected resonating sensors |
| US20090001487A1 (en) * | 2007-06-29 | 2009-01-01 | Fujitsu Limited | Packaged device and method of manufacturing the same |
| CN102539029A (en) * | 2012-02-29 | 2012-07-04 | 上海交通大学 | Three-dimensional fluid stress sensor based on flexible MEMS (microelectromechanical system) technology and array thereof |
| CN103257007A (en) * | 2012-02-17 | 2013-08-21 | 苏州敏芯微电子技术有限公司 | Pressure sensor dielectric medium isolation packaging structure and packaging method of same |
| CN204128731U (en) * | 2014-09-26 | 2015-01-28 | 深圳瑞德感知科技有限公司 | A kind of MEMS oil-filled pressure transducer |
| CN105203249A (en) * | 2014-06-19 | 2015-12-30 | 富士电机株式会社 | Double diaphragm type pressure sensor |
| CN205642678U (en) * | 2016-05-06 | 2016-10-12 | 浙江树人大学 | Multi -seal type pressure sensor |
-
2016
- 2016-12-09 CN CN201611125109.3A patent/CN106430085A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6550337B1 (en) * | 2000-01-19 | 2003-04-22 | Measurement Specialties, Inc. | Isolation technique for pressure sensing structure |
| US20080066550A1 (en) * | 2003-08-27 | 2008-03-20 | Shay Kaplan | Method for protecting resonating sensors and protected resonating sensors |
| US20090001487A1 (en) * | 2007-06-29 | 2009-01-01 | Fujitsu Limited | Packaged device and method of manufacturing the same |
| CN103257007A (en) * | 2012-02-17 | 2013-08-21 | 苏州敏芯微电子技术有限公司 | Pressure sensor dielectric medium isolation packaging structure and packaging method of same |
| CN102539029A (en) * | 2012-02-29 | 2012-07-04 | 上海交通大学 | Three-dimensional fluid stress sensor based on flexible MEMS (microelectromechanical system) technology and array thereof |
| CN105203249A (en) * | 2014-06-19 | 2015-12-30 | 富士电机株式会社 | Double diaphragm type pressure sensor |
| CN204128731U (en) * | 2014-09-26 | 2015-01-28 | 深圳瑞德感知科技有限公司 | A kind of MEMS oil-filled pressure transducer |
| CN205642678U (en) * | 2016-05-06 | 2016-10-12 | 浙江树人大学 | Multi -seal type pressure sensor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107894297A (en) * | 2017-11-07 | 2018-04-10 | 无锡必创传感科技有限公司 | A kind of pressure sensor chip and its manufacture method |
| CN107894297B (en) * | 2017-11-07 | 2020-02-18 | 无锡必创传感科技有限公司 | Pressure sensor chip and manufacturing method thereof |
| CN108020356A (en) * | 2017-11-27 | 2018-05-11 | 江西新力传感科技有限公司 | A kind of MEMS pressure sensor and its method for packing |
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Application publication date: 20170222 |