CN1059967C - 形成涂膜的方法和装置 - Google Patents
形成涂膜的方法和装置 Download PDFInfo
- Publication number
- CN1059967C CN1059967C CN94104922A CN94104922A CN1059967C CN 1059967 C CN1059967 C CN 1059967C CN 94104922 A CN94104922 A CN 94104922A CN 94104922 A CN94104922 A CN 94104922A CN 1059967 C CN1059967 C CN 1059967C
- Authority
- CN
- China
- Prior art keywords
- nozzle
- sheet
- solvent
- substrate
- coating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
Description
Claims (39)
Applications Claiming Priority (30)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP092579/1993 | 1993-03-25 | ||
JP9257993 | 1993-03-25 | ||
JP092579/93 | 1993-03-25 | ||
JP132594/1993 | 1993-05-10 | ||
JP132594/93 | 1993-05-10 | ||
JP13259493 | 1993-05-10 | ||
JP183442/93 | 1993-06-30 | ||
JP18344293 | 1993-06-30 | ||
JP183442/1993 | 1993-06-30 | ||
JP183443/93 | 1993-06-30 | ||
JP18344393 | 1993-06-30 | ||
JP183443/1993 | 1993-06-30 | ||
JP343722/1993 | 1993-12-16 | ||
JP343717/93 | 1993-12-16 | ||
JP343717/1993 | 1993-12-16 | ||
JP343722/93 | 1993-12-16 | ||
JP34371793 | 1993-12-16 | ||
JP34372293 | 1993-12-16 | ||
JP347348/1993 | 1993-12-24 | ||
JP347348/93 | 1993-12-24 | ||
JP34734893 | 1993-12-24 | ||
JP348812/93 | 1993-12-27 | ||
JP348812/1993 | 1993-12-27 | ||
JP34881293 | 1993-12-27 | ||
JP354052/1993 | 1993-12-28 | ||
JP354054/93 | 1993-12-28 | ||
JP35405493 | 1993-12-28 | ||
JP354052/93 | 1993-12-28 | ||
JP354054/1993 | 1993-12-28 | ||
JP35405293 | 1993-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1102505A CN1102505A (zh) | 1995-05-10 |
CN1059967C true CN1059967C (zh) | 2000-12-27 |
Family
ID=27580182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN94104922A Expired - Lifetime CN1059967C (zh) | 1993-03-25 | 1994-03-25 | 形成涂膜的方法和装置 |
Country Status (6)
Country | Link |
---|---|
US (3) | US5658615A (zh) |
EP (1) | EP0618504B1 (zh) |
KR (1) | KR100284556B1 (zh) |
CN (1) | CN1059967C (zh) |
DE (1) | DE69428391T2 (zh) |
SG (2) | SG93216A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101157074B (zh) * | 2006-10-02 | 2012-01-04 | Hoya株式会社 | 光膜的形成方法和装置以及光学物品 |
Families Citing this family (178)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3276449B2 (ja) * | 1993-05-13 | 2002-04-22 | 富士通株式会社 | 回転塗布方法 |
US6127279A (en) * | 1994-09-26 | 2000-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Solution applying method |
JPH08293452A (ja) * | 1995-04-25 | 1996-11-05 | Mitsubishi Electric Corp | レジスト塗布装置 |
US5952045A (en) * | 1995-07-27 | 1999-09-14 | Micron Technology, Inc. | Method and apparatus for improved coating of a semiconductor wafer |
JPH09106934A (ja) * | 1995-10-12 | 1997-04-22 | Dainippon Screen Mfg Co Ltd | 基板現像装置 |
KR970063423A (ko) * | 1996-02-01 | 1997-09-12 | 히가시 데쓰로 | 막형성방법 및 막형성장치 |
DE19619678C1 (de) | 1996-05-15 | 1997-11-20 | Steag Hamatech Gmbh Machines | Verfahren und Vorrichtung zum Beschichten von scheibenförmigen Informationsspeichermedien |
US5849084A (en) | 1996-06-21 | 1998-12-15 | Micron Technology, Inc. | Spin coating dispense arm assembly |
US5985031A (en) | 1996-06-21 | 1999-11-16 | Micron Technology, Inc. | Spin coating spindle and chuck assembly |
US5861061A (en) * | 1996-06-21 | 1999-01-19 | Micron Technology, Inc. | Spin coating bowl |
US6350319B1 (en) | 1998-03-13 | 2002-02-26 | Semitool, Inc. | Micro-environment reactor for processing a workpiece |
US6264752B1 (en) | 1998-03-13 | 2001-07-24 | Gary L. Curtis | Reactor for processing a microelectronic workpiece |
US6413436B1 (en) * | 1999-01-27 | 2002-07-02 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
US5759273A (en) * | 1996-07-16 | 1998-06-02 | Micron Technology, Inc. | Cross-section sample staining tool |
JP3254574B2 (ja) * | 1996-08-30 | 2002-02-12 | 東京エレクトロン株式会社 | 塗布膜形成方法及びその装置 |
US6147010A (en) | 1996-11-14 | 2000-11-14 | Micron Technology, Inc. | Solvent prewet and method to dispense the solvent prewet |
JP3333121B2 (ja) * | 1996-12-25 | 2002-10-07 | 東京エレクトロン株式会社 | 塗布装置 |
JP3300624B2 (ja) * | 1997-01-24 | 2002-07-08 | 東京エレクトロン株式会社 | 基板端面の洗浄方法 |
JP3410342B2 (ja) | 1997-01-31 | 2003-05-26 | 東京エレクトロン株式会社 | 塗布装置 |
EP0863538B1 (en) * | 1997-03-03 | 2003-05-21 | Tokyo Electron Limited | Coating apparatus and coating method |
TW432520B (en) * | 1997-03-31 | 2001-05-01 | Tokyo Electron Ltd | Photoresist coating method and apparatus |
DE19718471A1 (de) * | 1997-04-30 | 1998-11-05 | Steag Hamatech Gmbh Machines | Verfahren und Vorrichtung zum Verkleben von zwei Substraten |
US6207231B1 (en) * | 1997-05-07 | 2001-03-27 | Tokyo Electron Limited | Coating film forming method and coating apparatus |
US6240933B1 (en) | 1997-05-09 | 2001-06-05 | Semitool, Inc. | Methods for cleaning semiconductor surfaces |
US7264680B2 (en) * | 1997-05-09 | 2007-09-04 | Semitool, Inc. | Process and apparatus for treating a workpiece using ozone |
US7163588B2 (en) * | 1997-05-09 | 2007-01-16 | Semitool, Inc. | Processing a workpiece using water, a base, and ozone |
US7404863B2 (en) * | 1997-05-09 | 2008-07-29 | Semitool, Inc. | Methods of thinning a silicon wafer using HF and ozone |
US20050215063A1 (en) * | 1997-05-09 | 2005-09-29 | Bergman Eric J | System and methods for etching a silicon wafer using HF and ozone |
US6869487B1 (en) * | 1997-05-09 | 2005-03-22 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
US7378355B2 (en) | 1997-05-09 | 2008-05-27 | Semitool, Inc. | System and methods for polishing a wafer |
US6701941B1 (en) | 1997-05-09 | 2004-03-09 | Semitool, Inc. | Method for treating the surface of a workpiece |
US20050034745A1 (en) * | 1997-05-09 | 2005-02-17 | Semitool, Inc. | Processing a workpiece with ozone and a halogenated additive |
US7416611B2 (en) * | 1997-05-09 | 2008-08-26 | Semitool, Inc. | Process and apparatus for treating a workpiece with gases |
US20020157686A1 (en) * | 1997-05-09 | 2002-10-31 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
DE19722407A1 (de) * | 1997-05-28 | 1998-12-03 | Singulus Technologies Ag | Verfahren und Vorrichtung zur Schichtdicken- insbesondere Bondschichtdickenregelung |
SG71808A1 (en) * | 1997-07-04 | 2000-04-18 | Tokyo Electron Ltd | Centrifugal coating apparatus with detachable outer cup |
TW442336B (en) * | 1997-08-19 | 2001-06-23 | Tokyo Electron Ltd | Film forming method |
US6103636A (en) * | 1997-08-20 | 2000-08-15 | Micron Technology, Inc. | Method and apparatus for selective removal of material from wafer alignment marks |
US6248168B1 (en) * | 1997-12-15 | 2001-06-19 | Tokyo Electron Limited | Spin coating apparatus including aging unit and solvent replacement unit |
US6318385B1 (en) | 1998-03-13 | 2001-11-20 | Semitool, Inc. | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
US20050217707A1 (en) * | 1998-03-13 | 2005-10-06 | Aegerter Brian K | Selective processing of microelectronic workpiece surfaces |
US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
US6423642B1 (en) | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
US6635113B2 (en) | 1998-05-19 | 2003-10-21 | Tokyo Electron Limited | Coating apparatus and coating method |
JPH11340119A (ja) * | 1998-05-26 | 1999-12-10 | Tokyo Electron Ltd | 現像処理方法及び現像処理装置 |
JP3364155B2 (ja) * | 1998-06-05 | 2003-01-08 | 東京エレクトロン株式会社 | 塗布膜形成装置及びその方法 |
US6642155B1 (en) * | 1998-06-05 | 2003-11-04 | Micron Technology, Inc. | Method for applying a fluid to a rotating silicon wafer surface |
US6416583B1 (en) * | 1998-06-19 | 2002-07-09 | Tokyo Electron Limited | Film forming apparatus and film forming method |
FR2780665B1 (fr) * | 1998-07-03 | 2000-09-15 | Oreal | Procede et dispositif pour appliquer un revetement tel qu'une peinture ou un vernis |
KR100537040B1 (ko) * | 1998-08-19 | 2005-12-16 | 동경 엘렉트론 주식회사 | 현상장치 |
US6037275A (en) * | 1998-08-27 | 2000-03-14 | Alliedsignal Inc. | Nanoporous silica via combined stream deposition |
US6399425B1 (en) | 1998-09-02 | 2002-06-04 | Micron Technology, Inc. | Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices |
US6248171B1 (en) * | 1998-09-17 | 2001-06-19 | Silicon Valley Group, Inc. | Yield and line width performance for liquid polymers and other materials |
US6689215B2 (en) | 1998-09-17 | 2004-02-10 | Asml Holdings, N.V. | Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface |
US6387825B2 (en) | 1998-11-12 | 2002-05-14 | Advanced Micro Devices, Inc. | Solution flow-in for uniform deposition of spin-on films |
US6200913B1 (en) | 1998-11-12 | 2001-03-13 | Advanced Micro Devices, Inc. | Cure process for manufacture of low dielectric constant interlevel dielectric layers |
US6225240B1 (en) | 1998-11-12 | 2001-05-01 | Advanced Micro Devices, Inc. | Rapid acceleration methods for global planarization of spin-on films |
US6317642B1 (en) | 1998-11-12 | 2001-11-13 | Advanced Micro Devices, Inc. | Apparatus and methods for uniform scan dispensing of spin-on materials |
US6530340B2 (en) * | 1998-11-12 | 2003-03-11 | Advanced Micro Devices, Inc. | Apparatus for manufacturing planar spin-on films |
US6407009B1 (en) | 1998-11-12 | 2002-06-18 | Advanced Micro Devices, Inc. | Methods of manufacture of uniform spin-on films |
JP3458063B2 (ja) * | 1998-11-20 | 2003-10-20 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
US6302960B1 (en) | 1998-11-23 | 2001-10-16 | Applied Materials, Inc. | Photoresist coater |
US6548411B2 (en) | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
US6492284B2 (en) | 1999-01-22 | 2002-12-10 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
US6680253B2 (en) | 1999-01-22 | 2004-01-20 | Semitool, Inc. | Apparatus for processing a workpiece |
US6511914B2 (en) | 1999-01-22 | 2003-01-28 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
US7217325B2 (en) * | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
US7402467B1 (en) | 1999-03-26 | 2008-07-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
KR100585448B1 (ko) | 1999-04-08 | 2006-06-02 | 동경 엘렉트론 주식회사 | 막 형성방법 및 막 형성장치 |
KR100604024B1 (ko) | 1999-04-19 | 2006-07-24 | 동경 엘렉트론 주식회사 | 도포막 형성방법 및 도포장치 |
JP3616732B2 (ja) * | 1999-07-07 | 2005-02-02 | 東京エレクトロン株式会社 | 基板の処理方法及び処理装置 |
KR20020048376A (ko) * | 1999-07-29 | 2002-06-22 | 다니가와 다다시 | 원형 혹은 환상 도포막의 형성방법 |
JP2001060542A (ja) | 1999-08-19 | 2001-03-06 | Tokyo Electron Ltd | レジストパタ−ンの形成方法 |
US6261635B1 (en) * | 1999-08-27 | 2001-07-17 | Micron Technology, Inc. | Method for controlling air over a spinning microelectronic substrate |
US6232247B1 (en) | 1999-09-01 | 2001-05-15 | Micron Technology, Inc. | Substrate coating apparatus and semiconductor processing method of improving uniformity of liquid deposition |
US6536964B1 (en) * | 1999-09-03 | 2003-03-25 | Tokyo Electron Limited | Substrate processing system and substrate processing method |
US6555276B2 (en) | 1999-10-04 | 2003-04-29 | Micron Technology, Inc. | Substrate coating and semiconductor processing method of improving uniformity of liquid deposition |
US6322009B1 (en) * | 1999-10-29 | 2001-11-27 | Advanced Micro Devices, Inc. | Common nozzle for resist development |
US6170494B1 (en) * | 1999-11-12 | 2001-01-09 | Advanced Micro Devices, Inc. | Method for automatically cleaning resist nozzle |
JP4090648B2 (ja) * | 1999-11-18 | 2008-05-28 | 東京エレクトロン株式会社 | 膜形成方法及び膜形成装置 |
SE9904345D0 (sv) * | 1999-12-01 | 1999-12-01 | Ralf Goeran Andersson | method and device for producing a coherent layer of even thickness of liquid or melt on a rotating disk |
US6514344B2 (en) * | 1999-12-16 | 2003-02-04 | Tokyo Electron Limited | Film forming unit |
US6286231B1 (en) | 2000-01-12 | 2001-09-11 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
EP1124252A2 (en) * | 2000-02-10 | 2001-08-16 | Applied Materials, Inc. | Apparatus and process for processing substrates |
JP2001230191A (ja) * | 2000-02-18 | 2001-08-24 | Tokyo Electron Ltd | 処理液供給方法及び処理液供給装置 |
US6326319B1 (en) | 2000-07-03 | 2001-12-04 | Advanced Micro Devices, Inc. | Method for coating ultra-thin resist films |
AU2001282879A1 (en) * | 2000-07-08 | 2002-01-21 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US6746826B1 (en) | 2000-07-25 | 2004-06-08 | Asml Holding N.V. | Method for an improved developing process in wafer photolithography |
CA2314921A1 (en) * | 2000-08-03 | 2002-02-03 | Barry Partington | Apparatus and method for producing porous polymer particles |
KR100377400B1 (ko) * | 2000-09-18 | 2003-03-26 | 삼성에스디아이 주식회사 | 스핀 코팅장치 |
KR100798769B1 (ko) * | 2000-09-25 | 2008-01-29 | 동경 엘렉트론 주식회사 | 기판 처리장치 |
US6709699B2 (en) * | 2000-09-27 | 2004-03-23 | Kabushiki Kaisha Toshiba | Film-forming method, film-forming apparatus and liquid film drying apparatus |
US6500242B2 (en) * | 2001-01-04 | 2002-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd | Apparatus and method for degassing and preventing gelation in a viscous liquid |
EP1371755B1 (en) * | 2001-02-07 | 2007-02-28 | Tokyo Electron Limited | Method of electroless plating and apparatus for electroless plating |
US20050061676A1 (en) * | 2001-03-12 | 2005-03-24 | Wilson Gregory J. | System for electrochemically processing a workpiece |
US6860945B2 (en) * | 2001-03-22 | 2005-03-01 | Tokyo Electron Limited | Substrate coating unit and substrate coating method |
JP3967618B2 (ja) * | 2001-04-17 | 2007-08-29 | 東京エレクトロン株式会社 | 基板の処理方法及び基板の処理システム |
JP2002324745A (ja) * | 2001-04-25 | 2002-11-08 | Tokyo Ohka Kogyo Co Ltd | レジスト膜形成方法 |
JP3898906B2 (ja) * | 2001-05-22 | 2007-03-28 | 東京エレクトロン株式会社 | 基板の塗布装置 |
US6592939B1 (en) * | 2001-06-06 | 2003-07-15 | Advanced Micro Devices, Inc. | System for and method of using developer as a solvent to spread photoresist faster and reduce photoresist consumption |
KR100857972B1 (ko) * | 2001-06-07 | 2008-09-10 | 도쿄엘렉트론가부시키가이샤 | 도포막 형성방법 및 도포막 형성장치 |
JP3655576B2 (ja) * | 2001-07-26 | 2005-06-02 | 株式会社東芝 | 液膜形成方法及び半導体装置の製造方法 |
AU2002343330A1 (en) * | 2001-08-31 | 2003-03-10 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
JP3944368B2 (ja) * | 2001-09-05 | 2007-07-11 | 株式会社荏原製作所 | 基板処理装置及び基板処理方法 |
JP3658355B2 (ja) * | 2001-10-03 | 2005-06-08 | Hoya株式会社 | 塗布膜の乾燥方法、塗布膜の形成方法、及び塗布膜形成装置 |
US20030079679A1 (en) * | 2001-10-30 | 2003-05-01 | Toru Ikeda | Spin coater |
JP2003156858A (ja) * | 2001-11-22 | 2003-05-30 | Tokyo Electron Ltd | 基板処理方法及び基板処理システム |
JP3890229B2 (ja) * | 2001-12-27 | 2007-03-07 | 株式会社コガネイ | 薬液供給装置および薬液供給装置の脱気方法 |
US6992023B2 (en) * | 2001-12-28 | 2006-01-31 | Texas Instruments Incorporated | Method and system for drying semiconductor wafers in a spin coating process |
JP3947398B2 (ja) * | 2001-12-28 | 2007-07-18 | 株式会社コガネイ | 薬液供給装置および薬液供給方法 |
TW594421B (en) * | 2002-01-30 | 2004-06-21 | Toshiba Corp | Film forming method/device, image-forming method and semiconductor device manufacturing method |
JP4570008B2 (ja) * | 2002-04-16 | 2010-10-27 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
US6645880B1 (en) * | 2002-06-10 | 2003-11-11 | Dainippon Screen Mfg. Co., Ltd. | Treating solution applying method |
US6736896B2 (en) * | 2002-10-10 | 2004-05-18 | Taiwan Semiconductor Manufacturing Co., Ltd | Gas spray arm for spin coating apparatus |
US6846360B2 (en) * | 2003-01-13 | 2005-01-25 | Aptos Corporation | Apparatus and method for bubble-free application of a resin to a substrate |
US7041172B2 (en) * | 2003-02-20 | 2006-05-09 | Asml Holding N.V. | Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems |
JP3890025B2 (ja) * | 2003-03-10 | 2007-03-07 | 東京エレクトロン株式会社 | 塗布処理装置及び塗布処理方法 |
JP2004335923A (ja) * | 2003-05-12 | 2004-11-25 | Sony Corp | エッチング方法およびエッチング装置 |
US7370659B2 (en) * | 2003-08-06 | 2008-05-13 | Micron Technology, Inc. | Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning photolithographic stepper and/or scanner machines |
EP1536036B1 (en) * | 2003-11-14 | 2007-06-20 | Sharp Kabushiki Kaisha | Thin film forming apparatus |
JP4315787B2 (ja) * | 2003-11-18 | 2009-08-19 | 大日本スクリーン製造株式会社 | 基板処理装置、並びに被充填体における液体充填度および気体混入度判定構造 |
US7326437B2 (en) * | 2003-12-29 | 2008-02-05 | Asml Holding N.V. | Method and system for coating polymer solution on a substrate in a solvent saturated chamber |
US7384878B2 (en) * | 2004-05-20 | 2008-06-10 | International Business Machines Corporation | Method for applying a layer to a hydrophobic surface |
US7556697B2 (en) * | 2004-06-14 | 2009-07-07 | Fsi International, Inc. | System and method for carrying out liquid and subsequent drying treatments on one or more wafers |
KR100634374B1 (ko) * | 2004-06-23 | 2006-10-16 | 삼성전자주식회사 | 기판을 건조하는 장치 및 방법 |
JP4431461B2 (ja) * | 2004-08-09 | 2010-03-17 | オプトレックス株式会社 | 表示装置の製造方法 |
JP4464763B2 (ja) * | 2004-08-20 | 2010-05-19 | 東京エレクトロン株式会社 | 現像装置及び現像方法 |
KR101057121B1 (ko) * | 2004-09-03 | 2011-08-16 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널의 전극 패드 구조 |
JP4216238B2 (ja) * | 2004-09-24 | 2009-01-28 | 東京エレクトロン株式会社 | 塗布処理装置及び塗布処理方法 |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7255747B2 (en) | 2004-12-22 | 2007-08-14 | Sokudo Co., Ltd. | Coat/develop module with independent stations |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
TWI254358B (en) * | 2005-01-21 | 2006-05-01 | Promos Technologies Inc | Method of coating photoresist and photoresist layer formed by the same |
JP2006278966A (ja) * | 2005-03-30 | 2006-10-12 | Toshiba Corp | 半導体製造装置 |
JP4606234B2 (ja) * | 2005-04-15 | 2011-01-05 | 東京エレクトロン株式会社 | 液処理方法及び液処理装置 |
US7770535B2 (en) * | 2005-06-10 | 2010-08-10 | Semiconductor Energy Laboratory Co., Ltd. | Chemical solution application apparatus and chemical solution application method |
KR100685679B1 (ko) * | 2005-06-24 | 2007-02-26 | 주식회사 하이닉스반도체 | 스핀 코팅 방법 |
US7456928B2 (en) | 2005-08-29 | 2008-11-25 | Micron Technology, Inc. | Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography |
DE102005044796A1 (de) * | 2005-09-19 | 2007-03-29 | Hilger U. Kern Gmbh | Verfahren zur Steuerung einer Dosiereinrichtung für flüssige oder pasteuse Medien |
JP4493034B2 (ja) * | 2005-11-21 | 2010-06-30 | 東京エレクトロン株式会社 | 塗布膜の成膜方法及びその装置 |
US8472004B2 (en) * | 2006-01-18 | 2013-06-25 | Micron Technology, Inc. | Immersion photolithography scanner |
JP4527670B2 (ja) * | 2006-01-25 | 2010-08-18 | 東京エレクトロン株式会社 | 加熱処理装置、加熱処理方法、制御プログラムおよびコンピュータ読取可能な記憶媒体 |
KR20090068236A (ko) * | 2006-09-08 | 2009-06-25 | 메사추세츠 인스티튜트 오브 테크놀로지 | 자동화된 층상 분무 기법 |
KR100818674B1 (ko) | 2007-02-07 | 2008-04-02 | 주식회사 에스앤에스텍 | 블랭크 마스크의 레지스트 코팅방법 및 이를 이용하여제조된 블랭크 마스크 및 포토마스크 |
JP4341686B2 (ja) * | 2007-02-23 | 2009-10-07 | セイコーエプソン株式会社 | 成膜装置および成膜方法 |
JP5091722B2 (ja) * | 2008-03-04 | 2012-12-05 | 東京エレクトロン株式会社 | 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置 |
US7718551B2 (en) * | 2008-03-07 | 2010-05-18 | United Microelectronics Corp. | Method for forming photoresist layer |
WO2009119226A1 (ja) * | 2008-03-27 | 2009-10-01 | セントラル硝子株式会社 | 吸水性物品の製法 |
WO2009139826A2 (en) * | 2008-05-12 | 2009-11-19 | Fsi International, Inc. | Substrate processing systems and related methods |
JP5029486B2 (ja) * | 2008-05-13 | 2012-09-19 | 東京エレクトロン株式会社 | 塗布装置、塗布方法及び記憶媒体 |
US20100015322A1 (en) * | 2008-07-18 | 2010-01-21 | Cheng Uei Precision Industry Co., Ltd. | Method And Apparatus For Coating A Film On A Substrate |
KR101036592B1 (ko) * | 2008-11-28 | 2011-05-24 | 세메스 주식회사 | 처리액 공급 유닛과, 이를 이용한 기판 처리 장치 |
CN101664731B (zh) * | 2009-09-11 | 2014-05-07 | 晶能光电(江西)有限公司 | 实现半导体圆片连续涂胶的方法及其净化系统 |
WO2012075309A1 (en) * | 2010-12-01 | 2012-06-07 | Yale University | Spin spray layer-by-layer assembly systems and methods |
JP4812897B1 (ja) * | 2010-12-22 | 2011-11-09 | ミクロ技研株式会社 | 基板処理装置及び基板処理方法 |
JP5944132B2 (ja) * | 2011-10-05 | 2016-07-05 | 株式会社Screenセミコンダクターソリューションズ | 塗布方法および塗布装置 |
CN102698926B (zh) * | 2012-05-03 | 2014-06-04 | 信华精机有限公司 | 一种uv镜套环自动涂油装置 |
DE102014113927B4 (de) | 2014-09-25 | 2023-10-05 | Suss Microtec Lithography Gmbh | Verfahren zum Beschichten eines Substrats sowie Beschichtungsanlage |
JP6212066B2 (ja) * | 2015-03-03 | 2017-10-11 | 東京エレクトロン株式会社 | 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置 |
JP6482919B2 (ja) | 2015-03-23 | 2019-03-13 | 株式会社Screenホールディングス | ネガティブ現像処理方法およびネガティブ現像処理装置 |
US9482957B1 (en) * | 2015-06-15 | 2016-11-01 | I-Shan Ke | Solvent for reducing resist consumption and method using solvent for reducing resist consumption |
US10655019B2 (en) * | 2015-06-30 | 2020-05-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Priming material for substrate coating |
JP6612172B2 (ja) * | 2016-04-25 | 2019-11-27 | Towa株式会社 | 樹脂成形装置、樹脂成形方法、樹脂成形品の製造方法及び製品の製造方法 |
CN105964488B (zh) * | 2016-05-30 | 2019-12-03 | 中国科学院半导体研究所 | 带基片加热和气氛处理的匀胶机 |
CN106252263A (zh) * | 2016-10-10 | 2016-12-21 | 上海华虹宏力半导体制造有限公司 | 光阻管路及光阻涂布设备 |
CN107552362A (zh) * | 2017-08-28 | 2018-01-09 | 京东方科技集团股份有限公司 | 保护膜形成方法及设备 |
JP6873011B2 (ja) * | 2017-08-30 | 2021-05-19 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
CN108196431A (zh) * | 2018-01-02 | 2018-06-22 | 京东方科技集团股份有限公司 | 光刻胶涂覆方法及涂布机 |
US11592748B2 (en) | 2018-11-30 | 2023-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for multi-spray RRC process with dynamic control |
KR102093279B1 (ko) * | 2019-07-09 | 2020-03-25 | (주)에스티글로벌 | 케미컬 용액의 파티클 모니터링 장치 및 방법 |
JP7232737B2 (ja) * | 2019-08-07 | 2023-03-03 | 東京エレクトロン株式会社 | 基板処理装置 |
CN110620065A (zh) * | 2019-08-26 | 2019-12-27 | 石狮市纳傲贸易有限公司 | 一种晶圆加工设备 |
JP7331568B2 (ja) * | 2019-09-12 | 2023-08-23 | 東京エレクトロン株式会社 | 液処理装置及び液処理装置の液検出方法 |
CN111897049A (zh) * | 2020-08-27 | 2020-11-06 | 四川天邑康和通信股份有限公司 | 一种光分路器芯片自动贴片生产工艺 |
KR20220108560A (ko) * | 2021-01-27 | 2022-08-03 | 삼성전자주식회사 | 기판 처리 장치 |
KR102573825B1 (ko) * | 2023-05-15 | 2023-09-04 | 주식회사 기술공작소바다 | 이비알 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0403086A2 (en) * | 1989-06-14 | 1990-12-19 | Hewlett-Packard Company | Method for improving deposit of photoresist on wafers |
US5002008A (en) * | 1988-05-27 | 1991-03-26 | Tokyo Electron Limited | Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49114402A (zh) * | 1973-02-28 | 1974-10-31 | ||
JPS5085638A (zh) * | 1973-11-30 | 1975-07-10 | ||
DE2809286C3 (de) * | 1978-03-01 | 1981-09-03 | Mannesmann AG, 4000 Düsseldorf | Vorrichtung zum Auftragen von flüssigen Korrosionsschutzmitteln auf metallische Oberfläche |
JPS6053675B2 (ja) * | 1978-09-20 | 1985-11-27 | 富士写真フイルム株式会社 | スピンコ−テイング方法 |
FR2458363A1 (fr) * | 1979-06-13 | 1981-01-02 | Matrasur | Manipulateur d'outil |
JPS5743422A (en) * | 1980-08-29 | 1982-03-11 | Toshiba Corp | Resist coating apparatus |
JPS5882521A (ja) * | 1981-07-10 | 1983-05-18 | Hitachi Ltd | スピンナ |
JPS5911895A (ja) * | 1982-07-13 | 1984-01-21 | 株式会社東芝 | 衣類乾燥機 |
US4564280A (en) * | 1982-10-28 | 1986-01-14 | Fujitsu Limited | Method and apparatus for developing resist film including a movable nozzle arm |
US4451507A (en) * | 1982-10-29 | 1984-05-29 | Rca Corporation | Automatic liquid dispensing apparatus for spinning surface of uniform thickness |
JPS59141220A (ja) * | 1983-02-02 | 1984-08-13 | Nec Corp | 塗布方法 |
JPS6191655A (ja) * | 1984-10-12 | 1986-05-09 | Matsushita Electronics Corp | ホトレジストの塗布方法 |
JPS61150332A (ja) * | 1984-12-25 | 1986-07-09 | Toshiba Corp | 半導体レジスト塗布方法 |
JPS61280618A (ja) * | 1985-05-17 | 1986-12-11 | Asahi Glass Co Ltd | 回転塗布方法および回転塗布装置 |
JPS6286719A (ja) * | 1985-10-11 | 1987-04-21 | Nec Corp | レジスト塗布装置 |
JPS62126640A (ja) * | 1985-11-27 | 1987-06-08 | Mitsubishi Electric Corp | 揮発性コ−テイング剤塗布装置の発塵防止装置 |
JPS63301520A (ja) * | 1987-05-30 | 1988-12-08 | Nec Corp | フォトレジスト塗布装置 |
JPH01150332A (ja) * | 1987-12-07 | 1989-06-13 | Nec Corp | プリント回路基板 |
US5066616A (en) * | 1989-06-14 | 1991-11-19 | Hewlett-Packard Company | Method for improving photoresist on wafers by applying fluid layer of liquid solvent |
US5366759A (en) * | 1990-11-14 | 1994-11-22 | Nokia (Deutschland) Gmbh | Method of lacquering the luminophore layer of a color picture tube |
KR100230753B1 (ko) * | 1991-01-23 | 1999-11-15 | 도꾜 일렉트론 큐슈리미티드 | 액도포 시스템 |
NL9201825A (nl) * | 1992-10-21 | 1994-05-16 | Od & Me Bv | Inrichting voor het vervaardigen van een matrijs voor een schijfvormige registratiedrager. |
US5366757A (en) * | 1992-10-30 | 1994-11-22 | International Business Machines Corporation | In situ resist control during spray and spin in vapor |
-
1994
- 1994-03-25 EP EP94104793A patent/EP0618504B1/en not_active Expired - Lifetime
- 1994-03-25 KR KR1019940006105A patent/KR100284556B1/ko not_active IP Right Cessation
- 1994-03-25 CN CN94104922A patent/CN1059967C/zh not_active Expired - Lifetime
- 1994-03-25 SG SG9904149A patent/SG93216A1/en unknown
- 1994-03-25 SG SG200400577-3A patent/SG130022A1/en unknown
- 1994-03-25 US US08/217,636 patent/US5658615A/en not_active Expired - Lifetime
- 1994-03-25 DE DE69428391T patent/DE69428391T2/de not_active Expired - Lifetime
-
1996
- 1996-07-26 US US08/686,910 patent/US5942035A/en not_active Expired - Lifetime
-
1999
- 1999-04-06 US US09/287,193 patent/US6063190A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5002008A (en) * | 1988-05-27 | 1991-03-26 | Tokyo Electron Limited | Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state |
EP0403086A2 (en) * | 1989-06-14 | 1990-12-19 | Hewlett-Packard Company | Method for improving deposit of photoresist on wafers |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101157074B (zh) * | 2006-10-02 | 2012-01-04 | Hoya株式会社 | 光膜的形成方法和装置以及光学物品 |
Also Published As
Publication number | Publication date |
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SG93216A1 (en) | 2002-12-17 |
KR940022743A (ko) | 1994-10-21 |
US6063190A (en) | 2000-05-16 |
EP0618504A3 (en) | 1996-04-10 |
SG130022A1 (en) | 2007-03-20 |
EP0618504B1 (en) | 2001-09-26 |
DE69428391D1 (de) | 2001-10-31 |
US5658615A (en) | 1997-08-19 |
KR100284556B1 (ko) | 2001-04-02 |
DE69428391T2 (de) | 2002-07-04 |
EP0618504A2 (en) | 1994-10-05 |
CN1102505A (zh) | 1995-05-10 |
US5942035A (en) | 1999-08-24 |
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