CN104331131A - Host module and host board thereof - Google Patents
Host module and host board thereof Download PDFInfo
- Publication number
- CN104331131A CN104331131A CN201410567588.9A CN201410567588A CN104331131A CN 104331131 A CN104331131 A CN 104331131A CN 201410567588 A CN201410567588 A CN 201410567588A CN 104331131 A CN104331131 A CN 104331131A
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- adapter
- pcie
- electrical
- socket
- slot
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a host module. The host module comprises a host board, at least one switching flat cable and at least one adapter card, wherein the host board comprises a substrate, a first central processing unit slot, a second central processing unit slot and at least one adapter card slot; the first central processing unit slot and the second central processing unit slot are formed in the substrate; the adapter card slot is electrically connected to the first central processing unit slot or the second central processing unit slot and is positioned between the first central processing unit slot and the second central processing unit slot; one end of the switching flat cable is electrically connected to the adapter card slot, and the other end of the switching flat cable is electrically connected to the adapter card.
Description
Technical field
The present invention about a kind of host module, the particularly host module improved of a kind of slot configuration about motherboard.
Background technology
Along with the continuous progress and development of science and technology, the use of computing machine is considerably general and popular.Main frame generally includes a framework and is fixedly arranged on the plural adapter on framework, to expand the function of main frame.Wherein, adapter is generally directly be inserted on motherboard with the form of vertical card, then is fixed on framework through the mode of screw locking.But, can be assembled on framework for the ease of adapter, the adapter slot on motherboard generally by under the pressure of be arranged at motherboard corner and compared with away from the cpu socket on motherboard.Further, the problem faced at present is that the meeting of adapter slot and central processing unit are electrically connected, but adapter slot and cpu socket long except producing larger signal transmission and consuming, also make the circuit between adapter slot and central processing unit usually need to change a layer cabling, can avoid interfering with the remaining circuit on motherboard.Therefore, how to improve the combination between adapter and motherboard, it will be one of research staff's problem that should solve that the spacing of adapter slot and cpu socket can effectively be shortened.
Summary of the invention
The invention reside in and a kind of host module and motherboard thereof are provided, in order to improve the combination between adapter and motherboard, and shorten the spacing of adapter slot and cpu socket, simplify the circuit layout of motherboard.
Host module disclosed by the present invention, comprises a motherboard, at least one switching winding displacement and at least one adapter.Motherboard comprises a substrate, one first cpu socket, one second cpu socket and at least one adapter slot.First cpu socket is located at substrate.Second cpu socket is located at substrate.Adapter slot is electrically connected at the first cpu socket or the second cpu socket, and between the first cpu socket and the second cpu socket.One end of switching winding displacement is electrically connected at adapter slot, and the other end of switching winding displacement is electrically connected at adapter.
Motherboard disclosed by the present invention, comprises a substrate, one first cpu socket, one second cpu socket and at least one adapter slot.First cpu socket is located at substrate.Second cpu socket is located at substrate.Adapter slot is electrically connected at the first cpu socket or the second cpu socket, and between the first cpu socket and the second cpu socket.
Host module disclosed by the invention described above and motherboard thereof, adapter slot, between two cpu sockets, to reduce the probability that motherboard changes layer cabling, and then simplifies the circuit layout of motherboard.
In addition, adapter can improve through the switching winding displacement adapter slot be plugged on motherboard the not easy-to-assemble problem that adapter slot produces between two cpu sockets.
Above about the explanation of content of the present invention and the explanation of following embodiment in order to demonstration with explain principle of the present invention, and provide claims of the present invention further to explain.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of host module described according to a first embodiment of the present invention.
Fig. 2 is the decomposing schematic representation of Fig. 1.
Fig. 3 is the schematic top plan view of the motherboard of Fig. 2.
Fig. 4 is the schematic top plan view of motherboard described according to a second embodiment of the present invention.
Fig. 5 is the schematic perspective view that casing is fixed in one end of the switching winding displacement of the host module of Fig. 1.
Fig. 6 is the schematic perspective view of host module described according to a third embodiment of the present invention.
Fig. 7 is the schematic perspective view of host module described according to a fourth embodiment of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
Please refer to Fig. 1 to Fig. 3.Fig. 1 is the schematic perspective view of host module described according to a first embodiment of the present invention.Fig. 2 is the decomposing schematic representation of Fig. 1.Fig. 3 is the schematic top plan view of the motherboard of Fig. 2.
As shown in Figures 1 and 2, the host module 10 of the present embodiment comprises a motherboard 100, at least one switching winding displacement 200 and at least one adapter 300.
Motherboard 100 comprises substrate 110,1 first cpu socket 120,1 second cpu socket 130 and two adapter slots 140.
Substrate 110 is such as printed circuit board (PCB), ceramic circuit board, flexible electric circuit board or copper foil circuit board.Substrate 110 can connect each electronic package (as South Bridge chip, north bridge chips or display card slot) by printed wire (not illustrating).
First cpu socket 120, is located at substrate 110.First cpu socket 120 can be used to electrically plug for central processing unit (Central Processing Unit, CPU).
Second cpu socket 130, is located at substrate 110.Second cpu socket 130 can be used to electrically plug for central processing unit (Central Processing Unit, CPU).
Two adapter slots 140 are electrically connected at the second central processing unit, and between the first cpu socket 120 and the second cpu socket 130.In other embodiments, two adapter slots 140 also can be electrically connected at the first central processing unit, not as limit.
Specifically, as shown in Figure 3, the first cpu socket 120 has one first side, side 121,1 second 122 and one the 3rd side 123.First side 121 is connected to the relative both sides of the second side 122 with the 3rd side 123.Second cpu socket 130 has one the 4th side, side 131, the 5th 132 and one the 6th side 133.5th side 132 is towards the second side 122, and the 4th side 131 is connected to the relative both sides of the 5th side 132 with the 6th side 133.In the present embodiment, first side 121 and the 4th side 131 copline, and the 3rd side 123 and the 6th side 133 copline, and make the extended surface of the first side 121, the extended surface of the 3rd side 123, the second side 122 and the 5th side 132 around an adapter slot setting area 150.Further, adapter slot 140 can be positioned at adapter slot setting area 150 completely or have at least adapting part card slot 140 to be positioned at adapter slot setting area 150.Compared to the position of conventional adaptation card slot 140 ' (illustrating with dotted line), distance D1 between the adapter slot 140 of the present embodiment and the second cpu socket 130 is much smaller than minimum distance D2 with cpu socket of conventional adaptation card slot 140 ', therefore the probability that motherboard 100 changes layer cabling can be reduced, and then simplify the circuit layout of motherboard 100.
In the above-described embodiments, first side 121 and the 4th side 131 copline, and the 3rd side 123 and the 6th side 133 copline, but not as limit, in other embodiments, first side 121 and the 4th side 131 can not coplines, and the 3rd side 123 and the 6th side 133 also can not coplines.Refer to shown in Fig. 4.Fig. 4 is the schematic top plan view of motherboard described according to a second embodiment of the present invention.4th side 131 of the second cpu socket 130 is between the extended surface and the extended surface of the 3rd side 123 of the first side 121 of the first cpu socket 120, and the 3rd side 123 of the first cpu socket 120 is between the extended surface and the extended surface of the 6th side 133 of the 4th side 131 of the second cpu socket 130, and make the extended surface of the 4th side 131, the extended surface of the 3rd side 123, the second side 122 and the 5th side 132 around an adapter 300 slot setting area 150 '.
The quantity of adapter 300 slot of the embodiment of above-mentioned Fig. 1 is for two, but not as limit, in other embodiments, the quantity of adapter 300 slot also can be more than one or three.
In addition, the specification of adapter slot 140 can be PCIE (PCI Express, the one of computer bus) × 16, PCIE × 8, PCIE × 4 or PCIE × 1, and the adapter slot 140 of the present embodiment is for PCIE × 8, not as limit.
Switching winding displacement 200 comprises the electrical Plug Division of wire portion 210, one 220 and an electrical socket 230.Electrical Plug Division 220 and electrical socket 230 are electrically connected at the opposite end of wire portion 210 respectively, and electrically Plug Division 220 is inserted in adapter slot 140 pluggablely.Wherein electrically Plug Division 220 and electrical socket 230 can be all PCIE × 16 specification, are all PCIE × 8 specification, are all PCIE × 4 specification or are all PCIE × 1 specification, and the specification of the electrical Plug Division 220 of the present embodiment adapter slot 140 corresponding to the specification of electrical socket 230 and be all PCIE × 8, not as limit.
Adapter 300 has a Plug Division, interface 310.Plug Division, interface 310 is inserted in electrical socket 230 pluggablely.Wherein, the specification of interface Plug Division 310 can be PCIE × 16, PCIE × 8, PCIE × 4 or PCIE × 1, and the specification of the corresponding adapter slot 140 of the specification of the interface Plug Division 310 of the present embodiment and be PCIE × 8, not as limit.
In addition, because the loss of signal of winding displacement 200 of transferring is lower than the loss of the circuit on substrate 110, therefore the length and changing shortening the circuit on substrate 110 is transferred, winding displacement 200 replaces, and will contribute to the loss of the signal transmission between reduction adapter 300 and central processing unit (not illustrating).
It should be noted that, to transfer winding displacement 200 connecting adapter 300 and adapter slot 140 except can reducing the loss of the signal transmission between adapter 300 and central processing unit (not illustrating), the not easy-to-assemble problem of adapter 300 that adapter slot 140 produces between two cpu sockets can also be solved.Refer to Fig. 5.Fig. 5 is the schematic perspective view that casing is fixed in one end of the switching winding displacement of the host module of Fig. 1.The host module 10 of the present embodiment also comprises a casing 400.Motherboard 100 is installed in casing 400.Adapter 300 groove that the electrical Plug Division 220 of switching winding displacement 200 is inserted in motherboard 100 is inserted, and the electrical socket 230 of switching winding displacement 200 is fixed on casing 400.That is, the position transfer that switching winding displacement 200 can be crossed over motherboard 100 and be plugged by confession adapter 300 on casing 400, and is convenient to plugging of adapter 300.
Refer to Fig. 6.Fig. 6 is the schematic perspective view of host module described according to a third embodiment of the present invention.
The specification of two adapter slots 140 of the present embodiment is identical with the specification (PCIE × 8) of the adapter slot 140 of above-mentioned Fig. 1.Further, the switching winding displacement 200 of the present embodiment comprises an electrical Plug Division of wire portion 210, two 220 (specification is PCIE × 8) and an electrical socket 230 (specification is PCIE × 16).Two electrical Plug Divisions 220 are electrically connected at same one end of wire portion 210.Electrical socket 230 is electrically connected at the other end of wire portion 210.Two electrical Plug Divisions 220 are inserted in two adapter slots 140 pluggablely.The interface Plug Division 310 (specification is PCIE × 16) of adapter 300 is inserted in electrical socket 230 pluggablely.That is, the form of the replaceable switching winding displacement 200 of user, making originally also can the adapter 300 of compatible with PCI E × 16 specification without the motherboard 100 of PCIE × 16 adapter slot 140 specification, and then lifting host module 10 is for the compatibility of all size adapter 300.
Refer to Fig. 7.Fig. 7 is the schematic perspective view of host module described according to a fourth embodiment of the present invention.The specification of two adapter slots 140 of the present embodiment is identical with the specification (PCIE × 8) of the adapter slot 140 of above-mentioned Fig. 1.Further, the switching winding displacement 200 of the present embodiment comprises an electrical Plug Division of wire portion 210, one 220 (specification is PCIE × 8) and two electrical sockets 230 (specification is PCIE × 4).Two electrical access slot portions are electrically connected at same one end of wire portion 210.Electrical Plug Division 220 is electrically connected at the other end of wire portion 210.Electrical Plug Division 220 is inserted in adapter slot 140 pluggablely.The interface Plug Division 310 (specification is PCIE × 4) of two adapters 300 is inserted in two electrical sockets 230 pluggablely.That is, the replaceable switching winding displacement 200 of user promotes outside the compatibility of host module 10, the problem that usefulness also can be avoided to waste produces, for example, if not the adapter 300 of two PCIE × 4 specifications is shared on same adapter 300 slot (PCIE × 8) by the above-mentioned mode through switching winding displacement 200, but directly the adapter 300 of two PCIE × 4 specifications is inserted in two adapter 300 slots (PCIE × 8) respectively, although adapter 300 must give play to function, but waste the usefulness (about only playing half usefulness) of adapter 300 slot.
Host module disclosed by the invention described above and motherboard thereof, adapter slot, between two cpu sockets, to reduce the probability that motherboard changes layer cabling, and then simplifies the circuit layout of motherboard.
In addition, adapter is plugged in the adapter slot on motherboard through switching winding displacement, except the compatibility that can promote host module and the signal transmission loss reducing between central processing unit and adapter, also can improve the not easy-to-assemble problem that adapter slot produces between two cpu sockets.
Obviously, those skilled in the art can carry out various change and modification to invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a host module, comprises:
One motherboard, comprises:
One substrate;
One first cpu socket, is located at described substrate;
One second cpu socket, is located at described substrate; And
At least one adapter slot, described adapter slot is electrically connected at described first cpu socket or the second cpu socket, and between described first cpu socket and described second cpu socket; And
At least one switching winding displacement and at least one adapter, one end of described switching winding displacement is electrically connected at described adapter slot, and the other end of described switching winding displacement is electrically connected at described adapter.
2. host module as claimed in claim 1, wherein said switching winding displacement comprises a wire portion, an electrical Plug Division and an electrical socket, described electrical Plug Division and described electrical socket are electrically connected at the opposite end of described wire portion respectively, described adapter has a Plug Division, interface, described electrical Plug Division is inserted in described adapter slot pluggablely, and Plug Division, described interface is inserted in described electrical socket pluggablely.
3. host module as claimed in claim 2, wherein said electrical Plug Division and described electrical socket are all PCIE × 16 specification, are all PCIE × 8 specification, are all PCIE × 4 specification or are all PCIE × 1 specification.
4. host module as claimed in claim 1, the quantity of wherein said at least one adapter slot is two, described switching winding displacement comprises a wire portion, two electrical Plug Divisions and an electrical socket, described two electrical Plug Divisions are electrically connected at same one end of described wire portion, described electrical socket is electrically connected at the other end of described wire portion, described adapter has a Plug Division, interface, described two electrical Plug Divisions are inserted in described two adapter slots pluggablely, and Plug Division, described interface is inserted in described electrical socket pluggablely.
5. host module as claimed in claim 4, it is PCIE × 16 specification or described two electrical Plug Divisions are all PCIE × 4 specification and described electrical socket is PCIE × 8 specification that wherein said two electrical Plug Divisions are all PCIE × 8 specification and described electrical socket.
6. host module as claimed in claim 1, also comprise a casing, described motherboard is positioned at described casing, and described switching winding displacement is installed in described casing near one end of described adapter.
7. host module as claimed in claim 1, the quantity of wherein said at least one adapter is two, described switching winding displacement comprises a wire portion, an electrical Plug Division and two electrical sockets, described two electrical socket Plug Divisions are electrically connected at same one end of described wire portion, described electrical Plug Division is electrically connected at the other end of described wire portion, described adapter has a Plug Division, interface, described electrical Plug Division is inserted in described adapter slot pluggablely, and described second interface Plug Division is inserted in described two electrical sockets respectively pluggablely.
8. host module as claimed in claim 7, wherein said electrical Plug Division is PCIE × 16 specification and described two electrical sockets be PCIE × 8 specification or described electrical Plug Division is that PCIE × 8 specification and described two electrical sockets are all PCIE × 4 specification.
9. a motherboard, comprises:
One substrate;
One first cpu socket, is located at described substrate;
One second cpu socket, is located at described substrate; And
At least one adapter slot, described adapter slot is electrically connected at described first cpu socket or the second cpu socket, and between described first cpu socket and described second cpu socket.
10. motherboard as claimed in claim 9, wherein said adapter slot is PCIE × 16 specification, for PCIE × 8 specification, for PCIE × 4 specification or be PCIE × 1 specification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410567588.9A CN104331131A (en) | 2014-10-22 | 2014-10-22 | Host module and host board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410567588.9A CN104331131A (en) | 2014-10-22 | 2014-10-22 | Host module and host board thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104331131A true CN104331131A (en) | 2015-02-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410567588.9A Pending CN104331131A (en) | 2014-10-22 | 2014-10-22 | Host module and host board thereof |
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| CN (1) | CN104331131A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI735255B (en) * | 2020-06-12 | 2021-08-01 | 英業達股份有限公司 | Riser assembly and electronic device |
| CN113764916A (en) * | 2020-06-05 | 2021-12-07 | 英业达科技有限公司 | Switching assembly and electronic device |
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| US5491609A (en) * | 1994-02-28 | 1996-02-13 | Telepad | Portable electronic platform system |
| CN1866156A (en) * | 2005-05-20 | 2006-11-22 | 精英电脑股份有限公司 | Interface circuit capable of arranging CPU |
| CN1979460A (en) * | 2005-11-29 | 2007-06-13 | 泰安电脑科技（上海）有限公司 | Processor configuration frame of multi-processor system |
| CN101196761A (en) * | 2006-12-08 | 2008-06-11 | 英业达股份有限公司 | Extending device of abstraction type adapting card |
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2014
- 2014-10-22 CN CN201410567588.9A patent/CN104331131A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5491609A (en) * | 1994-02-28 | 1996-02-13 | Telepad | Portable electronic platform system |
| CN1866156A (en) * | 2005-05-20 | 2006-11-22 | 精英电脑股份有限公司 | Interface circuit capable of arranging CPU |
| CN1979460A (en) * | 2005-11-29 | 2007-06-13 | 泰安电脑科技（上海）有限公司 | Processor configuration frame of multi-processor system |
| CN101196761A (en) * | 2006-12-08 | 2008-06-11 | 英业达股份有限公司 | Extending device of abstraction type adapting card |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113764916A (en) * | 2020-06-05 | 2021-12-07 | 英业达科技有限公司 | Switching assembly and electronic device |
| CN113764916B (en) * | 2020-06-05 | 2024-02-06 | 英业达科技有限公司 | Switching assembly and electronic device |
| TWI735255B (en) * | 2020-06-12 | 2021-08-01 | 英業達股份有限公司 | Riser assembly and electronic device |
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Application publication date: 20150204 |