CN104299786A - High capacity multilayer ceramic dielectric capacitor composed of chips and provided with leads - Google Patents
High capacity multilayer ceramic dielectric capacitor composed of chips and provided with leads Download PDFInfo
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- CN104299786A CN104299786A CN201310306433.5A CN201310306433A CN104299786A CN 104299786 A CN104299786 A CN 104299786A CN 201310306433 A CN201310306433 A CN 201310306433A CN 104299786 A CN104299786 A CN 104299786A
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Abstract
The invention provides a high capacity multilayer ceramic dielectric capacitor composed of multiple chips and provided with leads. The high capacity multilayer ceramic dielectric capacitor relates to the electronic circuit technology field, and comprises leads, a substrate, ceramic dielectric capacitor chips, a metalized through hole and two copper foils. The metalized through hole is disposed in the substrate, and the copper foils are disposed on the substrate. The ceramic dielectric capacitor chip comprises a plurality of chips, and the two copper foils are parallelly disposed on the substrate in a coated manner. The ceramic dielectric capacitor chips are vertically disposed on the substrate at equal interval. The capacitor chips disposed on two sides of the substrate are connected together through the metalized through hole. A segment of each of the leads is bent vertically to be hooked with the metalized through hole of the substrate, and the lower part of each of the leads below the bent segment is directly disposed on the corresponding copper foil in a welded manner. The ceramic dielectric capacitor chips, the leads and the substrate are sleeved with the housing, the heat conductive silica gel can be poured in the housing in a sealed manner, and at last a housing cover can be used to seal the potting materials. The high capacity multilayer ceramic dielectric capacitor provided by the invention has advantages of strong anti-mechanical stress performance and strong thermal stress performance.
Description
Technical field
The present invention relates to electronic circuit technology field, particularly relate to a kind of leaded Large Copacity multilayer ceramic capacitor of multiple chip composition.
Background technology
Multilayer ceramic capacitor, because its volume is little, loss is low, high reliability is widely used in every field, is the better substitute of electrolytic capacitor such as aluminium electroloysis, tantalum electrolysis.But due to the restriction of manufacturing technology level, product size is difficult to do greatly, causes the relative electrolytic capacitor of the capacitance of single product not have advantage.
In order to improve the capacitance of multilayer ceramic capacitor, at present, more way is that many ceramic capacitor chips are carried out level or vertical stacking, welds various exit, does not encapsulate or adopt mold pressing to encapsulate.As CN201984955U, CN102592823A, CN202695133U, CN201984956U, CN202633053U etc.Doing Problems existing is like this contact with each other between many chips, causes being easy to produce stress in the process of welding exit, and finally can affect installation and the use of product.
Therefore, instantly need the urgent technical problem solved exactly: a kind of effective measures of the proposition how can innovate, to solve prior art Problems existing, meet more demands of practical application.
Summary of the invention
Outside the deficiency existed in the problems referred to above, the invention provides a kind of leaded Large Copacity multilayer ceramic capacitor of multiple chip composition, there is stronger mechanical resistant stress and thermal stress.
In order to solve the problem, the invention provides a kind of leaded Large Copacity multilayer ceramic capacitor of multiple chip composition, comprise: lead-out wire (1), substrate (2), ceramic capacitor chip (3), metallization via hole (4) on substrate and Copper Foil (5), wherein, described ceramic capacitor chip (3) comprises multiple chip, the Copper Foil (5) that the upper parallel coating two of described substrate (2) is parallel, described ceramic capacitor chip (3) equidistant vertical is arranged on substrate (2), the capacitor chip (3) on substrate (2) two sides is connected by metallization via hole (4), lead-out wire (1) adopts CP line, lead-out wire (1) one section of vertical curve part, to catch on the metallization via hole (4) of substrate, sweep is directly welded on Copper Foil (5) toward next part lead-in wire, described ceramic capacitor chip (3), lead-out wire (1) and substrate (2) put shell, and heat conductive silica gel is entered in embedding, casing cover is finally used to seal potting compound.
Further, described substrate is pcb board or aluminium base.
Further, described substrate lower end adopts domes.
Further, described substrate and lead-out wire adopt plastic casing to be packaged together.
Further, described substrate adopts together with packed by metal casing with lead-out wire.
Further, the space of heat conductive silica gel to described plastic casing inside is used to fill.
Further, the space of heat conductive silica gel to described metal shell inside is used to fill.
Further, described substrate adopts two-sided form.
Further, multiple chips of described ceramic capacitor chip (3) adopt parallel form to connect.
To sum up, two-sided form of welding side by side is adopted in this programme, can in less space capacitor in parallel more, therefore, the jumbo object of small size can be realized, simultaneously, capacitor chip uniform welding is on substrate, be not in contact with each other mutually between chip, manufacture can be eliminated, install, Yin Wendu or distortion in use procedure and the mechanical stress produced, and, substrate adopts domes, substrate is enable to bear the larger or a fairly large number of chip of weight, and can mechanical strength be improved, in addition, heat conductive silica gel is adopted to carry out inner embedding, both can effectively dispel the heat, also moisture can be prevented to enter capacitor internal.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with accompanying drawing and example, the present invention is described in further detail.But example is not as a limitation of the invention.
As shown in Figure 1, the invention provides a kind of schematic flow sheet of leaded Large Copacity multilayer ceramic capacitor of multiple chip composition, comprise lead-out wire (1), substrate (2), ceramic capacitor chip (3), metallization via hole (4) on substrate and Copper Foil (5), wherein, described ceramic capacitor chip (3) comprises multiple chip, the Copper Foil (5) that the upper parallel coating two of described substrate (2) is parallel, described ceramic capacitor chip (3) equidistant vertical is arranged on substrate (2), the capacitor chip (3) on substrate (2) two sides is connected by metallization via hole (4), lead-out wire (1) adopts CP line, lead-out wire (1) one section of vertical curve part, to catch on the metallization via hole (4) of substrate, sweep is directly welded on Copper Foil (5) toward next part lead-in wire, described ceramic capacitor chip (3), lead-out wire (1) and substrate (2) put shell, and heat conductive silica gel is entered in embedding, casing cover is finally used to seal potting compound.
Substrate adopts two-sided form, the Copper Foil that on the substrate of every face, coating two is parallel, and extends along substrate width direction at base ends; Domes are adopted below substrate; Ceramic capacitor chip equidistant vertical is arranged on substrate, and the capacitor on substrate two sides is connected by metallization via hole; Lead-out wire adopts CP line, and lead-out wire one section of vertical curve part, to catch on the metallization via hole of substrate.Sweep is directly welded on covering on Copper Foil of substrate toward next part lead-in wire.The chip welded, lead-out wire and substrate are put shell, and heat conductive silica gel is entered in embedding, finally use casing cover to seal potting compound.
Further illustrate, for reaching certain capacitance in this programme, major measure of the present invention remains carries out parallel connection by many ceramic capacitor chips; Each capacitor chip is welded on symmetrically and evenly on substrate (PCB or aluminium base), then lead-out wire is welded on substrate.Substrate lower end adopts domes, reaches the object increasing mechanical strength.Use plastic casing or metal shell the substrate welded and lead-out wire to be encapsulated, while encapsulation, use the space of heat conductive silica gel to enclosure to fill.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (9)
1. the leaded Large Copacity multilayer ceramic capacitor of a multiple chip composition, it is characterized in that, comprise lead-out wire (1), substrate (2), ceramic capacitor chip (3), metallization via hole (4) on substrate and Copper Foil (5), wherein, described ceramic capacitor chip (3) comprises multiple chip, the Copper Foil (5) that the upper parallel coating two of described substrate (2) is parallel, described ceramic capacitor chip (3) equidistant vertical is arranged on substrate (2), the capacitor chip (3) on substrate (2) two sides is connected by metallization via hole (4), lead-out wire (1) adopts CP line, lead-out wire (1) one section of vertical curve part, to catch on the metallization via hole (4) of substrate, sweep is directly welded on Copper Foil (5) toward next part lead-in wire, described ceramic capacitor chip (3), lead-out wire (1) and substrate (2) put shell, and heat conductive silica gel is entered in embedding, casing cover is finally used to seal potting compound.
2. the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition as claimed in claim 1, it is characterized in that, described substrate is pcb board or aluminium base.
3. the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition as claimed in claim 2, it is characterized in that, described substrate lower end adopts domes.
4. the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition as claimed in claim 1, it is characterized in that, described substrate and lead-out wire adopt plastic casing to be packaged together.
5. the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition as claimed in claim 1, it is characterized in that, described substrate adopts together with packed by metal casing with lead-out wire.
6. the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition as claimed in claim 4, is characterized in that, use the space of heat conductive silica gel to described plastic casing inside to fill.
7. the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition as claimed in claim 5, is characterized in that, use the space of heat conductive silica gel to described metal shell inside to fill.
8. the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition as claimed in claim 1, it is characterized in that, described substrate adopts two-sided form.
9. the leaded Large Copacity multilayer ceramic capacitor of multiple chip composition as claimed in claim 1, is characterized in that, multiple chips of described ceramic capacitor chip (3) adopt parallel form to connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310306433.5A CN104299786A (en) | 2013-07-19 | 2013-07-19 | High capacity multilayer ceramic dielectric capacitor composed of chips and provided with leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310306433.5A CN104299786A (en) | 2013-07-19 | 2013-07-19 | High capacity multilayer ceramic dielectric capacitor composed of chips and provided with leads |
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| CN104299786A true CN104299786A (en) | 2015-01-21 |
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| CN201310306433.5A Pending CN104299786A (en) | 2013-07-19 | 2013-07-19 | High capacity multilayer ceramic dielectric capacitor composed of chips and provided with leads |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428065A (en) * | 2016-01-26 | 2016-03-23 | 株洲宏达陶电科技有限公司 | Open-circuit-mode multicore combined ceramic capacitor and manufacturing method thereof |
| CN115295312A (en) * | 2022-08-10 | 2022-11-04 | 福建火炬电子科技股份有限公司 | Preparation process of multi-core group capacitor |
Citations (4)
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|---|---|---|---|---|
| US20040071944A1 (en) * | 2001-04-12 | 2004-04-15 | Weir Richard Dean | Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries |
| CN102103932A (en) * | 2009-12-21 | 2011-06-22 | 钰邦电子（无锡）有限公司 | Capacitor encapsulation structure using surface mount technology |
| CN202394718U (en) * | 2011-11-17 | 2012-08-22 | 福建火炬电子科技股份有限公司 | Three-dimensional stacked ceramic capacitor |
| CN203377106U (en) * | 2013-07-19 | 2014-01-01 | 北京元六鸿远电子技术有限公司 | High capacity multilayer ceramic dielectric capacitor constituted by a plurality of chips and provided with leads |
-
2013
- 2013-07-19 CN CN201310306433.5A patent/CN104299786A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040071944A1 (en) * | 2001-04-12 | 2004-04-15 | Weir Richard Dean | Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries |
| CN102103932A (en) * | 2009-12-21 | 2011-06-22 | 钰邦电子（无锡）有限公司 | Capacitor encapsulation structure using surface mount technology |
| CN202394718U (en) * | 2011-11-17 | 2012-08-22 | 福建火炬电子科技股份有限公司 | Three-dimensional stacked ceramic capacitor |
| CN203377106U (en) * | 2013-07-19 | 2014-01-01 | 北京元六鸿远电子技术有限公司 | High capacity multilayer ceramic dielectric capacitor constituted by a plurality of chips and provided with leads |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428065A (en) * | 2016-01-26 | 2016-03-23 | 株洲宏达陶电科技有限公司 | Open-circuit-mode multicore combined ceramic capacitor and manufacturing method thereof |
| CN115295312A (en) * | 2022-08-10 | 2022-11-04 | 福建火炬电子科技股份有限公司 | Preparation process of multi-core group capacitor |
| CN115295312B (en) * | 2022-08-10 | 2023-05-12 | 福建火炬电子科技股份有限公司 | Preparation process of multi-core group capacitor |
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