CN102569227A - Integrated circuit radiating system and manufacturing method thereof - Google Patents
Integrated circuit radiating system and manufacturing method thereof Download PDFInfo
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- CN102569227A CN102569227A CN2010106066273A CN201010606627A CN102569227A CN 102569227 A CN102569227 A CN 102569227A CN 2010106066273 A CN2010106066273 A CN 2010106066273A CN 201010606627 A CN201010606627 A CN 201010606627A CN 102569227 A CN102569227 A CN 102569227A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010606627.3A CN102569227B (en) | 2010-12-24 | 2010-12-24 | Integrated circuit radiating system and manufacturing method thereof |
Applications Claiming Priority (1)
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CN201010606627.3A CN102569227B (en) | 2010-12-24 | 2010-12-24 | Integrated circuit radiating system and manufacturing method thereof |
Publications (2)
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CN102569227A true CN102569227A (en) | 2012-07-11 |
CN102569227B CN102569227B (en) | 2015-05-20 |
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CN201010606627.3A Active CN102569227B (en) | 2010-12-24 | 2010-12-24 | Integrated circuit radiating system and manufacturing method thereof |
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CN (1) | CN102569227B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104201157A (en) * | 2014-08-08 | 2014-12-10 | 武汉新芯集成电路制造有限公司 | Semiconductor cooling structure and method in hybrid bonding process |
CN109060865A (en) * | 2018-07-26 | 2018-12-21 | 桂林电子科技大学 | A kind of experimental provision of equivalent heat source |
CN113192915A (en) * | 2021-04-26 | 2021-07-30 | 武汉新芯集成电路制造有限公司 | Three-dimensional integrated circuit module and manufacturing method |
CN115084059A (en) * | 2022-08-16 | 2022-09-20 | 杭州飞仕得科技有限公司 | Preparation method of insulating substrate and power device packaging method |
CN116153883A (en) * | 2023-04-10 | 2023-05-23 | 广东仁懋电子有限公司 | IGBT packaging method and IGBT packaging structure |
CN116368614A (en) * | 2020-09-24 | 2023-06-30 | Hrl实验室有限责任公司 | Wafer level integrated microstructured heat spreader |
CN116368614B (en) * | 2020-09-24 | 2024-05-03 | Hrl实验室有限责任公司 | Wafer level integrated microstructured heat spreader |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050263911A1 (en) * | 2004-05-31 | 2005-12-01 | Yusuke Igarashi | Circuit device and manufacturing method thereof |
US7138064B2 (en) * | 2002-02-15 | 2006-11-21 | Nec Electronics Corporation | Semiconductor device and method of manufacturing the same |
CN1925155A (en) * | 2005-09-02 | 2007-03-07 | 株式会社半导体能源研究所 | Integrated circuit device |
CN101477971A (en) * | 2007-12-31 | 2009-07-08 | 联发科技股份有限公司 | Semiconductor chip and its production method |
CN201490184U (en) * | 2009-06-22 | 2010-05-26 | 党兵 | Integrated circuit chip with microfluid cooling channel and encapsulating structure thereof |
-
2010
- 2010-12-24 CN CN201010606627.3A patent/CN102569227B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7138064B2 (en) * | 2002-02-15 | 2006-11-21 | Nec Electronics Corporation | Semiconductor device and method of manufacturing the same |
US20050263911A1 (en) * | 2004-05-31 | 2005-12-01 | Yusuke Igarashi | Circuit device and manufacturing method thereof |
CN1925155A (en) * | 2005-09-02 | 2007-03-07 | 株式会社半导体能源研究所 | Integrated circuit device |
CN101477971A (en) * | 2007-12-31 | 2009-07-08 | 联发科技股份有限公司 | Semiconductor chip and its production method |
CN201490184U (en) * | 2009-06-22 | 2010-05-26 | 党兵 | Integrated circuit chip with microfluid cooling channel and encapsulating structure thereof |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104201157A (en) * | 2014-08-08 | 2014-12-10 | 武汉新芯集成电路制造有限公司 | Semiconductor cooling structure and method in hybrid bonding process |
CN104201157B (en) * | 2014-08-08 | 2017-12-19 | 武汉新芯集成电路制造有限公司 | Semiconductor heat-dissipating structures and methods in hybrid bonded technique |
CN109060865A (en) * | 2018-07-26 | 2018-12-21 | 桂林电子科技大学 | A kind of experimental provision of equivalent heat source |
CN116368614A (en) * | 2020-09-24 | 2023-06-30 | Hrl实验室有限责任公司 | Wafer level integrated microstructured heat spreader |
CN116368614B (en) * | 2020-09-24 | 2024-05-03 | Hrl实验室有限责任公司 | Wafer level integrated microstructured heat spreader |
CN113192915A (en) * | 2021-04-26 | 2021-07-30 | 武汉新芯集成电路制造有限公司 | Three-dimensional integrated circuit module and manufacturing method |
CN113192915B (en) * | 2021-04-26 | 2024-02-27 | 武汉新芯集成电路制造有限公司 | Three-dimensional integrated circuit module and manufacturing method |
CN115084059A (en) * | 2022-08-16 | 2022-09-20 | 杭州飞仕得科技有限公司 | Preparation method of insulating substrate and power device packaging method |
CN115084059B (en) * | 2022-08-16 | 2022-12-02 | 杭州飞仕得科技有限公司 | Preparation method of insulating substrate and power device packaging method |
CN116153883A (en) * | 2023-04-10 | 2023-05-23 | 广东仁懋电子有限公司 | IGBT packaging method and IGBT packaging structure |
CN116153883B (en) * | 2023-04-10 | 2023-07-07 | 广东仁懋电子有限公司 | IGBT packaging method and IGBT packaging structure |
Also Published As
Publication number | Publication date |
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CN102569227B (en) | 2015-05-20 |
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Owner name: NATIONAL CENTER FOR ADVANCED PACKAGING Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20150227 |
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Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 214135 WUXI, JIANGSU PROVINCE |
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Effective date of registration: 20150227 Address after: Taihu international science and Technology Park in Jiangsu province Wuxi City Linghu road 214135 Wuxi national hi tech Industrial Development Zone No. 200 Chinese Sensor Network International Innovation Park building D1 Applicant after: National Center for Advanced Packaging Co., Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Institute of Microelectronics Applicant before: Institute of Microelectronics, Chinese Academy of Sciences |
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Effective date of registration: 20170825 Address after: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee after: Shanghai State Intellectual Property Services Co., Ltd. Address before: Taihu international science and Technology Park in Jiangsu province Wuxi City Linghu road 214135 Wuxi national hi tech Industrial Development Zone No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co., Ltd. |
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Effective date of registration: 20191204 Address after: 214028 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co., Ltd. Address before: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee before: Shanghai State Intellectual Property Services Co., Ltd. |