CN102551733B - Heat conduction device and non-invasive blood glucose detector probe with same - Google Patents
Heat conduction device and non-invasive blood glucose detector probe with same Download PDFInfo
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- CN102551733B CN102551733B CN 201210027536 CN201210027536A CN102551733B CN 102551733 B CN102551733 B CN 102551733B CN 201210027536 CN201210027536 CN 201210027536 CN 201210027536 A CN201210027536 A CN 201210027536A CN 102551733 B CN102551733 B CN 102551733B
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Abstract
The invention discloses a heat conduction device, which comprises a lower contactor, a lower conductor seat plate, a radiating fin, a base circuit board, compression springs, screws and a heat transfer bar. The lower contactor is provided with an upper contact square hole and arranged on the upper portion of the lower contactor seat plate; lower contactor seat plate fixing column thin ends are disposed on lower portions of seat plate fixing columns at the bottom of the lower contactor seat plate, and a lower contactor seat plate square hole is arranged in the middle of the lower contactor seat plate; the radiating fin is provided with radiating fin round holes, and a radiating fin square hole is arranged in the middle of the radiating fin; the lower contactor seat plate fixing column thin end successively penetrates through the radiating fin round holes, round holes of the base circuit board and the compression springs from top to bottom, and the screws are disposed on lower portions of the compression springs and fixed at bottoms of the lower contactor seat plate fixing column thin ends; and the heat transfer bar is a cross-shaped structure, the lower portion of the heat transfer bar penetrates through a base circuit board square hole and then is fixed on the base circuit board square hole, and the upper portion of the heat transfer bar successively penetrates through the radiating fin square hole, the lower contactor seat plate square hole and the upper contactor square hole. The invention further discloses a non-invasive blood glucose detector probe with the heat conduction device.
Description
Technical field
The present invention relates to a kind of non-invasive blood-sugar detecting instrument probe, particularly relate to a kind of heat conducting device and non-invasive blood-sugar detecting instrument thereof probe.
Background technology
Diabetes are a kind of endocrine diseases, and its treatment does not also have the method for radical cure at present to monitor, to control blood sugar level continually.Have and earn the traditional method that the blood measurement method is measuring blood, this method is not only brought wound and the pain sensation to the patient in measuring process, and is not easy to realize successional detection.The Woundless blood sugar detection technique has overcome the shortcoming of traditional detection method, can satisfy the demand that the diabetes patient in real time, frequently monitors blood sugar concentration effectively, is the direction of blood sugar test technical development.The Woundless blood sugar detection method mainly concentrates on the optical detection field, because interference component is many, individual variation is big, most of detection method still is in the laboratory research stage.
O.K.CHO (US.Pat.NO.5975305 and US.Pat.NO.20060094941 etc.) has realized a kind of heat based on metabolic rate heat integration method-optics Woundless blood sugar detection method.Suppose the energy that the origin of heat in the body discharges in metabolism, and the main energy sources material of metabolism is saccharide, most histiocytes produce and obtain energy by the aerobic oxidation process of glucose.Because under poised state, (static state) quantity of heat production and heat dissipation capacity numerically equal just can be estimated blood glucose value by measuring blood oxygen total amount and heat dissipation capacity so.O.K.CHO has only considered convection current and conduction heat and heat loss through radiation when measuring heat dissipation capacity.The non-invasive blood sugar instrument NBM-200G of OrSense company invention adopts the infrared transmission method below the 1000nm to record blood glucose value under the static state of blood, and it is the unique certified product with NIR (infrared ray) measuring blood.David Freger (US.Pat.NO.20050043602) merges three kinds of Woundless blood sugar measuring technologies, has improved the blood glucose measurement precision.But because the diversity between the human body individuality, the pressure that is subjected to of the finger of different people in measuring probe does not wait, and has influenced the collection of the physiological parameter (routine blood flow rate, heat) of finger, thereby has caused measurement error.
Summary of the invention
Technical problem solved by the invention provides a kind of heat conducting device, can eliminate the measurement error that causes owing to finger pressure discomfort in the probe, improves the certainty of measurement of blood glucose.
Technical scheme of the present invention is as follows:
A kind of heat conducting device comprises down contacting, contact down seat board, fin, base circuit plate, compression spring, screw and heat conductive bar; Described contact down has the contact square hole, and described contact down is arranged on the described top of contact seat board down; The bottom of the described seat board of contact down is provided with the seat board fixed leg, and contact seat board fixed leg is carefully held under being provided with in described seat board fixed leg bottom, and the middle part of the described seat board of contact down has down contact seat board square hole; Described fin has the fin circular hole, and the middle part has the fin square hole; The thin end of the described seat board of contact down fixed leg passes described fin circular hole, base circuit plate circular hole and compression spring from top to down successively, is provided with screw in the bottom of described compression spring, and described screw is fixed on the bottom of the thin end of described contact seat board fixed leg down; Described heat conductive bar is decussate texture, and the bottom of described heat conductive bar is passed and is fixed on the described base circuit plate square hole, the top of described heat conductive bar pass successively described fin square hole, down contact the seat board square hole with on contact square hole.
Further: when described heat conductive bar was under pressure, described heat conductive bar drove described base circuit plate and carefully holds along described down contact seat board fixed leg and move down under the support of described compression spring; When described pressure removed, described compression spring promoted the moving described heat conductive bar of described base circuit strip and moves up.
Further: described heat conductive bar is decussate texture, and top is the heat conductive bar butt end, and the bottom is that heat conductive bar is carefully held; The upper surface of two sides is the face that touches on the heat conductive bar salient point about described heat conductive bar, about the lower surface of two sides be the face that touches under the heat conductive bar salient point; The top of described heat conductive bar butt end is the heat conductive bar upper limb; The thin end of described heat conductive bar passes base circuit plate square hole, is fixed on the described base circuit plate square hole; The face that touches under the described heat conductive bar salient point contacts with tactile face on the described base circuit plate and adhesion is fixed; Described heat conductive bar butt end pass successively from the bottom up described fin square hole, down contact the seat board square hole with on contact square hole; Described heat conductive bar upper limb passes described going up and contacts square hole, and is positioned at described top of going up the contact square hole.
Further: when described heat conductive bar was in reset mode, the face that touches on the described heat conductive bar salient point contacted with described fin.
Further: the bottom at described compression spring is provided with packing ring, and described packing ring is fixed on the described screw; Described compression spring is enclosed within respectively on the thin end of the described seat board of contact down fixed leg between described base circuit plate and packing ring.
Further: the material of described fin is selected copper or aluminum for use.
Further: described contact down is positioned at described next door of going up the contact square hole and is provided with the contact groove.
Another technical problem solved by the invention provides a kind of non-invasive blood-sugar detecting instrument probe that is provided with heat conducting device, eliminates the measurement error that causes owing to finger pressure discomfort in the probe, improves the certainty of measurement of blood glucose.
Technical scheme is as follows:
A kind of non-invasive blood-sugar detecting instrument probe that is provided with heat conducting device, comprise heat conducting device, base, torsionspring and cover plate, described base is connected by hinge with cover plate, and described torsionspring is fixed between described base and the cover plate, and described heat conducting device is placed in the described base; Under comprising, described heat conducting device contacts, contact down seat board, fin, base circuit plate, compression spring, screw and heat conductive bar; Described contact down has the contact square hole, and described contact down is arranged on the described top of contact seat board down; The bottom of the described seat board of contact down is provided with the seat board fixed leg, and contact seat board fixed leg is carefully held under being provided with in described seat board fixed leg bottom, and the middle part of the described seat board of contact down has down contact seat board square hole; Described fin has the fin circular hole, and the middle part has the fin square hole; The thin end of the described seat board of contact down fixed leg passes described fin circular hole, base circuit plate circular hole and compression spring from top to down successively, is provided with screw in the bottom of described compression spring, and described screw is fixed on the bottom of the thin end of described contact seat board fixed leg down; Described heat conductive bar is decussate texture, and the bottom of described heat conductive bar is passed and is fixed on the described base circuit plate square hole, the top of described heat conductive bar pass successively described fin square hole, down contact the seat board square hole with on contact square hole.
Further: when described heat conductive bar was under pressure, described heat conductive bar drove described base circuit plate and carefully holds along described down contact seat board fixed leg and move down under the support of described compression spring; When described pressure removed, described compression spring promoted the moving described heat conductive bar of described base circuit strip and moves up.
Further: described heat conductive bar is decussate texture, and top is the heat conductive bar butt end, and the bottom is that heat conductive bar is carefully held; The upper surface of two sides is the face that touches on the heat conductive bar salient point about described heat conductive bar, about the lower surface of two sides be the face that touches under the heat conductive bar salient point; The top of described heat conductive bar butt end is the heat conductive bar upper limb; The thin end of described heat conductive bar passes base circuit plate square hole, is fixed on the described base circuit plate square hole; The face that touches under the described heat conductive bar salient point contacts with tactile face on the described base circuit plate and adhesion is fixed; Described heat conductive bar butt end pass successively from the bottom up described fin square hole, down contact the seat board square hole with on contact square hole; Described heat conductive bar upper limb passes described going up and contacts square hole, and is positioned at described top of going up the contact square hole.
Further: when described heat conductive bar was in reset mode, the face that touches on the described heat conductive bar salient point contacted with described fin.
Further: the bottom at described compression spring is provided with packing ring, and described packing ring is fixed on the described screw; Described compression spring is enclosed within respectively on the thin end of the described seat board of contact down fixed leg between described base circuit plate and packing ring.
Further: the material of described fin is selected copper or aluminum for use.
Further: described contact down is positioned at described next door of going up the contact square hole and is provided with the contact groove.
The present invention compared with prior art has the following advantages and the salience effect:
1, the heat conductive bar of Tan Tou heat conducting device adopts the extension type design, the finger that can make different size has the pressure of a relative equilibrium in probe, can effectively eliminate because the finger pressure discomfort is collected the influence that causes to data, and make the heat conductive bar finger of can better fitting, make the heat collection more accurate.
2, down the use of contact makes the heat conductive bar finger of can better fitting, and makes the collection of heat more accurate.
3, the design of fin of the present invention makes probe and heat conductive bar discharge heat fast, makes probe can quickly recover to ambient temperature, shortens interval time of measurement and carries out new measurement once.
Description of drawings
Fig. 1 is the structure chart of heat conducting device among the present invention;
Fig. 2 is following contacting structure figure among the present invention;
Fig. 3 is the structure chart of base circuit plate among the present invention;
Fig. 4 is the structure chart of heat conductive bar among the present invention;
Fig. 5 is the accessory assembly drawing of heat conducting device among the present invention;
The state diagram of heat conducting device when Fig. 6 is the pressure that following contact is not pointed among the present invention;
Fig. 7 is the structure chart of popping one's head among the present invention.
Among the figure: contact under the 1-, contact seat board under the 2-, the 3-fin, 4-base circuit plate, 5-compresses spring, 6-packing ring, the 7-screw, 8-heat conductive bar, 9-base, the 10-torsionspring, 11-cover plate, the last contact of 101-square hole, the last contact of 102-groove, contact seat board fixed leg butt end under the 201-, contact seat board fixed leg is carefully held under the 202-, contact seat board square hole under the 203-, 301-fin circular hole, 302-fin square hole, 401-base circuit plate circular hole, 402-base circuit plate square hole touches face on the 403-base circuit plate, touch face on the 801-heat conductive bar salient point, touch face under the 802-heat conductive bar salient point, 803-heat conductive bar upper limb, 804-heat conductive bar butt end, the 805-heat conductive bar is carefully held.
The specific embodiment
The present invention is based on existing non-invasive blood-sugar detecting instrument probe designs, be used for improving the accuracy of blood glucose measurement and shorten interval time of measurement.
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
As shown in Figure 1, be the structure chart of heat conducting device among the present invention, the structure of heat conducting device comprises: down contact 1, contact seat board 2, fin 3, base circuit plate 4, compression spring 5, packing ring 6, screw 7, heat conductive bar 8 down.
As shown in Figure 2, be to contact 1 structure chart among the present invention down.Under contact 1 and have contact square hole 101 at the middle part, be provided with in the position, next door of contact square hole 101 and contact groove 102.
The bottom that contacts seat board 2 down is provided with four seat board fixed legs 201, is provided with the thin end 202 of contact seat board fixed leg down in seat board fixed leg 201 bottoms, and the middle part of following contact seat board 2 has down contact seat board square hole 203.Contact 1 down and be arranged on down the top that contacts seat board 2.
As shown in Figure 3, be the structure chart of base circuit plate 4 among the present invention.Base circuit plate 4 has base circuit plate circular hole 401 in four bights, has base circuit plate square hole 402 at the middle part, and the upper surface of base circuit plate 4 is the face 403 that touches on the base circuit plate.
As shown in Figure 4, it is the structure chart of heat conductive bar 8 among the present invention, heat conductive bar 8 is decussate texture on the whole, top is heat conductive bar butt end 804, the bottom is the thin end 805 of heat conductive bar, about the upper surface of two sides be the face 801 that touches on the heat conductive bar salient point, touch on the heat conductive bar salient point face 801 and about the lower surface of two sides be the face 802 that touches under the heat conductive bar salient point, the top of heat conductive bar butt end 804 is heat conductive bar upper limb 803.
As shown in Figure 5, it is the accessory assembly drawing of heat conducting device among the present invention, four contact the thin end 202 of seat board fixed leg down and run through fin circular hole 301, base circuit plate circular hole 401, compression spring 5 from top to down successively, bottom at compression spring 5 is provided with packing ring 6, packing ring 6 is fixed on the screw 7, and screw 7 is fixed on down the bottom of the thin end 202 of contact seat board fixed leg.Four compression springs 5 are enclosed within four respectively and contact down on the thin end 202 of seat board fixed leg between base circuit plate 4 and packing ring 6.
The thin end 805 of the heat conductive bar of heat conductive bar 8 passes base circuit plate square hole 402, is fixed on the base circuit plate square hole 402, touches under the heat conductive bar salient point to touch face 403 on face 802 and the base circuit plate and contact also adhesion and fix; The heat conductive bar butt end 804 of heat conductive bar 8 pass successively from the bottom up fin square hole 302, down contact seat board square hole 203 with on contact square hole 101.Heat conductive bar upper limb 803 passes contact square hole 101, and is positioned at the top of contact square hole 101.
Under contact seat board fixed leg 201,202 whole heat conducting device in conjunction with as a whole.Wherein base circuit plate circular hole 401 is very smooth with the contact surface that contacts the thin end 202 of seat board fixed leg down, makes base circuit plate 4 energy hold 202 to be free to slide along contact seat board fixed leg is thin down.
When heat conductive bar upper limb 803 was subjected to finger pressure, heat conductive bar 8 pressed down base circuit plate 4, and base circuit plate 4 presses down compression spring 5, base circuit plate 4 under the support of compression spring 5 along under contact the thin end 202 of seat board fixed leg and move down.
The state diagram of heat conducting device when as shown in Figure 6, being the pressure that following contact is not pointed among the present invention.The position of base circuit plate 4 and heat conductive bar 8 is the state when resetting, the pressure that this moment, heat conductive bar 8 was not pointed, compression spring 5 is pushed into base circuit plate 4 and heat conductive bar 8 highest order of design, touch face 802 on the heat conductive bar salient point and prop up fin 3, this moment base circuit plate 4 with the very little gap that has that time contacts seat board fixed leg butt end 201.State when heat conductive bar 8 is subjected to a relatively large pressure, this moment, heat conductive bar 8 was in lowest order, compression spring 4 elastic deformations reach maximum, base circuit plate 4 with time contact the maximum that distance between the seat board fixed leg butt end 201 reaches design.
As shown in Figure 7, be the structure chart of popping one's head among the present invention.The structure of probe comprises: heat conducting device, base 9, torsionspring 10, cover plate 11, base 9 and cover plate 11 are connected by hinge, and torsionspring 10 is fixed between base 9 and the cover plate 11, and heat conducting device is placed in the base 9.
Below in conjunction with structure of the present invention, use is described in detail.
When the probe that has a heat conducting device when use is measured the patient, at first open probe mount 9 and cover plate 11, tested finger is placed the finger groove of contact 1, the finger nature keeps flat, finger tip props up down contact groove 102, and this moment, the finger tip abdominal part can touch heat conductive bar upper limb 803.Close up base 9 and cover plate 11 then, under the effect of torsionspring 10,11 of base 9 and cover plates apply a pressure to finger.This pressure passes to heat conductive bar 8 by finger, and the base circuit plate 4 of 8 drives of heat conductive bar holds 202 to move down under the support of compression spring 5 along contact seat board fixed leg is thin down; When measurement finishes when removing the pressure of finger, 5 on compression spring promotes base circuit plate 4 and drives heat conductive bars 8 and move up until resetting.By the regulating action of 5 pairs of pressure of compression spring, finger remains in the suitable scope the pressure of heat conductive bar 8 in measuring process, has effectively avoided because the measurement error that the finger size difference causes.
After using probe to finish one-shot measurement, finger shifts out probe, and when this moment, heat conductive bar 8 was not subjected to finger pressure to be in reset mode, contact surface 801 closely contacted with fin 3 on the heat conductive bar salient point, and heat can conduct to the fin 3 from heat conductive bar 8 under this state.
Claims (14)
1. a heat conducting device is characterized in that: comprise down contacting, contact down seat board, fin, base circuit plate, compression spring, screw and heat conductive bar; Described contact down has the contact square hole, and described contact down is arranged on the described top of contact seat board down; The bottom of the described seat board of contact down is provided with the seat board fixed leg, and contact seat board fixed leg is carefully held under being provided with in described seat board fixed leg bottom, and the middle part of the described seat board of contact down has down contact seat board square hole; Described fin has the fin circular hole, and the middle part has the fin square hole; Described base circuit plate offers base circuit plate circular hole, and offers base circuit plate square hole; The thin end of the described seat board of contact down fixed leg passes described fin circular hole, base circuit plate circular hole and compression spring from top to down successively, is provided with screw in the bottom of described compression spring, and described screw is fixed on the bottom of the thin end of described contact seat board fixed leg down; Described heat conductive bar is decussate texture, and the bottom of described heat conductive bar is passed and is fixed on the described base circuit plate square hole, the top of described heat conductive bar pass successively described fin square hole, down contact the seat board square hole with on contact square hole.
2. heat conducting device as claimed in claim 1 is characterized in that: when described heat conductive bar was under pressure, described heat conductive bar drove described base circuit plate and carefully holds along the described seat board of contact down fixed leg and move down under the support of described compression spring; When described pressure removed, described compression spring promoted the moving described heat conductive bar of described base circuit strip and moves up.
3. heat conducting device as claimed in claim 1, it is characterized in that: described heat conductive bar is decussate texture, and top is the heat conductive bar butt end, and the bottom is that heat conductive bar is carefully held; The upper surface of two sides is the face that touches on the heat conductive bar salient point about described heat conductive bar, about the lower surface of two sides be the face that touches under the heat conductive bar salient point; The top of described heat conductive bar butt end is the heat conductive bar upper limb; The thin end of described heat conductive bar passes base circuit plate square hole, is fixed on the described base circuit plate square hole; The face that touches under the described heat conductive bar salient point contacts with tactile face on the described base circuit plate and adhesion is fixed; Described heat conductive bar butt end pass successively from the bottom up described fin square hole, down contact the seat board square hole with on contact square hole; Described heat conductive bar upper limb passes described going up and contacts square hole, and is positioned at described top of going up the contact square hole.
4. heat conducting device as claimed in claim 3 is characterized in that: when described heat conductive bar was in reset mode, the face that touches on the described heat conductive bar salient point contacted with described fin.
5. heat conducting device as claimed in claim 1, it is characterized in that: the bottom at described compression spring is provided with packing ring, and described packing ring is fixed on the described screw; Described compression spring is enclosed within on the thin end of the described seat board of contact down fixed leg between described base circuit plate and packing ring.
6. heat conducting device as claimed in claim 1, it is characterized in that: the material of described fin is selected copper or aluminum for use.
7. heat conducting device as claimed in claim 1 is characterized in that: contact the next door that is positioned at described upward contact square hole under described and be provided with the contact groove.
8. a non-invasive blood-sugar detecting instrument that is provided with heat conducting device is popped one's head in, it is characterized in that: comprise heat conducting device, base, torsionspring and cover plate, described base is connected by hinge with cover plate, described torsionspring is fixed between described base and the cover plate, and described heat conducting device is placed in the described base; Under comprising, described heat conducting device contacts, contact down seat board, fin, base circuit plate, compression spring, screw and heat conductive bar; Described contact down has the contact square hole, and described contact down is arranged on the described top of contact seat board down; The bottom of the described seat board of contact down is provided with the seat board fixed leg, and contact seat board fixed leg is carefully held under being provided with in described seat board fixed leg bottom, and the middle part of the described seat board of contact down has down contact seat board square hole; Described fin has the fin circular hole, and the middle part has the fin square hole; Described base circuit plate offers base circuit plate circular hole, and offers base circuit plate square hole; The thin end of the described seat board of contact down fixed leg passes described fin circular hole, base circuit plate circular hole and compression spring from top to down successively, is provided with screw in the bottom of described compression spring, and described screw is fixed on the bottom of the thin end of described contact seat board fixed leg down; Described heat conductive bar is decussate texture, and the bottom of described heat conductive bar is passed and is fixed on the described base circuit plate square hole, the top of described heat conductive bar pass successively described fin square hole, down contact the seat board square hole with on contact square hole.
9. heat conducting device as claimed in claim 8 is characterized in that: when described heat conductive bar was under pressure, described heat conductive bar drove described base circuit plate and carefully holds along the described seat board of contact down fixed leg and move down under the support of described compression spring; When described pressure removed, described compression spring promoted the moving described heat conductive bar of described base circuit strip and moves up.
10. the non-invasive blood-sugar detecting instrument that is provided with heat conducting device as claimed in claim 8 is popped one's head in, and it is characterized in that: described heat conductive bar is decussate texture, and top is the heat conductive bar butt end, and the bottom is that heat conductive bar is carefully held; The upper surface of two sides is the face that touches on the heat conductive bar salient point about described heat conductive bar, about the lower surface of two sides be the face that touches under the heat conductive bar salient point; The top of described heat conductive bar butt end is the heat conductive bar upper limb; The thin end of described heat conductive bar passes base circuit plate square hole, is fixed on the described base circuit plate square hole; The face that touches under the described heat conductive bar salient point contacts with tactile face on the described base circuit plate and adhesion is fixed; Described heat conductive bar butt end pass successively from the bottom up described fin square hole, down contact the seat board square hole with on contact square hole; Described heat conductive bar upper limb passes described going up and contacts square hole, and is positioned at described top of going up the contact square hole.
11. heat conducting device as claimed in claim 10 is characterized in that: when described heat conductive bar was in reset mode, the face that touches on the described heat conductive bar salient point contacted with described fin.
12. the non-invasive blood-sugar detecting instrument probe that is provided with heat conducting device as claimed in claim 8, it is characterized in that: the bottom at described compression spring is provided with packing ring, and described packing ring is fixed on the described screw; Described compression spring is enclosed within on the thin end of the described seat board of contact down fixed leg between described base circuit plate and packing ring.
13. the non-invasive blood-sugar detecting instrument probe that is provided with heat conducting device as claimed in claim 8, it is characterized in that: the material of described fin is selected copper or aluminum for use.
14. the non-invasive blood-sugar detecting instrument probe that is provided with heat conducting device as claimed in claim 8 is characterized in that: described contact down is positioned at described next door of going up the contact square hole and is provided with the contact groove.
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| CN 201210027536 CN102551733B (en) | 2012-02-08 | 2012-02-08 | Heat conduction device and non-invasive blood glucose detector probe with same |
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| CN 201210027536 CN102551733B (en) | 2012-02-08 | 2012-02-08 | Heat conduction device and non-invasive blood glucose detector probe with same |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103750829A (en) * | 2014-01-16 | 2014-04-30 | 清华大学 | Multi-parameter physiological indication detecting device |
| CN103976742A (en) * | 2014-05-13 | 2014-08-13 | 桂林电子科技大学 | Measuring device and method aiming at local heat radiation quantity at tail end of finger of human body |
| CN108125684A (en) * | 2018-01-31 | 2018-06-08 | 博邦芳舟医疗科技（北京）有限公司 | A kind of profile leaf spring clamp type physiology indication detector probe |
| CN112386252A (en) * | 2019-08-15 | 2021-02-23 | 博邦芳舟医疗科技（北京）有限公司 | Blood glucose measuring probe and blood glucose measuring device and method |
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