CN1036972C - 用于制造印刷电路板的部件 - Google Patents

用于制造印刷电路板的部件 Download PDF

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CN1036972C
CN1036972C CN92109596A CN92109596A CN1036972C CN 1036972 C CN1036972 C CN 1036972C CN 92109596 A CN92109596 A CN 92109596A CN 92109596 A CN92109596 A CN 92109596A CN 1036972 C CN1036972 C CN 1036972C
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sheet
copper
copper foil
printed circuit
circuit board
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CN1070076A (zh
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詹姆斯·A·约翰斯顿
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Gould Electronics Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
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    • H05K3/46—Manufacturing multilayer circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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Abstract

一种用于制造印刷电路板的部件，包括：叠层件，包括铜箔片，构成功能件及基片如构成可废弃件的铝箔，铜片和基片的一个未沾污的表面在一个界面接合，其特征在于还包括柔性粘结剂带，将各个片的未沾污表面在其边缘粘结在一起并在片的边缘内部限定一个未沾污的中心区，并在所述界面不粘合。此外，还提供了一种制造用于制造印刷电路板的部件的方法。

Description

用于制造印刷电路板的部件
本发明涉及印刷电路板，具体地说，涉及用于制作印刷电路板和其他产品的部件。
按其最基本的形式，一个印刷电路板包括作为一个部件的浸渍了环氧树脂的编织玻璃纤维绝缘层，通称为“半固化片”在半固化片的两个相对的侧面上粘上导电的铜箔。然后，通过若干照像工艺对铜箔进行蚀刻，在半固化层的表面制成导电通路。当被这样组装后，该叠层常被称为型芯或板。
在制作加工中，往往将许多这种印刷电路板的各层，或者是如上所述的基本型或者还带有多个复合层，叠在一起，称为重叠，而叠成的一叠印刷电路板称为垛。整个一垛被加热并加挤压。在冷却固化后，将粘合好的各个板相互分开，再进一步加工。这种一般技术在本人的美国专利U.S-4,875,283中已有介绍。
在制作工序中相当重要的是保持清洁度，也就是避免铜箔片沾污。不管印刷电路板是简单的外层为铜箔而内层为半固化片的夹层板，还是一个由数层复合的板，都应保持清洁度。
沾污的主要原因之一是存在树脂粉尘、玻璃纤维的纤维，头发、污点以及由半固化片的前期制作和切割及半固化片的运输和贮存所引起的各种类型的外来物质。在印刷电路板叠成一叠的铺叠工序中，要特别注意用各种擦净技术除掉树脂粉尘。尽管如此，一些粉尘还是不可避免地留在铜箔的表面。在加热和加压的层压工序中，这些树脂粉尘将被溶化，导致铜表面上形成斑点或沉积物。
有关的另一个原因是在铜箔表面存在凹坑或凹痕。这也是由于在加热和层压工序期间铜箔上的树脂粉尘斑点引起的，使得铜箔被压凹。这也可能是对很薄的箔片进行安放操作而引起的。为了解决这个问题，尽管做了种种努力，但至今仍无可靠的方法来消除树脂粉尘，凹坑或凹痕的存在。
在铜片的表面上存在的凹坑或凹痕或熔化后又固化的树脂有害沉积物常常会引起在成品上出现导电通路被短路或开路的故障。在一块成品的印刷电路板中有许多多条平行的导线。如果在箔上，在成像和最终工序中将形成两条导线的区域上有凹痕，该凹痕可能将填上，引起电短路。相反，这种凹痕也可能会引起其中一条导线断开，造成开路。
以当前的技术，导线可做成0.13mm宽的量级，两导线间的间距通常与线宽相同。当今工业的要求与趋势是将导线及导线间的距离甚至制得更窄，例如0.00635mm。如果在铜的表面不完美，就会产生开路或短路，导致大多数的板报废。有时将板进行再加工，但在高技术应用中，再加工是不可接受的，板将变成无用的废料。
缺陷的另一个原因来自对铜箔的操作，当铜箔与半固化片一层压一层地叠起多层时，它们的对准由从工装板向上伸出的工装销钉保证。工装板是一个厚钢板，构成叠起的这一叠印刷电路板的底部。每一层，无论是铜箔或半固化片或局部完成的导电材料叠层的型芯，都按预定图案预钻或预冲成孔，一般尺寸和位置要符合工业标准。然后将每一层用手工使向上伸的销钉穿过预钻的孔，叠放在工装销钉上。
铜箔的一侧在成品中成为外露的导电通路。另一侧用氧化工艺处理，常制成粗糙灰色的表面，使其在粘合工艺中与熔化的树脂能更好的粘合。当今所用的铜箔是“半盎司箔”，即每平方米219.71克的铜箔。这种箔的厚度大约为0.01778mm。也使用7.08克和3.54克的箔。显然，操作如此之薄的箔片是个困难的课题。此种箔必须用手工一层层放到工装销钉上。这样可引起皱纹，而皱纹又可引起成品导电通路出现故障。
本发明的目的之一在于提供一种较容易铺叠铜箔的装置，不仅能防止铜箔打折或起皱纹，而且能保持清洁度。操作者每叠放好一个印刷电路板所需的各层后，必须把一个隔离件放到所叠的顶上，再在隔离件的顶上敷叠另一个板的各层。在这个工序中，操作者必须不仅擦净隔离件的表面，而且还要擦净每个导电箔。
产生印刷电路板上有缺陷的另一个原因是在工装销钉周围有树脂漏泄。
如上所述，各层均放置在工装销钉上，因此工装销钉必须稍小于预开在铜箔和半固化片各层的孔。在对叠起的这一叠施加压力和加热的工序中，溶化的树脂漏泄于工装销钉周围，并可填满半固化片和箔各层上的工装孔。它还可横向漏泄到各层之间，特别是漏泄到铜箔和隔离板之间。在固化后，它必须除掉，否则将成为腐蚀工序的抗蚀物质。另外，以后它可能剥落到铜箔的表面上。不仅树脂漏泄对铜箔的表面有不利影响，而且当固化的树脂堆积在销钉周围时，还给板的分拆带来困难，使这些印刷电路板难以从销钉上取下。
由上文看来，本发明之主要目的有三；
一是提供一种有利于操作极薄铜箔的装置；
二是确保在制作工序之前和之间，尽可能保持铜箔不被沾污；
三是避免工装销钉周围的树脂泄流到板的各层之间。
本发明提出了一种用于制作印刷电路板和类似产品的部件。这种部件是一个叠层件，包括至少一片铜箔，这片铜箔粘到一块印刷电路上加工后就构成该板的功能件，即导电通路。该叠层件还包括一片铝基片，该铝片构成最终印刷电路板的可抛弃件。
铜片和铝片的每个表面基本上不被沾污，并在一界面相互接合。
一个柔性粘结剂带在片子未沾污的表面的周边将片子粘合在一起，限定了一个在片子边缘之内、交界面未粘合的基本未沾污中心区。铝基片对铜箔起到加强作用，使操作更容易。
叠层部件可以由两片铜箔和一片铝构成，在制成的印刷电路板中，两片铜箔分别构成分开的两块印刷电路板的功能件，而铝片则是可抛弃件。每一个铜片的内表面和铝片的两个表面基本上未被沾污，而在铝的两侧的界面相互接合。
同样，该柔性粘结剂带将两个铜片的未沾污的表面与相对的铝片的两个未沾污的表面在其周边粘接在一起，因而，夹在中间的铝片的两侧，分别限定了两个在片子边缘之内的基本上未沾污的中心区。
至少有一个柔性的水溶性粘接剂岛，在预定的离开粘接片的边缘一定距离的位置上粘合未沾污的片子表面。在上、下片子上开或预钻一个穿过该岛的孔，使得在叠层件上形成工装销钉孔。可以从边缘粘结带向内设置多个这样的岛，构成随后在此冲工装孔的区域。在制作过程中，该粘结剂岛可防止漏泄的树脂流入叠层之间。
本发明的上述和其它特点，包括各种新的细微结构及各部件的结合情况，现在参照附图，详细予以介绍，并在权利要求书中指出。应该了解：体现本发明的用于制作印刷电路板的具体部件，只是作为解释性的说明，并不是对本发明的限制。本发明的原理和特点能用于许许多多的各种各样的不脱离本发明范畴的实施方案。
图1是解释通常的在叠压之前的两个印刷电路板的多层铺叠情况的示意剖视图。
图2是解释依照本发明的特点来制作的两块印刷电路板在粘合前的示意剖视图。
图3是本发明所提出的用于制造印刷电路板的部件的一个实施例的放大示意剖视图。
图4是另一个实施例。
图5是根据其中一实施例制作的本发明的部件的示意平面图。以及，
图6是一个带有在其内形成了工装销钉孔的粘结剂岛的放大视图。
图1是二块PC(即，印刷电路)板的通常6层多层铺叠情况的示意图。由底至顶，包括：第1隔离层2，它可以是一片覆以解纸(未示出)的通常抛光不锈钢板(如本人早期专利US-4,875,283所示)，或者是一片起双重用的其两面覆以硅氧烷聚合物的由铝制成的隔离解脱片，(在本人的专利US-4,875,283中也有说明)。第1或“外侧”的铜箔层4放置在隔离片2上，其工作表面或“清洁”表面6朝下。其上表面8可被氧化，以便更好的与半固化片的表面粘合。在铜箔上放置一个叠压成的多层型芯10，它包括三个双层半固化片12和两个在各自的两个表面预先蚀刻了导电通路15的双面板14。在内型芯叠层件10上是另一片铜箔4，其氧化表面16放置在型芯上，而其上表面或工作表面18与另一隔离片2相合。
上铜箔4的上表面18与下铜箔4的下表面6构成这一叠的第一块PC板的外工作表面，当PC板加工结束时，铜箔4将被蚀刻成一条条导电通路。
另一块PC板与第一块完全相同，放置在上隔离片2的上表面24上，它包括铜箔4、另一个型芯10以及铜箔4。这是典型的具有6层的多层坯件，因为有两个分开的铜箔层，分别贴在型芯10的两面(底面和顶面)，而型芯10具有两个双面板14，总共有4个导电通路层15，因而构成一个6层多层板。
本发明所提出的叠层部件30(也称作CAC，铜铝铜的缩写)可见图3的剖面。它包括一个商品级的铝基片。已发现铝的厚度为约0.254-0.381mm是令人满意的，虽然根据最终应用情况铝的厚度可以从0.0254-3.185mm。放在铝基片表面上的是一片铜箔C，对这种厚度的铝，铜箔C应是14.175克。这意味着每平方米219.71克。当分布均匀时，其厚度近似为0.01778mm。一般说来，这是现时PC板的工业标准。
虽然目前铝是用作基片的优选材料，其它材料，如不锈钢或镍合金也是可用的。在某些情况下，如叠压塑料信用卡，则可用聚丙烯。
铜的外表面Co(在图3中示为上表面)是预先氧化了的，常呈现灰色，这取决于SS采用氧化工艺，然而根据工艺也能得到其它颜色。这样做是为使铜在PC板制作工艺中更容易与半固化片粘接。铜的内表面Ci是清洁的、未沾污的面，通常称为“无瑕”表面。在最终印刷电路板中，该表面构成一个功能件，蚀成所需电路导线图案。铝片A与表面Ci接合的表面Ai基本上也是未沾污的。
贴在铝片A的底表面上的是第二片铜箔C，该铜箔同样有一个外氧化表面Co和一个“无瑕”或未沾污的内表面Ci，铝片A的贴合表面也尽可能制得清洁和无沾污。
由图4可见，在铝基片A上有个单片铜箔C。根据对制成的印刷板的要求和印刷板的制造者的设计能采用本发明的该实施例。除了只有一个单层铜层C之外，它与图3的实施例相同。铜层C将构成制成的印刷电路板的功能件，而铝片A将构成可抛弃件。
下面参照图5，所见的是叠层部件30或CAC，铜箔层的氧化表面Co朝上，并掀起一角。在目前制作PC板采用的铜箔片的标准尺寸是304.8mm×304.8mm，而另一标准是457.2mm×609.6mm，虽然所用的片子可大至1219.2mm×1828.8mm。914.4mm×1219.2mm的片子可切割成4个分开的457.2mm×609.6mm片子。其它中间尺寸也是常用的。
图5所示的CAC部件包括一层商品级铝基片A，厚度从约0.254mm-0.381mm。覆在基片上的是一片铜箔，在图示的实例中，是14.175克，即厚近似为0.01778mm。掀起的一角分别露出了铜和铝的内表面或“无瑕”表面Ci和Ai。
柔性粘结剂带40布在部件CAC上，靠近或在片子边缘的四周，把铜和铝未沾污的表面Ci和Ai在周边粘合在一起。因接触表面是“无瑕”的或至少尽可能清洁，粘结带40使得在片子边缘之内造成一个基本未沾污的中心区CZ。中心区的界面是不粘结的。
柔性粘结剂带40位于由虚线42和部件CAC的边缘限定的粘结剂涂敷区。根据成品要求和所用的铝片、铜片的尺寸，该区的宽度可是2.54-25.4mm。虽然根据要叠在一起的这些片的尺寸，粘结剂带或条的宽度可以约为0.254-13mm，厚度约为0.0254-0.13mm，但人们发现宽度为近似1.5mm-2.3mm，厚度为近似0.0254-0.05mm是令人满意的。
中心区CZ由从粘结剂敷设区界42向内隔开一段距离的边界线44限定。鉴于成品电路板会包括区域CZ和位于中心区边界线44和粘结剂敷设区边线42之间的一带状区域46，该带状区域46就常被用于质量控制小电路板的测试部位。
在一些PC板(常有10个之多)叠在一起后，加压加热进行粘合，在其固化后，这些PC板须经修整到由标号42代表的粘结剂敷设区的内限的尺寸。
这样，柔性粘结剂带40在制作工艺之前和期间将铜和铝层密封起来，防止了半固化片的粉尘的入侵或由空气中的粒子、指印、润滑油斑之类引起的任何其它沾污。
尽管CAC部件的结构是参照在铝基片A上放置一片铜箔C描述的，本发明同样可适用于图3和图4所示的实施例。即，在铝基片A的两面都贴上铜箔。在成品中，这两片铜箔将分别是两块分开的PC板上的功能件，而铝基片则是可抛弃件。
在图3的结构中，每片铜箔C的一个表面与铝基A的两个表面基本上是“无瑕”和未沾污的。柔性粘结剂带40将每个铜片C的未沾污的表面Ci同与之相对的铝基片的两个未沾污的表面Ai在其周边粘合起来，这样就在铝基片A的两个表面上限定了两个在片子边缘之内的基本未沾污的中心区。
尽管本发明是参照制作印刷电路板说明的，但也可用于制造基本叠层件的层合机，作为最终产品的前期工艺。
还有，本发明的原理可用于清洁度要求极高的信用卡的制作。在此情况下，基片可以是铝，而“箔”是塑料。其它基片也可以处理。
由图5所见，在预定位置有粘合片子未沾污的表面的四个柔性水溶粘结剂岛50。这些岛与粘合片子的边缘隔开。岛50设在被线42所限定的粘结剂敷设区往内的位置。这样，它就位于粘接带40往内和将中心区CZ与测试带区域分开的边界44的外侧。在图示的实施例中，岛50接近片子的边缘，并位于各边的中分线上。这些岛或斑(也有这样叫法)示为方块形状，但也可采用任何其他方便的形状。它们相对片子的确切位置是由工装销钉的配置情况决定的。
对于一般尺寸的工装销钉，岛50近似为10.16mm见方。根据板的尺寸和销钉的直径，岛50可小到0.254mm。粘结剂的厚度约为0.013-0.13mm。人们发现0.0254-0.05mm的厚度是令人满意的。
为了配合特定的制作复合片的压制机结构的工装销钉配置情况，岛的位置可以偏离中心。复合CAC片上冲或钻通过岛的孔，以容纳压制装置的工装销钉。
由图6所见，CAC片将被冲、钻或机加工出椭圆形的孔52，容纳工装销钉。孔的形状取决于工装销钉的形状。每个椭圆孔的短轴尺寸m稍大于工装销钉的直径，而长轴M能适应销钉沿长轴方向的任何装配误差。设计成长轴与片子边缘垂直而短轴与边缘平行相对于岛50最靠近的片子的边缘而言。
图2表示用本发明所提出的新的叠层部件30组装两个PC板的铺叠情况。两个与图1已经描述的型芯10完全相同的型芯10夹在三个本发明所提出的新的叠层CAC部件30之间。这里没有如本人早期专利所提出的参照图1，带解脱纸或覆以铝的不锈钢片。所得的成品PC板将与图1的相同。
图2所示的箔层7和9分别构成紧接在其上和其下的垛中另外两块PC板的顶层和底层。这两块PC板的其余部分为了清而未示出。在同时组装固化的一叠中通常有多至十个各有6层的PC板。
当这些片子铺叠好，形成一叠多至十个PC板时，施加于这一叠上的压力将使半固化片的熔液环绕工装销钉和沿工装销钉纵向流动。这会流过这叠开孔的PC板，倾向于向内沿着铜表面流动。这不仅能引起沾污，而且会隔开片子，是报废的主要原因。
粘结岛的作用是封住铜Ci和铝Ai间的清洁界面，使得在加热粘合加工期间半固化片熔液不致漏入。因工装孔是冲在岛50的区域内，粘结剂的存在就防止了固化片熔流横向流入铜C与铝A间的界面，这样就解决了问题。
在一叠PC板叠压、固化、冷却后，很容易将这些PC板分开。对于图2这种情况，最后将被分开成2个完整的PC板，还有三个要抛弃的CAC部件的铝层A。最上层的标以7的铜箔将是一块PC板(未示出)的下层的外表面，而最下层的铜箔9将是另一块PC板(未示出)的上层外表面。分离发生在铜的“无瑕”或未沾污的表面Ci和铝基片的“无瑕”或未沾污的表面Ai间，如图3和图4所示。
参照图2，分离将沿最上层叠层CAC部件30的“清洁表面”Ci铜片C由半固化片粘接到相应的型芯10上，图2所示的三个CAC部件的铝片A将与各铜片C分离，而铝被舍弃，再用或用于其它目的。
因为易破的薄铜箔C牢固粘接到铝基片A上，而CAC部件比较硬，容易操作，因此绝少造成铜箔损伤而报废。
不管粘接基片A是由什么材料制成的，使用了它，使用户(厂商)使用越来越薄的铜箔和最终使工序自动化的目标，变得更为现实，因为，采用本发明，铜箔再也不是没有非常需要的实实在在的支撑物了。
因为粘结剂带40的存在，原来就将铜箔和铝片紧贴在一起，因此在制作加工之前和期间半固化片粉尘或其它污染不能进到中心区CZ。
因为工装销钉是插在粘结剂岛50内，因此不会再有半固化片能渗入铝铜层间的界面。随后，按标准清洗粘接着的PC板的工艺，将形成岛50的水溶性粘结剂清洗掉，按尺寸修整板，铝基片不会成为成品PC板的部件，但可舍弃或反复使用。
通过采用这种CAC部件，满足了本发明的三个目的。

Claims (7)

1.用于制造印刷电路板的部件，包括：
叠层件(30，30′)，包括铜箔(C)片，在最终制成的印刷电路板中，该铜箔构成功能件，以及基片(A)，例如是构成可废弃件的铝箔；
铜片(C)和基片(A)的一个未沾污的表面(Ci，Ai)在一个界面相互接合，其特征是还包括：
柔性粘结剂带(40)，将各个片的未沾污表面(Ci，Ai)在其边缘粘结在一起并在片的边缘内部限定一个未沾污的中心区(CZ)，并在所述界面不粘合。
2.根据权利要求1所述的部件，其特征是所述铜箔(C)为两片，两个铜箔之间有基片(A)。
3.根据权利要求1所述的部件，还包括一个柔性的，水溶性岛(50)，将各片(C，A)的未沾污表面在从接合的表面的边缘向内的预定的距离粘合在一起。
4.根据权利要求1所述的部件，其特征是每个柔性粘结剂带(40)为大约0.25-13mm宽，和大约0.025-0.051mm厚。
5.根据权利要求3所述的部件，其特征是每个柔性的，水溶性和黏性的岛(50)为大约2.5mm×2.5mm见方到大约25.4mm×25.4mm见方并且大约为0.013-0.13mm厚。
6.根据权利要求1-5中任一个所述的部件，其特征是柔性粘结剂带(40)是连续的。
7.一种制造用于制造印刷电路板的部件的方法，所述部件具有外导电金属层和至少一个内介电层，所述介电层含有热固化树脂，所述制造方法包括下述步骤：
制备一个互相压接在一起的多层板；
与每个外介电层接合放置，迭合结构的二片铜箔，在制成的印刷电路板中构成功能件，一个铝片，构成可废弃件；
每个铜片的一个表面和铝片的两个表面是基本未被污染的并可在界面处互相接合；
柔性粘结剂带(40)，将铜片的各个未污染的表面在其边缘接到铝片相对的未污染表面并在铝片的相对的侧的片的边缘的内部限定一个基本未沾污的中心区；
一个柔性的，水溶性岛，在铝箔的每侧将各片的未沾污的表面从粘结剂带向内预定的距离粘合在一起；
将压接的板加热和加压使热固化树脂固化；
从每个固化的板上取下铝片。
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