CN103484904A - Copper plating process for iron-based hardware - Google Patents
Copper plating process for iron-based hardware Download PDFInfo
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- CN103484904A CN103484904A CN201310465603.4A CN201310465603A CN103484904A CN 103484904 A CN103484904 A CN 103484904A CN 201310465603 A CN201310465603 A CN 201310465603A CN 103484904 A CN103484904 A CN 103484904A
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- handware
- iron
- plating
- copper
- electroplating
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Abstract
The invention discloses a copper plating process for iron-based hardware. The process includes the steps of: (a) performing alkali washing on the iron-based hardware to remove oil stain, and conducting acid washing treatment to remove the oxide on the hardware surface; and (b) taking electrolytic copper as an anode, adopting the hardware as a cathode, placing them into an electrolytic bath to perform electroplating. Specifically, the electrolyte solution for electroplating contains 40-60g/L CuSO4.5H2O, 80-100mL/L glyoxylic acid, 50-60g/L calcium hypophosphite, 20-40g/L of nickel chloride, 50-80g/L boric acid, 0.5-0.8g/L 1, 4-butynediol. In particular, the temperature of the electrolyte solution is 40-60DEG C, the electroplating time is 40-60min, and the current density of electroplating gradually decreases from 3.0 to 2.0A/dm<2> within the plating time. The copper plating process for iron-based hardware provided by the invention has no need for virulent chemicals, guarantees the health of operation personnel, and is green and environmental-friendly.
Description
Technical field
The present invention relates to the technical field of surface of handware, relate in particular to a kind of copper-plating technique of iron-based handware.
Background technology
Handware refer to the metals such as iron, steel, aluminium through forging, calendering, cutting, etc. the various metal devices that form of Physical Processing manufacture, such as hardware & tools, five metals component, haberdashery and hardware, architectural hardware and security protection articles for use etc., handware all is widely used in the manufacturing of all trades and professions.To be that a kind of cost is low cut comparatively easily processing to iron, therefore iron is widely used in the manufacture handware, but the corrosion resistance nature of iron is poor, generally all can pass through process of surface treatment, prevent that phenomenon oxidized and corrosion from appearring in handware in follow-up processing and use procedure.
Plating is a kind of process of surface treatment be in daily use.Plating is to utilize electrolysis principle to plate the process of other metal or alloy of skim on some metallic surface, be to utilize electrolytic action that thereby the technique of the surface attachment layer of metal film of metal or other material product is played to prevent corrosion, improve the effects such as wear resistance, electroconductibility, reflective and having improved aesthetic appearance, copper is owing to having good electroconductibility, thermal conductivity, plasticity-, and is widely used in electroplating industry.As long as at present main copper-plating technique has cyanide electroplating and pyrophosphate copper plating, these two kinds of copper-plating techniques all need the pharmaceutical chemicals that uses toxicity larger, and operating personnel's health has been produced to very large threat, and the electroplating effluent environmental pollution is serious.
Summary of the invention
In view of the deficiencies in the prior art, the invention provides a kind of copper-plating technique of iron-based handware, this technique does not need to use hypertoxic pharmaceutical chemicals, has ensured operating personnel's health, environmental protection; And this technique can obtain on the handware surface rete of high compactness, high rigidity.
The technical solution adopted for the present invention to solve the technical problems is: a kind of copper-plating technique of iron-based handware comprises step:
(a) the iron-based handware is removed after alkali cleaning wipe oil, cleanup acid treatment to the oxide compound on handware surface; Then the described handware of heating, drying, discharge in acid cleaning process the gas at the handware remained on surface;
(b) take electrolytic copper as anode, handware is negative electrode, puts into electrolyzer and is electroplated; Wherein, the CuSO that the electrolytic solution of plating contains 40～60g/L
45H
2isosorbide-5-Nitrae one butynediol of the nickelous chloride of the oxoethanoic acid of O, 80～100mL/L, the calcium propionate of 50～60g/L, 20～40g/L, the boric acid of 50～80g/L, 0.5～0.8g/L;
Wherein, the temperature of electrolytic solution is 40～60 ℃, and the time of plating is 40～60min, the current density of plating within the time of electroplating from 3.0～2.0A/dm
2reduce gradually.
Preferably, the pH value of described electrolytic solution is 4～6.
Preferably, the CuSO that described electrolytic solution contains 40g/L
45H
2isosorbide-5-Nitrae one butynediol of the nickelous chloride of the oxoethanoic acid of O, 80mL/L, the calcium propionate of 50g/L, 20g/L, the boric acid of 50g/L, 0.5g/L.
Preferably, when electroplating, the temperature of electrolytic solution is 50～60 ℃, and the time of plating is 60min, the current density of plating within the time of electroplating from 3.0～2.5A/dm
2reduce gradually.
Preferably, the CuSO that described electrolytic solution contains 60g/L
45H
2isosorbide-5-Nitrae one butynediol of the nickelous chloride of the oxoethanoic acid of O, 100mL/L, the calcium propionate of 60g/L, 40g/L, the boric acid of 80g/L, 0.8g/L.
Preferably, when electroplating, the temperature of electrolytic solution is 40～50 ℃, and the time of plating is 30min, the current density of plating within the time of electroplating from 2.5～2.0A/dm
2reduce gradually.
Preferably, in step (a), adopt the sodium hydroxide solution that concentration is 15%～25% to clean the handware wipe oil.
Preferably, in step (b), adopt the phosphoric acid solution cleaning handware that concentration is 10%～20% to remove surperficial oxide compound.
The copper-plating technique of iron-based handware provided by the invention, this technique does not need to use hypertoxic pharmaceutical chemicals, has ensured operating personnel's health, environmental protection; And in the process of electroplating, current density reduces gradually, and the rete of acquisition has good bonding force; This technique can obtain on the handware surface rete of high compactness, high rigidity; And this technical process is simple, and production cost is low, is suitable for suitability for industrialized production.
Embodiment
The present invention is further detailed explanation in conjunction with specific embodiments now.
Embodiment 1
The copper-plating technique of the iron-based handware that the present embodiment provides comprises step:
(a) the iron-based handware is removed after alkali cleaning wipe oil, cleanup acid treatment to the oxide compound on handware surface; Then the described handware of heating, drying, discharge in acid cleaning process the gas at the handware remained on surface; Wherein, adopt the sodium hydroxide solution that concentration is 15%～25% to clean the handware wipe oil, scavenging period is 8～10min; Adopt the phosphoric acid solution cleaning handware that concentration is 10%～20% to remove surperficial oxide compound, scavenging period is 2～3min;
(b) take electrolytic copper as anode, handware is negative electrode, puts into electrolyzer and is electroplated; Wherein, the CuSO that described electrolytic solution contains 40g/L
45H
2isosorbide-5-Nitrae one butynediol of the nickelous chloride of the oxoethanoic acid of O, 80mL/L, the calcium propionate of 50g/L, 20g/L, the boric acid of 50g/L, 0.5g/L; The pH value of electrolytic solution is 4.
The temperature of controlling electrolytic solution in electrolyzer is that temperature is 50～60 ℃, and the time of plating is 60min, the current density of plating within the time of electroplating from 3.0～2.5A/dm
2reduce gradually; Taking-up handware cleaning, drying after plating completes, obtain stable and uniform, the rete of high compactness, high rigidity on the handware surface.
Embodiment 2
The copper-plating technique of the iron-based handware that the present embodiment provides comprises step:
(a) the iron-based handware is removed after alkali cleaning wipe oil, cleanup acid treatment to the oxide compound on handware surface; Then the described handware of heating, drying, discharge in acid cleaning process the gas at the handware remained on surface; Wherein, adopt the sodium hydroxide solution that concentration is 15%～25% to clean the handware wipe oil, scavenging period is 8～10min; Adopt the phosphoric acid solution cleaning handware that concentration is 10%～20% to remove surperficial oxide compound, scavenging period is 2～3min;
(b) take electrolytic copper as anode, handware is negative electrode, puts into electrolyzer and is electroplated; Wherein, the CuSO that electrolytic solution contains 60g/L
45H
2isosorbide-5-Nitrae one butynediol of the nickelous chloride of the oxoethanoic acid of O, 100mL/L, the calcium propionate of 60g/L, 40g/L, the boric acid of 80g/L, 0.8g/L; The pH value of electrolytic solution is 6.
The temperature of controlling electrolytic solution in electrolyzer is that temperature is 40～50 ℃, and the time of plating is 40min, the current density of plating within the time of electroplating from 2.5～2.0A/dm
2reduce gradually; Taking-up handware cleaning, drying after plating completes, obtain stable and uniform, the rete of high compactness, high rigidity on the handware surface.
More than comprehensive, the copper-plating technique of iron-based handware provided by the invention, this technique does not need to use hypertoxic pharmaceutical chemicals, has ensured operating personnel's health, environmental protection; And in the process of electroplating, current density reduces gradually, and the rete of acquisition has good bonding force; This technique can obtain on the handware surface rete of high compactness, high rigidity; And this technical process is simple, and production cost is low, is suitable for suitability for industrialized production.
The above-mentioned foundation desirable embodiment of the present invention of take is enlightenment, and by above-mentioned description, the relevant staff can, in the scope that does not depart from this invention technological thought, carry out various change and modification fully.The technical scope of this invention is not limited to the content on specification sheets, must determine its technical scope according to the claim scope.
Claims (8)
1. the copper-plating technique of an iron-based handware, is characterized in that, comprises step:
(a) the iron-based handware is removed after alkali cleaning wipe oil, cleanup acid treatment to the oxide compound on handware surface; Then the described handware of heating, drying, discharge in acid cleaning process the gas at the handware remained on surface;
(b) take electrolytic copper as anode, handware is negative electrode, puts into electrolyzer and is electroplated; Wherein, the CuSO that the electrolytic solution of plating contains 40～60g/L
45H
2isosorbide-5-Nitrae one butynediol of the nickelous chloride of the oxoethanoic acid of O, 80～100mL/L, the calcium propionate of 50～60g/L, 20～40g/L, the boric acid of 50～80g/L, 0.5～0.8g/L;
Wherein, the temperature of electrolytic solution is 40～60 ℃, and the time of plating is 40～60min, the current density of plating within the time of electroplating from 3.0～2.0A/dm
2reduce gradually.
2. the copper-plating technique of iron-based handware according to claim 1, is characterized in that, the pH value of described electrolytic solution is 4～6.
3. the copper-plating technique of iron-based handware according to claim 1, is characterized in that, the CuSO that described electrolytic solution contains 40g/L
45H
2isosorbide-5-Nitrae one butynediol of the nickelous chloride of the oxoethanoic acid of O, 80mL/L, the calcium propionate of 50g/L, 20g/L, the boric acid of 50g/L, 0.5g/L.
4. the copper-plating technique of iron-based handware according to claim 3, is characterized in that, when electroplating, the temperature of electrolytic solution is 50～60 ℃, and the time of plating is 60min, the current density of plating within the time of electroplating from 3.0～2.5A/dm
2reduce gradually.
5. the copper-plating technique of iron-based handware according to claim 1, is characterized in that, the CuSO that described electrolytic solution contains 60g/L
45H
2isosorbide-5-Nitrae one butynediol of the nickelous chloride of the oxoethanoic acid of O, 100mL/L, the calcium propionate of 60g/L, 40g/L, the boric acid of 80g/L, 0.8g/L.
6. the copper-plating technique of iron-based handware according to claim 5, is characterized in that, when electroplating, the temperature of electrolytic solution is 40～50 ℃, and the time of plating is 30min, the current density of plating within the time of electroplating from 2.5～2.0A/dm
2reduce gradually.
7. the copper-plating technique of iron-based handware according to claim 1, is characterized in that, in step (a), adopts the sodium hydroxide solution that concentration is 15%～25% to clean the handware wipe oil.
8. the copper-plating technique of iron-based handware according to claim 1, is characterized in that, in step (b), adopts the phosphoric acid solution cleaning handware that concentration is 10%～20% to remove surperficial oxide compound.
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| CN201310465603.4A CN103484904A (en) | 2013-10-08 | 2013-10-08 | Copper plating process for iron-based hardware |
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| CN201310465603.4A CN103484904A (en) | 2013-10-08 | 2013-10-08 | Copper plating process for iron-based hardware |
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Citations (9)
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|---|---|---|---|---|
| US3518170A (en) * | 1965-07-26 | 1970-06-30 | Ibm | Electrodeposition of iron group metals |
| US3833481A (en) * | 1972-12-18 | 1974-09-03 | Buckbel Mears Co | Electroforming nickel copper alloys |
| JPS5710957B2 (en) * | 1975-08-20 | 1982-03-01 | ||
| CN86102304A (en) * | 1986-04-05 | 1987-10-14 | 江西省崇义县农机修造厂 | Pre-plating process before the acidic copper-plating of bright steel parts |
| US20040152303A1 (en) * | 2003-02-05 | 2004-08-05 | Enthone, Inc. | Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication |
| JP2009167506A (en) * | 2008-01-21 | 2009-07-30 | Ebara Udylite Kk | Acid copper electroplating solution and method for producing fine wiring circuit using the same |
| CN101724873A (en) * | 2008-10-31 | 2010-06-09 | 鞍钢重型机械有限责任公司 | Functional electroplating process of copperplates of crystallizers |
| CN102443826A (en) * | 2010-09-30 | 2012-05-09 | 希捷科技有限公司 | Electrodeposition of CoNiP films |
| CN103280426A (en) * | 2013-05-31 | 2013-09-04 | 华进半导体封装先导技术研发中心有限公司 | Method for avoiding TSV overloading through current program |
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2013
- 2013-10-08 CN CN201310465603.4A patent/CN103484904A/en active Pending
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|---|---|---|---|---|
| US3518170A (en) * | 1965-07-26 | 1970-06-30 | Ibm | Electrodeposition of iron group metals |
| US3833481A (en) * | 1972-12-18 | 1974-09-03 | Buckbel Mears Co | Electroforming nickel copper alloys |
| CA1019274A (en) * | 1972-12-18 | 1977-10-18 | Buckbee-Mears Company | Electroforming nickel copper alloys in boric acid bath |
| JPS5710957B2 (en) * | 1975-08-20 | 1982-03-01 | ||
| CN86102304A (en) * | 1986-04-05 | 1987-10-14 | 江西省崇义县农机修造厂 | Pre-plating process before the acidic copper-plating of bright steel parts |
| US20040152303A1 (en) * | 2003-02-05 | 2004-08-05 | Enthone, Inc. | Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication |
| JP2009167506A (en) * | 2008-01-21 | 2009-07-30 | Ebara Udylite Kk | Acid copper electroplating solution and method for producing fine wiring circuit using the same |
| CN101724873A (en) * | 2008-10-31 | 2010-06-09 | 鞍钢重型机械有限责任公司 | Functional electroplating process of copperplates of crystallizers |
| CN102443826A (en) * | 2010-09-30 | 2012-05-09 | 希捷科技有限公司 | Electrodeposition of CoNiP films |
| CN103280426A (en) * | 2013-05-31 | 2013-09-04 | 华进半导体封装先导技术研发中心有限公司 | Method for avoiding TSV overloading through current program |
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Application publication date: 20140101 |