CN1054210C - 锯切数字微镜器件后的似大圆片加工 - Google Patents

锯切数字微镜器件后的似大圆片加工 Download PDF

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CN1054210C
CN1054210C CN94107015A CN94107015A CN1054210C CN 1054210 C CN1054210 C CN 1054210C CN 94107015 A CN94107015 A CN 94107015A CN 94107015 A CN94107015 A CN 94107015A CN 1054210 C CN1054210 C CN 1054210C
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理查德·O·盖尔
迈克尔·A·梅格尼亚德
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00888—Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/028—Dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening

Abstract

本发明涉及一种制造诸如数字微镜器件一类，微机械器件的加工固定件的方法，它能保护大圆片22上脆弱的结构在锯切操作和其后清洗操作期间免受碎屑的影响。在局部锯切大圆片22以产生锯槽之后，把大圆片22紧贴于真空固定件26上。然后将大圆片22的背面研磨减薄至锯槽24来分离器件32。每个器件32借助其上方端部空间内的真空紧贴于固定件上。在另一实施例中，器件通过把还在固定件上的大圆片完全锯开加以分离。

Description

锯切数字微镜器件后的似大圆片加工
本发明涉及集成电路(IC)工艺加工领域，尤其涉及包括可变形微镜器件的微机械器件的制造。
为了有效地降低加工集成电路的成本，应当用半导体大圆片在单个基片上同时制造多个芯片来大批量生产单个电路或芯片。微电子机械系统(MEMS)的典型工艺包括加工期间诸如牺牲层去除和器件测试一类众多的芯片操作处理。以大圆片而非单个芯片形式进行这些工艺加工的能力极富吸引力。在大圆片级水平上实现这些工艺加工使必要的操作减少，因为加工设备只要移动和对准一个大圆片而非许多个芯片。芯片测试的对准或对齐操作极为苛刻。在完成了所有大圆片级加工之后进行芯片的分离和封装。在从大圆片上分离器件时，会产生圆片微粒和灰尘，也称为切割碎屑。随后这些切割碎屑通常要在芯片被键合至封装之前，从IC表面加以清洗掉。
微机械器件的结构常常极为脆弱以致经受不住某些标准IC的制造步骤。数字微镜器件(DMD)就是一例。DMD在转让给德克萨斯仪器股份有限公司的美国专利No.5,061,049“空间光调制器和方法”中有所说明。如上述专利所述，DMD有一非常小的镜片，突出在硅基片表面所形成电极之上的气隙内。该镜片一旦形成并将牺牲材料从气隙上蚀去后，DMD就变得非常脆弱。例如在大圆片清洗期间，不可能把器件暴露于液体而不使镜片遭受损坏。因此，在牺牲层从镜片上蚀去之前必须对器件进行切割并把切割碎屑清洗掉。这需要将清洗和腐蚀步骤以及此后包括测试在内的一些步骤，在单个芯片而非大圆片上进行。
按照本发明，构筑一保护用固定件以便容许微机械器件的大圆片加工能有效地进行。该固定件可以通过把包围在它和大圆片之间的端部空间抽成真空而被紧贴于包含有微机械器件的大圆片上。把固定件设计成带有这样的一些表面，以使固定件和大圆片在每个器件周围形成密封。然后分离大圆片上的器件，并将分离过程中产生的任何碎屑从器件和保护固定件上清洗掉。本发明的优点在于提供一固定件和方法，以容许采用工业上标准的技术来完成对包含有微机械器件的大圆片加工制作。
图1A和1B分别是大圆片的俯视图和侧视图；局部示出分离器件的锯切轨迹，图中为图示目的作了相当大的放大。
图2是按本发明第一实施例制作的真空固定件的俯视示意图。
图2A是沿图2线2A-2A固定件的剖面图；
图3是在大圆片背面研磨之前紧贴于图2真空固定件上被局部锯切过的大圆片剖面图；
图4是在大圆片背面研磨之后紧贴于图2真空固定件上被局部锯切过的大圆片剖面图；
图5是按本发明第二实施例制作的真空固定件的俯视示意图；
图5A是沿图5线5A-5A固定件的剖面图；
图6是在锯切操作之前紧贴于图5实施例的真空固定件上大圆片的剖面图；
图7是在锯切操作之后紧贴于图5实施例的真空固定件上大圆片的剖面图。
图1A和1B表示一硅大圆片22，在其上制作有诸如数字微镜一类微机械器件。然而，应当理解，本发明也适用于其他一些基片和器件。大圆片22上锯槽24是在微镜自器件切出之前沿诸单个器件之间的划片标记或轨迹形成的。虽然为图示目的，对图1A和图1B所示的器件放大了许多倍，每图仅示出器件四排，但实际上每个大圆上通常所具有的排数十分之多。在制造其它诸如加速器或发动机类微机械器件时，局部锯槽24应在任何使器件变得过分脆弱以致经受不住把切割碎屑从器件上清洗掉的制造步骤之前形成。在冲洗了切割碎屑之后，此时微镜片变脆而不能进行许多加工步骤。器件的制造，包括除去牺牲层和进行测试可以大圆片的形式完成。
图2示出本发明实施例之一的真空固定件26。该固定件可以是不锈钢、陶瓷、石英或者其它能进行机械加工或形成必要容差的任何材料。将固定件26机械加工成具有多个端部空间，诸如大圆片器件之上的端部空间28。例如，若要制造微镜器件，则微镜上方的端部空间28将有助于防止与微镜接触。将每个器件上的端部空间28与多个真空端口30相通，以使端部空间28抽成真空。固定件26包括有经适当加工和定位过的分隔件29A、29B、29C、29D和29E，以便覆盖住大圆片上切出的锯槽，并密封住每个器件。
在完成了加工大圆片上器件所必需的所有工艺步骤之后，如图3所示把部分锯切过的大圆片22与真空固定件26相匹配。然后通过真空端口30将端部空间28抽空，并使大圆片22的背面研磨减薄至经部分锯切的锯槽上，以便分离器件。研磨大圆片背面的操作还对已完成器件提供更佳的热控制。一替代研磨圆片背面的技术是把大圆片从背面锯切至正面上的锯槽24。另一种可替代的技术是使用一专门设计用于揿碎大圆片的工具。对于这些替代技术中的某些，固定件26可能需要是柔性的，以便容许一些大圆片的揿片设备进行操作。
图4示出大圆片上的器件已经分离后的完整器件。每个器件被真空吸住紧贴于固定件26，这样就可对器件与固定件26的联合体进行清洗以除去因分离操作产生的任何碎屑。清洗之后，将吸持器件紧贴于固定件26的真空取消，使器件32能从固定件26上取下。然后准备把完成的器件进行封装以及进一步需要的任何工艺。
本发明工艺的另一实施例在完成器件加工之前无需对划片标记或轨迹进行局部锯切。按照如图5所示的该实施例，固定件36具有多个机械加工成的通道38，它们被设计4成与大圆片的划片间距相对齐。然后，如图6所示，在完成大圆片34的制造和包括测试在内所有大圆片级加工步骤之后，通过真空端端口40把端部空间抽成真空以使大圆片34安装到固定件36上。
用背面锯切操作来分离大圆片34上的器件。如图7所示，各锯槽42与通道38对齐。与前一实施例一样，现在可以清洗大圆片和固定件以除去锯切操作所产生的任何切割碎屑。然后去掉真空，以允许多个已完成的器件44从固定件36上取下。
这样，尽管至此描述了一制造微机械器件方法的特定实施例，在该实施例中，脆弱的微机械结构不受切割期间所产生碎屑的影响，但这并不意味着把这些特定的参考内容看作是对本发明范围的限制，本发明的范围由所附的权利要求书规定。另外，在描述本发明时结合了一些具体实施例，但应理解，该技术领域的熟练人员现在可以作出进一步的变化，所有这样的变化仍应归入所附权利要求书的范围。

Claims (11)

1.一种在大圆片加工期间至少保护一个位于大圆片上的微机械器件的固定件，其特征在于，所述固定件包含：
至少一个端部空间以防止所述固定件与所述圆片上所述器件部分之间的接触；
至少一个真空端口，与所述端部空间相连通，以允许把所述端部空间抽成真空；以及
一机械加工表面，限定所述的至少一个端部空间，以允许所述固定件与所述大圆片形成密封。
2.如权利要求1所述的固定件，其特征在于，所述固定件由不锈钢、陶瓷和石英所构成的一组材料中选出。
3.如权利要求1所述的固定件，其特征在于，所述固定件呈刚性。
4.如权利要求1所述的固定件，其特征在于，在所述机械加工表面上另外包含有通道以使锯切刀片留有间隙。
5.一种包含有一个或多个微机械器件的大圆片加工方法，其特征在于，包含：
把保护固定件置于所述大圆片之上并与所述大圆片相接触，
所述保护固定件在每个器件上限定一端部空间；
抽出所述端部空间内的空气，使之形成真空；
进一步对所述大圆片进行加工以分离所述器件；
从所述器件和固定件上清洗掉由所述进一步加工步骤所产生的碎屑；以及
除去所述真空以便从所述固定件上取下所述器件。
6.如权利要求5所述的方法，其特征在于，进一步包含在把所述大圆片置于所述固定件之前对第一侧面上的所述器件之间进行局部锯切的步骤。
7.如权利要求6所述的方法，其特征在于，所述进一步加工步骤包含对所述大圆片所述第一侧面的反面进行研磨。
8.如权利要求5所述的方法，其特征在于，所述进一步加工步骤包含对所述大圆片进行锯切。
9.如权利要求5所述的方法，其特征在于，所述进一步加工步骤包含对所述大圆片进行揿片。
10.如权利要求5所述的方法，其特征在于，所述固定件由不锈钢、陶瓷和石英构成的一组材料中选出。
11.如权利要求5所述的方法，其特征在于，所述固定件呈柔性。
CN94107015A 1993-06-24 1994-06-24 锯切数字微镜器件后的似大圆片加工 Expired - Fee Related CN1054210C (zh)

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TW258828B (zh) 1995-10-01
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