CN103367347A - Light emitting diode packaging construction and lamps - Google Patents
Light emitting diode packaging construction and lamps Download PDFInfo
- Publication number
- CN103367347A CN103367347A CN2012100999149A CN201210099914A CN103367347A CN 103367347 A CN103367347 A CN 103367347A CN 2012100999149 A CN2012100999149 A CN 2012100999149A CN 201210099914 A CN201210099914 A CN 201210099914A CN 103367347 A CN103367347 A CN 103367347A
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- Prior art keywords
- emitting diode
- led
- light
- backlight unit
- diode chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The invention discloses a light emitting diode packaging construction and lamps. The light emitting diode packaging construction is that multiple light emitting diode chips are packaged on a substrate with flexibility. The light emitting diode packaging construction can be curved so that a hollow and cylindrical lamp wall part of a light emitting diode lamp is formed. The multiple light emitting diode chips are electrically connected with each other, of which the light emitting direction orients towards the external of the lamp wall part so that a function of 360 degrees full circumferential surface lighting is provided.
Description
[technical field]
The present invention relates to a kind of encapsulation structure of LED and light fixture, particularly relates to a kind of light fixture that is comprised of encapsulation structure of LED.
[background technology]
Light-emitting diode (Light Emitting Diode, LED) be the solid-state light-emitting component made from semi-conducting material, materials'use III-V family semiconductor element (as: gallium phosphide (GaP), GaAs (GaAs) etc.), principle of luminosity is to convert electrical energy into light, namely compound semiconductor is applied electric current, see through the combination in electronics and electric hole, superfluous energy can disengage with the form of light, reach luminous effect, belong to cold property luminous, the life-span reached more than 100,000 hours.
The characteristics of LED maximum are: need not warm up the lamp time, reaction speed is fast, volume is little, power-saving, shatter-proof, pollute low, be fit to volume production, the tool high-reliability, easily the needs on the fit applications are made the assembly of minimum or array type.The LED assembly can only send the ruddiness of low luminosity in early days, develops afterwards other monochromatic version, and the light that can send has even to this day spreaded all over visible light, infrared ray and ultraviolet ray, and luminosity is also brought up to suitable luminosity.And its purposes is also by at the beginning as indicator light, display panel etc.; Continuous gradually being developed to is used as illumination along with the appearance of white light emitting diode.When pursuing scientific and technological progress, people also recognize environmental protection and energy-conservation importance, so replace the inexorable trend that traditional lighting has become development in science and technology with the LED light fixture.
Yet, the operating voltage of existing single LEDs package assembling is also about three ten-day period of hot season spy, and its lighting angle and brightness are still very limited, if will be as lighting use, usually must on a column support of a light fixture, solid plug assembling and be electrically connected a plurality of single LEDs package assemblings, to promote whole lamp brightness and light angle.Because each light fixture (bulb) has comprised a plurality of separately single LEDs package assemblings independently, therefore also so that the assembling complicated of LED light fixture and cost can't reduce.In addition, can produce high temperature during the running of LED light fixture, after particularly a plurality of single LEDs package assemblings being fitted together, the integral heat sink usefulness of LED light fixture is low also to be a problem that must overcome.
Therefore, be necessary to provide a kind of encapsulation structure of LED and light fixture, to solve the existing problem of prior art.
[summary of the invention]
Main purpose of the present invention is to provide a kind of led lamp, it comprises a lamp wall section that is hollow columnar, described lamp wall section is by curling being formed by connecting of an encapsulation structure of LED, described encapsulation structure of LED mainly coats a plurality of light-emitting diode chip for backlight unit, described a plurality of light-emitting diode chip for backlight unit mutually be electrically connected and light emission direction outwardly, providing a kind of 360 degree all-round illumination functions, and has good heat sinking function.
Secondary objective of the present invention is to provide a kind of encapsulation structure of LED, by a plurality of light emitting diode chip packages are had on the flexible substrate one, and can curlingly be connected to form the lamp wall section that one of a led lamp is hollow columnar.
For reaching aforementioned purpose of the present invention, the invention provides a kind of encapsulation structure of LED, it comprises: one have flexible substrate, a plurality of light-emitting diode chip for backlight unit, many wires and have flexible transparent encapsulated layer.Described have flexible substrate and have at least one chip bearing district, and form crawl curved around shape; Described a plurality of light-emitting diode chip for backlight unit is located in the chip bearing district of described substrate; Described many wires are electrically connected adjacent described a plurality of light-emitting diode chip for backlight unit, form electrical serial or parallel connection; Reach the described flexible transparent encapsulated layer that has, encapsulate the chip bearing district of described substrate, described a plurality of light-emitting diode chip for backlight unit and described many wires.
Moreover, the invention provides another kind of led lamp, it comprises the lamp wall section of a hollow columnar, and described lamp wall section is by curling being formed by connecting of an encapsulation structure of LED.Described encapsulation structure of LED comprises: one have flexible substrate, a plurality of light-emitting diode chip for backlight unit, many wires and have flexible transparent encapsulated layer.Wherein, described have flexible substrate and have at least one chip bearing district, and form crawl curved around shape; Described a plurality of light-emitting diode chip for backlight unit is located in the chip bearing district of described substrate; Described many wires are electrically connected adjacent described a plurality of light-emitting diode chip for backlight unit, form electrical serial or parallel connection; Reach the described flexible transparent encapsulated layer that has, encapsulate the chip bearing district of described substrate, described a plurality of light-emitting diode chip for backlight unit and described many wires.
[description of drawings]
Fig. 1 is the stereogram of the led lamp of one embodiment of the invention.
Fig. 2 is the stereogram of the led lamp of another embodiment of the present invention.
Fig. 3 A is the vertical view of the encapsulation structure of LED of another embodiment of the present invention.
Fig. 3 B is the side partial cross-sectional of the encapsulation structure of LED of Fig. 3 A embodiment of the present invention.
Fig. 4 A to 4F is the manufacturing process schematic diagram of the encapsulation structure of LED of Fig. 3 embodiment of the present invention.
Fig. 5 is the vertical view of the encapsulation structure of LED of another embodiment of the present invention.
Fig. 6 is the vertical view of the encapsulation structure of LED of another embodiment of the present invention.
Fig. 7 is the side partial cross-sectional of the encapsulation structure of LED of another embodiment of the present invention.
Fig. 8 A is the vertical view of the encapsulation structure of LED of another embodiment of the present invention.
Fig. 8 B is the side partial cross-sectional of the encapsulation structure of LED of Fig. 8 A embodiment of the present invention.
[embodiment]
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, preferred embodiment of the present invention cited below particularly, and cooperation accompanying drawing are described in detail below:
Please refer to shown in Figure 1ly, Fig. 1 is the stereogram of the led lamp 100 of one embodiment of the invention.The led lamp 100 of one embodiment of the invention comprises a lamp wall section 10 that is hollow columnar, described lamp wall section 10 by an encapsulation structure of LED curling and connect its both side edges and form, described lamp wall section 10 can be cylindric, triangle column or other polygonal column.Described encapsulation structure of LED mainly comprises a plurality of light-emitting diode chip for backlight unit 12.Therefore, the illumination functions of all-round of a kind of 360 degree can be provided after described led lamp 100 energisings.
In addition, as shown in Figure 1, one end (bottom) of described led lamp 100 can comprise a base 20 in addition, and described base 20 is located at an end (bottom) of described lamp wall section 10, in order to fixing and be electrically connected at an external power source or lamp socket (not illustrating).The circuit board (not illustrating) that power supply transformation/rectifier needs also can be set in the described base 20.Therefore, reach by transformation/rectification by the joint that suitable pattern is set, described led lamp 100 can use as general light fixture.
Moreover, because at least one end (top) of described led lamp 100 is opening-like, therefore the heat that produces of described a plurality of light-emitting diode chip for backlight unit 12 can be first conducted to the medial surface of described lamp wall section 10, then be transmitted to again the hollow interior space of described led lamp 100, and locate to flow out by at least one opening (upper opening among the figure) of described lamp wall section 10, thereby can reduce the heat that described a plurality of light-emitting diode chip for backlight unit 12 produces.
Please refer to shown in Figure 2ly, Fig. 2 is the stereogram of the led lamp 100a of another embodiment of the present invention.The led lamp 100a of second embodiment of the invention is similar in appearance to Fig. 1 embodiment of the present invention, and roughly continue to use same reference numbers, but the difference characteristic of the present embodiment is: the lamp wall 10a of section of described led lamp 100a is the circular cone column, and namely the diameter of the end of the described lamp wall 10a of section (being connected in the bottom of described base 20) is greater than the diameter on its other end (top).Therefore, described led lamp 100a can provide among more deflection figure the light source component of top, so that described led lamp 100a can more level off to the lighting kenel of traditional bulb-type lighting apparatus.
And, in order to strengthen radiating effect, can be provided with a plurality of air channels (not illustrating) on the described lamp wall 10a of section.Perhaps, the described lamp wall 10a of section is provided with a plurality of air vent holes 14 near described base 20 ring-types, so that described led lamp 100a produces a kind of stack effect (Stack effect).Stack effect refers to the lifting that makes progress along the space that gradient is arranged of internal heat air, causes air to add the phenomenon of strong convection.The heat that led lamp 100a can make described a plurality of light-emitting diode chip for backlight unit 12 produce can be transmitted to first inner space, shed as the outward opening of medium by described lamp wall section 10a top with inner air again, simultaneously outside colder air fills into the inner space by described a plurality of air vent holes 14, form exchange and the circulation of cold and hot air, therefore effectively reduce the heat that described a plurality of light-emitting diode chip for backlight unit 12 produces.
In sum, when existing LED product will be as lighting use, usually must be on a light fixture solid plug assembling and be electrically connected a plurality of single LEDs package assemblings, therefore so that the assembling of existing LED lamp lighting equipment is complicated, cost can't reduce, and have the problems such as heat radiation is bad.The present invention has flexible LED package support plate by a plurality of light-emitting diode chip for backlight unit 12 encapsulation are formed one, and by the curling lamp wall section 10 that is connected to form a led lamp 100 of described LED package support plate.Described led lamp 100 can provide the illumination functions of all-round of a kind of 360 degree, and has good heat sinking function.
Please refer to shown in Fig. 3 A and Fig. 3 B, Fig. 3 A is the vertical view of the encapsulation structure of LED 200 of another embodiment of the present invention; And Fig. 3 B is the side partial cross-sectional of the encapsulation structure of LED 200 of Fig. 3 A.Described encapsulation structure of LED 200 is can be further curling and connect its both side edges, to form the lamp wall section 10 of led lamp shown in Figure 1 100.Described encapsulation structure of LED 200 comprises one to have flexible substrate 210, a plurality of light-emitting diode chip for backlight unit 220, many wires 230, a plurality of phosphor powder layers 240 and and has flexible transparent encapsulated layer 250.
Described have flexible substrate 210 and have (or a plurality of) chip bearing district (indicate), and form crawl curved around shape; Described a plurality of light-emitting diode chip for backlight unit 220 is located at described substrate 210 described crawl curved in shape chip bearing district; Described many wires 230 are electrically connected adjacent described a plurality of light-emitting diode chip for backlight unit 220, form the curved electrical series connection around shape of crawling (or in parallel) relation; Each described a plurality of light-emitting diode chip for backlight unit 220 is provided with a phosphor powder layer 240, to adjust the light color that of described a plurality of light-emitting diode chip for backlight unit 220; Described chip bearing district, a plurality of light-emitting diode chip for backlight unit 220, described many wires and described phosphor powder layer 240 with the described substrate 210 of flexible transparent encapsulated layer 250 coatings.
In the present embodiment, described a plurality of light-emitting diode chip for backlight unit 220 can be the horizontal light emitting diode chip, refer to that namely two electrodes of its P utmost point and the N utmost point are left and right sides halves that level is divided into chip.Described wire 230 is electrically connected to form in order to the end face of the phase different electrode (not illustrating) that is electrically connected at two adjacent light-emitting diodes 220, for example is connected in series relation.Therefore, the illumination functions of one area source can be provided after described encapsulation structure of LED 200 energisings.
Yet, the present invention does not limit pattern and the series system of described a plurality of light-emitting diode chip for backlight unit 200, it can be horizontal light emitting diode chip or vertical LED chip, it can be electrical series, parallel, or series connection and combination in parallel, to be designed to meet the specification of user's demand.Above-mentioned vertical LED chip refers to that then its P utmost point and two electrodes of the N utmost point are the up and down halves that vertically vertically are divided into chip.
In addition, described to have flexible substrate 210 can be a flexible metal layer or a pliability non-metallic material bed of material, the aluminium sheet of copper coin, gold-plated copper coin, nickel plating copper coin, tool aluminum oxide film for example, or be coated with plastic plate of metallic film etc.Described have flexible transparent encapsulated layer 250 and can be a transparent resin layer (for example silica gel or resin), flexible to provide described encapsulation structure of LED 200 to have, so that the characteristic of shaping and setting to be provided.The basal surface of described encapsulation structure of LED 200 can supply described light-emitting diode chip for backlight unit 220 heat loss through conduction, and its top surface can outwards penetrate for light and penetrate so that illumination to be provided.Therefore, described encapsulation structure of LED 200 can further bend to the hollow columnar lamp wall section 10 that a curved surface used or formed first embodiment of the invention, and has the function luminous towards the outside.
The making step of the encapsulation structure of LED 200 of Fig. 3 of the present invention is described as follows with reference to Fig. 4 A to 4F:
Shown in Fig. 4 A, provide a board 300.
Shown in Fig. 4 B, have flexible substrate 210 with one and place on the described board 300, described substrate 210 has one or more chip bearings district (indicating), and formation is crawled curved around shape.
Shown in Fig. 4 C, with a plurality of light-emitting diode chip for backlight unit 220, paste in the chip bearing district of being fixed in described substrate 210 by a glue-line (not illustrating).
Shown in Fig. 4 D, utilize wire 230 to be electrically connected adjacent described a plurality of light-emitting diode chip for backlight unit 220, form electrically series connection (or in parallel).
Shown in Fig. 4 E, a plurality of phosphor powder layers 240 are formed at respectively the upper surface of described a plurality of light-emitting diode chip for backlight unit 220.
Shown in Fig. 4 F, coat described substrate 210, described a plurality of light-emitting diode chip for backlight unit 220, described many wires 230 and described a plurality of phosphor powder layer 240 to have flexible transparent encapsulated layer 250.
At last, remove described board 300 and make encapsulation structure of LED 200 shown in Fig. 3 B.But in case of necessity, also can select to keep described board 300 with the chip bearing district of the described substrate 210 of supplemental support.
Please refer to shown in Figure 5ly, Fig. 5 is the vertical view of the encapsulation structure of LED of another embodiment of the present invention.The led lamp 200a of the present embodiment is similar in appearance to Fig. 3 embodiment of the present invention, and roughly continue to use same reference numbers, but the difference characteristic of the present embodiment is: the profile of the encapsulation structure of LED 200a of the present embodiment is to be a scalloped profile, namely described substrate 210a crawl curved around shape chip bearing district and the arrangement of described a plurality of light-emitting diode chip for backlight unit 220 be to do the equidimension ratio along this scalloped profile to distribute.Therefore, the described encapsulation structure of LED 200a of the present embodiment can further bend to the lamp wall 10a of section of the present invention led lamp 100a shown in Figure 2.
Please refer to shown in Figure 6ly, Fig. 6 is the vertical view of the encapsulation structure of LED of another embodiment of the present invention.The led lamp 200b of the present embodiment is similar in appearance to Fig. 3 embodiment of the present invention, and roughly continue to use same reference numbers, but the difference characteristic of the present embodiment is: the described substrate 210b of described led lamp 200b has the chip bearing district in the large zone of single full wafer, except easy to make and reinforcement heat sinking function, in manufacturing process, also can not need to provide described board 300, but with the double purposes that supports described led lamp 200b as integrated carrying of described substrate 210b.In the present embodiment, be that upper surface at described a plurality of light-emitting diode chip for backlight unit 220 carries out owing to being electrically connected, therefore described substrate 210b also is fit to select other flexual nonmetallic materials, for example plastic plate except can selecting the good metal material of thermal diffusivity.
Please refer to shown in Figure 7ly, Fig. 7 is the side partial cross-sectional of the encapsulation structure of LED 200c of another embodiment of the present invention.The led lamp 200c of the present embodiment is similar in appearance to the encapsulation structure of LED 200 of Fig. 3 of the present invention, and roughly continue to use same reference numbers, but difference characteristic is: described led lamp 200c does not arrange phosphor powder layer at the upper surface of described light-emitting diode chip for backlight unit 220, when therefore if necessary described a plurality of light-emitting diode chip for backlight unit 220 being adjusted glow color, can change by the adding fluorescent material that in described transparent encapsulated layer 250c, directly mixes and realize.
Please refer to shown in Fig. 8 A and the 8B, Fig. 8 A is the vertical view of the encapsulation structure of LED 200d of another embodiment of the present invention; And Fig. 8 B is the side partial cross-sectional of the encapsulation structure of LED 200d of Fig. 8 A.The led lamp 200d of the present embodiment is similar in appearance to Fig. 3 embodiment of the present invention, and roughly continues to use same reference numbers, but difference characteristic is: the upper surface of described light-emitting diode chip for backlight unit 220 does not arrange phosphor powder layer.In addition, described a plurality of light-emitting diode chip for backlight unit 220d of described led lamp 200d are the vertical LED chip, and namely two electrodes of its P utmost point and the N utmost point are the up and down halves that vertically vertically are divided into chip.Described substrate 210d is made by metal material and comprises mutually disjunct a plurality of chip bearings district, and each described light-emitting diode chip for backlight unit 220d is separately positioned in the chip bearing district.
Moreover, the bottom-side electrodes of described a plurality of light-emitting diode chip for backlight unit 220d (not illustrating) for example by conductive adhesive layer (indicate) to be electrically connected the substrate 210d of described metal material, be electrically connected again electrode (not illustrating) and the described substrate 210d of adjacent described light-emitting diode chip for backlight unit 220d end face by described wire 230d.In the present embodiment, described led configurations 200d has the described substrate 210d of larger area metal material, therefore can strengthen heat sinking function.And, owing to adopting rectilinear described light-emitting diode chip for backlight unit 220d, also can further reduce the quantity of required described wire 230d, with the quality of simplified structure and raising electric connection.
The present invention is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present invention.Must be pointed out that, published embodiment does not limit the scope of the invention.Opposite, be contained in the spirit of claims and modification and impartial setting of scope and be included in the scope of the present invention.
Claims (10)
1. encapsulation structure of LED, it is characterized in that: described encapsulation structure of LED comprises:
One has flexible substrate, has at least one chip bearing district, and formation is crawled curved around shape;
A plurality of light-emitting diode chip for backlight unit are located in the chip bearing district of described substrate;
Many wires are electrically connected adjacent described a plurality of light-emitting diode chip for backlight unit; And
One has flexible transparent encapsulated layer, coats the chip bearing district of described substrate, described a plurality of light-emitting diode chip for backlight unit and described many wires.
2. encapsulation structure of LED as claimed in claim 1 is characterized in that: described encapsulation structure of LED structure has a scalloped profile, and the arrangement of described a plurality of light-emitting diode chip for backlight unit distributes along this scalloped profile.
3. encapsulation structure of LED as claimed in claim 1, it is characterized in that: described substrate is a flexible metal layer or a pliability non-metallic material bed of material.
4. led lamp is characterized in that: described led lamp comprises a lamp wall section that is hollow columnar, and described lamp wall section is that wherein said encapsulation structure of LED comprises by curling being formed by connecting of an encapsulation structure of LED:
One has flexible substrate, has at least one chip bearing district;
A plurality of light-emitting diode chip for backlight unit are located in the chip bearing district of described substrate;
Many wires are electrically connected adjacent described a plurality of light-emitting diode chip for backlight unit; And
One has flexible transparent encapsulated layer, coats the chip bearing district of described substrate, described a plurality of light-emitting diode chip for backlight unit and described many wires.
5. led lamp as claimed in claim 4, it is characterized in that: an end of described led lamp comprises a base in addition, and described lamp wall section is the circular cone column, and described lamp wall section connects the diameter of an end of described base greater than the diameter of its other end.
6. led lamp as claimed in claim 4 is characterized in that: described lamp wall section is provided with a plurality of air channels.
7. led lamp as claimed in claim 4 is characterized in that: described lamp wall section is provided with a plurality of air vent holes near described base ring-type.
8. led lamp as claimed in claim 4, it is characterized in that: described substrate is a flexible metal layer or a pliability non-metallic material bed of material.
9. led lamp as claimed in claim 4 is characterized in that: described substrate form crawl curved around shape.
10. led lamp as claimed in claim 4 is characterized in that: described substrate comprises mutually disjunct a plurality of described chip bearings district, and each described light-emitting diode chip for backlight unit is separately positioned in the described chip bearing district; And the described substrate of the bottom-side electrodes of described a plurality of light-emitting diode chip for backlight unit electric connection metal material, pass through again electrode and the described substrate that described wire is electrically connected adjacent described light-emitting diode chip for backlight unit end face.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100999149A CN103367347A (en) | 2012-04-06 | 2012-04-06 | Light emitting diode packaging construction and lamps |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012100999149A CN103367347A (en) | 2012-04-06 | 2012-04-06 | Light emitting diode packaging construction and lamps |
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| CN103367347A true CN103367347A (en) | 2013-10-23 |
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| US5806965A (en) * | 1996-01-30 | 1998-09-15 | R&M Deese, Inc. | LED beacon light |
| EP1046859A1 (en) * | 1999-04-19 | 2000-10-25 | OSHINO LAMPS GmbH | Lighting device |
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| CN102720976A (en) * | 2012-05-30 | 2012-10-10 | 深圳市日上光电有限公司 | LED soft light rope |
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Application publication date: 20131023 |