CN102999778A - Manufacture method of copper-ring-free dual-interface intelligent card packaging frame - Google Patents
Manufacture method of copper-ring-free dual-interface intelligent card packaging frame Download PDFInfo
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- CN102999778A CN102999778A CN2012105080944A CN201210508094A CN102999778A CN 102999778 A CN102999778 A CN 102999778A CN 2012105080944 A CN2012105080944 A CN 2012105080944A CN 201210508094 A CN201210508094 A CN 201210508094A CN 102999778 A CN102999778 A CN 102999778A
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- packaging frame
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 170
- 239000010949 copper Substances 0.000 claims abstract description 119
- 229910052802 copper Inorganic materials 0.000 claims abstract description 112
- 238000005530 etching Methods 0.000 claims abstract description 33
- 239000004744 fabric Substances 0.000 claims abstract description 32
- 239000003822 epoxy resin Substances 0.000 claims abstract description 19
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 19
- 239000011889 copper foil Substances 0.000 claims abstract description 15
- 238000004381 surface treatment Methods 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims description 35
- 238000003466 welding Methods 0.000 claims description 35
- 238000002203 pretreatment Methods 0.000 claims description 26
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 14
- 238000004080 punching Methods 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 14
- 238000011161 development Methods 0.000 claims description 11
- 239000003814 drug Substances 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 9
- 229910052708 sodium Inorganic materials 0.000 claims description 9
- 239000011734 sodium Substances 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 8
- 230000004927 fusion Effects 0.000 claims description 7
- 229920002521 macromolecule Polymers 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- 150000003254 radicals Chemical class 0.000 claims description 7
- 238000004064 recycling Methods 0.000 claims description 7
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 7
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000012528 membrane Substances 0.000 abstract 2
- 238000001035 drying Methods 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 19
- 239000004020 conductor Substances 0.000 description 19
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 12
- 239000011521 glass Substances 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 239000002699 waste material Substances 0.000 description 8
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000010923 batch production Methods 0.000 description 5
- 230000001680 brushing effect Effects 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229960003280 cupric chloride Drugs 0.000 description 3
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005270 abrasive blasting Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000003701 mechanical milling Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Abstract
A manufacture method of a copper-ring-free dual-interface intelligent card packaging frame belongs to the technical field of electronic information and is mainly applied to the field of an integrated circuit (IC) packaging frame. A second contact layer (3) is manufactured by adopting epoxy resin cloth with copper on one face through stamping, pretreating, membrane coating, exposing, developing and etching firstly; then a first contact layer (2) is manufactured through copper foil pasting on a copper-foil-free face, drying, pretreating, membrane coating, exposing, developing and etching; and finally surface treatment is carried out on the first contact layer (2) and the second contact layer (3). The dual-interface intelligent card packaging frame with greatly-reduced electric leads reduces gilded areas and saves cost. Furthermore, when a chip is pasted into, possibility of short circuits caused by contact between the electric leads and a copper ring is reduced.
Description
Technical field
Without copper ring double-interface smart card packaging frame method for making, belong to electronic information technical field, be mainly used in IC packaging frame field.
Background technology
Smart card also claims IC-card (Integrated Circuit Card, integrated circuit card), smart card (intelligent card), microcircuit card (microcircuit card) or chip card etc.It is a microelectronic chip to be embedded meet in the card base of ISO 7816 standards, makes card form.Smart card is another the novel information instrument that occurs after magnetic card.General common smart card adopts radio-frequency technique and card reader to carry out communication.It has successfully solved passive (non-transformer in the card) and this difficult problem of contact-free, is a quantum jump of field of electronic devices.Be mainly used in the automatic fare collection system of public transport, ferry, subway, also be applied in entrance guard management, proof of identification and stored value card.
Smart card has the product at single interface and the product at two interfaces at present.Wherein the product at single interface refers to that the smart card single face has functional copper billet design.The product at two interfaces refers to that smart card is two-sided a design of functional copper billet.General traditional two interfaces way is that two-sided copper billet design forms together.Such way must cover dry film with the protection welding hole at welding hole, prevents that etching solution from etching into the module of the first contact layer by welding hole.For the dry film of fixing on the welding hole must design copper ring at the welding hole edge.These copper rings must electric plated with nickel and gold.In order to electroplate it, copper ring must add plating line.Pressure welding face copper ring does not have practical significance, and area is very large, overgild, and the waste gold increases cost.When copper ring was arranged, conductor wire was a lot, and when being pasted into chip, wire is easy to contact with copper ring, causes short circuit.When copper ring was arranged, the copper ring conductor wire was numerous, to the product design Constrained, consider every plating line trend, and product design is loaded down with trivial details, and product is not attractive in appearance.
With reference to accompanying drawing 3 ~ 4: the double-interface smart card packaging frame product that classic method obtains, comprise basic unit 1, the first contact layer 2, the second contact layer 3, chip 4, conductor wire 5, welding hole 6, welding block 7, copper ring 8, chip bearing face 9, wire 10, described basic unit 1 is the middle layer, the first contact layer 2 and the second contact layer 3 coat respectively the pros and cons of basic unit 1, described chip bearing face 9 and welding hole 6 are for penetrating the hole of basic unit 1 and the second contact layer 3, be equipped with copper ring 8 on the edge of chip bearing face 9 and welding hole 6, copper ring 8 all is connected with its conductor wire 5 of electroplating usefulness.The center of chip bearing face 9 has the surface distributed of chip 4, the second contact layers 3 that are contained in the first contact layer 2 reverse side that welding block 7 is arranged, and described wire 10 passes chip bearing face 9 is connected with welding hole and connects the first contact layer 2 and chip 4.It is more loaded down with trivial details that conductor wire 5 is arranged closely inaesthetic simultaneously design, and actual difficulty of processing is larger, because wire 10 need pass chip bearing face 9 and welding hole 6, copper ring 8 easy and its edge is short-circuited, and becomes waste product.It is very large to electroplate area, has increased cost, and copper ring 8 does not have practical function with most of conductor wires 5, wastes material.
Old technology flow process: punching press-copper-surfaced paper tinsel-oven dry-pre-treatment-press dry film-exposure-development-etching/demoulding-surface treatment-cut-dimension control.
Summary of the invention
The technical problem to be solved in the present invention is: overcome the deficiencies in the prior art, provide a kind of pressure welding face without copper ring save cost without copper ring double-interface smart card packaging frame method for making.
The technical solution adopted for the present invention to solve the technical problems is: this is characterized in that without copper ring double-interface smart card packaging frame method for making:
At first, the epoxy resin cloth of copper is worn in employing one, produces the second contact layer through punching press, pre-treatment, overlay film, exposure, development, etching;
Producing the first contact layer without copper-clad surface copper-surfaced paper tinsel, oven dry, pre-treatment, overlay film, exposure, development, etching again;
Then, the first contact layer and the second contact layer are carried out surface treatment.。
Described concrete technology step without copper ring double-interface smart card packaging frame method for making is:
1, punching press: copper face stamps out welding hole to an epoxy resin cloth of wearing copper up;
2, pre-treatment: remove oxide, grease and the impurity on copper surface, cleaning and alligatoring copper face;
3, overlay film: the sense film resist is covered on the copper face after the pre-treatment;
4, exposure: the copper face behind the overlay film makes the sense film resist accept UV-irradiation, makes the light trigger in it be decomposed into free radical, excites monomer to produce polyreaction formation macromolecular compound figure is shifted on copper face;
5, develop: the alkalescent of utilizing sodium carbonate liquor with on the sense film without being partly dissolved of ultraviolet radiation, keep the part that fusion reaction occurs through ultraviolet radiation, technological parameter: temperature: 20 ~ 60 ℃, Na
2CO
3Solution concentration: 5 ~ 15 g/L, liquid medicine spray pressure: 0.1 ~ 0.2Mpa, washing pressure: 0.1 ~ 0.2Mpa, baking temperature: 30 ~ 100 ℃, transfer rate 1 ~ 10m/min;
6, etching: copper face is contacted the moulding of chemical solution hollow out, produce the second contact layer;
7, copper-surfaced paper tinsel: with Copper Foil and epoxy resin cloth cover being fitted tightly without the pressure of copper face recycling heat pressing wheel and the viscosity of epoxy resin of epoxy resin cloth of wearing copper; Process conditions: heat pressing wheel pressure: 0.1 ~ 0.3Mpa, tension force: 100 ~ 2000, the heat pressing wheel temperature: 80 ~ 200 ℃, speed: 0.5 ~ 10m/min;
8, oven dry: new copper-surfaced paper tinsel is carried out heat treated, make Copper Foil and epoxy resin cloth carry out secondary and fit tightly; Again the one side of new copper-surfaced paper tinsel is carried out described pre-treatment, overlay film, exposure, development, etched processing, produce the first contact layer;
9, surface treatment: electroplating processes is carried out on the surface to the first contact layer and the second contact layer, plates inert metal and covers copper face, the protection copper face.
Preferably, the technological parameter that described step 5 is developed: temperature: 25 ~ 35 ℃, Na
2CO
3Solution concentration: 8 ~ 12 g/L, liquid medicine spray pressure: 0.14 ~ 0.17Mpa, washing pressure: 0.14 ~ 0.17Mpa, baking temperature: 60 ~ 70 ℃, transfer rate 3 ~ 5m/min.
Preferably, the technological parameter of described step 7 copper-surfaced paper tinsel: heat pressing wheel pressure: 0.15 ~ 0.25Mpa, tension force: 900 ~ 1200, the heat pressing wheel temperature: 130 ~ 150 ℃, speed: 5.0 ~ 7.0m/min.
The method of described step 2 pre-treatment is abrasive blasting method, method of chemical treatment or mechanical milling method.
A: the abrasive blasting method has two kinds, and a kind of jet grinding method that is called directly directly sprays to copper face with the volcanics powder in the high pressure mode, reaches the purpose of coarse surface.Another kind is the low pressure polishing, makes with the low pressure sandblast first and flows out copper face again with white nylon bruss grinding, and these two kinds of methods all reach certain roughness, uniformity coefficient and remove impurity and oxide take the volcanics powder as the medium milling copper face.
B: method of chemical treatment utilizes acidic copper chloride and copper face effect, but removes copper surface oxide, impurity and etching trace meter copper, makes the copper face structure change to increase copper face homogeneity, roughness and increases the copper surfactivity, is beneficial to next process operations.
C: mechanical milling method refer to nylon bruss or weave cotton cloth rely on pressure directly to contact copper face and under transmission drives with the mutual friction of copper face phase, so as to changing the copper face structure, generally can brushing need to be divided into four classes according to processing procedure: heavy brushing, middle brushing, light brushing, little brushing, mainly count difference by brush wheel abrasive particle order and distinguish.
Described step 3 overlay film is for pasting dry film.The used dry film kind of upper dry film is solvent-borne type dry film, water-soluble dry film and exfoliated dry film.The overlay film step also can be to apply wet film.
The dry film brand: Du Pont's dry film, Asahi Chemical Industry's dry film, Hitachi's dry film, Changxing dry film is appointed and is known dry film, Changchun dry film, Cologne dry film.Wherein Hitachi's dry film is the alkali-developable photosensitive dry film of developing for the circuit formation of high density printed wiring board; characteristic with good concavo-convex following, adherence and resolution uses the etching protective film in internal layer/flexible circuit board that good characteristic is arranged.
Described step 6 etching is divided into acidic copper chloride etching, alkaline cupric chloride etching and iron chloride etching.
A, acidic copper chloride etching, etching mechanism:
Cu+CuCl
2→Cu
2Cl
2
?Cu
2Cl
2+4?Cl
-?→2(CuCl
3)
2-
B, alkaline cupric chloride etching, etching mechanism:
CuCl
2?+?4NH
3→Cu(NH
3)
4Cl
2
Cu(NH
3)
4Cl
2+Cu→2Cu(NH
3)
2Cl
C, iron chloride etching, etching mechanism:
FeCl
3+Cu→FeCl
2+CuCl
?FeCl
3+CuCl→FeCl
2+CuCl
2
?CuCl
2+Cu→2CuCl
Copper plate is in order to promote the electrodeposited coating adhesive ability, to reach resistance to corrosion in described step 9 surface treatment; Nickel coating is in order to promote corrosion stability and wearing quality; Gold plated Layer is in order to improve the conductive contact impedance, to promote the signal transmission, increase corrosion stability, wearing quality, inoxidizability, making product surface more attractive in appearance.
Traditional handicraft is that the first contact layer and the second contact layer are made together, and technique of the present invention is to do first the second contact layer, after do the first contact layer.Contrast the present invention, two kinds of techniques of tradition, the present invention before copper-surfaced, many these 5 procedures of pre-treatment-overlay film-exposure-development-etching, its purpose is exactly first the otiose copper of the second contact layer to be etched away.And need not in etching process to prevent that etching solution from etching into the first contact layer by welding hole.Also need not to add copper ring at welding hole, add conductor wire.
Compared with prior art, the beneficial effect that has without copper ring double-interface smart card packaging frame method for making of the present invention is: the inventive method need not copper ring and the corresponding conductor wire of the second contact layer, reduced gold-plated area, saved cost, made the area of electroless nickel layer and gold layer reduce 25 ~ 40%.And when being pasted into chip, reduced wire because contact the possibility that is short-circuited with copper ring.When product design of the present invention is produced, the second contact layer copper ring and conductor wire, functional area is more succinctly bright and clear, and product design is convenient attractive in appearance.
Description of drawings
Fig. 1 is product the second contact layer partial structurtes synoptic diagram without copper ring double-interface smart card packaging frame method for making.
Fig. 2 is that the product without copper ring double-interface smart card packaging frame method for making connects sectional structure synoptic diagram behind the chip.
Fig. 3 is conventional art double-interface smart card packaging frame product structure the second contact layer partial schematic diagram.
Fig. 4 is that conventional art double-interface smart card packaging frame product connects sectional structure synoptic diagram behind the chip.
Wherein: 1, basic unit 2, the first contact layer 3, the second contact layer 4, chip 5, conductor wire 6, welding hole 7, welding block 8, copper ring 9, chip bearing face 10, wire.
Fig. 1 ~ 2nd, the present invention is without the most preferred embodiment of copper ring double-interface smart card packaging frame method for making, and the present invention will be further described below in conjunction with accompanying drawing 1 ~ 4.
Embodiment
With reference to accompanying drawing 1 ~ 2: the present invention is without the product of copper ring double-interface smart card packaging frame method for making, comprise basic unit 1, the first contact layer 2, the second contact layer 3, chip 4, conductor wire 5, welding hole 6, welding block 7, chip bearing face 9 and wire 10, described basic unit 1 is the middle layer, the first contact layer 2 and the second contact layer 3 coat respectively the pros and cons of basic unit 1, described welding hole 6 is for penetrating the hole of basic unit 1 and the second contact layer 3, the center cartridge chip 4 of chip bearing face 9 has wire to be connected between the inner face of chip 4 and the first contact layer 2 that stays the welding hole 6 of establishing and each welding block 7; The surface distributed of the second contact layer 3 has welding block 7 and conductor wire 5, and welding block 7 and conductor wire 5 are arranged loose clear, and wire 10 passes chip bearing face 9 is connected with welding hole and connects the first contact layer 2 and chip 4.The edge of the second contact layer chip bearing face 9 and welding hole 6 does not have copper ring, does not connect the conductor wire of copper ring yet, and is simple in structure, very clear.
Below in conjunction with specific embodiment the present invention is described further without copper ring double-interface smart card packaging frame method for making, wherein embodiment 1 is most preferred embodiment.
Embodiment 1
1, punching press: copper face stamps out welding hole to an epoxy resin cloth of wearing copper up;
2, pre-treatment: with hydrogen peroxide and sulfuric acid and copper face effect, but remove copper surface oxide, impurity and etching trace meter copper, the copper face structure is changed, to increase copper face homogeneity, roughness and to increase the copper surfactivity;
3, overlay film: by hot pressing mode Hitachi's dry film is covered on the copper face after the pre-treatment, technological parameter: heat pressing wheel temperature: 110 ℃, heat pressing wheel pressure: 0.13Mpa press dry film speed: 4.5m/min;
4, exposure: the copper face side behind the upper dry film makes dry film photoresist accept UV-irradiation, light trigger is decomposed into free radical, excite monomer to produce polyreaction formation macromolecular compound figure is shifted on copper face, technological parameter: 41 lattice exposure guide rule lattice numbers are 22 lattice;
5, develop: the alkalescent of utilizing sodium carbonate liquor with on the dry film without being partly dissolved of ultraviolet radiation, ultraviolet radiation and part that fusion reaction occurs can keep technological parameter: temperature: 30 ℃, Na
2CO
3Solution concentration: 10 g/L, liquid medicine spray pressure: 0.16Mpa, washing pressure: 0.16Mpa, baking temperature: 65 ℃, transfer rate 4m/min;
6, etching: fall the copper face of not protected by dry film with the acidic copper chloride dissolved corrosion;
7, copper-surfaced paper tinsel: with one Copper Foil and expoxy glass cloth cover being fitted tightly without the pressure of copper face recycling heat pressing wheel and the viscosity of epoxy resin of epoxy cloth of wearing copper; Process conditions: heat pressing wheel pressure: 0.2Mpa, tension force: 1000, the heat pressing wheel temperature: 140 ℃, speed: 3m/min;
8, oven dry: new copper-surfaced paper tinsel is carried out heat treated, thereby make epoxy cure that Copper Foil and epoxy glass fabric are fit together better more closely; Again the one side of new copper-surfaced paper tinsel is carried out described pre-treatment, upper dry film, exposure, development, etched processing;
9, surface treatment: electroplating processes is all carried out on the two sides, and the plated with gold layer covers copper face, the protection copper face.
Product the second contact layer chip bearing face and welding hole edge are without copper ring, and it is clear that the residue conductor wire is arranged, and add up eight months in the batch production without the waste product that causes because of short circuit problem.
Embodiment 2
1, punching press: copper face is up to an epoxy cloth punching press of wearing copper;
2, pre-treatment: with the volcanics powder with high pressure spray to copper face, make the copper face alligatoring, remove oxide, grease and the impurity of copper face side, the cleaning and alligatoring plate face;
3, overlay film: by hot pressing mode Hitachi's dry film photoresist is covered on the copper face after the pre-treatment, technological parameter: heat pressing wheel temperature: 120 ℃, heat pressing wheel pressure: 0.1Mpa press dry film speed: 4m/min;
4, exposure: the copper face side behind the upper dry film makes dry film photoresist accept UV-irradiation, and light trigger is decomposed into free radical, excites monomer to produce polyreaction formation macromolecular compound figure is shifted on copper face, and technological parameter: 41 lattice exposure guide rules are 12 lattice;
5, develop: the alkalescent of utilizing sodium carbonate liquor with on the dry film without being partly dissolved of ultraviolet radiation, ultraviolet radiation and part that fusion reaction occurs can keep technological parameter: temperature: 35 ℃, Na
2CO
3Solution concentration: 12 g/L, liquid medicine spray pressure: 0.17Mpa, washing pressure: 0.17Mpa, baking temperature: 70 ℃, transfer rate 5m/min;
6, etching: fall the copper face of not protected by dry film with the acidic copper chloride dissolved corrosion;
7, copper-surfaced paper tinsel: with one Copper Foil and expoxy glass cloth cover being fitted tightly without the pressure of copper face recycling heat pressing wheel and the viscosity of epoxy resin of epoxy cloth of wearing copper; Process conditions: heat pressing wheel pressure: 0.25Mpa, tension force: 1200, the heat pressing wheel temperature: 150 ℃, speed: 5.0m/min;
8, oven dry: new copper-surfaced paper tinsel is carried out heat treated, thereby make epoxy cure that Copper Foil and epoxy glass fabric are fit together better more closely; Again the one side of new copper-surfaced paper tinsel is carried out described pre-treatment, upper dry film, exposure, development, etched processing;
9, surface treatment: electroplating processes is all carried out on the two sides, plate platinum layer and cover copper face, the protection copper face.
Product the second contact layer chip bearing face and welding hole edge are without copper ring, and it is clear that the residue conductor wire is arranged, and add up eight months in the batch production without the waste product that causes because of short circuit problem.
Embodiment 3
1, punching press: copper face is up to an epoxy cloth punching press of wearing copper;
2, pre-treatment: with the volcanics powder with high pressure spray to copper face, make the copper face alligatoring, remove oxide, grease and the impurity of copper face side, the cleaning and alligatoring plate face;
3, overlay film: by hot pressing mode Hitachi's dry film photoresist is covered on the copper face after the pre-treatment, technological parameter: heat pressing wheel temperature: 100 ℃, heat pressing wheel pressure: 0.3Mpa press dry film speed: 7m/min;
4, exposure: the copper face side behind the upper dry film makes dry film photoresist accept UV-irradiation, light trigger is decomposed into free radical, excite monomer to produce polyreaction formation macromolecular compound figure is shifted on copper face, technological parameter: 21 lattice exposure guide rule lattice numbers are 15 lattice;
5, develop: the alkalescent of utilizing sodium carbonate liquor with on the dry film without being partly dissolved of ultraviolet radiation, ultraviolet radiation and part that fusion reaction occurs can keep technological parameter: temperature: 25 ℃, Na
2CO
3Solution concentration: 8 g/L, liquid medicine spray pressure: 0.14Mpa, washing pressure: 0.14Mpa, baking temperature: 60 ℃, transfer rate 3m/min;
6, etching: fall the copper face of not protected by dry film with alkaline cupric chloride dissolved corrosion;
7, copper-surfaced paper tinsel: with one Copper Foil and expoxy glass cloth cover being fitted tightly without the pressure of copper face recycling heat pressing wheel and the viscosity of epoxy resin of epoxy cloth of wearing copper; Process conditions: heat pressing wheel pressure: 0.15Mpa, tension force: 900, the heat pressing wheel temperature: 130 ℃, speed: 7m/min;
8, oven dry: new copper-surfaced paper tinsel is carried out heat treated, thereby make epoxy cure that Copper Foil and epoxy glass fabric are fit together better more closely; Again the one side of new copper-surfaced paper tinsel is carried out described pre-treatment, upper dry film, exposure, development, etched processing;
9, surface treatment: electroplating processes is all carried out on the two sides, and the plated with gold layer covers copper face, the protection copper face.
Product the second contact layer chip bearing face and welding hole edge are without copper ring, and it is clear that the residue conductor wire is arranged, and add up eight months in the batch production without the waste product that causes because of short circuit problem.
Embodiment 4
1, punching press: copper face is up to an epoxy cloth punching press of wearing copper;
2, pre-treatment: with the volcanics powder with high pressure spray to copper face, make the copper face alligatoring, remove oxide, grease and the impurity of copper face side, the cleaning and alligatoring plate face;
3, overlay film: by hot pressing mode Hitachi's dry film photoresist is covered on the copper face after the pre-treatment, technological parameter: heat pressing wheel temperature: 80 ℃, heat pressing wheel pressure: 0.1Mpa press dry film speed: 1m/min;
4, exposure: the copper face side behind the upper dry film makes dry film photoresist accept UV-irradiation, and light trigger is decomposed into free radical, excites monomer to produce polyreaction formation macromolecular compound figure is shifted on copper face, and technological parameter: 21 lattice exposure guide rule lattice numbers are 6 lattice;
5, develop: the alkalescent of utilizing sodium carbonate liquor with on the dry film without being partly dissolved of ultraviolet radiation, ultraviolet radiation and part that fusion reaction occurs can keep technological parameter: temperature: 20 ℃, Na
2CO
3Solution concentration: 15 g/L, liquid medicine spray pressure: 0.2Mpa, washing pressure: 0.2Mpa, baking temperature: 30 ℃, transfer rate 1m/min;
6, etching: fall the copper face of not protected by dry film with the acidic copper chloride dissolved corrosion;
7, copper-surfaced paper tinsel: with one Copper Foil and expoxy glass cloth cover being fitted tightly without the pressure of copper face recycling heat pressing wheel and the viscosity of epoxy resin of epoxy cloth of wearing copper; Process conditions: heat pressing wheel pressure: 0.1Mpa, tension force: 100, the heat pressing wheel temperature: 80 ℃, speed: 0.5m/min;
8, oven dry: new copper-surfaced paper tinsel is carried out heat treated, thereby make epoxy cure that Copper Foil and epoxy glass fabric are fit together better more closely; Again the one side of new copper-surfaced paper tinsel is carried out described pre-treatment, upper dry film, exposure, development, etched processing;
9, surface treatment: electroplating processes is all carried out on the two sides, and the plated with gold layer covers copper face, the protection copper face.
Product the second contact layer chip bearing face and welding hole edge are without copper ring, and it is clear that the residue conductor wire is arranged, and add up eight months in the batch production without the waste product that causes because of short circuit problem.
1, punching press: copper face is up to an epoxy cloth punching press of wearing copper;
2, pre-treatment: with the volcanics powder with high pressure spray to copper face, make the copper face alligatoring, remove oxide, grease and the impurity of copper face side, the cleaning and alligatoring plate face;
3, overlay film: by hot pressing mode Hitachi's dry film photoresist is covered on the copper face after the pre-treatment, technological parameter: heat pressing wheel temperature: 150 ℃, heat pressing wheel pressure: 0.5Mpa press dry film speed: 10m/min;
4, exposure: the copper face side behind the upper dry film makes dry film photoresist accept UV-irradiation, and light trigger is decomposed into free radical, excites monomer to produce polyreaction formation macromolecular compound figure is shifted on copper face, and technological parameter: 41 lattice exposure guide rules are 30 lattice;
5, develop: the alkalescent of utilizing sodium carbonate liquor with on the dry film without being partly dissolved of ultraviolet radiation, ultraviolet radiation and part that fusion reaction occurs can keep technological parameter: temperature: 60 ℃, Na
2CO
3Solution concentration: 5 g/L, liquid medicine spray pressure: 0.1Mpa, washing pressure: 0.1Mpa, baking temperature: 100 ℃, transfer rate 10m/min;
6, etching: fall the copper face of not protected by dry film with the iron chloride dissolved corrosion;
[0040]7, copper-surfaced paper tinsel: with one Copper Foil and expoxy glass cloth cover being fitted tightly without the pressure of copper face recycling heat pressing wheel and the viscosity of epoxy resin of epoxy cloth of wearing copper; Process conditions: heat pressing wheel pressure: 0.3Mpa, tension force: 2000, the heat pressing wheel temperature: 200 ℃, speed: 10m/min;
8, oven dry: new copper-surfaced paper tinsel is carried out heat treated, thereby make epoxy cure that Copper Foil and epoxy glass fabric are fit together better more closely; Again the one side of new copper-surfaced paper tinsel is carried out described pre-treatment, upper dry film, exposure, development, etched processing;
9, surface treatment: electroplating processes is all carried out on the two sides, and the plated with gold layer covers copper face, the protection copper face.
Product the second contact layer chip bearing face and welding hole edge are without copper ring, and it is clear that the residue conductor wire is arranged, and add up eight months in the batch production without the waste product that causes because of short circuit problem.
The above only is preferred embodiment of the present invention, is not to be the restriction of the present invention being made other form, and any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solution of the present invention content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment does, still belongs to the protection domain of technical solution of the present invention according to technical spirit of the present invention.
Claims (5)
1. without copper ring double-interface smart card packaging frame method for making, it is characterized in that:
At first, the epoxy resin cloth of copper is worn in employing one, produces the second contact layer (3) through punching press, pre-treatment, overlay film, exposure, development, etching;
Producing the first contact layer (2) without copper-clad surface copper-surfaced paper tinsel, oven dry, pre-treatment, overlay film, exposure, development, etching again;
Then, the first contact layer (2) and the second contact layer (3) are carried out surface treatment.
2. according to claim 1 without copper ring double-interface smart card packaging frame method for making, it is characterized in that its concrete steps are:
2.1, punching press: copper face stamps out welding hole (6) to an epoxy resin cloth of wearing copper up;
2.2, pre-treatment: remove oxide, grease and the impurity on copper surface, the cleaning and the alligatoring copper face;
2.3, overlay film: the sense film resist is covered on the copper face after the pre-treatment;
2.4, exposure: the copper face behind the overlay film makes the sense film resist accept UV-irradiation, makes the light trigger in it be decomposed into free radical, excites monomer to produce polyreaction and forms macromolecular compound figure is shifted on copper face;
2.5, develop: the alkalescent of utilizing sodium carbonate liquor with on the sense film without being partly dissolved of ultraviolet radiation, keep the part that fusion reaction occurs through ultraviolet radiation, technological parameter: temperature: 20 ~ 60 ℃, Na
2CO
3Solution concentration: 5 ~ 15 g/L, liquid medicine spray pressure: 0.1 ~ 0.2Mpa, washing pressure: 0.1 ~ 0.2Mpa, baking temperature: 30 ~ 100 ℃, transfer rate 1 ~ 10m/min;
2.6, etching: copper face is contacted the moulding of chemical solution hollow out, produces the second contact layer (3);
2.7, the copper-surfaced paper tinsel: with Copper Foil and epoxy resin cloth cover being fitted tightly without the pressure of copper face recycling heat pressing wheel and the viscosity of epoxy resin of epoxy resin cloth of wearing copper; Process conditions: heat pressing wheel pressure: 0.1 ~ 0.3Mpa, tension force: 100 ~ 2000, the heat pressing wheel temperature: 80 ~ 200 ℃, speed: 0.5 ~ 10m/min;
2.8, the oven dry: new copper-surfaced paper tinsel is carried out heat treated, makes Copper Foil and epoxy resin cloth carry out secondary and fit tightly; Again the one side of new copper-surfaced paper tinsel is carried out described pre-treatment, overlay film, exposure, development, etched processing, produce the first contact layer (2);
2.9, surface treatment: electroplating processes is carried out on the surface to the first contact layer and the second contact layer, plates inert metal and covers copper face, the protection copper face.
3. according to claim 2 without copper ring double-interface smart card packaging frame method for making, it is characterized in that: described step 2.3 overlay film is for pasting dry film.
4. according to claim 2 without copper ring double-interface smart card packaging frame method for making, it is characterized in that: the technological parameter that described step 2.5 is developed: temperature: 25 ~ 35 ℃, Na
2CO
3Solution concentration: 8 ~ 12 g/L, liquid medicine spray pressure: 0.14 ~ 0.17Mpa, washing pressure: 0.14 ~ 0.17Mpa, baking temperature: 60 ~ 70 ℃, transfer rate 3 ~ 5m/min.
5. according to claim 2 without copper ring double-interface smart card packaging frame method for making, it is characterized in that: the technological parameter of described step 2.7 copper-surfaced paper tinsel: heat pressing wheel pressure: 0.15 ~ 0.25Mpa, tension force: 900 ~ 1200, the heat pressing wheel temperature: 130 ~ 150 ℃, speed: 5.0 ~ 7.0m/min.
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| CN201210508094.4A CN102999778B (en) | 2012-12-03 | 2012-12-03 | Without copper ring double-interface smart card packaging frame method for making |
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| US9583459B2 (en) | 2013-05-30 | 2017-02-28 | Linxens Holding | Method for producing a printed circuit, printed circuit obtained by this method and electronic module comprising such a printed circuit |
| CN108399449A (en) * | 2018-04-28 | 2018-08-14 | 山东新恒汇电子科技有限公司 | A kind of Dual-interface smart card carrier tape module and manufacturing method |
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| Publication number | Publication date |
|---|---|
| CN102999778B (en) | 2015-08-26 |
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