CN103252705A - Chemical mechanical polishing device - Google Patents
Chemical mechanical polishing device Download PDFInfo
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- CN103252705A CN103252705A CN201310180057XA CN201310180057A CN103252705A CN 103252705 A CN103252705 A CN 103252705A CN 201310180057X A CN201310180057X A CN 201310180057XA CN 201310180057 A CN201310180057 A CN 201310180057A CN 103252705 A CN103252705 A CN 103252705A
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Abstract
The invention discloses a chemical mechanical polishing device which comprises a wafer box loading device, a wafer transition device, a first mechanical arm, a chemical mechanical polishing machine, a wafer washing device, a wafer scrubbing device, a wafer drying device and a second mechanical arm, wherein the wafer box loading device is used for storing wafers, and the wafer transition device is used for accommodating the wafers. The wafer washing device comprises a first body, a first wafer supporting assembly and a wafer washing assembly, wherein the first body is provided with a first containing cavity, the first wafer supporting assembly is arranged in the first containing cavity, and the wafer washing assembly is arranged on the first body. The wafer scrubbing device comprises a second body, a wafer scrubbing assembly and a second wafer supporting assembly, wherein the second body is provided with a second containing cavity, and the wafer scrubbing assembly and the second wafer supporting assembly are arranged in the second containing cavity. The wafer drying device comprises a third body, a wafer drying assembly and a third wafer supporting assembly, wherein the third body is provided with a third containing cavity, and the wafer drying assembly and the third wafer supporting assembly are arranged in the third containing cavity. The chemical mechanical polishing device has the advantages of being good in washing effect and the like.
Description
Technical field
The present invention relates to a kind of chemical-mechanical polisher.
Background technology
There is the defective of cleaning performance difference in existing chemical-mechanical polisher.
Summary of the invention
The present invention one of is intended to solve the problems of the technologies described above at least to a certain extent or provides a kind of useful commerce to select at least.For this reason, one object of the present invention is to propose a kind of chemical-mechanical polisher.
To achieve these goals, according to embodiments of the invention a kind of chemical-mechanical polisher is proposed.Described chemical-mechanical polisher comprises be used to brilliant box-packed year device depositing wafer; Be used for placing the wafer transition apparatus of wafer; Be used for wafer is transported to first manipulator of described wafer transition apparatus from box-packed year device of described crystalline substance, described first manipulator is located between box-packed year device of described crystalline substance and the described wafer transition apparatus; Chemical-mechanical polishing mathing; Wafer cleaning device, described wafer cleaning device comprises first body with first container cavity, be located in described first container cavity first wafer support assembly of supporting wafer vertically and be located at wafer cleaning assembly on described first body, and the first side wall of described first container cavity is provided with first notch that connects the first side wall of described first container cavity along left and right directions; The wafer brushing device, described wafer brushing device comprises second body with second container cavity and is located at wafer in described second container cavity scrubs assembly and the second wafer support assembly of supporting wafer vertically, and the first side wall of described second container cavity is provided with second notch that connects the first side wall of described second container cavity along left and right directions; The drying wafer device, described drying wafer device comprises the 3rd body with the 3rd container cavity and is located at drying wafer assembly and the 3rd wafer support assembly of supporting wafer vertically in described the 3rd container cavity, the first side wall of described the 3rd container cavity is provided with the 3rd notch that connects the first side wall of described the 3rd container cavity along left and right directions, and second sidewall of described the 3rd container cavity is provided with the 4th notch that connects second sidewall of described the 3rd container cavity along left and right directions; And for second manipulator of carrying wafer between described wafer transition apparatus, described chemical-mechanical polishing mathing, described wafer cleaning device, described wafer brushing device and described drying wafer device, described second manipulator is located between described wafer transition apparatus, described chemical-mechanical polishing mathing, described wafer cleaning device, described wafer brushing device and the described drying wafer device.
Chemical-mechanical polisher according to the embodiment of the invention passes through at described wafer cleaning device, the interior setting of described wafer brushing device and described drying wafer device is the described first wafer support assembly of supporting wafer vertically, the described second wafer support assembly and described the 3rd wafer support assembly, thereby cleaning, make described wafer be in vertical duty when scrubbing with dry described wafer, the pollutant that washes and particle can (two surfaces of described wafer refer to two round sides of described wafer along two surfaces of described wafer, as follows) flow down vertically, and can not stay on two surfaces of described wafer, can improve the cleaning performance of described wafer thus widely, avoid cleaning the possibility of not thorough and secondary pollution.
And, according to the chemical-mechanical polisher of the embodiment of the invention by first notch that connects the first side wall of described first container cavity along left and right directions is set, connect second notch of the first side wall of described second container cavity along left and right directions, connect along left and right directions described the 3rd container cavity the first side wall the 3rd notch and connect the 4th notch of second sidewall of described the 3rd container cavity along left and right directions, thereby can be from described wafer cleaning device, the side of described wafer brushing device and described drying wafer device picks and places described wafer vertically, pollutant and particle in the wafer transfer mechanism (described first manipulator and described second manipulator and drive unit thereof) can not enter into described wafer cleaning device, the pollution to described wafer has been avoided in the inside of described wafer brushing device and described drying wafer device.Therefore, the chemical-mechanical polisher according to the embodiment of the invention has advantages such as cleaning performance is good.
In addition, chemical-mechanical polisher according to the above embodiment of the present invention can also have following additional technical characterictic:
According to one embodiment of present invention, each in the described first wafer support assembly and the described second wafer support assembly comprises: first driving wheel and second driving wheel; Motor, described motor are located on described first body and with described first driving wheel and link to each other with described second driving wheel for driving the rotation of described first driving wheel and described second driving wheel; Pinch roller, described pinch roller cooperate with described first driving wheel and described second driving wheel and support described wafer and described wafer is vertically directed; With the pinch roller actuator, described pinch roller actuator is located on described first body and links to each other to drive described pinch roller with described pinch roller and moves up and down.
Like this clean described wafer, described wafer can be vertically directed when scrubbing described wafer and dry described wafer, therefore clean and scrub the particle and the chemical agent that get off and can flow downward vertically along two surfaces of described wafer together along with cleaning fluid (for example deionized water) from described wafer, and can not stay on two surfaces of described wafer, thereby can improve the cleanliness factor of described wafer widely.
According to one embodiment of present invention, described drying wafer assembly comprises: water tank, described water tank can be located on described the 3rd body up or down, and the roof of described water tank is provided with the notch that connects described roof along the vertical direction and is used for passing through wafer; Water tank actuator, described water tank actuator are located on described the 3rd body and link to each other with described water tank and move up and down in order to drive described water tank; With the IPA drying system, described IPA drying system is located at and is used for dry described wafer on the described water tank.Described drying wafer assembly has advantages such as simple in structure, that drying effect is good.
According to one embodiment of present invention, described the 3rd wafer support assembly comprises: support, and described is erected on described the 3rd body; Following gripper jaw support, described gripper jaw support down is L shaped, the described vertical limb of gripper jaw support down links to each other with described support and the lower end of described vertical limb is stretched in the described water tank; Gripper jaw on the gripper jaw and second on first; Last gripper jaw actuator, described go up that the gripper jaw actuator is located at that in described support and the described gripper jaw support down one goes up and with described first on gripper jaw link to each other with gripper jaw on described second that gripper jaw moves up and down on the gripper jaw and described second in order to drive on described first; With following gripper jaw, described down gripper jaw is located on the horizontal limb of described gripper jaw support down, the cooperate described wafer of support and with described wafer orientation vertically of gripper jaw on the gripper jaw and second on the wherein said gripper jaw and described first down.
According to one embodiment of present invention, described wafer cleaning assembly comprises: the 1,000,000 shower nozzle and the 2,000,000 shower nozzle, described the 1,000,000 shower nozzle and described the 2,000,000 shower nozzle described wafer axially on turn up the soil at interval and be located in described first container cavity in order to be respectively applied to clean two surfaces of described wafer; With million shower nozzle actuators, described million shower nozzle actuators are located on described first body and link to each other with described the 2,000,000 shower nozzle with described the 1,000,000 shower nozzle in order to drive described the 1,000,000 shower nozzle and described the 2,000,000 shower nozzle along the radial translation of described wafer.
According to one embodiment of present invention, described wafer is scrubbed assembly and is comprised first hairbrush and second hairbrush, and described first hairbrush and described second hairbrush relatively and are at interval turned up the soil and arranged in order to be respectively applied to scrub two surfaces of described wafer.Described wafer is scrubbed assembly and is had advantages such as simple in structure, that washing effect is good thus.
According to one embodiment of present invention, described chemical-mechanical polisher also comprises frame, described wafer cleaning device, described wafer brushing device and described drying wafer device are located on the described frame, wherein said wafer brushing device is positioned at the downstream of described wafer cleaning device, and described drying wafer device is positioned at the downstream of described wafer brushing device.Thus can be more easily, firmly described wafer cleaning device, described wafer brushing device and described drying wafer device are installed.
According to one embodiment of present invention, described wafer brushing device is two, a described wafer brushing device is positioned at the downstream of described wafer cleaning device, the upstream side that another described wafer brushing device is positioned at the downstream of a described wafer brushing device and is positioned at described drying wafer device, described chemical-mechanical polishing mathing is a plurality of, and a plurality of described chemical-mechanical polishing mathings are arranged side by side.By two described wafer brushing devices are set, can successively carry out scrubbing for twice to described wafer, thereby can further improve the cleanliness factor of described wafer.
According to one embodiment of present invention, each in described first manipulator and described second manipulator is to comprise pedestal and be installed in arm on the described pedestal.
According to one embodiment of present invention, described pedestal arranges movably, and described arm is that two and each described arm are the joint arm.
Additional aspect of the present invention and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the vertical view according to the chemical-mechanical polisher of the embodiment of the invention;
Fig. 2 is the structural representation according to the chemical-mechanical polisher of the embodiment of the invention;
Fig. 3 is the structural representation according to the chemical-mechanical polisher of the embodiment of the invention;
Fig. 4 is the structural representation according to the chemical-mechanical polishing mathing of the chemical-mechanical polisher of the embodiment of the invention;
Fig. 5 is the partial structurtes schematic diagram according to the chemical-mechanical polisher of the embodiment of the invention;
Fig. 6 is the partial structurtes schematic diagram according to the chemical-mechanical polisher of the embodiment of the invention;
Fig. 7 is the partial structurtes schematic diagram according to the chemical-mechanical polisher of the embodiment of the invention;
Fig. 8 is the partial structurtes schematic diagram according to the chemical-mechanical polisher of the embodiment of the invention;
Fig. 9 is the partial structurtes schematic diagram according to the chemical-mechanical polisher of the embodiment of the invention;
Figure 10 is the structural representation according to the wafer cleaning device of the chemical-mechanical polisher of the embodiment of the invention;
Figure 11 is the structural representation according to the wafer brushing device of the chemical-mechanical polisher of the embodiment of the invention;
Figure 12 is the structural representation according to the drying wafer device of the chemical-mechanical polisher of the embodiment of the invention.
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, be intended to for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " " center "; " vertically "; " laterally "; " length "; " width "; " thickness ", " on ", D score, " preceding ", " back ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", close the orientation of indications such as " counterclockwise " or position is based on orientation shown in the drawings or position relation, only be that the present invention for convenience of description and simplification are described, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " first " only are used for describing purpose, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " first ".In description of the invention, the implication of " a plurality of " is two or more, unless clear and definite concrete restriction is arranged in addition.
In the present invention, unless clear and definite regulation and restriction are arranged in addition, broad understanding should be done in terms such as term " installation ", " linking to each other ", " connection ", " fixing ", for example, can be fixedly connected, also can be to removably connect, or connect integratedly; Can be mechanical connection, also can be to be electrically connected; Can be directly to link to each other, also can link to each other indirectly by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can understand above-mentioned term concrete implication in the present invention as the case may be.
In the present invention, unless clear and definite regulation and restriction are arranged in addition, first feature first feature it " on " or D score can comprise that first directly contacts with first feature, can comprise that also first and first feature is not directly contact but by the contact of the additional features between them.And, first feature first feature " on ", " top " and " above " comprise first feature directly over first feature and oblique upper, or only represent that the first characteristic level height is higher than first feature.First feature first feature " under ", " below " and " below " comprise first feature under first feature and tiltedly, or only represent that the first characteristic level height is less than first feature.
Below with reference to the chemical-mechanical polisher 10 of Fig. 1-Figure 12 description according to the embodiment of the invention.As Fig. 1-shown in Figure 12, comprise be used to brilliant box-packed year device 900 depositing wafer 800 according to the chemical-mechanical polisher 10 of the embodiment of the invention, be used for placing the wafer transition apparatus 600 of wafer 800, be used for wafer 800 is transported to from box-packed year device 900 of crystalline substance first manipulator 710 of wafer transition apparatus 600, chemical-mechanical polishing mathing 100, wafer cleaning device 200, wafer brushing device 300, drying wafer device 400 and being used at wafer transition apparatus 600, chemical-mechanical polishing mathing 100, wafer cleaning device 200, second manipulator 720 of carrying wafer 800 between wafer brushing device 300 and the drying wafer device 400.
Below with reference to Fig. 1-Figure 12 the method that utilization is carried out chemically mechanical polishing according to 10 pairs of wafers of chemical-mechanical polisher 800 of the embodiment of the invention is described.
At first, utilize first manipulator 710 to take out unpolished wafer 800 device 900 in box-packed year from crystalline substance, and wafer 800 is put on the wafer transition apparatus 600.Second manipulator 720 is taken wafer 800 and be put into away on the chemical-mechanical polishing mathing 100 from wafer transition apparatus 600, and 100 pairs of wafers of chemical-mechanical polishing mathing 800 carry out chemically mechanical polishing.After treating that wafer 800 polishings finish, second manipulator 720 is taken wafer 800 away and by first notch 212 wafer 800 is put in the wafer cleaning device 200 in order to the wafer 800 after the polishing is cleaned.After treating that wafer 800 cleanings finish, second manipulator 720 is put in the wafer brushing device 300 wafer 800 in order to wafer 800 is scrubbed by second notch 312.Treat wafer 800 scrub finish after, second manipulator 720 is put in the drying wafer device 400 wafer 800 in order to wafer 800 is carried out drying by the 3rd notch 412.After treating that wafer 800 dryings finish, first manipulator 710 takes out wafer 800 by the 4th notch 413 and wafer 800 is put in brilliant box-packed year device 900 from drying wafer device 400, and finished polishing to this wafer 800 this moment.
Chemical-mechanical polisher 10 according to the embodiment of the invention passes through at wafer cleaning device 200, wafer brushing device 300 and the 400 interior settings of drying wafer device are the described first wafer support assembly of supporting wafer vertically, the described second wafer support assembly and described the 3rd wafer support assembly, thereby cleaning, make wafer 800 be in vertical duty when scrubbing with dry wafer 800, the pollutant that washes and particle can (two surfaces of wafer 800 refer to two round sides of wafer 800 along two surfaces of wafer 800, as follows) flow down vertically, and can not stay on two surfaces of wafer 800, can improve the cleaning performance of wafer 800 thus widely, avoid cleaning the possibility of not thorough and secondary pollution.
And, according to the chemical-mechanical polisher 10 of the embodiment of the invention by first notch 212 that connects the first side wall of first container cavity 211 along left and right directions is set, connect second notch 312 of the first side wall of second container cavity 311 along left and right directions, connect along left and right directions the 3rd container cavity 411 the first side wall the 3rd notch 412 and connect the 4th notch 413 of second sidewall of the 3rd container cavity 411 along left and right directions, thereby can be from wafer cleaning device 200, the side of wafer brushing device 300 and drying wafer device 400 picks and places wafer 800 vertically, pollutant and particle in the wafer transfer mechanism (first manipulator 710 and second manipulator 720 and the drive unit thereof) can not enter into wafer cleaning device 200, the pollution to wafer 800 has been avoided in the inside of wafer brushing device 300 and drying wafer device 400.
Therefore, the chemical-mechanical polisher 10 according to the embodiment of the invention has advantages such as cleaning performance is good.
Particularly, the first side wall of the 3rd container cavity 411 can be relative with second sidewall of the 3rd container cavity 411.
As shown in Figure 10 and Figure 11, in some embodiments of the invention, each in the described first wafer support assembly and the described second wafer support assembly can comprise that first driving wheel 221, the second driving wheel 222(, first driving wheel 221 and second driving wheel 222 can drive the rotation of described wafer), motor (not shown), pinch roller (not shown) and pinch roller actuator 250.Motor 230 can be located on first body 210 and motor 230 can link to each other with second driving wheel 222 with first driving wheel 221 is used for driving first driving wheel 221 and 222 rotations of second driving wheel.Pinch roller 240 can cooperate with first driving wheel 221 and second driving wheel 222 and support described wafer and described wafer is vertically directed.Pinch roller actuator 250 can be located on first body 210, and pinch roller actuator 250 can link to each other with pinch roller 240 and moves up and down to drive pinch roller 240.Can wafer 800 is vertically directed.Like this at cleaning wafer 800, wafer 800 is can be vertically directed when scrubbing wafer 800 and dry wafer 800, therefore clean and scrub the particle and the chemical agent that get off and can flow downward vertically along two surfaces of wafer 800 together along with cleaning fluid (for example deionized water) from wafer 800, and can not stay on two surfaces of wafer 800, thereby can improve the cleanliness factor of wafer 800 widely.
As shown in figure 10, in one embodiment of the invention, described wafer cleaning assembly can comprise the 1,000,000 shower nozzle 260, the 2,000,000 shower nozzle 270 and million shower nozzle actuators 280.The 1,000,000 shower nozzle 260 and the 2,000,000 shower nozzle 270 can wafer 800 axially on turn up the soil at interval and be located in first container cavity 211 in order to can be respectively applied to two surfaces of cleaning wafer 800.Million shower nozzle actuator 280 can be located on first body 210, and million shower nozzle actuators 280 can link to each other with the 2,000,000 shower nozzle 270 with the 1,000,000 shower nozzle 260 in order to can drive the 1,000,000 shower nozzle 260 and the 2,000,000 shower nozzle 270 along the radial translation of wafer 800.
When wafer 800 is cleaned, can utilize first driving wheel 221 and second driving wheel 222 to drive wafer 800 rotations.Simultaneously, million shower nozzle actuators 280 can drive the 1,000,000 shower nozzle 260 and the 2,000,000 shower nozzle 270 and cleaning fluid (for example deionized water) can be sprayed onto on two surfaces of wafer 800 along the radial translation of wafer 800 and the 1,000,000 shower nozzle 260 and the 2,000,000 shower nozzle 270.
And when cleaning wafer 800, because what wafer 800 can rotate and the 1,000,000 shower nozzle 260 and the 2,000,000 shower nozzle 270 can be along wafers 800 radially does rectilinear motion, therefore by synthetic these two kinds of motions, can clean the surface of whole wafer 800 rapidly.Therefore, according to the described wafer cleaning assembly of the wafer cleaning equipment 10 of the embodiment of the invention can be all sidedly, cleaning wafer 800 rapidly, and the particle on the wafer 800 and chemical agent all can be washed, thereby reach better cleaning performance.
(not shown second notch 312 of Figure 11) as shown in figure 11, in a specific embodiment of the present invention, described wafer is scrubbed assembly can comprise that first hairbrush 331 and second hairbrush, 332, the first hairbrush 331 and second hairbrush 332 can be relatively and turn up the soil at interval and arrange in order to be respectively applied to scrub two surfaces of wafer 800.Described wafer is scrubbed assembly and is had advantages such as simple in structure, that washing effect is good.
When wafer 800 is scrubbed, can utilize first driving wheel 221 and second driving wheel 222 to drive wafer 800 rotations.Simultaneously, first hairbrush 331 and second hairbrush 332 can be along its axial direction rotation in order to scrub two surfaces of wafer 800.
In examples more of the present invention, (not shown the 3rd notch 412 of Figure 12 and the 4th notch 413) as shown in figure 12, described drying wafer assembly can comprise water tank 30, water tank actuator 40 and IPA drying system 50.Water tank 30 can be located on the 3rd body 410 up or down, and the roof 32 of water tank 30 is provided with the notch 31 that connects roof 32 along the vertical direction and is used for by wafer 800.Water tank actuator 40 is located on the 3rd body 410, and water tank actuator 40 links to each other with water tank 30 and moves up and down in order to drive water tank 30.IPA drying system 50 is located at and is used for dry wafer 800 on the water tank 30.Described drying wafer assembly has advantages such as simple in structure, that drying effect is good.
As shown in figure 12, in some embodiments of the invention, described the 3rd wafer support assembly can comprise support 21, down gripper jaw 24 on the gripper jaw 23, second on the gripper jaw support 22, first, go up gripper jaw actuator 25 and following gripper jaw 26.
As shown in Figure 1-Figure 3, in an example of the present invention, chemical-mechanical polisher 10 can also comprise frame 201, and wafer cleaning device 200, wafer brushing device 300 and drying wafer device 400 can be located on the frame 201.Wherein, wafer brushing device 300 can be positioned at the downstream of wafer cleaning device 200, and drying wafer device 400 can be positioned at the downstream of wafer brushing device 300.Thus can be more easily, firmly wafer cleaning device 200, wafer brushing device 300 and drying wafer device 400 are installed.
As shown in Figure 1-Figure 3, advantageously, wafer brushing device 300 can be two, a wafer brushing device 300 can be positioned at the downstream of wafer cleaning device 200, another wafer brushing device 300 can be positioned at the downstream of a wafer brushing device 300, and another wafer brushing device 300 can be positioned at the upstream side of drying wafer device 400.By two wafer brushing devices 300 are set, can successively carry out scrubbing for twice to wafer 800, thereby can further improve the cleanliness factor of wafer 800.
As shown in Figure 4, in some embodiments of the invention, chemical-mechanical polishing mathing 100 can comprise workbench 110, polishing disk 120, trimmer 130, polishing fluid conveyer 140, rubbing head support, loading/unloading platform 160 and rubbing head 170.Particularly, polishing disk 120 can be installed on the upper surface of workbench 110, and trimmer 130 and polishing fluid conveyer 140 can be installed on the upper surface of workbench 110 respectively and contiguous polishing disk 120.Described rubbing head support can be installed on the upper surface of workbench 110, and loading/unloading platform 160 can be installed on the upper surface of workbench 110.Rubbing head 170 can be rotatable and can be installed in movably on the described rubbing head support between polishing disk 120 and the loading/unloading platform 160.
Particularly, described rubbing head support can comprise horizontal base plate 151 and support side plate 152, horizontal base plate 151 can be formed with the groove 153 that connects at its thickness direction, and groove 153 can open wide at vertical end of horizontal base plate 151 and can extend towards the vertical other end of level.In other words, an end of groove 153 can open wide and the other end can seal.Support side plate 152 can link to each other with horizontal base plate 151 respectively and the both lateral sides that can lay respectively at groove 153 is used for support level substrate 151, wherein described vertical end of horizontal base plate 151 can extend beyond support side plate 152 in the vertical to constitute cantilever end, and described cantilever end can reach the top of polishing disk 120.
In a concrete example of the present invention, as shown in Figure 4, the upper end of support side plate 152 can link to each other with the bottom surface of horizontal base plate 151 respectively.Two horizontal base plates 151 can lay respectively at the both sides of groove 153 in the horizontal, and the left end of horizontal base plate 151 can extend longitudinally the left side that exceeds support side plate 152, thereby the left end of horizontal base plate 151 can constitute described cantilever end.The right-hand member of horizontal base plate 151 can extend support side plate 152, also can be concordant with them.Described rubbing head support is similar to the form of diving tower, therefore also can be called diving tower formula rubbing head support.The basal surface of support side plate 152 can be positioned on the same horizontal plane, when support side plate 152 is installed on the workbench 110 of chemical-mechanical polishing mathing 100, can guarantee horizontal base plate 151 levels thus.Particularly, horizontal base plate 151 can be U-shaped, and the blind end of groove 153 is arc.
As shown in Figure 4, in one embodiment of the invention, workbench 110 can be the general rectangular framework.Described rubbing head support can be installed on the workbench 110, and the described cantilever end of the horizontal base plate 151 of described rubbing head support can extend to polishing disk 120 above.Loading/unloading platform 160 can be installed on the upper surface of workbench 110 and can be below the described rubbing head support, between two support side plate 152.For example, the center of polishing disk 120 and loading/unloading platform 160 can be positioned on the longitudinal centre line of the groove 153 on the horizontal base plate 151.
In an example of the present invention, as shown in Figure 4, on the upper surface of horizontal base plate 151, can be provided with two parallel guide rails 154 in the both lateral sides of groove 153, rubbing head 170 can be supported on the guide rail 154 by bolster 155.Particularly, can be provided with slide block below bolster 155, described slide block can be supported on the guide rail 154 movably.Can be provided with drive motors 156 on bolster 155, the output shaft of drive motors 156 can link to each other by the rubbing head 170 of decelerator with bolster 155 belows, in order to drive rubbing head 170 rotations.Bolster 155 can be driven longitudinally by servomotor 157 and move and swing at guide rail 154, thereby makes rubbing head 170 can move to polishing disk 120 tops and loading/unloading platform 160 tops respectively.
Chemical-mechanical polishing mathing 100 can be for a plurality of, and a plurality of chemical-mechanical polishing mathings 100 can be arranged side by side.Can carry out chemically mechanical polishing to wafer 800 better thus.
As shown in Figure 1-Figure 3, each in first manipulator 710 and second manipulator 720 can comprise pedestal 711 and the arm 712 that is installed on the pedestal 711.Advantageously, pedestal 711 can arrange movably, and arm 712 can be to be the joint arm for two and each arm 712.
In the description of this specification, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, those of ordinary skill in the art can change above-described embodiment under the situation that does not break away from principle of the present invention and aim within the scope of the invention, modification, replacement and modification.
Claims (10)
1. a chemical-mechanical polisher is characterized in that, comprising:
Be used for depositing brilliant box-packed year device of wafer;
Be used for placing the wafer transition apparatus of wafer;
Be used for wafer is transported to first manipulator of described wafer transition apparatus from box-packed year device of described crystalline substance, described first manipulator is located between box-packed year device of described crystalline substance and the described wafer transition apparatus;
Chemical-mechanical polishing mathing;
Wafer cleaning device, described wafer cleaning device comprises first body with first container cavity, be located in described first container cavity first wafer support assembly of supporting wafer vertically and be located at wafer cleaning assembly on described first body, and the first side wall of described first container cavity is provided with first notch that connects the first side wall of described first container cavity along left and right directions;
The wafer brushing device, described wafer brushing device comprises second body with second container cavity and is located at wafer in described second container cavity scrubs assembly and the second wafer support assembly of supporting wafer vertically, and the first side wall of described second container cavity is provided with second notch that connects the first side wall of described second container cavity along left and right directions;
The drying wafer device, described drying wafer device comprises the 3rd body with the 3rd container cavity and is located at drying wafer assembly and the 3rd wafer support assembly of supporting wafer vertically in described the 3rd container cavity, the first side wall of described the 3rd container cavity is provided with the 3rd notch that connects the first side wall of described the 3rd container cavity along left and right directions, and second sidewall of described the 3rd container cavity is provided with the 4th notch that connects second sidewall of described the 3rd container cavity along left and right directions; With
Be used for second manipulator of carrying wafer between described wafer transition apparatus, described chemical-mechanical polishing mathing, described wafer cleaning device, described wafer brushing device and described drying wafer device, described second manipulator is located between described wafer transition apparatus, described chemical-mechanical polishing mathing, described wafer cleaning device, described wafer brushing device and the described drying wafer device.
2. chemical-mechanical polisher according to claim 1 is characterized in that, each in the described first wafer support assembly and the described second wafer support assembly comprises:
First driving wheel and second driving wheel;
Motor, described motor are located on described first body and with described first driving wheel and link to each other with described second driving wheel for driving the rotation of described first driving wheel and described second driving wheel;
Pinch roller, described pinch roller cooperate with described first driving wheel and described second driving wheel and support described wafer and described wafer is vertically directed; With
Pinch roller actuator, described pinch roller actuator are located on described first body and link to each other to drive described pinch roller with described pinch roller and move up and down.
3. chemical-mechanical polisher according to claim 1 is characterized in that, described drying wafer assembly comprises:
Water tank, described water tank can be located on described the 3rd body up or down, and the roof of described water tank is provided with the notch that connects described roof along the vertical direction and is used for passing through wafer;
Water tank actuator, described water tank actuator are located on described the 3rd body and link to each other with described water tank and move up and down in order to drive described water tank; With
IPA drying system, described IPA drying system are located at and are used for dry described wafer on the described water tank.
4. chemical-mechanical polisher according to claim 1 is characterized in that, described the 3rd wafer support assembly comprises:
Support, described is erected on described the 3rd body;
Following gripper jaw support, described gripper jaw support down is L shaped, the described vertical limb of gripper jaw support down links to each other with described support and the lower end of described vertical limb is stretched in the described water tank;
Gripper jaw on the gripper jaw and second on first;
Last gripper jaw actuator, described go up that the gripper jaw actuator is located at that in described support and the described gripper jaw support down one goes up and with described first on gripper jaw link to each other with gripper jaw on described second that gripper jaw moves up and down on the gripper jaw and described second in order to drive on described first; With
Following gripper jaw, described down gripper jaw are located on the horizontal limb of described gripper jaw support down, the cooperate described wafer of support and with described wafer orientation vertically of gripper jaw on the gripper jaw and second on the wherein said gripper jaw and described first down.
5. chemical-mechanical polisher according to claim 1 is characterized in that, described wafer cleaning assembly comprises:
The 1,000,000 shower nozzle and the 2,000,000 shower nozzle, described the 1,000,000 shower nozzle and described the 2,000,000 shower nozzle described wafer axially on turn up the soil at interval and be located in described first container cavity in order to be respectively applied to clean two surfaces of described wafer; With
Million shower nozzle actuators, described million shower nozzle actuators are located on described first body and link to each other with described the 2,000,000 shower nozzle with described the 1,000,000 shower nozzle in order to drive described the 1,000,000 shower nozzle and described the 2,000,000 shower nozzle along the radial translation of described wafer.
6. chemical-mechanical polisher according to claim 1, it is characterized in that, described wafer is scrubbed assembly and is comprised first hairbrush and second hairbrush, and described first hairbrush and described second hairbrush relatively and are at interval turned up the soil and arranged in order to be respectively applied to scrub two surfaces of described wafer.
7. according to each described chemical-mechanical polisher among the claim 1-5, it is characterized in that, also comprise frame, described wafer cleaning device, described wafer brushing device and described drying wafer device are located on the described frame, wherein said wafer brushing device is positioned at the downstream of described wafer cleaning device, and described drying wafer device is positioned at the downstream of described wafer brushing device.
8. chemical-mechanical polisher according to claim 7, it is characterized in that, described wafer brushing device is two, a described wafer brushing device is positioned at the downstream of described wafer cleaning device, the upstream side that another described wafer brushing device is positioned at the downstream of a described wafer brushing device and is positioned at described drying wafer device, described chemical-mechanical polishing mathing is a plurality of, and a plurality of described chemical-mechanical polishing mathings are arranged side by side.
9. chemical-mechanical polisher according to claim 1 is characterized in that, each in described first manipulator and described second manipulator is to comprise pedestal and the arm that is installed on the described pedestal.
10. chemical-mechanical polisher according to claim 9 is characterized in that, described pedestal arranges movably, and described arm is that two and each described arm are the joint arm.
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| CN201310180057XA CN103252705A (en) | 2013-05-15 | 2013-05-15 | Chemical mechanical polishing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310180057XA CN103252705A (en) | 2013-05-15 | 2013-05-15 | Chemical mechanical polishing device |
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| CN103252705A true CN103252705A (en) | 2013-08-21 |
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| CN110026886A (en) * | 2019-01-23 | 2019-07-19 | 杭州众硅电子科技有限公司 | Polishing wafer exchange system and method |
| CN110039441A (en) * | 2019-01-14 | 2019-07-23 | 杭州众硅电子科技有限公司 | A kind of based CMP apparatus |
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Application publication date: 20130821 |