CN103092295A - Heating method and device for electronic components, and electronic device - Google Patents
Heating method and device for electronic components, and electronic device Download PDFInfo
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- CN103092295A CN103092295A CN2011103399471A CN201110339947A CN103092295A CN 103092295 A CN103092295 A CN 103092295A CN 2011103399471 A CN2011103399471 A CN 2011103399471A CN 201110339947 A CN201110339947 A CN 201110339947A CN 103092295 A CN103092295 A CN 103092295A
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Abstract
The invention provides heating method and device for electronic components, and an electronic device. A heater is fitted to an electronic component. The heating method includes the steps of, driving the heater by electricity of a power module according to duty ratio; if output voltage of the power module is larger than a first threshold, setting the duty ratio as a first ratio; if the output voltage of the power module is smaller than a second threshold, setting the duty ratio as a second ratio; if the output voltage of the power module is between the first threshold and the second threshold, regulating the duty ratio to allow a difference between the output voltage of the power module and the second threshold to be proportional to the duty ratio; thereby acquiring a duty ratio according to the output voltage of the power module, heating the electronic component to normal operating temperature according to the duty ratio with no harm to the power module, such as a battery.
Description
[technical field]
The invention relates to a kind of electronic installation, and particularly relevant for heating means and the heating arrangement of electronic component under a kind of low temperature environment.
[background technology]
General running gear, notebook computer for example, its normal range of operation is positioned at 0 degree Celsius to the normal temperature of 45 degree Celsius.Within this temperature range, the battery of running gear normally output voltage to running gear, and the electronic component of running gear inside, hard disk for example also can directly running under the normal temperature of this temperature range.
Yet when running gear was applied under rugged environment, for example in the low temperature environments of-30 degree Celsius, the action that the element of running gear inside need to be heated can make the running gear normal operation.At this moment, if on hand without external power supply, must allow by the electric power of battery the electronic component of action device inside heat up.Just, the usefulness of battery also can't effectively provide under low temperature, if rashly directly with battery, running gear is heated, may the battery of low temperature be caused damage.Therefore, under the weather of above-mentioned low temperature, in to the running gear heating, must consider again the infringement of low temperature battery, be a kind of awkward situation.
[summary of the invention]
The invention provides a kind of heating means of electronic component, by the method, can under the situation of not damaging power module, efficiently electronic component be heated.
The invention provides the heating arrangement of electronic component in a kind of low temperature environment, this heating arrangement can under the situation of not damaging power module, heat electronic component efficiently.
The invention provides a kind of electronic installation, it can heat by the electronic component to its inside under low temperature environment, and does not damage power module.
The present invention proposes a kind of heating means of electronic component, and wherein primary heater is configured in electronic component, and heating means comprise the following steps.Drive than (duty ratio) electric energy that primary heater uses power module according to work.If the output voltage of power module greater than the first critical value, will be worked than being set as the first ratio.If the output voltage of power module less than the second critical value, will be worked than being set as the second ratio, wherein the second critical value is less than the first critical value and greater than zero, the second ratio is less than the first ratio.If the output voltage of power module between the first critical value and the second critical value, is adjusted the work ratio, the output voltage that makes power module is poor with the second critical value, and works than proportional.
In one embodiment of this invention, the first above-mentioned ratio is that 100%, the second ratio is 0%.
In one embodiment of this invention, in the step of above-mentioned adjustment work ratio, work is than between the first ratio and the second ratio.
In one embodiment of this invention, the step of above-mentioned adjustment work ratio comprises the following steps.To work than being set as (DH-DL) * [(V-VL)/(VH-VL)], wherein DH is less than or equal to 1 positive number, and DL is the positive number less than DH, and V is the output voltage of power module, and VH is the first critical value, and VL is the second critical value.
In one embodiment of this invention, the first above-mentioned ratio and DH are that 75%, the second ratio is that 0%, DL is that 10%, the first critical value is that 8.1, the second critical values are 7.1.
In one embodiment of this invention, in above-mentioned low temperature environment, the heating means of electronic component, more comprise the following steps.The configuration secondary heater is in the second electronic component, and according to the work ratio, the electric energy of use power module drives secondary heater.Wherein do not overlap during the activation of primary heater with during the activation of secondary heater.
In one embodiment of this invention, the duration of work of above-mentioned work ratio is all given primary heater and secondary heater.
In one embodiment of this invention, when the temperature of the first above-mentioned electronic component reaches a normal running temperature, the duration of work of work ratio is all distributed to secondary heater.
In one embodiment of this invention, in above-mentioned low temperature environment, the heating means of electronic component, more comprise the following steps.The configuration secondary heater is in the second electronic component, and according to the work ratio, the electric energy of use power module drives secondary heater.During wherein being overlapped in the activation of secondary heater during the activation of primary heater, and during the activation of primary heater with the activation of secondary heater during temporal summation be not more than work period of work ratio.
In one embodiment of this invention, in above-mentioned low temperature environment, the heating means of electronic component, more comprise the following steps.The first step, the temperature of detecting the first electronic component.Second step when the temperature of the first electronic component reaches normal running temperature, stops driving primary heater.In the 3rd step, when the temperature of the first electronic component reaches normal running temperature, start the first electronic component.
In one embodiment of this invention, the first above-mentioned electronic component is Winchester disk drive.
In one embodiment of this invention, above-mentioned power module is battery module or exchanges breakout box.
The invention provides the heating arrangement of electronic component in a kind of low temperature environment, comprise primary heater, power module and controller.Primary heater is disposed at the first electronic component, and power module provides primary heater required electric energy, and controller is coupled to primary heater and power module.Its middle controller uses electric energy heating first electronic component of power module than the control primary heater according to a job, if the output voltage of power module is greater than the first critical value, controller setting work ratio is the first ratio, if the output voltage of power module is less than the second critical value, controller setting work ratio is the second ratio.The second critical value is less than the first critical value and greater than zero, the second ratio is less than the first ratio, if and the output voltage of this power module is between this first critical value and this second critical value, this controller is adjusted this work ratio, make the poor of the output voltage of this power module and this second critical value, with this work than proportional.
In one embodiment of this invention, the heating arrangement of electronic component in above-mentioned low temperature environment is wherein worked as the output voltage of power module between the first critical value and the second critical value, and controller adjustment work is than between the first ratio and the second ratio.
In one embodiment of this invention, above-mentioned controller will be worked than being set as (DH-DL) * [(V-VL)/(VH-VL)], wherein DH is less than or equal to 1 positive number, DL is the positive number less than DH, V is the output voltage of power module, VH is the first critical value, and VL is the second critical value.
In one embodiment of this invention, the heating arrangement of electronic component in above-mentioned low temperature environment more comprises temperature sensor, and it is disposed at the first electronic component to detect the temperature of the first electronic component, and temperature sensor is coupled to controller.Wherein when the temperature of the first electronic component reached normal running temperature, controller was controlled the primary heater stopped heating.
The invention provides a kind of electronic installation and comprise the first electronic component, primary heater, power module and controller.Primary heater is disposed at the first electronic component, power module provides electronic installation and the required electric energy of primary heater, controller is coupled to primary heater and power module, and controller uses the electric energy of power module to heat the first electronic component according to work than controlling primary heater.If wherein the output voltage of power module is greater than the first critical value, controller setting work ratio is the first ratio.If the output voltage of power module is less than the second critical value, controller setting work ratio is the second ratio.The second critical value is less than the first critical value and greater than zero, the second ratio is less than the first ratio, if and the output voltage of power module is between the first critical value and the second critical value, controller adjustment work ratio, make the poor of the output voltage of power module and the second critical value, with work than proportional.
In one embodiment of this invention, above-mentioned electronic installation is wherein worked as the output voltage of power module between the first critical value and the second critical value, and controller adjustment work is than between the first ratio and the second ratio.
In one embodiment of this invention, above-mentioned controller will be worked than being set as (DH-DL) * [(V-VL)/(VH-VL)], wherein DH is less than or equal to 1 positive number, DL is the positive number less than DH, V is the output voltage of power module, VH is the first critical value, and VL is the second critical value.
In one embodiment of this invention, above-mentioned electronic installation more comprises temperature sensor.Temperature sensor is disposed at the first electronic component to detect the temperature of the first electronic component, and temperature sensor is coupled to controller.Wherein when the temperature of the first electronic component reached normal running temperature, controller was controlled the primary heater stopped heating.
Compared to prior art, the invention provides the heating means of electronic component in a kind of low temperature environment, its output voltage according to power module obtains a work ratio, and according to this work ratio, electronic component is heated, can make electronic component be heated to normal running temperature simultaneously, also do not damage power module, for example damage battery.The invention provides the heating arrangement of electronic component in a kind of low temperature environment, it utilizes the heating means of above-mentioned electronic component, and electronic component is heated.The present invention also provides a kind of electronic installation, and it comprises above-mentioned heating arrangement, is suitable for being applied under low temperature environment.
[description of drawings]
Fig. 1 illustrates the process flow diagram of the heating means of electronic component in the low temperature environment of one embodiment of the invention.
Fig. 2 illustrates the schematic diagram of the heating arrangement of electronic component in the low temperature environment of one embodiment of the invention.
Fig. 3 illustrates the oscillogram of duration of work (duty cycle) of the work ratio of one embodiment of the invention.
Fig. 4 illustrate one embodiment of the invention power module output voltage with work ratio graph of a relation.
Fig. 5 illustrates the process flow diagram that has the heating means of two electronic components in the low temperature environment of one embodiment of the invention.
Fig. 6 illustrates the oscillogram during the activation of the primary heater of one embodiment of the invention and secondary heater.
Fig. 7 illustrates the process flow diagram that has the heating means of two electronic components in the low temperature environment of one embodiment of the invention.
Fig. 8 illustrates another oscillogram during the activation of the primary heater of one embodiment of the invention and secondary heater.
Fig. 9 illustrates the Heating Electron element of one embodiment of the invention to the process flow diagram of operating temperature method.
Figure 10 illustrates two electronic components of heating of one embodiment of the invention to the process flow diagram of operating temperature method.
Figure 11 illustrates the process flow diagram of the electronic installation heating means of one embodiment of the invention.
[embodiment]
Fig. 1 illustrates the process flow diagram of the heating means of electronic component in the low temperature environment of one embodiment of the invention.Fig. 2 is illustrated in the function block schematic diagram of a kind of electronic installation in low temperature environment according to one embodiment of the invention.This electronic installation comprises heating arrangement 500 and electronic component 550.In low temperature environment, heating arrangement 500 can heat electronic component 550 in start process in advance.After the temperature of electronic component 550 was promoted to admissible temperature, this electronic installation was completed in-cycle work smoothly.
Under the low temperature situation, wish is to electronic installation shown in Figure 2 start and operation, and the temperature of the electronic component 550 of electronic installation inside must be heated to normal running temperature in advance, and the user can this electronic installation of normal running.For example, during to notebook computer start and operation, the temperature of notebook computer internal hard drive machine must be heated to 0 degree Celsius in advance under-30 degree environment Celsius, and the user can this notebook computer of normal running.
In the present embodiment, heating arrangement 500 comprises controller 510 (for example being embedded controller), power module 520 and well heater 530.Well heater 530 is disposed at electronic component 550 (for example Winchester disk drive).Controller 510 is coupled to well heater 530 and power module 520.The built-in power module 520 (for example battery module or interchange breakout box) of electronic installation provides well heater 530 required electric energy.Controller 510 decision/adjustment work are than (duty ratio), and according to this work than the well heater 530 of drive arrangements in electronic component 550, use the electric energy of power modules 520 to electronic component 550 heating of electronic installation inside with control heater 530.When power module 520 was battery module, the output voltage of battery module when low temperature must limit to some extent.For instance; under the low temperature situation; the usefulness of battery module output voltage is lower; if this moment, well heater 530 used whole output electric energy of battery module to electronic component 550 heating in large quantities; may cause damage to battery module; also or battery module in the low temperature over-discharge can, and cause battery module self-protection and power supply can't be provided.For example, if in the environment of-40 degree Celsius, if well heater 530 may cause damage to battery module constantly with the electric energy Heating Electron element 550 of 100% work than the use battery module.
Please refer to Fig. 1 and Fig. 2, controller 510 can be by the control chip of bus access power module 520, with temperature and the output voltage values of knowing power module 520.For example, controller 510 can pass through temperature and the output voltage values of System Management Bus (SM-Bus, System Management Bus) detecting power module 520.Controller 510 can dynamically determine the work ratio according to the output voltage of power module 520, and according to work than controlling/drive well heater 530 (step S110).Well heater 530 heats electronic component 550 than the electric energy that uses power module 520 to provide according to this work.Owing to suffering damage for protection power source module 520 is unlikely, work is than there being according to the output voltage of power module 520 interdependent relation, so need the following step dynamically to adjust the work ratio.
Above-mentioned step S120 to step S150 be at the output voltage that judges power module 520 whether in pre-set interval.If the output voltage of power module 520 on pre-set interval, is worked than being fixed to the first ratio.If the output voltage of power module 520 under pre-set interval, is worked than being fixed to the second ratio.If the output voltage of power module 520 is in pre-set interval, controller 510 carries out step S160.For example, if the output voltage of power module 520 is between the first critical value and the second critical value, controller 510 is dynamically adjusted the work ratio according to the output voltage of power module 520, make the poor of the output voltage of power module 520 and the second critical value, with work than proportional (step S160).That is to say, if the output voltage of power module 520 drops between two critical values, utilize the output voltage of power module 520 to deduct the value of the second critical value, converse the work ratio.And, after obtaining new work ratio, utilize new work ratio to return step S110, utilize new work than driving well heater 530.
For instance, in step S160, controller 510 can be adjusted the work ratio, makes described work than between the first ratio and the second ratio.For example, will work than being set as (DH-DL) * [(V-VL)/(VH-VL)], wherein DH is the positive number less than 1, and DL is the positive number less than DH, and V is the output voltage of power module 520, and VH is the first critical value, and VL is the second critical value.
For instance, suppose that power module 520 is 8.1 volts in the output voltage of normal running temperature, therefore the first critical value VH in step S120 can be made as 8.1 volts (step S120).In another hypothesis power module 520, the low pressure self-protection point of battery controller is set as 6.6 volts.Mean, during lower than 6.6 volts, may cause the infringement of power module 520 internal cells when the output voltage of power module 520.Therefore, the second critical value VL in step S120 can be set to greater than 6.6 volts and less than any value of the first critical value VH (8.1 volts).For example, can be conservatively the second critical value VL of step S140 be set as 7.1 volts.Further, export than mode with 100% work in order not make power module 520, and cause electric quantity consumption too fast, so the first ratio in step S130 can be set as 75%, and the second ratio in step S150 is made as 0%.At the same time, can define according to the design requirement of actual product the value of DH and DL in step S160, for example DH be 75% and DL be 10%.
Lift a concrete instance, please refer to Fig. 3, Fig. 3 illustrates the oscillogram of duration of work (duty cycle) of the work ratio of one embodiment of the invention.If the output voltage of power module 520 surpasses the first critical value (for example over 8.1 volts), the work that controller 510 drives the control signal of well heaters 530 is compared and is fixed as the first ratio (for example 75%, as shown in waveform D1).In the case, the fixing work ratio with 75% of controller 510 operates/drives well heater 530.If the output voltage of power module 520 is less than the second critical value (for example less than 7.1 volts), the controller 510 work ratio that drives the control signal of well heaters 530 is fixed as the second ratio (for example 10%, as shown in waveform D2).In the case, controller 510 is to fix 10% work than operation/drive well heater 530.If the output voltage of power module 520 is between the first critical value and the second critical value, for example between 7.1 volts and 8.1 volts, controller 510 drives the control signal of well heater 530 as shown in waveform D3.That is to say, controller 510 can be along with different output voltage values, with different work ratio operation/driving well heaters 530.
In another embodiment, controller 510 also can will be worked in step S160 than being set as (DH-DL) * [(V-VL)/(VH-VL)]+DL.Adjust the work ratio by this step S160, when the output voltage of power module 520 is between first and second critical value, can be with resulting work than between the scope that is limited in DL and DH.
Fig. 4 illustrates the graph of a relation of output voltage and the work ratio of well heater 530 of the power module 520 of one embodiment of the invention.Please refer to Fig. 4, the first ratio of step S130 is 75% in the present embodiment, and the second ratio of step S150 is 0%, the DH of step S160 is 75%, the DL of step S160 is 10%, and the first critical value VH of step S120 is 8.1, and the second critical value VL of step S140 is 7.1.Step S160, can obtain as the output voltage V of Fig. 4 and the graph of a relation of work ratio than the relational expression (DH-DL) of setting * [(V-VL)/(VH-VL)]+DL by above-mentioned work.As shown in Figure 4, during greater than the first critical value (V＞8.1), the work ratio of well heater 530 is fixed as the first ratio 75% in the output voltage V of power module 520.During less than the second critical value (V＜7.1), the work ratio of well heater 530 is fixed as the second ratio 0% in the output voltage V of power module 520.Between two critical values when (V=7.1～8.1), the work of the output voltage V of power module 520 and well heater 530 is than linear in the output voltage V of power module 520.
Subsidiary one carries, and in practical application, controller 510 can operate than the mode that is incorporated into pulse wave width modulation (PWM, Pulse Width Modulation) work to well heater 530.It should be noted that when low temperature, when for example spending lower than Celsius-30, the output of power module 520 internal cells is near the second critical value VL, and controller 510 can be turned down the work ratio of well heater 530, with protection power source module 520.But can discharge heat energy in the discharge process of power module 520 internal cells, make the temperature of battery itself gradually to rise.When power module 520 internal cell temperature climbed, its discharging efficiency may be better and better, and namely the output voltage of power module 520 internal cells may raise gradually.In this process, if controller 510 is constantly detected the output voltage of power module 520 internal cells and is dynamically changed according to this work ratio of well heater 530, can be along with the trend of cell output voltage, the work beguine of well heater 530 is increased together according to above-mentioned step.
In an embodiment of the present invention, if need in the device of low-temperature operation, have the first electronic component and the second electronic component, can be by following step, with primary heater and secondary heater, respectively to the first electronic component (for example the first hard disk) and the second electronic component (for example the second hard disk) heating.Fig. 5 illustrates the process flow diagram that has the heating means of two electronic components in the low temperature environment of one embodiment of the invention.The present embodiment can be analogized/be applied to the described implementation of Fig. 1 to Fig. 4.Please refer to Fig. 5, primary heater is configured in the first electronic component, and secondary heater is configured in the second electronic component (step S210).Controller can obtain according to the method for the described embodiment of Fig. 1 to Fig. 4 the work ratio.Controller drives respectively primary heater and secondary heater according to the work ratio.Driven primary heater and secondary heater can use the electric energy of power module and respectively the first electronic component and the second electronic component be heated.Wherein, during the activation of primary heater with the activation of secondary heater during do not overlap (step S220).
In the step S220 of above-described embodiment, owing to needing to wait until that the first electronic component and the second electronic component all are heated to normal running temperature in electronic installation, for example 0 degree Celsius, just can normally start, therefore controller in turn to two electronic component heating, can improve the effective utilization of well heater.Therefore, do not overlap during the activation of the primary heater of above-mentioned steps with during the activation of secondary heater.That is to say, when the first electronic component was heated, not to the second electronic component heating, vice versa.
As mentioned above, in order to overlap during the activation that does not make primary heater with during the activation of secondary heater, can reach by the mode that the duration of work of work ratio is all given primary heater and secondary heater.Fig. 6 illustrates the oscillogram during the activation of the primary heater of one embodiment of the invention and secondary heater.Please refer to Fig. 6, waveform T1 is that controller carries out the work ratio that calculates after the described flow process of Fig. 1, and wherein this work ratio has duration of work 610.By the duration of work 610 of mean allocation waveform T1, controller can produce respectively two control signal TA, TB to primary heater and secondary heater, so that do not overlap mutually during the activation of different heating device.Wherein, during the duration of work 611 of control signal TA is the activation of primary heater, and during the duration of work 612 of control signal TB is the activation of secondary heater.Above-mentioned duration of work 610 is more than or equal to duration of work 611 and duration of work 612 sums.
When the temperature of this first electronic component reaches normal running temperature, and the temperature of this second electronic component is when not yet reaching normal running temperature, and controller can all be distributed to this secondary heater with the duration of work 610 of this work ratio.That is to say, duration of work 611 is reduced to 0, equal duration of work 610 and duration of work 612 is added to grow to.Otherwise when the temperature of this second electronic component reaches normal running temperature, and the temperature of this first electronic component is when not yet reaching normal running temperature, and controller can all be distributed to this primary heater with the duration of work 610 of this work ratio.That is to say, duration of work 612 is reduced to 0, equal duration of work 610 and duration of work 611 is added to grow to.
Fig. 7 illustrates the process flow diagram that has the heating means of two electronic components in the low temperature environment of another embodiment of the present invention.Please refer to Fig. 7, this embodiment can be with reference to the related description of Fig. 5.Different from Fig. 5 is, in the step S220 of the present embodiment, during can being overlapped in the activation of secondary heater during the activation of primary heater, and during the activation of primary heater with the activation of secondary heater during temporal summation be not more than work period of work ratio.
Fig. 8 illustrates another oscillogram during the activation of the primary heater of another embodiment of the present invention and secondary heater.Please refer to Fig. 8, waveform T1 is that controller carries out the work ratio that calculates after the described flow process of Fig. 1, and wherein this work ratio has duration of work 610.Waveform TA is the control signal that controller is exported to primary heater, and wherein this control signal TA has duration of work (during activation) 613.Waveform TB is the control signal that controller is exported to secondary heater, and wherein this control signal TB has duration of work (during activation) 614.As shown in Figure 8, duration of work 613 is overlapped in duration of work 614, and the summation of duration of work 613 and duration of work 614 is not more than duration of work 610.That is to say, can operate simultaneously primary heater and secondary heater respectively to the heating of the first electronic component and the second electronic component, but during the activation of primary heater with the activation of secondary heater during summation be not more than duration of work 610.
As mentioned above, if need the electronic component of heating to surpass two, the duration of work of the work ratio of the output voltage of power module can distribute its duration of work 610 to each well heater according to quantity, therefore the heatable number of electronic components of the present invention is not limited to above-mentioned.
Except the work ratio, for some embodiment, the heating means of electronic component it should be noted that whether electronic component 550 has arrived normal running temperature.Fig. 9 illustrates the Heating Electron element of one embodiment of the invention to the process flow diagram of operating temperature method.In the present embodiment, heating arrangement 500 has also comprised temperature sensor 540, as shown in Figure 2.Temperature sensor 540 is disposed at electronic component 550.Temperature sensor 540 can be coupled to controller 510 by bus.For example, controller 510 can be by the sensing value of System Management Bus reading temperature sensor 540.Please refer to Fig. 2 and Fig. 9, controller 510 can be by the temperature (step S310) of temperature sensor 540 detecting electronic components 550 (for example hard disk).When the temperature of electronic component 550 reached normal running temperature, controller 510 stopped driving well heater 530 (step S320), and started electronic component 550 (S330).By above-mentioned three steps, when the cold-starting electronic component, can learn whether the electronic component of device inside has been in exercisable temperature, and under the situation of not damaging power module 520, reach the purpose of electronic component 550 being carried out heating operation.When the temperature of electronic component 550 reaches normal running temperature, controller 510 control heater 530 stopped heating electronic components 550.
Further, Figure 10 illustrates two electronic components of heating of another embodiment of the present invention to the process flow diagram of operating temperature method.Please refer to Figure 10, at first, under low temperature, primary heater controlled by controller and secondary heater heats a period of time (step S410) to the first electronic component and the second electronic component respectively.Next, whether the temperature of detecting the first electronic component is greater than 3 degree (step S420) Celsius.If the temperature of the first electronic component greater than 3 degree Celsius, is not got back to step S410, continue the first electronic component and the second electronic component heating a period of time.If the temperature of the first electronic component is greater than 3 degree Celsius, stopped heating the first electronic component, and heated for second electronic component a period of time (step S430).
Then, whether the temperature of detecting the second electronic component is greater than 3 degree (step S440) Celsius.If the temperature of the second electronic component greater than 3 degree Celsius, is not got back to step S430, continue second electronic component heating a period of time.If the temperature of the second electronic component is greater than 3 degree, stopped heating the second electronic components (step S450) Celsius.And, also rest on exercisable temperature in order to ensure the temperature of the first electronic component, whether controller can carry out step S460, spend less than Celsius 0 with the temperature of detecting the first electronic component.If the temperature of the first electronic component starts the first electronic component and the second electronic component (step S490) greater than 0 degree Celsius.If the temperature of the first electronic component heated for first electronic component a period of time (step S470) less than 0 degree Celsius.Then after step S470, whether detect again the temperature of the first electronic component greater than 3 degree (step S480) Celsius.If not, getting back to step S470 continued first electronic component heating a period of time.Otherwise, also enter step S490, complete startup the first electronic component and the second electronic component.
By the heating means of above-described embodiment, can guarantee two electronic components are all being started when being heated to operating temperature.It should be noted that above-mentioned to judge whether to heat enough ceiling temperatures be 3 degree Celsius, and sentence temperature whether not enough lower limit temperature be 0 degree Celsius.For prevent that the heating of one of them electronic component from completing and stopped heating after, when waiting for another electronic component heating, the electronic component temperature of stopped heating is down to below lower limit temperature again at once.Therefore, the upper limit that judgement heating is completed is increased to 3 degree Celsius higher than lower limit temperature, so that a buffering range to be provided.But ceiling temperature and lower limit temperature that the judgement heating is completed are decided by realistic situation, and the ceiling temperature that judgement heating only of the present invention is completed and lower limit temperature are not limited to 3 degree Celsius and 0 degree Celsius.
General situation, in the system of installing in action, such as notebook computer, flat computer etc., if the temperature of power module too low (for example-17 degree Celsius are following), the efficient of power module supply electric power is not enough to drive the well heater of hard disk.In any case this moment, the power module of low temperature was enough to supply electric power to give other system element, central processing unit (CPU, Central Processor Unit) etc. for example.After the system elements such as central processing unit powered on, these system elements can produce heat energy and heat whole electronic installation is inner.Therefore, the present embodiment will utilize these system elements to preheat.In carrying out pre-warmed process, except these system elements provide heat energy, battery also can discharge because of discharge heat energy, and then promotes battery temperature, namely promotes the efficient of power module supply electric power.If the temperature of power module is higher than the temperature more than spending as Celsius-17, the efficient of power module supply electric power is enough to drive the well heater of hard disk usually, therefore can directly use the electric power of power module that hard disk (electronic component) is heated.Be noted that above-mentioned-17 degree Celsius only for giving an example, actual temperature must be looked battery behavior and be decided.
Figure 11 illustrates the process flow diagram of the electronic installation heating means of further embodiment of this invention.Please refer to Figure 11, at first the user starts start (step S710), and at this moment, controller checks that whether the temperature of battery (power module) is lower than-17 degree (step S720) Celsius.If the judgement battery temperature is higher than-17 degree Celsius, controller checks that whether hard disk temperature is lower than hard disk normal working temperature lower limit (step S723).In this step, usually be limited to zero centigrade under the hard disk normal working temperature.If step S723 judgement hard disk temperature is carried out step S725 lower than the normal working temperature lower limit, with heating hard disk a period of time (for example heating several minutes), then can carry out normal boot-strap program (step S780).For example, the normal boot-strap programs such as rear selftest (Power On Self Test, POST) and load operation system (operating system, OS) of starting shooting.In addition, if step S723 judgement hard disk temperature is directly carried out the normal boot-strap program of step S780 higher than the normal working temperature lower limit.
In step S720, if the judgement battery temperature lower than-17 degree Celsius, first preheats a period of time (for example three minutes) (step S730) to the element of system (such as central processing unit etc.).In the present embodiment, step S730 can use heating means as described in Figure 1, namely according to cell output voltage dynamically the method for adjustment work ratio come the drive system element so that preheating system/battery.
Next, preheating to system element except continued power, battery (power module) also provides electric power to well heater so that heating hard disk a period of time (step S740).Next carry out step S750, with judgement battery temperature and the dynamic output voltage work ratio of adjusting power module.In the present embodiment, step S740 or step S750 can use heating means as described in Figure 1, namely according to cell output voltage dynamically the method for adjustment work ratio drive well heater so that the heating hard disk and/or is that the drive system element is so that preheating system/battery.
Moreover whether controller detecting hard disk temperature arrives a normal boot-strap temperature (step S760).If the temperature of hard disk during not higher than the normal boot-strap lowest temperature, is got back to step S740 and is proceeded system and preheat and heat hard disk.Otherwise if hard disk temperature preheats end to system higher than the normal boot-strap lowest temperature, the hard disk heating also finishes, and postpones a period of time (for example three seconds) (step S770), and is too high to prevent transient voltage.In this, can start normal boot-strap program (step S780).
In sum, the invention provides the heating means of electronic component in a kind of low temperature environment, its output voltage according to power module obtains a work ratio, and produce corresponding duration of work according to this work ratio, so that electronic component is heated to normal running temperature, make electronic component to operate under low temperature environment.Further, the duration of work of the ratio that more can share out the work can improve the effective utilization of well heater in most different electronic components.The invention provides the heating arrangement of electronic component in a kind of low temperature environment, it utilizes the heating means of electronic component, at least one electronic component heating.The present invention also provides a kind of electronic installation, and it comprises above-mentioned heating arrangement, is suitable for being applied under low temperature environment, and under specific low temperature, also can heats system element.
Claims (20)
1. heating means of an electronic component in a low temperature environment, wherein a primary heater is configured in this electronic component, it is characterized in that, and these heating means comprise:
Use the electric energy of a power module than this primary heater of driving according to a job;
If the output voltage of this power module greater than one first critical value, is set as one first ratio with this work ratio;
If the output voltage of this power module less than one second critical value, is set as one second ratio with this work ratio, wherein this second critical value is less than this first critical value and greater than zero, this second ratio is less than this first ratio; And
If the output voltage of this power module between this first critical value and this second critical value, is adjusted this work ratio, make the poor of the output voltage of this power module and this second critical value, with this work than proportional.
2. the heating means of electronic component in low temperature environment as claimed in claim 1, is characterized in that, this first ratio is 100%, and this second ratio is 0%.
3. the heating means of electronic component in low temperature environment as claimed in claim 1, is characterized in that, in the step of this work ratio of described adjustment, this work is than between this first ratio and this second ratio.
4. the heating means of electronic component in low temperature environment as claimed in claim 3, is characterized in that, the step of this work ratio of described adjustment comprises:
This work ratio is set as (DH-DL) * [(V-VL)/(VH-VL)], and wherein DH is less than or equal to 1 positive number, and DL is the positive number less than DH, and V is the output voltage of this power module, and VH is this first critical value, and VL is this second critical value.
5. the heating means of electronic component in low temperature environment as claimed in claim 4, is characterized in that, this first ratio and DH are 75%, and this second ratio is that 0%, DL is 10%, and this first critical value VH is 8.1, and this second critical value VL is 7.1.
6. the heating means of electronic component in low temperature environment as claimed in claim 1, is characterized in that, also comprises:
Configure a secondary heater in one second electronic component; And
According to this work ratio, drive the electric energy that this secondary heater uses this power module;
Wherein do not overlap during the activation of this primary heater with during the activation of this secondary heater.
7. the heating means of electronic component in low temperature environment as claimed in claim 6, is characterized in that, the duration of work of this work ratio is all given this primary heater and this secondary heater.
8. the heating means of electronic component in low temperature environment as claimed in claim 6, is characterized in that, when the temperature of this first electronic component reaches a normal running temperature, the duration of work of this work ratio all distributed to this secondary heater.
9. the heating means of electronic component in low temperature environment as claimed in claim 1, is characterized in that, also comprises:
Configure a secondary heater in one second electronic component; And
According to this work ratio, use the electric energy of this power module to drive this secondary heater;
During wherein being overlapped in the activation of this secondary heater during the activation of this primary heater, and during the activation of this primary heater with the activation of this secondary heater during temporal summation be not more than work period of this work ratio.
10. the heating means of electronic component in low temperature environment as claimed in claim 1, is characterized in that, also comprises:
Detect the temperature of this first electronic component;
When the temperature of this first electronic component reaches a normal running temperature, stop driving this primary heater; And
When the temperature of this first electronic component reaches this normal running temperature, start this first electronic component.
11. in low temperature environment as claimed in claim 1, the heating means of electronic component, is characterized in that, this first electronic component is Winchester disk drive.
12. in low temperature environment as claimed in claim 1, the heating means of electronic component, is characterized in that, this power module is that a battery module or exchanges breakout box.
13. in a low temperature environment, the heating arrangement of electronic component, is characterized in that, comprising:
One primary heater is disposed at one first electronic component;
One power module provides this primary heater required electric energy; And
One controller is coupled to this primary heater and this power module, and wherein this controller uses the electric energy of this power module to heat this first electronic component according to a job than controlling this primary heater; If the output voltage of this power module is greater than one first critical value, to set this work ratio be one first ratio to this controller; If the output voltage of this power module is less than one second critical value, to set this work ratio be one second ratio to this controller; This second critical value is less than this first critical value and greater than zero; This second ratio is less than this first ratio; And if the output voltage of this power module is between this first critical value and this second critical value, this controller is adjusted this work ratio, makes the poor of the output voltage of this power module and this second critical value, with this work than proportional.
14. the heating arrangement of electronic component in low temperature environment as claimed in claim 13, it is characterized in that, between this first critical value and this second critical value, this controller is adjusted this work than between this first ratio and this second ratio when the output voltage of this power module.
15. the heating arrangement of electronic component in low temperature environment as claimed in claim 14, it is characterized in that, this controller is set as (DH-DL) * [(V-VL)/(VH-VL)] with this work ratio, wherein DH is less than or equal to 1 positive number, DL is the positive number less than DH, V is the output voltage of this power module, and VH is this first critical value, and VL is this second critical value.
16. in low temperature environment as claimed in claim 13, the heating arrangement of electronic component, is characterized in that, also comprises:
One temperature sensor is disposed at this first electronic component to detect the temperature of this first electronic component, and this temperature sensor is coupled to this controller;
Wherein when the temperature of this first electronic component reached a normal running temperature, this controller was controlled this primary heater stopped heating.
17. an electronic installation is characterized in that, comprising:
One first electronic component;
One primary heater is disposed at one first electronic component;
One power module provides this electronic installation and this primary heater required electric energy; And
One controller is coupled to this primary heater and this power module, and this controller uses the electric energy of this power module to heat this first electronic component according to a job than controlling this primary heater;
If wherein the output voltage of this power module is greater than one first critical value, to set this work ratio be one first ratio to this controller; If the output voltage of this power module is less than one second critical value, to set this work ratio be one second ratio to this controller; This second critical value is less than this first critical value and greater than zero; This second ratio is less than this first ratio; And if the output voltage of this power module is between this first critical value and this second critical value, this controller is adjusted this work ratio, makes the poor of the output voltage of this power module and this second critical value, with this work than proportional.
18. electronic installation as claimed in claim 17 is characterized in that, between this first critical value and this second critical value, this controller is adjusted this work than between this first ratio and this second ratio when the output voltage of this power module.
19. electronic installation as claimed in claim 18, it is characterized in that, this controller is set as (DH-DL) * [(V-VL)/(VH-VL)] with this work ratio, wherein DH is less than or equal to 1 positive number, DL is the positive number less than DH, V is the output voltage of this power module, and VH is this first critical value, and VL is this second critical value.
20. electronic installation as claimed in claim 17 is characterized in that, also comprises:
One temperature sensor is disposed at this first electronic component to detect the temperature of this first electronic component, and this temperature sensor is coupled to this controller;
Wherein when the temperature of this first electronic component reached a normal running temperature, this controller was controlled this primary heater stopped heating.
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| CN201110339947.1A CN103092295B (en) | 2011-11-02 | 2011-11-02 | The heating means of electronic component and device and electronic installation |
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| CN201110339947.1A CN103092295B (en) | 2011-11-02 | 2011-11-02 | The heating means of electronic component and device and electronic installation |
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| US6928559B1 (en) * | 1997-06-27 | 2005-08-09 | Broadcom Corporation | Battery powered device with dynamic power and performance management |
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