CN103085178A - Slicing machine for cutting sapphire silicon rods - Google Patents
Slicing machine for cutting sapphire silicon rods Download PDFInfo
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- CN103085178A CN103085178A CN2011103467515A CN201110346751A CN103085178A CN 103085178 A CN103085178 A CN 103085178A CN 2011103467515 A CN2011103467515 A CN 2011103467515A CN 201110346751 A CN201110346751 A CN 201110346751A CN 103085178 A CN103085178 A CN 103085178A
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- cutting
- cutting roller
- sapphire silicon
- cut
- silicon rod
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Abstract
The invention provides a slicing machine for cutting sapphire silicon rods. The slicing machine for cutting the sapphire silicon rods comprises a machine frame provided with work-piece cutting areas, a first cutting roller, a second cutting roller, a third cutting roller and a diamond wire, wherein the third cutting roller is arranged between the first cutting roller and the second cutting roller and located above the same horizontal plane of the first cutting roller and the second cutting roller, connecting lines of the axle center of the third cutting roller and axle centers of the first and the second cutting rollers form an equilateral triangle, the diamond wire is sequentially wound around the first, the second and the third cutting rollers and forms three cutting lines with the equal lengths among the first, the second and the third cutting rollers, and when the diamond wire revolves at a high speed, two sapphire silicon rods are simultaneously cut by two of the three cutting lines with the equal lengths. The slicing machine can solve the problems in the prior art that cutting accuracy is easily influenced by an excessive flexing degree of the diamond wire caused by an arranging mode of cutting rollers and cutting work efficiency is low due to the fact that only one sapphire silicon rod can be cut in one cutting process.
Description
Technical field
The present invention relates to a kind of multi-wire saw technology, particularly relate to a kind of slicer for the cutting sapphire silicon rod.
Background technology
We know, LED purposes in society is very extensive, and for example various communication equipments, instrument and meter and display floater are backlight upper all with a large amount of LED is arranged.Sapphire (Sapphire) has very important status as the material of making LED at semiconductor applications.Before being formed for making LED silicon on sapphire substrate, still need the silicon on sapphire material is carried out front end processing, be about to the operation that sapphire silicon rod is cut into slices.Now sapphire silicon rod is carried out slice processing and generally adopt multi-wire saw, the multi-wire saw technology is present more advanced silicon chip process technology in the world.Thereby its principle is the steel wire by a high-speed motion to be driven the cutting blade material that is attached on steel wire and sapphire silicon rod is rubbed reaches the cutting purpose.Line cutting technology compares with traditional knife saw sheet, grinding wheel and inner circle cutting that to have efficient high, and production capacity is high, and precision is high, low cost and other advantages.
Existing multi-wire saw equipment such as silicon on sapphire bar slicer etc. includes usually at least: frame, be provided with workbench on described frame, the wire storage tube (not shown graphic) that is used for the retractable diamond wire, a plurality of guide roller that described diamond wire leads and two cutting rollers that are crossed on the relative both sides of workbench of being used to, described two cutting Kun are for being horizontally disposed with, and the diamond wire that between is wound around forms one section line of cut, send the part tool and is fixed on the sapphire silicon rod that send on the part tool being provided with above described line of cut.In the actual cutting process to sapphire silicon rod, described diamond wire is by the guiding of tens guide rollers, form a bracing cable net on the cutting roller of the relative both sides of workbench, utilize and describedly send the described sapphire silicon rod that the part tool will be fixed to be transported on described line of cut, line of cut is diamond wire, the diamond dust spraying plating is on diamond wire, drive grinding agent by diamond wire and back and forth tell motion, utilize diamond dust to produce cutting to described sapphire silicon rod, so that described sapphire silicon rod once is cut into many silicon on sapphires simultaneously.
on silicon on sapphire bar slicer in the prior art, the cutting roller that is positioned at workbench relative both sides is arranged on relative two heel posts of frame, thereby left, span between right cutting roller is very large, so the diamond wire cable run distance between the cutting roller of both sides is also very long, in the section operation of reality, when the cutting roller with workbench relative both sides lowers, when the diamond wire between the cutting roller of both sides is urged to workpiece, can make diamond wire form very large flexing degree, thereby diamond wire also just is subject to maximum running resistance all the time, because often having very high hardness, workpiece itself is difficult for cutting, add for the requirement of workpiece section precision very strict again, so causing the diamond wire flexing to be spent, above-mentioned set-up mode because of cutting roller is easy to greatly impact cutting precision.
In addition, in above-mentioned crystalline silicon bar slicer, only be provided with two cutting rollers of horizontal layout, make for single between the cutting area for the cutting sapphire silicon rod (only forming one section line of cut for the steel wire that is wound around between the cutting roller of two of both sides), so, single can the cutting sapphire silicon rod quantity also seldom (general single is only supported the cutting of a sapphire silicon rod), the operating efficiency of cutting is lower.
Therefore, how to provide a kind of cutting equipment that is applied to sapphire silicon rod, to avoid above-described disappearance, real is dealer's problem demanding prompt solution of association area.
Summary of the invention
The disappearance of prior art in view of the above, the object of the present invention is to provide a kind of slicer for the cutting sapphire silicon rod, cause the diamond wire flexing to spend Da Yi impact cutting precision and single only supports the cutting of a sapphire silicon rod to cause the low problem of cutting operating efficiency to solve in prior art set-up mode because of cutting roller.
Reach for achieving the above object other relevant purposes, the invention provides a kind of slicer for the cutting sapphire silicon rod, comprising: frame has the work piece cut district; The first cutting roller is arranged on the side in described work piece cut district; The second cutting roller is arranged on the opposite side in described work piece cut district, with described the first cutting roller opposing parallel and be positioned on same level; The 3rd cutting roller, be arranged between described the first cutting roller and described the second cutting roller, and be positioned at the top of described the first cutting roller and described the second cutting roller same level, and the axial connecting line of the axle center of described the 3rd cutting roller and described first, second cutting roller consists of an equilateral triangle; And diamond wire, be wound in successively on described first, second and third cutting roller, and described first, second, and the 3rd cutting roller between form three sections isometric lines of cut, when described diamond wire runs up, simultaneously two sapphire silicon rods are carried out cutting operation by two sections isometric lines of cut wherein.
Alternatively, described slicer comprises that also corresponding with the described two sections lines of cut that carry out cutting operation two are sent the part tool, be separately positioned on described frame, be used for transporting described two sapphire silicon rods and cut to the line of cut between described the first cutting roller and described the 3rd cutting roller and/or the line of cut between described the second cutting roller and described the 3rd cutting roller.
Alternatively, the described part tool that send closes described sapphire silicon rod via binding gluing.
Alternatively, described sapphire silicon rod and described sending also are bonded with glass plate between the part tool.
Alternatively, described sapphire silicon rod is cylinder.
Alternatively, the speed of service of described diamond wire is more than or equal to 720m/min～900m/min.
Slicer for the cutting sapphire silicon rod provided by the present invention, it provides three cutting Kun, and the set-up modes of three described cutting Kun are designed to the three originally, and to be angle be the equilateral triangle of 60 °, thereby the length of guaranteeing the diamond wire that is wound around between three described cutting Kun is identical with the flexing degree, thereby has guaranteed the accuracy of sapphire silicon rod.
In addition, in the present invention, it is the equilateral triangle of 60 ° that three described cutting Kun are angle, provide the left and right two sections lines of cut, thereby can cut two sapphire silicon rods simultaneously, compared to only providing one section line of cut single only to support the prior art of a sapphire silicon rod cutting, the present invention can improve the operating efficiency of sapphire silicon rod cutting greatly.
Description of drawings
Fig. 1 is the simplified structure schematic diagram of the present invention's slicer of being used for the cutting sapphire silicon rod.
Fig. 2 is the incision principle schematic diagram of the present invention's slicer of being used for the cutting sapphire silicon rod.
The specific embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantages of the present invention and effect easily by content disclosed in the present specification.The present invention can also be implemented or be used by other different concrete real mode, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications or change under spirit of the present invention not deviating from.
See also Fig. 1 and Fig. 2, wherein, Fig. 1 is the simplified structure schematic diagram of the present invention's slicer of being used for the cutting sapphire silicon rod, and Fig. 2 is the incision principle schematic diagram of the present invention's slicer of being used for the cutting sapphire silicon rod.Need to prove, the diagram that provides in the present embodiment only illustrates basic conception of the present invention in a schematic way, satisfy and only show the assembly relevant with the present invention in graphic but not component count, shape and size drafting when implementing according to reality, during its actual enforcement, kenel, quantity and the ratio of each assembly can be a kind of random change, and its assembly layout kenel also may be more complicated.
As shown in Figure 1, the invention provides slicer, it is applied to sapphire silicon rod is carried out cutting operation.Described sapphire silicon rod is cylinder, comprises relative end face, bottom surface and the periphery between described end face and described bottom surface.In the present embodiment, described slicer 1 comprises at least: frame 10, be arranged on the first cutting roller 12a, the second cutting roller 12b, the 3rd cutting roller 12c on frame 10, be wound in successively the diamond wire 14 on the first cutting roller 12a, the second cutting roller 12b and the 3rd cutting roller 12c, and be arranged on first on frame 10 and send part tool 16a and second to send part tool 16b.
Below will be described in detail above-mentioned each parts.
The first cutting roller 12a is arranged on a side in described work piece cut district, and the second cutting roller 12b relatively is arranged on the opposite side in described work piece cut district, the second cutting roller 12b and the first cutting roller 12a opposing parallel and be positioned on same level.In the present embodiment, described the first cutting roller 12a and described the second cutting roller 12b are positioned at the same level height.
The 3rd cutting roller 12c is arranged between the first cutting roller 12a and the second cutting roller 12b, and is positioned at the top of the first cutting roller 12a and the second cutting roller 12b same level.Especially, in the present embodiment, the axle center of the 3rd cutting Kun 12c and the axial connecting line (as shown in Figure 1 line L1, L2, L3) of first, second cutting roller 12a, 12b consist of an equilateral triangle, that is, to cut the spacing of Kun 12a identical for the spacing of the spacing of the first cutting roller 12a and the second cutting roller 12b, the second cutting roller 12b and the 3rd cutting Kun 12c and the 3rd cutting Kun 12c and first.
need to prove, just because of the first cutting roller 12a, axial connecting line between the second cutting roller 12b and the 3rd cutting roller 12c consists of equilateral triangle (i.e. the first cutting roller 12a, constant gap between the second cutting roller 12b and the 3rd cutting roller 12c, that is to say, the position of three cutting rollers is all changeless), so just guaranteed to be wrapped in respectively between the 3rd cutting Kun 12c and the first cutting Kun 12a, the 3rd cutting Kun 12c cut between Kun 12b with second and length and the flexing degree thereof of three sections lines of cut between the first cutting roller 12a and the second cutting roller 12b identical, thereby guaranteed wherein first, the second line of cut 14a, 14b is to two sapphire silicon rod 15a, the accuracy that 15b cuts.
In the present embodiment, diamond wire 14 is wound between the 3rd cutting roller 12c and the first cutting roller 12a or forms two sections line of cut 14a, 14b between the 3rd cutting roller 12c and the second cutting roller 12b, can carry out cutting operation to sapphire silicon rod 15a, 15b when running up.In more detail, on the slicer 1 of reality, the motor (not shown) that also has wire storage tube (not shown) and drive described wire storage tube by the described wire storage tube rotation of this driven by motor, and then makes its take-up or unwrapping wire and makes described diamond wire 14 run up.
Please continue to consult Fig. 2, slicer 1 of the present invention comprises that also two of being arranged on described frame 10 send the part tool, being denoted as first send part tool 16a and second to send part tool 16b, wherein, first send part tool 16a to be used for sapphire silicon rod 15a is transported to the first line of cut 14a that forms between the 3rd cutting roller 12c and the first cutting roller 12a, and second send part tool 16b to be used for sapphire silicon rod 15b is transported to the second line of cut 14b that forms between the 3rd cutting roller 12c and the first cutting roller 12a.
in the present embodiment, each is described send part tool (existing send part tool 16b to describe as example take second) to include: be arranged on the support 160b on frame 10, the swing arm 161b that is coupling with support 160b, be located on swing arm 161b, the second line of cut 14b between the 3rd cutting roller 12c and the first cutting roller 12a send part arm 162b, extension arm 163b by swing arm 161b extension, be movably set with roller feed screw nut 164b on free end away from swing arm 161b in extension arm 163b, run through the screw mandrel 165b of roller feed screw nut 164b to coordinate with roller feed screw nut 164b, fixed cross beam 166b and the screw rodb base 167b that is fixedly installed on fixed cross beam 166b, be movably arranged on screw rodb base 167b, the screw mandrel rotating disk 168b that is used for support screw mandrel 166b, and the motor 169b that is used for driving screw mandrel 166b.First send part tool 16a and second to send part tool 16b similar, therefore do not giving unnecessary details.Utilize first of said structure to send part tool 16a or second to send part tool 16b, the direction of arrow that just can be as shown in Figure 1 and sapphire silicon rod 15a or sapphire silicon rod 15b correspondingly are transported to the first line of cut 14a between the 3rd cutting roller 12c and the first cutting roller 12a or the second line of cut 14b between the 3rd cutting roller 12c and the first cutting roller 12a.
In addition, first, second send part tool 16a, 16b to have to bind the bonding medium of the bottom surface of sapphire silicon rod 15a, 15b, particularly, described bonding medium can be for example to bind glue, described bonding glue together binds a glass (not indicating) on the bottom surface of sapphire silicon rod 15a, 15b, after slice is completed, dissolve bonding glue and separate sapphire silicon rod and glass with hot water.
See also Fig. 2, Fig. 2 is shown as the incision principle schematic diagram of slicer of the present invention.In the cutting process of reality, first send part tool 16a that sapphire silicon rod 15a is transported on the first line of cut 14a between the 3rd cutting roller 12c and the first cutting roller 12a, and compressing makes the first line of cut 14a that runs up carry out cutting operation to sapphire silicon rod 15a; With it similarly, second send part tool 16b that sapphire silicon rod 15b is transported on the second line of cut 14b between the 3rd cutting roller 12c and the second cutting roller 12b, and compressing makes the first line of cut 14a that runs up carry out cutting operation to sapphire silicon rod 15a.
Be the equilateral triangle of 60 ° because the first cutting roller 12a, the second cutting roller 12b and the 3rd cutting roller 12c consist of angle α, be wrapped between the first cutting roller 12a and the second cutting roller 12b, between the second cutting roller 12b and the 3rd cutting Kun 12c and the 3rd cutting Kun 12c and first to cut length and the flexing degree thereof of three sections diamond wires 14 between Kun 12a identical, thereby guaranteed the accuracy that first, second line of cut 14a, 14b cut two sapphire silicon rod 15a, 15b.
In sum, slicer for the cutting sapphire silicon rod provided by the present invention, it provides three cutting Kun, and the set-up modes of three described cutting Kun are designed to the three originally, and to be angle be the equilateral triangle of 60 °, thereby the length of guaranteeing the diamond wire that is wound around between three described cutting Kun is identical with the flexing degree, thereby has guaranteed the accuracy of sapphire silicon rod.
In addition, in the present invention, it is the equilateral triangle of 60 ° that three described cutting Kun are angle, provide the left and right two sections lines of cut, thereby can cut two sapphire silicon rods simultaneously, compared to only providing one section line of cut single only to support the prior art of a sapphire silicon rod cutting, the present invention can improve the operating efficiency of sapphire silicon rod cutting greatly.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not is used for restriction the present invention.Any personage who has the knack of this technology all can under spirit of the present invention and category, modify or change above-described embodiment.Therefore, have in technical field under such as and know that usually the knowledgeable modifies or changes not breaking away from all equivalences of completing under disclosed spirit and technological thought, must be contained by claim described later.
Claims (6)
1. a slicer that is used for the cutting sapphire silicon rod, is characterized in that, comprising:
Frame has the work piece cut district;
The first cutting roller is arranged on the side in described work piece cut district;
The second cutting roller is arranged on the opposite side in described work piece cut district, with described the first cutting roller opposing parallel and be positioned on same level;
The 3rd cutting roller, be arranged between described the first cutting roller and described the second cutting roller, and be positioned at the top of described the first cutting roller and described the second cutting roller same level, and the axial connecting line of the axle center of described the 3rd cutting roller and described first, second cutting roller consists of an equilateral triangle; And
Diamond wire, be wound in successively on described first, second and third cutting roller, and described first, second, and the 3rd cutting roller between form three sections isometric lines of cut, when described diamond wire runs up, simultaneously two sapphire silicon rods are carried out cutting operation by two sections isometric lines of cut wherein.
2. the slicer for the cutting sapphire silicon rod according to claim 1, it is characterized in that: comprise that also corresponding with the described two sections lines of cut that carry out cutting operation two are sent the part tool, be separately positioned on described frame, be used for transporting described two sapphire silicon rods and cut to the line of cut between described the first cutting roller and described the 3rd cutting roller and/or the line of cut between described the second cutting roller and described the 3rd cutting roller.
3. the slicer for the cutting sapphire silicon rod according to claim 2 is characterized in that: the described part tool that send closes described sapphire silicon rod via binding gluing.
4. the slicer for the cutting sapphire silicon rod according to claim 3, it is characterized in that: described sapphire silicon rod and described sending also are bonded with glass plate between the part tool.
5. the slicer for the cutting sapphire silicon rod according to claim 1, it is characterized in that: described sapphire silicon rod is cylinder.
6. the slicer for the cutting sapphire silicon rod according to claim 1, is characterized in that: the speed of service 720m/min of described diamond wire～900m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110346751.5A CN103085178B (en) | 2011-11-04 | 2011-11-04 | Slicing machine for cutting sapphire silicon rods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110346751.5A CN103085178B (en) | 2011-11-04 | 2011-11-04 | Slicing machine for cutting sapphire silicon rods |
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| Publication Number | Publication Date |
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| CN103085178A true CN103085178A (en) | 2013-05-08 |
| CN103085178B CN103085178B (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110346751.5A Active CN103085178B (en) | 2011-11-04 | 2011-11-04 | Slicing machine for cutting sapphire silicon rods |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2428111A1 (en) * | 1973-06-12 | 1975-01-16 | Philips Nv | METHOD AND DEVICE FOR SAWING WORK PIECES |
| US6295977B1 (en) * | 1998-11-05 | 2001-10-02 | Wacker Chemie Gmbh | Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece |
| JP2009061528A (en) * | 2007-09-05 | 2009-03-26 | Denso Corp | Method of manufacturing silicon carbide substrate by wire and wire saw device for manufacturing silicon carbide substrate |
| CN102179880A (en) * | 2011-03-30 | 2011-09-14 | 苏州市汇峰机械设备厂 | Multi-wire cutting machine |
| CN102211362A (en) * | 2011-04-11 | 2011-10-12 | 黄禹宁 | Three-roller multi-wire cutting machine |
| CN102229213A (en) * | 2011-06-23 | 2011-11-02 | 英利能源（中国）有限公司 | Silicon block wire saw machine tool and silicon block fixing device thereof |
| CN202021702U (en) * | 2011-02-17 | 2011-11-02 | 深圳中电熊猫晶体科技有限公司 | Macromolecular resin tooth saw drum |
| CN202336944U (en) * | 2011-11-04 | 2012-07-18 | 上海日进机床有限公司 | Slicing machine for cutting sapphire silicon rods |
-
2011
- 2011-11-04 CN CN201110346751.5A patent/CN103085178B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2428111A1 (en) * | 1973-06-12 | 1975-01-16 | Philips Nv | METHOD AND DEVICE FOR SAWING WORK PIECES |
| US6295977B1 (en) * | 1998-11-05 | 2001-10-02 | Wacker Chemie Gmbh | Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece |
| JP2009061528A (en) * | 2007-09-05 | 2009-03-26 | Denso Corp | Method of manufacturing silicon carbide substrate by wire and wire saw device for manufacturing silicon carbide substrate |
| CN202021702U (en) * | 2011-02-17 | 2011-11-02 | 深圳中电熊猫晶体科技有限公司 | Macromolecular resin tooth saw drum |
| CN102179880A (en) * | 2011-03-30 | 2011-09-14 | 苏州市汇峰机械设备厂 | Multi-wire cutting machine |
| CN102211362A (en) * | 2011-04-11 | 2011-10-12 | 黄禹宁 | Three-roller multi-wire cutting machine |
| CN102229213A (en) * | 2011-06-23 | 2011-11-02 | 英利能源（中国）有限公司 | Silicon block wire saw machine tool and silicon block fixing device thereof |
| CN202336944U (en) * | 2011-11-04 | 2012-07-18 | 上海日进机床有限公司 | Slicing machine for cutting sapphire silicon rods |
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| CN103085178B (en) | 2015-04-08 |
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Effective date of registration: 20180521 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Patentee after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Patentee before: Shanghai Nissin Machine Tool Co., Ltd. |
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