CN103582282A - Circuit board and electronic module and light-emitting module comprising same - Google Patents
Circuit board and electronic module and light-emitting module comprising same Download PDFInfo
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- CN103582282A CN103582282A CN201210260842.1A CN201210260842A CN103582282A CN 103582282 A CN103582282 A CN 103582282A CN 201210260842 A CN201210260842 A CN 201210260842A CN 103582282 A CN103582282 A CN 103582282A
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- circuit board
- circuit layer
- barrier
- electronic device
- substrate
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Abstract
The invention relates to a circuit board (10). The circuit board (10) comprises a substrate (1) and a circuit layer (2) printed on the substrate (1) and is characterized by further comprising a blocking wall (3) formed on the first face (A), where the circuit layer (2) is printed, of the substrate (1), and the blocking wall (3) protrudes out of the first face (A) and encircles the circuit layer (2). In addition, the invention further relates to an electronic module and light-emitting module which comprise the circuit board.
Description
Technical field
The present invention relates to a kind of circuit board, a kind of electronic module and a kind of light emitting module that comprises this circuit board.
Background technology
In modern electronic installation, applied the electronic module in a large number with various functions.In order to meet the needs of various application scenarios, these electronic modules need to, through the processing of water proof and dust proof, pass through the encapsulation process of high leakproofness especially.In encapsulation process, utilize the encapsulating material of liquid to cast to the housing and the circuit board that are placed in mould, its middle shell covers a side of circuit board, at circuit board, be not printed with the fringe region of circuit layer and the fringe region of housing can be used as the joint portion being bonded to each other, the gap of encapsulating material between can seal junction after solidifying.
In this encapsulation process, must consider, whether excessive encapsulating material can further flow into the middle section that housing and circuit board limit through gap to be sealed, and then pollutes and be arranged in the circuit layer in this region and the electronic device of carrying thereof.Owing to being printed on the suprabasil circuit layer of circuit board, by conductive region and non-conductive region, being interlocked and combined, wherein conductive region normally has certain thickness copper film, and non-conductive region is the basal region not covered by copper film.Because the thickness of circuit layer is uneven, therefore excessive liquid encapsulating material can be from the fringe region of circuit board by central with respect to the non-conductive field flow orientation circuit board of conductive region depression, to pollute conductive layer thus, and and then affect the electrical characteristics of electronic installation.
In the prior art for fear of the generation of above-mentioned situation, before circuit board and housing are encapsulated, conventionally mould for holding the groove filling sealing agent of parts to be packaged.These sealants are for example applied on the fringe region of bottom portion of groove.Although can reduce to a certain extent the possibility of encapsulating material inflow circuit layer by means of sealant, because the viscosity of sealant is higher, therefore be difficult to be smeared exactly or be arranged in predetermined region.Therefore this solution has the advantages that cost is higher, manipulation process is complicated.
Summary of the invention
Therefore one object of the present invention is, propose a kind of circuit board, sort circuit plate can encapsulate with housing simply, and in encapsulation process, can guarantee that circuit layer on circuit board and the element of carrying thereof can not contact encapsulating material.
The circuit board proposing according to the present invention, comprise substrate, be printed on the circuit layer on described substrate, it is characterized in that, also comprise the barrier on the first surface that is printed with described circuit layer that is formed on described substrate, described barrier protrudes from described first surface and around described circuit layer.
Due to circuit layer by non-conductive region (the part substrate of exposure) with respect to non-conductive region, there is certain thickness conductive region (conductive layer) and form, therefore between two adjacent conductive regions, limit groove.For fear of liquid encapsulating material excessive in the pollutant coming from the outside, for example encapsulation process, may in circuit layer, extend through these grooves; affect its electrical characteristics and can pollute other devices that are arranged on circuit board, especially on the first surface of substrate, be the barrier that on the side at circuit layer place is provided for circuit layer to protect.Barrier is preferably arranged on the outside of circuit layer, particularly closes in the region of substrate edges, so as under the prerequisite of electrical characteristics that does not affect circuit layer by circuit layer comprehensive surrounding.
According to a preferred design of the present invention, the height that described barrier protrudes from described substrate is equal to or greater than the thickness of described circuit layer.In order to ensure barrier, can stop the pollutant coming from the outside completely, particularly when dimensional packaged circuit board, barrier can not be less than the thickness of circuit layer with respect to the height of substrate, in the plane of this circuit board, bearer circuit plate and the barrier being positioned between the two, limit the closed cavity that holds circuit layer, to prevent that pollutant from entering in this closed cavity.
According to a preferred design of the present invention, described barrier together forms by typography and described circuit layer.By means of for example silk-screen printing technique or other applicable technique, barrier and circuit layer can be printed on substrate simultaneously.The manufacturing cost of circuit board will be reduced significantly like this.Barrier can certainly be additionally provided on the circuit board that is printed with circuit layer, and circuit layer is enclosed in wherein.
According to of the present invention another, preferred embodiment propose, described barrier is the frame being arranged in the fringe region of described substrate.Because circuit board has rectangular profile conventionally, the barrier being therefore printed in the fringe region of circuit board is also preferably designed to rectangular shaped rim, region as much as possible can be looped around to rectangular shaped rim inside thus.
According to a preferred design of the present invention, the material of described barrier and described circuit layer is identical.Can simplify the manufacture process of circuit board thus, enhance productivity.
According to a preferred design of the present invention, described circuit layer and described barrier are made of copper.Preferably, for example the copper film process etch processes to the whole surface of covered substrate, obtains residual annular copper film frame and is looped around circuit layer wherein by copper film frame, and copper film frame is spaced apart from each other as barrier and circuit layer.
The invention still further relates to a kind of electronic module, comprise housing, encapsulating material and at least one electronic device, it is characterized in that, also comprise foregoing circuit plate, wherein said at least one electronic device is fixed on described circuit board.This electronic module can by simple and high leakproofness seal, and be positioned at the device of electronic module inside can packed material contamination.
According to a preferred design of the present invention, it is upper towards second of the first surface of described circuit board that the free end face of described barrier is resisted against described housing, makes described barrier stop that described encapsulating material contacts described circuit layer.Housing limits groove in a side, and circuit board can be placed in groove, and wherein the first surface of circuit board is towards the diapire of groove.By means of encapsulating material, can circuit board be positioned in groove and be filled in the fringe region between first and second.The one end that deviates from circuit board due to barrier is resisted against second above, therefore when encapsulation, stops that encapsulating material enters the middle section of groove along the second surface current, avoids thus encapsulating material to pollute circuit layer and the electronic device of circuit board.
According to a preferred design of the present invention, described housing and first surface also limit for holding the space of described at least one electronic device, and described at least one electronic device is fixed on described circuit layer.Because electronic device also has certain height, so second of housing have the with respect to the horizontal plane region of depression at middle section, for limiting with circuit board the space that holds electronic device.Can guarantee that thus barrier can be resisted against on the fringe region of second all the time.
The invention still further relates to a kind of light emitting module, it is characterized in that, comprise above-mentioned electronic module, at least one electronic device being wherein fixed on described circuit board is light source.In the case, housing is transmission region towards the part or all of zone design of first surface.Particularly preferably be, housing is lens area towards the zone design of light source.
According to a preferred design of the present invention, described at least one electronic device is LED chip.Can improve the optical efficiency of light emitting module thus, and reduce its power consumption.
Should be appreciated that, above generality is described and the following detailed description is all enumerated and illustrative, and object is for the further instruction that the invention provides to claimed.
Accompanying drawing explanation
Accompanying drawing forms the part of this specification, for helping further to understand the present invention.These accompanying drawings illustrate embodiments of the invention, and are used for illustrating principle of the present invention together with specification.Identical parts represent with identical label in the accompanying drawings.Shown in figure:
Fig. 1 is the first embodiment of plate in a circuit according to the invention;
Fig. 2 is according to the perspective, cut-away view of the first embodiment of electronic module of the present invention.
Embodiment
Fig. 1 is the first embodiment of plate in a circuit according to the invention.Plate 10 comprises substrate 1 and is printed on the circuit layer 2 on substrate 1 in a circuit according to the invention.This circuit layer 2 for example can be fixed at least one side of the substrate 1 with insulation characterisitic by means of silk-screen printing technique or other applicable typographies.
In printing process, normally according to circuit diagram, the copper film covering on substrate 1 is carried out to etching, wherein retain the part copper film as conductive region, remove remaining copper film simultaneously and be used as non-conductive region to expose the ，Gai region, subregion of substrate 1.This causes having certain difference in height between the conductive region of forming circuit layer 2 and non-conductive region, limits thus the space of form of grooves between two adjacent conductive regions.When circuit board is encapsulated, excessive encapsulating material is likely wherein entreated region from the fringe region of circuit layer 2 through the space inflow of form of grooves, thereby likely pollutes the device on circuit layer 2, or directly affects the electrical characteristics of circuit layer 2.
For this reason, on the first surface A of circuit board 10, be additionally provided for especially the barrier 3 of protective circuit layer 2, to stop external object, particularly encapsulating material contact circuit layer 2, thereby guarantee that circuit board 10 has good electrology characteristic.In the present embodiment, circuit board 10 has rectangular profile, and barrier 3 is preferably arranged in the fringe region of first surface A with rectangular shaped rim ground form, can guarantee that thus region large as far as possible in first surface A is arranged in the area of isolation that barrier 3 limits.Barrier 3 can be the fringe region that is used to form the copper film of circuit layer 2, by means of after copper film being processed such as applicable techniques such as etchings, form simultaneously and be positioned at the circuit layer 2 of first surface A central authorities and the barrier 3 of loop circuit capable layer 2 setting with interval.At this, circuit layer 2 and barrier 3 are all made of copper, and have identical thickness.
The barrier 3 with shaped as frame profile also can be additionally provided on the circuit board 10 that is printed with circuit layer 2, and will be looped around wherein with its circuit layer 2 being positioned at equally on first surface A.Therefore barrier 3 also can be made by other applicable materials, for example plastics.In the case, barrier 3 can be greater than the distance of circuit layer 2 to first surface A to the distance of first surface A.
Fig. 2 is according to the perspective, cut-away view of the first embodiment of electronic module of the present invention.As can be seen from Figure, electronic module 20 comprises the circuit board 10 of housing 21, electronic device 22 and carrying electronic device 22, and wherein circuit board 10 is placed in inverted housing 21, and can form an integral body with housing 21 by means of encapsulating material.Housing 21 comprises diapire and the sidewall that jointly limits groove, circuit board 10 can for example be put into groove from top, the first surface A of circuit board 10 and the bottom surface of groove, be housing 21 second B toward each other, and form clearance G to be sealed between first surface A and second B.
Because circuit board 10 comprises the extended annular barrier 3 of fringe region from first surface A, therefore in the situation that annular barrier 3 has certain altitude, for example be equal to or greater than in the situation of thickness of the circuit layer 2 being printed on first surface A, the free end face of barrier 3 can be resisted against on second B completely.On the one hand, barrier 3 and first surface A and second B limit jointly for holding the seal cavity of circuit layer 2 and electronic device 22.On the other hand, other regions of barrier 3 and circuit board 10 and housing 21 limit for holding the region to be packaged of encapsulating material.
The fringe region of second B is preferably designed to be parallel to the horizontal plane of first surface A, to realize and contacting with the seamless unoccupied place of free end face of barrier 3 as far as possible.Because the electronic device 22 being arranged on circuit layer 2 has certain thickness, so the distance between electronic device 22 and first surface A is greater than the free end face of barrier 3 and the distance between first surface A.For fear of electronic device 22, affect the sealing between housing 21 and circuit board 10, by the subregion of second B, the special zone design towards electronic device 22, be away from the curved surface of circuit board 10 depressions especially, can jointly limit for holding the space R of electronic device 22 with first surface A thus.
In the situation that electronic module 20 is designed to light emitting module, at least one electronic device 22 is light sources, particularly preferably is LED chip, and housing 21 can preferably be designed to lens towards the region of light source.
Electronic module 20 also comprises for giving the wire 23 of circuit board 10 supply of electrical energy, and two wires 23 shown in figure extend past circuit board 10 not a side, i.e. one side of end face shown in figure of bearer circuit layer 2 through default opening on housings 21.Circuit board 10 for example, is electrically connected to by means of conductive component, the electric mortiser pin stretching out from end face and wire 23, can be circuit board 10 power supplies thus.In addition can be for electronic module 20 is provided for from the cover plate of the top sealing electronic module 20 shown in figure, cover plate can be with the common configuration example of housing 21 of the below shown in figure as having the closed module of rectangular profile.Can further improve the sealing of electronic module 20 thus.
These are only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.All any modifications of doing within the spirit and principles in the present invention, be equal to replacement, improvement etc., within protection scope of the present invention all should be included in.
Label list
1 substrate
2 circuit layers
3 barriers
10 circuit boards
20 electronic modules
21 housings
22 electronic devices
23 wires
A first surface
Second of B
G gap
R space
Claims (11)
1. a circuit board (10), comprise substrate (1) and be printed on the circuit layer (2) on described substrate (1), it is characterized in that, also comprise the barrier (3) on the first surface that is printed with described circuit layer (2) (A) that is formed on described substrate (1), described barrier (3) protrudes from described first surface (A) and around described circuit layer (2).
2. circuit board according to claim 1 (10), is characterized in that, the height that described barrier (3) protrudes from described substrate (1) is equal to or greater than the thickness of described circuit layer (2).
3. circuit board according to claim 2 (10), is characterized in that, described barrier (3) together forms by typography and described circuit layer (2).
4. according to the circuit board described in any one in claims 1 to 3 (10), it is characterized in that, described barrier (3) is for being arranged on the frame in the fringe region of described substrate (1).
5. according to the circuit board described in any one in claims 1 to 3 (10), it is characterized in that, described barrier (3) is identical with the material of described circuit layer (2).
6. circuit board according to claim 5 (10), is characterized in that, described circuit layer (2) and described barrier (3) are made of copper.
7. an electronic module (20), comprise housing (21), encapsulating material and at least one electronic device (22), it is characterized in that, also comprise the circuit board described in any one (10) in claim 1-6, wherein said at least one electronic device (22) is fixed on described circuit board (10).
8. electronic module according to claim 7 (20), it is characterized in that, it is upper towards second (B) of the first surface (A) of described circuit board (10) that the free end face of described barrier (3) is resisted against described housing (21), makes described barrier (3) stop that described encapsulating material contacts described circuit layer (2).
9. electronic module according to claim 7 (20), it is characterized in that, described housing (21) and first surface (A) also limit for holding the space (R) of described at least one electronic device (22), and described at least one electronic device (22) is fixed on described circuit layer (2).
10. a light emitting module, is characterized in that, comprises the electronic module (20) described in claim 7 to 9, and at least one electronic device (22) being wherein fixed on described circuit board (10) is light source.
11. light emitting modules according to claim 10, is characterized in that, described at least one electronic device (22) is LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260842.1A CN103582282B (en) | 2012-07-25 | 2012-07-25 | Circuit board, electronic module and light emitting module including the circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210260842.1A CN103582282B (en) | 2012-07-25 | 2012-07-25 | Circuit board, electronic module and light emitting module including the circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103582282A true CN103582282A (en) | 2014-02-12 |
| CN103582282B CN103582282B (en) | 2018-05-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210260842.1A Expired - Fee Related CN103582282B (en) | 2012-07-25 | 2012-07-25 | Circuit board, electronic module and light emitting module including the circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103582282B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098633A (en) * | 2016-06-30 | 2016-11-09 | 广州兴森快捷电路科技有限公司 | A kind of base plate for packaging and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070086189A1 (en) * | 2004-05-18 | 2007-04-19 | Onscreen Technologies, Inc. | LED Assembly with Vented Circuit Board |
| CN201289055Y (en) * | 2008-11-19 | 2009-08-12 | 浙江晶皓光电科技有限公司 | High power LED lamp heat radiator |
| CN201651936U (en) * | 2010-04-23 | 2010-11-24 | 矽格微电子(无锡)有限公司 | LED packaging structure provided with glass cover |
| KR20110116306A (en) * | 2010-04-19 | 2011-10-26 | 심현섭 | Led lamp |
| US20120146084A1 (en) * | 2010-12-10 | 2012-06-14 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Light-emitting diode package structure |
-
2012
- 2012-07-25 CN CN201210260842.1A patent/CN103582282B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070086189A1 (en) * | 2004-05-18 | 2007-04-19 | Onscreen Technologies, Inc. | LED Assembly with Vented Circuit Board |
| CN201289055Y (en) * | 2008-11-19 | 2009-08-12 | 浙江晶皓光电科技有限公司 | High power LED lamp heat radiator |
| KR20110116306A (en) * | 2010-04-19 | 2011-10-26 | 심현섭 | Led lamp |
| CN201651936U (en) * | 2010-04-23 | 2010-11-24 | 矽格微电子(无锡)有限公司 | LED packaging structure provided with glass cover |
| US20120146084A1 (en) * | 2010-12-10 | 2012-06-14 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Light-emitting diode package structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098633A (en) * | 2016-06-30 | 2016-11-09 | 广州兴森快捷电路科技有限公司 | A kind of base plate for packaging and preparation method thereof |
| CN106098633B (en) * | 2016-06-30 | 2019-05-21 | 广州兴森快捷电路科技有限公司 | A kind of package substrate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103582282B (en) | 2018-05-18 |
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