CN103814440A - Electrical control device with moulded housing - Google Patents
Electrical control device with moulded housing Download PDFInfo
- Publication number
- CN103814440A CN103814440A CN201280045912.XA CN201280045912A CN103814440A CN 103814440 A CN103814440 A CN 103814440A CN 201280045912 A CN201280045912 A CN 201280045912A CN 103814440 A CN103814440 A CN 103814440A
- Authority
- CN
- China
- Prior art keywords
- circuit carrier
- molding compounds
- support component
- electric controller
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49531—Additional leads the additional leads being a wiring board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Abstract
An electrical control device (1) is proposed. The electrical control device (1) has a circuit carrier (3) with a first surface (5) and a second surface (7) facing the first surface (5). At least one electrical component (9) is arranged on the first surface (5) of the circuit carrier (3). The circuit carrier (3) is arranged in a moulded housing (11) made of a moulding material (13). Both the first surface (5) and the second surface (7) are in direct thermal contact with the moulding material (13).
Description
Technical field
The present invention relates to a kind of electric controller with molded shell.
Background technology
Electric controller is used for different application in different fields.For protect circuit element in controller opposing surrounding environment, especially opposing conduction and have rodent medium, described circuit element is arranged in housing.
Described housing for example can surround the circuit carrier with circuit element in shelly ground.In addition disclose molded shell, circuit carrier can be injected in this molded shell.For example EP 1 396 885 B1 disclose the circuit carrier with circuit element.Circuit carrier is arranged on substrate and by molded shell and surrounds.In this structure, the stability of controller and useful life are restricted, because for example because the different thermal coefficient of expansion of the material of circuit carrier, substrate and molded shell can occur thermal and mechanical stress in controller inside.
Summary of the invention
Therefore can have the demand of electric controller to improving, this electric controller has more simply to be constructed and realizes better thermal conductance and go out.
This task can be resolved by the theme of the present invention by independent claims.Favourable execution mode of the present invention is described in the dependent claims.
Discuss in detail below by the feature of the device of embodiment of the present invention, details and possible advantage.
A kind of electric controller has been proposed according to a first aspect of the invention.This controller has with first surface and is opposite to the circuit carrier of the second surface of first surface.On first surface, arrange at least one electric member.This circuit carrier is arranged in the molded shell of molding compounds formation.At this, not only first surface but also second surface all carry out direct thermo-contact with molding compounds.
In other words, design of the present invention is surrounded in other words and is injected with molding compounds in all sides together with the electric member being located thereon based on: circuit carrier, make molding compounds be distributed in as far as possible symmetrically first and second surface on.Can abandon other large-area parts and abandon thus other material by molding compounds being directly arranged on the both sides of circuit carrier.Especially can cancel and be used in substrate of the prior art.Can reduce thus the quantity of needed assembly.In addition reduce by this way, the thermal and mechanical stress of electric controller inside.At this, because two of molding compounds and circuit carrier surperficial thermo-contacts can distribute via all surface of molded shell the power loss of electric member by means of heat conduction or thermal radiation.This can make contributions to the effective cooling of controller.
Described electric controller for example can be for the peculiar process of vehicles in automobile.Especially electric controller can be configured for to the drive controller of automobile.
Circuit carrier, can be configured to ceramic bases also referred to as printed conductor substrate.This circuit carrier for example can have aluminium oxide Al
2o
3, " High Temperature Co Fired Ceramic " (HTCC), " LTCC " (HTCC) or the circuit carrier (PCB) of conventional printing.
Circuit carrier can be configured to the first side surface and the second side form of the plate on surface in other words in other words.One and preferred multiple electric member on first surface, are arranged.In addition, electric member, can be arranged on second surface also referred to as circuit element.This circuit element for example can be configured to " CPU " (CPU), input and output switch circuit.
Described molded shell comprises molding compounds, and this molding compounds is for example configured to resin-based synthetic material or thermosetting plastic.At this, the unit capacity of heat transmission of molding compounds can be greater than 1 watt/Kelvin rice (W/Km).Described molded shell preferably can surround the complete circuit carrier with all electric members.At this, this molding compounds is located immediately on all surface of circuit carrier and on electric member and is responsible for protecting and best as far as possible thermal conductance goes out simultaneously.
According to embodiments of the invention, described electric controller also has support component, this support component be configured to make circuit carrier pass molded shell and supporting bracket carry out mechanical connection in other words in molding process with respect to supporting bracket permanent circuit carrier.This supporting bracket has circuit carrier is remained on to the task in its target location of how much in molding process.
Described support component can be configured with the contact bar of at least three supporting surfaces.This contact bar, also referred to as bow strip or leadframe, be provided with groove at this in centre, circuit carrier contacts with molding compounds from both sides by this groove.Contact bar can have the material that can conduct electricity.This contact bar is for example made of copper.Supporting surface can be for example the edge of framework.Described groove for example can have the size slightly less than circuit carrier in the centre of contact bar, and circuit carrier is resisted against on the edge of contact bar.As an alternative or additional project, can in the quadrangle execution mode of contact bar, on the bight at contact bar, supporting surface be set, described supporting surface stretches in groove in the plane of framework.In addition, contact plug is set on contact bar, described contact plug shown here go out execution mode in be connected with electric member by means of pressing line.
According to another embodiment of the present invention, at least three of contact bar contact plugs are configured to supporting surface.That is to say, described contact plug stretches in groove until circuit carrier and especially reach electric member place.Directly electrically contact by this way electric member and described pressing line is unnecessary at least partly.At this, contact plug not only provides and has electrically contacted but also supporting surface is provided.
According to another embodiment of the present invention, described support component is configured to spacer block, also referred to as equipment piece.Spacer block is arranged in supporting bracket and replaces contact bar at this.Circuit carrier can be resisted against at least three described spacer blocks at this.This spacer block has the material that can conduct electricity and/or carries out coating with the material that can conduct electricity.Directly electrically contact by this way described electric member and not only described all dispensable with contact bar but also the pressing line of contact plug.Thus, spacer block is not only regarded the mechanical connection with circuit carrier as, and regards as and the electrically contacting of circuit carrier.
According to another embodiment of the present invention, described circuit carrier has symmetrical plane.Molding compounds about the symmetrical plane of circuit carrier be distributed to symmetrically first and second surface on.
The maximum of circuit carrier extends and is arranged in symmetrical plane.In structure at circuit carrier as plate, first and second surface that symmetrical plane is for example parallel to circuit carrier extend.At this, this symmetrical plane is especially warm-symmetrical plane of machinery.That is to say, symmetrical plane extends by circuit carrier, thereby also considers to be arranged in the extension of the electric member on circuit carrier.
In other words, described circuit carrier is disposed generally in the thermomechanical axis of symmetry of molded shell.Molding compounds forms thermo-contact and is substantially equivalent to the second volume below circuit carrier at the first volume above circuit carrier and first surface, and this second volume and second surface form thermo-contact.Based on the different thermal coefficient of expansion that depends on temperature of material molding compounds and circuit carrier, thermal and mechanical stress acts on symmetrically by this way and for example prevents crackle to form.
According to another embodiment of the present invention, described molding compounds is with the degree coating electrical member of maximum 0.5mm.By molding compounds, about being arranged symmetrically with of circuit carrier and electric member, the less mouldings bed of material can be enough to for protecting electric member and be used for thermal conductance best.Can reduce the cumulative volume of needed molding compounds and save by this way material and cost with respect to known execution mode thus.
According to another embodiment of the present invention, so select the material of described molding compounds, the thermal coefficient of expansion of this molding compounds is departed from it in other words as small as possible corresponding to the thermal coefficient of expansion of circuit carrier as far as possible.
Thermal coefficient of expansion, also referred to as temperature coefficient, for example can so select, the thermal coefficient of expansion that makes the thermal coefficient of expansion of molding compounds comprise that its tolerance is greater than circuit carrier comprises its tolerance.But at this, difference is as far as possible little.The thermal coefficient of expansion of LTCC can be for example 5.5 ± 0.5ppm/K.The thermal coefficient of expansion of molding compounds can be 7 ± 1ppm/K at this.
According to a second aspect of the invention, the method for the manufacture of above-mentioned electric controller has been proposed.The method has following steps: the circuit carrier that the second surface that has first surface and be opposite to described first surface is provided; At least one electric member is arranged on described first surface; Described circuit carrier is positioned on support component, and described support component mechanically and is preferably electrically connected circuit carrier with supporting bracket; Pour into a mould described circuit carrier with molding compounds, make described first surface and described second surface and described molding compounds carry out direct thermo-contact.
Accompanying drawing explanation
Further feature of the present invention and advantage can be found out with reference to accompanying drawing to those skilled in the art from the description of below exemplary execution mode being done, but described execution mode is not regarded limitation of the present invention as.
Fig. 1 shows the cross section of the electric controller going out by the corresponding thermal conductance of having of the embodiment of the present invention,
Fig. 2 shows by the vertical view of the cross section of the controller of the embodiment of the present invention,
Fig. 3 shows the support component that is configured to contact bar,
Fig. 4 shows by the cross section of the electric controller of another embodiment of the present invention,
Fig. 5 shows the deployment scenarios of electric controller in supporting bracket,
Fig. 6 shows the different contact flexible program of electric member.
Institute's drawings attached be only by the embodiment of the present invention by the device of the present invention schematic diagram of its part in other words.Especially do not reflect pari passu in the accompanying drawings spacing and size relationship.In different accompanying drawings, corresponding element is provided with identical Reference numeral.
Embodiment
Figure 1 illustrates by electric controller 1 of the present invention.This electric controller 1 has circuit carrier 3, and this circuit carrier is molded housing 11 and surrounds.Circuit carrier 3 has first surface 5 and is opposite to the second surface 7 of first surface 5.On first surface 5, arrange electric member 9, for example CPU.Electric member 9 can be connected with other electric component of controller outside by electrically contacting 37.
Described molded shell 11 comprises molding compounds 13, and circuit carrier 3 injects this molding compounds together with the electric member 9 being located thereon.At this, first and second surface 5,7 and molding compounds 13 form direct thermo-contact.That is to say, molding compounds 13 surrounds described circuit carrier 3 from all sides, and distributes symmetrically around thermomechanical symmetrical plane 27 at this.By this design, the quantity of the assembly of electric controller 1 is kept to minimum, especially because can abandon circuit carrier 3 substrate below.In addition, reduced thermomechanical stress between circuit carrier 3 and molding compounds 13 by symmetrical design.Because the direct thermo-contact of molding compounds 13 and all surface 5,7 of circuit carrier 3 can be effectively exported the power loss of electric member 9 by means of heat conduction or thermal radiation.This illustrates by arrow in Fig. 1.Especially can directly the major part of the heat producing in electric controller 1 be issued in fin by means of heat conduction by molding compounds 13, also referred to as " Heatsink ".This fin can be for example supporting bracket 19 valve plate (not illustrating in Fig. 1) in other words.This illustrates by the arrow on pointing in Fig. 1.In the surrounding environment that another part heat can send via thermal radiation by the convection current of the molded shell 11 upper fluids in surface.In addition, another part heat can be conducted and is issued in fluid around, for example, on air or transmission oil by heat.Thus can be via the heat conduction of dispelling the heat in other words of the whole surface of circuit carrier 3 and molding compounds 13.
Figure 2 illustrates electric controller along perpendicular to the plane shown in Fig. 1, be namely parallel to the cross section of the plane of symmetrical plane 27.Embodiment in Fig. 2 shows the deployment scenarios of circuit carrier 3 on support component 15, and this support component is connected by molded shell 11 circuit carrier 3 with supporting bracket 19.Support component is configured to contact bar 21 in Fig. 2.Electrically contact 37 forms that are configured to contact plug 23 on contact bar 21.As an alternative, described support component 15 can be as being configured to spacer block 25 shown in Fig. 6 C.Described circuit carrier 3 for example can electrically contact to the contact plug 23 of contact bar 21 or alternatively electrically contact to bending-paper tinsel (not illustrating in the accompanying drawings) by means of aluminium-pressing line.As an alternative, as shown at Fig. 4 to 6, can be directly to the direct contact on contact plug 23 or on spacer block 25.
Contact bar 21 in Fig. 2 has supporting surface 17(one of them is only shown on bight), described supporting surface is used at molding process permanent circuit carrier 3.Centre at contact bar 21 is provided with groove, molding compounds 13 by this groove also from contacting with circuit carrier 3 below.
Fig. 3 shows the intercepting part with the amplification of the contact bar 21 of contact plug 23 and supporting surface 17.This contact plug interconnects by means of support frame 39, and this support frame is also referred to as dam bar.In addition, described support frame 39 can be used in molding process sealed mold and is punched after molding process.The profile that is resisted against the circuit carrier 3 on supporting surface 17 is shown in broken lines.As alternate ways, supporting surface 17 can replace in the following manner, and contact plug 23 reaches circuit carrier 3 places and simultaneously as directly electrically contacting and as supporting surface 17.This is for example shown in Figure 4.
Fig. 4 has also illustrated that described molding compounds 13 surrounds the circuit carrier 3 with electric member 9 completely.In addition, this molding compounds 13 so distributes, and makes molding compounds 13 at the volume of circuit carrier 3 above and belows and especially almost equal at the volume of thermomechanical symmetrical plane 27 above and belows.Thus, issuable thermal and mechanical stress is applied on circuit carrier 3 symmetrically.Especially in electric member 9 " the highest " one be molded material 13 and cover maximum and reach 0.5mm.
In embodiment in Fig. 4 to 6, directly realize circuit carrier 3 in other words electric member electrically contact 37.Thus, the function that supporting surface 17 is born machinery simultaneously and electrically contacted.For example can be by pasting, especially leading alite paste by means of silver or realize and directly electrically contacting on first surface 5 and/or second surface 7 by soldering.
In the design as drive controller, can by molding compounds 13 in all sides of circuit carrier 3 the direct heat contact on surface 5,7 in other words not only will but also will arrive component side to the thermal radiation (arrow in Fig. 4 above) of transmission device, for example heat to the side of supporting bracket 19 is conducted (arrow below in Fig. 4) for cooling electric controller 1.
Fig. 5 shows the deployment scenarios of electric controller 1 in supporting bracket 19.At this, support component 15 mechanically and is also preferably connected circuit carrier 3 electricity with circuit board 29, and this circuit board is also referred to as printed circuit board (PCB) (PCB).At this, this circuit board 29 is arranged in supporting bracket 19.Between electric controller 1 and supporting bracket 19, can there is the fluid film of about 200 μ m, for example oil film.This fluid film illustrates by the point in Fig. 5.
Figure 6 illustrates the different direct flexible program that contacts of circuit carrier 3 and electric member 9.At this, supporting surface 17 provides the mechanical and contact of electricity simultaneously by the circuit carrier 3 of molded shell 11.
Fig. 6 A shows so-called gull wing type IC design (integrated circuit design).At this, the contact plug 23 of contact bar 21 is configured to Z-shaped.This is welded on circuit carrier 3, for example, on solder joint 33.In the outside of electric controller 1, contact plug 21 is welded on solder joint 33 on circuit board 29.
The QFN principle (square flat non-pin-principle) of direct contact has been shown in Fig. 6 B.That structure has the molded shell 11 of layering 31 with the difference of Fig. 6 B.In addition, contact bar 21 bent to molded shell 11 belows and be directly welded on molded shell 11 belows on circuit board 29.In this design, can save structure space.
Fig. 6 C shows the BGA principle (ball grid array-principle) of direct contact.At this, guarantee the mechanical of circuit carrier 3 and electrically contact by spacer block 25.At this, described molded shell 11 can have layering 31 as shown in Fig. 6 B.This spacer block 25 can weld with circuit board 29 in a side.In addition, epoxy-underfilling can be set on circuit board 29 and on spacer block 25 for sealing and fixing electric controller 1.On opposite side, can spacer block 25 be sticked on circuit carrier 3 by means of conductor alite paste.This spacer block 25 for example can have the size of about 1 × 1 × 1mm.In addition, at least three spacer blocks 25 are set on molded shell 11.
Finally be noted that as " having " or similarly expression should not get rid of the situation that other element or step can be set.Will point out in addition, " one " does not get rid of multiple situations.In addition described feature can be combined arbitrarily mutually in conjunction with different execution modes.Be also noted that, the Reference numeral in claim should not regarded the scope that limits claim as.
Claims (9)
1. electric controller (1), described electric controller (1) has with first surface (5) and is opposite to the circuit carrier (3) of the second surface (7) of described first surface (5);
Wherein on the first surface (5) of described circuit carrier (3), arrange at least one electric member (9);
Wherein said circuit carrier (3) is arranged in the molded shell (11) being made up of molding compounds (13);
It is characterized in that,
Described first surface (5) and described second surface (7) carry out direct thermo-contact with described molding compounds (13).
2. by electric controller claimed in claim 1 (1), have in addition support component (15), described support component is configured to make described circuit carrier (3) to carry out mechanical connection through described molded shell (11) and supporting bracket (19);
Wherein said support component (15) is configured with the contact bar (21) of at least three supporting surfaces (17);
Wherein said circuit carrier (3) is resisted against on the supporting surface (17) on described contact bar (21).
3. press electric controller claimed in claim 2 (1),
Wherein said contact bar (21) has contact plug (23) for contacting described electric member (9);
At least three contact plugs in wherein said contact plug (23) have formed described supporting surface (17).
4. by electric controller claimed in claim 1 (1), have in addition support component (15), described support component is configured to make described circuit carrier (3) to carry out mechanical connection through described molded shell (11) and supporting bracket (19);
Wherein said support component (15) is configured to spacer block (25), and described spacer block is arranged in described supporting bracket (19).
5. press the electric controller (1) described in any one in claim 2 to 4,
Wherein said support component (15) provides electrically contacting of described electric member (9).
6. press the electric controller (1) described in any one in claim 1 to 5,
Wherein said molding compounds (13) about the symmetrical plane (27) of described circuit carrier (3) be distributed to symmetrically described first and second surface (5,7) on.
7. press the electric controller (1) described in any one in claim 1 to 6,
Wherein said molding compounds (13) has covered described electric member (9) with maximum 0.5mm.
8. press the electric controller (1) described in any one in claim 1 to 6,
Wherein so select the material of described molding compounds (13), the thermal coefficient of expansion that makes described molding compounds (13) is substantially corresponding to the thermal coefficient of expansion of described circuit carrier (3).
9. for the manufacture of the method for the electric controller (1) by described in any one in claim 1 to 8, described method has following steps:
Provide and there is first surface (5) and be opposite to the circuit carrier (3) of the second surface (7) of described first surface (5);
At least one electric member (9) is arranged on described first surface (5);
Described circuit carrier (3) is positioned to support component (15) upper, described support component is connected circuit carrier (3) with supporting bracket (19);
Pour into a mould described circuit carrier (3) with molding compounds (13), make described first surface (5) and described second surface (7) and described molding compounds (13) carry out direct thermo-contact.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201110083002 DE102011083002A1 (en) | 2011-09-20 | 2011-09-20 | Electrical control unit with housing |
| DE102011083002.2 | 2011-09-20 | ||
| PCT/EP2012/065285 WO2013041288A1 (en) | 2011-09-20 | 2012-08-03 | Electrical control device with moulded housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103814440A true CN103814440A (en) | 2014-05-21 |
Family
ID=46679258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280045912.XA Pending CN103814440A (en) | 2011-09-20 | 2012-08-03 | Electrical control device with moulded housing |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20140063713A (en) |
| CN (1) | CN103814440A (en) |
| DE (1) | DE102011083002A1 (en) |
| WO (1) | WO2013041288A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014201032A1 (en) | 2014-01-21 | 2015-07-23 | Zf Friedrichshafen Ag | Electric control unit, transmission with an electric control unit and method for producing an electrical control unit |
| DE102014209282A1 (en) | 2014-05-16 | 2015-11-19 | Zf Friedrichshafen Ag | Electrical circuit arrangement with positioning aid for cable strands |
| DE102014209283A1 (en) | 2014-05-16 | 2015-11-19 | Zf Friedrichshafen Ag | Electrical circuit arrangement with positioning aid for cable strands |
| DE102014226062A1 (en) | 2014-12-16 | 2016-06-16 | Zf Friedrichshafen Ag | Positioning device and component with the same |
| DE102021211642A1 (en) | 2021-10-14 | 2023-04-20 | Robert Bosch Gesellschaft mit beschränkter Haftung | Power semiconductors, mold module and process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4763188A (en) * | 1986-08-08 | 1988-08-09 | Thomas Johnson | Packaging system for multiple semiconductor devices |
| EP0350833A2 (en) * | 1988-07-11 | 1990-01-17 | Fujitsu Limited | Integrated circuit package structure |
| US20090243082A1 (en) * | 2008-03-26 | 2009-10-01 | Zigmund Ramirez Camacho | Integrated circuit package system with planar interconnect |
| TWI320594B (en) * | 2006-05-04 | 2010-02-11 | Cyntec Co Ltd | Package structure |
| US20110205706A1 (en) * | 2010-02-25 | 2011-08-25 | Mitsubishi Electric Corporation | Resin-sealed electronic control device and method of fabricating the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3906767B2 (en) | 2002-09-03 | 2007-04-18 | 株式会社日立製作所 | Electronic control unit for automobile |
-
2011
- 2011-09-20 DE DE201110083002 patent/DE102011083002A1/en not_active Withdrawn
-
2012
- 2012-08-03 CN CN201280045912.XA patent/CN103814440A/en active Pending
- 2012-08-03 KR KR1020147007230A patent/KR20140063713A/en not_active Application Discontinuation
- 2012-08-03 WO PCT/EP2012/065285 patent/WO2013041288A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4763188A (en) * | 1986-08-08 | 1988-08-09 | Thomas Johnson | Packaging system for multiple semiconductor devices |
| EP0350833A2 (en) * | 1988-07-11 | 1990-01-17 | Fujitsu Limited | Integrated circuit package structure |
| TWI320594B (en) * | 2006-05-04 | 2010-02-11 | Cyntec Co Ltd | Package structure |
| US20090243082A1 (en) * | 2008-03-26 | 2009-10-01 | Zigmund Ramirez Camacho | Integrated circuit package system with planar interconnect |
| US20110205706A1 (en) * | 2010-02-25 | 2011-08-25 | Mitsubishi Electric Corporation | Resin-sealed electronic control device and method of fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013041288A1 (en) | 2013-03-28 |
| KR20140063713A (en) | 2014-05-27 |
| DE102011083002A1 (en) | 2013-03-21 |
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