CN104330080A - Integrated packaging method of novel MEMS gyroscope - Google Patents
Integrated packaging method of novel MEMS gyroscope Download PDFInfo
- Publication number
- CN104330080A CN104330080A CN201410624654.1A CN201410624654A CN104330080A CN 104330080 A CN104330080 A CN 104330080A CN 201410624654 A CN201410624654 A CN 201410624654A CN 104330080 A CN104330080 A CN 104330080A
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- CN
- China
- Prior art keywords
- ceramic substrate
- packaging
- mems gyro
- ltcc
- ltcc ceramic
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
Abstract
The invention discloses an integrated packaging method of a novel MEMS gyroscope. The integrated packaging method comprises the following steps: 1) interconnecting, namely, manufacturing interconnected ceramic substrates by adopting a low-temperature ceramic co-firing technology to ensure that an electrical connection is formed between an MEMS gyroscope structure and an ASIC chip; 2) preparing for packaging, namely, making an LTCC ceramic substrate into an integrated lead-free packaging form, directly leading the interconnected MEMS gyroscope structure and a function pin requiring to be led out of the ASIC chip to the back surface of the LTCC ceramic substrate, arranging a metal enclosing frame on the LTCC ceramic substrate; and 3) integrally packaging, namely, performing all-gas tightness packaging on a metal cover plate and the metal enclosing frame to form an integrated package. The integrated packaging method provided by the invention has the advantages of being strong in universality, low in cost, easy to realize, and high in reliability.
Description
Technical field
The present invention relates to a kind of novel MEMS gyro instrument integrative packaging, belong to electronic technology field.
Background technology
MEMS (Micro Electro-Mechanical System) gyroscope is one of sensor important in microminiature inertial navigational system, and the quality of its performance directly affects the navigation accuracy of inertial navigation system.MEMS gyroscope be in the past used for some electronic toy or mobile phones etc. some to reliability and the not too high occasion of accuracy requirement, but along with the development of semiconductor technology, MEMS gyro instrument performance obtains and significantly improves, MEMS gyro instrument is with its cheap price, less size, instead of increasing classical spinning top, application scenario also gets more and more.
But along with the increase of application scenario, the contour structures of MEMS gyro instrument and reliability are had higher requirement, the packaged type of current MEMS gyro instrument has: packed by metal casing, ceramic package encapsulation, based on the encapsulation of HTCC multilager base plate, metal shell and ceramic package package dimension bigger than normal, and the realization of inconvenient sensitive structure and signal processing circuit interconnect function, encapsulation based on HTCC multilager base plate can realize the interconnection of sensitive structure and signal processing circuit, but to the loss of tiny signal greatly and costly.Good interconnection mode and packaged type can expand an application scenario for MEMS gyro instrument greatly, improve its reliability, reduce cost and volume.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of novel MEMS gyro instrument integrative packaging, improves the reliability of MEMS gyro instrument.
For solving the problems of the technologies described above, the invention provides a kind of novel MEMS gyro instrument integrative packaging, it is characterized in that, comprise the following steps:
1) interconnect: adopt low-temp ceramics burning technology altogether, manufacture the ceramic substrate of interconnection, make to be formed between MEMS gyro structure and asic chip to be electrically connected;
2) encapsulation prepares: LTCC ceramic substrate is made an overall non-leaded package form, the function pin that the MEMS gyro structure of interconnection and asic chip need be drawn directly is led to the back side of LTCC ceramic substrate;
LTCC ceramic substrate arranges a metal enclosure frame;
3) integrative packaging: metal cover board and metal enclosure frame are carried out full air-tight packaging, forms integrative packaging.
The mode that described metal enclosure frame is welded by Vacuum Eutectic with ltcc substrate is connected.
Step 2) in, LTCC ceramic substrate is made an overall non-leaded package form, namely by burying in laser boring and conduction band on LTCC ceramic substrate, the function pin that the MEMS gyro structure of interconnection and asic chip need be drawn directly is led to the back side of LTCC ceramic substrate;
In step 3), by metal cover board with add the LTCC ceramic substrate after metal enclosure frame in a nitrogen environment, adopt the method for parallel soldering and sealing, carry out full air-tight packaging, formed integrative packaging.
The beneficial effect that the present invention reaches:
The integrative packaging mode that the present invention proposes has very strong versatility, and cost is low, is easy to realize, and reliability is high.
Accompanying drawing explanation
Fig. 1 ceramic substrate figure;
Fig. 2 pin on back surface figure;
The ceramic substrate figure after frame is enclosed in Fig. 3 increase;
Fig. 4 integrative packaging figure.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
Integrative packaging of the present invention is mainly divided into 3 steps, and one has been the interconnection of sensitive structure and signal processing circuit, and two has been preliminary work before the encapsulation using ceramic substrate as substrate, and three has been integrative packagings.
1. interconnecting method
As the basis of integrative packaging, the present invention adopts domestically leading low-temp ceramics to burn (LTCC) technology altogether, manufactures the ceramic substrate of interconnection, completes the electrical connection between different MEMS gyro structures and ASIC.
LTCC technology is a kind of novel process means occurred at home over nearly 20 years, technology that low-temp ceramics burns altogether (LTCC) low-temperature sintered ceramics powder is made the accurate and fine and close green band of thickness, green band utilizes laser boring, micropore slip casting, the techniques such as accurate conductor paste printing make required circuitous pattern, and can be as required, conduction band and multiple passive element are imbedded wherein, then overlap together, sinter at 900 DEG C, make the passive integration assembly of three-dimensional circuit network, also can be made into the three-dimensional circuit substrate of built-in passive element, IC and active device can be mounted on its surface, make passive/active integrated functional module.
Due to can on ceramic substrate bonding passive and active device, also can print conduction band, therefore manufacture the ceramic substrate of different size and different cabling, just can meet the electrical connection needs between various different MEMS gyro structure and ASIC.The present invention have chosen a kind of gyroscope structure and ASIC interconnects, and the ceramic substrate of manufacture is shown in Fig. 1.
2. encapsulate preliminary work
Packaged type of the present invention is exactly on the basis that low-temp ceramics burns the substrate that (LTCC) technology manufactures altogether, whole LTCC ceramic substrate is made an overall non-leaded package form.
MEMS gyro structure bonding on ceramic substrate and asic chip, after completing basic electrical connection, also need to be connected with follow-up signal acquiring system or host computer, therefore the function pin be connected with follow-up equipment will be drawn.Traditional way is bonded in by ceramic substrate in a shell, then by the mode of gold wire bonding, is connected by gyrostatic function pin, thus reaches the object of extraction with the pin of shell.But this way cost is higher, size is also comparatively large, is unfavorable for application.The method applied in the present invention, it is the technology utilizing LTCC ceramic substrate can bury in laser boring and conduction band, by the function pin that the MEMS gyro structure interconnected and asic chip need be drawn, directly lead to the back side of LTCC ceramic substrate, so namely, saved cost, also reduce volume, more once transfer because decrease, also can increase the reliability of MEMS gyro instrument.Outer pinouts is shown in Fig. 2.
But only function pin is extracted the encapsulation being also not enough to MEMS gyro instrument to prepare, due in a lot of application scenario, under MEMS gyro instrument need be operated in very severe condition, therefore very high to the requirement of MEMS gyro instrument, the various requirements such as such as impermeability, insulativity, corrosion resistance, long-time preservation.
The present invention adds a metal enclosure frame on LTCC ceramic substrate, and one is to better protect MEMS gyro structure and asic chip, two be can complete MEMS gyro instrument by metal enclosure frame rush the full air-tight packaging of nitrogen.The mode that metal enclosure frame is welded by Vacuum Eutectic with ltcc substrate is connected, and adds that the ltcc substrate after metal enclosure frame is shown in Fig. 3.
3. integrative packaging
By metal cover board with add the LTCC ceramic substrate after upper enclosure frame in a nitrogen environment, adopt the method for parallel soldering and sealing, after carrying out full air-tight packaging, just complete integrative packaging of the present invention.Integrative packaging figure is shown in Fig. 4.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and distortion, these improve and distortion also should be considered as protection scope of the present invention.
Claims (4)
1. a novel MEMS gyro instrument integrative packaging, is characterized in that, comprise the following steps:
1) interconnect: adopt low-temp ceramics burning technology altogether, manufacture the ceramic substrate of interconnection, make to be formed between MEMS gyro structure and asic chip to be electrically connected;
2) encapsulation prepares: LTCC ceramic substrate is made an overall non-leaded package form, the function pin that the MEMS gyro structure of interconnection and asic chip need be drawn directly is led to the back side of LTCC ceramic substrate;
LTCC ceramic substrate arranges a metal enclosure frame;
3) integrative packaging: metal cover board and metal enclosure frame are carried out full air-tight packaging, forms integrative packaging.
2. a kind of novel MEMS gyro instrument integrative packaging according to claim 1, it is characterized in that, the mode that described metal enclosure frame is welded by Vacuum Eutectic with ltcc substrate is connected.
3. a kind of novel MEMS gyro instrument integrative packaging according to claim 1, it is characterized in that, step 2) in, LTCC ceramic substrate is made an overall non-leaded package form, namely by burying in laser boring and conduction band on LTCC ceramic substrate, the function pin that the MEMS gyro structure of interconnection and asic chip need be drawn directly is led to the back side of LTCC ceramic substrate.
4. a kind of novel MEMS gyro instrument integrative packaging according to claim 1, is characterized in that, in step 3), by metal cover board with add the LTCC ceramic substrate after metal enclosure frame in a nitrogen environment, adopt the method for parallel soldering and sealing, carry out full air-tight packaging, form integrative packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410624654.1A CN104330080A (en) | 2014-11-07 | 2014-11-07 | Integrated packaging method of novel MEMS gyroscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410624654.1A CN104330080A (en) | 2014-11-07 | 2014-11-07 | Integrated packaging method of novel MEMS gyroscope |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104330080A true CN104330080A (en) | 2015-02-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410624654.1A Pending CN104330080A (en) | 2014-11-07 | 2014-11-07 | Integrated packaging method of novel MEMS gyroscope |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040150939A1 (en) * | 2002-11-20 | 2004-08-05 | Corporation For National Research Initiatives | MEMS-based variable capacitor |
| US20070092179A1 (en) * | 2005-10-11 | 2007-04-26 | Samsung Electro-Mechanics Co., Ltd. | MEMS module package |
| CN101875481A (en) * | 2010-06-29 | 2010-11-03 | 北京大学 | Low temperature co-fired ceramic-based micro-electromechanical system (MEMS) packaging method |
| CN102931938A (en) * | 2012-10-12 | 2013-02-13 | 中国兵器工业集团第二一四研究所苏州研发中心 | Charge gate converter circuit based on LTCC (Low Temperature Co-fired Ceramic) multilayer substrate technology |
| CN103500737A (en) * | 2013-10-24 | 2014-01-08 | 中国兵器工业集团第二一四研究所苏州研发中心 | Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
| CN103811434A (en) * | 2014-02-26 | 2014-05-21 | 中国兵器工业集团第二一四研究所苏州研发中心 | LTCC leadless encapsulation |
-
2014
- 2014-11-07 CN CN201410624654.1A patent/CN104330080A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040150939A1 (en) * | 2002-11-20 | 2004-08-05 | Corporation For National Research Initiatives | MEMS-based variable capacitor |
| US20070092179A1 (en) * | 2005-10-11 | 2007-04-26 | Samsung Electro-Mechanics Co., Ltd. | MEMS module package |
| CN101875481A (en) * | 2010-06-29 | 2010-11-03 | 北京大学 | Low temperature co-fired ceramic-based micro-electromechanical system (MEMS) packaging method |
| CN102931938A (en) * | 2012-10-12 | 2013-02-13 | 中国兵器工业集团第二一四研究所苏州研发中心 | Charge gate converter circuit based on LTCC (Low Temperature Co-fired Ceramic) multilayer substrate technology |
| CN103500737A (en) * | 2013-10-24 | 2014-01-08 | 中国兵器工业集团第二一四研究所苏州研发中心 | Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
| CN103811434A (en) * | 2014-02-26 | 2014-05-21 | 中国兵器工业集团第二一四研究所苏州研发中心 | LTCC leadless encapsulation |
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Application publication date: 20150204 |
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