CN102738056A - Push rod-type wafer clamping device which extends with cylinder - Google Patents
Push rod-type wafer clamping device which extends with cylinder Download PDFInfo
- Publication number
- CN102738056A CN102738056A CN2012102222159A CN201210222215A CN102738056A CN 102738056 A CN102738056 A CN 102738056A CN 2012102222159 A CN2012102222159 A CN 2012102222159A CN 201210222215 A CN201210222215 A CN 201210222215A CN 102738056 A CN102738056 A CN 102738056A
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- China
- Prior art keywords
- wafer
- push rod
- cylinder
- clamping device
- fixed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The invention relates to a push rod-type wafer clamping device which extends with a cylinder, and the push rod-type wafer clamping device is mainly used in semi-conductor wafer processing equipment. The device comprises a film V-shaped tray; both sides of the front end of the tray are respectively provided with a fixed element; four raised support elements are arranged on the tray, the four raised support elements are arranged on a circumference which is concentric with a wafer, and the connecting line of two diagonal raised support elements penetrates through the circle center of the wafer; the tail end of the tray is provided with a pneumatic device, and the pneumatic device is connected with one end of a push rod; the other end of the push rod is connected with an elastic element; fixed pieces are symmetrically arranged on both sides of the elastic element; and each fixed piece is provided with a movable clamp. According to the device, a wafer is clamped between the fixed elements and the movable clamp, so that the degree of freedom of the wafer is limited in horizontal and vertical directions. The device can transmit wafers with different diameters, and solves the problem of the single size of the transmitted wafer, the flexibility of the device is improved, and the wafer is prevented from being damaged due to the deviation of a moving distance during a wafer transmission process.
Description
Technical field
The present invention relates to a kind of wafer clamping device, be mainly used in the semiconductor crystal wafer process equipment.
Background technology
In semiconductor fabrication, like the cleaning of wafer, polishing etc., between film magazine-film magazine, film magazine-chamber, there are a large amount of transmission that wafer is carried out, therefore designing a kind of clamping device of wafer safely and effectively is one of focus of semicon industry research.
Summary of the invention
The present invention proposes a kind of flexible push-down wafer clamping device of cylinder that utilizes, and purpose is to provide a kind of and can and receive the wafer clamping device of diameter wafer size restrictions along any direction safe transmission.
Technical scheme of the present invention is following:
A kind of flexible push-down wafer clamping device of cylinder that utilizes; It is characterized in that: this clamping device contains a thin slice V-type pallet; The both sides of V-type pallet front end are respectively equipped with a retaining element; This retaining element is thick up and down middle thin cydariform, and its bus is formed by the straightway and the arc section smooth transition that tilt; On thin slice V-type pallet, be provided with four protruding support components, these four protruding support components be positioned at the concentric circumference of wafer on, and the line of two protruding support components at diagonal angle is through the wafer center of circle; Thin slice V-type pallet end is equipped with a pneumatic means, and this pneumatic means comprises cylinder, push rod and guide vane end stop; Cylinder is fixed on the thin slice V-type pallet, and guide vane end stop is fixed on the cylinder, is used to limit the displacement of push rod; Push rod one end is connected with flexible member, and the other end is connected with pneumatic means, makes push rod drive flexible member and moves along horizontal linear; The flexible member bilateral symmetry is furnished with fixture; Each fixture is provided with a removable clip identical with the retaining element shape.
The present invention since limited wafer in the horizontal direction with the degree of freedom of vertical direction, can be along any direction safe transmission; Adopt flexible member to increase the flexibility of device, wafer is damaged, protruding strutting piece position can be adjusted, and does not receive the restriction of wafer size, has solved to transmit the single problem of wafer size.
Description of drawings
Fig. 1 is the vertical view of wafer clamping device.
Fig. 2 is the end view of wafer clamping device shown in Figure 1.
Fig. 3 is movable fixture and cylinder portion enlarged drawing.
Fig. 4 is the end view of movable fixture.
Fig. 5 is that retaining element is under release condition and the enlarged drawing that concerns between the wafer.
Fig. 6 is that retaining element is under stationary state and the enlarged drawing that concerns between the wafer.
Fig. 7 is that removable clip concerns enlarged drawing under release condition and between the wafer.
Fig. 8 is that removable clip concerns enlarged drawing under stationary state and between the wafer.
Fig. 9 is the movable fixture enlarged drawing under the wafer release condition.
Figure 10 is the enlarged drawing when flexible member deforms under the wafer stationary state.
Figure 11 is retaining element, mobile clip, the protruding triangular height relationships figure of support.
Figure 12 is the fixed element size graph of a relation.
Among the figure:
100-wafer clamping device; 101-thin slice V-type pallet; The 102-retaining element; 102a-angled straight lines section; The 102b-arc section; The protruding strutting piece of 103-; The 104-screwed hole; The removable clip of 105-; The 106-securing supports; The 107-slide block; The 108-flexible member; The 109-wafer; The 200-pneumatic means; The 201-push rod; The 202-cylinder.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present invention is described in further detail.
Fig. 1 is the vertical view of wafer clamping device 100 among the present invention.Fig. 2 is the end view of wafer clamping device 100 among Fig. 1.
This clamping device contains a thin slice V-type pallet 101, and the both sides of V-type pallet front end are respectively equipped with a retaining element 102, and this retaining element is thick up and down middle thin cydariform, and its bus is formed by angled straight lines section 102a and arc section 102b smooth transition; On thin slice V-type pallet, be provided with four protruding support components 103, these four protruding support components 103 be positioned at the concentric circumference of wafer on, and the line of two protruding support components 103 at diagonal angle is through the wafer center of circle; Thin slice V-type pallet 101 ends are equipped with a pneumatic means 200, and this pneumatic means comprises cylinder 202, push rod 201 and guide vane end stop 203; Cylinder 202 is fixed on the thin slice V-type pallet 101, and guide vane end stop 203 is fixed on the cylinder 202, is used to limit the displacement of push rod; Push rod one end is connected with flexible member 108, and the other end is connected with pneumatic means, makes push rod drive flexible member and moves along horizontal linear; Flexible member 108 bilateral symmetry are furnished with fixture 106; Each fixture is provided with a removable clip 105 identical with the shape of retaining element.The terminal position of thin slice V-type pallet, both sides have screwed hole 104 respectively, and the quantity of every side screwed hole 104 can be 2-3.
Protruding strutting piece 103 is to be threaded with pallet 101.103 upper surface 103a are the plane, and when pallet 101 held up wafer 109, face 103a contacted with wafer 109 bottom surfaces, the support that realized wafer 109 by four convexities 103 this moment.
Like Fig. 3, shown in Figure 4, movable fixture comprises removable clip 105, strutting piece 106, slide block 107, flexible member 108.Removable clip is fixed on the below of strutting piece 106, and removable clip is the thick middle thinner drum types in two ends.Flexible member 108 1 ends are connected with strutting piece 106, and the other end is connected with slide block 107.
Movable fixture should have two removable clips 105 and strutting piece 106, and makes its relative slide block 107 symmetric arrangement.Utilize and wafer 109 EDGE CONTACT like this at 2, can play the effect of adjustment wafer 109 centers.
As shown in Figure 3,200 is pneumatic means, and pneumatic means is fixed on pallet 101 ends.Pneumatic means is connected with outside performance element, operates on it through external command.Slide block 107 is fixedly connected with push rod 201.Push rod 201 can move forward and backward under the effect of cylinder, and then drives 105,106,107 and 108 and move forward and backward together.
At first, when holding up wafer 109, wafer 109 bottom surfaces contact with the protruding 103 upper surface 103a that support, and wafer 109 is only supported by 4 convexities 103.The instruction that cylinder 200 is carried out control unit is operated.Do the time spent when cylinder 200, push rod 201 moves forward, and drives slide block 107 simultaneously and moves forward.Through flexible member 108 and strutting piece 106, slide block 107 drives removable clip 105 and moves forward.When the inclined side 105b of removable clip and wafer 109 EDGE CONTACT, under the constraint of 105b, wafer 109 is pushed together and moves forward.
Like Fig. 6, shown in Figure 8; When wafer 109 is continued to promote forward; Its edge contacts with the angled straight lines section 102a of the retaining element 102 of front end, and wafer is moved up along the inclined side edge of retaining element 102 and removable clip 105, and wafer 109 bottom surfaces are supported 103 upper surface 103a with convexity and separated; Final wafer 109 edges contact with 102b, 105a, are fixed between retaining element 102 and the removable clip 105.This moment, cylinder promoted slide block 107 segment distance that continues to move forward; Shown in figure 10; Make flexible member 108 that strain take place; Make 105 pairs of wafers of clip 109 produce a certain size active force, wafer 109 is fixed between retaining element 102 and the removable clip 105, limited the level of wafer 109 and the degree of freedom of vertical direction simultaneously.
As shown in Figure 3, in cylinder 202, increased guide vane end stop 203, guide vane end stop is fixed on the cylinder through being threaded; Through threaded adjustment guide vane end stop 203; Through the adjustment distance L, can make push rod 201 move different distances, therefore can realize the transmission of different-diameter size wafer 109.
Shown in figure 11; Suppose that the arc edge 102b center of retaining element 102 and the distance of pallet 101 upper surfaces are H1; In order to make wafer 109 in transmission course, keep level; The distance of the arc edge 105a center of removable clip 105 and pallet 101 upper surfaces also should be H1, and the gradient of 102a also should equate with the gradient of 105b simultaneously.。
When wafer 109 was transferred to assigned address, cylinder 200 was carried out external command, and push rod 201 is moved backward.Push rod 201 drives slide block 107 and moves backward; Slide block 107 drives removable clip 105 and moves backward; Wafer 109 edges separate with 102b, 105a, because the effect of gravity, wafer 109 will 102a, the downward landing of 105b along the slope; Wafer 109 bottom surfaces are contacted with 103 upper surface 103a again, support by protruding 103.
Shown in figure 12, when wafer is supported by 103 again, its edge and retaining element 102 EDGE CONTACT.If wafer 109 rigidly connects the edge of wafer 109 when touching with retaining element 102 edges and the distance at retaining element 102 centers is L2, can freely be unloaded for making wafer 109, should make L2>L1.
Wafer transfer robot device in this invention, wafer 109 is fixed by two retaining elements 102 and removable clip 105, limited the level of wafer 109 and the motion of vertical direction simultaneously, so wafer 109 can transmit in any direction.In pallet 101 terminal both sides 2-3 screwed hole arranged respectively,, can transmit the wafer 109 of different-diameter size, make wafer 109 transmitting devices not receive the restriction of wafer 109 sizes through adjusting protruding 103 the position and the displacement of slide block 107 of supporting.
Claims (1)
1. one kind is utilized the flexible push-down wafer clamping device of cylinder; It is characterized in that: this clamping device contains a thin slice V-type pallet (101); The both sides of V-type pallet front end are respectively equipped with a retaining element (102); This retaining element is thick up and down middle thin cydariform, and its bus is formed by the straightway (102a) and arc section (102b) smooth transition that tilt; On thin slice V-type pallet, be provided with four protruding support components (103), these four protruding support components (103) be positioned at the concentric circumference of wafer on, and the line of two protruding support components (103) at diagonal angle is through the wafer center of circle; Thin slice V-type pallet (101) end is equipped with a pneumatic means (200), and this pneumatic means comprises cylinder (202), push rod (201) and guide vane end stop (203); Cylinder (202) is fixed on the thin slice V-type pallet (101), and guide vane end stop (203) is fixed on the cylinder (202), is used to limit the displacement of push rod; Push rod (201) one ends are connected with flexible member (108), and the other end is connected with pneumatic means, make push rod (201) drive flexible member (108) and move along horizontal linear; Flexible member (108) bilateral symmetry is furnished with fixture (106); Each fixture (106) is provided with a removable clip (105) identical with retaining element (102) shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102222159A CN102738056A (en) | 2011-06-28 | 2012-06-28 | Push rod-type wafer clamping device which extends with cylinder |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110176773.1 | 2011-06-28 | ||
| CN201110176773 | 2011-06-28 | ||
| CN2012102222159A CN102738056A (en) | 2011-06-28 | 2012-06-28 | Push rod-type wafer clamping device which extends with cylinder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102738056A true CN102738056A (en) | 2012-10-17 |
Family
ID=46993296
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220308951 Expired - Lifetime CN202712152U (en) | 2011-06-28 | 2012-06-28 | Push rod type wafer clamping device which is retractable through air cylinder |
| CN2012102222159A Pending CN102738056A (en) | 2011-06-28 | 2012-06-28 | Push rod-type wafer clamping device which extends with cylinder |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220308951 Expired - Lifetime CN202712152U (en) | 2011-06-28 | 2012-06-28 | Push rod type wafer clamping device which is retractable through air cylinder |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN202712152U (en) |
| WO (1) | WO2013000423A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107785298A (en) * | 2016-08-25 | 2018-03-09 | 苏州能讯高能半导体有限公司 | The separation equipment and method that wafer is bonded temporarily |
| CN108666258A (en) * | 2017-03-31 | 2018-10-16 | 奇景光电股份有限公司 | Wafer jig and the method that wafer is clamped |
| CN109686696A (en) * | 2018-12-27 | 2019-04-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of chuck assembly |
| CN109865642A (en) * | 2017-12-05 | 2019-06-11 | 株洲中车时代电气股份有限公司 | A kind of chip center's positioning fixture |
| CN111244022A (en) * | 2020-01-22 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Wafer box clamping device and wafer cleaning machine |
| CN111916381A (en) * | 2020-08-24 | 2020-11-10 | 台州市老林装饰有限公司 | Auxiliary material taking mechanism for wafer material placing box |
| CN112992747A (en) * | 2021-02-10 | 2021-06-18 | 江苏亚电科技有限公司 | Wafer cleaning feeding and discharging device |
| EP3893270A1 (en) * | 2020-04-08 | 2021-10-13 | MUETEC Automatisierte Mikroskopie und Messtechnik GmbH | Device and method for removing a framed wafer from a wafer tray |
| CN113764330A (en) * | 2020-06-03 | 2021-12-07 | 中芯北方集成电路制造(北京)有限公司 | Wafer clamping device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202712152U (en) * | 2011-06-28 | 2013-01-30 | 清华大学 | Push rod type wafer clamping device which is retractable through air cylinder |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6216883B1 (en) * | 1998-07-24 | 2001-04-17 | Mitsubishi Denki Kabushiki Kaisha | Wafer holding hand |
| US6540468B1 (en) * | 1998-09-02 | 2003-04-01 | Tec-Sem Ag | Device and method for handling individual wafers |
| US6752585B2 (en) * | 2001-06-13 | 2004-06-22 | Applied Materials Inc | Method and apparatus for transferring a semiconductor substrate |
| JP2006150538A (en) * | 2004-11-30 | 2006-06-15 | Rorze Corp | Holding type conveying device, robot using the same, disk-shaped article working equipment, and disk-shaped article conveying method |
| US20060192400A1 (en) * | 2005-02-25 | 2006-08-31 | Woo-Young Kim | Wafer transfer apparatus |
| CN202712152U (en) * | 2011-06-28 | 2013-01-30 | 清华大学 | Push rod type wafer clamping device which is retractable through air cylinder |
-
2012
- 2012-06-28 CN CN 201220308951 patent/CN202712152U/en not_active Expired - Lifetime
- 2012-06-28 WO PCT/CN2012/077772 patent/WO2013000423A1/en active Application Filing
- 2012-06-28 CN CN2012102222159A patent/CN102738056A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6216883B1 (en) * | 1998-07-24 | 2001-04-17 | Mitsubishi Denki Kabushiki Kaisha | Wafer holding hand |
| US6540468B1 (en) * | 1998-09-02 | 2003-04-01 | Tec-Sem Ag | Device and method for handling individual wafers |
| US6752585B2 (en) * | 2001-06-13 | 2004-06-22 | Applied Materials Inc | Method and apparatus for transferring a semiconductor substrate |
| JP2006150538A (en) * | 2004-11-30 | 2006-06-15 | Rorze Corp | Holding type conveying device, robot using the same, disk-shaped article working equipment, and disk-shaped article conveying method |
| US20060192400A1 (en) * | 2005-02-25 | 2006-08-31 | Woo-Young Kim | Wafer transfer apparatus |
| CN202712152U (en) * | 2011-06-28 | 2013-01-30 | 清华大学 | Push rod type wafer clamping device which is retractable through air cylinder |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107785298A (en) * | 2016-08-25 | 2018-03-09 | 苏州能讯高能半导体有限公司 | The separation equipment and method that wafer is bonded temporarily |
| CN107785298B (en) * | 2016-08-25 | 2021-02-02 | 苏州能讯高能半导体有限公司 | Separation equipment and method for wafer temporary bonding |
| CN108666258A (en) * | 2017-03-31 | 2018-10-16 | 奇景光电股份有限公司 | Wafer jig and the method that wafer is clamped |
| CN109865642A (en) * | 2017-12-05 | 2019-06-11 | 株洲中车时代电气股份有限公司 | A kind of chip center's positioning fixture |
| CN109865642B (en) * | 2017-12-05 | 2021-05-14 | 株洲中车时代半导体有限公司 | Chip center positioning clamp |
| CN109686696A (en) * | 2018-12-27 | 2019-04-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of chuck assembly |
| CN111244022A (en) * | 2020-01-22 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Wafer box clamping device and wafer cleaning machine |
| CN111244022B (en) * | 2020-01-22 | 2023-02-10 | 北京北方华创微电子装备有限公司 | Wafer box clamping device and wafer cleaning machine |
| EP3893270A1 (en) * | 2020-04-08 | 2021-10-13 | MUETEC Automatisierte Mikroskopie und Messtechnik GmbH | Device and method for removing a framed wafer from a wafer tray |
| US11443974B2 (en) | 2020-04-08 | 2022-09-13 | Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh | Device and method for removing a framed wafer from a wafer tray |
| CN113764330A (en) * | 2020-06-03 | 2021-12-07 | 中芯北方集成电路制造(北京)有限公司 | Wafer clamping device |
| CN111916381A (en) * | 2020-08-24 | 2020-11-10 | 台州市老林装饰有限公司 | Auxiliary material taking mechanism for wafer material placing box |
| CN112992747A (en) * | 2021-02-10 | 2021-06-18 | 江苏亚电科技有限公司 | Wafer cleaning feeding and discharging device |
| CN112992747B (en) * | 2021-02-10 | 2022-01-25 | 江苏亚电科技有限公司 | Wafer cleaning feeding and discharging device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013000423A1 (en) | 2013-01-03 |
| CN202712152U (en) | 2013-01-30 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121017 |