CN104469356A - Image sensor characteristic parameter measuring and analyzing system - Google Patents
Image sensor characteristic parameter measuring and analyzing system Download PDFInfo
- Publication number
- CN104469356A CN104469356A CN201410838194.2A CN201410838194A CN104469356A CN 104469356 A CN104469356 A CN 104469356A CN 201410838194 A CN201410838194 A CN 201410838194A CN 104469356 A CN104469356 A CN 104469356A
- Authority
- CN
- China
- Prior art keywords
- data
- light source
- signal
- array
- testing image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Abstract
The invention discloses an image sensor characteristic parameter measuring and analyzing system which integrates a configurable light source, a detector room and a control terminal. The configurable light source comprises a light source controller, a laser spot light source, a pulse laser light source and a digital white light source, and a signal light source of the measuring and analyzing system is formed. The detector room comprises a core control panel, a light path module, a positioning executing mechanism and an integral camera bellow and is used for sample positioning, light path focusing and task equipment controlling. The control terminal comprises a high-reliability embedded multi-core processor, a high-speed data collecting and storing module, a physical parameter testing and analyzing module, an ADC array testing module and a precise programmable power source and is used for providing the power source for the system and conducting data collection, parameter calculation and man-machine interaction. The image sensor characteristic parameter measuring and analyzing system can integrally achieve the operation special for an image sensor, wherein the operation includes device physical parameter measuring, circuit characteristic parameter measuring and high-speed image data capturing and replaying.
Description
Technical field
The present invention relates to a kind of imageing sensor feature measurement analytical system, particularly relate to a kind of Graph-Oriented image-position sensor, be integrated with device physics parameter measurement, circuit characteristic is measured, the integrated testing analytical system of high speed image data acquisition and storage.
Background technology
Performance measurement and the analysis of imageing sensor comprise many kinds of parameters, have the parameters such as sensitivity, charge residue number, pixel-level fusion as pixel device aspect; There is the parameter such as gain linearity degree, ADC performance circuit characteristic aspect; In order to analysis image quality also needs to carry out image data acquiring and storage.Current existing imageing sensor test macro has the following disadvantages:
Pixel performance testing equipment, circuit performance testing equipment, image data acquiring equipment separately independent, system is huge, complicated operation, use inconvenience;
Partial key performance parameters cannot be measured, as charge residue number and electron transfer rate in pixel.
Therefore wish that a kind of imageing sensor feature measurement analytical system overcomes or at least to alleviate in the above-mentioned defect of prior art one or more.
Summary of the invention
A kind of imageing sensor feature measurement analytical system is the object of the present invention is to provide to overcome or at least to alleviate in the above-mentioned defect of prior art one or more.
For achieving the above object, the invention provides a kind of imageing sensor characterisitic parameter measuring and analysis system, it comprises:
Configurable light source, for generation of test desired signal light wave;
Probe chamber, at least comprises 1 testing image transducer, for receiving the signal light-wave that configurable light source sends, thus exports corresponding optoelectronic induction signal and related data;
Control terminal, for being described configurable light source, probe chamber provides power supply; The optoelectronic induction signal that pick-up probe room exports and related data, and according to the parameter that described optoelectronic induction signal and correlation data calculation and display are surveyed; The setting data of user, also for man-machine interaction, is sent in probe chamber to control the work of testing image transducer by described control terminal.
Imageing sensor feature measurement analytical system of the present invention, integrated image sensor devices physical parameters measurement, circuit characteristic are measured, high speed image data acquisition and memory function, thus solve in prior art, every testing equipment is separate, complicated operation, awkward problem; And provide a kind of for charge residue number in pixel, the isoparametric measurement means of electron transfer rate.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is elaborated:
Fig. 1 is that the entirety of " imageing sensor feature measurement analytical system " in the present invention forms block diagram;
Fig. 2 is high speed Data acquisition and storage schematic diagram of the present invention;
Fig. 3 is ADC array characteristics test philosophy figure in the present invention;
Fig. 4 is charge residue test philosophy figure in the present invention;
Fig. 5 is pel array fixed pattern noise test philosophy figure in the present invention;
Fig. 6 is pixel-level fusion test philosophy figure in the present invention.
Embodiment
For making object of the invention process, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is further described in more detail.In the accompanying drawings, same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Described embodiment is the present invention's part embodiment, instead of whole embodiments.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the present invention, and can not limitation of the present invention be interpreted as.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.Below in conjunction with accompanying drawing, embodiments of the invention are described in detail.
Fig. 1 shows the frame structure schematic diagram of the imageing sensor feature measurement analytical system that the present invention proposes.As shown in Figure 1, described measuring and analysis system comprises: configurable light source 1, probe chamber 2, control terminal 3.
Configurable light source comprises as shown in Figure 1: light source controller 11, laser facula light source 12, pulsed laser light source 13, digital white light light source 14.Described light source controller 11 switches for light source to be selected and light source control.Its power supply from the output of accurate program controlled power supply in control terminal, and carries out data communication by the core control panel in data cable and probe chamber.According to the setting data that core control panel issues, select current test light source kind used, as one in laser facula light source, pulsed laser light source and digital white light light source, and the operating frequency of the selected light source of setting; Or the light intensity of the selected light source of adjustment (laser facula light source/pulsed laser light source is adjusted by control source current; Digital white light light source is directly set by digital interface); Or frequency of light wave (laser facula light source internal, primarily of laser, filter wheel sheet, monochromator composition, sets by digital interface the centre wavelength that it exports monochromatic optical wave).
When carrying out imageing sensor different parameters and measuring, different light sources can be selected as signal source.Alternatively, when carrying out charge residue parameter measurement, pulsed laser light source is selected, for generation of pulse type laser; When carrying out pel array FPN noise testing, select digital white light light source, for sending parallel equal white light; When carrying out Cross Talk performance measurement between pixel, select laser facula light source, for sending one-wavelength laser hot spot.
Probe chamber as shown in Figure 1, comprises light path module 21, positioning actuators 22, core control panel 23, overall camera bellows 24.
Wherein light path module 21 for monitor, adjust configurable light source 1 send the light intensity of light beam, convergent beam finally project image sensor pixel array.Light path module 21 is by collimated light path 211, and light intensity monitoring/adjustment unit 212, Path of Convergent Rays 213 forms.Collimated light path 211 receives the light beam that configurable light source is launched, and collimates this light beam, controls the angle of divergence of incident beam, forms uniform parallel light, is beneficial to subsequent transmission.Light intensity monitoring and adjustment unit 212 are between collimated light path and Path of Convergent Rays, primarily of diaphragm, optical attenuator, light intensity detector composition, it is connected with core control panel 23 by data cable, real-time light intensity datagram is delivered to core control panel 23, control by it again, the light intensity in dynamic conditioning light path simultaneously.
Intensity control realizes mainly through diaphragm and optical attenuator.Diaphragm is the optical element with unthreaded hole.General circular flake, there are clear aperature in its central authorities, and pore size is adjustable by knob.The adjustment of light intensity is realized by convergent-divergent clear aperature.The light intensity greatly then passed through as clear aperature is strong, otherwise then weak.Optical attenuator is a kind of optical element with fixed attenuation multiplying power.By above-mentioned two parts, mainly as required, incident light light intensity is decayed, to prevent light intensity excessively strong, make the light induced electron of photodetector be in saturation condition always.
Light-intensity test mainly logical light intensity detector realizes, it mainly comprises light intensity detector and signal acquisition circuit, wherein, light intensity detector produces the faint signal of telecommunication by photoelectric effect, and after signal amplification, Acquisition Circuit process, image data is passed to core control panel, and finally reports and submits to control terminal through core control panel.
Positioning actuators 22 main precision level guide rail 222, three-dimensional Electrocontrolled sample platform 223.Be mainly used in the focusing of tested imageing sensor and the adjustment of irradiation position.Three-dimensional Electrocontrolled sample platform is installed on precision level guide rail 222, and the latter is used as horizontal reference.Controlled by X/Y/Z three-axis stepping motor, automatically controlled exact position can be carried out at X/Y/Z tri-axle and move.Because tested imageing sensor is installed on core control panel, and core control panel is held on three-dimensional Electrocontrolled sample platform 223, so three-dimensional Electrocontrolled sample platform 223 is in three axial movements, drives the position of tested imageing sensor to move simultaneously.Three-dimensional Electrocontrolled sample platform 223 power supply is from the output of accurate program controlled power supply in control terminal, and moving direction and the stepping length of its three spindle motor are then connected to core control panel by data cable, thus control by it.
Core control panel 23 is for ensureing that tested imageing sensor keeps normal work when testing.Imageing sensor is installed on core control panel, provides power supply, clock, the necessary drive singal of imageing sensor work such as biased, also according to the data time sequence of imageing sensor and data format, need obtain and export data simultaneously by core control panel.In addition, it is also the control centre of each task module, and it is connected with control terminal by data cable, receives its user data issued and signal, then exports control data, adjusts configurable light source 1, light path module 21, three-dimensional Electrocontrolled sample platform 222; And export imageing sensor output signal and institute's acquisition of image data to control terminal by data cable.
Overall darkroom 24 internal coat crow lac varnish, is mainly used in absorbing stray light, is provided as picture darkroom.In addition overall darkroom is provided with and the line arrangement passage of the control terminal communication of outside and power interface.Overall darkroom is provided with illuminating lamp and actuating doors, for handling and equipment debugging, parts for maintenance, the replacing etc. of testing image transducer, need close illuminating lamp and actuating doors during test.
Described measuring and analysis system also comprises damping isolation platform 221, and it is as horizontal reference platform, for carrying described configurable light source 1 and probe chamber 2 and isolating vibrations.
Control terminal comprises as shown in Figure 1: highly reliable embedded multi-core processor 31, high-speed data acquisition and memory module 32, physical parameter test module 33, ADC array test module 34, accurate program controlled power supply 35.
Wherein highly reliable embedded multi-core processor 31, is mainly used in data processing, calculation of parameter, graph making and man-machine interaction.
High-speed data acquisition and memory module 32, form primarily of read-write controller 321 and memory array 322, stores for high speed image data acquisition and parallel large capacity image data.Read-write controller mainly realizes the functions such as high-speed data acquisition, instructions parse and read-write operation control; Memory array is the actual physical storage medium of view data.
Physical parameter test module 33, forms primarily of lock-in amplifier 331, high-precision adc 332, data processing unit 333.Be mainly used in carrying out phase-locked, amplification (improving detectability and the accuracy of detection of tiny signal) to the tiny signal that tested imageing sensor exports; High-precision analog-digital translation (realizing the digitlization of analog signal) and data prediction.
ADC array test module 34 forms primarily of standard signal source 341 and signal source controller 342.For generation of low harmony wave standard A DC test signal, it is finally loaded on tested imageing sensor through shielding analog signal cable, core control panel.
Imageing sensor simplifies, and mainly comprises pel array and ADC conversion array.Can be understood as pixel and receive illumination and photosensitive generation analog signal, deliver ADC array and carry out gathering and be converted to digital signal, finally export, and obtained and display digital picture by the data acquisition unit of outside.And when testing separately the performance of ADC array self, by arranging (switching of image sensor chip internal switch), the input of the analog signal output of pixel and ADC is disconnected, switch to directly to load from the external world test low harmony wave standard analog signal (often adopt sine wave, method of testing and process known).Follow-up conversion exports with consistent before with numeral.The digital signal just converted is not photosensitive image, but the standard signal of input.
Above-mentioned high-speed data acquisition and memory module 32, physical parameter test module 33, ADC array test module 34 carry out data interaction by High speed rear panel data/address bus and highly reliable embedded multi-core processor 31, for its calling data, carry out data processing and calculation of parameter.
Accurate program controlled power supply is mainly used in as configurable light source, probe chamber and control terminal provide power supply.
Method of testing:
High-speed data acquisition that the present invention is integrated and storage, circuit characteristic are tested, device physics parameter testing function.The following realization introducing each function respectively.
High-speed data acquisition and storage:
Native system can realize 10Gbps magnitude high speed image data acquisition and storage, as shown in Figure 2.Testing image transducer is installed on core control panel 23, and the high-speed data that during work, it exports, after core control panel 23, high speed data bus, accesses high-speed data acquisition and memory module 32.Its concrete implementation is as follows:
When user's execution ' data acquisition and storage ' operates: send " gather to store and start " instruction by embedded multi-core controller 31, detected by core bus read-write control unit and obtain, submitting instructions parse unit to.Instructions parse unit starting restructural digital port unit, synchronous control unit, storage array read-write control unit are started working.The input of restructural digital port unit is connected with high speed data bus (can be configured to digital parallel interface, LVDS interface, Camera-Link interface as required), to obtain high-speed data from described testing image transducer; Its output is divided into: Parallel Digital port and synchronous signal port, respectively access data write buffer unit and synchronous control unit input.
Restructural digital port unit, it is for exporting the data received after converting corresponding format to according to the difference of output interface.Because each image chip design producer is different, the interface definition that its chip exports data is different, and digital parallel interface, LVDS interface, Camera-link interface is the most frequently used interface shape.In order to compatible multiple imageing sensor to the full extent, by restructural digital port cell location interface shape in the present invention, compatible above-mentioned several data-interface simultaneously.
Synchronous control unit, is mainly used in data syn-chronization.Because the general Parallel multiplex output of view data, up to tens ~ road up to a hundred.Keep above-mentioned data to export synchronous, otherwise when capturing view data and show, because data are asynchronous, the phenomenons such as image disappearance, dislocation can be caused.
Data write buffer unit, is mainly used in mating operating rate.Because view data output speed is higher, and image writing speed is comparatively slow, in order to allow the two speeds match, being formed and coordinating.First the view data received is cached, waits for that the last view data write operation also do not completed terminates, then the data of buffer memory are continued write.
Synchronizing signal comprises: data sync clock, frame synchronizing signal, line synchronizing signal, be connected to synchronous control unit as input signal.Synchronous control unit exports corresponding control signal to data and writes buffer unit, storage array read-write control unit, with matched data buffer memory and the operation write of running simultaneously.Storage array read-write control unit reads data from data write buffer unit, piecemeal write Large Copacity parallel memory arrays.To write completely storage array read-write control unit feedback ' write full ' signal to instructions parse unit and automatically hang-up no longer write new data.
When performing ' data report ' operation: embedded multi-core processor 31 sends ' data report ' instruction, is detected and obtain by core bus read-write control unit, submit instructions parse unit to.Instructions parse unit starting storage array read-write control unit, the data in piecemeal extraction memory are to data reading buffer unit.Instructions parse unit inspection data reading buffer unit also captures data, after being encapsulated as packet, by core bus read-write control unit, High speed rear panel bus, reporting to embedded multi-core processor and processes, display etc.
Circuit characteristic is measured:
As shown in Figure 3, support of the present invention is measured (tested number of channels depends on the inner ADC number of active lanes of image chip) parallel multi-channel adc circuit characteristic in testing image transducer, and its implementation procedure is as follows.During test, task device selects ADC array test module 34 and high-speed data acquisition and memory module 32.Chip image transducer to be measured is installed on core control panel 23, by core control panel 23 output image sensor control signal, the chip ADC array input of testing image transducer is made to switch to external signal input pattern (signal selecting switch k switches to external signal input as shown in Figure 3).
The low harmony wave standard analog signal sent by signal generator in control device, (be often sinusoidal signal, the frequency of sinusoidal signal, amplitude, phase place can be arranged as required: by sending parameters to " signal source controller ", signal source controller can control " standard signal source " and export standard analog signal waveform set by user).This signal is loaded into the input of ADC array in imageing sensor as external signal, for testing ADC array performance parameter.
Arranged according to user by embedded multi-core processor 31, through High speed rear panel data/address bus, send setup parameter and " outputting standard signal " instruction to the signal source controller 342 in ADC array test module 34.Signal source controller 342 to receive after instruction then adjustment criteria signal source, output amplitude, frequency are fixed, high s/n ratio (SNR), low harmonics distortion (THD) sinusoidal signal, is loaded into the ADC array input of testing image transducer through shielded signal line.Low harmonics distortion (THD) sinusoidal signal described in ADC array acquisition also exports data through high speed data bus after analog-to-digital conversion, is gathered by high-speed data acquisition and memory module 32 and stores.Finally read each channel data by highly reliable embedded multi-core processor 31, calculate each ADC channel circuit characterisitic parameter successively.
Device physics parameter measurement:
Emphasis solves charge residue parameter measurement, fixed pattern noise performance, the measurement of pixel-level fusion performance parameter.
Be illustrated in figure 4 charge residue parameter testing schematic diagram.During test, light source selects pulsed laser light source, and task device selects physics parametric testing module 33, adjusts light path module 21 and LASER Light Source is vertically projected on tested image sensor pixel array.Export light-pulse generator by core control panel and control clock (Opt_Clk as shown in Figure 4, export light source controller to) and tested imageing sensor work clock (Sens_Clk as shown in Figure 4, export tested imageing sensor to), the two keeps precision synchronous.Inner at image sensor pixel structure, can automatically produce transfer tube according to Sens_Clk and control clock (as shown in Figure 4 TX_Clk), for controlling pixel photoreceptor signal.Opt_Clk and TX_Clk compares, and Opt_Clk only exports the odd-times pulse of TX_Clk, also namely realizes in the first frame integral time, opens laser pulse light source and Signal transmissions pipe; In ensuing second frame integral time, laser pulse light source is closed, but Signal transmissions pipe is opened.The pixel of tested imageing sensor, within above-mentioned twice time of integration, successively exports photocurrent.Above-mentioned signal delivers to physical parameter test module 33 through shielded signal line, obtains digital value, obtain first time read output signal first after lock-in amplify, high precision analogue conversion and data prediction.Then according to the signal that second time reads, can calculate in first time optical-integral-time, residual electric charge number within the pixel, with its proportion.
First time reads, and is after pixel is subject to light-wave irradiation, generates the laggard line output of electric charge, is exported by after ADC collection, digitlization.The electric charge numerical value of the photosensitive acquisition of pixel can be gone out according to above-mentioned numerical computations.
Due to the effect of potential barrier, potential well in pixel, the electric charge during above-mentioned first time reads, can not be shifted out completely.Have a small amount of charge residue in pixel.Therefore need to carry out second time collection, now pixel is similar under details in a play not acted out on stage, but told through dialogues environment, unglazed photograph, also namely without newly-increased induced charge.What now gather and read is the electric charge originally remaining previous frame within the pixel.Residual electric charge number can be obtained thus, and its ratio accounted for.
Be illustrated in figure 5 pel array fixed pattern noise test philosophy figure.During test, light source selects digital white light light source 14, task device selects high-speed data acquisition and memory module 32, the uniform parallel white light that described light path module makes described digital white light light source 14 send is vertically projected on tested image sensor pixel array, and described testing image sensor array is listed in output photoelectric induced signal under the irradiation of described collimated white light.Utilize high-speed data acquisition and memory module 32 according to described optoelectronic induction fast capturing signal picture frame, the mean value utilizing highly reliable embedded multi-core processor 31 to calculate N frame exports as each pixel cell signal.Ask the standard deviation that each pixel cell dark current signals exports, then be the fixed pattern noise under institute's light-metering photograph divided by whole array pixel cells output signal output mean value.
Be illustrated in figure 6 pixel-level fusion performance test schematic diagram.During test, light source selects 12 laser facula light sources, and focused light passages part selects the microcobjective that multiplying power is higher.Task device selects high-speed data acquisition and memory module 32, adjusts the laser facula that light path module 21 makes described laser facula light source 12 send and is vertically projected on tested image sensor pixel array.Its spot diameter exported and the equal scale of single pixel (conventional image sensor pixel size is about 2 ~ 10um) after selected laser facula light source 12 line focus, sample stage Z axis is regulated to realize focusing, then regulate X/Y axle to make hot spot only cover single pixel, as pixel in Fig. 65 as far as possible.Utilize high-speed data acquisition and memory module to gather pel array and export the output data that data, particularly hot spot cover pixel and adjacent pixels thereof.Calculate its adjacent pixels by highly reliable embedded multi-core processor 31 and export the ratio exported with center pixel, pixel-level fusion parameter can be obtained.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. an imageing sensor characterisitic parameter measuring and analysis system, is characterized in that, comprising:
Configurable light source, for generation of test desired signal light wave;
Probe chamber, at least comprises 1 testing image transducer, for receiving the signal light-wave that configurable light source sends, thus exports corresponding optoelectronic induction signal and related data;
Control terminal, for being described configurable light source, probe chamber provides power supply; The optoelectronic induction signal that pick-up probe room exports and related data, and according to the parameter that described optoelectronic induction signal and correlation data calculation and display are surveyed; The setting data of user, also for man-machine interaction, is sent in probe chamber to control the work of testing image transducer by described control terminal.
2. measuring system as claimed in claim 1, wherein, described configurable light source comprises at least one light source and light source controller, and described light source controller is used for selecting at least one light source described to produce test desired signal light wave as required.
3. measuring system as claimed in claim 1, wherein, described probe chamber also comprises:
Light path module, for the signal light-wave light intensity that light source configurable described in measuring and adjustation produces, and is projected on testing image sensor pixel array by described signal light-wave;
Positioning actuators, for adjusting the position of testing image transducer;
Core control panel, described testing image transducer is arranged on described core control panel, and described core control panel for controlling the work of described testing image transducer, and carries out transfer of data with described control terminal;
Overall camera bellows, it is for the stray light of absorbance detector indoor, and provides the interface mutual with outside.
4. measuring system as claimed in claim 1, wherein, described control terminal comprises:
Processor, for control data collection and memory module, physical parameter test module and ADC array test module work, and processs and displays the data that above-mentioned module exports;
Data acquisition and storage module, for gathering the optoelectronic induction signal and related data storing it that tested imageing sensor exports;
Physical parameter test module, for optoelectronic induction signal that testing image transducer is exported and related data carry out phase-locked, amplify, analog-to-digital conversion and data prediction;
ADC array test module, for generation of low harmony wave ADC test signal, and is loaded on the ADC array of testing image transducer.
5. measuring system as claimed in claim 4, wherein, described measuring system is used for Data acquisition and storage, and described Data acquisition and storage module comprises:
Core bus read-write control unit, for detect and obtain described processor indicate according to user the instruction issued, and submit instructions parse unit to;
Described instructions parse for resolving described instruction, and is that data acquisition or data report instruction by instructions parse unit; When for data acquisition instructions, start described restructural digital port unit; When data acquisition instructions be data report instruction time, start storage array read-write control unit, and read data from data reading buffer unit and report to processor;
Restructural digital port unit, receives and treats the optoelectronic induction signal that imageing sensor exports and related data, and exports data write buffer unit and synchronous control unit after converting thereof into corresponding format data to;
Synchronous control unit, it is for exporting synchronous control signal, with the operation of synchrodata write buffer unit, data reading buffer unit and storage array read-write control unit;
Data write buffer unit, for the data that buffer memory restructural digital port unit exports;
Data reading buffer unit, for the data that storage array read-write control unit described in buffer memory exports;
Storage array read-write control unit, for reading data from data write buffer unit, and in piecemeal write Large Copacity parallel memory arrays; Also for extracting data write data reading buffer unit from parallel array memory;
Parallel array memory, for storing data.
6. measuring system as claimed in claim 4, wherein, described ADC array test module comprises: standard signal source and signal source controller; Wherein, when circuit characteristic is measured,
Described processor exports setup parameter and outputting standard signal instruction according to user's instruction to described signal source controller;
Signal source controller, according to described instruction adjustment criteria signal source, loads low harmony wave ADC test signal to testing image transducer;
Low harmony wave ADC test signal described in ADC array acquisition in described testing image transducer and through digital-to-analogue transform after output DAC test data;
Described ADC test data is by described Data acquisition and storage module acquires and store;
Described processor reads described ADC test data, and calculates the circuit characteristic parameter of each passage of ADC array in described testing image transducer.
7. measuring system as claimed in claim 4, wherein, described physical parameter test module can be used for measuring the charge residue parameter of described testing image transducer, fixed pattern noise performance and pixel-level fusion performance parameter.
8. measuring system as claimed in claim 7, wherein, described configurable light source comprises pulsed laser light source; Wherein, when measuring the charge residue parameter of described testing image transducer,
The laser pulse that described pulsed laser light source exports is vertically projected on testing image sensor pixel array by described light path module;
Described testing image sensor array is listed in output photoelectric induced signal under the irradiation of described laser pulse;
Described physical parameter test module obtain described optoelectronic induction signal and carried out lock-in amplify, high precision analogue conversion and data prediction after obtain first time numerical data;
Described physical parameter test module again obtain described optoelectronic induction signal and carried out lock-in amplify, high precision analogue conversion and data prediction after obtain second time numerical data;
Described physical parameter test module according to described first time numerical data and second time numerical data calculate the electric charge number and ratio thereof that remain in testing image sensor array pel array.
9. measuring system as claimed in claim 7, wherein, described configurable light source comprises digital white light light source; Wherein, when measuring the fixed pattern noise performance of described testing image transducer,
The uniform parallel white light vertical irradiation that described digital white light light source sends by described light path module is on testing image sensor pixel array;
Described testing image sensor array is listed in output photoelectric induced signal under the irradiation of described collimated white light;
Described Data acquisition and storage module is according to described optoelectronic induction signal capture picture frame;
Described processor calculates the signal data of mean value as each pixel cell in described testing image sensor pixel array of multiple picture frames that described Data acquisition and storage module is caught, and the signal data of described each pixel cell calculates fixed pattern noise performance data.
10. measuring system as claimed in claim 7, wherein, described configurable light source comprises laser facula light source; Wherein, when measuring the pixel-level fusion performance of described testing image sensor pixel array,
The laser facula that described laser facula light source sends is vertically projected on testing image sensor pixel array by described light path module, and make described laser facula be radiated in the single pixel of described pel array, the diameter of laser facula and the equal scale of the single pixel of described pel array;
Described testing image sensor pixel array is output photoelectric induced signal under the irradiation of described laser facula;
Optoelectronic induction signal described in described Data acquisition and storage module acquires also obtains the current data of illuminated pixel cell and adjacent pixel unit output thereof respectively;
The current data that described processor exports according to described illuminated pixel cell and adjacent pixel unit thereof calculates pixel-level fusion performance data.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410838194.2A CN104469356B (en) | 2014-12-29 | 2014-12-29 | Image sensor characteristic parameter measuring and analyzing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410838194.2A CN104469356B (en) | 2014-12-29 | 2014-12-29 | Image sensor characteristic parameter measuring and analyzing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104469356A true CN104469356A (en) | 2015-03-25 |
| CN104469356B CN104469356B (en) | 2017-04-19 |
Family
ID=52914629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410838194.2A Active CN104469356B (en) | 2014-12-29 | 2014-12-29 | Image sensor characteristic parameter measuring and analyzing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104469356B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358038A (en) * | 2016-09-06 | 2017-01-25 | 上海集成电路研发中心有限公司 | Detecting method of pixel performance |
| CN106908715A (en) * | 2017-03-23 | 2017-06-30 | 张家港市欧微自动化研发有限公司 | A kind of test system for linear transducer |
| CN106973287A (en) * | 2017-03-29 | 2017-07-21 | 张家港市欧微自动化研发有限公司 | A kind of test system for cmos sensor |
| CN106993184A (en) * | 2017-03-29 | 2017-07-28 | 张家港市欧微自动化研发有限公司 | A kind of method of testing for cmos sensor |
| CN107995487A (en) * | 2017-12-14 | 2018-05-04 | 南京理工大学 | The EMCCD blind elements that collimater is homogenized based on light test system and method |
| CN109342750A (en) * | 2018-11-22 | 2019-02-15 | 四川省久益生物肥料有限公司 | Device for detecting water content is used in a kind of processing of organic fertilizer |
| CN109901907A (en) * | 2019-03-15 | 2019-06-18 | 北京星网锐捷网络技术有限公司 | A kind of method and server of transfer of virtual desktop |
| CN110779621A (en) * | 2019-10-17 | 2020-02-11 | 中国航空工业集团公司洛阳电光设备研究所 | Automatic testing device and method for brightness sensor for head-up display |
| CN113589139A (en) * | 2021-07-16 | 2021-11-02 | 苏州芯迈智能科技有限公司 | Image testing system and method based on TOF chip wafer |
| CN114666521A (en) * | 2020-12-07 | 2022-06-24 | 旭景科技股份有限公司 | Image sensing device with adjustable parameters for image sampling |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004053451A1 (en) * | 2002-12-06 | 2004-06-24 | Inter Action Corporation | Instrument for testing solid-state imaging device |
| CN1856121A (en) * | 2005-02-08 | 2006-11-01 | 惠普开发有限公司 | Imaging device analysis systems and imaging device analysis methods |
| CN101000881A (en) * | 2006-01-09 | 2007-07-18 | 三星电子株式会社 | Image sensor testing method and apparatus |
| CN101360254A (en) * | 2007-07-30 | 2009-02-04 | 比亚迪股份有限公司 | Test system for CMOS image sensor electrical performance |
| US7502066B1 (en) * | 2002-11-05 | 2009-03-10 | Foveon, Inc. | Methods for manufacturing and testing image sensing devices |
| CN101969575A (en) * | 2010-08-19 | 2011-02-09 | 北京中星微电子有限公司 | Method for detecting image sensor of photographic device and detection device |
| CN102508141A (en) * | 2011-10-26 | 2012-06-20 | 西安电子科技大学 | Measurement system of performance parameters of charge coupled device (CCD) chip |
-
2014
- 2014-12-29 CN CN201410838194.2A patent/CN104469356B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7502066B1 (en) * | 2002-11-05 | 2009-03-10 | Foveon, Inc. | Methods for manufacturing and testing image sensing devices |
| WO2004053451A1 (en) * | 2002-12-06 | 2004-06-24 | Inter Action Corporation | Instrument for testing solid-state imaging device |
| CN1856121A (en) * | 2005-02-08 | 2006-11-01 | 惠普开发有限公司 | Imaging device analysis systems and imaging device analysis methods |
| CN101000881A (en) * | 2006-01-09 | 2007-07-18 | 三星电子株式会社 | Image sensor testing method and apparatus |
| CN101360254A (en) * | 2007-07-30 | 2009-02-04 | 比亚迪股份有限公司 | Test system for CMOS image sensor electrical performance |
| CN101969575A (en) * | 2010-08-19 | 2011-02-09 | 北京中星微电子有限公司 | Method for detecting image sensor of photographic device and detection device |
| CN102508141A (en) * | 2011-10-26 | 2012-06-20 | 西安电子科技大学 | Measurement system of performance parameters of charge coupled device (CCD) chip |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358038B (en) * | 2016-09-06 | 2018-05-29 | 上海集成电路研发中心有限公司 | A kind of detection method of pixel performance |
| CN106358038A (en) * | 2016-09-06 | 2017-01-25 | 上海集成电路研发中心有限公司 | Detecting method of pixel performance |
| CN106908715A (en) * | 2017-03-23 | 2017-06-30 | 张家港市欧微自动化研发有限公司 | A kind of test system for linear transducer |
| CN106973287A (en) * | 2017-03-29 | 2017-07-21 | 张家港市欧微自动化研发有限公司 | A kind of test system for cmos sensor |
| CN106993184A (en) * | 2017-03-29 | 2017-07-28 | 张家港市欧微自动化研发有限公司 | A kind of method of testing for cmos sensor |
| CN107995487B (en) * | 2017-12-14 | 2023-11-21 | 南京理工大学 | EMCCD blind pixel testing system and method based on light homogenizing collimator |
| CN107995487A (en) * | 2017-12-14 | 2018-05-04 | 南京理工大学 | The EMCCD blind elements that collimater is homogenized based on light test system and method |
| CN109342750A (en) * | 2018-11-22 | 2019-02-15 | 四川省久益生物肥料有限公司 | Device for detecting water content is used in a kind of processing of organic fertilizer |
| CN109901907B (en) * | 2019-03-15 | 2022-05-20 | 北京星网锐捷网络技术有限公司 | Method and server for transmitting virtual desktop |
| CN109901907A (en) * | 2019-03-15 | 2019-06-18 | 北京星网锐捷网络技术有限公司 | A kind of method and server of transfer of virtual desktop |
| CN110779621A (en) * | 2019-10-17 | 2020-02-11 | 中国航空工业集团公司洛阳电光设备研究所 | Automatic testing device and method for brightness sensor for head-up display |
| CN114666521A (en) * | 2020-12-07 | 2022-06-24 | 旭景科技股份有限公司 | Image sensing device with adjustable parameters for image sampling |
| CN114666521B (en) * | 2020-12-07 | 2024-02-27 | 旭景科技股份有限公司 | Image sensing device with adjustable parameters for image sampling |
| CN113589139A (en) * | 2021-07-16 | 2021-11-02 | 苏州芯迈智能科技有限公司 | Image testing system and method based on TOF chip wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104469356B (en) | 2017-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104469356A (en) | Image sensor characteristic parameter measuring and analyzing system | |
| CN101915612B (en) | Ultraviolet radiation comprehensive test device | |
| KR101121451B1 (en) | Apparatus and method for inspecting quantum efficiency homogeneity of solar cell using imaging device | |
| CN102507596A (en) | Optical element surface defect detecting system based on active laser beam scanning | |
| CN102538963A (en) | High-sensitivity light spectrum acquisition and test system with board waveband covering visible light | |
| CN207396343U (en) | TDLAS boiler furnace gas two dimension concentration distribution detection devices based on automatic scanning system | |
| CN108204824B (en) | Photoelectric detector detection device and detection method | |
| CN113188765A (en) | Test system for MTF and anti-dispersion test of visible light detector | |
| CN104483105B (en) | A kind of pixel-level fusion detecting system and method | |
| CN109100118A (en) | Test of light source method and system | |
| US9310249B2 (en) | Spectrophotometer for the automated optical characterization of solar collector tubes and method for the operation thereof | |
| CN102879095B (en) | Method for testing relative spectral responsivity of grating type imaging spectrometer | |
| CN207923419U (en) | A kind of parallel optical detection device and system | |
| CN106918446B (en) | Apparatus for measuring quality of laser beam and method based on the sampling of rotating cylinder spiral string holes | |
| CN105445570A (en) | Wide-angle lens camera signal to noise ratio testing system and measuring method | |
| CN114112314B (en) | Detection performance test method for multifunctional photoelectric detection system | |
| CN101893679A (en) | Direct-current measuring device for quantum efficiency of solar cell and using method thereof | |
| CN103837241A (en) | Laser pulse waveform meter | |
| CN113804681A (en) | Lens quality evaluation method and device based on intelligent optics | |
| CN207897093U (en) | CCD/CMOS parameter detecting systems | |
| CN105300297A (en) | Machine vision width measuring machine and collagen casing width warning analysis method | |
| CN107478660B (en) | Optical fiber quality detection system and method | |
| CN205301449U (en) | Wide -angle shot machine SNR test system | |
| CN114252753B (en) | Method and system for screening four-quadrant detector | |
| CN205003072U (en) | Terahertz is image device now |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |